TWI876929B - 基板設計支援裝置、基板設計支援系統及與電路資訊相關之資料構造 - Google Patents

基板設計支援裝置、基板設計支援系統及與電路資訊相關之資料構造 Download PDF

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Publication number
TWI876929B
TWI876929B TW113109906A TW113109906A TWI876929B TW I876929 B TWI876929 B TW I876929B TW 113109906 A TW113109906 A TW 113109906A TW 113109906 A TW113109906 A TW 113109906A TW I876929 B TWI876929 B TW I876929B
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Taiwan
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unit
conductors
equivalent circuit
ground
power
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TW113109906A
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English (en)
Chinese (zh)
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TW202447450A (zh
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古川剛史
姫田髙志
笹本亮一
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日商村田製作所股份有限公司
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/31—Design entry, e.g. editors specifically adapted for circuit design
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW113109906A 2023-03-20 2024-03-18 基板設計支援裝置、基板設計支援系統及與電路資訊相關之資料構造 TWI876929B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023044204 2023-03-20
JP2023-044204 2023-03-20
WOPCT/JP2024/009856 2024-03-13
PCT/JP2024/009856 WO2024195666A1 (ja) 2023-03-20 2024-03-13 基板設計支援装置、基板設計支援システム及び回路情報に関するデータ構造

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TW202447450A TW202447450A (zh) 2024-12-01
TWI876929B true TWI876929B (zh) 2025-03-11

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TW113109906A TWI876929B (zh) 2023-03-20 2024-03-18 基板設計支援裝置、基板設計支援系統及與電路資訊相關之資料構造

Country Status (5)

Country Link
US (1) US20250181812A1 (https=)
JP (1) JPWO2024195666A1 (https=)
CN (1) CN119895423A (https=)
TW (1) TWI876929B (https=)
WO (1) WO2024195666A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100213573A1 (en) * 2009-02-20 2010-08-26 Dong-Hyun Han Semiconductor device
US20100325594A1 (en) * 2009-06-22 2010-12-23 Fujitsu Limited Printed circuit board design assisting method, printed circuit board design assisting device, and storage medium
CN103824695A (zh) * 2012-11-16 2014-05-28 太阳诱电株式会社 可变电容复合部件
US10339257B2 (en) * 2014-05-30 2019-07-02 Canon Kabushiki Kaisha Information processing apparatus, method, and storage medium
TW202027570A (zh) * 2019-01-02 2020-07-16 瑞昱半導體股份有限公司 主控元件及電路基板
CN113258789A (zh) * 2021-06-28 2021-08-13 珠海拓芯科技有限公司 开关电源电路及电子设备
TW202242424A (zh) * 2021-04-16 2022-11-01 旺矽科技股份有限公司 用於半導體測試之電路板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253631A (ja) * 2005-02-14 2006-09-21 Fujitsu Ltd 半導体装置及びその製造方法、キャパシタ構造体及びその製造方法
CN117813666A (zh) * 2021-08-18 2024-04-02 株式会社村田制作所 电容器元件

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100213573A1 (en) * 2009-02-20 2010-08-26 Dong-Hyun Han Semiconductor device
US20100325594A1 (en) * 2009-06-22 2010-12-23 Fujitsu Limited Printed circuit board design assisting method, printed circuit board design assisting device, and storage medium
CN103824695A (zh) * 2012-11-16 2014-05-28 太阳诱电株式会社 可变电容复合部件
US10339257B2 (en) * 2014-05-30 2019-07-02 Canon Kabushiki Kaisha Information processing apparatus, method, and storage medium
TW202027570A (zh) * 2019-01-02 2020-07-16 瑞昱半導體股份有限公司 主控元件及電路基板
TW202242424A (zh) * 2021-04-16 2022-11-01 旺矽科技股份有限公司 用於半導體測試之電路板
CN113258789A (zh) * 2021-06-28 2021-08-13 珠海拓芯科技有限公司 开关电源电路及电子设备

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Publication number Publication date
US20250181812A1 (en) 2025-06-05
WO2024195666A1 (ja) 2024-09-26
TW202447450A (zh) 2024-12-01
JPWO2024195666A1 (https=) 2024-09-26
CN119895423A (zh) 2025-04-25

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