TWI872283B - 用於疊對量測之系統及方法 - Google Patents
用於疊對量測之系統及方法 Download PDFInfo
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- TWI872283B TWI872283B TW110136643A TW110136643A TWI872283B TW I872283 B TWI872283 B TW I872283B TW 110136643 A TW110136643 A TW 110136643A TW 110136643 A TW110136643 A TW 110136643A TW I872283 B TWI872283 B TW I872283B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/94—Hardware or software architectures specially adapted for image or video understanding
- G06V10/945—User interactive design; Environments; Toolboxes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/40—Software arrangements specially adapted for pattern recognition, e.g. user interfaces or toolboxes therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
- G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0481—Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0464—Convolutional networks [CNN, ConvNet]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N5/00—Computing arrangements using knowledge-based models
- G06N5/04—Inference or reasoning models
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—Two-dimensional [2D] image generation
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/16—Image acquisition using multiple overlapping images; Image stitching
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/24—Aligning, centring, orientation detection or correction of the image
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
- G06V10/765—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects using rules for classification or partitioning the feature space
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/24—Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/07—Target detection
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Multimedia (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Medical Informatics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Human Computer Interaction (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Computational Biology (AREA)
- Computational Linguistics (AREA)
- Databases & Information Systems (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Molecular Biology (AREA)
- Biophysics (AREA)
- Quality & Reliability (AREA)
- Signal Processing (AREA)
- Biomedical Technology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/060,372 US11556738B2 (en) | 2020-10-01 | 2020-10-01 | System and method for determining target feature focus in image-based overlay metrology |
| US17/060,372 | 2020-10-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202219459A TW202219459A (zh) | 2022-05-16 |
| TWI872283B true TWI872283B (zh) | 2025-02-11 |
Family
ID=80931435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110136643A TWI872283B (zh) | 2020-10-01 | 2021-10-01 | 用於疊對量測之系統及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11556738B2 (https=) |
| EP (1) | EP4200599A4 (https=) |
| JP (1) | JP7642804B2 (https=) |
| KR (1) | KR102718045B1 (https=) |
| CN (2) | CN118225804B (https=) |
| TW (1) | TWI872283B (https=) |
| WO (1) | WO2022072162A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102680508B1 (ko) | 2020-08-24 | 2024-07-01 | 그린 라이온 피티이. 리미티드 | 리튬이온 배터리의 재활용에서의 불순물 제거 공정 |
| US11556738B2 (en) * | 2020-10-01 | 2023-01-17 | Kla Corporation | System and method for determining target feature focus in image-based overlay metrology |
| WO2022098354A1 (en) | 2020-11-05 | 2022-05-12 | Kla Corporation | Systems and methods for measurement of misregistration and amelioration thereof |
| CN116802886A (zh) | 2022-01-17 | 2023-09-22 | 绿狮私人有限公司 | 用于回收利用磷酸铁锂电池的方法 |
| AU2023223959B2 (en) | 2022-02-23 | 2025-04-03 | Green Li-Ion Pte. Ltd | Processes and systems for purifying and recycling lithium-ion battery waste streams |
| TWI890995B (zh) | 2022-04-18 | 2025-07-21 | 新加坡商綠色鋰離子私人有限公司 | 用於自鋰離子電池組回收鋰之方法及系統 |
| EP4367610A1 (en) * | 2022-09-13 | 2024-05-15 | Google LLC | Method for retraining with auto-validation of machine learning models |
| US12535744B2 (en) * | 2022-10-31 | 2026-01-27 | Kla Corporation | Overlay estimation based on optical inspection and machine learning |
| US12322771B2 (en) | 2023-08-23 | 2025-06-03 | Green Li-Ion Pte. Ltd. | Adaptable processes and systems for purifying co-precipitated or independent streams of manganese, nickel, and cobalt from lithium-ion battery waste streams |
| US20260064014A1 (en) * | 2024-09-04 | 2026-03-05 | Kla Corporation | System and method for target centering detection in overlay metrology |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160025650A1 (en) * | 2014-07-22 | 2016-01-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay metrology method and overlay control method and system |
| TW201702588A (zh) * | 2015-04-06 | 2017-01-16 | 克萊譚克公司 | 在度量衡系統中度量衡資料之前向饋送 |
| TW201918806A (zh) * | 2017-07-18 | 2019-05-16 | 美商克萊譚克公司 | 基於影像之疊對量測及使用全焦點成像之監測 |
| US20190228518A1 (en) * | 2018-01-22 | 2019-07-25 | Kla-Tencor Corporation | On The Fly Target Acquisition |
| US20190310080A1 (en) * | 2018-04-09 | 2019-10-10 | Kla-Tencor Corporation | Localized Telecentricity and Focus Optimization for Overlay Metrology |
| US20190378737A1 (en) * | 2018-06-07 | 2019-12-12 | Kla-Tencor Corporation | Overlay Measurement Using Phase and Amplitude Modeling |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60045076D1 (de) * | 1999-08-10 | 2010-11-18 | Cellavision Ab | Verfahren und Vorrichtungen in einem optischen System |
| US10576603B2 (en) | 2014-04-22 | 2020-03-03 | Kla-Tencor Corporation | Patterned wafer geometry measurements for semiconductor process controls |
| KR102184033B1 (ko) * | 2014-06-24 | 2020-11-27 | 케이엘에이 코포레이션 | 반도체 프로세스 제어를 위한 패터닝된 웨이퍼 지오메트리 측정 |
| US9830694B2 (en) * | 2015-08-31 | 2017-11-28 | Mitutoyo Corporation | Multi-level image focus using a tunable lens in a machine vision inspection system |
| US10395356B2 (en) * | 2016-05-25 | 2019-08-27 | Kla-Tencor Corp. | Generating simulated images from input images for semiconductor applications |
| US10477097B2 (en) * | 2017-01-03 | 2019-11-12 | University Of Connecticut | Single-frame autofocusing using multi-LED illumination |
| US10964013B2 (en) * | 2017-01-10 | 2021-03-30 | Kla-Tencor Corporation | System, method for training and applying defect classifiers in wafers having deeply stacked layers |
| US10474040B2 (en) * | 2017-12-07 | 2019-11-12 | Kla-Tencor Corporation | Systems and methods for device-correlated overlay metrology |
| CN116758012A (zh) * | 2018-06-08 | 2023-09-15 | Asml荷兰有限公司 | 确定与在衬底上的结构相关的感兴趣的特性的方法、掩模版、衬底 |
| US11676264B2 (en) * | 2019-07-26 | 2023-06-13 | Kla Corporation | System and method for determining defects using physics-based image perturbations |
| US11556738B2 (en) * | 2020-10-01 | 2023-01-17 | Kla Corporation | System and method for determining target feature focus in image-based overlay metrology |
-
2020
- 2020-10-01 US US17/060,372 patent/US11556738B2/en active Active
-
2021
- 2021-09-21 CN CN202410326042.8A patent/CN118225804B/zh active Active
- 2021-09-21 WO PCT/US2021/051163 patent/WO2022072162A1/en not_active Ceased
- 2021-09-21 CN CN202180064419.1A patent/CN116235042B/zh active Active
- 2021-09-21 JP JP2023520310A patent/JP7642804B2/ja active Active
- 2021-09-21 KR KR1020237010248A patent/KR102718045B1/ko active Active
- 2021-09-21 EP EP21876216.9A patent/EP4200599A4/en active Pending
- 2021-10-01 TW TW110136643A patent/TWI872283B/zh active
-
2023
- 2023-01-16 US US18/097,438 patent/US11921825B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160025650A1 (en) * | 2014-07-22 | 2016-01-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay metrology method and overlay control method and system |
| TW201702588A (zh) * | 2015-04-06 | 2017-01-16 | 克萊譚克公司 | 在度量衡系統中度量衡資料之前向饋送 |
| TW201918806A (zh) * | 2017-07-18 | 2019-05-16 | 美商克萊譚克公司 | 基於影像之疊對量測及使用全焦點成像之監測 |
| US20190228518A1 (en) * | 2018-01-22 | 2019-07-25 | Kla-Tencor Corporation | On The Fly Target Acquisition |
| US20190310080A1 (en) * | 2018-04-09 | 2019-10-10 | Kla-Tencor Corporation | Localized Telecentricity and Focus Optimization for Overlay Metrology |
| US20190378737A1 (en) * | 2018-06-07 | 2019-12-12 | Kla-Tencor Corporation | Overlay Measurement Using Phase and Amplitude Modeling |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202219459A (zh) | 2022-05-16 |
| EP4200599A4 (en) | 2024-10-09 |
| US11921825B2 (en) | 2024-03-05 |
| US20240020353A1 (en) | 2024-01-18 |
| US11556738B2 (en) | 2023-01-17 |
| JP2025074126A (ja) | 2025-05-13 |
| WO2022072162A1 (en) | 2022-04-07 |
| KR20230078666A (ko) | 2023-06-02 |
| JP7642804B2 (ja) | 2025-03-10 |
| CN118225804B (zh) | 2025-09-19 |
| EP4200599A1 (en) | 2023-06-28 |
| CN116235042A (zh) | 2023-06-06 |
| US20220108128A1 (en) | 2022-04-07 |
| KR102718045B1 (ko) | 2024-10-15 |
| CN116235042B (zh) | 2024-04-12 |
| JP2023544388A (ja) | 2023-10-23 |
| CN118225804A (zh) | 2024-06-21 |
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