TWI855790B - 光源單元、照明單元、曝光裝置、及曝光方法 - Google Patents

光源單元、照明單元、曝光裝置、及曝光方法 Download PDF

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Publication number
TWI855790B
TWI855790B TW112127508A TW112127508A TWI855790B TW I855790 B TWI855790 B TW I855790B TW 112127508 A TW112127508 A TW 112127508A TW 112127508 A TW112127508 A TW 112127508A TW I855790 B TWI855790 B TW I855790B
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TW
Taiwan
Prior art keywords
light source
substrate
source unit
light
heat sink
Prior art date
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TW112127508A
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English (en)
Chinese (zh)
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TW202417999A (zh
Inventor
吉田亮平
鈴木智也
櫻井友紀也
成
Original Assignee
日商尼康股份有限公司
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Publication of TW202417999A publication Critical patent/TW202417999A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70183—Zoom systems for adjusting beam diameter
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Light Sources And Details Of Projection-Printing Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW112127508A 2022-08-18 2023-07-24 光源單元、照明單元、曝光裝置、及曝光方法 TWI855790B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/031212 2022-08-18
PCT/JP2022/031212 WO2024038537A1 (ja) 2022-08-18 2022-08-18 光源ユニット、照明ユニット、露光装置、及び露光方法

Publications (2)

Publication Number Publication Date
TW202417999A TW202417999A (zh) 2024-05-01
TWI855790B true TWI855790B (zh) 2024-09-11

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Family Applications (1)

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TW112127508A TWI855790B (zh) 2022-08-18 2023-07-24 光源單元、照明單元、曝光裝置、及曝光方法

Country Status (5)

Country Link
JP (1) JPWO2024038537A1 (https=)
KR (1) KR20250036881A (https=)
CN (1) CN119790351A (https=)
TW (1) TWI855790B (https=)
WO (1) WO2024038537A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017048263A (ja) * 2015-08-31 2017-03-09 公立大学法人大阪府立大学 光硬化性樹脂組成物の硬化物の製造方法および光照射装置
TW201842545A (zh) * 2017-03-31 2018-12-01 日商尼康股份有限公司 物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法
TW201921404A (zh) * 2017-09-29 2019-06-01 日商尼康股份有限公司 電子束裝置及元件製造方法
TW201921405A (zh) * 2017-09-29 2019-06-01 日商尼康股份有限公司 電子束裝置及元件製造方法
TW201923480A (zh) * 2017-09-29 2019-06-16 日商尼康股份有限公司 電子束裝置及元件製造方法
TW201923830A (zh) * 2017-09-29 2019-06-16 日商尼康股份有限公司 電子束裝置及元件製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2332190A1 (en) * 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
JP4587170B2 (ja) 2005-01-20 2010-11-24 キヤノン株式会社 露光装置及びデバイスの製造方法
CN104718634A (zh) * 2012-10-19 2015-06-17 夏普株式会社 发光装置以及发光装置向散热器安装的安装构造
JP6410085B2 (ja) * 2014-08-18 2018-10-24 カシオ計算機株式会社 締結構造及びこの締結構造を備える投影装置、締結方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017048263A (ja) * 2015-08-31 2017-03-09 公立大学法人大阪府立大学 光硬化性樹脂組成物の硬化物の製造方法および光照射装置
TW201842545A (zh) * 2017-03-31 2018-12-01 日商尼康股份有限公司 物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法
TW201921404A (zh) * 2017-09-29 2019-06-01 日商尼康股份有限公司 電子束裝置及元件製造方法
TW201921405A (zh) * 2017-09-29 2019-06-01 日商尼康股份有限公司 電子束裝置及元件製造方法
TW201923480A (zh) * 2017-09-29 2019-06-16 日商尼康股份有限公司 電子束裝置及元件製造方法
TW201923830A (zh) * 2017-09-29 2019-06-16 日商尼康股份有限公司 電子束裝置及元件製造方法

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Publication number Publication date
JPWO2024038537A1 (https=) 2024-02-22
WO2024038537A1 (ja) 2024-02-22
KR20250036881A (ko) 2025-03-14
TW202417999A (zh) 2024-05-01
CN119790351A (zh) 2025-04-08

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