TWI844320B - 導熱性膜狀接著劑用組成物及導熱性膜狀接著劑、以及使用導熱性膜狀接著劑之半導體封裝之製造方法 - Google Patents

導熱性膜狀接著劑用組成物及導熱性膜狀接著劑、以及使用導熱性膜狀接著劑之半導體封裝之製造方法 Download PDF

Info

Publication number
TWI844320B
TWI844320B TW112111748A TW112111748A TWI844320B TW I844320 B TWI844320 B TW I844320B TW 112111748 A TW112111748 A TW 112111748A TW 112111748 A TW112111748 A TW 112111748A TW I844320 B TWI844320 B TW I844320B
Authority
TW
Taiwan
Prior art keywords
alumina filler
silane coupling
coupling agent
thermally conductive
conductive film
Prior art date
Application number
TW112111748A
Other languages
English (en)
Chinese (zh)
Other versions
TW202344550A (zh
Inventor
森田稔
大淵俊弥
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202344550A publication Critical patent/TW202344550A/zh
Application granted granted Critical
Publication of TWI844320B publication Critical patent/TWI844320B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
TW112111748A 2022-03-30 2023-03-28 導熱性膜狀接著劑用組成物及導熱性膜狀接著劑、以及使用導熱性膜狀接著劑之半導體封裝之製造方法 TWI844320B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-055427 2022-03-30
JP2022055427 2022-03-30

Publications (2)

Publication Number Publication Date
TW202344550A TW202344550A (zh) 2023-11-16
TWI844320B true TWI844320B (zh) 2024-06-01

Family

ID=88202285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111748A TWI844320B (zh) 2022-03-30 2023-03-28 導熱性膜狀接著劑用組成物及導熱性膜狀接著劑、以及使用導熱性膜狀接著劑之半導體封裝之製造方法

Country Status (6)

Country Link
US (1) US20240352289A1 (https=)
JP (1) JP7383206B1 (https=)
KR (1) KR102742635B1 (https=)
CN (1) CN118696105A (https=)
TW (1) TWI844320B (https=)
WO (1) WO2023190321A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120530179A (zh) * 2023-01-31 2025-08-22 积水化学工业株式会社 固化性导热性粘接剂、和其供给形态
WO2025183038A1 (ja) * 2024-02-27 2025-09-04 日東シンコー株式会社 接着シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201525055A (zh) * 2013-10-17 2015-07-01 住友電木股份有限公司 環氧樹脂組成物、附樹脂層之載體材料、金屬基底電路基板及電子裝置
TW201741414A (zh) * 2016-02-26 2017-12-01 日立化成股份有限公司 接著膜及切晶・黏晶膜
TW201908441A (zh) * 2017-07-20 2019-03-01 日商日立化成股份有限公司 散熱性黏晶膜及切晶-黏晶膜

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005171206A (ja) * 2003-12-15 2005-06-30 Toyota Motor Corp 樹脂配合用粉体混合物及び樹脂組成物
CN104334604A (zh) * 2012-05-17 2015-02-04 太阳油墨制造株式会社 碱显影型的热固化性树脂组合物、印刷电路板
WO2013187303A1 (ja) * 2012-06-12 2013-12-19 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板
JP6366228B2 (ja) 2013-06-04 2018-08-01 日東電工株式会社 接着シート、及びダイシング・ダイボンディングフィルム
JP2016104832A (ja) 2014-12-01 2016-06-09 Dic株式会社 樹脂組成物、熱伝導性接着剤、熱伝導性接着シート及び積層体
JP7167441B2 (ja) * 2016-05-06 2022-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤
JP7005906B2 (ja) * 2017-02-21 2022-01-24 昭和電工マテリアルズ株式会社 多層樹脂シート、多層樹脂シートの製造方法、多層樹脂シート硬化物、多層樹脂シート積層体、及び多層樹脂シート積層体硬化物
WO2021033368A1 (ja) 2019-08-22 2021-02-25 古河電気工業株式会社 接着剤用組成物、フィルム状接着剤及びその製造方法、並びに、フィルム状接着剤を用いた半導体パッケージおよびその製造方法
JP2021050305A (ja) * 2019-09-26 2021-04-01 昭和電工マテリアルズ株式会社 樹脂シート及びパワー半導体装置
KR102655890B1 (ko) 2020-07-30 2024-04-11 후루카와 덴키 고교 가부시키가이샤 접착제용 조성물 및 필름형 접착제와 필름형 접착제를 사용한 반도체 패키지 및 그 제조 방법
CN117255839A (zh) * 2021-07-13 2023-12-19 古河电气工业株式会社 导热性膜状粘接剂、半导体封装及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201525055A (zh) * 2013-10-17 2015-07-01 住友電木股份有限公司 環氧樹脂組成物、附樹脂層之載體材料、金屬基底電路基板及電子裝置
TW201741414A (zh) * 2016-02-26 2017-12-01 日立化成股份有限公司 接著膜及切晶・黏晶膜
TW201908441A (zh) * 2017-07-20 2019-03-01 日商日立化成股份有限公司 散熱性黏晶膜及切晶-黏晶膜

Also Published As

Publication number Publication date
CN118696105A (zh) 2024-09-24
US20240352289A1 (en) 2024-10-24
WO2023190321A1 (ja) 2023-10-05
JPWO2023190321A1 (https=) 2023-10-05
JP7383206B1 (ja) 2023-11-17
KR102742635B1 (ko) 2024-12-17
TW202344550A (zh) 2023-11-16
KR20230158517A (ko) 2023-11-20

Similar Documents

Publication Publication Date Title
US11952513B2 (en) Adhesive composition, film-like adhesive and production method thereof, and semiconductor package using film-like adhesive and production method thereof
TWI485225B (zh) 接著片及半導體裝置的製造方法
TWI759375B (zh) 半導體加工用帶
TWI844320B (zh) 導熱性膜狀接著劑用組成物及導熱性膜狀接著劑、以及使用導熱性膜狀接著劑之半導體封裝之製造方法
TWI824195B (zh) 切晶黏晶膜與使用其之半導體封裝及其製造方法
CN104212374A (zh) 热固型芯片接合薄膜、带切割片的芯片接合薄膜及半导体装置的制造方法
WO2022202271A1 (ja) ダイシングダイアタッチフィルム及びその製造方法、並びに半導体パッケージ及びその製造方法
US20240279517A1 (en) Adhesive composition and film adhesive, and semiconductor package using film adhesive and producing method thereof
TWI843947B (zh) 接著劑用組成物及膜狀接著劑、以及使用有膜狀接著劑之半導體封裝及其製造方法
US20240084172A1 (en) Adhesive composition, film adhesive, and semiconductor package using film adhesive and producing method thereof
WO2014126147A1 (ja) 電子部品封止用樹脂シート、樹脂封止型半導体装置、及び、樹脂封止型半導体装置の製造方法
US20240150622A1 (en) Adhesive composition and film adhesive, and semiconductor package using film adhesive and producing method thereof
JP7115537B2 (ja) 半導体装置の製造方法及びフィルム状接着剤
HK40112069A (zh) 导热性膜状粘接剂用组合物和导热性膜状粘接剂、以及使用导热性膜状粘接剂的半导体封装及其制造方法
TWI828455B (zh) 接著劑用組成物及膜狀接著劑、以及使用膜狀接著劑之半導體封裝及其製造方法
TWI905665B (zh) 導熱性接著劑用組成物及其製造方法、導熱性膜狀接著劑、以及使用導熱性膜狀接著劑之半導體封裝及其製造方法
HK40107977A (zh) 粘接剂用组合物和膜状粘接剂、以及使用了膜状粘接剂的半导体封装及其制造方法
HK40092024A (zh) 粘接剂用组合物和膜状粘接剂、以及使用了膜状粘接剂的半导体封装及其制造方法
HK40077350A (en) Dicing die attach film and method for producing same, and semiconductor package and method for producing same
HK40059508A (en) Dicing die attach film, semiconductor package using dicing die attach film, and method for manufacturing semiconductor package
HK40099212A (zh) 粘接剂用组合物和膜状粘接剂、以及使用了膜状粘接剂的半导体封装及其制造方法
WO2023286389A1 (ja) 熱伝導性フィルム状接着剤、半導体パッケージ及びその製造方法
HK40059508B (zh) 切晶粘晶膜、以及使用了该切晶粘晶膜的半导体封装及其制造方法