TWI844167B - Method for manufacturing printed circuit board and the printed circuit board and manufacturing equipment thereof - Google Patents

Abstract

Present invention discloses a method for manufacturing a printed circuit board, and the printed circuit board and manufacturing equipment thereof. The manufacturing method of the printed circuit board includes: a preparation step, providing a multi-layer board, the multi-layer board having a plurality of core board overlapping on each other and at least one via hole, the plurality of core board can be defined a target layer, plurality of alignment mark provided on the target layer; an alignment hole forming step, reading the position of the plurality of alignment mark, and drilling a plurality of alignment hole corresponding to the plurality of alignment mark on the bottom surface of the multilayer board; a positioning compensation step, reading the positions of a plurality of alignment hole to calculate a back-drilling positioning compensation; and a back-drilling hole forming step, calculate a drilling position according to the back-drilling hole positioning compensation, then drilling at least one back-drilling hole according to the back-drilling position.

Description

Printed circuit board manufacturing method, printed circuit board and manufacturing equipment

The present invention relates to a method for manufacturing a printed circuit board, a printed circuit board and a manufacturing device, and in particular to a method for manufacturing a printed circuit board for manufacturing a multi-layer printed circuit board, a printed circuit board and a manufacturing device.

In multi-layer circuit boards, signal transmission between different layers of the circuit board is achieved through vias. However, in high-speed multi-layer circuit boards, the electroplated copper inside the vias will become stubs (also called tails or pillars) for signal transmission. These stubs will have an adverse effect on signal transmission, such as causing noise interference or poor signal integrity. In order to obtain better signal transmission quality, it is necessary to reduce the length of the stubs in the vias, and the shorter the length of the residual stubs, the better the quality of signal transmission.

In order to reduce the length of stubs in vias, back drilling technology is one of the methods often used; however, due to the increase in density of existing printed circuit boards, the distance between the inner conductor and the back drill hole is reduced. Therefore, when drilling back drill holes in printed circuit boards, if the position of the back drill holes is deviated, it is easy to contact the inner conductors adjacent to the back drill holes, causing damage to the inner conductors or even fractures, resulting in defects.

Therefore, the inventors of the present invention believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects.

The technical problem to be solved by the present invention is to provide a method for manufacturing a printed circuit board in view of the shortcomings of the prior art, which comprises: a preparation step, providing a multi-layer board, the multi-layer board can define a relative top surface and a bottom surface, the multi-layer board has a plurality of core boards stacked on each other, and at least one conductive hole penetrating the plurality of core boards; a target layer can be defined among the plurality of core boards, the target layer is provided with a plurality of alignment marks, and the positions of the plurality of alignment marks and the position of at least one conductive hole do not overlap; an alignment hole forming step, reading the positions of the plurality of alignment marks, and forming a hole at the target layer; A plurality of alignment holes are drilled on the bottom surface of the multi-layer board at positions corresponding to the plurality of alignment marks; a positioning compensation step is performed to read the positions of the plurality of alignment holes and calculate a back drill hole positioning compensation according to the positions of the plurality of alignment holes; and a back drill hole forming step is performed to calculate a back drill hole drilling position according to the back drill hole positioning compensation and then drill at least one back drill hole on the bottom surface of the multi-layer board according to the back drill hole drilling position; the position of at least one back drill hole overlaps with at least one conductive hole, and the diameter of at least one back drill hole is greater than the diameter of at least one conductive hole.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a printed circuit board manufacturing equipment, which includes: a supporting device for supporting a multi-layer board; an image capture module for capturing images of multiple alignment marks and multiple alignment holes; a moving module, which is arranged on the supporting device; and at least one first drilling device and at least one second drilling device, which are arranged on the moving module and can drive the first drilling device and the second drilling device and the supporting device to move relative to each other through the moving module; at least one of the first drilling devices has a first drill bit for drilling at least one alignment hole, and at least one of the second drilling devices has a second drill bit for drilling at least one back drill hole. wherein the printed circuit board manufacturing equipment is configured to capture the image of the multi-layer board through at least one of the image capture modules, and then read the positions of the plurality of alignment marks through the image of the multi-layer board, and control the first drilling device to drill the plurality of alignment holes at the positions corresponding to the plurality of alignment marks on the bottom surface of the multi-layer board; the printed circuit board manufacturing equipment is further configured In order to capture the image of the alignment hole through at least one of the camera devices, and read the positions of multiple alignment holes through images of multiple multi-layer plates, and then calculate the back drill hole positioning compensation through the positions of multiple alignment holes, and then calculate the back drill hole drilling position according to the back drill hole positioning compensation, and control the second drilling device to drill at least one back drill hole.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a printed circuit board manufactured by the printed circuit board manufacturing method.

One of the beneficial effects of the present invention is that the printed circuit board manufacturing method provided by the present invention provides a plurality of alignment marks on the target layer, and drills a plurality of alignment holes on the bottom surface of the multi-layer board by reading the positions of the plurality of alignment marks, and calculates the back drill hole positioning compensation by reading the positions of the plurality of alignment holes, and then uses the back drill hole positioning compensation to calculate the back drill hole drilling position, and then drills at least one back drill hole on the bottom surface of the multi-layer board. The technical solution can correct the back drill hole drilling position through the back drill hole positioning compensation, so that the position of at least one back drill hole can be corrected according to the position offset or deformation of the target layer. Therefore, the deviation of the relative position of the back drill hole and the target layer is reduced, and the situation where the conductive line of the target layer is damaged by the back drill hole can be reduced, thereby improving the manufacturing yield of the printed circuit board.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following is an explanation of the implementation of the "printed circuit board manufacturing method and printed circuit board and manufacturing equipment" disclosed in the present invention through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used herein may include any one or more combinations of the associated listed items as appropriate.

The present invention provides a method for manufacturing a printed circuit board and a printed circuit board and a manufacturing device thereof. To facilitate understanding of the method for manufacturing the printed circuit board, the method for manufacturing the printed circuit board will be first introduced below, followed by the printed circuit board and the manufacturing device for the printed circuit board.

1 to 9 , the printed circuit board manufacturing method of the present invention comprises: a preparation step S10, a positioning hole forming step S20, a positioning compensation step S30, and a back drilling hole forming step S40. The printed circuit board manufacturing method mainly provides a multi-layer board 1 in the preparation step, then drills a plurality of alignment holes 20 on the multi-layer board 1 in the alignment hole forming step S20, calculates a back drill hole position compensation through the positions of the plurality of alignment holes 20 in the positioning compensation step S30, corrects the drilling position of the back drill hole through the back drill hole position compensation in the back drill hole forming step S40, and drills at least one back drill hole 30 on the multi-layer board 1.

As shown in FIG1 , the preparation step S10 is to provide the multilayer board 1. As shown in FIG2 to FIG4 , the multilayer board 1 can define a relative top surface and a bottom surface, and the multilayer board 1 has a plurality of core boards 10 stacked on each other, and at least one conductive hole 11 penetrating the plurality of core boards 10. The plurality of core boards 10 are formed by cutting a copper foil substrate into a suitable size and then undergoing a circuit etching process. Each of the core boards 10 has a conductive circuit 12, and each of the core boards 10 is bonded to each other to form the multilayer board 1.

At least one of the vias 11 passes through the plurality of core boards 10, and the inner wall of at least one of the vias 11 is formed into a conductive layer 111 by electroplating. The conductive layer 111 extends to the outer side of the opening of at least one of the vias 11, and forms a contact pad 112 located on the outer side of the opening of the via 11. Among the plurality of core boards 10, the conductive line 12 of at least one of the core boards 10 is electrically connected to the conductive layer 111, and at least one of the core boards 10 whose conductive line 12 is electrically connected to the conductive layer 111 is defined as a signal layer 10b.

The multi-layer board 1 can also define a target layer 10a. As shown in FIG. 2 and FIG. 6 to FIG. 8, among the conductive lines of each core board 10 penetrated by at least one back-drilled hole 30, the distance between the conductive line 12 closest to the inner wall of the back-drilled hole 30 and the back-drilled hole 30 is defined as the conductor spacing. The target layer 10a is the core board 10 having the smallest conductor spacing among the multiple core boards 10 penetrated by at least one back-drilled hole 30.

As shown in FIG. 2 to FIG. 8 , the target layer 10a is provided with a plurality of alignment marks 13. In this embodiment, the plurality of alignment marks 13 are respectively provided at four corners of the target layer 10a. However, the present invention is not limited thereto. For example, in an embodiment where the multi-layer board 1 has a larger area, the target layer 10a can be divided into a plurality of blocks, and the plurality of alignment marks are respectively provided at the corners of the plurality of blocks. Through the above configuration, the spacing between the plurality of alignment marks 13 in the multi-layer board 1 with a large area can be avoided to be too large, thereby affecting the accuracy of positioning.

As shown in FIG. 5 and FIG. 6 , the alignment hole forming step S20 is to capture the image of the multi-layer board 1 through a camera device, and read the positions of the plurality of alignment marks 13 from the image of the multi-layer board 1, and then drill a plurality of alignment holes 20 at positions corresponding to the plurality of alignment marks 13 on the bottom surface of the multi-layer board 1.

In more detail, as shown in Figures 5, 6, 7 and 10, in this embodiment, in the alignment hole forming step S20, an image of the multi-layer board 1 is captured by an image capture module 230 of a printed circuit board manufacturing equipment 200, and a plurality of alignment holes 20 are drilled in the multi-layer board 1 by a first drilling device 240.

It is worth noting that when the image capture module captures the image of the multi-layer board 1, although the multiple alignment marks 13 are covered by the multiple core boards 10, the image within the area of the multiple alignment marks 13 and the image in the area outside the multiple alignment marks 13 will have color difference or brightness difference, so the position and coordinates of the multiple alignment marks 13 can be distinguished.

As shown in FIG7 , after the alignment hole forming step S20 is completed, a plurality of alignment holes 20 are drilled at positions on the bottom surface of the multi-layer board 1 corresponding to the plurality of alignment marks 13. In this embodiment, the diameter of the plurality of alignment holes 20 is at least 20 mil greater than the diameter of the corresponding alignment mark 13, and the drilling depth of each alignment hole 20 is less than the distance between the bottom surface of the multi-layer board 1 and the target layer 10a, so that the target layer 10a will not be drilled by the plurality of alignment holes 20.

As shown in FIG. 1 , the positioning compensation step S30 is to read the positions of the plurality of alignment holes 20 and calculate a back drilling hole positioning compensation according to the positions of the plurality of alignment holes 20 .

In more detail, as shown in FIGS. 7, 8 and 10, in this embodiment, the positioning compensation step S30 can capture the image of the multi-layer board 1 through the image capture module 230 of the printed circuit board manufacturing equipment 200, and then read the positions of the plurality of alignment holes 20 from the image of the multi-layer board 1, and then calculate the back drill hole positioning compensation. The back drill hole positioning compensation is used to correct the drilling position of at least one back drill hole 30 when the printed circuit board manufacturing equipment 200 drills at least one back drill hole 30 in the subsequent back drill hole forming step S40.

It is worth noting that, since the drilling positions of the plurality of alignment holes 20 correspond to the plurality of alignment marks 13 on the target layer 10a, the back drilling hole positioning compensation can be calculated based on the offset or deformation of the plurality of alignment marks 13 on the target layer 10a. In other words, the back drilling hole positioning compensation can be used to correct the deviation of the position offset or deformation of the target layer 10a in the subsequent back drilling hole forming step, thereby improving the positioning accuracy of the relative position of the back drilling hole 30 and the target layer 10a.

As shown in FIG. 8 and FIG. 9 , the back drill hole forming step S40 is to calculate at least one back drill hole drilling position through the back drill hole positioning compensation, and then drill at least one back drill hole 30 on the bottom surface of the multi-layer board 1 according to at least one back drill hole drilling position.

More specifically, as shown in FIG8 and FIG10 , the back-drilling hole forming step S40 is to drill at least one back-drilling hole 30 on the bottom surface of the multi-layer board 1 by a second drilling device 250 of the printed circuit board manufacturing equipment 200. The second drilling device 250 has a second drill bit 251 for drilling the back-drilling hole 30.

As shown in FIG9 , the diameter of at least one of the back drill holes 30 is larger than the diameter of at least one of the via holes 11, the position of at least one of the back drill holes 30 coincides with the position of at least one of the via holes 11, and the drilling depth of at least one of the back drill holes 30 is smaller than the length of at least one of the via holes 11, so that the conductive layer 111 on the inner side wall of at least one of the via holes 11 is partially cut off by the back drill hole 30, so that the length of the conductive layer 111 in the via hole 11 is shortened.

In more detail, the diameter of at least one of the back drill holes 30 is at least 10 mil greater than the diameter of at least one of the via holes 11, and the drilling depth of at least one of the back drill holes 30 is less than the distance between the bottom surface of the multi-layer board 1 and the signal layer 10b, so that the signal layer 10b will not be drilled by at least one of the back drill holes 30.

As shown in FIG9 , it is a combined cross-sectional view of a printed circuit board manufactured by the method of the present invention. The printed circuit board has the multi-layer board 1, and the multi-layer board 1 has a plurality of core boards 10 stacked on each other, and at least one conductive hole 11 penetrating the plurality of core boards 10. Since the position of at least one back drill hole 30 can be corrected according to the positions of the plurality of alignment marks 13 of the target layer 10a, the accuracy of the relative position of at least one back drill hole 30 and the target layer 10a can be ensured, and the conductive line 12 of the target layer 10a closest to the back drill hole 30 is prevented from contacting the back drill hole 30 or being drilled by the back drill hole 30, thereby improving the yield of the printed circuit board.

A signal layer 10b and a target layer 10a can be defined in the core boards 10 of the multi-layer board 1. A plurality of alignment marks 13 are provided on the target layer 10a.

The bottom surface of the multi-layer board 1 is drilled with a plurality of alignment holes 20 at positions corresponding to the plurality of alignment marks 13 , and at least one back drill hole 30 is drilled at a position corresponding to at least one conductive hole 11 .

As shown in FIG10 , the printed circuit board manufacturing equipment 200 of the present invention is used to manufacture the printed circuit board. The printed circuit board manufacturing equipment 200 comprises: a carrier device 210, a moving module 220, an image capturing module 230, a first drilling device 240, and a second drilling device 250.

The supporting device 210 has a platform for supporting the multi-layer plate 1, and is used to position the multi-layer plate 1 at a processing position. The moving module 220 is arranged on the supporting device 210, and is used to arrange the first drilling device 240 and the second drilling device 250. The moving module 220 is used to control the relative displacement of the first drilling device 240, the second drilling device 250 and the supporting device 210.

The image capture module 230 is disposed above the carrier 210 and is used to capture the image of the multi-layer board 1. In this embodiment, the image capture module 230 has at least one camera, which is used to capture the image of the multi-layer board 1 and identify the positions of the plurality of alignment marks 13 and the positions of the plurality of alignment holes 20.

The first drilling device 240 and the second drilling device 250 are respectively connected to the moving module 220 and can be controlled by the moving module to move relative to the supporting device. The first drilling device 240 has a first drill bit 241 for drilling a plurality of the alignment holes 20, and the second drilling device 250 has a second drill bit 251 for drilling at least one back drilling hole 30.

The printed circuit board manufacturing equipment 200 is configured to capture the image of the bottom surface of the multi-layer board 1 through at least one image capture module 230, and read the positions of the multiple alignment marks 13 through image recognition means, and then drive the first drilling device 240 through the moving module 220 to drill the multiple alignment holes 20 at the positions of the multiple alignment marks 13 on the bottom surface of the multi-layer board 1.

Then, at least one of the image capture modules 230 is used to capture the image of the bottom surface of the multi-layer board 1, and the positions of the plurality of the alignment holes 20 are read out. Then, a back drill hole positioning compensation is calculated based on the positions of the plurality of the alignment holes 20. Then, the drilling position of the back drill hole 30 is corrected based on the back drill hole positioning compensation to obtain a back drill hole drilling position. Then, at least one back drill hole 30 is drilled in the multi-layer board 1 through the second drilling device 250.

[Beneficial Effects of Embodiments]

One of the beneficial effects of the present invention is that the printed circuit board manufacturing method provided by the present invention provides a plurality of alignment marks on the target layer, and drills a plurality of alignment holes on the bottom surface of the multi-layer board by reading the positions of the plurality of alignment marks, and calculates the back drill hole positioning compensation by reading the positions of the plurality of alignment holes, and then uses the back drill hole positioning compensation to calculate the back drill hole drilling position, and then drills at least one back drill hole on the bottom surface of the multi-layer board. The technical solution can correct the back drill hole drilling position through the back drill hole positioning compensation, so that the position of at least one back drill hole can be corrected according to the position offset or deformation of the target layer. Therefore, the deviation of the relative position of the back drill hole and the target layer is reduced, and the situation where the conductive line of the target layer is damaged by the back drill hole can be reduced, thereby improving the manufacturing yield of the printed circuit board.

The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

1: Multi-layer board 10: Core board 10a: Target layer 10b: Signal layer 11: Via hole 111: Conductive layer 112: Contact pad 12: Conductive line 13: Alignment mark 20: Alignment hole 30: Back drilling hole 200: Printed circuit board manufacturing equipment 210: Carrier device 220: Moving module 230: Image capture module 240: First drilling device 241: First drill head 250: Second drilling device 251: Second drill head S10: Preparation step S20: Alignment hole forming step S30: Positioning compensation step S40: Back drilling forming steps

FIG. 1 is a flow chart of a method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a multi-layer assembly according to an embodiment of the present invention.

FIG. 3 is an exploded schematic diagram of a multi-layer board according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a multi-layer assembly according to an embodiment of the present invention.

FIG. 5 is a schematic top view of a multi-layer board according to an embodiment of the present invention.

FIG6 is a schematic diagram of the method for implementing the alignment hole forming step of the present invention.

FIG. 7 is a schematic diagram of a multi-layer plate after completing the alignment hole forming step according to an embodiment of the present invention.

FIG8 is a schematic diagram of a method for implementing the back drilling hole forming step of the present invention.

FIG. 9 is a schematic diagram of a multi-layer plate after completing the back drilling forming step according to an embodiment of the present invention.

FIG. 10 is a schematic diagram of a printed circuit board manufacturing apparatus according to an embodiment of the present invention.

S10: Preparation step S20: Alignment hole forming step S30: Positioning compensation step S40: Back drilling hole forming step

Claims (10)

A method for manufacturing a printed circuit board is used to manufacture a printed circuit board, and the method comprises: A preparation step, providing a multi-layer board, the multi-layer board can define a relative top surface and a bottom surface, the multi-layer board has a plurality of core boards stacked on each other, and at least one conductive hole penetrating the plurality of core boards; a target layer can be defined among the plurality of core boards, the target layer is provided with a plurality of alignment marks, and the positions of the plurality of alignment marks and the position of at least one conductive hole do not overlap; An alignment hole forming step, reading the positions of the plurality of alignment marks, and drilling a plurality of alignment holes at the positions corresponding to the plurality of alignment marks on the bottom surface of the multi-layer board; A positioning compensation step, reading the positions of the plurality of alignment holes, and calculating a back drill hole positioning compensation according to the positions of the plurality of alignment holes; and A back drill hole forming step, after calculating a back drill hole drilling position according to the back drill hole positioning compensation, drilling at least one back drill hole on the bottom surface of the multi-layer board according to the back drill hole drilling position; the position of at least one back drill hole overlaps with at least one via hole, and the diameter of at least one back drill hole is greater than the diameter of at least one via hole. A method for manufacturing a printed circuit board as described in claim 1, wherein each of the core boards has a plurality of conductive lines, and among the plurality of conductive lines of each core board, the distance between the conductive line closest to the back drill hole and the back drill hole is defined as the conductor spacing; in the preparation step, among the plurality of core boards penetrated by at least one of the back drill holes, the core board having the smallest conductor spacing is defined as the target layer. A printed circuit board manufacturing method as described in claim 1, wherein a plurality of alignment marks are arranged at four corner positions of the core board of the target layer. A printed circuit board manufacturing method as described in claim 1, wherein, in the hole positioning forming step, the diameter of the plurality of alignment holes is greater than the diameter of the plurality of alignment marks. A method for manufacturing a printed circuit board as described in claim 4, wherein the diameter of each of the alignment holes is at least 20 mil greater than the diameter of the corresponding alignment mark. A printed circuit board manufacturing method as described in claim 1, wherein, in the alignment hole forming step, a plurality of alignment mark images are captured by a camera device, and the positions of the plurality of alignment marks are identified by the images of the plurality of alignment marks; and in the positioning compensation step, a plurality of alignment hole images are captured by a camera device, and the positions of the plurality of alignment holes are identified by the images of the plurality of alignment holes. A printed circuit board manufacturing method as described in claim 1, wherein the drilling depth of at least one of the alignment holes is less than the distance between the bottom surface of the multi-layer board and the target layer. In the printed circuit board manufacturing method as described in claim 1, a core board with a signal layer can be defined among the multiple core boards, the conductive line of the signal layer is electrically connected to the conductive layer of the back drill hole, and the drilling depth of at least one of the back drill holes is less than the distance between the bottom surface of the multi-layer board and the signal layer. A printed circuit board manufacturing device used in the method as described in any one of claims 1 to 8, comprising: A carrier device for carrying a multi-layer board; An image capture module for capturing images of a plurality of alignment marks and a plurality of alignment holes; A moving module disposed on the carrier device; At least one first drilling device and at least one second drilling device, disposed on the moving module, and capable of driving the first drilling device and the second drilling device and the carrier device to move relative to each other through the moving module; at least one of the first drilling devices has a first drill bit for drilling at least one alignment hole, and at least one of the second drilling devices has a second drill bit for drilling at least one back drill hole; The printed circuit board manufacturing equipment is configured to capture the image of the multi-layer board through at least one of the image capture modules, and then read the positions of the plurality of alignment marks through the image of the multi-layer board, and control the first drilling device to drill the plurality of alignment holes at the positions of the plurality of alignment marks on the bottom surface of the multi-layer board; the printed circuit board manufacturing equipment is also configured to The image of the alignment hole can be captured through at least one of the camera devices, and the positions of the plurality of alignment holes can be read through the images of the plurality of multi-layer boards, and the back drilling hole positioning compensation can be calculated through the positions of the plurality of alignment holes, and the back drilling hole drilling position can be calculated according to the back drilling hole positioning compensation, and the second drilling device can be controlled to drill at least one of the back drilling holes. A printed circuit board is manufactured by the method described in any one of claims 1 to 8.

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