TW202423209A - Method for manufacturing printed circuit board and the printed circuit board and manufacturing equipment thereof - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 93
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
Description
本發明涉及一種印刷電路板製造方法及其印刷電路板與製造設備,特別是涉及一種用來製造多層印刷電路板的印刷電路板製造方法及其印刷電路板與製造設備。The present invention relates to a method for manufacturing a printed circuit board, a printed circuit board and a manufacturing device, and in particular to a method for manufacturing a printed circuit board for manufacturing a multi-layer printed circuit board, a printed circuit board and a manufacturing device.
多層式的電路板,信號在電路板的不同層之間的傳輸是透過導通孔來實現。然而,在高速的多層式電路板中,導通孔內部分的電鍍銅會成為訊號傳輸的Stubs(也可叫做尾巴或柱子),這些Stubs對訊號傳輸會產生不利的影響,如:造成雜訊干擾或訊號完整性不佳。為了獲得更好的訊號傳輸品質,就需要減少導通孔內Stubs的長度,而且殘留Stubs的長度越短,對訊號傳輸的品質越有利。In multi-layer circuit boards, signal transmission between different layers of the circuit board is achieved through vias. However, in high-speed multi-layer circuit boards, the electroplated copper inside the vias will become stubs (also called tails or pillars) for signal transmission. These stubs will have an adverse effect on signal transmission, such as causing noise interference or poor signal integrity. In order to obtain better signal transmission quality, it is necessary to reduce the length of the stubs in the vias, and the shorter the length of the residual stubs, the better the quality of signal transmission.
為了要減少導通孔內Stubs的長度,背鑽孔技術是常常被採用的方式之一;然而,現有的印刷電路板由於密度提高,使得內層導體和背鑽孔的間距縮小,因此使得印刷電路板鑽設背鑽孔時,背鑽孔位置若有偏差,容易接觸到鄰近於背鑽孔的內層導體,而導致內層導體損壞,甚至於斷裂,造成不良。In order to reduce the length of stubs in vias, back drilling technology is one of the methods often used; however, due to the increase in density of existing printed circuit boards, the distance between the inner conductor and the back drill hole is reduced. Therefore, when drilling back drill holes in printed circuit boards, if the position of the back drill holes is deviated, it is easy to contact the inner conductors adjacent to the back drill holes, causing damage to the inner conductors or even fractures, resulting in defects.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventors of the present invention believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種印刷電路板製造方法,其包括:一準備步驟,提供一多層板,所述多層板能夠定義出相對的頂面與底面,所述多層板具有相互疊合的多個芯板,和貫通多個所述芯板的至少一個導通孔;多個所述芯板當中能夠定義出一目標層,所述目標層設置有多個對位標記,多個所述對位標記的位置和至少一個所述導通孔的位置不相重疊;一對位孔成型步驟,讀取多個所述對位標記的位置,在所述多層板的底面對應於多個所述對位標記的位置鑽設多個對位孔;一定位補償步驟,讀取多個所述對位孔的位置,依據多個所述對位孔的位置,計算出一背鑽孔定位補償;及一背鑽孔成型步驟,為依據所述背鑽孔定位補償計算出一背鑽孔鑽孔位置後,依據所述背鑽孔鑽孔位置在所述多層板的底面鑽設出至少一個背鑽孔;至少一個所述背鑽孔的位置和至少一個所述導通孔重疊,且至少一個所述背鑽孔的直徑大於至少一個所述導通孔的直徑。The technical problem to be solved by the present invention is to provide a method for manufacturing a printed circuit board in view of the shortcomings of the prior art, which comprises: a preparation step, providing a multi-layer board, the multi-layer board can define a relative top surface and a bottom surface, the multi-layer board has a plurality of core boards stacked on each other, and at least one conductive hole penetrating the plurality of core boards; a target layer can be defined among the plurality of core boards, the target layer is provided with a plurality of alignment marks, and the positions of the plurality of alignment marks and the position of at least one conductive hole do not overlap; an alignment hole forming step, reading the positions of the plurality of alignment marks, and forming a hole at the target layer; A plurality of alignment holes are drilled on the bottom surface of the multi-layer board at positions corresponding to the plurality of alignment marks; a positioning compensation step is performed to read the positions of the plurality of alignment holes and calculate a back drill hole positioning compensation according to the positions of the plurality of alignment holes; and a back drill hole forming step is performed to calculate a back drill hole drilling position according to the back drill hole positioning compensation and then drill at least one back drill hole on the bottom surface of the multi-layer board according to the back drill hole drilling position; the position of at least one back drill hole overlaps with at least one conductive hole, and the diameter of at least one back drill hole is greater than the diameter of at least one conductive hole.
為了解決上述的技術問題,本發明所採用的另外一技術方案是提供一種印刷電路板製造設備,其中包括:一承載裝置,用來承載一個所述多層板;一影像擷取模組,用來擷取多個所述對位標記和多個所述對位孔的影像;一移動模組,設置於所述承載裝置上;及至少一第一鑽孔裝置和至少一第二鑽孔裝置,設置於所述移動模組上,且能透過所述移動模組帶動所述第一鑽孔裝置和所述第二鑽孔裝置和所述承載裝置相對位移;至少一個所述第一鑽孔裝置具有一第一鑽頭,用來鑽設至少一個所述對位孔,至少一個所述第二鑽孔裝置具有一第二鑽頭,用來鑽設至少一個所述背鑽孔;其中,所述印刷電路板製造設備配置為能夠透過至少一個所述影像擷取模組擷取所述多層板的影像,進而透過多層板的影像讀取多個所述對位標記的位置,且控制所述第一鑽孔裝置在所述多層板底面對應多個所述對位標記的位置鑽設多個所述對位孔;所述印刷電路板製造設備還配置為能夠透過至少一個所述攝像裝置擷取所述對位孔的影像,且透過多個多層板的影像讀取多個所述對位孔的位置,進而透過多個所述對位孔的位置計算出所述背鑽孔定位補償,進而依據所述背鑽孔定位補償計算出所述背鑽孔鑽孔位置,並控制所述第二鑽孔裝置鑽設至少一個所述背鑽孔。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a printed circuit board manufacturing equipment, which includes: a supporting device for supporting a multi-layer board; an image capture module for capturing images of multiple alignment marks and multiple alignment holes; a moving module, which is arranged on the supporting device; and at least one first drilling device and at least one second drilling device, which are arranged on the moving module and can drive the first drilling device and the second drilling device and the supporting device to move relative to each other through the moving module; at least one of the first drilling devices has a first drill bit for drilling at least one alignment hole, and at least one of the second drilling devices has a second drill bit for drilling at least one back drill hole. wherein the printed circuit board manufacturing equipment is configured to capture the image of the multi-layer board through at least one of the image capture modules, and then read the positions of the plurality of alignment marks through the image of the multi-layer board, and control the first drilling device to drill the plurality of alignment holes at the positions corresponding to the plurality of alignment marks on the bottom surface of the multi-layer board; the printed circuit board manufacturing equipment is further configured In order to capture the image of the alignment hole through at least one of the camera devices, and read the positions of multiple alignment holes through images of multiple multi-layer plates, and then calculate the back drill hole positioning compensation through the positions of multiple alignment holes, and then calculate the back drill hole drilling position according to the back drill hole positioning compensation, and control the second drilling device to drill at least one back drill hole.
為了解決上述的技術問題,本發明所採用的另外再一技術方案是提供一種以所述印刷電路板製造方法所製造的印刷電路板。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a printed circuit board manufactured by the printed circuit board manufacturing method.
本發明的其中一有益效果在於,本發明所提供的所述印刷電路板製造方法,透過在所述目標層設置多個所述對位標記,以及透過讀取多個所述對位標記的位置,而在所述多層板底面鑽設多個對位孔,並透過讀取多個所述對位孔的位置計算出所述背鑽孔定位補償,進而使用所述背鑽孔定位補償計算出所述背鑽孔鑽孔位置,再於所述多層板的底面鑽設至少一個所述背鑽孔的技術方案,其能夠透過所述背鑽孔定位補償修正所述背鑽孔鑽孔位置,使得至少一個所述背鑽孔的位置能夠依據所述目標層的位置偏移或變形而修正。因此減少了所述背鑽孔和所述目標層相對位置的偏差,而能夠減少所述目標層的導電線路被所述背鑽孔接觸而損毀的情形,進而提高印刷電路板的製造良率。One of the beneficial effects of the present invention is that the printed circuit board manufacturing method provided by the present invention provides a plurality of alignment marks on the target layer, and drills a plurality of alignment holes on the bottom surface of the multi-layer board by reading the positions of the plurality of alignment marks, and calculates the back drill hole positioning compensation by reading the positions of the plurality of alignment holes, and then uses the back drill hole positioning compensation to calculate the back drill hole drilling position, and then drills at least one back drill hole on the bottom surface of the multi-layer board. The technical solution can correct the back drill hole drilling position through the back drill hole positioning compensation, so that the position of at least one back drill hole can be corrected according to the position offset or deformation of the target layer. Therefore, the deviation of the relative position of the back drill hole and the target layer is reduced, and the situation where the conductive line of the target layer is damaged by the back drill hole can be reduced, thereby improving the manufacturing yield of the printed circuit board.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“印刷電路板製造方法及其印刷電路板與製造設備”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is an explanation of the implementation of the "printed circuit board manufacturing method and printed circuit board and manufacturing equipment" disclosed in the present invention through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used herein may include any one or more combinations of the associated listed items as appropriate.
本發明實施例提供一種印刷電路板製造方法及其印刷電路板與製造設備。為便於理解所述印刷電路板的製造方法,以下將先介紹所述印刷電路板的製造方法,接著再介紹所述印刷電路板,和所述印刷電路板的製造設備。The present invention provides a method for manufacturing a printed circuit board and a printed circuit board and a manufacturing device thereof. To facilitate understanding of the method for manufacturing the printed circuit board, the method for manufacturing the printed circuit board will be first introduced below, followed by the printed circuit board and the manufacturing device for the printed circuit board.
參考圖1至圖9所示,本發明所述印刷電路板製造方法包含:一準備步驟S10、一對位孔成型步驟S20、一定位補償步驟S30、和一背鑽孔成型步驟S40。所述印刷電路板製造方法主要為在所述準備步驟中提供一多層板1,接著在所述對位孔成型步驟S20中在所述多層板1上鑽設多個對位孔20,在所述定位補償步驟S30中透過多個所述對位孔20的位置計算一背鑽孔位置補償,在所述背鑽孔成型步驟S40中,透過所述背鑽孔位置補償修正背鑽孔的鑽孔位置,而在所述多層板1上鑽設至少一個背鑽孔30。1 to 9 , the printed circuit board manufacturing method of the present invention comprises: a preparation step S10, a positioning hole forming step S20, a positioning compensation step S30, and a back drilling hole forming step S40. The printed circuit board manufacturing method mainly provides a
其中,如圖1所示,所述準備步驟S10為提供所述多層板1。如圖2至圖4所示,所述多層板1能夠定義出相對的頂面與底面,所述多層板1具有相互疊合的多個芯板10,和貫穿多個所述芯板10的至少一個導通孔11。其中,多個所述芯板10是由銅箔基板裁切為適合的尺寸後,再通過線路蝕刻製程所形成。每一個所述芯板10上分別具有導電線路12,且每一個所述芯板10相互貼合,而形成所述多層板1。As shown in FIG1 , the preparation step S10 is to provide the
至少一個所述導通孔11貫穿過多個所述芯板10,至少一個所述導通孔11的內側壁透過電鍍手段形成一導電層111。所述導電層111延伸到至少一個所述導通孔11的開口的外側,而形成位於所述導通孔11的開口外側的一接觸墊112。多個所述芯板10當中,至少一個所述芯板10的導電線路12和所述導電層111電性連接,導電線路12電性連接所述導電層111的至少一個所述芯板10定義為信號層10b。At least one of the
所述多層板1還能夠定義出一目標層10a。如圖2和圖6至圖8所示,被至少一個所述背鑽孔30貫穿的每一個所述芯板10的所述導電線路當中,最為靠近所述背鑽孔30內側壁的所述導電線路12相距於所述背鑽孔30的距離定義為導體間距。而所述目標層10a為被至少一個所述背鑽孔30貫穿的多個所述芯板10當中,具有最小的所述導體間距的所述芯板10。The
如圖2至圖8所示,所述目標層10a設置有多個對位標記13,本實施例中,多個所述對位標記13分別設置於所述目標層10a的四個邊角位置。然而,本發明不限於此,舉例來說,當所述多層板1具有較大面積的實施例中,所述目標層10a能夠區分為多個區塊,多個所述對位標記分別設置於多個所述區塊的邊角位置。透過上述配置方式,使得大面積的所述多層板1中,能夠避免多個所述對位標記13的間距過大,而影響定位的精確度。As shown in FIG. 2 to FIG. 8 , the
如圖5和圖6所示,所述對位孔成型步驟S20,為透過攝像裝置擷取所述多層板1的影像,且從所述多層板1的影像讀取多個所述對位標記13的位置,進而在所述多層板1的底面對應多個所述對位標記13的位置鑽設多個對位孔20。As shown in FIG. 5 and FIG. 6 , the alignment hole forming step S20 is to capture the image of the
更詳細地說,如圖5、圖6、圖7和圖10所示,本實施例中,在所述對位孔成型步驟S20中,是透過一印刷電路板製造設備200的影像擷取模組230擷取所述多層板1的影像,以及透過一第一鑽孔裝置240在所述多層板1鑽設多個所述對位孔20。In more detail, as shown in Figures 5, 6, 7 and 10, in this embodiment, in the alignment hole forming step S20, an image of the
值得說明的是,當影像擷取模組擷取所述多層板1的影像時,多個所述對位標記13雖然被多個所述芯板10覆蓋,然而在多個所述對位標記13區域內的影像和在位於多個所述對位標記13以外的區域的影像會具有色差或明暗差異,因而能夠辨別出多個所述對位標記13的位置和座標。It is worth noting that when the image capture module captures the image of the
如圖7所示,當所述對位孔成型步驟S20完成後,在所述多層板1底面對應於多個所述對位標記13的位置鑽設有多個所述對位孔20。本實施例中,多個所述對位孔20的直徑相較於相對應的所述對位標記13的直徑至少大於20mil,並且每一個所述對位孔20的鑽孔深度小於所述多層板1的底面距離所述目標層10a的距離,因而使得所述目標層10a不會被多個所述對位孔20鑽破。As shown in FIG7 , after the alignment hole forming step S20 is completed, a plurality of
如圖1所示,所述定位補償步驟S30,為讀取多個所述對位孔20的位置,且依據多個所述對位孔20的位置,計算出一背鑽孔定位補償。As shown in FIG. 1 , the positioning compensation step S30 is to read the positions of the plurality of
更詳細地說,如圖7、圖8和10所示,本實施例中,所述定位補償步驟S30,能夠透過所述印刷電路板製造設備200的所述影像擷取模組230擷取所述多層板1的影像,進而從所述多層板1的影像讀取多個所述對位孔20的位置,進而計算出所述背鑽孔定位補償。所述背鑽孔定位補償,是用來在後續的背鑽孔成型步驟S40中,供所述印刷電路板製造設備200鑽設至少一個所述背鑽孔30時,修正至少一個所述背鑽孔30的鑽孔位置。In more detail, as shown in FIGS. 7, 8 and 10, in this embodiment, the positioning compensation step S30 can capture the image of the
值得說明的是,由於多個所述對位孔20的鑽孔位置是對應於所述目標層10a上的多個所述對位標記13,因而使得所述背鑽孔定位補償能夠依據所述目標層10a的多個所述對位標記13的偏移或變形而計算出來。也就是說,所述背鑽孔定位補償能夠在後續的背鑽孔成型步驟中,用來修正所述目標層10a的位置偏移或變形的偏差,而提高背鑽孔30和所述目標層10a相對位置的定位精確度。It is worth noting that, since the drilling positions of the plurality of
如圖8和圖9所示,所述背鑽孔成型步驟S40,為透過所述背鑽孔定位補償,計算出至少一個背鑽孔鑽孔位置後,依據至少一個所述背鑽孔鑽孔位置在所述多層板1的底面鑽設出至少一個所述背鑽孔30。As shown in FIG. 8 and FIG. 9 , the back drill hole forming step S40 is to calculate at least one back drill hole drilling position through the back drill hole positioning compensation, and then drill at least one
更詳細地說,如圖8和圖10所示,所述背鑽孔成型步驟S40是透過所述印刷電路板製造設備200的一第二鑽孔裝置250在所述多層板1的底面鑽設出至少一個所述背鑽孔30。所述第二鑽孔裝置250具有用來鑽設所述背鑽孔30的第二鑽頭251。More specifically, as shown in FIG8 and FIG10 , the back-drilling hole forming step S40 is to drill at least one back-
如圖9所示,至少一個所述背鑽孔30的直徑大於至少一個所述導通孔11的直徑,至少一個所述背鑽孔30的位置是和至少一個所述導通孔11的位置重合,並且至少一個所述背鑽孔30的鑽孔深度小於至少一個所述導通孔11的長度,因而使得至少一個所述導通孔11內側壁的導電層111被所述背鑽孔30部分地截斷,因而使得所述導通孔11內具有所述導電層111的長度縮短。As shown in FIG9 , the diameter of at least one of the
更詳細地說,至少一個所述背鑽孔30的直徑相較於至少一個所述導通孔11的直徑至少大於10mil,並且至少一個所述背鑽孔30的鑽孔深度小於所述多層板1的底面距離所述信號層10b的距離,因而使得所述信號層10b不會被至少一個所述背鑽孔30鑽破。In more detail, the diameter of at least one of the
如圖9所示,為透過本發明方法製造完成的印刷電路板的組合剖面圖。所述印刷電路板具有所述多層板1,所述多層板1具有相互疊合的多個所述芯板10,和貫穿多個所述芯板10的至少一個所述導通孔11。由於至少一個所述背鑽孔30的位置能夠依據所述目標層10a的多個所述對位標記13的位置而修正,因而能夠確保至少一個所述背鑽孔30和所述目標層10a相對位置的精確度,避免所述目標層10a的最為靠近所述背鑽孔30的所述導電線路12接觸到所述背鑽孔30,或被所述背鑽孔30鑽破的情形,因而能夠提高印刷電路板良率。As shown in FIG9 , it is a combined cross-sectional view of a printed circuit board manufactured by the method of the present invention. The printed circuit board has the
所述多層板1的多個所述芯板10當中能夠定義出一個所述信號層10b和一個所述目標層10a。在所述目標層10a設置有多個所述對位標記13。A
所述多層板1的底面在對應多個所述對位標記13的位置鑽設有多個所述對位孔20,並且在對應至少一個所述導通孔11的位置鑽設有至少一個所述背鑽孔30。The bottom surface of the
如圖10所示,為本發明用來製造所述印刷電路板的印刷電路板製造設備200。所述印刷電路板製造設備200包含:一承載裝置210、一移動模組220、一影像擷取模組230,和第一鑽孔裝置240、及第二鑽孔裝置250。As shown in FIG10 , the printed circuit
其中,所述承載裝置210具有用來承載所述多層板1的載台,用來將所述多層板1定位於一加工位置上。所述移動模組220設置於所述承載裝置210上,且供設置所述第一鑽孔裝置240和所述第二鑽孔裝置250,所述移動模組220用來控制所述第一鑽孔裝置240和所述第二鑽孔裝置250和所述承載裝置210相對位移。The supporting
所述影像擷取模組230設置於所述承載裝置210上方,用來擷取所述多層板1的影像。本實施例中,所述影像擷取模組230具有至少一個攝像頭,用夠用來擷取所述多層板1的影像,並辨識多個所述對位標記13的位置和多個所述對位孔20的位置。The
所述第一鑽孔裝置240和所述第二鑽孔裝置250分別連接於所述移動模組220,且能夠受所述移動模組控制,而和所述承載裝置相對位移。所述第一鑽孔裝置240具有一第一鑽頭241,用來鑽設多個所述對位孔20,所述第二鑽孔裝置250具有一第二鑽頭251,用來鑽設至少一個所述背鑽孔30。The
所述印刷電路板製造設備200配置為能夠透過至少一所述影像擷取模組230擷取所述多層板1底面的影像,且透過影像辨識手段讀取到多個所述對位標記13的位置,接著再透過所述移動模組220帶動所述第一鑽孔裝置240在所述多層板1的底面對應多個所述對位標記13的位置鑽設多個所述對位孔20。The printed circuit
接著再透過至少一個所述影像擷取模組230擷取所述多層板1底面的影像,並讀取出多個所述多個所述對位孔20的位置,接著再依據多個所述對位孔20的位置,計算出一背鑽孔定位補償,接著再依據所述背鑽孔定位補償修正所述背鑽孔30的鑽孔位置,得到一背鑽孔鑽孔位置,再透過所述第二鑽孔裝置250在所述多層板1鑽設至少一個所述背鑽孔30。Then, at least one of the
[實施例的有益效果][Beneficial Effects of Embodiments]
本發明的其中一有益效果在於,本發明所提供的所述印刷電路板製造方法,透過在所述目標層設置多個所述對位標記,以及透過讀取多個所述對位標記的位置,而在所述多層板底面鑽設多個對位孔,並透過讀取多個所述對位孔的位置計算出所述背鑽孔定位補償,進而使用所述背鑽孔定位補償計算出所述背鑽孔鑽孔位置,再於所述多層板的底面鑽設至少一個所述背鑽孔的技術方案,其能夠透過所述背鑽孔定位補償修正所述背鑽孔鑽孔位置,使得至少一個所述背鑽孔的位置能夠依據所述目標層的位置偏移或變形而修正。因此減少了所述背鑽孔和所述目標層相對位置的偏差,而能夠減少所述目標層的導電線路被所述背鑽孔接觸而損毀的情形,進而提高印刷電路板的製造良率。One of the beneficial effects of the present invention is that the printed circuit board manufacturing method provided by the present invention provides a plurality of alignment marks on the target layer, and drills a plurality of alignment holes on the bottom surface of the multi-layer board by reading the positions of the plurality of alignment marks, and calculates the back drill hole positioning compensation by reading the positions of the plurality of alignment holes, and then uses the back drill hole positioning compensation to calculate the back drill hole drilling position, and then drills at least one back drill hole on the bottom surface of the multi-layer board. The technical solution can correct the back drill hole drilling position through the back drill hole positioning compensation, so that the position of at least one back drill hole can be corrected according to the position offset or deformation of the target layer. Therefore, the deviation of the relative position of the back drill hole and the target layer is reduced, and the situation where the conductive line of the target layer is damaged by the back drill hole can be reduced, thereby improving the manufacturing yield of the printed circuit board.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.
1:多層板
10:芯板
10a:目標層
10b:信號層
11:導通孔
111:導電層
112:接觸墊
12:導電線路
13:對位標記
20:對位孔
30:背鑽孔
200:印刷電路板製造設備
210:承載裝置
220:移動模組
230:影像擷取模組
240:第一鑽孔裝置
241:第一鑽頭
250:第二鑽孔裝置
251:第二鑽頭
S10:準備步驟
S20:對位孔成型步驟
S30:定位補償步驟
S40:背鑽孔成型步驟
1: Multi-layer board
10:
圖1為本發明實施例印刷電路板製造方法的流程圖。FIG. 1 is a flow chart of a method for manufacturing a printed circuit board according to an embodiment of the present invention.
圖2為本發明實施例一多層板的組合示意圖。FIG. 2 is a schematic diagram of a multi-layer assembly according to an embodiment of the present invention.
圖3為本發明實施例一多層板的分解示意圖。FIG. 3 is an exploded schematic diagram of a multi-layer board according to an embodiment of the present invention.
圖4為本發明實施例一多層板的組合剖面示意圖。FIG. 4 is a schematic cross-sectional view of a multi-layer assembly according to an embodiment of the present invention.
圖5為本發明實施例一多層板的俯視示意圖。FIG. 5 is a schematic top view of a multi-layer board according to an embodiment of the present invention.
圖6為本發明實施對位孔成型步驟的方法示意圖。FIG6 is a schematic diagram of the method for implementing the alignment hole forming step of the present invention.
圖7為本發明實施例的完成對位孔成型步驟後的多層板的示意圖。FIG. 7 is a schematic diagram of a multi-layer plate after completing the alignment hole forming step according to an embodiment of the present invention.
圖8為本發明實施背鑽孔成型步驟的方法示意圖。FIG8 is a schematic diagram of a method for implementing the back drilling hole forming step of the present invention.
圖9為本發明實施例的完成背鑽孔成型步驟後的多層板的示意圖。FIG. 9 is a schematic diagram of a multi-layer plate after completing the back drilling forming step according to an embodiment of the present invention.
圖10為本發明實施例的印刷電路板製造設備的示意圖。FIG. 10 is a schematic diagram of a printed circuit board manufacturing apparatus according to an embodiment of the present invention.
S10:準備步驟 S10: Preparation steps
S20:對位孔成型步驟 S20: Alignment hole forming step
S30:定位補償步驟 S30: Positioning compensation step
S40:背鑽孔成型步驟 S40: Back drilling forming step
Claims (10)
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