TWI843808B - 切晶黏晶膜 - Google Patents

切晶黏晶膜 Download PDF

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Publication number
TWI843808B
TWI843808B TW109105121A TW109105121A TWI843808B TW I843808 B TWI843808 B TW I843808B TW 109105121 A TW109105121 A TW 109105121A TW 109105121 A TW109105121 A TW 109105121A TW I843808 B TWI843808 B TW I843808B
Authority
TW
Taiwan
Prior art keywords
die cutting
cutting film
film
die
cutting
Prior art date
Application number
TW109105121A
Other languages
English (en)
Other versions
TW202039612A (zh
Inventor
木村雄大
杉村敏正
大西謙司
宍戸雄一郎
福井章洋
高本尚英
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019038249A external-priority patent/JP7389556B2/ja
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202039612A publication Critical patent/TW202039612A/zh
Application granted granted Critical
Publication of TWI843808B publication Critical patent/TWI843808B/zh

Links

TW109105121A 2019-03-04 2020-02-18 切晶黏晶膜 TWI843808B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-038249 2019-03-04
JP2019038249A JP7389556B2 (ja) 2019-03-04 2019-03-04 ダイシングダイボンドフィルム

Publications (2)

Publication Number Publication Date
TW202039612A TW202039612A (zh) 2020-11-01
TWI843808B true TWI843808B (zh) 2024-06-01

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201908438A (zh) 2017-07-04 2019-03-01 日商日東電工股份有限公司 切晶帶、切晶黏晶膜、及半導體裝置製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201908438A (zh) 2017-07-04 2019-03-01 日商日東電工股份有限公司 切晶帶、切晶黏晶膜、及半導體裝置製造方法

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