TWI840763B - Repair equipment - Google Patents
Repair equipment Download PDFInfo
- Publication number
- TWI840763B TWI840763B TW111108593A TW111108593A TWI840763B TW I840763 B TWI840763 B TW I840763B TW 111108593 A TW111108593 A TW 111108593A TW 111108593 A TW111108593 A TW 111108593A TW I840763 B TWI840763 B TW I840763B
- Authority
- TW
- Taiwan
- Prior art keywords
- tape
- track
- laser
- rail
- repair device
- Prior art date
Links
- 230000008439 repair process Effects 0.000 title claims abstract description 69
- 239000004065 semiconductor Substances 0.000 claims abstract description 45
- 238000012360 testing method Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 19
- 230000002950 deficient Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 230000007488 abnormal function Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
本發明的修補設備包括一基座、一承載裝置、測試裝置及一雷射修補裝置。基座包括一第一安裝區、一第二安裝區、一第一軌道、一第二軌道及一第三軌道。第二安裝區自第一安裝區向上延伸,第一軌道及第二軌道固定設置在第一安裝區。第三軌道設置在第二安裝區。承載裝置連接第一軌道,並用以承載一料盤。料盤包括一半導體元件。測試裝置連接第二軌道,並用以承載一電路基板。雷射修補裝置連接第三軌道,而可在承載裝置及測試裝置上方移動,雷射修補裝置用以將半導體元件電性連接至電路基板。 The repair equipment of the present invention includes a base, a carrier, a test device and a laser repair device. The base includes a first mounting area, a second mounting area, a first track, a second track and a third track. The second mounting area extends upward from the first mounting area, and the first track and the second track are fixedly arranged in the first mounting area. The third track is arranged in the second mounting area. The carrier is connected to the first track and is used to carry a tray. The tray includes a semiconductor component. The test device is connected to the second track and is used to carry a circuit substrate. The laser repair device is connected to the third track and can move above the carrier and the test device. The laser repair device is used to electrically connect the semiconductor component to the circuit substrate.
Description
本發明與修補設備有關,特別是指一種半導體元件的修補設備。 The present invention relates to a repair device, and in particular to a repair device for semiconductor components.
光電元件所組成的面板需要使用巨量的發光二極體(LED),這些發光二極體是矩陣密集地排列,因此,電性測試面板的功能後雖然可發現功能異常地發光二極體及其位置,但目前電性測試及修補需要透過不同的設備來進行,因此,輸送、取料及修補會浪費較多移動的製程時間。 Panels composed of optoelectronic components require a large number of light-emitting diodes (LEDs), which are densely arranged in a matrix. Therefore, although abnormally functioning LEDs and their locations can be found after electrical testing of the panel, electrical testing and repairs currently require different equipment to be performed. Therefore, transportation, material collection and repairs will waste more moving process time.
再者,發光二極體的尺寸微小外,且各發光二極體也是緊密排列在一起,因此在維修上是非常困難的。 Furthermore, the LEDs are tiny in size and are closely arranged together, making them very difficult to repair.
有鑑於上述缺失,本發明的修補設備將電路基板及料盤放置於同一設備上,並透過可移動的雷射修補裝置在電路基板及料盤上移動來實現修補電路基板上功能異常或缺漏半導體元件的位置。 In view of the above defects, the repair equipment of the present invention places the circuit substrate and the material tray on the same equipment, and uses a movable laser repair device to move on the circuit substrate and the material tray to repair the position of the semiconductor components with abnormal functions or missing on the circuit substrate.
為了解決上述缺失,本發明的修補設備包括一基座、一承載裝置、測試裝置及一雷射修補裝置。基座包括一第一安裝區、一第二安裝區、一第一軌道、一第二軌道及一第三軌道。第二安裝區自第一安裝區向上延伸,第一軌道及第二軌道固定設置在第一安裝區。第三軌道設置在第二安裝區。承載裝置 連接第一軌道,並用以承載一料盤。料盤包括一半導體元件。測試裝置連接第二軌道,並用以承載一電路基板。雷射修補裝置連接第三軌道,而可在承載裝置及測試裝置上方移動,雷射修補裝置用以將半導體元件電性連接至電路基板。 In order to solve the above-mentioned defects, the repair equipment of the present invention includes a base, a carrier, a test device and a laser repair device. The base includes a first mounting area, a second mounting area, a first track, a second track and a third track. The second mounting area extends upward from the first mounting area, and the first track and the second track are fixedly arranged in the first mounting area. The third track is arranged in the second mounting area. The carrier is connected to the first track and used to carry a material tray. The material tray includes a semiconductor component. The test device is connected to the second track and used to carry a circuit substrate. The laser repair device is connected to the third track and can be moved above the carrier and the test device. The laser repair device is used to electrically connect the semiconductor component to the circuit substrate.
如此,本發明的修補設備將料盤及電路基板同步放在相同設備上,來縮短移動所耗費的時間,進而提高修補的效率。 In this way, the repair equipment of the present invention places the material tray and the circuit substrate on the same equipment simultaneously to shorten the time spent on movement, thereby improving the efficiency of repair.
10:修補設備 10: Repair equipment
11:基座 11: Base
111:第一安裝區 111: First installation area
113:第二安裝區 113: Second installation area
115:第一軌道 115: Track 1
117:第二軌道 117: Second track
119:第三軌道 119: Track 3
13:承載裝置 13: Carrier device
15:測試裝置 15:Testing equipment
17:雷射修補裝置 17: Laser repair device
171:安裝座 171: Mounting seat
173:雷射系統 173:Laser system
1731:雷射光束 1731:Laser beam
175:取料系統 175: Material taking system
176:膠帶 176: Tape
177:輸送模組 177:Transport module
1771:第一滾筒 1771: First roller
1773:第二滾筒 1773: Second roller
1775:第三滾筒 1775: The third roller
1777:定位滾筒 1777: Positioning roller
179:推動模組 179: Push module
1791:升降單元 1791: Lifting unit
1793:按壓件 1793: Pressing parts
1795:結合塊 1795: Binding block
1797:接觸塊 1797:Contact block
1798:頭部 1798:Head
17981:頂斜面 17981: Top bevel
17983:底面 17983: Bottom
17985:凸部 17985: convex part
1799:窗口 1799:Window
30:料盤 30: Material tray
50:電路基板 50: Circuit board
51:不良品半導體元件 51: Defective semiconductor components
31:良品半導體元件 31:Qualified semiconductor components
有關修補設備的詳細構造、特點與其製作方法將於以下的實施例予以說明,然而,應能理解的是,以下將說明的實施例以及圖式僅只作為示例性地說明,其不應用來限制本發明的申請專利範圍,其中:圖1是本發明的修補設備的立體圖。 The detailed structure, features and manufacturing method of the repair device will be described in the following embodiments. However, it should be understood that the embodiments and drawings described below are only for exemplary purposes and should not be used to limit the scope of the patent application of the present invention. FIG. 1 is a three-dimensional diagram of the repair device of the present invention.
圖2是圖1中修補設備的雷射修補裝置的放大圖。 Figure 2 is an enlarged view of the laser repair device of the repair equipment in Figure 1.
圖3是圖2中雷射修補裝置的按壓件的立體圖。 Figure 3 is a three-dimensional diagram of the pressing part of the laser repair device in Figure 2.
圖4是圖3中按壓件的頭部的圓圈處放大示意圖。 Figure 4 is an enlarged schematic diagram of the circle at the head of the pressing member in Figure 3.
圖5至圖7是圖1中承載裝置、測試裝置及雷射修補裝置的簡化示意,且表示執行移除作業的示意圖。 Figures 5 to 7 are simplified schematic diagrams of the carrier device, the test device, and the laser repair device in Figure 1, and are schematic diagrams of performing the removal operation.
圖8至圖10是圖1中承載裝置、測試裝置及雷射修補裝置的簡化示意,且表示執行取料作業的示意圖。 Figures 8 to 10 are simplified schematic diagrams of the carrier device, test device and laser repair device in Figure 1, and are schematic diagrams of performing the material extraction operation.
圖11至圖13是圖1中承載裝置、測試裝置及雷射修補裝置的簡化示意,且表示執行修補作業的示意圖。 Figures 11 to 13 are simplified schematic diagrams of the carrier device, the test device, and the laser repair device in Figure 1, and are schematic diagrams of performing the repair operation.
為了詳細說明本發明的技術特點所在,茲舉以下的實施例並配合圖式說明如後,其中:如圖1所示,修補設備10包括一基座11、一承載裝置13、一測試裝置15及一雷射修補裝置17。基座11包括一第一安裝區111、一第二安裝區113、一第一軌道115、一第二軌道117及一第三軌道119。第二安裝區113自第一安裝區111向上延伸。第一軌道115及第二軌道117固定設置在第一安裝區111。第三軌道119固定設置在第二安裝區113。
In order to explain the technical features of the present invention in detail, the following embodiments are cited and illustrated with drawings, wherein: As shown in FIG1 , the repair device 10 includes a base 11, a
承載裝置13連接基座11,且連接第一軌道115,並可沿著第一軌道115移動。承載裝置13用以承載料盤30,料盤30上包括多個陣列排列的半導體元件,例如光電元件或積體電路等,料盤30可以是晶圓。半導體元件是微型元件,也就是說半導體元件的其中一尺寸是小於150微米(um)。
The supporting
測試裝置15連接第二軌道117,並可沿著第二軌道117移動。測試裝置15用以承載及測試電路基板50。測試是透過電源或信號來檢查電路基板50的功能。其他實施例中,測試功能也可以透過其他設備進行。
The
電路基板50包括基板本體、導電線路及多個半導體元件。基板本體的材料例如玻璃、聚亞醯胺(Polyimide,PI)等。導電線路形成於基板本體上。半導體元件電性連接導電線路。
The
雷射修補裝置17連接基座11,且連接第三軌道119,並可沿著第三軌道119移動,而在承載裝置13及測試裝置15上移動。雷射修補裝置17移動在承載裝置13上方以取得半導體元件,雷射修補裝置移動在測試裝置上方可選擇移除電路基板的半導體元件或重新連接半導體元件。
The
如此,承載裝置13及測試裝置15可在承載對應的料盤30及電路基板50後,透過第一軌道115及第二軌道117移動雷射修補裝置17下方,接著,雷射修補裝置17只需在料盤30及電路基板50上方進行短行程的移動即可實現有效率的運行。再者,承載裝置13及測試裝置15可獨立運行,來重新承載料盤30及電路基板50。其中,上述各軌道的數量可以更多,而不以本實施例每一裝置配合一軌道為限。
In this way, after carrying the corresponding
如圖2所示,雷射修補裝置17包括安裝座171、雷射系統173及取料系統175。雷射系統173及取料系統175連接安裝座171。
As shown in FIG2 , the
雷射系統173用以投射雷射光束,雷射光束的光斑較佳是矩形形狀,以提供均勻的能量。
The
取料系統175包括一膠帶176、一輸送模組177及一推動模組179。輸送模組177連接膠帶176,且用以輸送膠帶176。本實施例中,輸送模組177包括一第一滾筒1771、一第二滾筒1773、一第三滾筒1775及二定位滾筒1777。膠帶176的一端連接第一滾筒1771,膠帶176的另一端連接第二滾筒1773,第一滾筒1771及第二滾筒1773是透過滾動來輸送膠帶176。
The
本實施例中,第一滾筒1771用以供應膠帶176,第二滾筒1773用以回收膠帶176。第三滾筒1775接觸膠帶176,且用以調整膠帶176的輸送方向。二定位滾筒1777是接觸膠帶176,以使膠帶176在二定位滾筒1777之間形成一平整區。其他實施例中,輸送模組177可以有更多滾筒或較少滾筒,且平整區的範圍可透過二定位滾筒1777來調整。
In this embodiment, the first roller 1771 is used to supply the
膠帶176包括一基材及一黏膠層,膠帶176例如聚醯亞胺(PI)膠帶或熱解膠膠帶(Thermal Release Tape)等。黏膠層連接本體層,且面對第一安裝區。
The
推動模組179用以推動輸送模組177所輸送的膠帶176,推動模組179包括一升降單元1791及一按壓件1793。按壓件1793連接升降單元1791,且隨著升降單元1791向上或向下移動,以使按壓件1793向下移動來推動膠帶176,及按壓件1793向上移動以放開膠帶176。按壓件1793位在平整區上,且用以按壓膠帶176。推動模組179用以由上向下移動來推動膠帶176,以使膠帶176向下變形來黏取半導體元件。雷射光束穿過推動模組179及膠帶176。
The push module 179 is used to push the
如圖3及圖4所示,按壓件1793包括一結合塊1795及一接觸塊1797。結合塊1795連接升降單元1791。接觸塊1797連接結合塊1795。接觸塊1797自結合塊1795的側邊徑向突伸,且包括一頭部1798及一窗口1799,頭部1798形成於接觸塊1797的突伸末段,窗口1799形成於頭部1798。雷射光束投射路徑是穿過窗口。頭部1798包括一頂斜面17981、一底面17983及二凸部17985。窗口1799是貫穿頂斜面17981及底面17983。二凸部17985自底面向下凸出,且鄰近窗口1799周圍。二凸部17985之間的距離略大於半導體元件,以在按壓膠帶過程中利用膠帶下壓的力量讓半導體元件接觸電路基板的導電線路,並可避免二凸部17985下壓損壞半導體元件。
As shown in FIG. 3 and FIG. 4 , the pressing
本實施例中,頭部1798略呈錐狀,窗口1799除了讓雷射系統173能有效的投射雷射光束外,更可讓雷射系統173有效的對焦來實現有效率的修補作業。
In this embodiment, the
以上說明本發明的修補設備的組成,隨後透過圖5至圖13說明修補設備的運作。為了更容易理解本發明,圖5至圖13是簡化圖1中承載裝置13、測試裝置15及雷射修補裝置17的結構,並放大部分零件的尺寸。
The above describes the composition of the repair device of the present invention, and then the operation of the repair device is described through Figures 5 to 13. In order to make it easier to understand the present invention, Figures 5 to 13 simplify the structure of the
當透過測試得到電路基板上的不良品的半導體元件的位置來進行修補程序時,表示需先將電路基板上的不良品的半導體元件移除,再重新連接良品半導體元件,不良品半導體元件位置被定義為修補位置。 When the position of a defective semiconductor component on a circuit board is obtained through testing to perform a repair process, it means that the defective semiconductor component on the circuit board must be removed first, and then a good semiconductor component must be reconnected. The position of the defective semiconductor component is defined as the repair position.
雷射修補裝置進行移除作業,如圖5-7所示,圖5中雷射修補裝置17是先移動至測試裝置15上方,且對準修補位置,即電路基板50的不良品半導體元件51,然後,如圖6所示,按壓件1793被向下移動以推動膠帶176來黏貼修補位置中不良品半導體元件51,並透過雷射光束1731加熱不良品半導體元件51,以使不良品半導體元件51與電路基板50的導電線路解焊而被膠帶移除。如圖7所示,按壓件1793向上移動,而讓電路基板50的修補位置留下導電線路,且不良品半導體元件51被黏走。
The laser repair device performs the removal operation, as shown in Figures 5-7. In Figure 5, the
接著,取料系統175重新取料作業,以取得良品半導體元件31,如圖8-10所示。如圖8所示,雷射修補裝置17移動至承載裝置13上,並隨著取料系統175的二定位滾筒1777滾動而讓膠帶176位移,來讓未被使用的膠帶176對準良品半導體元件31,接著,如圖9所示,按壓件1793再次向下移動以推動膠帶176黏取承載裝置13所承載的良品半導體元件31,隨後,如圖10所示,雷射修補裝置17向上移動而讓膠帶176取走良品半導體元件31。
Then, the
最後,雷射修補裝置17進行修補作業,如圖11-13所示。如圖11所示,取料系統175重回修補位置,如圖12所示,透過雷射修補裝置17向下移動以使黏在膠帶176上的良品半導體元件31接觸導電線路,並藉由雷射光束1731加熱良品半導體元件31,來實現良品半導體元件31焊接在導電線路。焊接完成後,如圖13所示,按壓件1793向上移動,而使膠帶176與良品半導體元件31分離,修補
作業後可再透過測試來確認是否修復完成。其中,圖9至圖12中按壓件1793的位置保持不變,以便於隨後的雷射焊接作業。
Finally, the
膠帶與良品半導體元件分離可藉由雷射光束的熱解膠來實現,或良品半導體元件焊接在導電線路的結合力量大於膠帶的黏著力來做分離。 The separation of the tape and the good semiconductor components can be achieved by thermally decomposing the adhesive with a laser beam, or by separating the good semiconductor components when the bonding strength of the soldered conductive lines is greater than the adhesive force of the tape.
透過上述實施例說明本領域技術人員可理解本發明的修補設備的技術及目的,因此,上述關於修補設備的配置亦能在硬體中透過數量或邏輯元件安排來改變來達成相同的技術及目的,因此,實施例中所說明的修補設備只是以本實施例中的說明,並非作為限制主張範圍的用意。 Through the above-mentioned embodiments, those skilled in the art can understand the technology and purpose of the repair device of the present invention. Therefore, the above-mentioned configuration of the repair device can also be changed in the hardware through the number or arrangement of logical components to achieve the same technology and purpose. Therefore, the repair device described in the embodiments is only an explanation in this embodiment and is not intended to limit the scope of the claims.
10:修補設備 10: Repair equipment
11:基座 11: Base
111:第一安裝區 111: First installation area
113:第二安裝區 113: Second installation area
115:第一軌道 115: Track 1
117:第二軌道 117: Second track
119:第三軌道 119: Track 3
13:承載裝置 13: Carrier device
15:測試裝置 15:Testing equipment
17:雷射修補裝置 17: Laser repair device
171:安裝座 171: Mounting seat
173:雷射系統 173:Laser system
175:取料系統 175: Material taking system
30:料盤 30: Material tray
50:電路基板 50: Circuit board
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111108593A TWI840763B (en) | 2022-03-09 | 2022-03-09 | Repair equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111108593A TWI840763B (en) | 2022-03-09 | 2022-03-09 | Repair equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202337300A TW202337300A (en) | 2023-09-16 |
TWI840763B true TWI840763B (en) | 2024-05-01 |
Family
ID=88927402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111108593A TWI840763B (en) | 2022-03-09 | 2022-03-09 | Repair equipment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI840763B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007097380A1 (en) * | 2006-02-21 | 2007-08-30 | Nikon Corporation | Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method |
TW201215977A (en) * | 2010-10-07 | 2012-04-16 | Au Optronics Corp | Laser repairing equipment |
TW202040731A (en) * | 2019-04-19 | 2020-11-01 | 台灣愛司帝科技股份有限公司 | Chip transferring machine |
TWM615648U (en) * | 2021-05-05 | 2021-08-11 | 大陸商福建捷聯電子有限公司 | Dual-track laser engraving machine |
TWM629143U (en) * | 2022-03-09 | 2022-07-01 | 東捷科技股份有限公司 | Repairing apparatus |
-
2022
- 2022-03-09 TW TW111108593A patent/TWI840763B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007097380A1 (en) * | 2006-02-21 | 2007-08-30 | Nikon Corporation | Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method |
TW201215977A (en) * | 2010-10-07 | 2012-04-16 | Au Optronics Corp | Laser repairing equipment |
TW202040731A (en) * | 2019-04-19 | 2020-11-01 | 台灣愛司帝科技股份有限公司 | Chip transferring machine |
TWM615648U (en) * | 2021-05-05 | 2021-08-11 | 大陸商福建捷聯電子有限公司 | Dual-track laser engraving machine |
TWM629143U (en) * | 2022-03-09 | 2022-07-01 | 東捷科技股份有限公司 | Repairing apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW202337300A (en) | 2023-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101918106B1 (en) | Apparatus and method for repairing bad elements | |
US20020024883A1 (en) | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card | |
US11177157B2 (en) | Method for constructing micro-LED display module | |
CN113035763B (en) | High-precision chip transfer method | |
JP2013034021A (en) | Semiconductor cell lead wire connection device and connection method | |
KR20210091640A (en) | Method of manufacturing display apparatus, display apparatus, and structure for manufacturing display apparatus | |
WO2021117753A1 (en) | Collection lens height adjusting method, chip transfer method, collection lens height adjusting device, and chip transfer device | |
KR100728453B1 (en) | Probe arrangement assembly, method of manufacturing probe arrangement assembly, probe mounting method using probe arrangement assembly, and probe mounting apparatus | |
CN111834266A (en) | Chip transfer machine | |
KR102565265B1 (en) | Micro led manufacturing system and micro led manufacturing method | |
CN111508862B (en) | Laser welding device and method for semiconductor device | |
TWM629143U (en) | Repairing apparatus | |
TWI840763B (en) | Repair equipment | |
CN217344003U (en) | Repair equipment | |
CN116786976A (en) | Repair device | |
JP3949031B2 (en) | Chip mounting method | |
KR102547027B1 (en) | Method of bonding a die on a base substrate | |
JP2022121826A (en) | Chip component removing method and chip component removing device | |
US11508780B2 (en) | Method of manufacturing display apparatus, display apparatus, and structure for manufacturing display apparatus | |
CN113808988B (en) | Light-emitting chip bearing structure and manufacturing method thereof | |
TWI810025B (en) | Ultra-small led chip rework apparatus using transfer method and rework method thereof | |
CN115172191B (en) | Mass transfer method of micro device and display panel | |
CN116995148A (en) | Micro-component welding method, bearing substrate and driving backboard | |
KR102575887B1 (en) | Bonding method | |
CN220825577U (en) | Laser welding equipment |