TWI840763B - Repair equipment - Google Patents

Abstract

The repair equipment of the present invention includes a base, a carrier, a test device and a laser repair device. The base includes a first mounting area, a second mounting area, a first track, a second track and a third track. The second mounting area extends upward from the first mounting area, and the first track and the second track are fixedly arranged in the first mounting area. The third track is arranged in the second mounting area. The carrier is connected to the first track and is used to carry a tray. The tray includes a semiconductor component. The test device is connected to the second track and is used to carry a circuit substrate. The laser repair device is connected to the third track and can move above the carrier and the test device. The laser repair device is used to electrically connect the semiconductor component to the circuit substrate.

Description

Repair equipment

The present invention relates to a repair device, and in particular to a repair device for semiconductor components.

Panels composed of optoelectronic components require a large number of light-emitting diodes (LEDs), which are densely arranged in a matrix. Therefore, although abnormally functioning LEDs and their locations can be found after electrical testing of the panel, electrical testing and repairs currently require different equipment to be performed. Therefore, transportation, material collection and repairs will waste more moving process time.

Furthermore, the LEDs are tiny in size and are closely arranged together, making them very difficult to repair.

In view of the above defects, the repair equipment of the present invention places the circuit substrate and the material tray on the same equipment, and uses a movable laser repair device to move on the circuit substrate and the material tray to repair the position of the semiconductor components with abnormal functions or missing on the circuit substrate.

In order to solve the above-mentioned defects, the repair equipment of the present invention includes a base, a carrier, a test device and a laser repair device. The base includes a first mounting area, a second mounting area, a first track, a second track and a third track. The second mounting area extends upward from the first mounting area, and the first track and the second track are fixedly arranged in the first mounting area. The third track is arranged in the second mounting area. The carrier is connected to the first track and used to carry a material tray. The material tray includes a semiconductor component. The test device is connected to the second track and used to carry a circuit substrate. The laser repair device is connected to the third track and can be moved above the carrier and the test device. The laser repair device is used to electrically connect the semiconductor component to the circuit substrate.

In this way, the repair equipment of the present invention places the material tray and the circuit substrate on the same equipment simultaneously to shorten the time spent on movement, thereby improving the efficiency of repair.

10: Repair equipment

11: Base

111: First installation area

113: Second installation area

115: Track 1

117: Second track

119: Track 3

13: Carrier device

15:Testing equipment

17: Laser repair device

171: Mounting seat

173:Laser system

1731:Laser beam

175: Material taking system

176: Tape

177:Transport module

1771: First roller

1773: Second roller

1775: The third roller

1777: Positioning roller

179: Push module

1791: Lifting unit

1793: Pressing parts

1795: Binding block

1797:Contact block

1798:Head

17981: Top bevel

17983: Bottom

17985: convex part

1799:Window

30: Material tray

50: Circuit board

51: Defective semiconductor components

31:Qualified semiconductor components

The detailed structure, features and manufacturing method of the repair device will be described in the following embodiments. However, it should be understood that the embodiments and drawings described below are only for exemplary purposes and should not be used to limit the scope of the patent application of the present invention. FIG. 1 is a three-dimensional diagram of the repair device of the present invention.

Figure 2 is an enlarged view of the laser repair device of the repair equipment in Figure 1.

Figure 3 is a three-dimensional diagram of the pressing part of the laser repair device in Figure 2.

Figure 4 is an enlarged schematic diagram of the circle at the head of the pressing member in Figure 3.

Figures 5 to 7 are simplified schematic diagrams of the carrier device, the test device, and the laser repair device in Figure 1, and are schematic diagrams of performing the removal operation.

Figures 8 to 10 are simplified schematic diagrams of the carrier device, test device and laser repair device in Figure 1, and are schematic diagrams of performing the material extraction operation.

Figures 11 to 13 are simplified schematic diagrams of the carrier device, the test device, and the laser repair device in Figure 1, and are schematic diagrams of performing the repair operation.

In order to explain the technical features of the present invention in detail, the following embodiments are cited and illustrated with drawings, wherein: As shown in FIG1 , the repair device 10 includes a base 11, a carrier 13, a test device 15 and a laser repair device 17. The base 11 includes a first mounting area 111, a second mounting area 113, a first track 115, a second track 117 and a third track 119. The second mounting area 113 extends upward from the first mounting area 111. The first track 115 and the second track 117 are fixedly arranged in the first mounting area 111. The third track 119 is fixedly arranged in the second mounting area 113.

The supporting device 13 is connected to the base 11 and the first track 115, and can move along the first track 115. The supporting device 13 is used to support the material tray 30, which includes a plurality of semiconductor components arranged in an array, such as optoelectronic components or integrated circuits, etc. The material tray 30 can be a wafer. The semiconductor component is a micro component, that is, one of the dimensions of the semiconductor component is less than 150 micrometers (um).

The test device 15 is connected to the second track 117 and can move along the second track 117. The test device 15 is used to carry and test the circuit substrate 50. The test is to check the function of the circuit substrate 50 through power or signal. In other embodiments, the test function can also be performed through other equipment.

The circuit substrate 50 includes a substrate body, a conductive line and a plurality of semiconductor elements. The material of the substrate body is, for example, glass, polyimide (PI), etc. The conductive line is formed on the substrate body. The semiconductor element is electrically connected to the conductive line.

The laser repair device 17 is connected to the base 11 and the third track 119, and can move along the third track 119 and move on the carrier 13 and the test device 15. The laser repair device 17 moves above the carrier 13 to obtain the semiconductor components. The laser repair device moves above the test device to selectively remove the semiconductor components of the circuit substrate or reconnect the semiconductor components.

In this way, after carrying the corresponding material tray 30 and circuit substrate 50, the supporting device 13 and the testing device 15 can move the laser repair device 17 below through the first track 115 and the second track 117. Then, the laser repair device 17 only needs to move a short stroke above the material tray 30 and the circuit substrate 50 to achieve efficient operation. Furthermore, the supporting device 13 and the testing device 15 can operate independently to reload the material tray 30 and the circuit substrate 50. The number of the above-mentioned tracks can be more, and it is not limited to one track for each device in this embodiment.

As shown in FIG2 , the laser repair device 17 includes a mounting base 171, a laser system 173 and a material taking system 175. The laser system 173 and the material taking system 175 are connected to the mounting base 171.

The laser system 173 is used to project a laser beam, and the spot of the laser beam is preferably rectangular in shape to provide uniform energy.

The material taking system 175 includes a rubber belt 176, a conveying module 177 and a pushing module 179. The conveying module 177 is connected to the rubber belt 176 and is used to convey the rubber belt 176. In this embodiment, the conveying module 177 includes a first roller 1771, a second roller 1773, a third roller 1775 and two positioning rollers 1777. One end of the rubber belt 176 is connected to the first roller 1771, and the other end of the rubber belt 176 is connected to the second roller 1773. The first roller 1771 and the second roller 1773 convey the rubber belt 176 by rolling.

In this embodiment, the first roller 1771 is used to supply the tape 176, and the second roller 1773 is used to recycle the tape 176. The third roller 1775 contacts the tape 176 and is used to adjust the conveying direction of the tape 176. The second positioning roller 1777 contacts the tape 176 so that the tape 176 forms a flat area between the two positioning rollers 1777. In other embodiments, the conveying module 177 can have more rollers or fewer rollers, and the range of the flat area can be adjusted by the two positioning rollers 1777.

The tape 176 includes a substrate and an adhesive layer. The tape 176 is, for example, a polyimide (PI) tape or a thermal release tape. The adhesive layer is connected to the body layer and faces the first mounting area.

The push module 179 is used to push the tape 176 transported by the conveying module 177. The push module 179 includes a lifting unit 1791 and a pressing member 1793. The pressing member 1793 is connected to the lifting unit 1791 and moves upward or downward with the lifting unit 1791, so that the pressing member 1793 moves downward to push the tape 176, and the pressing member 1793 moves upward to release the tape 176. The pressing member 1793 is located on the flat area and is used to press the tape 176. The push module 179 is used to move from top to bottom to push the tape 176, so that the tape 176 is deformed downward to adhere the semiconductor component. The laser beam passes through the push module 179 and the tape 176.

As shown in FIG. 3 and FIG. 4 , the pressing member 1793 includes a coupling block 1795 and a contact block 1797. The coupling block 1795 is connected to the lifting unit 1791. The contact block 1797 is connected to the coupling block 1795. The contact block 1797 protrudes radially from the side edge of the coupling block 1795 and includes a head 1798 and a window 1799. The head 1798 is formed at the protruding end of the contact block 1797, and the window 1799 is formed at the head 1798. The laser beam projection path passes through the window. The head 1798 includes a top inclined surface 17981, a bottom surface 17983 and two convex portions 17985. The window 1799 penetrates the top bevel 17981 and the bottom surface 17983. The two protrusions 17985 protrude downward from the bottom surface and are adjacent to the periphery of the window 1799. The distance between the two protrusions 17985 is slightly larger than the semiconductor element, so that the force of the tape pressing down can be used to allow the semiconductor element to contact the conductive line of the circuit substrate during the pressing process of the tape, and the two protrusions 17985 can be prevented from damaging the semiconductor element.

In this embodiment, the head 1798 is slightly conical, and the window 1799 not only allows the laser system 173 to effectively project the laser beam, but also allows the laser system 173 to effectively focus to achieve efficient repair work.

The above describes the composition of the repair device of the present invention, and then the operation of the repair device is described through Figures 5 to 13. In order to make it easier to understand the present invention, Figures 5 to 13 simplify the structure of the carrier device 13, the test device 15 and the laser repair device 17 in Figure 1, and enlarge the size of some parts.

When the position of a defective semiconductor component on a circuit board is obtained through testing to perform a repair process, it means that the defective semiconductor component on the circuit board must be removed first, and then a good semiconductor component must be reconnected. The position of the defective semiconductor component is defined as the repair position.

The laser repair device performs the removal operation, as shown in Figures 5-7. In Figure 5, the laser repair device 17 is first moved to the top of the test device 15 and aligned with the repair position, that is, the defective semiconductor component 51 of the circuit substrate 50. Then, as shown in Figure 6, the pressing member 1793 is moved downward to push the tape 176 to stick the defective semiconductor component 51 in the repair position, and the defective semiconductor component 51 is heated by the laser beam 1731 to desolder the defective semiconductor component 51 and the conductive line of the circuit substrate 50 and be removed by the tape. As shown in Figure 7, the pressing member 1793 moves upward, leaving the conductive line at the repair position of the circuit substrate 50, and the defective semiconductor component 51 is stuck away.

Then, the material picking system 175 re-picks the material to obtain the good semiconductor component 31, as shown in Figures 8-10. As shown in Figure 8, the laser repair device 17 moves to the carrier 13, and as the two positioning rollers 1777 of the material picking system 175 roll, the tape 176 is displaced to allow the unused tape 176 to align with the good semiconductor component 31. Then, as shown in Figure 9, the pressing member 1793 moves downward again to push the tape 176 to stick to the good semiconductor component 31 carried by the carrier 13. Then, as shown in Figure 10, the laser repair device 17 moves upward to allow the tape 176 to take away the good semiconductor component 31.

Finally, the laser repair device 17 performs the repair operation, as shown in Figures 11-13. As shown in Figure 11, the material taking system 175 returns to the repair position, as shown in Figure 12, the laser repair device 17 moves downward to make the good semiconductor component 31 adhered to the tape 176 contact the conductive line, and the laser beam 1731 heats the good semiconductor component 31 to achieve the welding of the good semiconductor component 31 to the conductive line. After the welding is completed, as shown in Figure 13, the pressing piece 1793 moves upward to separate the tape 176 from the good semiconductor component 31. After the repair operation, it can be confirmed by testing whether the repair is completed. Among them, the position of the pressing piece 1793 in Figures 9 to 12 remains unchanged to facilitate the subsequent laser welding operation.

The separation of the tape and the good semiconductor components can be achieved by thermally decomposing the adhesive with a laser beam, or by separating the good semiconductor components when the bonding strength of the soldered conductive lines is greater than the adhesive force of the tape.

Through the above-mentioned embodiments, those skilled in the art can understand the technology and purpose of the repair device of the present invention. Therefore, the above-mentioned configuration of the repair device can also be changed in the hardware through the number or arrangement of logical components to achieve the same technology and purpose. Therefore, the repair device described in the embodiments is only an explanation in this embodiment and is not intended to limit the scope of the claims.

10: Repair equipment

11: Base

111: First installation area

113: Second installation area

115: Track 1

117: Second track

119: Track 3

13: Carrier device

15:Testing equipment

17: Laser repair device

171: Mounting seat

173:Laser system

175: Material taking system

30: Material tray

50: Circuit board

Claims (3)

A repair device comprises: a base, comprising a first mounting area, a second mounting area, a first rail, a second rail and a third rail, wherein the second mounting area extends upward from the first mounting area, the first rail and the second rail are fixedly arranged in the first mounting area, and the third rail is fixedly arranged in the second mounting area; a supporting device connected to the first rail and used to support a tray, wherein the tray includes a semiconductor component; a testing device connected to the second rail and for carrying and testing a circuit substrate; and a laser repair device connected to the third track and movable above the carrying device and the testing device, wherein when the laser repair device contacts the semiconductor element obtained from the tray with the circuit substrate, the laser repair device is used to weld the semiconductor element to the circuit substrate, wherein the laser repair device includes a mounting seat, a laser system and a material taking system, wherein the mounting seat is connected to the third track, and the laser system is connected to the mounting seat. The mounting base is used to project a laser beam. The material taking system is connected to the mounting base and includes a tape, a conveying module and a pushing module. The tape is used to stick the semiconductor element. The conveying module is connected to the tape and used to convey the tape. The pushing module is used to push the tape on the conveying module. The laser beam passes through the pushing module and the tape to weld the semiconductor element to the circuit substrate. The tape includes a flat area. The semiconductor element is pasted on The flat area, the pushing module includes a lifting unit and a pressing member, the pressing member is connected to the lifting unit, faces the flat area, and is used to push the tape downward, wherein the pressing member includes a bonding block and a contact block, the bonding block is connected to the lifting unit, the contact block is connected to the bonding block, and protrudes from the side of the bonding block, and includes a head and a window, the head is formed at the protruding end of the contact block, and the window is formed in the head for the laser beam to pass through. The repair device as described in claim 1, wherein the head portion includes a top bevel, a bottom surface and at least one convex portion, the window passes through the top bevel and the bottom surface, and the at least one convex portion protrudes downward from the bottom surface and is adjacent to the window. The repair equipment as described in claim 1, wherein the conveying module includes two positioning rollers, and the flattening area is located between the two positioning rollers.

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