TW202337300A - Repair equipment includes a base, a first carrying device, a second carrying device, and a laser repair device - Google Patents

Abstract

The repair equipment of the present invention includes a base, a first carrying device, a second carrying device, and a laser repair device. The base includes a first installation area, a second installation area, a first track, a second track, and a third track. The second installation area extends upward from the first installation area. The first rail and the second rail are fixedly arranged in the first installation area. The third track is arranged in the second installation area. The first carrying device is connected to the first track and used to carry a material tray. The material tray includes a semiconductor device. The second carrying device is connected to the second track and used to carry a circuit substrate. The laser repair device is connected to the third track and can move above the first carrying device and the second carrying device. The laser repair device is used to electrically connect the semiconductor device to the circuit substrate.

Description

patch device

The present invention relates to repair equipment, and in particular to a repair equipment for semiconductor components.

Panels composed of optoelectronic components require the use of a large number of light-emitting diodes (LEDs). These light-emitting diodes are densely arranged in a matrix. Therefore, after electrically testing the function of the panel, abnormally functioning light-emitting diodes and Its location, but currently electrical testing and repair need to be carried out through different equipment. Therefore, conveying, picking up and repairing will waste more moving process time.

Furthermore, the size of the light-emitting diodes is very small, and the light-emitting diodes are closely arranged together, so it is very difficult to maintain.

In view of the above shortcomings, the repair equipment of the present invention places the circuit substrate and the material tray on the same equipment, and uses the movable laser repair device to move on the circuit substrate and the material tray to repair abnormal functions or missing semiconductors on the circuit substrate. The location of the component.

In order to solve the above deficiencies, the repair equipment of the present invention includes a base, a first carrying device, a second carrying device and a laser repair device. The base includes a first installation area, a second installation area, a first track, a second track and a third track. The second installation area extends upward from the first installation area, and the first rail and the second rail are fixedly arranged in the first installation area. The third track is provided in the second installation area. The first carrying device is connected to the first track and used to carry a material tray. The tray includes a semiconductor device. The second carrying device is connected to the second track and used to carry a circuit substrate. The laser repair device is connected to the third rail and can move above the first carrying device and the second carrying device. The laser repair device is used to electrically connect the semiconductor component to the circuit substrate.

In this way, the repair equipment of the present invention places the material tray and the circuit substrate simultaneously on the same equipment, thereby shortening the time spent on movement and thereby improving the efficiency of repair.

In order to explain the technical characteristics of the present invention in detail, the following embodiments are given and described with the drawings, wherein:

As shown in FIG. 1 , the repairing equipment 10 includes a base 11 , a first carrying device 13 , a second carrying device 15 and a laser repairing device 17 . The base 11 includes a first installation area 111 , a second installation area 113 , a first track 115 , a second track 117 and a third track 119 . The second mounting area 113 extends upward from the first mounting area 111 . The first rail 115 and the second rail 117 are fixedly provided in the first installation area 111 . The third rail 119 is fixedly provided in the second installation area 113 .

The first carrying device 13 is connected to the base 11 and the first rail 115 and can move along the first rail 115 . The first carrying device 13 is used to carry the material tray 30. The material tray 30 includes a plurality of semiconductor components arranged in an array, such as photoelectric components or integrated circuits. The material tray 30 may be a wafer. Semiconductor devices are micro devices, which means that one of the dimensions of the semiconductor device is less than 150 microns (um).

The second carrying device 15 is connected to the second rail 117 and can move along the second rail 117 . The second carrying device 15 is used to carry and test the circuit substrate 50 . Testing is to check the function of the circuit substrate 50 through power or signals. In other embodiments, the testing function can also be performed through other devices.

The circuit substrate 50 includes a substrate body, conductive circuits and a plurality of semiconductor elements. The material of the substrate body is, for example, glass, polyimide (PI), etc. Conductive lines are formed on the substrate body. The semiconductor element is electrically connected to the conductive circuit.

The laser repair device 17 is connected to the base 11 and the third rail 119, and can move along the third rail 119 and move on the first carrying device 13 and the second carrying device 15. The laser repair device 17 moves above the first carrying device 13 to obtain the semiconductor components, and the laser repair device moves above the second carrying device to selectively remove the semiconductor components of the circuit substrate or reconnect the semiconductor components.

In this way, after carrying the corresponding material tray 30 and circuit substrate 50, the first carrying device 13 and the second carrying device 15 can move under the laser repair device 17 through the first rail 115 and the second rail 117, and then, the laser repair The device 17 only needs to move in a short stroke above the material tray 30 and the circuit substrate 50 to achieve efficient operation. Furthermore, the first carrying device 13 and the second carrying device 15 can operate independently to reload the material tray 30 and the circuit substrate 50 . The number of the above-mentioned tracks can be greater, and is not limited to each device matching one track in this embodiment.

As shown in FIG. 2 , the laser repair device 17 includes a mounting base 171 , a laser system 173 and a material taking system 175 . The laser system 173 and the material taking system 175 are connected to the mounting base 171 .

The laser system 173 is used to project a laser beam, and the spot of the laser beam is preferably in a rectangular shape to provide uniform energy.

The material picking system 175 includes a tape 176, a conveying module 177 and a pushing module 179. The conveying module 177 is connected to the adhesive tape 176 and used to convey the adhesive tape 176 . In this embodiment, the conveying module 177 includes a first roller 1771, a second roller 1773, a third roller 1775 and two positioning rollers 1777. One end of the tape 176 is connected to the first roller 1771, and the other end of the tape 176 is connected to the second roller 1773. The first roller 1771 and the second roller 1773 transport the tape 176 by rolling.

In this embodiment, the first roller 1771 is used to supply the adhesive tape 176, and the second roller 1773 is used to recover the adhesive tape 176. The third roller 1775 contacts the tape 176 and is used to adjust the conveying direction of the tape 176 . The two positioning rollers 1777 are in contact with the tape 176, so that the tape 176 forms a flat area between the two positioning rollers 1777. In other embodiments, the conveying module 177 can have more rollers or fewer rollers, and the range of the flattening area can be adjusted through the two positioning rollers 1777.

The tape 176 includes a base material and an adhesive layer. The tape 176 is, for example, polyimide (PI) tape or thermal release tape (Thermal Release Tape). The adhesive layer is connected to the body layer and faces the first installation area.

The pushing module 179 is used to push the adhesive tape 176 transported by the conveying module 177 . The pushing module 179 includes a lifting unit 1791 and a pressing member 1793 . The pressing member 1793 is connected to the lifting unit 1791, and as the lifting unit 1791 moves upward or downward, the pressing member 1793 moves downward to push the adhesive tape 176, and the pressing member 1793 moves upward to release the adhesive tape 176. The pressing member 1793 is located on the flat area and is used to press the tape 176 . The pushing module 179 is used to push the tape 176 by moving from top to bottom, so that the tape 176 deforms downward to adhere the semiconductor components. The laser beam passes through the pushing module 179 and the adhesive tape 176 .

As shown in FIGS. 3 and 4 , the pressing member 1793 includes a combination block 1795 and a contact block 1797 . The combination block 1795 is connected to the lifting unit 1791. Contact block 1797 connects bonding block 1795. The contact block 1797 protrudes radially from the side of the combination block 1795 and includes a head 1798 and a window 1799. The head 1798 is formed on the protruding end of the contact block 1797, and the window 1799 is formed on the head 1798. The path of the laser beam is through the window. The head 1798 includes a top inclined surface 17981, a bottom surface 17983 and two convex parts 17985. The window 1799 runs through the top slope 17981 and the bottom surface 17983. The two protrusions 17985 protrude downward from the bottom surface and are adjacent to the window 1799. The distance between the two protrusions 17985 is slightly larger than the semiconductor element, so that the semiconductor element can contact the conductive circuit of the circuit substrate by using the force of pressing the tape during the process of pressing the tape, and can prevent the semiconductor element from being damaged by the pressing of the two protrusions 17985.

In this embodiment, the head 1798 is slightly cone-shaped, and the window 1799 not only allows the laser system 173 to effectively project the laser beam, but also allows the laser system 173 to focus effectively to achieve efficient repair operations.

The above describes the composition of the repair equipment of the present invention, and then the operation of the repair equipment is explained through FIGS. 5 to 13 . In order to make it easier to understand the present invention, Figures 5 to 13 simplify the structures of the first carrying device 13, the second carrying device 15 and the laser repair device 17 in Figure 1, and enlarge the dimensions of some parts.

When the location of the defective semiconductor component on the circuit substrate is obtained through testing for repair, it means that the defective semiconductor component on the circuit substrate needs to be removed first, and then the good semiconductor component is reconnected, and the location of the defective semiconductor component is Defined as patch location.

The laser repair device is removed, as shown in Figures 5-7. In Figure 5, the laser repair device 17 is first moved to the top of the second carrying device 15, and is aligned with the repair position, that is, the defective semiconductor on the circuit substrate 50. Component 51, and then, as shown in FIG. 6, the pressing member 1793 is moved downward to push the tape 176 to adhere the defective semiconductor component 51 in the repair position, and heats the defective semiconductor component 51 through the laser beam 1731, so that the defective semiconductor component 51 is heated. The semiconductor element 51 and the conductive traces of the circuit substrate 50 are desoldered and removed by the tape. As shown in FIG. 7 , the pressing member 1793 moves upward, leaving conductive traces in the repair position of the circuit substrate 50 , and the defective semiconductor component 51 is stuck away.

Then, the picking system 175 resumes the picking operation to obtain good-quality semiconductor components 31, as shown in FIGS. 8-10. As shown in Figure 8, the laser repair device 17 moves to the first carrying device 13, and as the two positioning rollers 1777 of the material picking system 175 roll, the tape 176 is displaced, so that the unused tape 176 is aligned with the good product. Semiconductor element 31. Then, as shown in Figure 9, the pressing member 1793 moves downward again to push the tape 176 to adhere to the good semiconductor element 31 carried by the first carrying device 13. Then, as shown in Figure 10, the laser repair device 17 moves upward to allow the tape 176 to take away the good semiconductor component 31 .

Finally, the laser repair device 17 performs the repair operation, as shown in Figures 11-13. As shown in FIG. 11 , the retrieval system 175 returns to the repair position. As shown in FIG. 12 , the laser repair device 17 moves downward so that the good-quality semiconductor components 31 adhered to the tape 176 contact the conductive lines, and are repaired by the laser. The beam 1731 heats the good semiconductor element 31 to achieve welding of the good semiconductor element 31 to the conductive circuit. After the welding is completed, as shown in FIG. 13 , the pressing member 1793 moves upward to separate the tape 176 from the good semiconductor component 31 . After the repair operation, a test can be performed to confirm whether the repair is completed. Among them, the position of the pressing member 1793 in Figures 9 to 12 remains unchanged to facilitate subsequent laser welding operations.

The separation between the tape and the good-quality semiconductor components can be achieved by pyrolyzing the glue with a laser beam, or the bonding force of the good-quality semiconductor components when welded to the conductive circuit is greater than the adhesive force of the tape.

The above embodiments illustrate that those skilled in the art can understand the technology and purpose of the patching equipment of the present invention. Therefore, the above configuration of the patching equipment can also be changed in the hardware through the number or logical component arrangement to achieve the same technology and purpose. , therefore, the repair equipment described in the embodiment is only used for illustration in this embodiment, and is not intended to limit the scope of the claim.

10: Patching equipment 11: base 111: First installation area 113: Second installation area 115: First track 117:Second track 119:Third track 13: First carrying device 15: Second carrying device 17:Laser repair device 171:Mounting base 173:Laser system 1731:Laser Beam 175:Retrieval system 176:Tape 177:Conveyor module 1771:First roller 1773:Second roller 1775:Third roller 1777: Positioning roller 179: Push module 1791:Lifting unit 1793:Press piece 1795: Combined block 1797: Contact block 1798:Head 17981: Top slope 17983: Bottom 17985:convex part 1799:window 30: Material tray 50:Circuit substrate 51: Defective semiconductor components 31:Good quality semiconductor components

The detailed structure, features and manufacturing methods of the repair equipment will be described in the following embodiments. However, it should be understood that the embodiments and drawings described below are only for illustrative purposes and should not be used to limit the present invention. The patentable scope of the invention, including:

Figure 1 is a perspective view of the repair device of the present invention. FIG. 2 is an enlarged view of the laser repair device of the repair equipment in FIG. 1 . FIG. 3 is a perspective view of the pressing member of the laser repair device in FIG. 2 . FIG. 4 is an enlarged schematic diagram of the circled portion of the head of the pressing member in FIG. 3 . 5 to 7 are simplified schematic diagrams of the first carrying device, the second carrying device and the laser repair device in Figure 1 , and illustrate a schematic diagram of performing the removal operation. 8 to 10 are simplified schematic diagrams of the first carrying device, the second carrying device and the laser repair device in Figure 1 , and represent a schematic diagram of performing a material retrieval operation. 11 to 13 are simplified schematic diagrams of the first carrying device, the second carrying device and the laser repair device in Figure 1 , and illustrate the execution of the repair operation.

10: Patching equipment

11: base

111: First installation area

113: Second installation area

115: First track

117:Second track

119:Third track

13: First carrying device

15: Second carrying device

17:Laser repair device

171:Mounting base

173:Laser system

175:Retrieval system

30: Material tray

50:Circuit substrate

Claims (7)

A patching device consisting of: A base includes a first installation area, a second installation area, a first track, a second track and a third track, the second installation area extends upward from the first installation area, the first track And the second rail is fixedly arranged in the first installation area, and the third rail is fixedly arranged in the second installation area; a first carrying device connected to the first track and used to carry a material tray, the material tray including a semiconductor component; a second carrying device connected to the second track and used to carry a circuit substrate; and A laser repair device is connected to the third track and can move above the first carrying device and the second carrying device. The laser repair device is used to electrically connect the semiconductor component to the circuit substrate. The repair equipment as described in claim 1, wherein the laser repair device includes a mounting base, a laser system and a material retrieval system, the mounting base is connected to the third track, the laser system is connected to the mounting base, and It is used to project a laser beam. The pickup system is connected to the mounting base and includes a tape, a conveyor module and a push module. The tape is used to stick the semiconductor component, and the conveyor module is connected to the tape. And used to transport the tape, the push module is used to push the tape on the transport module, the laser beam passes through the push module and the tape to weld the semiconductor component to the circuit substrate. The repair equipment as described in claim 2, wherein the tape includes a flat area, the semiconductor component is pasted on the flat area, the pushing module includes a lifting unit and a pressing member, and the pressing member is connected to the lifting unit, And face the flat area and push the tape downward. The repair equipment of claim 3, wherein the pressing member includes a combination block and a contact block, the combination block is connected to the lifting unit, the contact block is connected to the combination block, and protrudes from the side of the combination block , and includes a head and a window, the head is formed on the protruding end of the contact block, and the window is formed on the head for allowing the laser beam to pass through. The repair equipment of claim 4, wherein the head includes a top slope, a bottom surface and at least one convex portion, the window penetrates the top slope and the bottom surface, and the at least one convex portion protrudes downward from the bottom surface. , and adjacent to the window. The repair equipment as claimed in claim 3, wherein the conveying module includes two positioning rollers, and the flat area is located between the two positioning rollers. The repair equipment of claim 1, wherein the second carrying device is used to test the circuit substrate.

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