TWI839602B - Stage device - Google Patents
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- TWI839602B TWI839602B TW110111037A TW110111037A TWI839602B TW I839602 B TWI839602 B TW I839602B TW 110111037 A TW110111037 A TW 110111037A TW 110111037 A TW110111037 A TW 110111037A TW I839602 B TWI839602 B TW I839602B
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- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/38—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members using fluid bearings or fluid cushion supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2707/00—Automatic supply or removal of metal workpieces
- B23Q2707/04—Automatic supply or removal of metal workpieces by means of grippers also magnetic or pneumatic gripping
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
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- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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- Details Of Measuring And Other Instruments (AREA)
- Machine Tool Units (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
[課題] 提供一種能夠實現載台裝置的高精度化之技術。 [解決手段] 載台裝置係具備:第一移動體;X軸驅動部,係在X軸方向上驅動第一移動體,且構成為能夠在Y軸方向上移動;第二移動體,係引導第一移動體在X軸方向上的移動,且構成為能夠在Y軸方向上移動;Y軸驅動部,係在Y軸方向上驅動X軸驅動部或第二移動體;以及拘束單元,係不拘束X軸驅動部與第二移動體在X軸方向上的相對移動,而在兩者非接觸的狀態下拘束在Y軸方向上的相對移動。[Topic] Provide a technology capable of realizing high precision of a stage device. [Solution] The stage device comprises: a first moving body; an X-axis driving unit that drives the first moving body in the X-axis direction and is configured to be movable in the Y-axis direction; a second moving body that guides the movement of the first moving body in the X-axis direction and is configured to be movable in the Y-axis direction; a Y-axis driving unit that drives the X-axis driving unit or the second moving body in the Y-axis direction; and a restraining unit that does not restrain the relative movement of the X-axis driving unit and the second moving body in the X-axis direction, but restrains the relative movement of the two in the Y-axis direction in a non-contact state.
Description
本發明係有關一種載台裝置。The present invention relates to a carrier device.
已知一種用以定位對象物之載台裝置。以往,提出有一種載台裝置,係具備:第一移動體;驅動體,係在X軸方向上驅動第一移動體;以及第二移動體,係引導第一移動體在X軸方向上的移動,且構成為能夠在Y軸方向上移動(例如專利文獻1)。 [先前技術文獻]A stage device for positioning an object is known. In the past, a stage device has been proposed, which comprises: a first moving body; a driving body that drives the first moving body in the X-axis direction; and a second moving body that guides the movement of the first moving body in the X-axis direction and is configured to be able to move in the Y-axis direction (e.g., Patent Document 1). [Prior Technical Document]
[專利文獻1] 日本特開2009-101427號公報[Patent Document 1] Japanese Patent Application Publication No. 2009-101427
[發明所欲解決之問題][The problem the invention is trying to solve]
在以往的載台裝置中,X軸驅動部被支撐於第二移動體。因此,X軸驅動部驅動第一移動體時的反作用力能夠傳遞到第二移動體。In the conventional stage device, the X-axis driving unit is supported by the second moving body. Therefore, the reaction force when the X-axis driving unit drives the first moving body can be transmitted to the second moving body.
然而,有想要使用載台裝置使用來定位更大的對象物之要求。在該情況下,需要使載台裝置大型化,隨之X軸驅動部亦會大型化,且X軸驅動部驅動第一移動體時的反作用力亦會變大。若將以往的載台裝置直接大型化,則會導致其較大的反作用力傳遞到第二移動體。這會誘發由第二移動體的結構構件引起之滯後(hysteresis)及振動。亦即,妨礙高精度化。However, there is a demand to use a stage device to position larger objects. In this case, the stage device needs to be enlarged, and the X-axis drive unit will also be enlarged, and the reaction force when the X-axis drive unit drives the first moving body will also become larger. If the conventional stage device is directly enlarged, its larger reaction force will be transmitted to the second moving body. This will induce hysteresis and vibration caused by the structural components of the second moving body. In other words, it hinders high precision.
又,載台裝置有時使用於半導體元件的製造。由於半導體元件的設計規則的微細化或重疊、或者由於積層的需求,對製造中所使用之載台裝置要求進一步的高精度化。In addition, the stage device is sometimes used in the manufacture of semiconductor devices. Due to the miniaturization or overlap of design rules of semiconductor devices, or due to the need for lamination, the stage device used in the manufacture is required to have higher precision.
總之,對於載台裝置而言要求高精度化。In short, high precision is required for the stage device.
本發明係於此種狀況下完成者,其一種實施樣態的例示性目的之一為提供一種能夠實現載台裝置的高精度化之技術。 [解決問題之技術手段]The present invention was completed under such circumstances, and one of the exemplary purposes of one embodiment is to provide a technology that can achieve high precision of the stage device. [Technical means to solve the problem]
為了解決上述問題,本發明的一種實施樣態的載台裝置係具備:第一移動體;X軸驅動部,係在X軸方向上驅動第一移動體,且構成為能夠在Y軸方向上移動;第二移動體,係引導第一移動體在X軸方向上的移動,且構成為能夠在Y軸方向上移動;Y軸驅動部,係在Y軸方向上驅動X軸驅動部或第二移動體;以及拘束單元,係不拘束X軸驅動部與第二移動體在X軸方向上的相對移動,而在兩者非接觸的狀態下拘束在Y軸方向上的相對移動。In order to solve the above-mentioned problem, a stage device of an implementation form of the present invention comprises: a first moving body; an X-axis driving unit, which drives the first moving body in the X-axis direction and is configured to be able to move in the Y-axis direction; a second moving body, which guides the movement of the first moving body in the X-axis direction and is configured to be able to move in the Y-axis direction; a Y-axis driving unit, which drives the X-axis driving unit or the second moving body in the Y-axis direction; and a restraining unit, which does not restrain the relative movement of the X-axis driving unit and the second moving body in the X-axis direction, but restrains the relative movement in the Y-axis direction when the two are in a non-contact state.
再者,以上構成要素的任意組合或本發明的構成要素和表述在方法、裝置、系統等之間相互置換者亦作為本發明之實施樣態而有效。 [發明之效果]Furthermore, any combination of the above constituent elements or any interchange of the constituent elements and expressions of the present invention between methods, devices, systems, etc. is also valid as an implementation mode of the present invention. [Effect of the invention]
依據本發明,能夠實現載台裝置的高精度化。According to the present invention, it is possible to realize high precision of the stage device.
以下,參閱圖式並基於適合的實施形態,對本發明進行說明。實施形態為例示而並非係限定發明者,且實施形態中記載的所有的特徵或其組合,未必係發明的本質性內容。對各圖式所示之相同或相等的構成要素、構件、處理標註相同的符號,並適當省略重複之說明。The present invention is described below with reference to the drawings and based on appropriate embodiments. The embodiments are illustrative and do not limit the invention, and all features or combinations thereof described in the embodiments are not necessarily essential to the invention. The same or equivalent components, members, and processes shown in each drawing are marked with the same symbols, and repeated descriptions are appropriately omitted.
在本說明書中,“構件A與構件B非接觸”是指,構件A與構件B在物理上不直接接觸,並且構件A與構件B亦不間接接觸(亦即,亦不透過其他構件而間接連接)。In this specification, “component A and component B are not in contact” means that component A and component B are not in direct physical contact, and component A and component B are not in indirect contact (that is, they are not indirectly connected through other components).
圖1係實施形態之載台裝置100的立體圖。為了便於說明,如圖所示,規定XYZ正交座標系,其中,將與台面10a(後述)平行的某一方向設為X軸方向,將與X軸方向正交且與台面10a平行的方向設為Y軸方向,將與兩者正交之(亦即,與台面10a正交之)方向設為Z軸方向。圖2(a)~圖2(c)係表示圖1的載台裝置100之圖。圖2(a)係載台裝置100的俯視圖,圖2(b)係沿X軸方向觀察之載台裝置100的側視圖,圖2(c)係沿Y軸方向觀察之載台裝置100的側視圖。FIG. 1 is a three-dimensional diagram of a
載台裝置100稱為XY載台,在X軸方向、Y軸方向上定位對象物。載台裝置100係具備:平台10;第一移動體12,係構成為能夠在X軸方向上移動;第二移動體14,係引導第一移動體12在X軸方向上的移動,並且構成為能夠在Y軸方向上移動;第一X軸驅動部16及第二X軸驅動部18,係在X軸方向上驅動第一移動體12;第一Y軸驅動部20及第二Y軸驅動部22,係在Y軸方向上驅動第二移動體14;以及四個拘束單元88,係非接觸地拘束第一Y軸導件24、第二Y軸導件26、X軸驅動部及第二移動體14在Y軸方向上的相對移動。The
平台10在俯視觀察時為矩形形狀的構件。對作為平台10之上表面的台面10a實施平面加工。又,對沿Y軸方向延伸的第一側面10b亦實施平面加工。台面10a及第一側面10b如後述那樣作為空氣軸承(air bearing)滑動之滑動面而發揮作用。The
第一Y軸驅動部20包括第一Y軸定子28及第一Y軸可動件30。第一Y軸定子28係與長度方向正交之截面為圓形狀之細長的棒狀的構件,其連結複數個圓柱狀的磁鐵而構成。第一Y軸定子28配置成軸線方向與Y軸方向一致,其兩端由被固定於平台10的第一側面10b之未圖示的一對保持構件來保持。亦即,第一Y軸定子28在俯視觀察時,配置於平台10的外側。The first Y-
第一Y軸可動件30包括殼體(housing)32及線圈(未圖示)。在殼體32中,形成有沿Y軸方向貫穿之截面為圓形的插穿孔,並插穿有第一Y軸定子28。線圈以圍繞第一Y軸定子28的方式配置在插穿孔內,並固定於插穿孔的周面。當在線圈中流過電流時,在線圈與第一Y軸定子28之間產生電磁力,由於其電磁相互作用,線圈乃至第一Y軸可動件30沿Y軸方向移動。The first Y-axis
第二Y軸驅動部22包括第二Y軸定子34及第二Y軸可動件36。第二Y軸定子34、第二Y軸可動件36的結構與第一Y軸定子28、第一Y軸可動件30的結構相同。再者,第二Y軸定子34配置成其軸線方向與Y軸方向一致,且與第一Y軸定子28平行排列。又,第二Y軸定子34的兩端由被固定於台面10a上之一對保持構件(未圖示)來支撐。The second Y-
第二移動體14包括第二可動部38、複數個Y軸偏航空氣軸承(yaw air bearings)40、導樑42及複數個Y軸升降空氣軸承(lift air bearing)44。The second moving
第二可動部38為板狀構件,並配置成兩個主表面朝向X軸方向。第二可動部38設置在第一Y軸可動件30的下方,並連結於第一Y軸可動件30。因此,第二可動部38與第一Y軸可動件30一同移動。第二可動部38的下側部分與平台10的第一側面10b相對向。The second
複數個Y軸偏航空氣軸承40固定於與平台10的第一側面10b相對向之第二可動部38的下側部分,並相對於第一側面10b噴出空氣等氣體。藉由該排斥力,第二可動部38與第一側面10b的非接觸狀態得以維持。A plurality of Y-axis yaw
導樑42為長條狀的構件,並以長度方向與X軸方向一致的方式,配置在第一X軸定子52(後述)與第二X軸定子58(後述)之間。導樑42的其中一端連結於第二可動部38,且另一端連結於第二Y軸可動件36。導樑42的與X軸方向正交之截面的形狀具有凹形。詳細而言,導樑42包括底壁46、第一側壁48及第二側壁50。底壁46為在X軸方向上較長的平板狀的構件,並設置成兩個主表面朝向Z軸方向。第一側壁48為在X軸方向上較長的立壁,並從底壁46的上表面(亦即,一個主表面)的Y軸方向的其中一端立起設置。第二側壁50與第一側壁48相同,為在X軸方向上較長的立壁,並從底壁46的上表面的Y軸方向的另一端立起設置,以使與第一側壁48在Y軸方向上相對向。The
第一側壁48的外側的面,亦即與第二側壁50相對向的面為相反側的面被實施平面加工,並作為用以使空氣軸承滑動的滑動面而發揮作用。以下,將第一側壁48的外側的面稱為第一滑動面48a。同樣地,第二側壁50的外側的面被實施平面加工,並作為用以使空氣軸承滑動的滑動面而發揮作用。以下,將第二側壁50的外側的面稱為第二滑動面50a。The outer surface of the
複數個Y軸升降空氣軸承44固定於導樑42。Y軸升降空氣軸承44相對於平台10的台面10a噴出氣體。藉由該排斥力,Y軸升降空氣軸承44乃至導樑42與台面10a保持非接觸狀態,詳細而言在與台面10a之間隔著數μm左右的間隙而被支撐在Z軸方向上。A plurality of Y-axis
第一X軸驅動部16包括第一X軸定子52和第一X軸可動件54。第一X軸定子52的機構與第一Y軸定子28或第二Y軸定子34的結構相同。第一X軸定子52配置成軸線方向與X軸方向一致,其兩端被第一支撐構件56支撐。第一X軸可動件54的結構與第一Y軸可動件30或第二Y軸可動件36的結構相同,並且藉由與第一X軸定子52的電磁相互作用而在X軸方向上移動。The first
第二X軸驅動部18包括第二X軸定子58、第二X軸可動件60及第二支撐構件62。第二X軸定子58、第二X軸可動件60的結構分別與第一X軸定子52及第一X軸可動件54的結構相同。第二X軸定子58配置成軸線方向與X軸方向一致且與第一X軸定子52平行排列,其兩端被第二支撐構件62支撐。The second
圖3係沿圖2(a)的A-A線剖切之剖面圖。第一移動體12包括第一可動部64、複數個X軸偏航空氣軸承66、複數個X軸升降空氣軸承68及載台70。第一可動部64為方形筒狀構件,並插穿有導樑42。第一可動部64包括底壁72、上壁74、第一側壁76及第二側壁78。第一側壁76與導樑42的第一滑動面48a相對向,且第二側壁78與導樑42的第二滑動面50a相對向。在第一側壁76的外側的面,經由未圖示的連接部件連結有第一X軸可動件54,且在第二側壁78的外側的面,經由未圖示的連接部件連結有第二X軸可動件60。因此,第一可動部64與第一X軸可動件54及第二X軸可動件60一同移動。FIG3 is a cross-sectional view taken along the A-A line of FIG2(a). The first
複數個X軸偏航空氣軸承66固定於第一側壁76的內表面(亦即,與第二側壁78相對向之面)76a及第二側壁78的內表面(亦即,與第一側壁76相對向之面)78a,並對導樑42的第一滑動面48a及第二滑動面50a噴出氣體。又,複數個X軸升降空氣軸承68固定於底壁72的下表面72a,並對台面10a噴出氣體。藉由由X軸偏航空氣軸承66及X軸升降空氣軸承68噴出氣體而產生的排斥力,第一可動部64與導樑42及台面10a保持非接觸的狀態,詳細而言在導樑42及台面10a之間隔著數μm左右的間隙而被支撐在Y軸方向及Z軸方向上。A plurality of X-axis
載台70固定於第一可動部64。在載台70上,例如載置有半導體晶圓等加工對象物等。The
返回圖1、圖2(a)~圖2(c),第一Y軸導件24包括第一Y軸導軌80和兩個第一滑動件82。第一Y軸導軌80以延伸方向與Y軸方向一致的方式固定於台面10a上。兩個第一滑動件82分別包括複數個滾動體,並沿第一Y軸導軌80在Y軸方向上移動。Returning to FIG. 1 and FIG. 2(a) to FIG. 2(c), the first Y-
第二Y軸導件26包括第二Y軸導軌84和兩個第二滑動件86。第二Y軸導軌84、第二滑動件86的結構分別與第一Y軸導軌80、第一滑動件82的結構相同。再者,第二Y軸導軌84配置成延伸方向與Y軸方向一致,且與第一Y軸導軌80平行排列。The second Y-
支撐第一X軸定子52之兩個第一支撐構件56中的一個被第一Y軸導件24的第一滑動件82支撐,且另一個被第二Y軸導件26的第二滑動件86支撐。亦即,第一支撐構件56乃至第一X軸驅動部16構成為能夠在Y軸方向上移動。One of the two first supporting
同樣地,支撐第二X軸定子58之兩個第二支撐構件62中的一個被第一Y軸導件24的第一滑動件82支撐,且另一個被第二Y軸導件26的第二滑動件86支撐。亦即,第二支撐構件62乃至第二X軸驅動部18構成為能夠在Y軸方向上移動。Similarly, one of the two second supporting
在此,對第一移動體12、第二移動體14、X軸驅動部及Y軸驅動部的支撐進行總結。Here, the support of the first moving
(i)第一移動體12不直接亦不間接地(亦即,經由其他構件)被第二移動體14、X軸驅動部及Y軸驅動部支撐。第一移動體12直接被平台10支撐。具體而言,藉由從X軸升降空氣軸承68噴出之氣體的排斥力,第一移動體12在與平台10非接觸的狀態下,被平台10支撐。(i) The first moving
(ii)第二移動體14不直接亦不間接地被第一移動體12、X軸驅動部及Y軸驅動部支撐。第二移動體14直接被平台10支撐。具體而言,藉由從複數個Y軸升降空氣軸承44噴出之氣體的排斥力,第二移動體14在與平台10非接觸的狀態下,被平台10支撐。(ii) The second moving
(iii)X軸驅動部不直接亦不間接地被第一移動體12、第二移動體14及Y軸驅動部支撐。X軸驅動部經由直接被平台10支撐之Y軸導件,而被平台10支撐。(iii) The X-axis driving part is not directly or indirectly supported by the first moving
(iv)Y軸驅動部不直接亦不間接地被第一移動體12、第二移動體14及X軸驅動部支撐。Y軸驅動部經由直接被平台10支撐的未圖示的保持構件,而被平台10支撐。(iv) The Y-axis driving unit is not directly or indirectly supported by the first moving
如上所述,第一移動體12、第二移動體14、X軸驅動部及Y軸驅動部相互獨立地,換言之,不經由共通的構件或彼此,而被平台10支撐。As described above, the first moving
圖4係表示導樑42的其中一端和其周邊之立體圖。拘束單元88不拘束X軸驅動部與第二移動體14在X軸方向上的相對移動,而拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。拘束單元88尤其在X軸驅動部與第二移動體14保持非接觸的狀態下,更具體而言,X軸驅動部與第二移動體14不直接接觸,且亦不經由其他構件連接的情況下,拘束在Y軸方向上的相對移動。FIG4 is a three-dimensional diagram showing one end of the
圖5係說明拘束單元88的其中一例之圖。圖5係載台裝置100的俯視圖。在圖5中,省略第一移動體12和Y軸驅動部的顯示。拘束單元88包括第一磁鐵90、第二磁鐵92及磁性體93。磁鐵90、磁鐵92可以是永久磁鐵,亦可以是電磁體。第一磁鐵90固定於X軸驅動部。在圖5中,固定於與導樑42相對向之支撐構件的側面。第二磁鐵92及磁性體93固定於第二移動體14。在圖5中,固定於與支撐構件相對向之導樑42的側面。FIG5 is a diagram illustrating one example of the
磁性體93與第一磁鐵90在Y軸方向上相對向。再者,磁性體93亦可以固定於X軸驅動部,且與第二磁鐵92在Y軸方向上相對向。總之,磁性體93與磁鐵在Y軸方向上相互吸引,藉此X軸驅動部與第二移動體14在Y軸方向上相互吸引,X軸驅動部與第二移動體14在Y軸方向上的相對移動受到拘束。亦即,本實施形態的拘束單元88藉由磁性的吸引力,拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。藉由在Y軸方向上的相對移動受到拘束,當第二移動體14被Y軸驅動部驅動而在Y軸方向上移動時,X軸驅動部追隨第二移動體14亦在Y軸方向上移動。The
又,第一磁鐵90和第二磁鐵92以相同的磁極在Y軸方向上相對向的方式被固定。在圖5中,以S極彼此相對向的方式被固定。藉由相同的磁極在Y軸方向上相對向,第一磁鐵90和第二磁鐵92在Y軸方向上彼此排斥。通過該排斥力,第一磁鐵90乃至X軸驅動部與第二磁鐵92乃至第二移動體14的非接觸狀態得以維持。Furthermore, the
另一方面,X軸驅動部與第二移動體14在X軸方向上的相對移動不受拘束,並且彼此獨立地被支撐,因此藉由X軸驅動部驅動第一移動體12時的反作用力不會被傳遞到第二移動體14。On the other hand, the relative movement of the X-axis driving portion and the second moving
對如上構成之載台裝置100的動作進行說明。
若電流供給至第一Y軸驅動部20的第一Y軸可動件30的線圈、及第二Y軸驅動部22的第二Y軸可動件36的線圈,則在各線圈與Y軸定子之間產生電磁力,藉由其電磁相互作用,Y軸可動件乃至第二移動體14(及第一移動體12)在Y軸方向上移動。若電流供給至第一X軸驅動部16的第一X軸可動件54的線圈、及第二X軸驅動部18的第二X軸可動件60的線圈,則在各線圈與X軸定子之間產生電磁力,藉由其電磁相互作用,X軸可動件乃至第一移動體12在X軸方向上移動。如此,藉由使第一移動體12及第二移動體14移動,使第一移動體12的載台70在XY方向上移動,並將載置於載台70的對象物在XY方向上定位。第一X軸驅動部16及第二X軸驅動部18與第二移動體14藉由拘束單元88在Y軸方向上的相對移動受到拘束,因此隨著第二移動體14在Y軸方向上的移動,第一X軸驅動部16及第二X軸驅動部18亦在Y軸方向上移動。The operation of the
依據以上說明之實施形態之載台裝置100,X軸驅動部與第二移動體14在X軸方向上的相對移動不受拘束,在Y軸方向上的相對移動以非接觸的方式被拘束,進而,X軸驅動部與第二移動體14彼此獨立地被支撐。藉此,追隨第二移動體14在Y軸方向上的移動而使X軸驅動部在Y軸方向上移動的同時,抑制了藉由X軸驅動部驅動第一移動體12時的反作用力傳遞到第二移動體14(尤其第二可動部38)。因此,不會產生由第二可動部38的結構構件引起之滯後及振動,或者抑制其產生。亦即,可實現更高精度的載台裝置100。又,由於抑制了反作用力傳遞到第二可動部38,因此由該反作用力引起之第二可動部38的振動比較迅速地停止。藉此,使用載台裝置100生產的生產量提高。According to the
以上,對實施形態的載台裝置進行了說明。該實施形態為例示,本領域技術人員應當理解該等各構成要素和各處理製程的組合可以存在各種變形例,並且該等變形例亦在本發明的範圍內。以下示出變形例。The above is a description of the stage device of the embodiment. The embodiment is an example, and those skilled in the art should understand that the combination of the components and the processing steps may have various variations, and the variations are also within the scope of the present invention. The following are variations.
(變形例1)
圖6係說明拘束單元88的另一例之圖。圖6對應於圖5。在本變形例中,拘束單元88為空氣墊96。空氣墊96固定於X軸驅動部及第二移動體14中的一個上。在圖6中,空氣墊96固定於與導樑42相對向之支撐構件的側面。空氣墊96可以經由間隔件98而固定於支撐構件,以使與導樑42的間隙變得微小。空氣墊96具有朝向導樑42的側面的吸引口96a及噴出口96b。空氣墊96從吸引口96a吸引空氣。藉由該吸引力,拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。(Variant 1)
Figure 6 is a diagram illustrating another example of the
又,空氣墊96將從未圖示的供氣系統供給之高壓的氣體從噴出口96b朝向導樑42沿Y軸方向噴出。藉由該排斥力,X軸驅動部與第二移動體14的非接觸狀態得以維持。The
依據本變形例,能夠實現與實施形態相同的效果。According to this variant example, the same effect as the implementation form can be achieved.
(變形例2)
圖7係說明拘束單元88的又一例之圖。圖7對應於圖5。第一X軸驅動部16與第二X軸驅動部18藉由連接構件94而彼此連接,以形成為一體在Y軸方向上移動。在圖7中,第一支撐構件56與第二支撐構件62藉由連接構件94而連接。(Variant 2)
Figure 7 is a diagram illustrating another example of the
拘束單元88包括第一磁鐵90及第二磁鐵92。第一磁鐵90固定於X軸驅動部。在圖7中,固定於與導樑42相對向之支撐構件的側面。第二磁鐵92固定於第二移動體14。在圖7中,固定於與支撐構件相對向之導樑42的側面。第一磁鐵90與第二磁鐵92以相同的磁極在Y軸方向上相對向的方式被固定。在圖7中,以S極彼此相對向的方式被固定。藉此,第一磁鐵90與第二磁鐵92在Y軸方向上彼此排斥。The restraining
當第二移動體14向第一X軸驅動部16側移動時,第一支撐構件56乃至第一X軸驅動部16藉由磁鐵的排斥力而被導樑42(第二移動體14)推壓,並與第二移動體14一同移動。與第一X軸驅動部16連接之第二X軸驅動部18亦朝向相同的方向移動。當第二移動體14向第二X軸驅動部18側移動時,第二支撐構件62乃至第二X軸驅動部18藉由磁鐵的排斥力而被導樑42(第二移動體14)推壓,並與第二移動體14一同移動。與第二X軸驅動部18連接之第一X軸驅動部16亦朝向相同的方向移動。When the second moving
亦即,在本變形例中,使用磁性的排斥力,拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。That is, in this modification, the magnetic repulsive force is used to constrain the relative movement of the X-axis driving portion and the second
依據本變形例,能夠實現與實施形態相同的效果。According to this variant example, the same effect as the implementation form can be achieved.
(變形例3)
圖8係說明拘束單元88的又一例的圖。圖8對應於圖7。(Variant 3)
Figure 8 is a diagram illustrating another example of the restraining
拘束單元88包括固定於X軸驅動部及第二移動體14中的其中一個上之空氣墊96。在圖8中,空氣墊96固定於與導樑42相對向之支撐構件的側面。空氣墊96為噴出型的空氣墊。空氣墊96將由未圖示的供氣系統供給之高壓的氣體朝向導樑42沿Y軸方向噴出,並在與導樑42之間的微小的間隙中形成高壓的氣體層。再者,空氣墊96亦可以固定於導樑42的側面。The
當第二移動體14向第一X軸驅動部16側移動時,第一支撐構件56乃至第一X軸驅動部16藉由氣體層而被導樑42(第二移動體14)推壓,並與第二移動體14一同移動。與第一X軸驅動部16連接之第二X軸驅動部18亦朝向相同的方向移動。當第二移動體14向第二X軸驅動部18側移動時,第二支撐構件62乃至第二X軸驅動部18藉由氣體層而被導樑42(第二移動體14)推壓,並與第二移動體14一同移動。與第二X軸驅動部18連接之第一X軸驅動部16亦朝向相同的方向移動。When the second moving
亦即,在本變形例中,使用空氣的排斥力,拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。That is, in this modification, the repulsive force of air is used to constrain the relative movement of the X-axis driving portion and the second
依據本變形例,能夠實現與實施形態相同的效果。According to this variant example, the same effect as the implementation form can be achieved.
(變形例4)
在實施形態中,對Y軸驅動部在Y軸方向上驅動第二移動體14之情況進行了說明,但是並不限定於此,Y軸驅動部亦可以在Y軸方向上驅動X軸驅動部。在該情況下,Y軸驅動部的可動件與X軸驅動部被連結。當X軸驅動部被Y軸驅動部驅動而在Y軸方向上移動時,藉由拘束單元88,與X軸驅動部在Y軸方向上的相對移動受到拘束的第二移動體14與X軸驅動部一同在Y軸方向上移動。(Variant 4)
In the embodiment, the Y-axis driving unit drives the second
上述的實施形態與變形例的任意組合亦作為本發明的實施形態而有用。藉由組合而產生之新的實施形態兼具所組合之實施形態及變形例各自的效果。Any combination of the above-mentioned embodiments and modifications is also useful as an embodiment of the present invention. A new embodiment generated by the combination has the effects of the combined embodiments and modifications.
12:第一移動體 14:第二移動體 16:第一X軸驅動部 18:第二X軸驅動部 20:第一Y軸驅動部 22:第二Y軸驅動部 88:拘束單元 100:載台裝置12: First moving body 14: Second moving body 16: First X-axis driving unit 18: Second X-axis driving unit 20: First Y-axis driving unit 22: Second Y-axis driving unit 88: Constraint unit 100: Stage device
[圖1]係表示實施形態之載台裝置之圖。 [圖2(a)]~[圖2(c)]係表示圖1的載台裝置之圖。 [圖3]係沿圖2(a)的A-A線剖切之剖面圖。 [圖4]係表示圖1的導樑(guide beam)的其中一端與其周邊之立體圖。 [圖5]係說明拘束單元的其中一例之圖。 [圖6]係說明拘束單元的另一例之圖。 [圖7]係說明拘束單元的又一例之圖。 [圖8]係說明拘束單元的又一例之圖。[Fig. 1] is a diagram showing a stage device of an implementation form. [Fig. 2(a)] to [Fig. 2(c)] are diagrams showing the stage device of Fig. 1. [Fig. 3] is a cross-sectional view taken along line A-A of Fig. 2(a). [Fig. 4] is a three-dimensional view showing one end of the guide beam of Fig. 1 and its periphery. [Fig. 5] is a diagram showing one example of a restraining unit. [Fig. 6] is a diagram showing another example of a restraining unit. [Fig. 7] is a diagram showing still another example of a restraining unit. [Fig. 8] is a diagram showing still another example of a restraining unit.
10:平台 10: Platform
10a:台面 10a: Countertop
10b:第一側面 10b: First side
12:第一移動體 12: First moving body
14:第二移動體 14: Second moving body
16:第一X軸驅動部 16: First X-axis drive unit
18:第二X軸驅動部 18: Second X-axis drive unit
20:第一Y軸驅動部 20: First Y-axis drive unit
22:第二Y軸驅動部 22: Second Y-axis drive unit
24:第一Y軸導件 24: First Y-axis guide
26:第二Y軸導件 26: Second Y-axis guide
28:第一Y軸定子 28: First Y-axis stator
30:第一Y軸可動件 30: First Y-axis movable part
32:殼體 32: Shell
34:第二Y軸定子 34: Second Y-axis stator
36:第二Y軸可動件 36: Second Y-axis movable part
38:第二可動部 38: Second movable part
40:Y軸偏航空氣軸承 40: Y-axis eccentric air bearing
42:導樑 42: Guide beam
46:底壁 46: Bottom wall
48:第一側壁 48: First side wall
48a:第一滑動面 48a: First sliding surface
50:第二側壁 50: Second side wall
52:第一X軸定子 52: First X-axis stator
54:第一X軸可動件 54: First X-axis movable part
56:第一支撐構件 56: The first supporting member
58:第二X軸定子 58: Second X-axis stator
60:第二X軸可動件 60: Second X-axis movable part
62:第二支撐構件 62: Second supporting member
70:載台 70: Carrier
80:第一Y軸導軌 80: First Y-axis guide rail
82:第一滑動件 82: First sliding member
84:第二Y軸導軌 84: Second Y-axis guide rail
86:第二滑動件 86: Second sliding member
88:拘束單元 88: Restraint unit
100:載台裝置 100: stage device
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JP2020062981A JP7370920B2 (en) | 2020-03-31 | 2020-03-31 | stage equipment |
JP2020-062981 | 2020-03-31 |
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KR (1) | KR102527517B1 (en) |
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CN113471133A (en) | 2021-10-01 |
KR20210122116A (en) | 2021-10-08 |
KR102527517B1 (en) | 2023-04-28 |
TW202140186A (en) | 2021-11-01 |
JP7370920B2 (en) | 2023-10-30 |
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