TWI839602B - Stage device - Google Patents

Stage device Download PDF

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TWI839602B
TWI839602B TW110111037A TW110111037A TWI839602B TW I839602 B TWI839602 B TW I839602B TW 110111037 A TW110111037 A TW 110111037A TW 110111037 A TW110111037 A TW 110111037A TW I839602 B TWI839602 B TW I839602B
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Taiwan
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axis
moving body
axis direction
movable
axis driving
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TW110111037A
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TW202140186A (en
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中島龍太
吉田達矢
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日商住友重機械工業股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/38—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members using fluid bearings or fluid cushion supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2707/00—Automatic supply or removal of metal workpieces
    • B23Q2707/04—Automatic supply or removal of metal workpieces by means of grippers also magnetic or pneumatic gripping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Machine Tool Units (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

[課題] 提供一種能夠實現載台裝置的高精度化之技術。 [解決手段] 載台裝置係具備：第一移動體；X軸驅動部，係在X軸方向上驅動第一移動體，且構成為能夠在Y軸方向上移動；第二移動體，係引導第一移動體在X軸方向上的移動，且構成為能夠在Y軸方向上移動；Y軸驅動部，係在Y軸方向上驅動X軸驅動部或第二移動體；以及拘束單元，係不拘束X軸驅動部與第二移動體在X軸方向上的相對移動，而在兩者非接觸的狀態下拘束在Y軸方向上的相對移動。[Topic] Provide a technology capable of realizing high precision of a stage device. [Solution] The stage device comprises: a first moving body; an X-axis driving unit that drives the first moving body in the X-axis direction and is configured to be movable in the Y-axis direction; a second moving body that guides the movement of the first moving body in the X-axis direction and is configured to be movable in the Y-axis direction; a Y-axis driving unit that drives the X-axis driving unit or the second moving body in the Y-axis direction; and a restraining unit that does not restrain the relative movement of the X-axis driving unit and the second moving body in the X-axis direction, but restrains the relative movement of the two in the Y-axis direction in a non-contact state.

Description

載台裝置Stage device

本發明係有關一種載台裝置。The present invention relates to a carrier device.

已知一種用以定位對象物之載台裝置。以往，提出有一種載台裝置，係具備：第一移動體；驅動體，係在X軸方向上驅動第一移動體；以及第二移動體，係引導第一移動體在X軸方向上的移動，且構成為能夠在Y軸方向上移動(例如專利文獻1)。 [先前技術文獻]A stage device for positioning an object is known. In the past, a stage device has been proposed, which comprises: a first moving body; a driving body that drives the first moving body in the X-axis direction; and a second moving body that guides the movement of the first moving body in the X-axis direction and is configured to be able to move in the Y-axis direction (e.g., Patent Document 1). [Prior Technical Document]

[專利文獻1] 日本特開2009-101427號公報[Patent Document 1] Japanese Patent Application Publication No. 2009-101427

[發明所欲解決之問題][The problem the invention is trying to solve]

在以往的載台裝置中，X軸驅動部被支撐於第二移動體。因此，X軸驅動部驅動第一移動體時的反作用力能夠傳遞到第二移動體。In the conventional stage device, the X-axis driving unit is supported by the second moving body. Therefore, the reaction force when the X-axis driving unit drives the first moving body can be transmitted to the second moving body.

然而，有想要使用載台裝置使用來定位更大的對象物之要求。在該情況下，需要使載台裝置大型化，隨之X軸驅動部亦會大型化，且X軸驅動部驅動第一移動體時的反作用力亦會變大。若將以往的載台裝置直接大型化，則會導致其較大的反作用力傳遞到第二移動體。這會誘發由第二移動體的結構構件引起之滯後(hysteresis)及振動。亦即，妨礙高精度化。However, there is a demand to use a stage device to position larger objects. In this case, the stage device needs to be enlarged, and the X-axis drive unit will also be enlarged, and the reaction force when the X-axis drive unit drives the first moving body will also become larger. If the conventional stage device is directly enlarged, its larger reaction force will be transmitted to the second moving body. This will induce hysteresis and vibration caused by the structural components of the second moving body. In other words, it hinders high precision.

又，載台裝置有時使用於半導體元件的製造。由於半導體元件的設計規則的微細化或重疊、或者由於積層的需求，對製造中所使用之載台裝置要求進一步的高精度化。In addition, the stage device is sometimes used in the manufacture of semiconductor devices. Due to the miniaturization or overlap of design rules of semiconductor devices, or due to the need for lamination, the stage device used in the manufacture is required to have higher precision.

總之，對於載台裝置而言要求高精度化。In short, high precision is required for the stage device.

本發明係於此種狀況下完成者，其一種實施樣態的例示性目的之一為提供一種能夠實現載台裝置的高精度化之技術。 [解決問題之技術手段]The present invention was completed under such circumstances, and one of the exemplary purposes of one embodiment is to provide a technology that can achieve high precision of the stage device. [Technical means to solve the problem]

為了解決上述問題，本發明的一種實施樣態的載台裝置係具備：第一移動體；X軸驅動部，係在X軸方向上驅動第一移動體，且構成為能夠在Y軸方向上移動；第二移動體，係引導第一移動體在X軸方向上的移動，且構成為能夠在Y軸方向上移動；Y軸驅動部，係在Y軸方向上驅動X軸驅動部或第二移動體；以及拘束單元，係不拘束X軸驅動部與第二移動體在X軸方向上的相對移動，而在兩者非接觸的狀態下拘束在Y軸方向上的相對移動。In order to solve the above-mentioned problem, a stage device of an implementation form of the present invention comprises: a first moving body; an X-axis driving unit, which drives the first moving body in the X-axis direction and is configured to be able to move in the Y-axis direction; a second moving body, which guides the movement of the first moving body in the X-axis direction and is configured to be able to move in the Y-axis direction; a Y-axis driving unit, which drives the X-axis driving unit or the second moving body in the Y-axis direction; and a restraining unit, which does not restrain the relative movement of the X-axis driving unit and the second moving body in the X-axis direction, but restrains the relative movement in the Y-axis direction when the two are in a non-contact state.

再者，以上構成要素的任意組合或本發明的構成要素和表述在方法、裝置、系統等之間相互置換者亦作為本發明之實施樣態而有效。 [發明之效果]Furthermore, any combination of the above constituent elements or any interchange of the constituent elements and expressions of the present invention between methods, devices, systems, etc. is also valid as an implementation mode of the present invention. [Effect of the invention]

依據本發明，能夠實現載台裝置的高精度化。According to the present invention, it is possible to realize high precision of the stage device.

以下，參閱圖式並基於適合的實施形態，對本發明進行說明。實施形態為例示而並非係限定發明者，且實施形態中記載的所有的特徵或其組合，未必係發明的本質性內容。對各圖式所示之相同或相等的構成要素、構件、處理標註相同的符號，並適當省略重複之說明。The present invention is described below with reference to the drawings and based on appropriate embodiments. The embodiments are illustrative and do not limit the invention, and all features or combinations thereof described in the embodiments are not necessarily essential to the invention. The same or equivalent components, members, and processes shown in each drawing are marked with the same symbols, and repeated descriptions are appropriately omitted.

在本說明書中，“構件A與構件B非接觸”是指，構件A與構件B在物理上不直接接觸，並且構件A與構件B亦不間接接觸(亦即，亦不透過其他構件而間接連接)。In this specification, “component A and component B are not in contact” means that component A and component B are not in direct physical contact, and component A and component B are not in indirect contact (that is, they are not indirectly connected through other components).

圖1係實施形態之載台裝置100的立體圖。為了便於說明，如圖所示，規定XYZ正交座標系，其中，將與台面10a(後述)平行的某一方向設為X軸方向，將與X軸方向正交且與台面10a平行的方向設為Y軸方向，將與兩者正交之(亦即，與台面10a正交之)方向設為Z軸方向。圖2(a)～圖2(c)係表示圖1的載台裝置100之圖。圖2(a)係載台裝置100的俯視圖，圖2(b)係沿X軸方向觀察之載台裝置100的側視圖，圖2(c)係沿Y軸方向觀察之載台裝置100的側視圖。FIG. 1 is a three-dimensional diagram of a stage device 100 of an implementation form. For ease of explanation, as shown in the figure, an XYZ orthogonal coordinate system is defined, wherein a direction parallel to a table surface 10a (described later) is set as an X-axis direction, a direction perpendicular to the X-axis direction and parallel to the table surface 10a is set as a Y-axis direction, and a direction perpendicular to both (that is, perpendicular to the table surface 10a) is set as a Z-axis direction. FIG. 2(a) to FIG. 2(c) are diagrams showing the stage device 100 of FIG. 1. FIG. 2(a) is a top view of the stage device 100, FIG. 2(b) is a side view of the stage device 100 observed along the X-axis direction, and FIG. 2(c) is a side view of the stage device 100 observed along the Y-axis direction.

載台裝置100稱為XY載台，在X軸方向、Y軸方向上定位對象物。載台裝置100係具備：平台10；第一移動體12，係構成為能夠在X軸方向上移動；第二移動體14，係引導第一移動體12在X軸方向上的移動，並且構成為能夠在Y軸方向上移動；第一X軸驅動部16及第二X軸驅動部18，係在X軸方向上驅動第一移動體12；第一Y軸驅動部20及第二Y軸驅動部22，係在Y軸方向上驅動第二移動體14；以及四個拘束單元88，係非接觸地拘束第一Y軸導件24、第二Y軸導件26、X軸驅動部及第二移動體14在Y軸方向上的相對移動。The stage device 100 is called an XY stage, and positions an object in the X-axis direction and the Y-axis direction. The stage device 100 comprises: a platform 10; a first movable body 12, which is configured to be movable in the X-axis direction; a second movable body 14, which guides the movement of the first movable body 12 in the X-axis direction and is configured to be movable in the Y-axis direction; a first X-axis driving unit 16 and a second X-axis driving unit 18, which drive the first movable body 12 in the X-axis direction; a first Y-axis driving unit 20 and a second Y-axis driving unit 22, which drive the second movable body 14 in the Y-axis direction; and four restraining units 88, which restrain the relative movement of the first Y-axis guide 24, the second Y-axis guide 26, the X-axis driving unit and the second movable body 14 in the Y-axis direction in a non-contact manner.

平台10在俯視觀察時為矩形形狀的構件。對作為平台10之上表面的台面10a實施平面加工。又，對沿Y軸方向延伸的第一側面10b亦實施平面加工。台面10a及第一側面10b如後述那樣作為空氣軸承(air bearing)滑動之滑動面而發揮作用。The platform 10 is a rectangular member when viewed from above. The table 10a, which is the upper surface of the platform 10, is subjected to planar processing. In addition, the first side surface 10b extending along the Y-axis direction is also subjected to planar processing. The table 10a and the first side surface 10b function as sliding surfaces for sliding of an air bearing as described later.

第一Y軸驅動部20包括第一Y軸定子28及第一Y軸可動件30。第一Y軸定子28係與長度方向正交之截面為圓形狀之細長的棒狀的構件，其連結複數個圓柱狀的磁鐵而構成。第一Y軸定子28配置成軸線方向與Y軸方向一致，其兩端由被固定於平台10的第一側面10b之未圖示的一對保持構件來保持。亦即，第一Y軸定子28在俯視觀察時，配置於平台10的外側。The first Y-axis drive unit 20 includes a first Y-axis stator 28 and a first Y-axis movable member 30. The first Y-axis stator 28 is a thin and long rod-shaped member having a circular cross section perpendicular to the longitudinal direction, and is formed by connecting a plurality of cylindrical magnets. The first Y-axis stator 28 is arranged so that the axial direction is consistent with the Y-axis direction, and its two ends are held by a pair of holding members (not shown) fixed to the first side surface 10b of the platform 10. That is, the first Y-axis stator 28 is arranged on the outer side of the platform 10 when viewed from above.

第一Y軸可動件30包括殼體(housing)32及線圈(未圖示)。在殼體32中，形成有沿Y軸方向貫穿之截面為圓形的插穿孔，並插穿有第一Y軸定子28。線圈以圍繞第一Y軸定子28的方式配置在插穿孔內，並固定於插穿孔的周面。當在線圈中流過電流時，在線圈與第一Y軸定子28之間產生電磁力，由於其電磁相互作用，線圈乃至第一Y軸可動件30沿Y軸方向移動。The first Y-axis movable part 30 includes a housing 32 and a coil (not shown). In the housing 32, a through hole with a circular cross section is formed that penetrates along the Y-axis direction, and the first Y-axis stator 28 is inserted through it. The coil is arranged in the through hole in a manner surrounding the first Y-axis stator 28 and is fixed to the circumferential surface of the through hole. When current flows through the coil, an electromagnetic force is generated between the coil and the first Y-axis stator 28. Due to the electromagnetic interaction, the coil and even the first Y-axis movable part 30 move along the Y-axis direction.

第二Y軸驅動部22包括第二Y軸定子34及第二Y軸可動件36。第二Y軸定子34、第二Y軸可動件36的結構與第一Y軸定子28、第一Y軸可動件30的結構相同。再者，第二Y軸定子34配置成其軸線方向與Y軸方向一致，且與第一Y軸定子28平行排列。又，第二Y軸定子34的兩端由被固定於台面10a上之一對保持構件(未圖示)來支撐。The second Y-axis drive unit 22 includes a second Y-axis stator 34 and a second Y-axis movable member 36. The structures of the second Y-axis stator 34 and the second Y-axis movable member 36 are the same as those of the first Y-axis stator 28 and the first Y-axis movable member 30. Furthermore, the second Y-axis stator 34 is configured so that its axial direction is consistent with the Y-axis direction and is arranged in parallel with the first Y-axis stator 28. In addition, both ends of the second Y-axis stator 34 are supported by a pair of holding members (not shown) fixed to the table 10a.

第二移動體14包括第二可動部38、複數個Y軸偏航空氣軸承(yaw air bearings)40、導樑42及複數個Y軸升降空氣軸承(lift air bearing)44。The second moving body 14 includes a second movable portion 38 , a plurality of Y-axis yaw air bearings 40 , a guide beam 42 , and a plurality of Y-axis lift air bearings 44 .

第二可動部38為板狀構件，並配置成兩個主表面朝向X軸方向。第二可動部38設置在第一Y軸可動件30的下方，並連結於第一Y軸可動件30。因此，第二可動部38與第一Y軸可動件30一同移動。第二可動部38的下側部分與平台10的第一側面10b相對向。The second movable part 38 is a plate-shaped member and is configured such that two main surfaces face the X-axis direction. The second movable part 38 is disposed below the first Y-axis movable part 30 and is connected to the first Y-axis movable part 30. Therefore, the second movable part 38 moves together with the first Y-axis movable part 30. The lower side portion of the second movable part 38 is opposite to the first side surface 10b of the platform 10.

複數個Y軸偏航空氣軸承40固定於與平台10的第一側面10b相對向之第二可動部38的下側部分，並相對於第一側面10b噴出空氣等氣體。藉由該排斥力，第二可動部38與第一側面10b的非接觸狀態得以維持。A plurality of Y-axis yaw pneumatic bearings 40 are fixed to the lower portion of the second movable portion 38 opposite to the first side surface 10b of the platform 10, and eject gas such as air toward the first side surface 10b. By the repulsive force, the non-contact state between the second movable portion 38 and the first side surface 10b is maintained.

導樑42為長條狀的構件，並以長度方向與X軸方向一致的方式，配置在第一X軸定子52(後述)與第二X軸定子58(後述)之間。導樑42的其中一端連結於第二可動部38，且另一端連結於第二Y軸可動件36。導樑42的與X軸方向正交之截面的形狀具有凹形。詳細而言，導樑42包括底壁46、第一側壁48及第二側壁50。底壁46為在X軸方向上較長的平板狀的構件，並設置成兩個主表面朝向Z軸方向。第一側壁48為在X軸方向上較長的立壁，並從底壁46的上表面(亦即，一個主表面)的Y軸方向的其中一端立起設置。第二側壁50與第一側壁48相同，為在X軸方向上較長的立壁，並從底壁46的上表面的Y軸方向的另一端立起設置，以使與第一側壁48在Y軸方向上相對向。The guide beam 42 is a long strip-shaped member, and is arranged between the first X-axis stator 52 (described later) and the second X-axis stator 58 (described later) in a manner that the length direction is consistent with the X-axis direction. One end of the guide beam 42 is connected to the second movable part 38, and the other end is connected to the second Y-axis movable part 36. The shape of the cross section of the guide beam 42 perpendicular to the X-axis direction has a concave shape. In detail, the guide beam 42 includes a bottom wall 46, a first side wall 48 and a second side wall 50. The bottom wall 46 is a flat plate-shaped member that is longer in the X-axis direction, and is arranged so that the two main surfaces face the Z-axis direction. The first side wall 48 is a vertical wall that is longer in the X-axis direction and is erected from one end in the Y-axis direction of the upper surface (i.e., one main surface) of the bottom wall 46. The second side wall 50 is the same as the first side wall 48, and is a vertical wall that is longer in the X-axis direction and is erected from the other end in the Y-axis direction of the upper surface of the bottom wall 46 so as to be opposite to the first side wall 48 in the Y-axis direction.

第一側壁48的外側的面，亦即與第二側壁50相對向的面為相反側的面被實施平面加工，並作為用以使空氣軸承滑動的滑動面而發揮作用。以下，將第一側壁48的外側的面稱為第一滑動面48a。同樣地，第二側壁50的外側的面被實施平面加工，並作為用以使空氣軸承滑動的滑動面而發揮作用。以下，將第二側壁50的外側的面稱為第二滑動面50a。The outer surface of the first side wall 48, that is, the surface opposite to the second side wall 50, is flattened and functions as a sliding surface for the air bearing to slide. Hereinafter, the outer surface of the first side wall 48 is referred to as the first sliding surface 48a. Similarly, the outer surface of the second side wall 50 is flattened and functions as a sliding surface for the air bearing to slide. Hereinafter, the outer surface of the second side wall 50 is referred to as the second sliding surface 50a.

複數個Y軸升降空氣軸承44固定於導樑42。Y軸升降空氣軸承44相對於平台10的台面10a噴出氣體。藉由該排斥力，Y軸升降空氣軸承44乃至導樑42與台面10a保持非接觸狀態，詳細而言在與台面10a之間隔著數μm左右的間隙而被支撐在Z軸方向上。A plurality of Y-axis lift air bearings 44 are fixed to the guide beam 42. The Y-axis lift air bearings 44 eject gas toward the table 10a of the stage 10. Due to the repulsive force, the Y-axis lift air bearings 44 and even the guide beams 42 are kept in a non-contact state with the table 10a, and more specifically, are supported in the Z-axis direction with a gap of about several μm between them and the table 10a.

第一X軸驅動部16包括第一X軸定子52和第一X軸可動件54。第一X軸定子52的機構與第一Y軸定子28或第二Y軸定子34的結構相同。第一X軸定子52配置成軸線方向與X軸方向一致，其兩端被第一支撐構件56支撐。第一X軸可動件54的結構與第一Y軸可動件30或第二Y軸可動件36的結構相同，並且藉由與第一X軸定子52的電磁相互作用而在X軸方向上移動。The first X-axis drive unit 16 includes a first X-axis stator 52 and a first X-axis movable member 54. The mechanism of the first X-axis stator 52 is the same as the structure of the first Y-axis stator 28 or the second Y-axis stator 34. The first X-axis stator 52 is configured so that the axial direction is consistent with the X-axis direction, and both ends thereof are supported by the first supporting member 56. The structure of the first X-axis movable member 54 is the same as the structure of the first Y-axis movable member 30 or the second Y-axis movable member 36, and moves in the X-axis direction by electromagnetic interaction with the first X-axis stator 52.

第二X軸驅動部18包括第二X軸定子58、第二X軸可動件60及第二支撐構件62。第二X軸定子58、第二X軸可動件60的結構分別與第一X軸定子52及第一X軸可動件54的結構相同。第二X軸定子58配置成軸線方向與X軸方向一致且與第一X軸定子52平行排列，其兩端被第二支撐構件62支撐。The second X-axis drive unit 18 includes a second X-axis stator 58, a second X-axis movable member 60, and a second support member 62. The structures of the second X-axis stator 58 and the second X-axis movable member 60 are respectively the same as the structures of the first X-axis stator 52 and the first X-axis movable member 54. The second X-axis stator 58 is arranged so that the axial direction is consistent with the X-axis direction and is arranged in parallel with the first X-axis stator 52, and its two ends are supported by the second support member 62.

圖3係沿圖2(a)的A-A線剖切之剖面圖。第一移動體12包括第一可動部64、複數個X軸偏航空氣軸承66、複數個X軸升降空氣軸承68及載台70。第一可動部64為方形筒狀構件，並插穿有導樑42。第一可動部64包括底壁72、上壁74、第一側壁76及第二側壁78。第一側壁76與導樑42的第一滑動面48a相對向，且第二側壁78與導樑42的第二滑動面50a相對向。在第一側壁76的外側的面，經由未圖示的連接部件連結有第一X軸可動件54，且在第二側壁78的外側的面，經由未圖示的連接部件連結有第二X軸可動件60。因此，第一可動部64與第一X軸可動件54及第二X軸可動件60一同移動。FIG3 is a cross-sectional view taken along the A-A line of FIG2(a). The first movable body 12 includes a first movable portion 64, a plurality of X-axis yaw air bearings 66, a plurality of X-axis lifting air bearings 68, and a carrier 70. The first movable portion 64 is a square cylindrical member, and the guide beam 42 is inserted through the first movable portion 64. The first movable portion 64 includes a bottom wall 72, an upper wall 74, a first side wall 76, and a second side wall 78. The first side wall 76 is opposite to the first sliding surface 48a of the guide beam 42, and the second side wall 78 is opposite to the second sliding surface 50a of the guide beam 42. The first X-axis movable member 54 is connected to the outer surface of the first side wall 76 via a connecting member not shown, and the second X-axis movable member 60 is connected to the outer surface of the second side wall 78 via a connecting member not shown. Therefore, the first movable portion 64 moves together with the first X-axis movable member 54 and the second X-axis movable member 60.

複數個X軸偏航空氣軸承66固定於第一側壁76的內表面(亦即，與第二側壁78相對向之面)76a及第二側壁78的內表面(亦即，與第一側壁76相對向之面)78a，並對導樑42的第一滑動面48a及第二滑動面50a噴出氣體。又，複數個X軸升降空氣軸承68固定於底壁72的下表面72a，並對台面10a噴出氣體。藉由由X軸偏航空氣軸承66及X軸升降空氣軸承68噴出氣體而產生的排斥力，第一可動部64與導樑42及台面10a保持非接觸的狀態，詳細而言在導樑42及台面10a之間隔著數μm左右的間隙而被支撐在Y軸方向及Z軸方向上。A plurality of X-axis yaw air bearings 66 are fixed to the inner surface 76a of the first side wall 76 (i.e., the surface opposite to the second side wall 78) and the inner surface 78a of the second side wall 78 (i.e., the surface opposite to the first side wall 76), and spray gas to the first sliding surface 48a and the second sliding surface 50a of the guide beam 42. In addition, a plurality of X-axis lifting air bearings 68 are fixed to the lower surface 72a of the bottom wall 72, and spray gas to the table 10a. The first movable portion 64 maintains a non-contact state with the guide beam 42 and the table 10a by the repulsive force generated by the gas ejected from the X-axis yaw air bearing 66 and the X-axis lift air bearing 68. Specifically, the first movable portion 64 is supported in the Y-axis direction and the Z-axis direction with a gap of about several μm between the guide beam 42 and the table 10a.

載台70固定於第一可動部64。在載台70上，例如載置有半導體晶圓等加工對象物等。The stage 70 is fixed to the first movable portion 64. On the stage 70, a processing object such as a semiconductor wafer is placed.

返回圖1、圖2(a)～圖2(c)，第一Y軸導件24包括第一Y軸導軌80和兩個第一滑動件82。第一Y軸導軌80以延伸方向與Y軸方向一致的方式固定於台面10a上。兩個第一滑動件82分別包括複數個滾動體，並沿第一Y軸導軌80在Y軸方向上移動。Returning to FIG. 1 and FIG. 2(a) to FIG. 2(c), the first Y-axis guide 24 includes a first Y-axis guide rail 80 and two first slide members 82. The first Y-axis guide rail 80 is fixed to the table 10a in a manner such that the extension direction is consistent with the Y-axis direction. The two first slide members 82 each include a plurality of rolling bodies and move along the first Y-axis guide rail 80 in the Y-axis direction.

第二Y軸導件26包括第二Y軸導軌84和兩個第二滑動件86。第二Y軸導軌84、第二滑動件86的結構分別與第一Y軸導軌80、第一滑動件82的結構相同。再者，第二Y軸導軌84配置成延伸方向與Y軸方向一致，且與第一Y軸導軌80平行排列。The second Y-axis guide 26 includes a second Y-axis guide rail 84 and two second sliders 86. The structures of the second Y-axis guide rail 84 and the second slider 86 are respectively the same as the structures of the first Y-axis guide rail 80 and the first slider 82. Furthermore, the second Y-axis guide rail 84 is configured to extend in the same direction as the Y-axis direction and is arranged in parallel with the first Y-axis guide rail 80.

支撐第一X軸定子52之兩個第一支撐構件56中的一個被第一Y軸導件24的第一滑動件82支撐，且另一個被第二Y軸導件26的第二滑動件86支撐。亦即，第一支撐構件56乃至第一X軸驅動部16構成為能夠在Y軸方向上移動。One of the two first supporting members 56 supporting the first X-axis stator 52 is supported by the first sliding member 82 of the first Y-axis guide 24, and the other is supported by the second sliding member 86 of the second Y-axis guide 26. That is, the first supporting member 56 and even the first X-axis driving part 16 are configured to be movable in the Y-axis direction.

同樣地，支撐第二X軸定子58之兩個第二支撐構件62中的一個被第一Y軸導件24的第一滑動件82支撐，且另一個被第二Y軸導件26的第二滑動件86支撐。亦即，第二支撐構件62乃至第二X軸驅動部18構成為能夠在Y軸方向上移動。Similarly, one of the two second supporting members 62 supporting the second X-axis stator 58 is supported by the first sliding member 82 of the first Y-axis guide 24, and the other is supported by the second sliding member 86 of the second Y-axis guide 26. That is, the second supporting member 62 and even the second X-axis driving part 18 are configured to be movable in the Y-axis direction.

在此，對第一移動體12、第二移動體14、X軸驅動部及Y軸驅動部的支撐進行總結。Here, the support of the first moving body 12, the second moving body 14, the X-axis driving part, and the Y-axis driving part is summarized.

(i)第一移動體12不直接亦不間接地(亦即，經由其他構件)被第二移動體14、X軸驅動部及Y軸驅動部支撐。第一移動體12直接被平台10支撐。具體而言，藉由從X軸升降空氣軸承68噴出之氣體的排斥力，第一移動體12在與平台10非接觸的狀態下，被平台10支撐。(i) The first moving body 12 is not directly or indirectly (i.e., via other components) supported by the second moving body 14, the X-axis drive unit, and the Y-axis drive unit. The first moving body 12 is directly supported by the platform 10. Specifically, the first moving body 12 is supported by the platform 10 in a non-contact state by the repulsive force of the gas ejected from the X-axis lifting air bearing 68.

(ii)第二移動體14不直接亦不間接地被第一移動體12、X軸驅動部及Y軸驅動部支撐。第二移動體14直接被平台10支撐。具體而言，藉由從複數個Y軸升降空氣軸承44噴出之氣體的排斥力，第二移動體14在與平台10非接觸的狀態下，被平台10支撐。(ii) The second moving body 14 is not directly or indirectly supported by the first moving body 12, the X-axis driving unit, and the Y-axis driving unit. The second moving body 14 is directly supported by the platform 10. Specifically, the second moving body 14 is supported by the platform 10 in a non-contact state by the repulsive force of the gas ejected from the plurality of Y-axis lifting air bearings 44.

(iii)X軸驅動部不直接亦不間接地被第一移動體12、第二移動體14及Y軸驅動部支撐。X軸驅動部經由直接被平台10支撐之Y軸導件，而被平台10支撐。(iii) The X-axis driving part is not directly or indirectly supported by the first moving body 12, the second moving body 14, and the Y-axis driving part. The X-axis driving part is supported by the platform 10 via the Y-axis guide directly supported by the platform 10.

(iv)Y軸驅動部不直接亦不間接地被第一移動體12、第二移動體14及X軸驅動部支撐。Y軸驅動部經由直接被平台10支撐的未圖示的保持構件，而被平台10支撐。(iv) The Y-axis driving unit is not directly or indirectly supported by the first moving body 12, the second moving body 14, and the X-axis driving unit. The Y-axis driving unit is supported by the platform 10 via a holding member (not shown) that is directly supported by the platform 10.

如上所述，第一移動體12、第二移動體14、X軸驅動部及Y軸驅動部相互獨立地，換言之，不經由共通的構件或彼此，而被平台10支撐。As described above, the first moving body 12, the second moving body 14, the X-axis driving unit, and the Y-axis driving unit are supported by the platform 10 independently of each other, in other words, not via a common component or each other.

圖4係表示導樑42的其中一端和其周邊之立體圖。拘束單元88不拘束X軸驅動部與第二移動體14在X軸方向上的相對移動，而拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。拘束單元88尤其在X軸驅動部與第二移動體14保持非接觸的狀態下，更具體而言，X軸驅動部與第二移動體14不直接接觸，且亦不經由其他構件連接的情況下，拘束在Y軸方向上的相對移動。FIG4 is a three-dimensional diagram showing one end of the guide beam 42 and its periphery. The restraining unit 88 does not restrain the relative movement of the X-axis driving portion and the second moving body 14 in the X-axis direction, but restrains the relative movement of the X-axis driving portion and the second moving body 14 in the Y-axis direction. The restraining unit 88 restrains the relative movement in the Y-axis direction, especially when the X-axis driving portion and the second moving body 14 are in a non-contact state, more specifically, when the X-axis driving portion and the second moving body 14 are not in direct contact and are not connected via other components.

圖5係說明拘束單元88的其中一例之圖。圖5係載台裝置100的俯視圖。在圖5中，省略第一移動體12和Y軸驅動部的顯示。拘束單元88包括第一磁鐵90、第二磁鐵92及磁性體93。磁鐵90、磁鐵92可以是永久磁鐵，亦可以是電磁體。第一磁鐵90固定於X軸驅動部。在圖5中，固定於與導樑42相對向之支撐構件的側面。第二磁鐵92及磁性體93固定於第二移動體14。在圖5中，固定於與支撐構件相對向之導樑42的側面。FIG5 is a diagram illustrating one example of the restraint unit 88. FIG5 is a top view of the stage device 100. In FIG5, the first movable body 12 and the Y-axis drive unit are omitted. The restraint unit 88 includes a first magnet 90, a second magnet 92 and a magnetic body 93. Magnets 90 and 92 can be permanent magnets or electromagnetic bodies. The first magnet 90 is fixed to the X-axis drive unit. In FIG5, it is fixed to the side of the support member opposite to the guide beam 42. The second magnet 92 and the magnetic body 93 are fixed to the second movable body 14. In FIG5, it is fixed to the side of the guide beam 42 opposite to the support member.

磁性體93與第一磁鐵90在Y軸方向上相對向。再者，磁性體93亦可以固定於X軸驅動部，且與第二磁鐵92在Y軸方向上相對向。總之，磁性體93與磁鐵在Y軸方向上相互吸引，藉此X軸驅動部與第二移動體14在Y軸方向上相互吸引，X軸驅動部與第二移動體14在Y軸方向上的相對移動受到拘束。亦即，本實施形態的拘束單元88藉由磁性的吸引力，拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。藉由在Y軸方向上的相對移動受到拘束，當第二移動體14被Y軸驅動部驅動而在Y軸方向上移動時，X軸驅動部追隨第二移動體14亦在Y軸方向上移動。The magnetic body 93 and the first magnet 90 are opposite to each other in the Y-axis direction. Furthermore, the magnetic body 93 can also be fixed to the X-axis driving part and be opposite to the second magnet 92 in the Y-axis direction. In short, the magnetic body 93 and the magnet attract each other in the Y-axis direction, thereby the X-axis driving part and the second moving body 14 attract each other in the Y-axis direction, and the relative movement of the X-axis driving part and the second moving body 14 in the Y-axis direction is constrained. That is, the constraining unit 88 of this embodiment constrains the relative movement of the X-axis driving part and the second moving body 14 in the Y-axis direction by magnetic attraction. Since the relative movement in the Y-axis direction is restricted, when the second movable body 14 is driven by the Y-axis driving unit to move in the Y-axis direction, the X-axis driving unit follows the second movable body 14 and also moves in the Y-axis direction.

又，第一磁鐵90和第二磁鐵92以相同的磁極在Y軸方向上相對向的方式被固定。在圖5中，以S極彼此相對向的方式被固定。藉由相同的磁極在Y軸方向上相對向，第一磁鐵90和第二磁鐵92在Y軸方向上彼此排斥。通過該排斥力，第一磁鐵90乃至X軸驅動部與第二磁鐵92乃至第二移動體14的非接觸狀態得以維持。Furthermore, the first magnet 90 and the second magnet 92 are fixed in such a manner that the same magnetic poles face each other in the Y-axis direction. In FIG. 5 , they are fixed in such a manner that the S poles face each other. By having the same magnetic poles face each other in the Y-axis direction, the first magnet 90 and the second magnet 92 repel each other in the Y-axis direction. By this repulsive force, the non-contact state between the first magnet 90 and even the X-axis driving part and the second magnet 92 and even the second moving body 14 is maintained.

另一方面，X軸驅動部與第二移動體14在X軸方向上的相對移動不受拘束，並且彼此獨立地被支撐，因此藉由X軸驅動部驅動第一移動體12時的反作用力不會被傳遞到第二移動體14。On the other hand, the relative movement of the X-axis driving portion and the second moving body 14 in the X-axis direction is not restricted and they are supported independently of each other, so the reaction force when the first moving body 12 is driven by the X-axis driving portion will not be transmitted to the second moving body 14.

對如上構成之載台裝置100的動作進行說明。 若電流供給至第一Y軸驅動部20的第一Y軸可動件30的線圈、及第二Y軸驅動部22的第二Y軸可動件36的線圈，則在各線圈與Y軸定子之間產生電磁力，藉由其電磁相互作用，Y軸可動件乃至第二移動體14(及第一移動體12)在Y軸方向上移動。若電流供給至第一X軸驅動部16的第一X軸可動件54的線圈、及第二X軸驅動部18的第二X軸可動件60的線圈，則在各線圈與X軸定子之間產生電磁力，藉由其電磁相互作用，X軸可動件乃至第一移動體12在X軸方向上移動。如此，藉由使第一移動體12及第二移動體14移動，使第一移動體12的載台70在XY方向上移動，並將載置於載台70的對象物在XY方向上定位。第一X軸驅動部16及第二X軸驅動部18與第二移動體14藉由拘束單元88在Y軸方向上的相對移動受到拘束，因此隨著第二移動體14在Y軸方向上的移動，第一X軸驅動部16及第二X軸驅動部18亦在Y軸方向上移動。The operation of the stage device 100 constructed as above is described. If current is supplied to the coil of the first Y-axis movable part 30 of the first Y-axis drive unit 20 and the coil of the second Y-axis movable part 36 of the second Y-axis drive unit 22, an electromagnetic force is generated between each coil and the Y-axis stator, and the Y-axis movable part and even the second movable body 14 (and the first movable body 12) move in the Y-axis direction by the electromagnetic interaction. If current is supplied to the coil of the first X-axis movable part 54 of the first X-axis drive unit 16 and the coil of the second X-axis movable part 60 of the second X-axis drive unit 18, an electromagnetic force is generated between each coil and the X-axis stator, and the X-axis movable part and even the first movable body 12 move in the X-axis direction by the electromagnetic interaction. In this way, by moving the first moving body 12 and the second moving body 14, the stage 70 of the first moving body 12 is moved in the XY direction, and the object placed on the stage 70 is positioned in the XY direction. The first X-axis driving unit 16 and the second X-axis driving unit 18 are constrained in relative movement with the second moving body 14 in the Y-axis direction by the restraining unit 88, so that as the second moving body 14 moves in the Y-axis direction, the first X-axis driving unit 16 and the second X-axis driving unit 18 also move in the Y-axis direction.

依據以上說明之實施形態之載台裝置100，X軸驅動部與第二移動體14在X軸方向上的相對移動不受拘束，在Y軸方向上的相對移動以非接觸的方式被拘束，進而，X軸驅動部與第二移動體14彼此獨立地被支撐。藉此，追隨第二移動體14在Y軸方向上的移動而使X軸驅動部在Y軸方向上移動的同時，抑制了藉由X軸驅動部驅動第一移動體12時的反作用力傳遞到第二移動體14(尤其第二可動部38)。因此，不會產生由第二可動部38的結構構件引起之滯後及振動，或者抑制其產生。亦即，可實現更高精度的載台裝置100。又，由於抑制了反作用力傳遞到第二可動部38，因此由該反作用力引起之第二可動部38的振動比較迅速地停止。藉此，使用載台裝置100生產的生產量提高。According to the stage device 100 of the embodiment described above, the relative movement of the X-axis driving part and the second movable body 14 in the X-axis direction is not constrained, and the relative movement in the Y-axis direction is constrained in a non-contact manner. Furthermore, the X-axis driving part and the second movable body 14 are supported independently of each other. Thereby, while the X-axis driving part moves in the Y-axis direction following the movement of the second movable body 14 in the Y-axis direction, the reaction force when the first movable body 12 is driven by the X-axis driving part is suppressed from being transmitted to the second movable body 14 (especially the second movable part 38). Therefore, hysteresis and vibration caused by the structural components of the second movable part 38 will not be generated, or their generation is suppressed. That is, a stage device 100 with higher precision can be achieved. Furthermore, since the reaction force is suppressed from being transmitted to the second movable portion 38, the vibration of the second movable portion 38 caused by the reaction force stops relatively quickly. Thus, the production throughput using the stage device 100 is improved.

以上，對實施形態的載台裝置進行了說明。該實施形態為例示，本領域技術人員應當理解該等各構成要素和各處理製程的組合可以存在各種變形例，並且該等變形例亦在本發明的範圍內。以下示出變形例。The above is a description of the stage device of the embodiment. The embodiment is an example, and those skilled in the art should understand that the combination of the components and the processing steps may have various variations, and the variations are also within the scope of the present invention. The following are variations.

(變形例1) 圖6係說明拘束單元88的另一例之圖。圖6對應於圖5。在本變形例中，拘束單元88為空氣墊96。空氣墊96固定於X軸驅動部及第二移動體14中的一個上。在圖6中，空氣墊96固定於與導樑42相對向之支撐構件的側面。空氣墊96可以經由間隔件98而固定於支撐構件，以使與導樑42的間隙變得微小。空氣墊96具有朝向導樑42的側面的吸引口96a及噴出口96b。空氣墊96從吸引口96a吸引空氣。藉由該吸引力，拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。(Variant 1) Figure 6 is a diagram illustrating another example of the restraint unit 88. Figure 6 corresponds to Figure 5. In this variant, the restraint unit 88 is an air pad 96. The air pad 96 is fixed to one of the X-axis drive unit and the second movable body 14. In Figure 6, the air pad 96 is fixed to the side of the support member opposite to the guide beam 42. The air pad 96 can be fixed to the support member via a spacer 98 so that the gap with the guide beam 42 becomes smaller. The air pad 96 has a suction port 96a and a spray port 96b facing the side of the guide beam 42. The air pad 96 draws air from the suction port 96a. This attractive force restricts the relative movement of the X-axis driving unit and the second moving body 14 in the Y-axis direction.

又，空氣墊96將從未圖示的供氣系統供給之高壓的氣體從噴出口96b朝向導樑42沿Y軸方向噴出。藉由該排斥力，X軸驅動部與第二移動體14的非接觸狀態得以維持。The air pad 96 ejects high-pressure gas supplied from an air supply system (not shown) from an ejection port 96b in the Y-axis direction toward the guide beam 42. The non-contact state between the X-axis driving portion and the second moving body 14 is maintained by this repulsive force.

依據本變形例，能夠實現與實施形態相同的效果。According to this variant example, the same effect as the implementation form can be achieved.

(變形例2) 圖7係說明拘束單元88的又一例之圖。圖7對應於圖5。第一X軸驅動部16與第二X軸驅動部18藉由連接構件94而彼此連接，以形成為一體在Y軸方向上移動。在圖7中，第一支撐構件56與第二支撐構件62藉由連接構件94而連接。(Variant 2) Figure 7 is a diagram illustrating another example of the restraint unit 88. Figure 7 corresponds to Figure 5. The first X-axis drive unit 16 and the second X-axis drive unit 18 are connected to each other by a connecting member 94 so as to move in the Y-axis direction as a whole. In Figure 7, the first support member 56 and the second support member 62 are connected by the connecting member 94.

拘束單元88包括第一磁鐵90及第二磁鐵92。第一磁鐵90固定於X軸驅動部。在圖7中，固定於與導樑42相對向之支撐構件的側面。第二磁鐵92固定於第二移動體14。在圖7中，固定於與支撐構件相對向之導樑42的側面。第一磁鐵90與第二磁鐵92以相同的磁極在Y軸方向上相對向的方式被固定。在圖7中，以S極彼此相對向的方式被固定。藉此，第一磁鐵90與第二磁鐵92在Y軸方向上彼此排斥。The restraining unit 88 includes a first magnet 90 and a second magnet 92. The first magnet 90 is fixed to the X-axis driving part. In FIG7 , it is fixed to the side of the support member opposite to the guide beam 42. The second magnet 92 is fixed to the second movable body 14. In FIG7 , it is fixed to the side of the guide beam 42 opposite to the support member. The first magnet 90 and the second magnet 92 are fixed in such a manner that the same magnetic poles face each other in the Y-axis direction. In FIG7 , they are fixed in such a manner that the S poles face each other. Thereby, the first magnet 90 and the second magnet 92 repel each other in the Y-axis direction.

當第二移動體14向第一X軸驅動部16側移動時，第一支撐構件56乃至第一X軸驅動部16藉由磁鐵的排斥力而被導樑42(第二移動體14)推壓，並與第二移動體14一同移動。與第一X軸驅動部16連接之第二X軸驅動部18亦朝向相同的方向移動。當第二移動體14向第二X軸驅動部18側移動時，第二支撐構件62乃至第二X軸驅動部18藉由磁鐵的排斥力而被導樑42(第二移動體14)推壓，並與第二移動體14一同移動。與第二X軸驅動部18連接之第一X軸驅動部16亦朝向相同的方向移動。When the second moving body 14 moves toward the first X-axis driving part 16, the first supporting member 56 and even the first X-axis driving part 16 are pushed by the guide beam 42 (second moving body 14) by the repulsive force of the magnet, and move together with the second moving body 14. The second X-axis driving part 18 connected to the first X-axis driving part 16 also moves in the same direction. When the second moving body 14 moves toward the second X-axis driving part 18, the second supporting member 62 and even the second X-axis driving part 18 are pushed by the guide beam 42 (second moving body 14) by the repulsive force of the magnet, and move together with the second moving body 14. The first X-axis driving portion 16 connected to the second X-axis driving portion 18 also moves in the same direction.

亦即，在本變形例中，使用磁性的排斥力，拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。That is, in this modification, the magnetic repulsive force is used to constrain the relative movement of the X-axis driving portion and the second movable body 14 in the Y-axis direction.

依據本變形例，能夠實現與實施形態相同的效果。According to this variant example, the same effect as the implementation form can be achieved.

(變形例3) 圖8係說明拘束單元88的又一例的圖。圖8對應於圖7。(Variant 3) Figure 8 is a diagram illustrating another example of the restraining unit 88. Figure 8 corresponds to Figure 7.

拘束單元88包括固定於X軸驅動部及第二移動體14中的其中一個上之空氣墊96。在圖8中，空氣墊96固定於與導樑42相對向之支撐構件的側面。空氣墊96為噴出型的空氣墊。空氣墊96將由未圖示的供氣系統供給之高壓的氣體朝向導樑42沿Y軸方向噴出，並在與導樑42之間的微小的間隙中形成高壓的氣體層。再者，空氣墊96亦可以固定於導樑42的側面。The restraint unit 88 includes an air pad 96 fixed to one of the X-axis drive unit and the second movable body 14. In FIG8 , the air pad 96 is fixed to the side of the support member opposite to the guide beam 42. The air pad 96 is a spray-type air pad. The air pad 96 sprays high-pressure gas supplied by an unillustrated air supply system toward the guide beam 42 along the Y-axis direction, and forms a high-pressure gas layer in the tiny gap between the air pad 96 and the guide beam 42. Furthermore, the air pad 96 can also be fixed to the side of the guide beam 42.

當第二移動體14向第一X軸驅動部16側移動時，第一支撐構件56乃至第一X軸驅動部16藉由氣體層而被導樑42(第二移動體14)推壓，並與第二移動體14一同移動。與第一X軸驅動部16連接之第二X軸驅動部18亦朝向相同的方向移動。當第二移動體14向第二X軸驅動部18側移動時，第二支撐構件62乃至第二X軸驅動部18藉由氣體層而被導樑42(第二移動體14)推壓，並與第二移動體14一同移動。與第二X軸驅動部18連接之第一X軸驅動部16亦朝向相同的方向移動。When the second moving body 14 moves toward the first X-axis driving part 16, the first supporting member 56 and even the first X-axis driving part 16 are pushed by the guide beam 42 (second moving body 14) through the gas layer and move together with the second moving body 14. The second X-axis driving part 18 connected to the first X-axis driving part 16 also moves in the same direction. When the second moving body 14 moves toward the second X-axis driving part 18, the second supporting member 62 and even the second X-axis driving part 18 are pushed by the guide beam 42 (second moving body 14) through the gas layer and move together with the second moving body 14. The first X-axis driving part 16 connected to the second X-axis driving part 18 also moves in the same direction.

亦即，在本變形例中，使用空氣的排斥力，拘束X軸驅動部與第二移動體14在Y軸方向上的相對移動。That is, in this modification, the repulsive force of air is used to constrain the relative movement of the X-axis driving portion and the second movable body 14 in the Y-axis direction.

依據本變形例，能夠實現與實施形態相同的效果。According to this variant example, the same effect as the implementation form can be achieved.

(變形例4) 在實施形態中，對Y軸驅動部在Y軸方向上驅動第二移動體14之情況進行了說明，但是並不限定於此，Y軸驅動部亦可以在Y軸方向上驅動X軸驅動部。在該情況下，Y軸驅動部的可動件與X軸驅動部被連結。當X軸驅動部被Y軸驅動部驅動而在Y軸方向上移動時，藉由拘束單元88，與X軸驅動部在Y軸方向上的相對移動受到拘束的第二移動體14與X軸驅動部一同在Y軸方向上移動。(Variant 4) In the embodiment, the Y-axis driving unit drives the second movable body 14 in the Y-axis direction, but the present invention is not limited thereto. The Y-axis driving unit may also drive the X-axis driving unit in the Y-axis direction. In this case, the movable member of the Y-axis driving unit is connected to the X-axis driving unit. When the X-axis driving unit is driven by the Y-axis driving unit and moves in the Y-axis direction, the second movable body 14 whose relative movement in the Y-axis direction is restrained by the restraining unit 88 moves in the Y-axis direction together with the X-axis driving unit.

上述的實施形態與變形例的任意組合亦作為本發明的實施形態而有用。藉由組合而產生之新的實施形態兼具所組合之實施形態及變形例各自的效果。Any combination of the above-mentioned embodiments and modifications is also useful as an embodiment of the present invention. A new embodiment generated by the combination has the effects of the combined embodiments and modifications.

12:第一移動體 14:第二移動體 16:第一X軸驅動部 18:第二X軸驅動部 20:第一Y軸驅動部 22:第二Y軸驅動部 88:拘束單元 100:載台裝置12: First moving body 14: Second moving body 16: First X-axis driving unit 18: Second X-axis driving unit 20: First Y-axis driving unit 22: Second Y-axis driving unit 88: Constraint unit 100: Stage device

[圖1]係表示實施形態之載台裝置之圖。 [圖2(a)]～[圖2(c)]係表示圖1的載台裝置之圖。 [圖3]係沿圖2(a)的A-A線剖切之剖面圖。 [圖4]係表示圖1的導樑(guide beam)的其中一端與其周邊之立體圖。 [圖5]係說明拘束單元的其中一例之圖。 [圖6]係說明拘束單元的另一例之圖。 [圖7]係說明拘束單元的又一例之圖。 [圖8]係說明拘束單元的又一例之圖。[Fig. 1] is a diagram showing a stage device of an implementation form. [Fig. 2(a)] to [Fig. 2(c)] are diagrams showing the stage device of Fig. 1. [Fig. 3] is a cross-sectional view taken along line A-A of Fig. 2(a). [Fig. 4] is a three-dimensional view showing one end of the guide beam of Fig. 1 and its periphery. [Fig. 5] is a diagram showing one example of a restraining unit. [Fig. 6] is a diagram showing another example of a restraining unit. [Fig. 7] is a diagram showing still another example of a restraining unit. [Fig. 8] is a diagram showing still another example of a restraining unit.

10:平台 10: Platform

10a:台面 10a: Countertop

10b:第一側面 10b: First side

12:第一移動體 12: First moving body

14:第二移動體 14: Second moving body

16:第一X軸驅動部 16: First X-axis drive unit

18:第二X軸驅動部 18: Second X-axis drive unit

20:第一Y軸驅動部 20: First Y-axis drive unit

22:第二Y軸驅動部 22: Second Y-axis drive unit

24:第一Y軸導件 24: First Y-axis guide

26:第二Y軸導件 26: Second Y-axis guide

28:第一Y軸定子 28: First Y-axis stator

30:第一Y軸可動件 30: First Y-axis movable part

32:殼體 32: Shell

34:第二Y軸定子 34: Second Y-axis stator

36:第二Y軸可動件 36: Second Y-axis movable part

38:第二可動部 38: Second movable part

40:Y軸偏航空氣軸承 40: Y-axis eccentric air bearing

42:導樑 42: Guide beam

46:底壁 46: Bottom wall

48:第一側壁 48: First side wall

48a:第一滑動面 48a: First sliding surface

50:第二側壁 50: Second side wall

52:第一X軸定子 52: First X-axis stator

54:第一X軸可動件 54: First X-axis movable part

56:第一支撐構件 56: The first supporting member

58:第二X軸定子 58: Second X-axis stator

60:第二X軸可動件 60: Second X-axis movable part

62:第二支撐構件 62: Second supporting member

70:載台 70: Carrier

80:第一Y軸導軌 80: First Y-axis guide rail

82:第一滑動件 82: First sliding member

84:第二Y軸導軌 84: Second Y-axis guide rail

86:第二滑動件 86: Second sliding member

88:拘束單元 88: Restraint unit

100:載台裝置 100: stage device

Claims (3)

一種載台裝置，其特徵為，係具備：第一移動體；X軸驅動部，係在X軸方向上驅動前述第一移動體，且構成為能夠在Y軸方向上移動；第二移動體，係引導前述第一移動體在X軸方向上的移動，且構成為能夠在Y軸方向上移動；Y軸驅動部，係在Y軸方向上驅動前述X軸驅動部或前述第二移動體；以及拘束單元，係不拘束前述X軸驅動部與前述第二移動體在X軸方向上的相對移動，而在兩者利用磁力而非接觸的狀態下拘束在Y軸方向上的相對移動，前述X軸驅動部，被配置於前述第二移動體的兩側，前述拘束單元的至少其中一部分，被配置於前述X軸驅動部，並且，相對於前述第二移動體，在Y軸方向上相對向配置，前述拘束單元藉由磁性的吸引力或磁性的排斥力，拘束前述X軸驅動部與前述第二移動體在Y軸方向上的相對移動。 A stage device, characterized in that it comprises: a first moving body; an X-axis driving unit, which drives the first moving body in the X-axis direction and is configured to be movable in the Y-axis direction; a second moving body, which guides the movement of the first moving body in the X-axis direction and is configured to be movable in the Y-axis direction; a Y-axis driving unit, which drives the X-axis driving unit or the second moving body in the Y-axis direction; and a restraining unit, which does not restrain the X-axis driving unit and the second moving body in the X-axis direction. The X-axis driving part is arranged on both sides of the second moving body, and at least a part of the restraining unit is arranged on the X-axis driving part, and is arranged opposite to the second moving body in the Y-axis direction. The restraining unit restrains the relative movement of the X-axis driving part and the second moving body in the Y-axis direction by magnetic attraction or magnetic repulsion. 如請求項1所述之載台裝置，其中前述X軸驅動部與前述第二移動體彼此獨立地被支撐。 The stage device as described in claim 1, wherein the aforementioned X-axis driving unit and the aforementioned second moving body are supported independently of each other. 如請求項1或請求項2所述之載台裝置，其中 前述X軸驅動部與前述Y軸驅動部彼此獨立地被支撐。 The stage device as described in claim 1 or claim 2, wherein the aforementioned X-axis driving part and the aforementioned Y-axis driving part are supported independently of each other.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003266258A (en) * 2002-03-14 2003-09-24 Ricoh Co Ltd Holding device, and holding method
TW200606610A (en) * 2004-05-19 2006-02-16 Sumitomo Heavy Industries Mobil position control device and stage device using the same
CN100464401C (en) * 2004-05-20 2009-02-25 住友重机械工业株式会社 Object table device
CN101611470A (en) * 2007-03-05 2009-12-23 株式会社尼康 The manufacture method and the mobile body drive method of mobile body device, pattern formation device and pattern formation method, device manufacturing method, mobile body device
WO2014120082A1 (en) * 2013-01-30 2014-08-07 Akribis Systems Pte Ltd A planar positioning system and method of using the same
TW201741063A (en) * 2016-05-16 2017-12-01 住友重機械工業股份有限公司 Stage apparatus includes first and second X-axis driving units driving a first movable body, and a second movable body, in which the first and second X-axis driving units are supported without passing through the second movable body

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2714502B2 (en) * 1991-09-18 1998-02-16 キヤノン株式会社 Moving stage device
JP4580537B2 (en) 2000-10-27 2010-11-17 シグマテクノス株式会社 XY stage
JP4122815B2 (en) * 2002-04-03 2008-07-23 株式会社ニコン Linear motor, stage apparatus, and linear motor control method
US20080073982A1 (en) 2004-12-24 2008-03-27 Nikon Corporation Magnetic Guide Apparatus, Stage Apparatus, Exposure Apparatus, and Device Manufacturing Method
JP5106981B2 (en) 2007-10-19 2012-12-26 住友重機械工業株式会社 Stage equipment
TWI471971B (en) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
JP5026455B2 (en) * 2009-03-18 2012-09-12 住友重機械工業株式会社 XY stage apparatus, semiconductor inspection apparatus, and semiconductor exposure apparatus
JP5295855B2 (en) * 2009-04-28 2013-09-18 住友重機械工業株式会社 Reaction force processing mechanism
JP5304566B2 (en) * 2009-09-16 2013-10-02 株式会社安川電機 Substrate transport device with fail-safe mechanism
JP2018167337A (en) * 2017-03-29 2018-11-01 ブラザー工業株式会社 Machining device
CN108809037A (en) * 2018-06-20 2018-11-13 魏明刚 A kind of electromagnetic engine of low-disturbance power

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003266258A (en) * 2002-03-14 2003-09-24 Ricoh Co Ltd Holding device, and holding method
TW200606610A (en) * 2004-05-19 2006-02-16 Sumitomo Heavy Industries Mobil position control device and stage device using the same
CN100464401C (en) * 2004-05-20 2009-02-25 住友重机械工业株式会社 Object table device
CN101611470A (en) * 2007-03-05 2009-12-23 株式会社尼康 The manufacture method and the mobile body drive method of mobile body device, pattern formation device and pattern formation method, device manufacturing method, mobile body device
WO2014120082A1 (en) * 2013-01-30 2014-08-07 Akribis Systems Pte Ltd A planar positioning system and method of using the same
TW201741063A (en) * 2016-05-16 2017-12-01 住友重機械工業股份有限公司 Stage apparatus includes first and second X-axis driving units driving a first movable body, and a second movable body, in which the first and second X-axis driving units are supported without passing through the second movable body

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