JP7146525B2 - Stage equipment and bonding equipment - Google Patents

Description

The present invention relates to a stage device and a bonding device.

In the manufacture of semiconductor devices, a chip bonding method is used to separate individual semiconductor chips by dicing a wafer on which a large number of elements are collectively built, and to bond these chips one by one to a predetermined position on a lead frame or the like. is adopted. A die bonder (bonding device) is used for this chip bonding.

As shown in FIG. 7, the bonding apparatus includes a bonding arm (not shown) having a collet 3 for sucking the semiconductor chip 1 of the supply unit 2 and a confirmation camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. and a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

The supply unit 2 includes a semiconductor wafer 6 (see FIG. 8), which is divided into a large number of semiconductor chips 1 . That is, the wafer 6 is attached to an adhesive sheet (dicing sheet), and this dicing sheet is held by an annular frame. Then, the wafer 6 on the dicing sheet is separated into individual chips 1 using a circular blade (dicing saw) or the like. Also, the bonding arm holding the collet 3 can be moved between the pick-up position and the bonding position via the conveying means.

Also, the chip 1 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 3 , and the chip 1 is attracted to the lower end surface of the collet 3 . Note that the chip 1 is removed from the collet 3 when this vacuum suction (vacuum drawing) is released.

Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed by a camera for confirmation placed above the supply unit 2, and after the collet 3 is positioned above the chip 1 to be picked up, the collet 3 is moved as shown by an arrow B. to pick up this chip 1. After that, the collet 3 is raised as indicated by arrow A.

Next, the island portion 5 of the lead frame 4 to be bonded is observed by a confirmation camera placed above the bonding position, and the collet 3 is moved in the direction of arrow E to move the collet 3 above the island portion 5. After positioning, the collet 3 is moved downward in the direction of arrow D to supply the chips 1 to the island portion 5 . After the chips are supplied to the island portion 5, the collet 3 is raised as indicated by arrow C, and then returned to the standby position above the pick-up position as indicated by arrow F.

The collet 3 moves up in the direction of arrow A above the pick-up position P, moves down in the direction of arrow B, moves up in the direction of arrow C above the bonding position Q, and moves up in the direction of arrow D. Downward direction and reciprocating movement in the directions of arrows E and F between pick-up position P and bonding position Q are allowed. The movement of the arrows A, B, C, D, E, and F of the moving mechanism is controlled by control means (not shown). As the movement mechanism, various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism can be used, and an XYZ axis stage (stage device) can be used.

Conventionally, there has been proposed a chip bonding apparatus using a stage device having an X stage, a Y stage, and a Z stage as a moving mechanism (conveying means) (Patent Document 1). The chip bonding apparatus described in Patent Document 1 has a Z drive motor that drives the Z table in the Z-axis direction. part is connected to the bonding head part. Also, the movable portion of the Z drive motor is movable in the Z-axis direction along a guide provided on the Y table.

With this configuration, the X table is driven at a low speed, so even if the load on the fixed portion of the Z drive motor is further borne, there is little effect on its characteristics. On the other hand, the load on the Y table can be reduced because the load on the fixed portion of the Z drive motor is eliminated. Therefore, it is possible to increase the speed of the chip bonding apparatus. Therefore, when the chip is bonded to the bonding object, the load on the Y table can be further reduced.

By the way, a linear motor is used for each of the drive motors. Conventionally, a linear motor has been proposed in which a fixed coil and a movable magnet have four planes and a rectangular cross section. (Patent Document 2).

Japanese Patent No. 4397349 JP-A-2003-116260

In Patent Document 1, the X table becomes heavy due to the presence of movable parts and fixed parts of the Y drive motor and the Z drive motor on the X table. Therefore, the movable portion of the X drive motor can only move at a low speed, which affects the takt time of the device. In addition, the X table, Y table, and Z table are independent of each other, leading to an increase in the number of parts and hindering cost reduction. Furthermore, since the Y table is mounted on the X table, the X table must be highly rigid, resulting in inferior design.

As a linear motor, there is a linear motor having a rectangular tube shape as described in Patent Document 2. In such a device, when used in a Y drive motor, it is necessary to set the relative positions of the magnet portion and the coil portion at equal distances in the X and Z directions, resulting in poor design freedom when structuring the device. rice field.

In view of the above problems, the present invention provides a stage apparatus that can reduce the number of parts by using an X/Y movable table, reduce the weight of the X movable portion, and increase the speed of the apparatus. A bonding apparatus is provided.

The stage apparatus of the present invention includes an X drive motor having an X motor fixed portion and an X movable portion that reciprocates along the X direction, and a Y motor fixed portion and a Y motor that reciprocates along the Y direction perpendicular to the X direction. A stage device comprising: a Y drive motor having a movable portion; and a Z drive motor having a Z motor fixed portion and a Z movable portion that reciprocates along a Z direction orthogonal to the X direction and the Y direction, Equipped with an integrated X/Y movable table that reciprocates along the X direction by driving the X movable portion of the X drive motor and reciprocates along the Y direction by driving the Y movable portion of the Y drive motor, The X motor fixed part and the Y motor fixed part are fixed to the fixed base, the Z motor fixed part is fixed to the X/Y movable table, and the Z drive part reciprocates in the Z direction by the drive of the Z drive motor. is attached to the X/Y movable table.

According to the stage device of the present invention, the X movable table and the Y movable table can be integrated, and the number of parts can be reduced. Moreover, it is not necessary to provide all the components of the Y drive motor and the Z-axis motor on the X/Y table, and the weight of the X movable side can be reduced. The X motor fixing portion and the Y motor fixing portion are fixed to the fixing base, so that the rigidity of the device can be improved.

It is preferable to provide an X/Y slide allowable portion that allows reciprocating slide along the X direction and reciprocating slide along the Y direction between the X/Y movable table and the fixed base. By providing such an X/Y slide permitting portion, the X/Y movable table can be smoothly reciprocated in the X direction and in the Y direction. Also, the X/Y slide allowance section may be configured with an air bearing that generates static pressure to float the X/Y movable table and maintains a constant gap between the X/Y movable table and the fixed base. can. By using air bearings in this way, it is possible to slide more smoothly. direction), shortening the working time.

An X-movable table that can be driven only in the X-direction is arranged on a fixed base, and the X-movable table is moved in the X-direction through a Y-direction slide allowing section that allows the X-Y movable table to slide in the Y-direction. It may be attached to the Y movable table.

Also in this configuration, the X/Y movable table can be reciprocated in the X direction by driving the X drive motor, and the X/Y movable table can be reciprocated in the Y direction by driving the Y drive motor. By driving the motor, the suction collet can reciprocate in the Z direction. Moreover, since the X movable table is interposed between the X movable section and the Y movable section, the X and Y movable tables can be made compact, and each table can be stably slid and X driven. A compact motor and Y drive motor can be achieved.

The Y-direction slide allowance part is composed of an air bearing interposed between the X/Y movable table and the X movable table, or a linear motion guide interposed between the X/Y movable table and the X movable table. It can be configured by a mechanism, and the degree of freedom in design can be improved.

The X/Y movable table has a main body made of a short-square cylinder, and the upper and lower walls of the main body are provided with magnets, which are the Y movable parts of the Y drive motor. The Y-motor fixing portion is fitted on the coil portion, and the body portion can be configured to reciprocate in the X direction and the Y direction while being fitted on the coil portion.

With this configuration, the number of movable magnets can be reduced by two compared to a so-called rectangular tube linear drive motor in which the stationary coil and the movable magnet have four planes and the cross section has a square shape. . As a result, it is possible to secure a moving space in the X direction and reduce the weight of the X/Y movable table.

In the bonding apparatus of the present invention, a bonding head having a suction collet for sucking a workpiece is attached to the Z table of the stage device.

INDUSTRIAL APPLICABILITY The stage device of the present invention can reduce the number of parts, improve the ease of assembly, and reduce the cost. Also, the weight of the X movable side can be reduced, and the speed of the apparatus can be increased.

The bonding apparatus of the present invention uses the stage device of the present invention, and has the unique effects of having this stage device.

1 is a simplified diagram showing a bonding apparatus using a stage device of the present invention; FIG. 2 is a simplified block diagram of the stage device shown in FIG. 1; FIG. FIG. 4 is a simplified cross-sectional view of main parts of an air bearing used for the X/Y slide allowance. FIG. 3 is a simplified diagram of an X/Y table used for an X/Y slide allowance section; 1 is a simplified diagram of a bonding apparatus of the present invention; FIG. FIG. 4 is a simplified diagram of another stage apparatus of the present invention; 1 is a simplified diagram showing the operation of a typical bonding device; FIG. 1 is a simplified diagram showing a wafer; FIG.

An embodiment of the present invention will be described below with reference to FIGS. 1 to 6. FIG.

FIG. 1 shows a die bonder (bonding device) using a stage device according to the present invention. As shown in FIG. 5, such a bonding apparatus picks up a chip 11 cut from a wafer by a collet 13 at a pickup position P and transfers (mounts) it to a bonding position Q of a base material 12 such as a lead frame. It is. The wafer is adhered to a wafer sheet (adhesive sheet 15) stretched over a metal ring (wafer ring), and is divided (divided) into a large number of chips 11 by a dicing process.

In the stage device according to the present invention, which is a moving mechanism, the collet 13 moves up in the direction of arrow A above the pickup position P and moves down in the direction of arrow B, and moves up in the direction of arrow C above the bonding position Q and moves up in the direction of arrow D. Downward direction and reciprocating movement in the directions of arrows E and F between pick-up position P and bonding position Q are allowed. The movements of the arrows A, B, C, D, E, and F of the stage device are controlled by control means (not shown). The control means is, for example, a microcomputer in which a CPU (Central Processing Unit) is centered and a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are interconnected via a bus. The ROM stores programs and data executed by the CPU.

As shown in FIG. 1, the stage apparatus includes an X drive motor 23 having an X motor fixed portion 22 and an X movable portion 21 that reciprocates along the X direction, and a Y motor fixed portion 25 and a Y motor perpendicular to the X direction. A Y drive motor 26 having a Y movable portion 24 that reciprocates along the Z direction, and a Z motor fixed portion 28 and a Z movable portion 27 that reciprocates along the Z direction orthogonal to the X and Y directions. and a drive motor 29 .

The X drive motor 23 is a flat type linear motor having an X motor fixed portion 22 as a stator and an X movable portion 21 as a mover. In this case, it may be an MC type in which the stator is a magnet and the mover is a coil, or an MM type in which the stator is a coil and the mover is a magnet. The X motor fixed portion 22 is fixed to a support member 31 erected on a fixed base 30 , and the X movable portion 21 is attached to an X/Y movable table 32 .

The X/Y movable table 32 has a main body 33 which is a short rectangular cylinder, in this case, a flat rectangular body in which the upper wall 33a and the lower wall 33b are longer than the left and right vertical walls 33c and 33d. Magnets (magnet portions) 35a and 35b constituting a Y movable portion 24 as a movable member of the Y drive motor 26 are attached to the inner surface of the upper wall 33a and the inner surface of the lower wall 33b.

Also, the Y motor fixing portion 25 of the Y drive motor 26 is fitted into the body portion 33 . The Y motor fixing portion 25 includes a supporting member 36 having a flat rectangular cross section, a laminated yoke (laminated iron core) 37, a coil 38, and the like, and extends in the Y direction as shown in FIG. This support member 36 is fixed to the fixed base 30 . That is, the Y motor fixed portion 25 is fixed to the fixed base 30 .

In a state where the axis of the Y motor fixing part 25 and the axis of the main body part 33 are aligned, the Y motor fixing part 25 and the magnet 35a attached to the upper wall 33a are closely opposed to each other with a clearance A1, The Y motor fixing portion 25 and the magnet 35b attached to the lower wall 33b are closely opposed to each other with a clearance A2. In this case, A1 and A2 have substantially the same dimensions. A1 and A2 do not change due to the reciprocating motion of the X/Y movable table 32 in the X direction.

In addition, in a state in which the axis of the Y motor fixing portion 25 and the axis of the main body portion 33 are aligned, the Y motor fixing portion 25 and the inner surface of one vertical wall 33c face each other with a clearance A3, and the motor is fixed. The portion 25 and the inner surface of the other vertical wall 33d face each other with a clearance A4. In this case, A3+A4>A1+A2. Therefore, a space is provided between the Y motor fixing portion 25 and the body portion 33 so that the body portion 33 can slide in the X direction. Note that A3 and A4 fluctuate due to the reciprocating motion of the X/Y movable table 32 in the X direction.

Between the X/Y movable table 32 and the fixed base 30, there is provided an X/Y slide that allows the X/Y movable table 32 to slide reciprocally along the X direction and to slide reciprocally along the Y direction. A permitting section 40 is provided.

For example, an air bearing 41 as shown in FIG. 3 can be used for the X/Y slide allowance part 40 . The air bearing 41 includes a porous member 42 and an air supplier such as a compressor (not shown) that supplies air to the porous member 42 . An air suction hole 42a is provided in the porous member 42, and a vacuum device for sucking air is connected to the air suction hole 42a.

Therefore, air is jetted from the entire surface of the porous member 42 as indicated by an arrow α to float the X/Y movable table 32 . Also, the X/Y movable table 32 is sucked as indicated by the arrow β through the air suction hole 42a. That is, the suction force generated by the air suction holes 42a regulates the floating amount H of the X/Y movable table 32 which is lifted by the air ejected from the porous member . Therefore, the floating amount H of the X/Y movable table 32 can be controlled by controlling the attraction force.

Therefore, the air bearing 41 can generate static pressure to float the X/Y movable table 32 and maintain a constant distance between the X/Y movable table 32 and the fixed base 30 . Therefore, the X/Y movable table 32 can be slid in the X direction, the Y direction, and oblique directions (directions forming an arbitrary angle from the X axis or the Y axis).

Also, the X/Y slide permitting section 40 can be configured by an XY table 45 as shown in FIG. The XY table 45 includes an X-direction guide rail 46 extending in the X-direction, a slider 47 fitted to the X-direction guide rail 46 and sliding along the X-direction guide rail 46 , and a slider 47 mounted on the slider 47 . 1 table 48, a Y-direction guide rail 49 disposed on the upper surface of the first table 48 and extending in the Y-direction, and a slider 50 fitted to the Y-direction guide rail 49 and sliding along the Y-direction guide rail 49. and a second table 51 placed on the slider 50 .

In this case, the X-direction guide rail 46 is arranged on the fixed base 30 and the second table 51 is fixed to the X/Y movable table 32 . As a result, the X/Y movable table 32 is maintained at a predetermined distance from the fixed base 30, the first table 48 slides in the X direction, and the second table 51 slides in the Y direction. Therefore, the X/Y movable table 32 can be slid in the X and Y directions.

The Z drive motor 29 is a flat type linear motor having a Z motor fixed portion 28 as a stator and a Z movable portion 27 as a mover. In this case, it may be an MC type in which the stator is a magnet and the mover is a coil, or an MM type in which the stator is a coil and the mover is a magnet. The Z motor fixed portion 28 is attached (fixed) to one vertical wall 33 c of the body portion 33 of the X/Y movable table 32 , and the Z movable portion 27 is connected to the Z table 55 . A bonding head 56 having a suction collet 13 attached to its tip is connected to the Z table 55 .

A guide mechanism 57 is interposed between the Z table 55 and the vertical wall 33c of the X/Y movable table 32 to guide the reciprocating motion of the Z table 55 in the Z direction. The guide mechanism 57 includes a guide rail 58 arranged along the Z direction on the vertical wall 33c, and a slider 59 that fits into the guide rail 58 and slides along the guide rail 58 in the Z direction.

In the bonding apparatus configured as described above, the X/Y movable table 32 can be reciprocated in the X direction by driving the X driving motor 23, and the X/Y movable table 32 can be moved in the Y direction by driving the Y driving motor 26. By driving the Z drive motor 29, the suction collet 13 can reciprocate in the Z direction. Therefore, the collet 13 rises above the pickup position P in the direction of arrow A and lowers in the direction of arrow B, rises above the bonding position Q in the direction of arrow C and lowers in the direction of arrow D, and moves between the pickup position P and bonding. Reciprocating movement in the directions of arrows E and F between positions Q is possible.

In the stage device of the present invention, the X movable table and the Y movable table can be integrated, and the number of parts can be reduced. For this reason, it is possible to improve the ease of assembly and to reduce the cost. In addition, it is not necessary to provide all the components of the Y drive motor 26 and the Z-axis motor 29 on the X/Y movable table 32, so that the weight of the X movable side can be reduced and the speed of the apparatus can be increased. . The X motor fixing portion 22 and the Y motor fixing portion 25 are fixed to the fixing base 30, so that the rigidity of the device can be improved and the device has excellent durability.

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By providing the X/Y slide allowance part 40, the reciprocating motion of the X/Y movable table 32 in the X direction and the reciprocating motion in the Y direction can be performed smoothly. Further, if an air bearing is used for the X/Y slide allowance part 40, it is possible to slide more smoothly. or a direction forming an arbitrary angle from the Y-axis), thereby shortening the working time.

The X/Y movable table 32 includes a body portion 33 made of a short-angled cylinder, and magnet portions 35a and 35b, which are the Y moving portion 24 of the Y drive motor 26, are mounted on the upper wall 33a and the lower wall 33b of the body portion 33. is provided, and the body portion 33 is fitted on the coil portion, which is the Y motor fixing portion 25 of the Y drive motor 26, and is fitted on the coil portion 38. It is configured so that reciprocating motion in the direction is possible.

With this configuration, the fixed yoke, the fixed coil, and the movable magnet have four planes and the cross section has a square shape, which reduces the number of movable magnets by two compared to a so-called rectangular tube linear drive motor. be able to. As a result, it is possible to secure the movement space in the X direction and to reduce the weight of the X/Y movable table 32 .

The bonding apparatus of the present invention has a bonding head having a suction collet 13 for sucking a workpiece attached to a Z table 55 in a stage device. For this reason, the bonding apparatus of the present invention uses the stage device of the present invention, and has the unique effects of having this stage device.

By the way, FIG. 6 shows a bonding apparatus using another stage device according to the present invention. In this case, an X movable table 60 that can be driven only in the X direction is arranged on the fixed base 30 . The X/Y movable table 60 is attached to the X/Y movable table 42 via a Y-direction slide allowance portion 61 that allows the X/Y movable table 42 to slide in the Y direction.

Also, the X movable table 60 slides in the X direction via a guide mechanism 62 interposed between the base 30 and the X movable table 60 . The guide mechanism 61 can be composed of a linear guide or the like that includes a guide rail and a slider that slides in the X direction along the guide rail. As the Y-direction slide allowance part 61, an air bearing 41 interposed between the X/Y movable table 32 and the X movable table 60 as shown in FIG. It can be interposed between the table 60 and composed of a linear motion guide mechanism. The linear motion guide mechanism can be composed of a linear guide or the like including a guide rail and a slider that slides along the guide rail.

With this configuration, the X/Y movable table 32 can be reciprocated in the X direction by driving the X drive motor 23, similar to the bonding apparatus using the stage device shown in FIG. 26 drives the X/Y movable table 32 to reciprocate in the Y direction, and the Z drive motor 29 drives the suction collet 13 to reciprocate in the Z direction. Therefore, the collet 13 rises above the pickup position P in the direction of arrow A and lowers in the direction of arrow B, rises above the bonding position Q in the direction of arrow C and lowers in the direction of arrow D, and moves between the pickup position P and bonding. Reciprocating movement in the directions of arrows E and F between positions Q is possible.

Moreover, since the X movable table 60 is interposed between the X movable section 21 and the Y movable section 24, the X/Y movable table 32 can be made compact. A stable slide and downsizing of the X drive motor 23 and the Y drive motor 26 can be achieved.

The Y-direction slide allowance part 61 is configured by an air bearing interposed between the X/Y movable table 32 and the X movable table 60, or is interposed between the X/Y movable table 32 and the X movable table 60. It can be configured with a linear motion guide mechanism, which can improve the degree of freedom in design.

The present invention is not limited to the above-described embodiment, and various modifications are possible. However, it may have a square cross section. However, if a magnet with a square cross section is used, the length of the magnet on the movable side in the X direction is shortened, the magnetic buoyancy is reduced, and the reciprocating motion of the X/Y movable table 32 in the X direction may not be stable. . Moreover, the height dimension of the stage device is increased, and there are cases where it cannot be installed depending on the location where it is installed. On the other hand, if the main body 33 of the X/Y movable table 32 is of a rectangular shape with a flattened cross section, the length of the magnet on the movable side in the X direction can be relatively large, and sufficient magnetism can be obtained. Buoyancy can be obtained, and the reciprocating motion of the X/Y movable table 32 in the X direction is stabilized. Moreover, the height dimension of the stage device can be kept low.

As a stage device, it can be used in various devices other than the bonding device, such as an assembly device, an inspection device, or a processing device. Further, although the stage device is an XYZ table in the embodiment, it may be an XYZθ table.

13 Suction collet 21 X movable part 22 X motor fixed part 23 X drive motor 24 Y movable part 25 Y motor fixed part 26 Y drive motor 27 Z movable part 28 Z motor fixed part 29 Z drive motor 30 Fixed base 32 X/Y movable Table 33 Body portion 33a Upper wall 33b Lower walls 35a, 35b Magnet portion 38 Coil portion 40 Slide allowance portion 41 Air bearing 55 Z table 56 Bonding heads α, β Arrow

Claims (7)

An X drive motor having an X motor fixed portion and an X movable portion that reciprocates along the X direction, and a Y drive having a Y motor fixed portion and a Y movable portion that reciprocates along the Y direction orthogonal to the X direction. A stage device comprising a motor and a Z drive motor having a Z motor fixed portion and a Z movable portion that reciprocates along a Z direction perpendicular to the X and Y directions,
Equipped with an integrated X/Y movable table that reciprocates along the X direction by driving the X movable portion of the X drive motor and reciprocates along the Y direction by driving the Y movable portion of the Y drive motor, The X motor fixed part and the Y motor fixed part are fixed to the fixed base, the Z motor fixed part is fixed to the X/Y movable table, and the Z movable part reciprocates in the Z direction by the drive of the Z drive motor. is attached to an X/Y movable table , and the X/Y movable table has a main body made of a short rectangular cylinder. A magnet portion is provided, and the main body portion is fitted on a coil portion, which is a Y motor fixing portion of the Y drive motor. A stage device characterized by being capable of directional reciprocation . A claim characterized in that an X/Y slide permitting portion for permitting reciprocating slide along the X direction and reciprocating slide along the Y direction is provided between the X/Y movable table and the fixed base. Item 1. The stage device according to item 1. The X/Y slide allowable part is characterized in that it is composed of an air bearing that generates static pressure to float the X/Y movable table and maintains a constant gap between the X/Y movable table and the fixed base. 3. The stage device according to claim 2. An X-movable table that can be driven only in the X-direction is arranged on a fixed base, and the X-movable table is moved in the X-direction through a Y-direction slide allowing section that allows the X-Y movable table to slide in the Y-direction. 2. The stage device according to claim 1, wherein the stage device is attached to the Y movable table. 5. The stage device according to claim 4, wherein the Y-direction slide allowance is composed of an air bearing interposed between the X/Y movable table and the X movable table. 5. The stage device according to claim 4, wherein the Y-direction slide allowance is constituted by a guide mechanism interposed between the X/Y movable table and the X movable table. A bonding apparatus, wherein a bonding head having a suction collet for sucking a workpiece is attached to the Z table of the stage apparatus according to any one of claims 1 to 6 .

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