JP2020031078A - Stage device and bonding device - Google Patents

Abstract

To provide a stage device that is composed of components, the number of which can be reduced by using an XY movable table, and is enabled to have an X movable unit with reduced weight and have enhanced device speed, and a bonding device.SOLUTION: A stage device comprises one XY movable table that is reciprocated along the X direction by an X movable unit driven by an X drive motor and is reciprocated along the Y direction by a Y movable unit driven by a Y drive motor. An X motor fixation unit and a Y motor fixation unit are fixed to a fixation base. A Z motor fixation unit is fixed to the XY movable table. A Z drive unit that is reciprocated in the Z direction by drive by a Z drive motor is attached to the XY movable table.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a stage device and a bonding device.

  In the manufacture of semiconductor devices, a chip bonding method in which a wafer in which a large number of elements are manufactured together is diced and separated into individual semiconductor chips, which are bonded one by one to predetermined positions such as a lead frame. Has been adopted. A die bonder (bonding device) is used for this chip bonding.

  As shown in FIG. 7, the bonding apparatus includes a bonding arm (not shown) having a collet 3 for sucking the semiconductor chip 1 of the supply unit 2 and a confirmation camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. And a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

  The supply unit 2 includes a semiconductor wafer 6 (see FIG. 8), and the semiconductor wafer 6 is divided into a large number of semiconductor chips 1. That is, the wafer 6 is attached to an adhesive sheet (dicing sheet), and the dicing sheet is held by the annular frame. Then, the wafer 1 on the dicing sheet is singulated using a circular blade (dicing saw) or the like to form the chip 1. Further, the bonding arm holding the collet 3 can be moved between the pickup position and the bonding position via the transfer means.

  In addition, the chip 1 of the collet 3 is vacuum-suctioned through the suction hole opened at the lower end surface, and the chip 1 is adsorbed to the lower end surface of the collet 3. When the vacuum suction (vacuum evacuation) is released, the chip 1 comes off the collet 3.

  Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed by a confirmation camera arranged above the supply unit 2, and the collet 3 is positioned above the chip 1 to be picked up. To pick up this chip 1. Thereafter, the collet 3 is raised as shown by the arrow A.

  Next, the island 5 of the lead frame 4 to be bonded is observed with the confirmation camera arranged above the bonding position, and the collet 3 is moved in the direction of the arrow E to move the collet 3 above the island 5. After being positioned, the collet 3 is moved downward as shown by the arrow D, and the chip 1 is supplied to the island portion 5. After the chips are supplied to the island portion 5, the collet 3 is raised as shown by the arrow C, and then returned to the standby position above the pip-up position as shown by the arrow F.

  The collet 3 is moved by a moving mechanism (not shown) as a transporting means in the pick-up position P in the direction of arrow A and in the direction of arrow B, and in the bonding position Q in the direction of arrow C and in the direction of arrow D. , And reciprocal movement in the directions of arrows E and F between the pickup position P and the bonding position Q are enabled. The moving mechanism controls the movement of the arrows A, B, C, D, E, and F by control means (not shown). Note that the moving mechanism can be constituted by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism, and an XYZ axis stage (stage device) can be used.

  Conventionally, a chip bonding apparatus using a stage device having an X stage, a Y stage, and a Z stage as a moving mechanism (transporting means) has been proposed (Patent Document 1). In the chip bonding apparatus described in Patent Document 1, the Z drive motor for driving the Z table in the Z-axis direction has a fixed portion having a heavy weight or a large inertia provided on the X table, and a movable member having a light weight or a small inertia. Is connected to the bonding head. The movable portion of the Z drive motor is movable in the Z-axis direction along a guide provided on the Y table.

  With this configuration, since the X table is driven at a low speed, even if the load on the fixed portion of the Z drive motor is further imposed, there is little effect on its characteristics. On the other hand, the load on the Y table can be reduced since the load on the fixed portion of the Z drive motor is eliminated. Therefore, the speed of the chip bonding apparatus can be increased. Therefore, when the chip is bonded to the bonding object, the load on the Y table can be further reduced.

  By the way, linear motors are used for the respective drive motors. Conventionally, as a linear motor, a fixed coil and a movable magnet having four planes and a rectangular cross section have been proposed. (Patent Document 2).

Japanese Patent No. 4397349 JP 2003-116260 A

  In Patent Literature 1, the movable portion and the fixed portion of the Y drive motor and the Z drive motor are present on the X table, and the X table becomes heavy. For this reason, the movable portion of the X drive motor can move only at a low speed, which affects the tact of the device. Further, the X table, the Y table, and the Z table are independent of each other, resulting in an increase in the number of parts, which hinders low cost. Further, since the Y table is mounted on the X table, the X table needs to have high rigidity, which is inferior in design.

  In addition, as a linear motor, there is a rectangular tube-shaped motor as described in Patent Document 2. In such a motor, when used in a Y drive motor, the relative positions of the magnet and the coil must be set at equal distances in the X and Z directions, which is inferior in the degree of freedom in designing the apparatus. Was.

  In view of the above problems, the present invention provides a stage device that can reduce the number of parts by using an XY movable table, can reduce the weight of the X movable portion, and can increase the speed of the device. A bonding device is provided.

  A stage device according to the present invention includes an X drive motor having an X motor fixed portion and an X movable portion that reciprocates along the X direction, and a Y motor that reciprocates along the Y motor fixed portion along a Y direction orthogonal to the X direction. A stage device comprising: a Y drive motor having a movable portion; and a Z drive motor having a Z motor fixed portion and a Z movable portion that reciprocates along a Z direction orthogonal to the X direction and the Y direction, An integrated XY movable table that reciprocates along the X direction by driving the X movable portion of the X drive motor and reciprocates along the Y direction by driving the Y movable portion of the Y drive motor, An X motor fixing section and a Y motor fixing section are fixed to a fixed base, a Z motor fixing section is fixed to an XY movable table, and a Z drive section that reciprocates in the Z direction by driving a Z drive motor. Is XY movable It is one that is attached to the Buru.

  According to the stage device of the present invention, the X movable table and the Y movable table can be integrated, and the number of parts can be reduced. Further, it is not necessary to provide all the components of the Y drive motor and the Z-axis motor on the XY table, so that the weight of the X movable side can be reduced. The X motor fixing portion and the Y motor fixing portion are fixed to the fixing base, so that the rigidity of the device can be improved.

  It is preferable to provide an XY slide permitting portion between the XY movable table and the fixed base, which allows reciprocal slide along the X direction and reciprocal slide along the Y direction. By providing such an XY slide allowing portion, the reciprocating motion in the X and Y directions of the XY movable table can be smoothly performed. The XY slide allowing section may be configured by an air bearing that generates a static pressure to float the XY movable table and keeps a constant distance between the XY movable table and the fixed base. it can. By using an air bearing in this manner, the slide can be performed more smoothly, and the XY movable table can be formed not only in the X-axis and Y-axis directions but also in an oblique direction (arbitrary angle from the X-axis or Y-axis). Direction), and the working time can be reduced.

  An X movable table that can be driven only in the X direction is provided on the fixed base, and the X movable table is moved through a Y direction slide permitting portion that allows the XY movable table to slide in the Y direction. What is attached to the Y movable table may be used.

  Also in this configuration, the XY movable table can reciprocate in the X direction by driving the X drive motor, and the XY movable table can reciprocate in the Y direction by driving the Y drive motor. By driving the motor, the suction collet can reciprocate in the Z direction. In addition, since the X movable table is interposed between the X movable section and the Y movable section, the XY movable table can be made compact, and each table can be stably slid and the X drive can be performed. A compact motor and Y drive motor can be achieved.

  The Y-direction slide permitting portion is constituted by an air bearing interposed between the XY movable table and the X movable table, or a linear motion guide interposed between the XY movable table and the X movable table. It can be constituted by a mechanism, and the degree of freedom of design can be improved.

  The XY movable table includes a main body formed of a short-angle cylindrical body, and a magnet portion serving as a Y movable portion of a Y drive motor is provided on an upper wall and a lower wall of the main body. The main body portion can be reciprocated in the X direction and the Y direction while being externally fitted to the coil portion as the Y motor fixing portion.

  With this configuration, the fixed coil and the movable magnet have four planes, and have a rectangular cross section, so that the number of movable magnets can be reduced by two as compared with a so-called rectangular cylinder linear drive motor. . As a result, a moving space in the X direction can be secured, and the weight of the XY movable table can be reduced.

  In the bonding apparatus of the present invention, a bonding head having a suction collet for sucking a work is attached to a Z table in the stage device.

  ADVANTAGE OF THE INVENTION The stage apparatus of this invention can reduce the number of parts, can aim at the improvement of assemblability, and can aim at cost reduction. Further, the weight of the X movable side can be reduced, and the speed of the apparatus can be increased.

  The bonding apparatus of the present invention uses the stage device according to the present invention, and has a specific operation and effect having the stage device.

FIG. 3 is a simplified diagram showing a bonding device using the stage device of the present invention. FIG. 2 is a simplified block diagram of the stage device shown in FIG. 1. It is a principal part simplified sectional view of the air bearing used for an XY slide permission part. FIG. 4 is a simplified diagram of an XY table used for an XY slide allowance unit. It is a simplified diagram of the bonding device of the present invention. It is a simplified diagram of another stage device of the present invention. It is a simplified diagram showing the operation of a general bonding apparatus. It is a simplified diagram showing a wafer.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 shows a die bonder (bonding device) using a stage device according to the present invention. As shown in FIG. 5, such a bonding apparatus picks up a chip 11 cut out from a wafer at a pickup position P with a collet 13 and transfers (loads) the chip 11 to a bonding position Q of a base material 12 such as a lead frame. Things. The wafer is adhered on a wafer sheet (adhesive sheet 15) stretched over a metal ring (wafer ring), and is divided (divided) into a number of chips 11 by a dicing process.

  The collet 13 is lifted in the direction of arrow A and lowered in the direction of arrow B on the pickup position P, and raised in the direction of arrow C and in the direction of arrow D on the bonding position Q by the stage device according to the present invention, which is a moving mechanism. , And reciprocal movement in the directions of arrows E and F between the pickup position P and the bonding position Q are enabled. The movement of the arrows A, B, C, D, E and F of the stage device is controlled by control means (not shown). The control means is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus centering on a CPU (Central Processing Unit). The ROM stores programs and data executed by the CPU.

  As shown in FIG. 1, the stage device includes an X drive motor 23 having an X motor fixed portion 22 and an X movable portion 21 reciprocating along the X direction, and a Y motor fixed portion 25 and a Y motor orthogonal to the X direction. A Y drive motor 26 having a Y movable portion 24 reciprocating along a direction, and a Z motor having a Z motor fixed portion 28 and a Z movable portion 27 reciprocating along a Z direction orthogonal to the X direction and the Y direction. And a drive motor 29.

  The X drive motor 23 is a flat linear motor including an X motor fixed section 22 as a stator and an X movable section 21 as a mover. In this case, an MC type in which the stator is a magnet (magnet) and the mover is a coil, or an MM type in which the stator is a coil and the mover is a magnet (magnet) may be used. The X motor fixing section 22 is fixed to a support member 31 erected on a fixed base 30, and the X movable section 21 is attached to an XY movable table 32.

  The XY movable table 32 includes a main body 33 having a short rectangular cylinder, in this case, an upper wall 33a and a lower wall 33b each having a flat rectangular cross section longer than the left and right vertical walls 33c and 33d. Further, magnets (magnet parts) 35a and 35b constituting the Y movable portion 24 as a movable element of the Y drive motor 26 are provided on the inner surface of the upper wall 33a and the inner surface of the lower wall 33b.

  The Y motor fixing portion 25 of the Y drive motor 26 is fitted into the main body 33. The Y motor fixing portion 25 includes a support member 36 having a flat rectangular cross section, a laminated yoke (laminated iron core) 37, a coil 38, and the like, and extends in the Y direction as shown in FIG. The support member 36 is fixed to the fixed base 30. That is, the Y motor fixing portion 25 is fixed to the fixed base 30.

  In a state where the axis of the Y motor fixing part 25 and the axis of the main body part 33 coincide with each other, the Y motor fixing part 25 and the magnet 35a attached to the upper wall 33a are closely opposed with the clearance A1, and The Y motor fixing portion 25 and the magnet 35b attached to the lower wall 33b face each other with a clearance A2. In this case, A1 and A2 have substantially the same dimensions. A1 and A2 do not change due to the reciprocation of the XY movable table 32 in the X direction.

  Further, in a state where the axis of the Y motor fixing part 25 and the axis of the main body part 33 coincide with each other, the Y motor fixing part 25 and the inner surface of one of the vertical walls 33c face each other with a clearance A3, and The portion 25 and the inner surface of the other vertical wall 33d face each other with a clearance A4. In this case, A3 + A4> A1 + A2. For this reason, a space is provided between the Y motor fixing portion 25 and the main body 33 so that the main body 33 can slide in the X direction. A3 and A4 are changed by the reciprocating movement of the XY movable table 32 in the X direction.

  An XY slide between the XY movable table 32 and the fixed base 30 that allows the XY movable table 32 to reciprocate along the X direction and reciprocate along the Y direction. An allowance section 40 is provided.

  For example, an air bearing 41 as shown in FIG. The air bearing 41 includes a porous member 42 and an air supply device such as a compressor (not shown) that supplies air to the porous member 42. The porous member 42 is provided with an air suction hole 42a, and a vacuum device for sucking air is connected to the air suction hole 42a.

  Therefore, air is blown from the entire surface of the porous member 42 as shown by the arrow α, and the XY movable table 32 is floated. Further, the XY movable table 32 is sucked as shown by an arrow β through the air suction hole 42a. That is, the suction force generated by the air suction holes 42a regulates the floating amount H of the XY movable table 32 that has floated by the air ejected from the porous member 42. For this reason, the floating amount H of the XY movable table 32 can be controlled by controlling the suction force.

  Therefore, the air bearing 41 can generate a static pressure to float the XY movable table 32 and maintain a constant distance between the XY movable table 32 and the fixed base 30. For this reason, the XY movable table 32 can be slid in the X direction, the Y direction, and the oblique direction (a direction forming an arbitrary angle from the X axis or the Y axis).

  Further, as the XY slide permitting section 40, as shown in FIG. The XY table 45 has an X-direction guide rail 46 extending in the X-direction, a slider 47 fitted on the X-direction guide rail 46 and sliding along the X-direction guide rail 46, and a XY table 45 mounted on the slider 47. A first table 48, a Y-direction guide rail 49 disposed on the upper surface of the first table 48 and extending in the Y-direction, and a slider 50 fitted on the Y-direction guide rail 49 and sliding along the Y-direction guide rail 49. And a second table 51 mounted on the slider 50.

  In this case, the X-direction guide rail 46 is provided on the fixed base 30, and the second table 51 is fixed to the XY movable table 32. As a result, the XY movable table 32 is maintained at a predetermined interval from the fixed base 30, the first table 48 slides in the X direction, and the second table 51 slides in the Y direction. Therefore, the XY movable table 32 can be slid in the X direction and the Y direction.

  The Z drive motor 29 is a flat type linear motor including a Z motor fixing section 28 as a stator and a Z movable section 27 as a mover. In this case, an MC type in which the stator is a magnet (magnet) and the mover is a coil, or an MM type in which the stator is a coil and the mover is a magnet (magnet) may be used. The Z motor fixing section 28 is attached (fixed) to one vertical wall 33 c of the main body section 33 of the XY movable table 32, and the Z movable section 27 is connected to the Z table 55. The Z table 55 is connected to a bonding head 56 having a suction collet 13 attached to the tip.

  A guide mechanism 57 for guiding the Z table 55 to reciprocate in the Z direction is interposed between the Z table 55 and the vertical wall 33c of the XY movable table 32. The guide mechanism 57 includes a guide rail 58 disposed on the vertical wall 33c along the Z direction, and a slider 59 that fits on the guide rail 58 and slides along the guide rail 58 in the Z direction.

  In the bonding apparatus configured as described above, the XY movable table 32 can reciprocate in the X direction by driving the X drive motor 23, and the XY movable table 32 can move in the Y direction by driving the Y drive motor 26. The suction collet 13 can reciprocate in the Z direction by driving the Z drive motor 29. Therefore, the collet 13 rises in the direction of arrow A and descends in the direction of arrow B on the pickup position P, rises in the direction of arrow C and descends in the direction of arrow D on the bonding position Q, and bonds with the pickup position P. Reciprocation in the directions of arrows E and F between the position Q and the position Q is enabled.

  In the stage device of the present invention, the X movable table and the Y movable table can be integrated, and the number of parts can be reduced. For this reason, the assemblability can be improved and the cost can be reduced. Further, it is not necessary to provide all the components of the Y drive motor 26 and the Z-axis motor 29 on the XY movable table 32, so that the weight on the X movable side can be reduced, and the speed of the apparatus can be increased. . The X motor fixing portion 22 and the Y motor fixing portion 25 are fixed to the fixing base 30, so that the rigidity of the device can be improved and the device has excellent durability.

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By providing the XY slide allowing portion 40, the XY movable table 32 can smoothly reciprocate in the X and Y directions. If an air bearing is used for the XY slide permitting portion 40, the slide can be performed more smoothly, and the XY movable table 32 can be used not only in the X-axis and Y-axis directions but also in oblique directions (X-axis). Or, it can be slid in a direction forming an arbitrary angle from the Y axis), and the working time can be reduced.

  The XY movable table 32 includes a main body 33 formed of a short-angle cylindrical body, and magnet sections 35a and 35b serving as the Y movable section 24 of the Y drive motor 26 are provided on an upper wall 33a and a lower wall 33b of the main body 33. The main body portion 33 is externally fitted to the coil portion, which is the Y motor fixing portion 25 of the Y drive motor 26, and the main body portion 33 is reciprocated in the X direction and externally fitted to the coil portion 38. It is configured such that reciprocation in the directions can be performed.

  With this configuration, the fixed yoke, the fixed coil, and the movable magnet have four planes, and have a quadrangular cross section, so that the number of movable magnets is reduced by two as compared with a so-called rectangular cylinder linear drive motor. be able to. Thereby, a moving space in the X direction can be secured, and the weight of the XY movable table 32 can be reduced.

  In the bonding apparatus of the present invention, a bonding head having a suction collet 13 for sucking a work is attached to a Z table 55 in a stage device. For this reason, the bonding apparatus of the present invention uses the stage device according to the present invention, and has a specific operation and effect having this stage device.

  FIG. 6 shows a bonding apparatus using another stage apparatus according to the present invention. In this case, an X movable table 60 that can be driven only in the X direction is provided on the fixed base 30. The X movable table 60 is attached to the XY movable table 42 via a Y-direction slide permitting portion 61 that allows the XY movable table 42 to slide in the Y direction.

  The X movable table 60 slides in the X direction via a guide mechanism 62 interposed between the base 30 and the X movable table 60. The guide mechanism 61 can be configured by a linear guide or the like including a guide rail and a slider that slides in the X direction along the guide rail. An air bearing 41 as shown in FIG. 3 interposed between the XY movable table 32 and the X movable table 60 may be used as the Y-direction slide permitting portion 61, or the XY movable table 32 and the X movable It can be constituted by a linear motion guide mechanism interposed between the table 60 and the table. The linear guide mechanism can be constituted by a linear guide or the like including a guide rail and a slider that slides along the guide rail.

  With this configuration, the X / Y movable table 32 can reciprocate in the X direction by driving the X drive motor 23, as in the bonding apparatus using the stage device as shown in FIG. The XY movable table 32 can reciprocate in the Y direction by the drive of 26, and the suction collet 13 can reciprocate in the Z direction by the drive of the Z drive motor 29. Therefore, the collet 13 rises in the direction of arrow A and descends in the direction of arrow B on the pickup position P, rises in the direction of arrow C and descends in the direction of arrow D on the bonding position Q, and bonds with the pickup position P. Reciprocation in the directions of arrows E and F between the position Q and the position Q is enabled.

  Moreover, the X movable table 60 is interposed between the X movable section 21 and the Y movable section 24, so that the XY movable table 32 can be made compact. A stable slide and a compact X drive motor 23 and Y drive motor 26 can be achieved.

  The Y-direction slide permitting portion 61 is configured by an air bearing interposed between the XY movable table 32 and the X movable table 60, or interposed between the XY movable table 32 and the X movable table 60. , And the degree of freedom of design can be improved.

  The present invention can be variously modified without being limited to the above-described embodiment. For example, as the main body 33 of the XY movable table 32, in the above-described embodiment, the cross-section is made of a flat rectangular shape. However, the cross section may be square. However, when a cross section having a square shape is used, the length of the magnet on the movable side in the X direction is reduced, the magnetic buoyancy is reduced, and the reciprocation of the XY movable table 32 in the X direction may not be stabilized. . In addition, the height of the stage device becomes large, and there are cases where the stage device cannot be installed depending on the installation site. On the other hand, if the main body 33 of the XY movable table 32 is made of a rectangular body having a flat cross section, the length of the movable magnet in the X direction can be made relatively large, and sufficient magnetism can be obtained. Buoyancy can be obtained, and reciprocation of the XY movable table 32 in the X direction is stabilized. In addition, the height of the stage device can be reduced.

  The stage device can be used for various devices such as an assembly device, an inspection device, and a processing device other than the bonding device. In the embodiment, the stage device is an XYZ table, but may be an XYZθ table.

13 Suction collet 21 X movable section 22 X motor fixed section 23 X drive motor 24 Y movable section 25 Y motor fixed section 26 Y drive motor 27 Z movable section 28 Z motor fixed section 29 Z drive motor 30 fixed base 32 XY movable Table 33 Main part 33a Upper wall 33b Lower wall 35a, 35b Magnet part 38 Coil part 40 Slide permissible part 41 Air bearing 55 Z table 56 Bonding head α, β Arrow

Claims (8)

An X drive motor having an X motor fixed portion and an X movable portion reciprocating in the X direction, and a Y drive having a Y motor fixed portion and a Y movable portion reciprocating in a Y direction orthogonal to the X direction. A stage device comprising: a motor; and a Z drive motor having a Z motor fixed portion and a Z movable portion that reciprocates in a Z direction orthogonal to the X direction and the Y direction,
An integrated XY movable table that reciprocates along the X direction by driving the X movable portion of the X drive motor and reciprocates along the Y direction by driving the Y movable portion of the Y drive motor, An X motor fixed portion and a Y motor fixed portion are fixed to a fixed base, a Z motor fixed portion is fixed to an XY movable table, and a Z movable portion that reciprocates in a Z direction by driving a Z drive motor. Is attached to the XY movable table.   An XY slide permitting portion is provided between the XY movable table and the fixed base, the XY slide permitting portion permitting the reciprocating slide along the X direction and the reciprocal slide along the Y direction. Item 2. The stage device according to item 1.   The XY slide allowance unit is configured by an air bearing that generates a static pressure to float the XY movable table and keeps a constant distance between the XY movable table and the fixed base. The stage device according to claim 2.   An X movable table that can be driven only in the X direction is provided on the fixed base, and the X movable table is moved through a Y direction slide permitting portion that allows the XY movable table to slide in the Y direction. The stage device according to claim 1, wherein the stage device is attached to the Y movable table.   5. The stage device according to claim 4, wherein the Y-direction slide permitting portion is constituted by an air bearing interposed between the XY movable table and the X movable table.   5. The stage device according to claim 4, wherein the Y-direction slide permitting portion is constituted by a guide mechanism interposed between the XY movable table and the X movable table.   The XY movable table includes a main body formed of a short-angle cylindrical body, and a magnet portion serving as a Y movable portion of a Y drive motor is provided on an upper wall and a lower wall of the main body. And the main body is capable of reciprocating in the X-direction and in the Y-direction while being externally fitted to the coil. The stage device according to claim 1.   8. A bonding apparatus, wherein a bonding head having a suction collet for sucking a work is attached to a Z table in the stage device according to claim 1.

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