TWI838506B - Method for producing perforated laminate and device for producing perforated laminate - Google Patents
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Abstract
Description
本發明係有關於至少積層有樹脂膜層和貼合層且具有貫穿積層方向之洞的開洞積層體的製造方法及製造裝置。 The present invention relates to a method and device for manufacturing a hole-opening laminated body which is at least laminated with a resin film layer and a bonding layer and has holes penetrating the laminated layer.
偏光板已廣泛使用作為液晶顯示裝置或有機電致發光(EL)顯示裝置等顯示裝置中的偏光之供應元件,或作為偏光的檢測元件。傳統上,偏光板係使用在偏光片的一面或兩面上接著有保護膜者。 Polarizing plates have been widely used as polarized light supply elements in display devices such as liquid crystal display devices or organic electroluminescent (EL) display devices, or as polarized light detection elements. Traditionally, polarizing plates are used with protective films attached to one or both sides of the polarizer.
備有偏光板的顯示裝置也有在筆記型電腦或行動電話等行動設備上部署,由於對顯示目的的多樣化、顯示區分的明確、裝飾等需求,因此需要具有不同透射率的區域之偏光板。尤其以智慧型手機或平板型終端為代表的中小型行動終端中,從裝飾性的觀點而言,可將偏光板全面性貼合以作成全面無縫設計。此時,由於偏光板也在攝影鏡片的區域或畫面下的圖像或標誌打印區域中重疊,故會有相機的感光度不佳或設計不良的問題。 Display devices equipped with polarizing plates are also deployed on mobile devices such as laptops and mobile phones. Due to the diversification of display purposes, clear display distinction, and decoration requirements, polarizing plates with different transmittance areas are required. In particular, in small and medium-sized mobile terminals represented by smartphones or tablet terminals, from a decorative point of view, polarizing plates can be fully bonded to create a seamless design. At this time, since the polarizing plate is also overlapped in the area of the photographic lens or the image or logo printing area under the screen, there will be problems such as poor camera sensitivity or poor design.
因此,通常可藉由在偏光板上形成孔洞等加工,而抑制相機的感度下降或設計性不良。日本特開2017-226034號公報係記載有在偏光板等光學構件上形成孔洞的加工方法或加工裝置,日本特開2007-307683公報係記載有 將光學構件沖壓成預定形狀的加工方法和加工裝置。 Therefore, it is usually possible to suppress the decrease in sensitivity or poor design of the camera by processing such as forming holes in the polarizing plate. Japanese Patent Publication No. 2017-226034 describes a processing method or processing device for forming holes in optical components such as polarizing plates, and Japanese Patent Publication No. 2007-307683 describes a processing method and processing device for punching optical components into a predetermined shape.
在偏光板上形成孔洞或使用沖壓刀片形成沖孔時,會有未去除沖壓碎屑殘留在偏光板上且不能良好形成孔洞的情形。殘留在偏光板上的沖壓碎屑必須從偏光板去除。 When forming holes in a polarizing plate or using a punching blade to punch holes, there may be a situation where punching debris is not removed and remains on the polarizing plate and the holes cannot be formed well. The punching debris remaining on the polarizing plate must be removed from the polarizing plate.
本發明的目係提供用以有效率地製造具有貫穿積層方向的開洞積層體之製造方法及製造裝置。 The purpose of the present invention is to provide a manufacturing method and a manufacturing device for efficiently manufacturing a laminate having holes that penetrate the laminate.
本發明提供以下所呈示的開洞積層體之製造方法及開洞積層體的製造裝置。 The present invention provides a method for manufacturing a porous laminate and a device for manufacturing a porous laminate as shown below.
〔1〕一種開洞積層體的製造方法,係製造具有貫穿積層方向的孔洞之開洞積層體,該製造方法包括下述步驟: [1] A method for manufacturing a porous laminate, which is to manufacture a porous laminate having holes penetrating the laminate direction, and the manufacturing method comprises the following steps:
準備附切隙(slits)的積層體之步驟,該附切隙的積層體係積層有一層以上的樹脂膜層與一層以上的貼合層,且具有貫穿積層方向的切隙和由該切隙形成之切除片;以及 The step of preparing a laminate with slits, wherein the laminate with slits has one or more resin film layers and one or more bonding layers, and has slits running through the laminate and excision pieces formed by the slits; and
形成孔洞的步驟,係藉由連續或間歇輸送前述附切隙的積層體同時將前述切除片從前述附切隙的積層體去除,而形成前述孔洞。 The step of forming the hole is to continuously or intermittently transport the aforementioned layered body with the cutout and remove the aforementioned excised piece from the aforementioned layered body with the cutout, thereby forming the aforementioned hole.
〔2〕如〔1〕所述之開洞積層體的製造方法,其中,前述形成孔洞的步驟中,係藉由對前述切除片施加外力而形成前述孔洞。 [2] A method for manufacturing a hole-forming laminate as described in [1], wherein the hole-forming step is performed by applying an external force to the cut piece.
〔3〕如〔2〕所述之開洞積層體的製造方法,其中,前述外力係用按壓部件按壓前述切除片的力、抽吸前述切除片的力及將流體噴射到前述切除片上的 力中之至少1種。 [3] A method for manufacturing a porous laminate as described in [2], wherein the external force is at least one of a force of pressing the cut piece with a pressing member, a force of sucking the cut piece, and a force of spraying a fluid onto the cut piece.
〔4〕如〔1〕至〔3〕項中任一項所述之開洞積層體的製造方法,其中,前述的準備步驟包括在積層前述一層以上的樹脂層和前述一層以上的貼合層之材料積層體的積層方向,將沖壓刀片切入而形成前述切隙的操作。 [4] A method for manufacturing a hole-opening laminate as described in any one of items [1] to [3], wherein the aforementioned preparation step includes cutting a punch blade into the lamination direction of the material laminate of the aforementioned one or more resin layers and the aforementioned one or more bonding layers to form the aforementioned cut gap.
〔5〕如〔1〕至〔3〕項中任一項所述之開洞積層體的製造方法,其中,前述孔洞之徑係1mm以上20mm以下。 [5] A method for manufacturing a hole-carrying laminate as described in any one of items [1] to [3], wherein the diameter of the hole is greater than 1 mm and less than 20 mm.
〔6〕如〔1〕至〔5〕項中任一項所述之開洞積層體的製造方法,其中,前述形成孔洞的步驟中,係藉由輸送帶、輸送輥及旋轉台的至少一種輸送前述附切隙的積層體。 [6] A method for manufacturing a multilayer structure with holes as described in any one of items [1] to [5], wherein in the step of forming holes, the multilayer structure with cutouts is transported by at least one of a conveyor belt, a conveyor roller and a rotating table.
〔7〕如〔1〕至〔6〕項中任一項所述之開洞積層體的製造方法,其中,前述形成孔洞的步驟中,間歇輸送前述附切隙的積層體,並在輸送前述附切隙的積層體之停止期間去除前述切片。 [7] A method for manufacturing a multilayer structure with holes as described in any one of items [1] to [6], wherein in the step of forming holes, the multilayer structure with cutouts is transported intermittently, and the slices are removed during the stop period of transporting the multilayer structure with cutouts.
〔8〕如〔1〕至〔7〕項中任一項所述之開洞積層體的製造方法,其中,前述形成孔洞的步驟進一步包括在從前述附切隙的積層體去除切片之後,輸送由該去除操作而得的開洞積層體之操作。 [8] A method for manufacturing a porous laminate as described in any one of items [1] to [7], wherein the step of forming holes further includes an operation of transporting the porous laminate obtained by the removal operation after removing the slice from the laminate with the cutout.
〔9〕如〔1〕至〔8〕項中任一項所述之開洞積層體的製造方法,其中,前述附切隙的積層體係片狀體。 [9] A method for manufacturing a multilayer body with holes as described in any one of items [1] to [8], wherein the multilayer body with cutouts is a sheet-like body.
〔10〕如〔1〕至〔9〕項中任一項所述之開洞積層體的製造方法,其中,前述附切隙的積層體係包含基材膜及剝離膜作為前述樹脂膜層, [10] A method for manufacturing a multilayer structure with holes as described in any one of items [1] to [9], wherein the multilayer structure with cutouts comprises a substrate film and a release film as the resin film layer,
前述基材膜、前述貼合層及前述剝離膜係依此順序積層。 The aforementioned base film, the aforementioned bonding layer and the aforementioned peeling film are layered in this order.
〔11〕如〔1〕至〔9〕項中任一項所述之開洞積層體的製造方法,其中,前述附切隙的積層體包含直線偏光片及保護膜作為前述樹脂膜, [11] A method for manufacturing a multilayer with holes as described in any one of items [1] to [9], wherein the multilayer with cutouts comprises a linear polarizer and a protective film as the resin film,
前述保護膜係積層於前述直線偏光片的單面或兩面。 The aforementioned protective film is laminated on one or both sides of the aforementioned linear polarizer.
〔12〕如〔1〕至〔11〕項中任一項所述之開洞積層體的製造方法,其中,前述貼合層係黏著劑層或接著劑層。 [12] A method for manufacturing a porous laminate as described in any one of items [1] to [11], wherein the bonding layer is an adhesive layer or a bonding agent layer.
〔13〕一種開洞積層體的製造裝置,該開洞積層體係具有貫穿積層方向的孔洞,該製造裝置係具備: [13] A manufacturing device for a porous laminate, wherein the porous laminate has holes that penetrate the laminate direction, and the manufacturing device comprises:
連續或間歇輸送附切隙的積層體用之輸送部,該附切隙的積層體積層有一層以上的樹脂膜層與一層以上的貼合層,並具有貫穿積層方向的切隙與由該切隙形成之切除片;以及 A conveying part for continuously or intermittently conveying a laminate with a cutout, wherein the laminate with a cutout has one or more resin film layers and one or more bonding layers, and has a cutout that penetrates the laminate and a cutout formed by the cutout; and
形成前述孔洞用之孔洞形成部,係從藉由前述輸送部連續或間歇輸送的前述附切隙的積層體去除前述切除片而形成前述孔洞。 The hole forming section for forming the aforementioned hole removes the aforementioned cut-off piece from the aforementioned layered body with the cut gap continuously or intermittently transported by the aforementioned transport section to form the aforementioned hole.
〔14〕如〔13〕所述之開洞積層體的製造裝置,其中,前述孔洞形成部包含藉由按壓構件按壓前述切除片用之按壓部、抽吸前述切除片用的抽吸部及為將流體噴射在前述切除片上用之噴射部中的至少1種。 [14] A manufacturing device for a hole-perforated laminate as described in [13], wherein the hole-forming portion includes at least one of a pressing portion for pressing the cut piece by a pressing member, a suction portion for sucking the cut piece, and a spray portion for spraying a fluid onto the cut piece.
〔15〕如〔13〕或〔14〕所述之開洞積層體的製造裝置,其進一步設有由積層前述一層以上的樹脂膜層與前述一層以上的貼合層之材料積層體而得之前述附切隙的積層體之機構。 [15] A manufacturing device for a porous laminate as described in [13] or [14], further comprising a mechanism for obtaining the aforementioned laminate with cutouts by laminating a material laminate of one or more resin film layers and one or more bonding layers.
〔16〕如〔15〕所述之開洞積層體的製造裝置,其中,藉由前述材料積層體而得的前述附切隙的積層體之機構,係在前述材料積層體的積層方向具備形成前述切隙用之沖壓刀具。 [16] A manufacturing device for a hole-perforated laminate as described in [15], wherein the structure of the laminate with the slit obtained by the material laminate is a punching tool for forming the slit in the lamination direction of the material laminate.
〔17〕如〔13〕至〔16〕中任一項所述之開洞積層體的製造裝置,其中,前述輸送部上設有輸送前述附切隙的積層體用之輸送帶、輸送輥及旋轉台中的至少1種。 [17] A manufacturing device for a multilayer body with holes as described in any one of [13] to [16], wherein the conveying section is provided with at least one of a conveyor belt, a conveyor roller and a rotating table for conveying the multilayer body with cutouts.
〔18〕如〔13〕至〔17〕中任一項所述之開洞積層體的製造裝置,其中,前述輸送部在去除前述切除片後可立即輸送前述開洞的積層體。 [18] A manufacturing device for a multilayer body with holes as described in any one of [13] to [17], wherein the conveying unit can immediately convey the multilayer body with holes after removing the cut-off piece.
根據本發明可有效製造具有貫穿積層方向的孔洞之開洞積層體。 According to the present invention, a hole-opening laminate having holes penetrating the direction of the laminate can be effectively manufactured.
10a:材料積層體 10a: Material layer
10b:附切隙的積層體 10b: Laminated body with cutouts
10c:開洞積層體 10c: Open hole layered structure
11a:切除片 11a: Resection piece
11b:切隙 11b: Cutting gap
11c:孔洞 11c: Holes
12a,12b,12c:直線偏光片 12a,12b,12c: linear polarizer
13a,13b,13c:貼合層 13a, 13b, 13c: bonding layer
14a,14b,14c:保護膜 14a,14b,14c: Protective film
31:輸送部 31: Transport Department
32:釘銷(按壓構件、按壓部) 32: Nail (pressing member, pressing part)
33:按壓固定部 33: Press and fix the part
34:輸送帶 34: Conveyor belt
34c:帶孔 34c: with hole
41:輸送部 41: Transport Department
42:抽吸部 42: Suction unit
51:輸送部 51: Transport Department
52:噴射部 52: Jet Department
61:輸送部 61: Transport Department
62a:第1輸送帶(輸送帶) 62a: No. 1 conveyor belt (conveyor belt)
62b:第2輸送帶(輸送帶) 62b: Second conveyor belt (conveyor belt)
63a,63b:夾輥 63a,63b: Clamping roller
圖1(a)係示意性呈示本發明的開洞積層體之製造方法中使用之材料積層體的一例之示意平面圖,(b)係(a)的x-x’剖面圖。 Figure 1 (a) is a schematic plan view schematically showing an example of a material laminate used in the method for manufacturing an open-hole laminate of the present invention, and (b) is an x-x’ cross-sectional view of (a).
圖2(a)係示意性呈示本發明的開洞積層體之製造方法中使用的附切隙的積層體的一例之示意性平面圖,(b)係(a)的y-y’剖面圖。 Figure 2 (a) is a schematic plan view schematically showing an example of a laminate with cutouts used in the method for manufacturing a laminate with holes of the present invention, and (b) is a y-y’ cross-sectional view of (a).
圖3(a)係示意性呈示本發明的開洞積層體之一例的示意性平面圖,(b)係(a)的z-z’剖面圖。 Figure 3 (a) is a schematic plan view schematically showing an example of the open-hole laminate of the present invention, and (b) is a z-z’ cross-sectional view of (a).
圖4係示意性呈示本發明的開洞積層體之製造裝置的一例之示意圖。 FIG4 is a schematic diagram schematically showing an example of a manufacturing device for the open-hole laminate of the present invention.
圖5係示意性呈示本發明的開洞積層體之製造裝置的另一例之示意圖。 FIG5 is a schematic diagram showing another example of a manufacturing device for a porous laminate of the present invention.
圖6係示意性呈示本發明的開洞積層體之製造裝置的另一例之示意圖。 FIG6 is a schematic diagram showing another example of a manufacturing device for a porous laminate of the present invention.
圖7係示意性呈示本發明的開洞積層體之製造裝置的另一例之示意圖。 FIG. 7 is a schematic diagram showing another example of a manufacturing device for a porous laminate of the present invention.
以下,參照圖式說明本發明的開洞積層體之製造方法的較佳實施型態。以下呈示的各實施型態可任意的組合。各實施型態中,對於和該等之前的實施型態中說明之構件相同的構件係附上相同的符號並省略其說明。 The following is a preferred embodiment of the method for manufacturing the open-hole laminate of the present invention with reference to the drawings. The embodiments presented below can be combined arbitrarily. In each embodiment, the same components as those described in the previous embodiments are given the same symbols and their descriptions are omitted.
〔實施型態1〕 [Implementation Type 1]
在本實施型態中,開洞積層體及附切隙的積層體具有作為樹脂膜層的直線偏光片(以下也稱「偏光片」。)及保護膜和貼合層,茲列舉在直線偏光片的一面隔著貼合層而具有保護膜之直線偏光板(以下也稱「偏光板」。)的情形為例說明。 In this embodiment, the hole-opening laminate and the laminate with cutouts have a linear polarizer (hereinafter also referred to as a "polarizer") as a resin film layer, a protective film, and a bonding layer. Herein, a linear polarizer (hereinafter also referred to as a "polarizer") having a protective film on one side of the linear polarizer through a bonding layer is taken as an example for explanation.
(開洞積層體的製造方法) (Manufacturing method of open-cell laminate)
本實施型態的開洞積層體10c(圖3(a)及(b))之製造方法,係包含製備附切隙的積層體10b(圖2(a)及(b))之步驟(以下也稱「製備步驟」。)和形成貫穿積層方向的孔洞11c(圖3(a)及(b))之步驟(以下也稱「孔洞形成步驟」。)。圖2(a)及(b)中切隙11b係呈示切除片11a存在附切隙的積層體10b上用之點畫線。
The manufacturing method of the holed
附切隙的積層體10b可藉由在後述的(圖1(a)及(b))之材料積層體10a上形成切隙11b而製造。切隙11b係為形成孔洞11c用者。
The laminate 10b with a slit can be manufactured by forming a
形成切隙11b的方法係在後述的「製備步驟」中說明。
The method of forming the
孔洞形成步驟,可進一步包含從附切隙的積層體10b去除由切隙11b形成的切除片11a之後,輸送由該去除操作而得的開洞積層體10c之操作。開洞積層體10c的輸送可連續性進行,也可間歇性進行。於孔洞形成步驟中,在連續輸送附切隙的積層體10b的同時去除切除片11a時,也可連續地輸送由上述去除操作而得的開洞積層體10c。於孔洞形成步驟中,在去除切除片11a時如停止附切隙的積層體10b之輸送時,可連續地輸送由上述去除操作而得的開洞積層體10c,也可間歇地輸送。
The hole forming step may further include an operation of conveying the hole-opening
(開洞積層體) (Open hole layer)
如圖3(a)所示,開洞積層體10c係平面圖中4個角為圓角(具有R的形狀)的圓角四邊形。例如圖3(b)所示,開洞積層體10c係依偏光片12c(樹脂膜層)、貼合層13c及保護膜14c(樹脂膜層)之順序積層者。開洞積層體10c具有貫穿其積層方向的孔洞11c,且作成開洞積層體10c的各層之偏光片12c、貼合層13c及保護膜14c也分別具有貫穿其厚度方向的孔洞。
As shown in FIG3(a), the open-
開洞積層體10c的平面形狀並無特別的限制,通常係四角形或四角形的至少一個角成為圓角的圓角四邊形,該部分可以係U字型、V字型、ㄇ字型、半圓型等具有缺角的缺角部。圖3(a)呈示的開洞積層體10c雖然係片狀體,但也可以係長形的連續體。
The planar shape of the
孔洞11c的形狀並無特別的限制,可以係圓形;楕圓形;楕圓形;三角形或四角形等多角形;多角形的至少一個角作成圓角(具有R的形狀)的多角形等。
The shape of the
孔洞11c的徑係以1mm以上為佳,可以係3mm以上,可以係5mm以上,也可以係7mm以上,以20mm以下為佳,可以係18mm以下,可以係15mm以下,也可以係12mm以下。
The diameter of the
本說明書中,孔洞之徑係指孔洞為圓形(正圓形)時係孔洞的直徑,孔洞為圓形(正圓形)以外的形狀時係指孔洞的外接圓(正圓形)之直徑。本實施型態的製造方法及製造裝置係如後述,可適用於製造孔洞11c之徑為上述範圍的開洞積層體10c之情況。
In this specification, the hole diameter refers to the diameter of the hole when the hole is circular (perfect circle), and refers to the diameter of the circumscribed circle (perfect circle) of the hole when the hole is a shape other than circular (perfect circle). The manufacturing method and manufacturing device of this embodiment are described below and can be applied to the case of manufacturing a hole-opening
在圖3(a)及(b)呈示的開洞積層體10c中,雖然係呈示孔洞11c為
一個的情況,但也可具有2個以上的孔洞。偏光板為長形的連續體時,通常為在之後的步驟中裁切成製品尺寸(片狀體),故較佳為配合此裁切時的形狀在連續體上設有多個孔洞。雖然圖3(b)呈示的開洞積層體10c係在偏光片12c的一面上具有保護膜14c者,但也可以係隔著貼合層而在偏光片12c的兩面上具有保護膜者。
In the hole-forming
(材料積層體) (Material layer)
例如圖1(a)所示,材料積層體10a係平面圖中4個角為圓角的圓角四邊形。
For example, as shown in FIG1(a), the
材料積層體10a的平面形狀並無特別的限制,係與開洞積層體10c同樣的以四角形或圓角四角形為佳,也可以係具有缺角部分者。雖然圖1(a)呈示的材料積層體10a係片狀體,但也可以係長形的連續體。
There is no particular limitation on the planar shape of the
圖1(b)所示,材料積層體10a係依偏光片12a、貼合層13a及保護膜14a的此順序積層者。偏光片12a及保護膜14a係樹脂膜層。
As shown in FIG1(b), the
雖然圖1(b)呈示的材料積層體10a係在偏光片12a的一面具有保護膜14a者,但也可以係隔著貼合層而在偏光片的兩面具有保護膜者。
Although the
貼合層13a可以係使用接著劑而形成的接著劑層,也可以係使用黏著劑而形成的黏著劑層。在後述的附切隙的積層體10b(圖2(a)及(b))中,貼合層為黏著劑層時,有容易使切除片11a殘留在附切隙的積層體10b上的傾向。本實施型態的製造方法及製造裝置也可適用於含有黏著劑層作為貼合層的情況。
The
(附切隙的積層體) (Laminar body with cutouts)
如圖2(a)所示,附切隙的積層體10b係平面圖中4個角為圓角的圓角四邊形。如圖2(b)所示,附切隙的積層體10b係依偏光片12b、貼合層13b及保護膜14b的此順序積層者,切隙11b係沿著開洞積層體10c的孔洞11c之外緣形成。偏光片12b、貼合層13b及保護膜14b分別具有貫穿其厚度方向的切隙。
As shown in FIG2(a), the laminate 10b with cutouts is a rounded quadrilateral with four rounded corners in the plane view. As shown in FIG2(b), the laminate 10b with cutouts is a laminate of
附切隙的積層體10b之平面形狀並無特別的限制,與開洞積層體10c同樣以四角形或圓角四邊形為佳,也可以為具有缺角部分者。雖然圖2(a)呈示的附切隙的積層體10b係片狀體,但也可以為長形的連續體。
There is no particular restriction on the plane shape of the
附切隙的積層體10b具有切除片11a。切除片11a係由切隙11b形成的材料積層體10a之片段。切除片11a係從附切隙的積層體10b之本體(切除片11a以外的部分)上因切隙11b而呈部分或完全的分離狀態。切除片11a可存在於至少部分被切隙11b圍繞的區域中,也可以為雖然並不存在於被切隙11b圍繞的區域中,而部分的切除片11a未完全從附切隙的積層體10b之本體上分離的狀態(例如,切除片11a係懸掛在附切隙的積層體10b之本體上的狀態)。附切隙的積層體10b之切隙11b係如貫穿偏光片12b、貼合層13b及保護膜14b的積層方向形成,垂直於該積層方向的面中,沿著成為開洞積層體10c的孔洞11c之輪廓(外緣)的部分連續地形成。因此,藉由從附切隙的積層體10b去除切除片11a,可得形成有孔洞11c的開洞積層體10c。
The laminate 10b with a cutout has a
切除片11a的形狀只要對應開洞積層體10c的孔洞11c之形狀設定即可。切除片11a的形狀可以係楕圓形;小楕圓形(卵圓型);三角形或四角形等多角形;多角形的至少一個角作成圓角的圓角多角形等。
The shape of the cut-
切除片11a之徑係以1mm以上為佳,可以係3mm以上,可以係5mm以上,也可以係7mm以上,以20mm以下為佳,可以係18mm以下,可以係15mm以下,也可以
係12mm以下。
The diameter of the
本說明書中,切除片之徑在切除片的平面形狀為圓形(正圓形)時,係指切除片的直徑,切除片的平面形狀為圓形(正圓形)以外時,係指切除片的外接圓(正圓形)之直徑者。 In this manual, the diameter of the cut piece refers to the diameter of the cut piece when the plane shape of the cut piece is a circle (a perfect circle); when the plane shape of the cut piece is other than a circle (a perfect circle), it refers to the diameter of the circumscribed circle (a perfect circle) of the cut piece.
當切除片11a之徑為上述範圍時,其不易從附切隙的積層體10b去除,容易殘留在圍繞切除片11a的區域中,有不能完全從附切隙的積層體10b之本體上分離之傾向。切除片11a的平面形狀之徑為上述範圍時,換言之,當從附切隙的積層體10b上移除上述徑的切除片11a而製造具有對應於切除片11a之徑的孔洞11c之開洞積層體10c(圖3(a))時,可適用本實施型態的製造方法和製造裝置。
When the diameter of the
貼合層13b雖然可以係由接著劑形成的接著劑層,也可以係由黏著劑形成的黏著劑層,但在貼合層為黏著劑層時,切除片11a難以完全從附切隙的積層體10b之本體上分離,而有在附切隙的積層體10b上殘留切除片11a之傾向。本實施型態的製造方法及製造裝置即便於包含黏著劑層作成貼合層的附切隙的積層體10b的情況亦可適用。
Although the
在圖2(a)及(b)呈示的附切隙的積層體10b中,雖然係呈示切隙11b為的情況,但也可具有2個以上的切隙。附切隙的積層體係長形的連續體時,通常之後的步驟中為裁切成製品尺寸(片狀體),係以配合此裁切時的形狀而設計連續的多個切隙為佳。雖然圖2(b)呈示的附切隙的積層體10b係在偏光片12b的一面上具有保護膜14b者,但也可以係在偏光片的兩面上隔著貼合層而具有保護膜者。
In the laminate 10b with notches shown in FIG. 2 (a) and (b), although the
(製備步驟) (Preparation steps)
開洞積層體10c的製造方法中之製備步驟係例如準備具有切隙11b及切除片11a的附切隙的積層體10b(圖2(a)及(b))的步驟。製備步驟可包括藉由在材料積層體10a(圖1(a)及(b))上形成切隙11b而製造附切隙的積層體10b之操作者。製造附切隙的積層體10b之方法可包括例如在材料積層體10a的積層方向藉由沖壓刀片切割而形成切隙11b之操作。沖壓刀片並無特別的限制,可使用例如湯姆森刀片和腐蝕刀片(Pinnacle(註冊商標)刀片)等。
The preparation step in the manufacturing method of the hole-opening
(孔洞形成步驟) (Hole forming step)
在開洞積層體10c的製造方法中形成孔洞的步驟中,可使用例如圖4呈示的開洞積層體10c之製造裝置。
In the step of forming holes in the manufacturing method of the
圖4呈示的製造裝置具備為連續或間歇性輸送附切隙的積層體10b用之輸送部31和為在附切隙的積層體10b之切除片11a上施加按壓力(外力)而從附切隙的積層體10b按壓去除切除片11a用之釘銷32(按壓構件、按壓部)。釘銷32係為藉由用輸送部31輸送的附切隙的積層體10b去除切除片11a而形成孔洞11c之用者。釘銷32係以可對向於由輸送部31輸送的附切隙的積層體10b的方式設在輸送部31之上方。製造裝置可在釘銷32按壓切除片11a時進一步具有為按壓固定附切隙的積層體10b用的按壓固定部33(固定部)。按壓固定部33係設在和釘銷32的相同側上,即輸送部31的上方。
The manufacturing device shown in FIG4 includes a conveying
輸送部31備有輸送帶34,釘銷32設在輸送帶34的輸送面之上方。輸送帶34以能去除被釘銷32沖壓出的切除片11a的方式設置有切除片11a可穿過的帶孔34c。因此,附切隙的積層體10b係如使切除片11a配置在帶孔34c之位置的放置在輸送帶34上的方式而被輸送。
The conveying
如圖4中的兩個箭頭呈示,釘銷32係設置成可相對於輸送帶34的輸送面進退移動,並按壓由輸送帶34輸送的附切隙的積層體10b的切除片11a而沖壓切除片11a者。釘銷32係可作成例如棒狀的構件,與切除片11a接觸的尖端部之剖面積較佳為小於切除片11a的面積。與釘銷32之切除片11a接觸之側的尖端部可形成錐形,尖端部分上可附接如海綿或橡膠等的軟質構件。
As shown by the two arrows in FIG. 4 , the
按壓固定部33係例如按壓附切隙的積層體10b之切隙11b周邊的按壓棒。藉由使用按壓固定部33按壓固定積層體10b的位置,可隨著釘銷32按壓切除片11a或解放該按壓等釘銷32的前進後退,而抑制附切隙的積層體10b或開洞積層體10c之輸送位置偏移等問題。在圖4呈示的製造裝置中,係例示在垂直於輸送方向的方向設置2個按押棒之情況。按壓固定部33可作成例如板狀或棒狀的構件,也可具有能按壓垂直於附切隙的積層體10b之輸送方向的全長之長度。按壓固定部33係以在不和垂直於附切隙的積層體10b之輸送方向延伸的產品端面接觸之位置按壓為佳。貼合層13b露出在附切隙的積層體10b之端面上,使此端面與按壓固定部33接觸時,因形成貼合層13的黏著劑或接著劑會附著在按壓固定部33,而可能成為產生異物或污染輸送路徑的原因。例如圖4中的兩箭頭呈示,按壓固定部33係和與附切隙的積層體之釘銷32的進退運動同步進退,可配合釘銷32按壓切除片11a的時機按壓附切隙的積層體10b。
The pressing and fixing
在孔洞形成步驟中,藉由輸送帶34的驅動使附切隙的積層體10b依序朝圖4中的一箭頭呈示的方向輸送。當附切隙的積層體10b之切除片11a部分到達釘銷32的設置位置時,按壓固定部33係朝向輸送帶34進出。因此,使按壓固定部33按壓附切隙的積層體10b之切隙11b的周圍而固定附切隙的積層體10b之位置,此狀態中藉由釘銷32朝向輸送帶34進出而按壓切除片11a,而沖壓
切除片11a而得開洞積層體10c(圖4)。沖壓出的切除片11a可從輸送帶34的帶孔34c排出至輸送部之外部。然後,使釘銷32及按壓固定部朝離開輸送帶34的方向移動,藉由輸送帶34連續或間歇地輸送所得的開洞積層體10c(圖4)。
In the hole forming step, the
用釘銷32按壓切除片11a可在連續輸送附切隙的積層體10b之同時進行,也可在間歇輸送附切隙的積層體10b之停止期間進行。用釘銷32按壓切除片11a係隨著釘銷32及按壓固定部33對輸送帶34上的附切隙的積層體10b的進退運動(在圖4中,係上下運動)。因此,為了使釘銷32適切地按壓切除片11a,係以在進行間歇輸送附切隙的積層體10b或開洞積層體10c之暫時停止輸送的停止期間,使按壓固定部33按壓附切隙的積層體10b,並使釘銷32按壓切除片11a為佳。此時,附切隙的積層體10b或開洞積層體10c的輸送較佳為在不進行按壓固定部33及釘銷32的按壓之間進行。
The pressing of the cut-
如圖4所示,根據本實施型態可因輸送附切隙的積層體10b同時藉由按壓而去除切除片11a,故可有效地進行孔洞形成步驟。
As shown in FIG. 4 , according to this embodiment, the cut-
在圖4呈示的製造裝置中,雖然釘銷係設在輸送帶34的上方,但只要可按壓輸送帶34上的附切隙的積層體10b的切除片11a,其位置即無特別的限制。例如,釘銷也可設在輸送帶34的下方。將釘銷設在輸送帶34的下方時,較佳為將按壓固定部也設在輸送帶34的下方。
In the manufacturing device shown in FIG. 4, although the pin is disposed above the
在圖4呈示的製造裝置中,雖然係舉設置對於輸送帶34的輸送面可進退之釘銷為例說明,但並不限定於此,也可使用例如在表面具有預定間隔的釘銷之附釘銷的輥。可藉由輸送附切隙的積層體同時使附釘銷的輥旋轉,以使附釘銷的輥之釘銷與附切隙的積層體中之切隙接觸,並使附釘銷的輥之釘銷接觸切除片而按壓,而從附切隙的積層體去除切除片。
In the manufacturing device shown in FIG. 4, although a pin that can move forward and backward relative to the conveying surface of the
在圖4呈示的製造裝置中,雖然係舉使用2個按壓棒作為按壓固定部的情況為例說明,但只要係可按壓固定切隙11b的周圍者,即無特別限制使用的按壓棒之數或形狀等,可使用一個按壓棒,也可設置圍繞切隙11b的周圍之形狀的按壓固定部。
In the manufacturing device shown in FIG. 4, although two pressing rods are used as the pressing and fixing part as an example, as long as the periphery of the
也可使用可固定附切隙的積層體10b之位置的固定部取代按壓固定部33。例如,可設置抽吸固定附切隙的積層體10b之位置用的抽吸固定部(固定部)取代按壓固定部33。此外,如能充分固定附切隙的積層體10b之位置時,也可不設置固定部。
A fixing portion that can fix the position of the
上述的開洞積層體10c之製造裝置(圖4)可在附切隙的積層體10b之輸送方向上游側具備沖壓刀片,以在材料積層體10a的積層方向形成切隙11b。藉此,即可由材料積層體1a獲得附切隙的積層體10b,可連續或間歇地輸送所得的附切隙的積層體10b而進行孔洞形成步驟。
The manufacturing device of the above-mentioned hole-opening
圖4呈示的製造裝置上,也可設置為聚集從輸送部31去除的切除片11a用之聚集部,也可設置將切除片11a排出至製造裝置外用的切除片排出部。
The manufacturing device shown in FIG. 4 may also be provided with a gathering section for gathering the excised
〔實施型態2〕 [Implementation Type 2]
本實施型態中也與之前的實施型態中說明之開洞積層體、附切隙的積層體及材料積層體同樣的舉出有開洞積層體、附切隙的積層體及材料積層體之偏光板的情況為例說明。在本實施型態中,係使用圖5呈示的開洞積層體之製造裝置取代圖4呈示的開洞積層體之製造裝置。以下主要說明與之前的實施型態中說明之處不同之處,並且省略與之前的實施型態中說明的相同處。 In this embodiment, the case of a polarizing plate having an open hole laminate, an open hole laminate, and a material laminate is also cited as an example, similar to the open hole laminate, the open hole laminate, and the material laminate described in the previous embodiment. In this embodiment, the manufacturing device of the open hole laminate shown in FIG. 5 is used to replace the manufacturing device of the open hole laminate shown in FIG. 4. The following mainly describes the differences from the previous embodiment, and omits the same points as the previous embodiment.
圖5係示意性呈示本實施型態的開洞積層體之製造裝置的另一例之示意圖。在本實施型態的開洞積層體之製造裝置中,係使用具備抽吸部42的製造裝置(圖5)取代之前的實施型態中使用的釘銷32(圖4),在進行孔洞形成步驟之點與之前的實施型態不同之處。 FIG5 is a schematic diagram schematically showing another example of the manufacturing device for the open-hole laminated body of the present embodiment. In the manufacturing device for the open-hole laminated body of the present embodiment, a manufacturing device with a suction portion 42 (FIG5) is used to replace the nail pin 32 (FIG4) used in the previous embodiment, which is different from the previous embodiment in the point where the hole forming step is performed.
圖5呈示的製造裝置具備連續或間歇性輸送附切隙的積層體10b用之輸送部41、在附切隙的積層體10b之切除片11a上施加抽吸力(外力)而從附切隙的積層體10b上抽吸去除切除片11a用之抽吸部42。抽吸部42係藉由從用輸送部41輸送的附切隙的積層體10b去除切除片11a而形成孔洞11c用者。抽吸部42係以可和用輸送部41輸送附切隙的積層體10b相對的方式設在輸送部41的下方。
The manufacturing device shown in FIG5 has a conveying
輸送部41具有輸送帶34,抽吸部42係設在輸送帶34的輸送面之下方。被抽吸部42,輸送帶34係以可將藉由抽吸部42抽吸的切除片11a抽吸去除的方式,在附切隙的積層體10b的切除片11a的位置設有可通過切除片11a的帶孔34c。因此,附切隙的積層體10b係以切除片11a配置在帶孔34c的位置的方式承載在輸送帶34上而輸送。
The conveying
抽吸部42例如係抽吸盒(suction box),並位於輸送帶34的下方,可從輸送帶34的帶孔34c賦予附切隙的積層體10b抽吸力。抽吸部42係例如整體為長方體的箱形形狀,在面對輸送帶34的表面上具有開口,並在另一面上具有排出被抽吸到抽吸盒中的氣體之排氣口。
The suction part 42 is, for example, a suction box, and is located below the
在孔洞形成步驟中,係由輸送帶34的驅動朝向圖5中的一個箭頭呈示之方向依序輸送附切隙的積層體10b。當附附切隙的積層體10b的切除片11a部分到達輸送部41上的抽吸部42之設置位置時,可藉由抽吸部42的抽吸,
而從輸送帶34的帶孔34c移除至輸送部41之外部,而得開洞積層體10c。所得的開洞積層體10c(圖5)係用輸送帶34連續或間歇地輸送。
In the hole forming step, the laminate 10b with cutouts is sequentially conveyed by the
藉由抽吸部42進行的切除片11a的抽吸,可在連續輸送附切隙的積層體10b的同時進行,也可間歇輸送附切隙的積層體10b並在停止輸送附切隙的積層體10b之停止期間進行。為有效進行藉由抽吸部42的抽吸切除片11a,係以在由抽吸部42的抽吸動作狀態中,藉由用連續驅動輸送帶34而連續輸送附切隙的積層體10b,並使切除片11a通過抽吸部42的位置而抽吸去除為佳。
The suction of the excised
根據本實施型態,如圖5所示,因可在輸送附切隙的積層體10b的同時藉由抽吸力等外力而去除切除片11a,故可有效地進行孔洞形成步驟。
According to this embodiment, as shown in FIG5 , since the
在圖5呈示的製造裝置中,雖然抽吸部係設在輸送帶34的下方,但只要可抽吸輸送帶34上的附切隙的積層體10b的切除片11a,其位置即無特別的限制。例如,也可將抽吸部42設在輸送帶34的上方。
In the manufacturing device shown in FIG. 5 , although the suction part is disposed below the
在圖5呈示的製造裝置中,雖然係列舉使用抽吸盒作為抽吸部42為例說明,但並不侷限於此例,也可使用例如在周圍方向具有預定長度的抽吸區域之抽吸輥。使用抽吸輥時,可在驅動輸送帶的同時使抽吸輥旋轉,以抽吸輥的抽吸區域和輸送帶的帶孔之位置彼此面對的方式藉由在抽吸輥之抽吸區域中抽吸,而從輸送帶的附切隙的積層體上抽吸去除切除片。 In the manufacturing device shown in FIG. 5, although a suction box is used as the suction part 42 as an example, it is not limited to this example, and a suction roller having a suction area of a predetermined length in the circumferential direction may also be used. When using the suction roller, the suction roller can be rotated while driving the conveyor belt, and the suction area of the suction roller and the belt hole of the conveyor belt are positioned facing each other, and the excised pieces are removed from the laminated body with the cut gap of the conveyor belt by suction in the suction area of the suction roller.
如之前的實施型態中之說明,圖5呈示的製造裝置可在附切隙的積層體10b之輸送方向上游側具備用以在材料積層體10a的積層方向上形成切隙11b的沖壓刀片。因此,可從材料積層體10a獲得附切隙的積層體10b,將所得的附切隙的積層體10b連續或間歇輸送而進行孔洞形成步驟。
As described in the previous embodiment, the manufacturing device shown in FIG. 5 may be provided with a punching blade for forming a
圖5呈示的製造裝置中,可設置用以聚集由輸送部去除的切除片
11a用之聚集部,也可設置用以將切除片11a排放至製造裝置外的切除片排放部。
In the manufacturing device shown in FIG. 5, a gathering section for gathering the excised
〔實施型態3〕 [Implementation Type 3]
本實施型態中也和之前的實施型態中說明之開洞積層體、附切隙的積層體及材料積層體相同的列舉開洞積層體、附切隙的積層體及材料積層體為偏光板的情況為例說明。在本實施型態中,係使用圖6呈示的開洞積層體之製造裝置取代上述中說明的開洞積層體之製造裝置。以下主要說明與之前的實施型態中說明之處不同之處,並且省略與之前的實施型態中說明的相同處。 In this embodiment, the same open hole laminate, laminate with cutouts, and material laminate as described in the previous embodiment are listed as an example of the case where the open hole laminate, laminate with cutouts, and material laminate are polarizing plates. In this embodiment, the manufacturing device of the open hole laminate shown in FIG. 6 is used to replace the manufacturing device of the open hole laminate described above. The following mainly describes the differences from the previous embodiment, and omits the same points as described in the previous embodiment.
圖6係示意性呈示本實施型態的開洞積層體之製造裝置的另一例之示意圖。在本實施型態的開洞積層體之製造裝置中,係使用具備噴射流體用之噴射部的製造裝置(圖6),取代之前的實施型態中使用的釘銷32(圖4)或抽吸部42,於進行孔洞形成步驟中之點與之前的實施型態不同。 FIG6 is a schematic diagram schematically showing another example of the manufacturing device of the hole-forming laminated body of the present embodiment. In the manufacturing device of the hole-forming laminated body of the present embodiment, a manufacturing device (FIG6) having a spraying part for spraying fluid is used to replace the nail 32 (FIG4) or the suction part 42 used in the previous embodiment, and the point in the hole forming step is different from the previous embodiment.
圖6呈示的製造裝置具備為連續或間歇輸送附切隙的積層體10b用的輸送部51,和在附切隙的積層體10b之切除片11a施加(外力)以噴射流體,從附切隙的積層體10b上噴射去除切除片11a用之噴射部52。噴射部52係為藉由從輸送部51輸送的附切隙的積層體10b去除切除片11a而形成孔洞11c之用者。噴射部52係以面對從輸送部51輸送的附切隙的積層體10b的方式,設在輸送部51的上部。圖6呈示的製造裝置在噴射部52對切除片11a噴射時,也可進一步具有按壓固定部33(固定部),以按壓固定附切隙的積層體10b之位置。按壓固定部33係與噴射部52同側,即設在輸送部的上部。
The manufacturing apparatus shown in FIG6 includes a conveying
輸送部51具備輸送帶34,噴射部52係設在輸送帶34的輸送面之上
部。附切隙的積層體10b之切除片11a之位置,以可用噴射部52去除切除片11a的方式,設有可通過切除片11a的帶孔34c。因此,附切隙的積層體10b係以切除片11a配置在帶孔34c的位置的方式承載在輸送帶34而輸送。
The conveying
噴射部52設在輸送帶34的上部,可用空氣或氮氣、稀有氣體等或水等液體等流體噴射在切除片11a上者,以可噴射壓縮空氣者為佳。噴射部52可具備例如噴嘴,可藉由調節噴嘴的大小等而將流體僅噴射在切除片11a或僅噴射在切除片11a與其周圍。
The spraying
按壓固定部33係例如按壓附切隙的積層體10b之切隙11b周邊的按壓棒。因此,從噴射部52噴射流體時,可抑制附切隙的積層體10b或開洞積層體10c的輸送位置偏移等問題。圖6呈示的製造裝置中,係呈示在切隙11b的周邊上和輸送方向垂直的方向上設置二個按壓棒時的情況之例。如之前的實施型態中之說明,按壓固定部33較佳為在不和附切隙的積層體10b之輸送方向垂直的方向延伸之製品端部接觸的位置按壓。按壓固定部33係例如圖6中的兩個箭頭呈示,可和藉由噴射部52的噴射流體同步進退,並使噴射部52配合流體噴射到切除片11a上之時點按壓附切隙的積層體10b。
The pressing and fixing
在孔洞形成步驟中,係藉由輸送帶34的驅動,朝圖6中的單個箭頭呈示之方向依序輸送附切隙的積層體10b。當附切隙的積層體10b之切除片11a部分到達噴射部52的設置位置時,按壓固定部33朝輸送帶34進出。因此,藉由按壓固定部33按壓附切隙的積層體10b之切隙11b的周圍而固定附切隙的積層體10b之位置,並以此狀態使噴射部52朝向切除片11a噴射流體。藉由將噴射到流體的切除片11a從輸送帶34的帶孔34c中輸送移除至輸送部51之外,可得開洞積層體10c。用輸送帶34連續或間歇地輸送所得的開洞積層體10c(圖6)。
In the hole forming step, the laminate with
用噴射部52的噴射切除片11a可在連續輸送附切隙的積層體10b時同時進行,也可在間歇輸送附切隙的積層體10b並停止輸送附切隙的積層體10b之停止期間進行。當由噴射部52對切除片11a噴射流體時,如間歇進行附切隙的積層體10b之按壓固定時,係在以按壓固定部33適切地固定附切隙的積層體10b之狀態,適切地在切除片11a上噴射流體的方式,間歇進行附切隙的積層體10b的輸送,並較佳為在暫時停止輸送的停止期間進行用按壓固定部33的按壓固定及用噴射部52的噴射流體。此時,附切隙的積層體10b或開洞積層體10c的輸送較佳為進行用按壓固定部33的按壓或用噴射部52噴射流體。
The ejection of the
如圖6所示,根據本實施型態因輸送附切隙的積層體10b時可同時藉由流體的噴射而去除切除片11a,故可有效進行孔洞的形成步驟。
As shown in FIG6 , according to this embodiment, the
在圖6呈示的製造裝置中,雖然噴射部52係設在輸送帶34的上部,但只要可按壓輸送帶34上的附切隙的積層體10b的切除片11a,其位置即無特別的限制。例如,可設在輸送帶34的下部。如噴射部設在輸送帶34的下部時,將按壓固定部也較佳為設在輸送帶34的下部。
In the manufacturing device shown in FIG. 6, although the
在圖6呈示的製造裝置中,雖然係特別將可噴射流體的噴射部2設在切除片11a上,但只要可賦予外力從附切隙的積層體10b去除切除片11a,即無限制。例如,可以在和附切隙的積層體10b之輸送方向垂直的方向之沿線設置噴射部,而將流體噴射在切除片11a及其周圍的方式為之。在圖6呈示的製造裝置中,雖然係列舉將噴射部設在輸送帶上的特定位置為例說明,但噴射部也可設成和附切隙的積層體10b之輸送同步移動。
In the manufacturing device shown in FIG6, although the ejection part 2 capable of ejecting fluid is specially arranged on the
在圖6呈示的製造裝置中,雖然係列舉使用2個按壓棒作為按壓固定部33的情況為例說明,但也可如之前的實施型態中說明的,只要可按壓切隙
11b的周圍者,即無特別限制按壓棒之數或形狀等,可使用一個按壓棒,也可設置圍繞切隙11b的周圍之環繞形狀的按壓固定部。
In the manufacturing device shown in FIG. 6, although two pressing rods are used as the pressing fixing
可使用可固定附切隙的積層體10b之位置的固定部取代按壓固定部33。例如,可設置用以抽吸固定附切隙的積層體10b之位置用的抽吸固定部(固定部)取代按壓固定部33。此外,如可充分進行固定附切隙的積層體10b之位置時,也可不設置固定部。
A fixing portion that can fix the position of the
如之前的實施型態中之說明,圖6呈示的製造裝置可在附切隙的積層體10b之輸送方向上游側,具備為在材料積層體10a的積層方向形成切隙11b用之沖壓刀片。因此,可由材料積層體10a獲得附切隙的積層體10b,並連續或間歇輸送所得的附切隙的積層體10b而進行形成孔洞之步驟。
As described in the previous embodiment, the manufacturing device shown in FIG6 can be provided with a punching blade for forming the
圖6呈示的製造裝置上,可設置為收集由輸送部51去除的切除片11a用之收集部,可設置為將切除片11a排出至製造裝置之外的切除片排出部。
The manufacturing device shown in FIG6 may be provided with a collecting section for collecting the excised
〔實施型態4〕 [Implementation Type 4]
本實施型態中也和之前的實施型態說明之開洞積層體、附切隙的積層體及材料積層體相同的列舉開洞積層體、附切隙的積層體及材料積層體為偏光板的情況為例說明。以下主要說明與之前的實施型態中說明之處不同之處,並且省略與之前的實施型態中說明的相同處。 In this embodiment, the same hole-opening laminate, slit-attached laminate, and material laminate described in the previous embodiment are also listed as an example of a case where the hole-opening laminate, slit-attached laminate, and material laminate are polarizing plates. The following mainly describes the differences from the previous embodiment, and omits the same points as the previous embodiment.
圖7係示意性呈示本實施型態的開洞積層體之製造裝置的另一例之示意圖。在本實施型態的開洞積層體之製造裝置中,係使用在一組夾輥之間設有噴射部的製造裝置(圖6),取代之前的實施型態中使用的輸送帶34上設有噴射部52(圖6)之製造裝置,係在進行孔洞形成步驟中與之前的實施型態不同
之處。
FIG. 7 is a schematic diagram schematically showing another example of the manufacturing device of the open-hole laminated body of the present embodiment. In the manufacturing device of the open-hole laminated body of the present embodiment, a manufacturing device with a spraying part between a set of rollers (FIG. 6) is used, replacing the manufacturing device with a spraying part 52 (FIG. 6) on the
圖7呈示的製造裝置具備為連續或間歇性輸送附切隙的積層體10b用的輸送部51,以及用以在附切隙的積層體10b上之切除片11a施加噴射流體的力(外力)而從附切隙的積層體10b上噴射去除切除片11a之噴射部52。噴射部52係為從由輸送部61輸送的附切隙的積層體10b去除切除片11a而形成孔洞11c之用者。噴射部52係以面對由輸送部61輸送的附切隙的積層體10b的方式設在輸送部61之上部。
The manufacturing device shown in FIG7 has a conveying
輸送部61係從附切隙的積層體10b之輸送方向上游側依序具備第1輸送帶62a(輸送帶)、一組夾輥63a、63b(輸送輥)與第2輸送帶62b(輸送帶)。第1輸送帶62a係輸送附切隙的積層體10b,第2輸送帶62b係輸送通過一組夾輥63a、63b之附切隙的積層體10b或輸送已從附切隙的積層體10b去除切除片11a的開洞積層體10c(圖7)。
The conveying
一組夾輥63a、63b分別具有1對輥,以附切隙的積層體10b夾在此1對輥之間的狀態輸送之同時在噴射部52對切除片11a上噴射流體時,可作為固定附切隙的積層體10b之位置的固定部之功能。一組的夾輥63a、63b係以不按壓可輸送的附切隙的積層體10b的切隙11b的方式,以一定的間隔並排在夾輥63a、63b之軸方向(與附切隙的積層體10b之輸送方向垂直的方向)(圖7)。夾輥63a、63b上係以1對的輥之至少一方賦有驅動力為佳。
A set of clamping
噴射部52係例如圖7呈示的,以可對通過一組的夾輥63a、63b之間的附切隙的積層體10b的切除片11a噴射流體的方式,設在一組的夾輥63a、63b之間的上部。噴射部52係可對切除片11a噴射空氣或氮氣、稀有氣體等氣體或水等液體等流體者,以可噴射壓縮空氣者為佳。噴射部52可具備例如噴射噴
嘴,可藉由調節噴射噴嘴的大小而將流體僅噴射到切除片11a或切除片11a和其周圍上。
The spraying
在孔洞形成步驟中,可藉由第1輸送帶62a的驅動而依序朝圖7的一箭頭呈示之方向輸送附切隙的積層體10b。當附切隙的積層體10b到達一組夾輥63a、63b的位置時,用第1輸送帶62a及一組夾輥63a、63b輸送。當附切隙的積層體10b的切除片11a部分藉由此輸送而到達一組的夾輥63a、63b之位置時,藉由從噴射部52上的噴射流體之力,從一組的夾輥63a、63b之間去除到輸送部61之外部的結果,可得開洞積層體10c。所得的開洞積層體10c(圖7)可由一組的夾輥63a、63b或第2輸送帶62b連續或間歇地輸送。
In the hole forming step, the laminate 10b with cutouts can be sequentially conveyed in the direction indicated by an arrow in FIG. 7 by driving the
藉由噴射部52對切除片11a的噴射流體,可在連續輸送附切隙的積層體10b時同時進行,也可間歇輸送附切隙的積層體10b,在停止間歇輸送附切隙的積層體10b之停止期間進行。在圖7呈示的製造裝置中,由於一組的夾輥63a、63b可在挾持附切隙的積層體10b而固定位置的同時輸送,故可在連續進行附切隙的積層體10b之輸送同時進行由噴射部52的流體噴射。如此即可在孔洞形成步驟中,用一組的夾輥63a、63b連續或間歇輸送附切隙的積層體10b同時去除切除片11a。
The fluid spraying of the excised
如圖7所示,根據本實施型態,因可在輸送附切隙的積層體10b同時由流體的噴射而去除切除片11a,故可有效地進行孔洞形成步驟。
As shown in FIG. 7, according to this embodiment, the hole forming step can be effectively performed because the
在圖7呈示的製造裝置中,雖然噴射部52係設在一組夾輥63a、63b間之上方,但也可將噴射部設在一組夾輥63a、63b間之下方。
In the manufacturing device shown in FIG. 7, although the spraying
如之前的實施型態中說明,圖7呈示的製造裝置可在附切隙的積層體10b之輸送方向上游側,具備為在材料積層體10a的積層方向形成切隙11b
用之沖壓刀片。因此,可由材料積層體10a獲得附切隙的積層體10b,並連續或間歇輸送所得的附切隙的積層體10b而進行孔洞形成步驟。
As described in the previous embodiment, the manufacturing device shown in FIG. 7 can be provided with a punching blade for forming the
如之前的實施型態中說明,在圖7呈示的製造裝置可設置為收集由輸送部51去除的切除片11a用之收集部,可設置為將切除片11a排出至製造裝置外部的切除片排出部。收集部及切除片排出部可設在例如一組的夾輥63a、63b間。
As described in the previous embodiment, the manufacturing device shown in FIG. 7 can be provided as a collecting section for collecting the excised
以上雖然係說明本發明的實施型態,但本發明並不侷限於此等實施型態,也可組合實施上述各實施型態的各結構及各步驟。以下詳細說明所有實施型態中共通的各事項或上述實施型態的變形例等。 Although the above is an explanation of the implementation of the present invention, the present invention is not limited to these implementations, and the structures and steps of the above implementations can also be implemented in combination. The following details the common matters in all implementations or the variations of the above implementations.
(開洞積層體的製造方法) (Manufacturing method of open-cell laminate)
如上述,本發明的製造方法係包括製備附切隙的積層體之步驟和形成孔洞的步驟。 As described above, the manufacturing method of the present invention includes the steps of preparing a laminate with cutouts and forming holes.
前述的製備步驟,可包括在材料積層體的積層方向藉由沖壓刀片的沖壓而形成切隙的操作作為獲得附切隙的積層體之操作。 The aforementioned preparation steps may include an operation of forming a slit in the lamination direction of the material laminate by punching with a punching blade as an operation for obtaining a laminate with a slit.
通常係藉由在前述切除片上施加外力而形成前述孔洞。前述外力係藉由按壓構件按壓前述切除片之力、抽吸前述切除片之抽吸力及將流體噴射在前述切除片上之力中的至少1種。 The hole is usually formed by applying an external force to the cut piece. The external force is at least one of a force of pressing the cut piece by a pressing member, a suction force of sucking the cut piece, and a force of spraying a fluid on the cut piece.
形成前述孔洞的步驟中,典型上係藉由輸送帶、輸送輥及旋轉台中的至少1種而輸送前述附切隙的積層體。 In the step of forming the aforementioned hole, the aforementioned layered body with the cutout is typically transported by at least one of a conveyor belt, a conveyor roller, and a rotating table.
形成前述孔洞的步驟中,可間歇輸送前述附切隙的積層體,並在停止輸送前述附切隙的積層體期間去除前述切除片。 In the step of forming the aforementioned hole, the aforementioned laminate with the cutout gap may be transported intermittently, and the aforementioned excised piece may be removed during the period of stopping the transport of the aforementioned laminate with the cutout gap.
形成前述孔洞的步驟可在從附切隙的積層體去除切除片之後,進一步包括輸送由該去除操作而得的開洞積層體之操作。 The step of forming the aforementioned hole may further include the operation of transporting the hole-opening laminate obtained by the removal operation after removing the cut piece from the laminate with the cut gap.
(開洞積層體的製造裝置) (Device for manufacturing porous laminated bodies)
本發明的開洞積層體之製造裝置具備用以連續或間歇輸送附切隙的積層體10b用之輸送部,和藉由從輸送部輸送的附切隙的積層體10b去除由切隙11b形成的切除片11a而形成孔洞11c之孔洞形成部。
The manufacturing device of the hole-opening laminate of the present invention has a conveying part for continuously or intermittently conveying the laminate 10b with cutouts, and a hole forming part for forming
如之前的實施型態中之說明,本發明的製造裝置可在附切隙的積層體10b之輸送方向上游側上設置由材料積層體10a而得的附切隙的積層體10b之機構。該機構可為在材料積層體10a的積層方向具備形成切隙11b用之沖壓刀片。
As described in the previous embodiment, the manufacturing device of the present invention can be provided with a mechanism for forming a
輸送部上典型上可設置輸送附切隙的積層體10b用之輸送帶、輸送輥及旋轉台之中的至少1種。 The conveying section may typically be provided with at least one of a conveying belt, a conveying roller, and a rotating table for conveying the laminate 10b with cutouts.
在上述的實施型態之開洞積層體(開洞積層體)的製造裝置中,雖然係列舉在搬送部設置輸送帶的情形(第4至6圖)、設置輸送帶與輸送輥的情形(圖7)為例說明,但並不限於此。也可使用輸送輥或旋轉台取代輸送帶,也可將此等做任意的組合。 In the manufacturing device of the open hole laminate (open hole laminate) of the above-mentioned embodiment, although the case where a conveyor belt is provided in the conveying part (Figures 4 to 6) and the case where a conveyor belt and a conveyor roller are provided (Figure 7) are cited as examples for explanation, it is not limited to this. A conveyor roller or a rotating table may be used instead of a conveyor belt, and these may be combined arbitrarily.
此外,輸送部上也可設置固定台和輸送臂,用輸送臂將承載在固定台上的附切隙的積層體或開洞積層體抬起而輸送至另一固定台上。 In addition, a fixed table and a conveying arm can also be provided on the conveying section, and the conveying arm can be used to lift the laminated body with cutouts or the laminated body with holes carried on the fixed table and convey it to another fixed table.
輸送部可輸送的附切隙的積層體或開洞積層體可單獨的輸送,也可用積層有2層以上的狀態輸送。用積層有2層以上的積層體或開洞積層體之狀態輸送時,上述的孔洞形成步驟也可用此種積層狀態進行。 The conveying unit can convey the laminated body with cutouts or the laminated body with holes, either individually or in a state where two or more layers are laminated. When the laminated body with two or more layers or the laminated body with holes is conveyed, the above-mentioned hole forming step can also be performed in this laminated state.
孔洞形成部包含例如為藉由釘銷等按壓構件按壓用之按壓部、抽吸切除片用之抽吸部及為在切除片上噴射流體用之噴射部中的至少一種。 The hole forming part includes at least one of a pressing part for pressing by a pressing member such as a nail, a suction part for sucking the cut piece, and a spraying part for spraying a fluid on the cut piece.
上述的實施型態之製造裝置可在從附切隙的積層體去除切除片後之開洞積層體的輸送方向下游側上,設置進行開洞積層體的孔洞之研磨的立銑刀等等切削工具。此時,在孔洞形成步驟之後,藉由使用切削工具研磨從附切隙的積層體去除切除部後之開洞積層體的孔洞,可改善孔洞的加工品質或尺寸精度。 The manufacturing device of the above-mentioned embodiment can be provided with a cutting tool such as a milling cutter for grinding the hole of the holed laminated body on the downstream side of the conveying direction of the holed laminated body after the cut-off piece is removed from the cut-off laminated body. At this time, after the hole forming step, the processing quality or dimensional accuracy of the hole can be improved by grinding the hole of the holed laminated body after the cut-off portion is removed from the cut-off laminated body with the cut-off portion using the cutting tool.
上述的實施型態之製造裝置在從附切隙的積層體去除切除片後的開洞積層體之輸送方向下游側,也可具備用以檢查是否已去除切除片之檢查部。檢查部係作成例如用相機等攝取開洞積層體的孔洞狀態而可檢查切除片的去除狀態者。檢查部可在用上述的切削工具進行研磨之前進行,也可在研磨之後進行。 The manufacturing device of the above-mentioned embodiment may also be provided with an inspection unit for checking whether the cut pieces have been removed on the downstream side of the conveying direction of the holed laminated body after the cut pieces have been removed from the laminated body with the cutout. The inspection unit is configured to inspect the removal state of the cut pieces by, for example, photographing the hole state of the holed laminated body with a camera. The inspection unit may be performed before grinding with the above-mentioned cutting tool or after grinding.
上述的實施型態之製造裝置上,在從附切隙的積層體去除切除片後之開洞積層體的輸送方向下游側上,也可具備為去除附著在開洞積層體的表面上之異物等用之裝置(膠黏輥等)。該裝置可設在檢查部的開洞積層體之輸送方向的下游側,也可設在輸送方向的上游側。 The manufacturing device of the above-mentioned embodiment may also be provided with a device (such as an adhesive roller) for removing foreign matter attached to the surface of the holed laminate after the cut piece is removed from the laminate with the cutout. The device may be provided on the downstream side of the holed laminate in the conveying direction of the inspection unit, or on the upstream side of the conveying direction.
(材料積層體) (Material layer)
在上述的實施型態中,雖然係列舉材料積層體為直線偏光板的情形為例說明,但並不限於此。材料積層體雖然只要係具有一層以上的樹脂膜層與一層以上的貼合層者,即不特別限制其結構或積層數,但以貼合層的兩面設有樹脂膜層為佳。例如,材料積層體可以係積層有光學層(樹脂膜層)與貼合層者,可以 係積層有光學層以外的樹脂膜層和貼合層者,也可以係積層有光學層以外的樹脂膜層、光學層和貼合層者。 In the above-mentioned implementation form, although the case where the material laminate is a linear polarizer is cited as an example for explanation, it is not limited to this. Although the material laminate has no particular restrictions on its structure or number of layers as long as it has one or more resin film layers and one or more bonding layers, it is preferred that the resin film layers are provided on both sides of the bonding layer. For example, the material laminate may be a laminate having an optical layer (resin film layer) and a bonding layer, a laminate having a resin film layer other than an optical layer and a bonding layer, or a laminate having a resin film layer other than an optical layer, an optical layer, and a bonding layer.
材料積層體上使用的光學層可列舉例如直線偏光片(偏光片)、相位差膜、增亮膜、防眩膜、抗反射膜、擴散膜、聚光膜等。此等光學層可僅使用1種,也可將2種以上組合使用。具有光學層的材料積層體可列舉直線偏光片的一面或兩面上隔著貼合層而具有保護膜的直線偏光板。含有光學層的材料積層體可進一步具有貼合在顯示面板或顯示元件等其他的構件上用之貼合層及塗布保護此貼合層的剝離膜(樹脂膜層)。 Optical layers used on the material laminate include, for example, linear polarizers (polarizers), phase difference films, brightness enhancement films, anti-glare films, anti-reflection films, diffusion films, and focusing films. Such optical layers may be used alone or in combination of two or more. A material laminate having an optical layer includes a linear polarizer having a protective film on one or both sides of the linear polarizer with a bonding layer interposed therebetween. The material laminate containing the optical layer may further include a bonding layer for bonding to other components such as a display panel or a display element, and a release film (resin film layer) for coating and protecting the bonding layer.
不具有光學層的材料積層體可列舉例如積層在偏光板等光學膜的外面之防護膜(表面保護膜)等。防護膜係依序積層有例如基材膜(樹脂膜層)、貼合層、剝離膜(樹脂膜層)者。 Examples of material laminates without optical layers include protective films (surface protective films) laminated on the outside of optical films such as polarizing plates. Protective films are laminated in order, for example, with a base film (resin film layer), a bonding layer, and a release film (resin film layer).
材料積層體的具體例除了上述偏光板、防護膜以外,可列舉具有偏光板與防護膜之附防護膜的偏光板、具有直線偏光板與相位差膜的圓偏光板等。圓偏光板上使用的相位差膜可列舉λ/2層、λ/4層、逆波長分散性的λ/4層、正C層等。圓偏光板的層結構可列舉例如包含依序積層直線偏光板、貼合層、λ/2層、貼合層及λ/4層者、依序積層直線偏光板、貼合層、逆波長分散性的λ/4層、貼合層及正C層者、與依序積層直線偏光板、貼合層、正C層、貼合層及逆波長分散性的λ/4層者。相位差膜可以係樹脂膜,也可以係聚合性液晶化合物的硬化膜。 Specific examples of the material laminate include, in addition to the above-mentioned polarizing plate and protective film, a polarizing plate with a protective film having a polarizing plate and a protective film, a circular polarizing plate having a linear polarizing plate and a retardation film, etc. The retardation film used in the circular polarizing plate includes a λ/2 layer, a λ/4 layer, a λ/4 layer with reverse wavelength dispersion, a positive C layer, etc. The layer structure of the circular polarizing plate may include, for example, a linear polarizing plate, a laminating layer, a λ/2 layer, a laminating layer, and a λ/4 layer laminated in sequence, a linear polarizing plate, a laminating layer, a λ/4 layer with reverse wavelength dispersion, a laminating layer, and a positive C layer laminated in sequence, and a linear polarizing plate, a laminating layer, a positive C layer, a laminating layer, and a λ/4 layer with reverse wavelength dispersion laminated in sequence. The phase difference film may be a resin film or a cured film of a polymerizable liquid crystal compound.
(附切隙的積層體) (Laminar body with cutouts)
在上述的實施型態中,雖然係列舉附切隙的積層體為直線偏光板的情形為 例說明,但並不侷限於此。附切隙的積層體之層結構可列舉具有和上述的材料積層體相同之層結構者。上述的材料積層體上,藉由材料積層體朝積層方向貫穿而形成切隙,可得附切隙的積層體。 In the above-mentioned embodiment, although the case where the laminate with notches is a linear polarizer is cited as an example for explanation, it is not limited to this. The layer structure of the laminate with notches can be cited as having the same layer structure as the above-mentioned material laminate. On the above-mentioned material laminate, the notches are formed by penetrating the material laminate in the lamination direction, and the laminate with notches can be obtained.
附切隙的積層體並無特別的限制,可列舉例如片狀體的積層體。 There is no particular limitation on the laminated body with cutouts, and examples thereof include laminated bodies.
作為附切隙的積層體之一例,可列舉依序積層基材膜、前述貼合層及前述剝離膜之積層體、或積層在直線偏光片的一面或兩面上具有前述保護膜的偏光板之積層體。 As an example of a laminate with a cutout, there can be cited a laminate in which a base film, the aforementioned laminating layer, and the aforementioned peeling film are laminated in sequence, or a laminate in which a polarizing plate having the aforementioned protective film laminated on one or both sides of a linear polarizer is laminated.
(開洞積層體) (Open hole layer)
在上述的實施型態中,雖然係列舉開洞積層體為偏光板的情況為例說明,但並不限於此。開洞積層體的層結構可列舉具有與上述的材料積層體或上述的附切隙的積層體相同的層結構者。藉由從上述的附切隙的積層體去除切除片,可得開洞積層體。 In the above-mentioned embodiment, although the case where the hole-opening laminate is a polarizing plate is cited as an example for explanation, it is not limited to this. The layer structure of the hole-opening laminate can be cited as having the same layer structure as the above-mentioned material laminate or the above-mentioned laminate with cutouts. The hole-opening laminate can be obtained by removing the cutout piece from the above-mentioned laminate with cutouts.
孔洞之徑係以1mm以上為佳,可以係3mm以上,可以係5mm以上,也可以係7mm以上,以20mm以下為佳,可以係18mm以下,可以係15mm以下,也可以係12mm以下。 The hole diameter is preferably 1mm or more, and can be 3mm or more, 5mm or more, or 7mm or more. It is preferably 20mm or less, and can be 18mm or less, 15mm or less, or 12mm or less.
開洞積層體在例如具備直線偏光片作為光學層的情況時等,可適用於液晶顯示裝置或有機電致發光(EL)顯示裝置等顯示裝置上而使用。藉由在可配置智慧型手機或平板終端等的顯示裝置的相機鏡頭之區域或可印刷圖像或標誌的區域上配置開洞積層體之孔洞,可以直線偏光片不配置在此等區域上的方式為之。 The hole-forming laminate can be used in display devices such as liquid crystal display devices or organic electroluminescent (EL) display devices when a linear polarizer is used as an optical layer. By arranging holes in the hole-forming laminate in the area where the camera lens of a display device such as a smartphone or tablet terminal can be arranged or in the area where an image or logo can be printed, it is possible to achieve this in a manner where a linear polarizer is not arranged in such an area.
(直線偏光片) (Linear polarizer)
直線偏光片係具有從自然光中選擇性通過某一方向的直線偏之功能的層或膜。直線偏光片可列舉例如在以單軸或二軸延伸的聚乙烯醇系樹脂膜上吸附定向有二色性色素之膜。二色性色素可列舉碘、二色性有機染料等。此外,直線偏光片可以係在基材膜上塗布熔致液晶態(lyotropic liquid crystal)的二色性染料,並定向固定化之塗布型偏光膜。 A linear polarizer is a layer or film that has the function of selectively passing a linear polarization in a certain direction from natural light. Examples of linear polarizers include films on which dichroic pigments are adsorbed and oriented on a polyvinyl alcohol resin film that is uniaxially or biaxially extended. Examples of dichroic pigments include iodine and dichroic organic dyes. In addition, a linear polarizer can be a coating-type polarizing film in which a dichroic dye in a lyotropic liquid crystal state is coated on a substrate film and oriented and fixed.
直線偏光片的厚度可作成40μm以下,以30μm以下為佳(例如20μm以下,15μm以下更佳,10μm以下或8μm以下又更佳)。直線偏光片的厚度通常係2μm以上。 The thickness of the linear polarizer can be made below 40μm, preferably below 30μm (for example, below 20μm, below 15μm is better, below 10μm or below 8μm is even better). The thickness of the linear polarizer is usually above 2μm.
(保護膜) (Protective film)
設在直線偏光片的單面或兩面上的保護膜,只要係可透光之樹脂膜即無限制。樹脂膜之例可列舉由環狀聚烯烴系樹脂膜、如三乙醯纖維素、二乙醯纖維素的樹脂形成之乙酸纖維素系樹脂膜、如聚對苯二甲酸乙二酯、聚對萘二甲酸乙二酯、聚對苯二甲酸丁二酯的樹脂形成之聚酯系樹脂膜、聚碳酸酯系樹脂膜、(甲基)丙烯酸系樹脂膜、聚丙烯系樹脂膜等該領域中已知之膜。從薄型化的觀點,保護膜的厚度通常係300μm以下,以200μm以下為佳,100μm以下更佳,此外,通常係5μm以上,以20μm以上為佳。保護膜可具有相位差特性或改善亮度等光學功能,也可不具有。具有相位差特性的保護膜可藉由將例如從上述材料形成之透明樹脂膜延伸(一軸延伸或二軸延伸等)或在該膜上形成液晶層等,賦予任意的相位差值而得。 The protective film provided on one or both sides of the linear polarizer is not limited as long as it is a light-transmitting resin film. Examples of resin films include cyclic polyolefin resin films, cellulose acetate resin films formed from resins such as triacetyl cellulose and diacetyl cellulose, polyester resin films formed from resins such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate, polycarbonate resin films, (meth) acrylic resin films, polypropylene resin films, and other films known in the field. From the perspective of thinning, the thickness of the protective film is usually 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less. In addition, it is usually 5 μm or more, and preferably 20 μm or more. The protective film may or may not have optical functions such as phase difference characteristics or brightness improvement. The protective film having phase difference characteristics can be obtained by extending a transparent resin film formed from the above-mentioned materials (uniaxial extension or biaxial extension, etc.) or forming a liquid crystal layer on the film, etc., to give an arbitrary phase difference value.
保護膜可以係形成有硬塗層者。硬塗層可形成在由上述材料形成 的透明樹脂膜之一面上,也可形成在兩面上。藉由設置硬塗層可作成提高硬度及耐刮擦性的保護膜。硬塗層係例如紫外線硬化型樹脂的硬化層。紫外線硬化型樹脂可列舉例如丙烯酸系樹脂、有機矽系樹脂、聚酯系樹脂、聚胺酯系樹脂、醯胺系樹脂、環氧系樹脂等。硬塗層也可含有添加劑以提高強度。添加劑並無限制,可列舉無機系微粒、有機系微粒或此等的混合物。 The protective film may be formed with a hard coating. The hard coating may be formed on one side of the transparent resin film formed of the above-mentioned material, or may be formed on both sides. By providing a hard coating, a protective film with improved hardness and scratch resistance can be made. The hard coating is, for example, a hardened layer of a UV-curable resin. Examples of UV-curable resins include acrylic resins, organic silicone resins, polyester resins, polyurethane resins, amide resins, and epoxy resins. The hard coating may also contain additives to increase strength. The additives are not limited, and may include inorganic particles, organic particles, or mixtures thereof.
(防護膜) (Protective film)
防護膜係如上述的具有基材膜、貼合層與剝離膜。構成基材膜的樹脂並無特別的限制,可以係例如聚乙烯的聚乙烯系樹脂、如聚丙烯的聚丙烯系樹脂、如聚對苯二甲酸乙二酯或聚萘二甲酸乙二酯的聚酯系樹脂、聚碳酸酯系樹脂等熱可塑性樹脂。以使用聚對苯二甲酸乙二酯等聚酯系樹脂為佳。 The protective film has a base film, a laminating layer and a peeling film as described above. The resin constituting the base film is not particularly limited, and can be a thermoplastic resin such as polyethylene resin such as polyethylene, polypropylene resin such as polypropylene, polyester resin such as polyethylene terephthalate or polyethylene naphthalate, polycarbonate resin, etc. It is preferred to use polyester resins such as polyethylene terephthalate.
剝離膜可列舉在從聚乙烯等聚乙烯系樹脂、聚丙烯等聚丙烯系樹脂、聚對苯二甲酸乙二酯等聚酯系樹脂形成之膜上用矽膠塗料等施加離型處理者。 The release film may be a film formed from polyethylene resins such as polyethylene, polypropylene resins such as polypropylene, polyester resins such as polyethylene terephthalate, etc., and subjected to release treatment using silicone coating or the like.
(貼合層) (bonding layer)
貼合層可以為由黏著劑形成的黏著劑層,也可以為由接著劑形成的接著劑層。如上述,當含有黏著劑層作為貼合層時,有容易使切除片11a殘存在附切隙的積層體10b之傾向。因此,上述的各實施型態之製造方法及製造裝置可適用於材料積層體、附切隙的積層體及開洞積層體具有黏著劑層作為貼合層的情況。
The bonding layer can be an adhesive layer formed by an adhesive or an adhesive layer formed by an adhesive. As mentioned above, when an adhesive layer is included as a bonding layer, there is a tendency that the
黏著劑層所使用的黏著劑可使用將(甲基)丙烯酸系樹脂、有機矽 系樹脂、聚酯系樹脂、聚胺酯系樹脂、聚醚系樹脂等作成基礎聚合物者。其中從透明性、黏著性、可靠性、耐候性、耐熱性、修整加工性等觀點,係以(甲基)丙烯酸系黏著劑為佳。(甲基)丙烯酸系黏著劑中,係將具有甲基、乙基、正-、異-或第三丁基等碳數20以下的烷基之(甲基)丙烯酸烷酯與(甲基)丙烯酸或含有(甲基)烯酸羥基乙酯等官能基的(甲基)丙烯酸系單體,以玻璃轉移溫度成為25℃以下為佳,成為0℃以下更佳的的方式調配成重量平均分子量為10萬以上的(甲基)丙烯酸系樹脂用作為基礎聚合物。 The adhesive used in the adhesive layer may be one using (meth)acrylic resins, organic silicone resins, polyester resins, polyurethane resins, polyether resins, etc. as base polymers. Among them, (meth)acrylic adhesives are preferred from the viewpoints of transparency, adhesion, reliability, weather resistance, heat resistance, and finishing processability. In the (meth)acrylic adhesive, (meth)acrylic alkyl esters having an alkyl group with a carbon number of 20 or less such as methyl, ethyl, n-, iso-, or t-butyl and (meth)acrylic acid or (meth)acrylic monomers containing functional groups such as (meth)acrylic acid hydroxyethyl ester are mixed in a manner such that the glass transition temperature is preferably below 25°C, and more preferably below 0°C, to form a (meth)acrylic resin having a weight average molecular weight of 100,000 or more as the base polymer.
黏著劑層的厚度雖然係取決於其接著力等,但以1μm以上50μm以下的範圍為適當,2μm以上40μm以下為較佳。 The thickness of the adhesive layer depends on its adhesion, etc., but it is appropriate to be in the range of 1μm to 50μm, and preferably in the range of 2μm to 40μm.
接著劑層上使用的接著劑層可列舉硬化性樹脂成分已溶解或分散於水中的已知之水性組成物(包含水性接著劑。)及含有活性能量線硬化性化合物的已知之活性能量線硬化性組成物(包含活性能量線硬化性接著劑。)等。 The adhesive layer used in the adhesive layer includes known water-based compositions (including water-based adhesives) in which the curable resin component is dissolved or dispersed in water and known active energy ray-curable compositions (including active energy ray-curable adhesives) containing active energy ray-curable compounds.
水性組成物中含有的樹脂成分可列舉聚乙烯醇系樹脂或聚胺酯樹脂等。活性能量線硬化性組成物係藉由紫外線、可見光、電子束、X射線等活性能量線的照射而硬化之組成物。藉由活性能量線的照射而硬化之組成物係以紫外線硬化性組成物為佳,以含有由陽離子聚合而硬化的環氧系化合物作為硬化性成分更佳。 The resin component contained in the water-based composition may include polyvinyl alcohol resin or polyurethane resin. The active energy ray-curable composition is a composition that is cured by irradiation with active energy rays such as ultraviolet rays, visible light, electron beams, and X-rays. The composition that is cured by irradiation with active energy rays is preferably an ultraviolet ray-curable composition, and more preferably contains an epoxy compound that is cured by cationic polymerization as a curing component.
接著劑層的厚度並無特別的限制,以1μm以上50μm以下的範圍為適當,以2μm以上40μm以下為佳。 There is no particular restriction on the thickness of the adhesive layer. The appropriate range is 1 μm to 50 μm, and the best range is 2 μm to 40 μm.
上述的開洞積層體可適用於例如顯示裝置上。將開洞積層體適用在顯示裝置上時,可單獨將開洞積層體、或開洞積層體和前面板或背面板積層,作成光學積層體而適用於顯示裝置上。 The above-mentioned open hole laminate can be applied to, for example, a display device. When the open hole laminate is applied to a display device, the open hole laminate alone, or the open hole laminate and the front panel or back panel laminate can be made into an optical laminate and applied to the display device.
光學積層體具有前面板或背面板,並且開洞積層體含有直線偏光片或相位差膜等光學層時,光學積層體可依序具有前面板、開洞積層體及背面板。 When the optical laminate has a front panel or a back panel, and the open-hole laminate contains an optical layer such as a linear polarizer or a phase difference film, the optical laminate may have a front panel, an open-hole laminate, and a back panel in sequence.
(前面板) (Front panel)
前面板係構成顯示裝置的觀看側之最表面,可具有保護顯示裝置的前面(畫面)之功能。前面板係以可透光的板狀體為佳。前面板可僅由1層構成,也可由2層以上構成。前面板可具有截止藍光功能、調節視角功能等。 The front panel is the outermost surface of the viewing side of the display device and can protect the front (screen) of the display device. The front panel is preferably a light-transmitting plate. The front panel can be composed of only one layer or more than two layers. The front panel can have the function of cutting off blue light, adjusting the viewing angle, etc.
前面板可列舉例如玻璃製的板狀體(玻璃板、可撓性薄質玻璃等)、樹脂製的板狀體(樹脂板、樹脂片、樹脂膜(也可稱為窗膜)等),以呈示可撓性的板狀體為佳。上述之中,係以樹脂膜等樹脂製的板狀體為佳。 The front panel may be a glass plate (glass plate, flexible thin glass, etc.), a resin plate (resin plate, resin sheet, resin film (also called window film), etc.), and a plate showing flexibility is preferred. Among the above, a resin plate such as a resin film is preferred.
樹脂製的板狀體可列舉由熱塑性樹脂形成之樹脂膜。熱塑性樹脂可列舉鏈狀聚烯烴系樹脂(聚乙烯系樹脂、聚丙烯系樹脂、聚甲基戊烯系樹脂等)、環狀聚烯烴系樹脂(降冰片烯系樹脂等)等聚烯烴系樹脂;三乙醯纖維素等纖維素系樹脂;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂;聚碳酸酯系樹脂;乙烯-乙酸乙烯酯系樹脂;聚苯乙烯系樹脂;聚醯胺系樹脂;聚醚醯亞胺系樹脂;聚(甲基)丙烯酸甲酯樹脂等(甲基)丙烯酸系樹脂;聚醯亞胺系樹脂;聚醚碸系樹脂;聚碸系樹脂;聚氯乙烯系樹脂;聚偏二氯乙烯系樹脂;聚乙烯醇系樹脂;聚乙烯縮醛系樹脂;聚醚酮系樹脂;聚醚醚酮系樹脂;聚醚碸系樹脂;聚醯胺醯亞胺系樹脂等。 Examples of the resin plate-like body include resin films formed of thermoplastic resins. Examples of the thermoplastic resins include polyolefin resins such as chain polyolefin resins (polyethylene resins, polypropylene resins, polymethylpentene resins, etc.) and cyclic polyolefin resins (norbornene resins, etc.); cellulose resins such as triacetyl cellulose; polyester resins such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate; polycarbonate resins; ethylene-vinyl acetate resins; Polystyrene resins; polyamide resins; polyetherimide resins; polymethyl (meth)acrylate resins, etc. (meth)acrylic resins; polyimide resins; polyethersulfone resins; polysulfone resins; polyvinyl chloride resins; polyvinylidene chloride resins; polyvinyl alcohol resins; polyvinyl acetal resins; polyetherketone resins; polyetheretherketone resins; polyethersulfone resins; polyamideimide resins, etc.
熱塑性樹脂可單獨或混合2種以上使用。 Thermoplastic resins can be used alone or as a mixture of two or more.
其中,從可撓性、強度及透明性的觀點,構成前面板的熱塑性樹脂可適用 聚醯亞胺系樹脂、聚醯胺系樹脂、聚醯胺醯亞胺系樹脂。 Among them, from the viewpoints of flexibility, strength and transparency, the thermoplastic resin constituting the front panel can be applied to polyimide resin, polyamide resin, and polyamide imide resin.
前面板可以在基材膜的至少一面上設置硬塗層而進一步改善硬度之膜。基材膜可使用上述之樹脂膜。 The front panel can be provided with a hard coating layer on at least one side of the base film to further improve the hardness of the film. The base film can use the above-mentioned resin film.
硬塗層可形成在基材膜的一面上,也可形成在兩面上。可藉由設置硬塗層而改善硬度及耐刮擦性。硬塗層的厚度可以係例如0.1μm以上30μm以下,以1μm以上20μm以下為佳,5μm以上15μm以下更佳。 The hard coating layer can be formed on one side of the substrate film or on both sides. The hard coating layer can be provided to improve the hardness and scratch resistance. The thickness of the hard coating layer can be, for example, 0.1 μm to 30 μm, preferably 1 μm to 20 μm, and more preferably 5 μm to 15 μm.
硬塗層係例如紫外線硬化型樹脂的硬化層。紫外線硬化型樹脂可列舉(甲基)丙烯酸系樹脂、有機矽系樹脂、聚酯系樹脂、聚胺酯系樹脂、醯胺系樹脂、環氧系樹脂等。硬塗層可含有添加劑以提高強度。添加劑並無限制,可列舉無機系微粒、有機系微粒及此等的混合物等。 The hard coating layer is a hardened layer of, for example, a UV-curable resin. Examples of UV-curable resins include (meth)acrylic resins, organic silicone resins, polyester resins, polyurethane resins, amide resins, and epoxy resins. The hard coating layer may contain additives to increase strength. The additives are not limited, and examples include inorganic microparticles, organic microparticles, and mixtures thereof.
前面板的厚度可例如係20μm以上2000μm以下,以25μm以上1500μm以下為佳,30μm以上1000μm以下更佳,40μm以上500μm以下又更佳,40μm以上200μm以下特別佳,更可以係40μm以上100μm以下。 The thickness of the front panel may be, for example, 20 μm to 2000 μm, preferably 25 μm to 1500 μm, more preferably 30 μm to 1000 μm, more preferably 40 μm to 500 μm, more preferably 40 μm to 200 μm, and more preferably 40 μm to 100 μm.
(背面板) (Back panel)
背面板係以可透光的板狀體為佳。背面板可僅由1層構成,也可由2層以上構成。 The back panel is preferably a light-transmitting plate. The back panel can be composed of only one layer or more than two layers.
背面板可構成例如顯示裝置的液晶面板或有機顯示元件等的影像顯示元件層。 The back panel may constitute an image display element layer such as a liquid crystal panel or an organic display element of a display device.
和前面板相同,背面板可列舉例如玻璃製的板狀體(例如玻璃板、玻璃膜等)、樹脂製的板狀體(例如樹脂板、樹脂片、樹脂膜等)。 Similar to the front panel, the back panel may be a plate-like body made of glass (e.g., a glass plate, a glass film, etc.), or a plate-like body made of resin (e.g., a resin plate, a resin sheet, a resin film, etc.).
對於構成樹脂製的板狀體之熱塑性樹脂的具體例,可列舉前面板中例示的 熱塑性樹脂。熱塑性樹脂係以纖維素系樹脂、(甲基)丙烯酸系樹脂、環狀聚烯烴系樹脂、聚酯系樹脂、聚碳酸酯系樹脂等為佳。 Specific examples of thermoplastic resins constituting the resin plate-like body include the thermoplastic resins exemplified in the front panel. Thermoplastic resins are preferably cellulose resins, (meth) acrylic resins, cyclic polyolefin resins, polyester resins, polycarbonate resins, etc.
從薄型化的觀點,背面板的厚度係以15μm以上200μm以下為佳,20μm以上150μm以下更佳,30μm以上130μm以下又更佳。 From the perspective of thinness, the thickness of the back panel is preferably between 15μm and 200μm, more preferably between 20μm and 150μm, and even more preferably between 30μm and 130μm.
(顯示裝置) (Display device)
開洞積層體含有直線偏光片或相位差膜等光學層時,可適用於顯示裝置。顯示裝置並無特別的限制,可列舉液晶顯示裝置、有機EL顯示裝置等。 When the open-cell laminate contains an optical layer such as a linear polarizer or a phase difference film, it can be applied to a display device. There is no particular limitation on the display device, and examples thereof include a liquid crystal display device, an organic EL display device, etc.
顯示裝置可以係具有可折疊、彎曲或重複捲取的可撓性(可曲性,flexible特性,flexibility)的顯示裝置。 The display device may be a display device having flexibility (flexibility) that can be folded, bent, or repeatedly rolled up.
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