TWI832511B - Holder for handler of electronic component - Google Patents

Holder for handler of electronic component Download PDF

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Publication number
TWI832511B
TWI832511B TW111140396A TW111140396A TWI832511B TW I832511 B TWI832511 B TW I832511B TW 111140396 A TW111140396 A TW 111140396A TW 111140396 A TW111140396 A TW 111140396A TW I832511 B TWI832511 B TW I832511B
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Taiwan
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electronic component
pair
adapter
movable guides
guides
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TW111140396A
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Chinese (zh)
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TW202321721A (en
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羅閏成
金索比
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韓商泰克元股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

本發明涉及一種電子部件分選機用擱置器。根據本發明的電子部件分選機用擱置器具有移動型引導件,從而藉由移動型引導件的移動而能夠將具有最大公差內的寬度的所有電子部件均穩定地安置在適配器,因此最終具有能夠提升分選機的運行率的優點。 The present invention relates to a shelf for an electronic component sorting machine. The shelf for electronic component sorting machines according to the present invention has a movable guide, so that all electronic components with a width within the maximum tolerance can be stably placed on the adapter by the movement of the movable guide, so it finally has It can improve the operation rate of the sorting machine.

Description

電子部件分選機用擱置器 Shelves for electronic component sorting machines

本發明涉及一種用於在電子部件分選機中擱置電子部件的擱置器。The present invention relates to a rack for racking electronic components in an electronic component sorting machine.

電子部件經過多種製程生產,在測試後出廠。此時,在多個作業製程中使用用於對電子部件進行分選的電子部件分選機(以下簡稱為「分選機」)。尤其,為了測試及分類生產的電子部件,必須使用分選機。Electronic components are produced through a variety of processes and shipped out after testing. In this case, an electronic component sorter (hereinafter referred to as "sorter") for sorting electronic components is used in multiple work processes. In particular, sorting machines are necessary for testing and sorting produced electronic components.

隨著新的電子部件的開發或所要求的製程,分選機以新的結構提出及製造,並為了穩定化而正在進行多種後續開發。With the development of new electronic components or required processes, the sorting machine is proposed and manufactured with a new structure, and various subsequent developments are being carried out for stabilization.

近來,作為搭載了多個電子元件的大型電子部件的固態硬碟(SSD:Solid State Drive)的普及趨勢正在擴大。Recently, the popularity of solid state drives (SSDs), which are large electronic components equipped with multiple electronic components, is increasing.

初期由於固態硬碟的需求少,所以在只有生產少量時,通過手工操作來處理固態硬碟。尤其在測試製程中,通過手工操作將固態硬碟直接電連接到測試器,並解除該連接。然而,隨著需求的劇增,通過手工操作的測試支持已經達到了困難的狀態。 In the early days, due to the low demand for SSDs, SSDs were processed manually when only a small amount was produced. Especially during the testing process, the solid state drive is directly electrically connected to the tester and disconnected through manual operations. However, with the dramatic increase in demand, manual test support has reached a difficult state.

但是,由於固態硬碟的厚度、結構及重量等與現有的電子部件不同,所以不能直接應用現有的分選機。因此,本發明的申請人此前在韓國公開專利10-2019-0050483號及10-2019-0061291號中提出了適合於諸如固態硬碟之類的大型電子部件的測試支援的分選機。 However, since the thickness, structure, and weight of solid-state drives are different from existing electronic components, existing sorters cannot be directly applied. Therefore, the applicant of the present invention has previously proposed a sorter suitable for test support of large electronic components such as solid-state drives in Korean Patent Publication Nos. 10-2019-0050483 and 10-2019-0061291.

另外,現有的分選機設計成僅處理相同規格的電子部件,或者在需要處理的電子部件的規格發生變化的情況下,必須更換多個構成部件。由此,需要具備與用於處理多種規格的電子部件的數量相對應的分選機,從而造成構建費用及空間的浪費或因更換部件而導致的執行時間的降低。 In addition, existing sorters are designed to process only electronic components of the same specifications, or must replace multiple constituent components when the specifications of the electronic components to be processed change. Therefore, it is necessary to provide a sorting machine corresponding to the number of electronic components for handling various specifications, resulting in a waste of construction costs and space, or a reduction in execution time due to replacement of components.

此外,由於諸如固態硬碟之類的電子部件根據所應用的成品而規格十分多樣規格十分多樣,因此實際上是藉由多品種少量生產的系統而生產的。考慮到這種情況,本發明的申請人在韓國專利申請第10-20-0073725號中提出了具有通用性的分選機(以下稱為「在先申請發明」)。 In addition, since electronic components such as solid-state drives have very diverse specifications depending on the finished product to which they are applied, they are actually produced using a system of high-variety, low-volume production. Considering this situation, the applicant of the present invention proposed a universal sorting machine in Korean Patent Application No. 10-20-0073725 (hereinafter referred to as the "prior-filed invention").

根據在先申請發明的分選機中應用適配器,適配器起到用於向測試器供應電子部件的載體的功能。由此,僅通過更換適配器,一個分選機就可以處理尺寸不同的多種類型的電子部件。 According to the use of an adapter in a sorting machine of the previously applied invention, the adapter functions as a carrier for supplying electronic components to the tester. As a result, one sorter can handle multiple types of electronic components of different sizes simply by changing adapters.

適配器具有對安置的電子部件進行握持或解除握持的一對握持導軌,在將電子部件安置於適配器或從適配器脫離的程序中,一對握持導軌之間的間隔變寬,從而需要使適配器處於開放狀態。並且,在適配器處於開放狀態的情況下,為了維持電子部件的位置,需要能夠支撐電子部件的單獨的支撐突起。 The adapter has a pair of gripping rails for gripping or releasing the mounted electronic components. During the process of placing the electronic components on or detaching the electronic components from the adapter, the distance between the pair of gripping rails becomes wider, which requires Leave the adapter open. Furthermore, in order to maintain the position of the electronic components when the adapter is in an open state, a separate support protrusion capable of supporting the electronic components is required.

另外,電子部件雖然製作得非常精緻,但必然會存在公差。例如,當要製造寬度為22mm的電子部件時,實際製造的電子部件的寬度反映了0.15mm的公差,從而具有從21.85mm至22.15mm的範圍。因此,藉由支撐裝置來支撐的寬度只能設定為22.15mm。 In addition, although electronic components are made very delicately, there are bound to be tolerances. For example, when an electronic component is to be manufactured with a width of 22mm, the width of the actual manufactured electronic component reflects a tolerance of 0.15mm, thus having a range from 21.85mm to 22.15mm. Therefore, the width supported by the support device can only be set to 22.15mm.

但是,如圖20的參照圖所示,形成於支撐突起213a、213b的支撐台sj由於與電子部件ED的結構或適配器的其他結構的干涉等,從而形成為僅能夠支撐電子部件ED的左右兩端0.25mm左右。因此,如圖21所示,反映負公差的寬度為21.85mm的電子部件ED無法正常地被支撐台sj支撐而可能會發生一側向下方下降的安置不良。並且,若發生安置不良,則需要在中止分選機的運行後消除安置不良,因此存在分選機的運行率會相應地下降或電子部件ED受損的問題。 However, as shown in the reference drawing of FIG. 20 , the support base sj formed on the support protrusions 213 a and 213 b is formed to be able to support only the left and right sides of the electronic component ED due to interference with the structure of the electronic component ED or other structures of the adapter. The end is about 0.25mm. Therefore, as shown in FIG. 21 , the electronic component ED with a width of 21.85 mm reflecting the negative tolerance cannot be supported by the support table sj normally, and may cause a placement failure in which one side drops downward. Furthermore, if placement failure occurs, it is necessary to eliminate the placement failure after stopping the operation of the sorting machine. Therefore, there is a problem that the operation rate of the sorting machine decreases accordingly or the electronic component ED is damaged.

本發明是對能夠將因公差而製造成寬度彼此不同的電子部件良好地支撐的結構進行思考而提出的。 The present invention is based on consideration of a structure that can favorably support electronic components that are manufactured to have different widths due to tolerances.

根據本發明的電子部件分選機用擱置器包括:一對握持桿,對可拆卸地安置電子部件的適配器能夠進行握持或解除握持;驅動源,通過縮小或擴大所述一對握持桿之間的間隔,以使所述一對握持桿能夠對適配器進行握持或解除握持;一對移動型引導件,在適配器藉由開放機而開放的狀態下支撐電子部件,並在電子部件被安置到適配器的程序中引導電子部件的安置位置;復原部件,對所述一對移動型引導件施加外力而使所述一對移動型引導件移動後,若將外力從所述一對移動型引導件移除,則使所述一對移動型引導件復原到原來的位置;及設置框架,用於設置所述一對握持桿、所述驅動源、所述一對移動型引導件及所述復原部件,其中所述移動型引導件可移動地設置於所述設置框架,通過位於適配器的通過區域而向上方突出,以能夠支撐安置在適配器上的電子部件,所述一對移動型引導件包括:引導部位,相互面向的面越向下方,所述引導部位的寬度越窄,從而引導電子部件的安置位置;及支撐部位,位於所述引導部位的下側來支撐電子部件,從而形成設定電子部件能夠安置於適配器的安置位置的支撐台。 The shelf for electronic component sorting machines according to the present invention includes: a pair of gripping levers capable of gripping or releasing an adapter for detachably housing electronic components; and a driving source that reduces or expands the pair of gripping levers. The interval between the holding rods enables the pair of holding rods to hold or release the adapter; a pair of movable guides supports the electronic components in a state where the adapter is opened by the opening machine, and Guide the installation position of the electronic component in the process of installing the electronic component to the adapter; a restoration component that applies an external force to the pair of movable guides to move the pair of movable guides. If the external force is removed from the pair of movable guides, When a pair of movable guides is removed, the pair of movable guides are restored to their original positions; and a frame is provided for arranging the pair of holding rods, the driving source, and the pair of moving guides. type guide and the restoration component, wherein the movable guide is movably disposed on the setting frame and protrudes upward through the passage area of the adapter to support electronic components placed on the adapter, A pair of movable guides includes: a guide part whose width becomes narrower as the surfaces facing each other go downwards, so as to guide the placement position of the electronic component; and a support part located below the guide part to support it. The electronic component is thereby formed to form a support platform that sets the placement position at which the electronic component can be placed on the adapter.

所述一對移動型引導件通過其下端部位鉸鏈結合於所述設置框架,以藉由旋轉移動使位於所述一對引導件的支撐台之間的間隔變寬或變窄。 The pair of movable guides are hingedly coupled to the installation frame through their lower ends so as to widen or narrow the distance between the support platforms of the pair of guides through rotational movement.

所述復原部件具有使所述一對移動型引導件分別復原的一對復原彈簧。The restoring member has a pair of restoring springs for respectively restoring the pair of movable guides.

所述復原部件具有用於使所述一對移動型引導件一併復原的一對復原彈簧。The restoring member has a pair of restoring springs for restoring the pair of movable guides together.

還包括:一對固定型引導件,固定地設置於所述設置框架,在開放機使適配器開放的狀態下能夠支撐電子部件,並在電子部件被安置到適配器的程序中引導電子部件的安置位置。It also includes: a pair of fixed guides fixedly provided on the installation frame, capable of supporting the electronic components when the adapter is opened by the opening machine, and guiding the placement position of the electronic components during the process of placing the electronic components into the adapter. .

還包括:防止突起,固定地設置於所述設置框架,用於在開放器使適配器開放的狀態下防止安置於適配器的電子部件的偏斜。It also includes: a prevention protrusion fixedly provided on the installation frame for preventing the electronic components placed on the adapter from deflecting when the opener opens the adapter.

還包括:感測器,用於在電子部件被安置到適配器的程序中感測電子部件的不良安置。Also included is a sensor for sensing poor placement of the electronic component during a process in which the electronic component is placed into the adapter.

根據本發明,因公差而製造成寬度彼此不同的電子部件均能夠穩定地安置在適配器,因此最終具有能夠提升分選機的運行率的效果。According to the present invention, electronic components manufactured with different widths due to tolerances can be stably placed on the adapter, thereby ultimately having the effect of improving the operation rate of the sorting machine.

參照圖式對根據本發明的較佳實施例進行說明,為了說明的簡潔,對重複或實質上相同結構說明盡可能地省略或精簡。 <針對電子部件與測試器的電連接的說明> Preferred embodiments according to the present invention are described with reference to the drawings. For simplicity of description, repeated or substantially identical structural descriptions are omitted or simplified as much as possible. <Instructions for electrical connection between electronic components and tester>

應用了根據本發明的用於電子部件分選機的擱置器(以下簡稱為「擱置器」)的分選機更適合於諸如固態硬碟之類的電子部件的接觸端子側部位插入到測試器的測試狹縫的方式。 A sorter to which a rack (hereinafter referred to as a "rack") for an electronic component sorter according to the present invention is applied is more suitable for inserting the contact terminal side portion of an electronic component such as a solid state drive into a tester way of testing the slit.

例如,如圖1所示,測試器TESTER具有測試狹縫S,電子部件ED的端子T側部位插入到該測試狹縫S中,從而具有電子部件ED和測試器TESTER電連接的結構。在此,如圖1所示,測試狹縫S可以是沿上下方向較長的形態,也可以是沿水平方向較長的形態。 For example, as shown in FIG. 1 , the tester TESTER has a test slit S, and the terminal T-side portion of the electronic component ED is inserted into the test slit S, thereby having a structure in which the electronic component ED and the tester TESTER are electrically connected. Here, as shown in FIG. 1 , the test slit S may be long in the up-down direction or long in the horizontal direction.

<針對分選機的大構成的示意性的說明> <Schematic explanation of the overall configuration of the sorting machine>

圖2是分選機HR的示意性的平面圖,圖3是圖2的分選機HR的示意性的立體圖。 FIG. 2 is a schematic plan view of the sorting machine HR, and FIG. 3 is a schematic perspective view of the sorting machine HR of FIG. 2 .

根據本實施例的分選機HR包括連接部分CP、堆疊件部分SP及傳送裝置TA。 The sorting machine HR according to the present embodiment includes a connection part CP, a stack part SP and a conveyor TA.

連接部分CP從使用者托盤CT取出將要測試的電子部件ED並提供到測試器TESTER,或從測試器TESTER回收測試結束的電子部件ED並裝載到使用者托盤CT。根據本發明的擱置器設置於該連接部分CP。 The connection part CP takes out the electronic component ED to be tested from the user tray CT and supplies it to the tester TESTER, or recovers the electronic component ED after testing from the tester TESTER and loads it into the user tray CT. A shelf according to the present invention is provided on the connection part CP.

堆疊件部分SP為了向連接部分CP供應裝載有將要測試的電子部件ED的使用者托盤CT而保管搬入到分選機HR的使用者托盤,或者從連接部分CP回收裝載有測試結束的電子部件ED的使用者托盤CT並從分選機HR搬出之前進行保管。此外,堆疊件部分SP將裝載有所保管的將要測試的電子部件ED的使用者托盤CT提供到傳送裝置 TA,或者從傳送裝置TA回收裝載有測試結束的電子部件ED的使用者托盤CT。 The stacker section SP stores the user trays loaded into the sorter HR in order to supply the user trays CT loaded with the electronic components ED to be tested to the connection section CP, or collects the electronic components ED loaded with the test completed from the connection section CP. The user's pallet CT is stored before being moved out from the sorter HR. In addition, the stack section SP provides the user tray CT loaded with the stored electronic components ED to be tested to the conveyor TA, or the user tray CT loaded with the electronic component ED after testing is recovered from the conveyor TA.

傳送裝置TA在連接部分CP和堆疊件部分SP之間傳送使用者托盤CT。即,裝載有將要測試的電子部件ED的使用者托盤CT通過傳送裝置TA從堆疊件部分SP向連接部分CP傳遞,裝載有測試結束的電子部件ED的使用者托盤CT通過傳送裝置TA從連接部分CP向堆疊件部分SP傳遞。 The transport device TA transports the user tray CT between the connection part CP and the stack part SP. That is, the user tray CT loaded with the electronic component ED to be tested is transferred from the stack part SP to the connection part CP by the transfer device TA, and the user tray CT loaded with the electronic component ED that has been tested is transferred from the connection part via the transfer device TA. CP is transferred to the stack part SP.

需要在如前述的分選機HR中進行測試的電子部件ED以裝載於使用者托盤CT的狀態通過傳送裝置TA從堆疊件部分SP向連接部分CP移動。並且,在連接部分CP,通過移動把手MH從使用者托盤CT移動到中繼裝置100,並通過測試把手TH從中繼裝置100供應到測試器TESTER。之後,測試結束的電子部件ED經過上述的逆程序移動到堆疊件部分SP。 The electronic components ED that need to be tested in the sorter HR as described above are moved from the stack part SP to the connection part CP through the conveyor TA in a state loaded on the user tray CT. And, in the connection part CP, it is moved from the user tray CT to the relay device 100 by the moving handle MH, and is supplied from the relay device 100 to the tester TESTER by the test handle TH. After that, the electronic component ED after the test is moved to the stack part SP through the above-mentioned reverse procedure.

在此,移動把手MH具有通過真空吸附的方式握持電子部件ED的結構,並且測試把手TH具有通過兩端加壓的方式握持電子部件ED的結構。 Here, the moving handle MH has a structure that holds the electronic component ED by vacuum suction, and the test handle TH has a structure that holds the electronic component ED by pressing both ends.

<適配器所管理的連接部分所實施的電子部件的流程概要> <Outline of the flow of electronic components implemented in the connection part managed by the adapter>

正如在先申請發明中的詳細說明,參照圖4的概念圖,概括了在應用適配器AD的情況下執行的電子部件ED的流程。 As described in detail in the previously applied invention, with reference to the conceptual diagram of FIG. 4 , the flow of the electronic component ED executed in the case of application of the adapter AD is summarized.

在適配器AD擱置於中繼裝置100的狀態下,移動把手MH從使用者托盤CT取出電子部件ED並安置於位於 第一作業區域WA1的適配器AD。此時,中繼裝置100將適配器AD開放,使得移動把手MH能夠將電子部件ED安置於適配器AD。 With the adapter AD placed on the relay device 100, the moving handle MH takes out the electronic component ED from the user tray CT and places it on the relay device 100. Adapter AD of the first working area WA1. At this time, the relay device 100 opens the adapter AD so that the electronic component ED can be placed on the adapter AD by moving the handle MH.

當完成將電子部件ED安置於適配器AD的第一作業時,中繼裝置100將適配器AD從第一作業區域WA1移動到第二作業區域WA2。在此,所述第一作業區域WA1在所述第二作業區域WA2的後方。 When the first operation of placing the electronic component ED on the adapter AD is completed, the relay device 100 moves the adapter AD from the first operation area WA1 to the second operation area WA2. Here, the first working area WA1 is behind the second working area WA2.

當完成適配器AD向第二作業區域WA2的移動時,中繼裝置100使適配器AD旋轉,使得安置於適配器AD的電子部件ED的姿勢從臥式轉換為立式。接著,測試把手TH握持適配器AD之後移動,從而將安置於適配器AD的電子部件ED電連接到測試器TESTER。然後,若對電子部件ED的測試結束,則經過相反的操作,測試結束的電子部件ED向使用者托盤CT移動。 When the movement of the adapter AD to the second work area WA2 is completed, the relay device 100 rotates the adapter AD so that the posture of the electronic component ED installed on the adapter AD is converted from a horizontal position to a vertical position. Next, the test handle TH holds the adapter AD and moves to electrically connect the electronic component ED installed in the adapter AD to the tester TESTER. Then, when the test of the electronic component ED is completed, the reverse operation is performed, and the electronic component ED whose test has been completed moves to the user tray CT.

<針對適配器的示意性的說明> <Illustrative description of the adapter>

圖5作為適配器AD的平面圖,如本發明的申請人的在先韓國專利申請第10-2021-0017446號(以下稱為「在先申請」)所示,能夠藉由開放器(隨後說明)而對開放桿FL進行加壓或解除對開放桿FL的加壓。若開放桿FL被加壓,則一對夾持軌道GR1、GR2之間的間隔變寬,從而適配器AD被開放,因此可將電子部件ED安置在適配器AD或使安置於適配器AD的電子部件ED脫離。並且,若解除對開放桿FL的加壓,則一對夾持軌道GR1、GR2之間 的間隔變窄,從而適配器AD被封閉,在這種情況下,安置於適配器AD的電子部件ED被固定。 5 is a plan view of the adapter AD, which can be opened by an opener (described later) as shown in the prior Korean Patent Application No. 10-2021-0017446 (hereinafter referred to as the "prior application") of the applicant of the present invention. The open lever FL is pressurized or depressurized. When the opening lever FL is pressurized, the distance between the pair of clamping rails GR1 and GR2 becomes wider, and the adapter AD is opened. Therefore, the electronic component ED can be placed on the adapter AD or the electronic component ED placed on the adapter AD can be placed. Detach. And when the pressure on the release lever FL is released, the gap between the pair of clamping rails GR1 and GR2 The gap is narrowed, so that the adapter AD is closed. In this case, the electronic component ED placed on the adapter AD is fixed.

如前述的適配器AD的其他結構或操作結構等已在上述的在先申請中進行了詳細說明,因此在本說明書中省略。 Other structures or operating structures of the aforementioned adapter AD have been described in detail in the above-mentioned prior applications and are therefore omitted in this specification.

由於這種適配器AD可拆卸地結合於中繼裝置100,因此藉由測試把手TH與電子部件ED一起移動。 Since this adapter AD is detachably coupled to the relay device 100, the test handle TH is moved together with the electronic component ED.

作為參考,適配器具有能夠使待後述的流動型引導件及固定型引導件通過的通過區域pf。 For reference, the adapter has a passage area pf through which a flow-type guide and a fixed-type guide to be described later can pass.

<針對中繼裝置的配備目的及結構的示意性的說明> <Schematic explanation of the purpose and structure of the relay device>

中繼裝置100在移動把手MH和測試把手TH之間中繼電子部件ED,移動把手MH和測試把手TH負責將位於使用者托盤CT的電子部件ED供應給測試器TESTER或者將完成測試的電子部件ED從測試器TESTER回收到使用者托盤CT。 The relay device 100 relays the electronic component ED between the moving handle MH and the test handle TH. The moving handle MH and the test handle TH are responsible for supplying the electronic component ED located on the user tray CT to the tester TESTER or the electronic component that will complete the test. ED is recovered from the tester TESTER to the user tray CT.

通常,諸如固態硬碟之類的形態較寬的大型電子部件ED在以臥式裝載於使用者托盤CT的狀態下被供應到分選機HR。因此,為了從使用者托盤CT提取電子部件ED,藉由真空吸附方式來握持電子部件ED的方式是比較合適的。但是,為了向測試器TESTER的測試狹縫S強行插入電子部件ED,藉由真空吸附方式來握持電子部件ED的方式並不合適,而對電子部件ED的兩端加壓來握持的方式才是合適的。這是因為在藉由對電子部件ED的兩端加壓 的方式的情況下,可以很容易地採取能夠適當引導為了被插入而移動的電子部件ED的結構。 Generally, large electronic components ED with a wide shape such as solid state drives are supplied to the sorter HR in a state of being horizontally loaded on the user tray CT. Therefore, in order to extract the electronic component ED from the user tray CT, it is more appropriate to hold the electronic component ED by vacuum suction. However, in order to forcibly insert the electronic component ED into the test slit S of the tester TESTER, it is not appropriate to hold the electronic component ED by vacuum suction. Instead, the method of holding the electronic component ED by applying pressure to both ends is is appropriate. This is because by applying pressure to both ends of the electronic component ED In the case of the method, it is possible to easily adopt a structure that can appropriately guide the electronic component ED that moves for insertion.

因此,正如上述的相關的申請所示,分選機HR需要具備用於握持電子部件ED的兩種握持結構。其中一個是能夠通過真空吸附方式握持電子部件ED的移動把手MH,另一個是能夠通過兩端加壓方式握持電子部件ED的測試把手TH。 Therefore, as shown in the above-mentioned related applications, the sorting machine HR needs to have two holding structures for holding the electronic component ED. One of them is a mobile handle MH that can hold the electronic component ED by vacuum adsorption, and the other is a test handle TH that can hold the electronic component ED by pressing at both ends.

移動把手MH用於從使用者托盤CT提取電子部件ED或向使用者托盤CT裝載電子部件ED。並且,測試把手TH在向測試器TESTER的測試狹縫S插入電子部件ED或從測試狹縫S回收電子部件ED時使用。 The mobile handle MH is used to extract the electronic components ED from the user tray CT or to load the electronic components ED to the user tray CT. Furthermore, the test handle TH is used when inserting the electronic component ED into the test slit S of the tester TESTER or when recovering the electronic component ED from the test slit S.

另外,若移動把手MH的作業區域與測試把手TH的作業區域重疊,則不僅是用於防止彼此之間的干擾的控制設計非常複雜,而且運行率也會降低,因此,如前述,最好將作業區域WA1和WA2區分開來。另外,在測試狹縫S為上下細長的形態的情況下,有必要將臥式的電子部件ED的姿勢轉換為立式。因此,需要如同本發明的中繼裝置100。 In addition, if the working area of the moving handle MH and the working area of the test handle TH overlap, not only the control design to prevent interference between them will be very complicated, but also the operation rate will be reduced. Therefore, as mentioned above, it is best to Work areas WA1 and WA2 are distinguished. In addition, when the test slit S has a vertically elongated shape, it is necessary to change the posture of the horizontal electronic component ED to a vertical posture. Therefore, a relay device 100 like the present invention is needed.

即,出於以下原因而配備根據本發明的中繼裝置100。 That is, the relay device 100 according to the present invention is provided for the following reasons.

第一,需要在具有真空吸附方式結構的移動把手MH與具有兩端加壓方式結構的測試把手TH之間適當地中繼電子部件ED。 First, it is necessary to appropriately relay the electronic component ED between the moving handle MH having a vacuum suction system structure and the test handle TH having a double-end pressure system structure.

第二,在中繼程序中,需要將電子部件ED的姿勢從臥式轉換為立式或從立式轉換為臥式。 Second, in the relay program, it is necessary to change the posture of the electronic component ED from a horizontal position to a vertical position or from a vertical position to a horizontal position.

第三,需要防止移動把手MH和測試把手TH的作業區域WA1、WA2重疊。 Third, it is necessary to prevent the working areas WA1 and WA2 of the moving handle MH and the test handle TH from overlapping.

第四,需要使分選機HR處理各種規格的電子部件ED。 Fourth, it is necessary to enable the sorting machine HR to handle various specifications of electronic components ED.

為此,如同在圖6的概念圖及省略往返移動器120的圖7的部分摘錄圖中參照到,中繼裝置100包括擱置器110、往返移動器120、姿勢轉換器130及開放器140。 To this end, as referred to in the conceptual diagram of FIG. 6 and the partial excerpt of FIG. 7 in which the shuttle 120 is omitted, the relay device 100 includes the rest 110 , the shuttle 120 , the posture converter 130 and the opener 140 .

擱置器110為了擱置先前所述的適配器AD而配備。並且本發明涉及這種擱置器110,將在後文中的另一個目錄中進行更詳細地說明。 The shelf 110 is equipped to hold the previously described adapter AD. And the present invention relates to such a shelf 110, which will be described in more detail later in another category.

往返移動器120使擱置器110在移動把手MH進行作業的第一作業區域WA1和測試把手TH進行作業的第二作業區域WA2之間往返移動。因此,第一作業區域WA1和第二作業區域WA2可以彼此不重疊而分開,並且可以防止移動把手MH和測試把手TH之間的操作干擾。 The shuttle 120 reciprocates the shelf 110 between the first working area WA1 where the moving handle MH works and the second working area WA2 where the test handle TH works. Therefore, the first working area WA1 and the second working area WA2 can be separated without overlapping each other, and operational interference between the moving handle MH and the test handle TH can be prevented.

姿勢轉換器130通過旋轉擱置器110來旋轉擱置於擱置器110的適配器AD,由此最終旋轉安置於適配器AD的電子部件ED,從而轉換電子部件ED的姿勢。作為參考,在電子部件ED供給到測試器TESTER的程序中,電子部件ED的姿勢從臥式轉換為立式,並且在電子部件ED回收至使用者托盤CT的程序中,電子部件ED的姿勢從立式轉換為臥式。 The attitude converter 130 rotates the adapter AD placed on the stand 110 by rotating the stand 110, thereby finally rotating the electronic component ED placed on the adapter AD, thereby converting the posture of the electronic component ED. For reference, in the process of supplying the electronic component ED to the tester TESTER, the posture of the electronic component ED changes from horizontal to vertical, and in the process of recovering the electronic component ED to the user tray CT, the posture of the electronic component ED changes from Vertical to horizontal conversion.

開放器140使適配器AD開放,使得電子部件ED可以安置於適配器AD或可以使安置於適配器AD的電子部件ED提取出來。如圖8的摘錄圖所示,這種開放器140包括加壓桿141、加壓源142以及回彈彈簧143。 The opener 140 opens the adapter AD so that the electronic component ED can be placed in the adapter AD or the electronic component ED placed in the adapter AD can be extracted. As shown in the excerpt of FIG. 8 , this opener 140 includes a pressure rod 141 , a pressure source 142 and a rebound spring 143 .

加壓桿141對適配器AD的開放桿FL進行加壓以使適配器AD開放。 The pressurizing lever 141 pressurizes the opening lever FL of the adapter AD to open the adapter AD.

加壓源142通過使加壓桿141進退,以使加壓桿141對適配器AD的開放桿FL進行加壓或解除加壓。作為這種加壓源142,雖然在本實施例中應用了氣缸,但並不一定限於氣缸。 The pressure source 142 moves the pressure rod 141 forward and backward, so that the pressure rod 141 pressurizes or depressurizes the open lever FL of the adapter AD. As this pressure source 142, although a cylinder is used in this embodiment, it is not necessarily limited to a cylinder.

回彈彈簧143被設置成,在沒有從加壓源142供給加壓力的情況下向解除加壓的方向對加壓桿141施加彈力的彈性部件。 The rebound spring 143 is provided as an elastic member that biases the pressure lever 141 in the direction of releasing pressure when the pressure force is not supplied from the pressure source 142 .

另外,需要注意的是,擱置器110藉由姿勢轉換器130而旋轉。因此,為了對擱置於擱置器110的適配器AD進行開放操作,可優先考慮開放器140結合於擱置器110,但由於擱置器110本身的操作結構,很難使開放器140結合於擱置器110。因此,在本實施例中,通過採用加壓桿141可旋轉地結合於加壓源142的結構,使得擱置器110在藉由姿勢轉換器130而進行旋轉時可以使加壓桿141一同旋轉。 In addition, it should be noted that the stand 110 is rotated by the posture converter 130 . Therefore, in order to open the adapter AD placed on the shelf 110 , the opener 140 may be coupled to the shelf 110 first. However, due to the operating structure of the shelf 110 itself, it is difficult to couple the opener 140 to the shelf 110 . Therefore, in this embodiment, by adopting a structure in which the pressure rod 141 is rotatably coupled to the pressure source 142, the rest 110 can rotate the pressure rod 141 together when the rest 110 is rotated by the posture converter 130.

作為參考,由於上述姿勢轉換器130及開放器140需要與擱置器110一起進行往返移動,因此分別以可操作的結構與擱置器110結合而與擱置器110一起移動。 For reference, since the posture converter 130 and the opener 140 need to move back and forth together with the shelf 110, they are respectively combined with the shelf 110 in an operable structure and move together with the shelf 110.

<針對擱置器的說明> <Instructions for the shelf>

如圖9、圖10及圖11的摘錄圖所示,擱置器110具有一對握持桿111a、111b、驅動源112、一對移動型引導件113a、113b、一對固定型引導件114a、114b、一對復原彈簧115a、115b、設置框架116及感測器117。 As shown in the excerpts of FIG. 9 , FIG. 10 and FIG. 11 , the shelf 110 has a pair of holding rods 111 a and 111 b, a driving source 112 , a pair of movable guides 113 a and 113 b, and a pair of fixed guides 114 a. 114b, a pair of return springs 115a, 115b, a mounting frame 116 and a sensor 117.

對於一對握持桿111a、111b及驅動源112,參照圖12及圖13的摘錄圖進行說明。 The pair of grip levers 111a and 111b and the drive source 112 will be described with reference to excerpts of FIGS. 12 and 13 .

一對握持桿111a、111b通過縮小或擴大相互之間的間隔來對適配器AD進行握持或解除握持。 The pair of holding levers 111a and 111b hold or release the adapter AD by narrowing or widening the distance between them.

驅動源112通過縮小或擴大一對握持桿111a、111b之間的間隔,從而提供使一對握持桿111a、111b能夠對適配器AD進行自動握持或解除握持的驅動力。在本實施例中,不採用來自驅動源的驅動力直接供給到一對握持桿111a、111b的結構,而是具有通過導軌a、一對旋轉連桿b及進退部件c傳遞的結構。 The driving source 112 reduces or expands the distance between the pair of gripping levers 111a and 111b, thereby providing a driving force that enables the pair of gripping levers 111a and 111b to automatically grip or release the adapter AD. In this embodiment, the driving force from the driving source is not directly supplied to the pair of gripping rods 111a and 111b. Instead, the driving force is transmitted through the guide rail a, the pair of rotating links b, and the advance and retreat member c.

當握持桿111a、111b向左右方向移動時,導軌a引導握持桿111a、111b的移動。為此,握持桿111a、111b軌道結合於導軌a上。 When the gripping bars 111a and 111b move in the left and right directions, the guide rail a guides the movement of the gripping bars 111a and 111b. For this purpose, the gripping rods 111a and 111b are orbitally coupled to the guide rail a.

一對旋轉連桿b的一側可旋轉地結合於握持桿111a、111b,並且另一側可旋轉地結合於進退部件c。因此,在旋轉連桿b藉由進退部件c的前進或後退而旋轉的同時握持桿111a、111b向左右方向被推動或拉動。 One side of the pair of rotating links b is rotatably coupled to the holding rods 111a and 111b, and the other side is rotatably coupled to the advance and retreat member c. Therefore, the holding rods 111a and 111b are pushed or pulled in the left and right directions while the rotating link b is rotated by the forward or backward movement of the forward and backward member c.

進退部件c藉由驅動源112的驅動力前進及旋轉。 The advancement and retraction member c advances and rotates by the driving force of the driving source 112 .

作為參考,在本實施例中,採用了利用氣缸構成的驅動源112的驅動力通過進退部件c等被傳遞到一對握持桿111a、111b的結構,但只要能夠改變一對握持桿111a、111b之間的間隔,則任何結構都可以被較佳地應用。 For reference, in this embodiment, the driving force of the driving source 112 composed of a cylinder is transmitted to the pair of gripping rods 111a and 111b through the forward and backward member c, etc., but as long as the pair of gripping rods 111a can be changed , 111b, any structure can be optimally applied.

另外,一對握持桿111a、111b在電子部件ED處於臥式的狀態下應能夠對適配器AD進行握持或解除握持,在電子部件ED處於立式的狀態下也應當能夠對適配器AD進行握持或解除握持。因此,握持桿111a、111b和驅動源112應被設置為能夠藉由姿勢轉換器130而與設置框架116一起旋轉。為此,在本實施例中採用握持桿111a、111b和驅動源112可操作地結合於設置框架116的結構。其中如同在圖11中參照到,驅動源112位於擱置適配器AD的反面,即設置框架116的背面,從而在向一對握持桿111a、111b適當地供給驅動力的同時,不會干涉適配器AD的擱置。 In addition, the pair of holding levers 111a and 111b should be able to hold or release the adapter AD when the electronic component ED is in a horizontal state, and should also be able to hold the adapter AD when the electronic component ED is in an upright state. Holding or releasing a hold. Therefore, the holding rods 111a, 111b and the driving source 112 should be configured to be rotatable together with the setting frame 116 by the posture converter 130. For this reason, in this embodiment, a structure is adopted in which the holding rods 111a, 111b and the driving source 112 are operatively coupled to the setting frame 116. As shown in FIG. 11 , the driving source 112 is located on the opposite side of the adapter AD, that is, the back side of the frame 116 , so that the driving force is appropriately supplied to the pair of holding rods 111 a and 111 b without interfering with the adapter AD. of shelving.

一對移動型引導件113a、113b可以在適配器AD藉由開放器140而開放的狀態下對電子部件ED進行支撐以保持電子部件ED的位置,並且在電子部件ED被安置到適配器AD的程序中引導電子部件ED的安置位置。這種移動型引導件113a、113b通過裝載固定於設置框架116的托架B而與托架B鉸鏈結合,從而最終可旋轉移動地設置在設置框架116上。並且,可以通過適配器AD的通過區域pf向上方突出,從而能夠支撐安置於適配器AD的電子部件 ED。為此,如圖14的摘錄圖所示,移動型引導件113a、113b具有引導部位gp和支撐部位sp。 The pair of movable guides 113a, 113b can support the electronic component ED to maintain the position of the electronic component ED when the adapter AD is opened by the opener 140, and in the process of placing the electronic component ED into the adapter AD Guide the placement position of the electronic component ED. The movable guides 113a and 113b are mounted on the bracket B fixed to the installation frame 116 and are hingedly coupled to the bracket B, and are finally installed on the installation frame 116 to be rotatably movable. Furthermore, the passage area pf of the adapter AD can protrude upward, thereby supporting the electronic components placed on the adapter AD. ED. For this reason, as shown in the excerpt of FIG. 14 , the movable guides 113a and 113b have a guide part gp and a support part sp.

引導部位gp的相互面向的面越向下,其寬度變得越窄,從而引導電子部件ED的安置位置。 The width of the mutually facing surfaces of the guide portion gp becomes narrower as it goes downward, thereby guiding the placement position of the electronic component ED.

支撐部位sp與引導部位gp一體地形成,並位於引導部位gp的下側而支撐電子部件ED,從而形成設定電子部件ED能夠安置在適配器AD上的安置位置的支撐台sj。 The support portion sp is formed integrally with the guide portion gp and is located below the guide portion gp to support the electronic component ED, thereby forming a support base sj that sets a placement position at which the electronic component ED can be placed on the adapter AD.

並且,如圖15所示,在移動型引導件113a、113b中,形成有能夠使復原彈簧115a、115b插入的插入槽ig,所述復原彈簧115a、115b被設置成用於使移動型引導件113a、113b的位置復原的復原部件。 Furthermore, as shown in FIG. 15 , the movable guides 113 a and 113 b are formed with insertion grooves ig into which return springs 115 a and 115 b configured to allow the movable guides to be inserted. Restoration components for position restoration of 113a and 113b.

較佳地,一對移動型引導件113a、113b之間的間隔設定為能夠安置具有最大的負公差寬度的電子部件ED。 Preferably, the interval between the pair of movable guides 113a, 113b is set to be able to accommodate the electronic component ED having the largest negative tolerance width.

一對固定型引導件114a、114b的形態及結構與一對移動型引導件113a、113b相同,但固定地設置於設置框架116。這種一對固定型引導件114a、114b也可以在電子部件ED被安置到適配器AD的程序中引導電子部件ED的安置位置。然而,一對固定型引導件114a、114b之間的間隔設定為能夠安置具有最大的正公差寬度的電子部件ED。此外,一對固定型引導件114a、114b還具有防止在開放器140使適配器AD開放的狀態下被安置到適配器AD的電子部件ED偏斜的功能。因此,從防止上述的電子部件ED的偏斜的功能方面來看,一對固定型引導件 114a、114b也可以被命名為防止電子部件ED偏斜的防止突起。例如,兩個復原彈簧115a、115b的彈性係數變得不同,從而藉由移動把手MH下降的電子部件ED可能向一側偏斜,此時,固定型引導件114a、114b將會防止電子部件ED偏斜超過規定閾值。 The pair of fixed guides 114a and 114b have the same shape and structure as the pair of movable guides 113a and 113b, but are fixedly installed on the installation frame 116. Such a pair of fixed guides 114a and 114b can also guide the placement position of the electronic component ED during the process of placing the electronic component ED on the adapter AD. However, the spacing between the pair of fixed guides 114a, 114b is set to be able to accommodate the electronic component ED having the largest positive tolerance width. In addition, the pair of fixed guides 114a and 114b also has a function of preventing the electronic component ED placed on the adapter AD from being deflected in a state where the adapter AD is opened by the opener 140. Therefore, from the functional point of view of preventing the above-mentioned deflection of the electronic component ED, a pair of fixed guides 114a, 114b may also be named as prevention protrusions that prevent the electronic component ED from deflecting. For example, the elastic coefficients of the two return springs 115a and 115b become different, so that the electronic component ED lowered by moving the handle MH may be deflected to one side. At this time, the fixed guides 114a and 114b will prevent the electronic component ED from being deflected to one side. Skew exceeds specified threshold.

一對復原彈簧115a、115b被設置為,在向一對移動型引導件113a、113b施加外力而使一對移動型引導件113a、113b旋轉移動後,若將外力從一對移動型引導件113a、113b移除,則使一對移動型引導件113a、113b復原到原來的位置的復原部件。這種復原彈簧115a、115b的下端固定於設置框架116。 The pair of return springs 115a and 115b are provided so that when an external force is applied to the pair of movable guides 113a and 113b to rotate and move the pair of movable guides 113a and 113b, the pair of return springs 115a and 115b are provided so that the external force is removed from the pair of movable guides 113a. , 113b is removed, and the pair of movable guides 113a, 113b is restored to its original position. The lower ends of such return springs 115a and 115b are fixed to the installation frame 116.

設置框架116用於設置一對握持桿111a、111b、驅動源112、一對移動型引導件113a、113b、一對固定型引導件114a、114b及復原彈簧115a、115b。 The installation frame 116 is used to install a pair of gripping rods 111a and 111b, a driving source 112, a pair of movable guides 113a and 113b, a pair of fixed guides 114a and 114b, and return springs 115a and 115b.

感測器117在將電子部件ED被安置到適配器AD的程序中感測電子部件AD的安置不良。 The sensor 117 senses the placement failure of the electronic component AD in the process of placing the electronic component ED to the adapter AD.

圖16圖示適配器AD擱置於擱置器110的示例。參照圖16,可以確認,適配器AD在通過區域pf設置有移動型引導件113a和固定型引導件114a。 FIG. 16 illustrates an example in which the adapter AD is placed on the shelf 110 . Referring to FIG. 16 , it can be confirmed that the adapter AD is provided with a movable guide 113 a and a fixed guide 114 a in the passage area pf.

<針對特徵性操作的說明> <Instructions for characteristic operations>

當藉由移動把手MH將電子部件ED供應到安裝在擱置器110上的適配器AD時,適配器AD藉由開放器140而保持開放的狀態。 When the electronic component ED is supplied to the adapter AD installed on the holder 110 by moving the handle MH, the adapter AD is kept open by the opener 140 .

首先,對於具有最大負公差寬度的電子部件ED而言,移動型引導件113a、113b不會發生旋轉移動。 First, for the electronic component ED having the maximum negative tolerance width, the movable guides 113a and 113b do not rotate.

然而,對於具有最大負公差寬度以上的寬度的電子部件ED而言,若電子部件ED藉由移動把手MH下降,則電子部件ED的兩端在接觸到引導部位gp的同時沿移動型引導件113a、113b的展開方向施加外力。由此,如放大的圖17所示,在移動型引導件113a、113b旋轉移動的同時,兩個支撐台sj之間的間隔被拉開,從而使電子部件ED可以被適當地支撐在兩個支撐台sj。 However, for the electronic component ED having a width greater than or equal to the maximum negative tolerance width, if the electronic component ED is lowered by the moving handle MH, both ends of the electronic component ED will move along the movable guide 113a while contacting the guide portion gp. , apply external force in the unfolding direction of 113b. Thereby, as shown in the enlarged FIG. 17 , while the movable guides 113 a and 113 b rotate and move, the distance between the two support stands sj is widened, so that the electronic component ED can be appropriately supported on the two support bases sj . Support table sj.

<針對擱置器的應用示例> <Application example for shelving device>

參照圖18的示意圖,通過移動型引導件113a、113b的水平移動,使支撐台之間的間隔變寬或變窄。 Referring to the schematic diagram of FIG. 18 , the horizontal movement of the movable guides 113 a and 113 b widens or narrows the interval between the support tables.

此外,參照圖19的示意圖,一個復原彈簧115形成為同時向兩側移動型引導件113a、113b提供復原力。如圖19所示,在採用藉由一個復原彈簧115向兩個移動型引導件113a、113b均施加復原力的示例的情況下,可以防止因復原彈簧115a、115b的彈性係數彼此不同而導致移動型引導件113a、113b的移動量變得彼此不同的問題。 In addition, referring to the schematic diagram of FIG. 19 , one restoring spring 115 is formed to provide restoring force to both sides of the movable guides 113 a and 113 b at the same time. As shown in FIG. 19 , in the case where a restoring force is applied to both movable guides 113 a and 113 b by one restoring spring 115 , it is possible to prevent movement caused by the elastic coefficients of the restoring springs 115 a and 115 b being different from each other. There is a problem that the movement amounts of the guides 113a and 113b become different from each other.

如前述,雖然關於本發明的具體說明是通過參照圖式的實施例進行的,但上述實施例僅以本發明的較佳例為例進行說明,因此,不能理解為本發明只局限於上述實施例,並且本發明的權利範圍應理解為後述的請求範圍及其等效範圍。As mentioned above, although the specific description of the present invention is carried out with reference to the embodiments of the drawings, the above-mentioned embodiments are only examples of preferred examples of the present invention. Therefore, it cannot be understood that the present invention is limited to the above-mentioned embodiments. For example, the scope of rights of the present invention should be understood as the scope of claims described below and their equivalent scope.

110:電子部件分選機用擱置器 111a,111b:握持桿 112:驅動源 113a,113b:移動型引導件 gp:引導部位 sp:支撐部位 sj:支撐台 114a,114b:固定型引導件 115a,115b:復原彈簧 116:設置框架 117:感測器 110: Shelves for electronic components sorting machines 111a,111b: Grip rod 112:Drive source 113a,113b: Mobile guide gp: guide part sp: support part sj: support platform 114a, 114b: fixed guide 115a,115b:Return spring 116:Set the frame 117: Sensor

圖1是用於說明電子部件與測試器之間的電連接結構的參照圖。FIG. 1 is a reference diagram for explaining the electrical connection structure between the electronic component and the tester.

圖2是根據本發明的一實施例的電子部件分選機的概念性的結構圖。FIG. 2 is a conceptual structural diagram of an electronic component sorting machine according to an embodiment of the present invention.

圖3是圖2的分選機的示意性的立體圖。FIG. 3 is a schematic perspective view of the sorting machine of FIG. 2 .

圖4是用於說明在連接部分執行的電子部件的流程的參照圖。FIG. 4 is a reference diagram for explaining the flow of the electronic component executed in the connection section.

圖5是可應用於圖2的分選機的適配器的平面圖。FIG. 5 is a plan view of an adapter applicable to the sorting machine of FIG. 2 .

圖6是應用於圖2的分選機的電子部件分選機用中繼裝置的概念圖。FIG. 6 is a conceptual diagram of a relay device for an electronic component sorter applied to the sorter of FIG. 2 .

圖7是圖6的中繼裝置的部分摘錄圖。FIG. 7 is a partial excerpt of the relay device in FIG. 6 .

圖8是應用於圖6的中繼裝置的開放器的摘錄圖。FIG. 8 is an excerpt of an opener applied to the relay device of FIG. 6 .

圖9、圖10及圖11是應用於圖6的中繼裝置的擱置器的摘錄圖。FIG. 9 , FIG. 10 and FIG. 11 are excerpted views of the shelving device used in the relay device of FIG. 6 .

圖12及圖13是用於說明應用於圖9的擱置器的一對握持桿和驅動源的摘錄圖。12 and 13 are excerpted views for explaining a pair of gripping levers and a driving source applied to the shelf of FIG. 9 .

圖14及圖15是應用於圖9的擱置器的移動型引導件的摘錄圖。14 and 15 are excerpts of a movable guide applied to the shelf of FIG. 9 .

圖16圖示適配器結合於擱置板的示例。Figure 16 illustrates an example of an adapter coupled to a shelf.

圖17是用於說明在圖9的擱置器中進行的特徵性操作的參照圖。FIG. 17 is a reference diagram for explaining characteristic operations performed in the shelf of FIG. 9 .

圖18及圖19是用於說明圖9的擱置器的應用例的參照圖。18 and 19 are reference diagrams for explaining an application example of the shelf of FIG. 9 .

圖20及圖21是用於說明電子部件安置的問題的參照圖。20 and 21 are reference diagrams for explaining the problem of placement of electronic components.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

110:電子部件分選機用擱置器 110: Shelves for electronic components sorting machines

111a,111b:握持桿 111a,111b: Grip rod

112:驅動源 112:Drive source

113a,113b:移動型引導件 113a,113b: Mobile guide

114a,114b:固定型引導件 114a, 114b: fixed guide

116:設置框架 116:Set the frame

117:感測器 117: Sensor

Claims (7)

一種電子部件分選機用擱置器,包括:一對握持桿,能夠對可拆卸地安置電子部件的適配器進行握持或解除握持;驅動源,通過縮小或擴大所述一對握持桿之間的間隔,以使所述一對握持桿能夠對所述適配器進行握持或解除握持;一對移動型引導件,在所述適配器藉由開放器而開放的狀態下支撐所述電子部件,並在所述電子部件被安置到所述適配器的程序中引導所述電子部件的安置位置;復原部件,對所述一對移動型引導件施加外力而使所述一對移動型引導件移動後,若將外力從所述一對移動型引導件移除,則使所述一對移動型引導件復原到原來的位置;及設置框架,用於設置所述一對握持桿、所述驅動源、所述一對移動型引導件及所述復原部件,其中所述一對移動型引導件可移動地設置於所述設置框架,通過位於所述適配器的通過區域而向上方突出,以支撐安置在所述適配器上的所述電子部件,所述一對移動型引導件包括:引導部位,相互面向的面越向下方,所述引導部位的寬度越窄,從而引導所述電子部件的安置位置;及支撐部位,位於所述引導部位的下側來支撐所述電子部件,從而形成設定所述電子部件安置於所述適配器的 安置位置的支撐台。 A shelving device for an electronic component sorting machine, including: a pair of gripping levers capable of holding or releasing an adapter for detachably housing electronic components; and a driving source that reduces or expands the pair of gripping levers space between them to enable the pair of holding rods to hold or release the adapter; a pair of movable guides to support the adapter in a state where the adapter is opened by an opener The electronic component guides the installation position of the electronic component in the process of installing the electronic component to the adapter; the restoration component applies an external force to the pair of movable guides to cause the pair of movable guides to After the parts are moved, if the external force is removed from the pair of movable guides, the pair of movable guides are restored to their original positions; and a frame is provided for arranging the pair of holding rods, The drive source, the pair of movable guides, and the restoration member, wherein the pair of movable guides are movably provided on the installation frame and protrude upward through a passage area of the adapter , to support the electronic component placed on the adapter, the pair of movable guides includes: guide parts, the width of the guide parts becomes narrower as the surfaces facing each other go downwards, thereby guiding the electronic components The placement position of the component; and a support portion located on the lower side of the guide portion to support the electronic component, thereby forming a position where the electronic component is placed on the adapter. Support platform for placement. 如請求項1之電子部件分選機用擱置器,其中所述一對移動型引導件通過其下端部位鉸鏈結合於所述設置框架,以藉由旋轉移動使位於所述一對移動型引導件的所述支撐台之間的間隔變寬或變窄。 The shelf for an electronic component sorting machine as claimed in claim 1, wherein the pair of movable guides are hingedly coupled to the installation frame through their lower end portions, so that the pair of movable guides can be positioned on the pair of movable guides by rotational movement. The spacing between the support platforms becomes wider or narrower. 如請求項1之電子部件分選機用擱置器,其中所述復原部件具有使所述一對移動型引導件分別復原的一對復原彈簧。 The shelf for an electronic component sorting machine according to claim 1, wherein the restoring member has a pair of restoring springs for respectively restoring the pair of movable guides. 如請求項1之電子部件分選機用擱置器,其中所述復原部件具有用於使所述一對移動型引導件一併復原的一對復原彈簧。 The shelf for an electronic component sorting machine according to claim 1, wherein the restoring member has a pair of restoring springs for restoring the pair of movable guides together. 如請求項1之電子部件分選機用擱置器,還包括:一對固定型引導件,固定地設置於所述設置框架,被設置成在所述開放器使所述適配器開放的狀態下支撐所述電子部件,並在所述電子部件被安置到所述適配器的程序中引導所述電子部件的安置位置。 The shelf for an electronic component sorting machine according to Claim 1, further comprising: a pair of fixed guides fixedly provided on the installation frame and configured to support the adapter in a state where the opener opens the adapter. the electronic component, and guides the placement position of the electronic component in the process of placement of the electronic component into the adapter. 如請求項1之電子部件分選機用擱置器,還包括:防止突起,固定地設置於所述設置框架,用於在所述開放器使所述適配器開放的狀態下防止安置於所述適配 器的所述電子部件的偏斜。 The shelf for an electronic component sorting machine according to claim 1, further comprising: a preventing protrusion fixedly provided on the installation frame for preventing the adapter from being placed on the adapter when the opener opens the adapter. match Deflection of the electronic components of the device. 如請求項1之電子部件分選機用擱置器,還包括:感測器,用於在所述電子部件被安置到所述適配器的程序中感測所述電子部件的安置不良。 The shelf for an electronic component sorting machine as claimed in claim 1 further includes: a sensor for sensing placement failure of the electronic component during the process of placing the electronic component into the adapter.
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KR20220114214A (en) * 2021-02-08 2022-08-17 (주)테크윙 Adaptor of handler for testing electronic component
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