TWI830816B - Heat treatment device and heat treatment method - Google Patents

Heat treatment device and heat treatment method Download PDF

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TWI830816B
TWI830816B TW108142248A TW108142248A TWI830816B TW I830816 B TWI830816 B TW I830816B TW 108142248 A TW108142248 A TW 108142248A TW 108142248 A TW108142248 A TW 108142248A TW I830816 B TWI830816 B TW I830816B
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substrate
temperature
hot plate
heating
cooling
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TW108142248A
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TW202101531A (en
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七種剛
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日商東京威力科創股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/0032—Devices or apparatus characterised by heat providing or glossing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Abstract

提供一種「在將基板加熱處理的熱處理裝置中，提高基板之熱處理的面內均勻性」之技術。 Provided is a technology that "improves the in-plane uniformity of heat treatment of a substrate in a heat treatment apparatus that heats a substrate."

具備有：熱板，將所載置之基板加熱至第1溫度；搬送體，具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板；收授機構，在前述上方區域中之前述搬送體與前述熱板之間收授前述基板；加熱機構，將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度；及冷卻機構，以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻。 It is provided with: a hot plate that heats the placed substrate to a first temperature; and a transport body that has a support portion that supports the substrate, between an upper area of the hot plate and an outer area away from the upper area in the lateral direction. a receiving and receiving mechanism that receives and receives the substrate between the conveying body and the hot plate in the upper region; and a heating mechanism that heats the hot plate that is supported by the support portion in the outer region The front substrate is heated to a second temperature lower than the first temperature; and a cooling mechanism is used so that the substrate heated by the hot plate and supported on the support portion for transportation to the outer area becomes lower than the first temperature. Cooling is performed at the third temperature of 2 temperatures.

Description

熱處理裝置及熱處理方法 Heat treatment device and heat treatment method

本揭示，係關於對基板進行加熱的技術。 This disclosure relates to a technology for heating a substrate.

在半導體製造製程之光微影工程中，係對基板即半導體晶圓進行由光阻等的藥液之塗佈之各塗佈膜的形成、塗佈膜即光阻膜的曝光及顯像。而且，在將塗佈膜塗佈於基板後或對光阻膜進行曝光處理後等，進行將基板加熱的熱處理。作為像這樣的熱處理裝置，係例如已知將水平載置之基板加熱的熱處理裝置。 In the photolithography process of the semiconductor manufacturing process, the substrate, that is, the semiconductor wafer, is formed by applying a chemical solution such as photoresist to form each coating film, and the coating film, that is, the photoresist film, is exposed and developed. Furthermore, after applying the coating film to the substrate or after exposing the photoresist film, a heat treatment of heating the substrate is performed. As such a heat treatment apparatus, for example, a heat treatment apparatus that heats a horizontally placed substrate is known.

在專利文獻1中，係記載有熱處理裝置，其具備有：載置台，具有在容器內加熱被處理體的發熱體；及被處理體溫度控制裝置，在該容器內，與載置台之上方相對向而設置。而且，在以載置台加熱被處理體之前，使被處理體接近或接觸被處理體溫度控制裝置，且對被處理體進行預備加熱。 Patent Document 1 describes a heat treatment apparatus, which is provided with: a mounting table having a heating element for heating an object to be processed in a container; and a temperature control device for the object to be processed in the container, facing above the mounting table. Set towards the direction. Furthermore, before heating the object to be processed with the mounting table, the object to be processed is brought close to or in contact with the object to be processed temperature control device, and the object to be processed is preliminarily heated.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Document]

[專利文獻1]日本特開2005-150696號公報 [Patent Document 1] Japanese Patent Application Publication No. 2005-150696

本揭示，係有鑑於像這樣的情事所進行研究者，在於提供如下述技術：在將基板加熱處理的熱處理裝置中，提高基板之熱處理的面內均勻性。 The present disclosure is made by researchers in view of such a situation, and aims to provide a technology that improves the in-plane uniformity of heat treatment of a substrate in a heat treatment apparatus that heats a substrate.

本揭示之熱處理裝置，係具備有：熱板，將所載置之基板加熱至第1溫度；搬送體，具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板；收授機構，在前述上方區域中之前述搬送體與前述熱板之間收授前述基板；加熱機構，將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度；及冷卻機構，以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻。 The heat treatment apparatus of the present disclosure is provided with: a hot plate that heats the placed substrate to a first temperature; and a transport body that is provided with a support portion that supports the substrate. The substrate is transported between outer areas that are laterally distant from each other; a receiving and receiving mechanism receives and receives the substrate between the conveying body and the hot plate in the upper area; and a heating mechanism supports the substrate in the outer area by the supporting portion The substrate before being heated by the hot plate is heated to a second temperature lower than the first temperature; and a cooling mechanism is provided so that the substrate is heated by the hot plate and is supported on the supporting portion for transportation to the outer area. The substrate is cooled to a third temperature lower than the second temperature.

根據本揭示，在將基板加熱處理的熱處理裝置中，可提高基板之熱處理的面內均勻性。According to the present disclosure, in a heat treatment apparatus that heats a substrate, the in-plane uniformity of the heat treatment of the substrate can be improved.

[用於實施發明之最佳形態][Best form for carrying out the invention]

分別參閱圖1之縱剖側視圖、圖2之平面圖，說明關於本發明之實施形態的熱處理裝置1。在被搬送至該熱處理裝置1之晶圓W的表面，係形成有化學增幅型之光阻膜，該光阻膜之表面，係以在由該熱處理裝置1進行加熱後進行顯像處理而形成光阻圖案的方式，被予以曝光。亦即，熱處理裝置1，係進行曝光後烘烤(PEB)，使藉由曝光所產生的酸擴散於光阻膜中。The heat treatment apparatus 1 according to the embodiment of the present invention will be described with reference to the longitudinal sectional side view of FIG. 1 and the plan view of FIG. 2 respectively. A chemically amplified photoresist film is formed on the surface of the wafer W transported to the heat treatment device 1. The surface of the photoresist film is formed by developing after being heated by the heat treatment device 1. The photoresist pattern is exposed. That is, the heat treatment device 1 performs post-exposure baking (PEB) to diffuse acid generated by exposure into the photoresist film.

熱處理裝置1，係具備有殼體11，該殼體11之側壁，係設置有晶圓W的搬送口12。在殼體11內，當將搬送口12呈開口之側設成為前方側時，則在殼體11內之後方側，係設置有水平之圓形的熱板2，該熱板，係經由支撐柱23被設置於殼體11的底面。在熱板2之上面，係分散設置有多數個間隙銷22，該間隙銷22，係支撐晶圓W。又，在熱板2，係例如埋設有由發熱電阻體所構成的加熱器21，並被構成為可將載置於熱板2之晶圓W加熱處理至第1溫度例如110℃。在熱板2，係沿圓周方向設置有3處貫通孔30，該貫通孔30，係於厚度方向貫穿熱板2。在貫通孔30中，係設置有垂直的升降銷31。各升降銷31，係經由升降板32被連接於升降機構33，該升降機構33，係被設置於殼體11之底面，各升降銷31，係藉由升降機構33進行升降，升降銷31之前端，係在熱板2的表面突出/沒入。圖1中之94，係用以使加熱器21升溫的電源部。The heat treatment apparatus 1 is provided with a casing 11, and a transfer port 12 for the wafer W is provided on the side wall of the casing 11. In the casing 11, when the side with the opening of the transport port 12 is set as the front side, a horizontal circular hot plate 2 is provided on the rear side in the casing 11. This hot plate is supported by The pillar 23 is provided on the bottom surface of the housing 11 . On the upper surface of the hot plate 2, a plurality of gap pins 22 are dispersedly provided, and the gap pins 22 support the wafer W. Furthermore, a heater 21 composed of, for example, a heating resistor is embedded in the hot plate 2, and is configured to heat-process the wafer W placed on the hot plate 2 to a first temperature, for example, 110°C. The hot plate 2 is provided with three through holes 30 in the circumferential direction, and the through holes 30 penetrate the hot plate 2 in the thickness direction. In the through hole 30, a vertical lifting pin 31 is provided. Each lifting pin 31 is connected to a lifting mechanism 33 via a lifting plate 32. The lifting mechanism 33 is provided on the bottom surface of the housing 11. Each lifting pin 31 is lifted and lowered by the lifting mechanism 33. The lifting pin 31 is The front end is protruding/submerged in the surface of the hot plate 2. Reference numeral 94 in Fig. 1 is a power supply unit for heating the heater 21.

在熱板2之上方，係以包含被載置於熱板2之晶圓W的方式，設置有底面側呈開口之扁平圓筒形的蓋板24。蓋板24，係經由支撐部25被連接於升降機構26，蓋板24，係在熱板2上進行升降。在將晶圓W加熱處理之際，如圖1所示般，蓋板24之側壁的下端，係與熱板2接觸，藉由蓋板24與熱板2對晶圓W的周圍進行劃分，在將晶圓W收授至熱板2時，係蓋板24上升而開放晶圓W的周圍。Above the hot plate 2, a flat cylindrical cover 24 with an opening on the bottom side is provided so as to include the wafer W placed on the hot plate 2. The cover plate 24 is connected to the lifting mechanism 26 via the support part 25, and the cover plate 24 is raised and lowered on the hot plate 2. When the wafer W is being heated, as shown in FIG. 1 , the lower end of the side wall of the cover plate 24 is in contact with the hot plate 2, and the periphery of the wafer W is divided by the cover plate 24 and the hot plate 2. When the wafer W is transferred to the hot plate 2 , the cover 24 rises to open the periphery of the wafer W.

在殼體11內之前方側(搬送口12側)，係設置有搬送體即搬送臂4。搬送臂4，係具備有水平之概略圓板狀的支撐部即支撐板40，且晶圓W被載置於支撐板40之表面。該支撐板40，係可藉由經由支撐構件42所連接的移動機構43在前後方向進行移動，並在熱板2的上方區域與朝熱板2之橫方向遠離的外側區域(圖1所示的位置)之間進行移動。On the front side (transport port 12 side) inside the casing 11, a transport arm 4 serving as a transport body is provided. The transfer arm 4 is provided with a support plate 40 which is a horizontal, generally disc-shaped support portion, and the wafer W is placed on the surface of the support plate 40 . The support plate 40 is movable in the front-rear direction by the moving mechanism 43 connected through the support member 42, and is located between the upper area of the hot plate 2 and the outer area away from the lateral direction of the hot plate 2 (shown in FIG. 1 positions).

在搬送臂4位於外側區域時，保持了晶圓W之熱處理裝置1之外部的搬送機構從搬送口12進入殼體11內，並從支撐板40之上方往下方進行升降，藉此，在該外部的搬送機構與臂體34之間進行晶圓W的收授。另外，在該例中，外部之搬送機構，係被構成為從4處下方側等間隔地支撐晶圓W的周緣部。因此，為了在收授晶圓W時避免搬送機構與支撐板40彼此干涉，從而在支撐板40之周緣等間隔地形成4處缺口44。 又，如圖2所示般，在支撐板40，係從後端朝向前方側形成縫隙45。在支撐板40藉由該縫隙45位於熱板2上時，從熱板2突出/沒入之升降銷31可經由該縫隙45朝支撐板40上突出，並藉由升降銷31之升降與搬送臂4之進退的協同作用，在熱板2與支撐板40之間進行晶圓W之收授。升降銷31，係相當於收授機構。When the transfer arm 4 is located in the outer area, the transfer mechanism outside the heat treatment apparatus 1 holding the wafer W enters the housing 11 from the transfer port 12 and moves up and down from the top of the support plate 40 to the bottom. The wafer W is received and received between the external transport mechanism and the arm 34 . In addition, in this example, the external transport mechanism is configured to support the peripheral edge portion of the wafer W from four lower sides at equal intervals. Therefore, in order to prevent the transport mechanism and the support plate 40 from interfering with each other when receiving and receiving the wafer W, four notches 44 are formed at equal intervals on the periphery of the support plate 40 . Furthermore, as shown in FIG. 2 , a slit 45 is formed in the support plate 40 from the rear end toward the front side. When the support plate 40 is positioned on the hot plate 2 through the gap 45 , the lifting pin 31 protruding/recessing from the hot plate 2 can protrude toward the support plate 40 through the gap 45 , and can be lifted, lowered and transported by the lifting pin 31 The synergy of the advance and retreat of the arm 4 allows the wafer W to be received and transferred between the hot plate 2 and the support plate 40 . The lifting pin 31 is equivalent to the receiving and awarding mechanism.

又，在支撐板40之內部，係埋設有兼用為加熱機構及冷卻機構的泊耳帖元件部41。泊耳帖元件部41，係被連接於冷暖切換部95，該冷暖切換部95，係切換被供給至泊耳帖元件部41之電流的流向，將支撐板40切換成以第2溫度例如40℃進行加熱的加熱狀態與以第3溫度例如23℃進行冷卻的冷卻狀態。另外，冷暖切換部95，係亦可構成為可調整供給至泊耳帖元件部41之電流的大小，且調整泊耳帖元件部41的加熱溫度及冷卻溫度。泊耳帖元件部41，係例如被4分割成前後2行左右2列之2×2的行列狀，並被構成為可將載置於支撐板40之晶圓W的整面均勻地加熱或冷卻。在像這樣的熱處理裝置1中，係藉由被設置於搬送臂4之支撐板40進行晶圓W的加熱及冷卻，該搬送臂4，係在熱板2的上方區域與其外側區域之間直接搬送晶圓W的搬送體。亦即，將晶圓W進行溫度調整的搬送體與將晶圓W搬送至熱板2的上方區域之搬送體成為一體。Furthermore, a Peltier element portion 41 serving as both a heating mechanism and a cooling mechanism is embedded inside the support plate 40 . The Peltier element part 41 is connected to the cooling and heating switching part 95. The cooling and heating switching part 95 switches the flow direction of the current supplied to the Peltier element part 41 and switches the support plate 40 to a second temperature, for example, 40°C. A heating state in which heating is performed at a temperature of 23° C. and a cooling state in which cooling is performed at a third temperature, for example, 23° C. In addition, the heating and cooling switching unit 95 may be configured to adjust the magnitude of the current supplied to the Peltier element unit 41 and adjust the heating temperature and cooling temperature of the Peltier element unit 41 . The Peltier element unit 41 is divided into four parts, for example, into a 2×2 matrix of 2 front and rear rows and 2 left and right columns, and is configured to uniformly heat the entire surface of the wafer W placed on the support plate 40 or Cool. In the heat treatment apparatus 1 like this, the wafer W is heated and cooled by the support plate 40 provided on the transfer arm 4, which is directly between the upper area and the outer area of the hot plate 2. A transport body that transports wafer W. That is, the transport body that adjusts the temperature of the wafer W and the transport body that transports the wafer W to the upper area of the hot plate 2 are integrated.

如圖3所示般，熱處理裝置1，係例如具備有由電腦所構成的控制部9。控制部9，係具備有CPU91、記憶體92及程式儲存部93。圖3中之90，係匯流排。又，控制部9，係被構成為可將控制信號輸出至冷暖切換部95、對加熱器21進行加熱的電源部94、搬送臂4的移動機構43、各升降機構33、26(在圖3中，係省略蓋板24的升降機構)。As shown in FIG. 3 , the heat treatment device 1 is provided with a control unit 9 composed of a computer, for example. The control unit 9 includes a CPU 91, a memory 92, and a program storage unit 93. Number 90 in Figure 3 is the bus bar. In addition, the control unit 9 is configured to output a control signal to the cooling and heating switching unit 95, the power supply unit 94 for heating the heater 21, the moving mechanism 43 of the transport arm 4, and each of the lifting mechanisms 33 and 26 (see FIG. 3 , the lifting mechanism of the cover 24 is omitted).

在程式儲存部93，係儲存有程式，該程式，係以實施後述之熱處理裝置1的作用所示之泊耳帖元件部41的加熱狀態與冷卻狀態之切換的控制、搬送臂4之移動、蓋板24之升降、晶圓W之收授等的順序之方式，組成命令(步驟群)。該程式，係例如藉由光碟、硬碟、MO(光磁碟)、DVD、記憶卡等的記憶媒體被儲存而安裝於控制部9。The program storage unit 93 stores a program for controlling the switching of the heating state and the cooling state of the Peltier element unit 41 and the movement of the transfer arm 4, as shown by the functions of the heat treatment device 1 described later. The sequential manner of raising and lowering the cover 24, receiving and receiving the wafer W, etc. constitutes a command (step group). This program is stored in a storage medium such as an optical disk, a hard disk, an MO (optical disk), a DVD, a memory card, etc., and is installed in the control unit 9 .

接著，使用圖4~圖9之示意圖，說明關於本實施形態之熱處理裝置1的作用。形成有化學增幅型之光阻膜而進行了曝光處理的晶圓W，係藉由殼體11之外部的搬送機構A5被搬送至殼體11內。在熱處理裝置1中，係於晶圓W被搬送之前，將熱板2加熱至例如110℃，支撐板40，係在被冷卻至例如23℃的冷卻狀態下，待機於外側區域。在圖4~圖9中，在支撐板40為冷卻狀態(23℃)時，係從支撐板40延伸表示虛線的箭頭，在支撐板40為加熱狀態時，係從支撐板40延伸表示實線之波形的箭頭。加熱被載置於熱板2之晶圓W時，亦從熱板2延伸表示實線之波形的箭頭。Next, the operation of the heat treatment apparatus 1 of this embodiment will be described using the schematic diagrams of FIGS. 4 to 9 . The wafer W on which the chemically amplified photoresist film has been formed and subjected to the exposure process is transported into the housing 11 by the transport mechanism A5 outside the housing 11 . In the thermal processing apparatus 1 , before the wafer W is transferred, the hot plate 2 is heated to, for example, 110° C., and the support plate 40 is cooled to, for example, 23° C. and waits in the outer area in a cooling state. In FIGS. 4 to 9 , when the support plate 40 is in a cooling state (23° C.), a dotted line is shown extending from the support plate 40 . When the support plate 40 is in a heated state, a solid line is shown extending from the support plate 40 . wavy arrow. When the wafer W placed on the hot plate 2 is heated, an arrow representing a solid waveform also extends from the hot plate 2 .

首先，如圖4所示般，使保持了熱處理對象之晶圓W的搬送機構A5進入熱處理裝置1內，並使其從支撐板40之上方往下方移動，將晶圓W載置於支撐板40上。而且，例如如圖5所示般，在與晶圓W被載置於支撐板40的同時，將泊耳帖元件部41從冷卻狀態切換成加熱狀態。藉此，晶圓W之溫度，係從冷卻溫度即23℃升溫至比酸開始在光阻膜之內部擴散的溫度之下限更低的溫度例如40℃。First, as shown in FIG. 4 , the transport mechanism A5 holding the wafer W to be heat processed enters the heat treatment apparatus 1 and moves from above to below the support plate 40 to place the wafer W on the support plate. 40 on. Then, for example, as shown in FIG. 5 , while the wafer W is placed on the support plate 40 , the Peltier element unit 41 is switched from the cooling state to the heating state. Thereby, the temperature of the wafer W is raised from the cooling temperature, which is 23°C, to a temperature lower than the lower limit of the temperature at which acid starts to diffuse inside the photoresist film, for example, 40°C.

其次，如圖6所示般，使熱板2側之蓋板24上升，並將支撐板40維持在加熱狀態下，使其往熱板2之正上方的上方區域移動。而且，藉由升降銷31，將被支撐於支撐板40之晶圓W上推且接收，並使支撐板40退避至外側區域。其後，如圖7所示般，使升降銷31下降而將晶圓W載置於熱板2，並使蓋板24下降。藉此，晶圓W藉由熱板2進一步被加熱至110℃，酸擴散反應便在晶圓W之內部進行。在支撐板40中，在使晶圓W收授至升降銷31時，係將泊耳帖元件部41切換成冷卻狀態，並待機於外側區域。Next, as shown in FIG. 6 , the cover plate 24 on the hot plate 2 side is raised, and the support plate 40 is maintained in a heated state and moved to the upper area directly above the hot plate 2 . Furthermore, the wafer W supported on the support plate 40 is pushed up and received by the lifting pin 31 , and the support plate 40 is retracted to the outer area. Thereafter, as shown in FIG. 7 , the lift pin 31 is lowered to place the wafer W on the hot plate 2 and the cover plate 24 is lowered. Thereby, the wafer W is further heated to 110° C. by the hot plate 2, and the acid diffusion reaction proceeds inside the wafer W. In the support plate 40, when the wafer W is received by the lifting pin 31, the Peltier element part 41 is switched to the cooling state and waits in the outer area.

而且，當晶圓W之加熱完成時，則在藉由升降銷31將熱板2上的晶圓W上推，並將支撐板40維持在冷卻狀態下，使其往上方區域移動。而且，如圖8所示般，使升降銷31下降而將晶圓W收授至支撐板40。支撐板40，係當接收晶圓W時，如圖9所示般，快速地往外側區域移動。由於支撐板40，係預先被切換成冷卻狀態，因此，在被載置於支撐板40後立即開始冷卻晶圓W。而且，由於支撐板40，係低於將晶圓W搬送至熱板2上時的溫度，因此，所載置之晶圓W的溫度會急遽下降，酸擴散反應便在晶圓W之面內整體停止。Moreover, when the heating of the wafer W is completed, the wafer W on the hot plate 2 is pushed up by the lifting pin 31, and the support plate 40 is maintained in a cooling state and moved to the upper area. Then, as shown in FIG. 8 , the lift pin 31 is lowered to receive the wafer W to the support plate 40 . When receiving the wafer W, the support plate 40 rapidly moves toward the outer area as shown in FIG. 9 . Since the support plate 40 is switched to the cooling state in advance, cooling of the wafer W starts immediately after being placed on the support plate 40 . Moreover, since the support plate 40 is lower than the temperature when the wafer W is transferred to the hot plate 2, the temperature of the placed wafer W will drop sharply, and the acid diffusion reaction will occur within the surface of the wafer W. Overall stop.

而且，在搬送臂4待機於外側位置的期間，晶圓W，係例如被冷卻至23℃。其後，例如使外部之搬送機構A5進入支撐板40的下方，並使搬送機構A5上升。藉此，載置於支撐板40之晶圓W會被收授至搬送機構A5。其後，支撐板40，係維持在冷卻狀態下，待機於外側區域以便搬送後續的晶圓W。關於後續的晶圓W，亦與先前處理的晶圓W相同地進行處理。亦即，以前述的程序進行處理。While the transfer arm 4 is waiting at the outer position, the wafer W is cooled to, for example, 23°C. Thereafter, for example, the external conveyance mechanism A5 is moved under the support plate 40 and the conveyance mechanism A5 is raised. Thereby, the wafer W placed on the support plate 40 is received to the transport mechanism A5. Thereafter, the support plate 40 is maintained in a cooling state and waits in the outer area to transport the subsequent wafer W. The subsequent wafer W is also processed in the same manner as the previously processed wafer W. That is, the process is performed according to the above-mentioned procedure.

在此，如上述般，說明關於藉由支撐板40對載置於熱板2之前的晶圓W進行加熱的理由。從熱處理裝置1所搬出之晶圓W，係被搬送至顯像裝置。在顯像裝置中，係將顯像液供給至晶圓W，對被曝光至光阻膜的圖案進行顯像。在塗佈了化學增幅型光阻的晶圓W中，係在進行曝光處理後，例如加熱至110℃，藉此，酸擴散於光阻中。藉由該酸，在負型光阻的情況下，係未曝光之區域成為可溶於顯像液，在正型光阻的情況下，係經曝光之區域成為可溶於顯像液。此時，藉由在面內均勻地加熱晶圓W的方式，酸會均勻地擴散於光阻膜中，且進行了顯像處理時的線寬變得均勻。Here, as described above, the reason why the wafer W placed in front of the hot plate 2 is heated by the support plate 40 will be explained. The wafer W carried out from the heat treatment apparatus 1 is transported to the imaging device. In the developing device, a developing liquid is supplied to the wafer W, and the pattern exposed to the photoresist film is developed. In the wafer W coated with the chemical amplification photoresist, after the exposure process, for example, it is heated to 110° C., whereby the acid diffuses into the photoresist. By using this acid, in the case of a negative photoresist, the unexposed areas become soluble in the developer, and in the case of a positive photoresist, the exposed areas become soluble in the developer. At this time, by uniformly heating the wafer W within the plane, the acid is uniformly diffused in the photoresist film, and the line width becomes uniform when the development process is performed.

然而，在將晶圓W放置於熱板2後，係難以在該晶圓W之面內控制溫度的均勻性，具體而言，係在晶圓W之面內會導致升溫過度特性(在開始升溫後，直至溫度成為固定為止之溫度變化的特性)產生差異。亦即，難以在面內均勻地維持晶圓W之溫度而使其上升至目標溫度。特別是，在熱板2之溫度與晶圓W之溫度的差為較大的情況下，係在晶圓W之面內變得容易產生關於升溫過度特性的差。而且，當在晶圓W之面內，升溫過度特性產生差異時，則有「在晶圓W之面內，導致熱歷程產生差異，並在晶圓W之面內，酸的擴散情況不一致，且在顯像處理時，圖案之線寬的均勻性變差」之虞。近年來，雖係藉由熱板2之加熱器圖案的最佳化或控制等來實現升溫過度特性之提高，但在實現圖案之微細化方面要求進一步的改善。However, after the wafer W is placed on the hot plate 2, it is difficult to control the temperature uniformity within the surface of the wafer W. Specifically, excessive temperature rise characteristics (at the beginning) will occur within the surface of the wafer W. After the temperature rises, the temperature change characteristics until the temperature becomes fixed) are different. That is, it is difficult to maintain the temperature of the wafer W uniformly within the surface and raise it to the target temperature. In particular, when the difference between the temperature of the hot plate 2 and the temperature of the wafer W is large, a difference in overheating characteristics is likely to occur within the surface of the wafer W. Furthermore, when there are differences in the overheating characteristics within the surface of the wafer W, there will be differences in the thermal history within the surface of the wafer W, and the diffusion of acid will be inconsistent within the surface of the wafer W. And during the development process, the uniformity of the line width of the pattern may become worse." In recent years, although the overheating characteristics have been improved by optimizing or controlling the heater pattern of the hot plate 2, further improvement has been required in achieving miniaturization of the pattern.

因此，根據上述的實施形態，在對形成有曝光後之光阻膜的顯像前之晶圓W進行熱處理的熱處理裝置1中，設置「以光阻膜中之酸擴散的第1溫度加熱晶圓W」之熱板2。而且，在熱板2的上方區域與從上方區域朝橫方向遠離的外側區域之間，設置用以搬送被載置於支撐板40之晶圓W的搬送臂4。而且，構成為在外側區域進行熱板2的加熱之前，以低於光阻膜中之酸擴散的溫度之第2溫度加熱被載置於支撐板40的晶圓W，並設成為在藉由支撐板40將由熱板2進行了加熱處理之晶圓W搬送至外側區域時，以低於第2溫度的第3溫度進行冷卻。Therefore, according to the above-mentioned embodiment, in the heat treatment apparatus 1 for performing heat treatment on the wafer W before development on which the exposed photoresist film is formed, "heating the wafer W at a first temperature at which the acid in the photoresist film diffuses" is provided. Circle W" hot plate 2. Furthermore, a transfer arm 4 for transferring the wafer W placed on the support plate 40 is provided between an upper area of the hot plate 2 and an outer area laterally distant from the upper area. Furthermore, before heating the hot plate 2 in the outer region, the wafer W placed on the support plate 40 is heated at a second temperature lower than the temperature at which the acid in the photoresist film diffuses, and is configured to be heated by When the wafer W heated by the hot plate 2 is transferred to the outer area, the support plate 40 cools the wafer W at a third temperature lower than the second temperature.

因此，可在將被搬入熱處理裝置1之晶圓W收授至熱板2之前，預先加熱至比光阻膜反應之溫度低的溫度，其後，收授至熱板2。因此，由於載置於熱板2後的晶圓W之第1溫度與被載置於熱板2之前的晶圓W之溫度的差變小，且在晶圓W之面內，升溫過度特性的差變小，故，反應在晶圓W之面內以高均勻性進行。而且，其後，藉由以晶圓W之第3溫度進行冷卻的方式，使反應在面內整體同時停止。藉由像這樣進行處理的方式，可使光阻膜在晶圓W之面內各部以高均勻性進行反應。因此，在對該晶圓W進行顯像時，可使圖案之線寬成為均勻。Therefore, before the wafer W carried into the heat treatment apparatus 1 is transferred to the hot plate 2 , it can be preheated to a temperature lower than the temperature at which the photoresist film reacts, and then transferred to the hot plate 2 . Therefore, the difference between the first temperature of the wafer W after being placed on the hot plate 2 and the temperature of the wafer W before being placed on the hot plate 2 becomes smaller, and in the surface of the wafer W, the temperature rises excessively. The difference becomes smaller, so the reaction proceeds with high uniformity within the surface of the wafer W. Then, by cooling the wafer W at the third temperature, the reaction is stopped simultaneously throughout the entire surface. By processing in this manner, the photoresist film can react with high uniformity in various parts of the surface of the wafer W. Therefore, when developing the wafer W, the line width of the pattern can be made uniform.

另外，在上述之引用文獻1的裝置，係藉由加熱部，對載置於熱板之前的晶圓W進行加熱，該加熱部，係被設置於含有熱板的容器內。因此，由於受到容器內之溫度分布的影響，因此，吾人認為難以在晶圓W之面內高精度地控制溫度。因此，在熱處理裝置1中，係與引用文獻1之裝置相比，可在晶圓W之面內進行更高均勻性的處理。In addition, in the apparatus of the above cited document 1, the wafer W placed in front of the hot plate is heated by the heating unit, and the heating unit is installed in a container containing the hot plate. Therefore, it is believed that it is difficult to control the temperature within the surface of the wafer W with high accuracy due to the influence of the temperature distribution within the container. Therefore, in the heat treatment apparatus 1, compared with the apparatus in the cited document 1, it is possible to perform processing with higher uniformity within the surface of the wafer W.

然而，在上述的熱處理裝置1所致之處理中，係在將晶圓W收授至熱板2後，支撐板40從加熱狀態切換成冷卻狀態，且並列進行熱板2之晶圓W的加熱與支撐板40的降溫。因此，在熱板2所致之處理完成後，可藉由支撐板40快速地冷卻晶圓W，並防止過度進行反應。又，由於在熱板2所致之處理完成後，不需設置將支撐板40冷卻所需的時間，因此可防止生產率下降。 另外，作為將支撐板40從加熱狀態切換成冷卻狀態之時間點，係不限於上述的例子，例如亦可為將晶圓W收授至升降銷31之前，或亦可為支撐板40往外側區域移動後。However, in the above-mentioned processing by the heat treatment apparatus 1, after the wafer W is transferred to the hot plate 2, the support plate 40 is switched from the heating state to the cooling state, and the wafer W on the hot plate 2 is processed in parallel. Heating and cooling of the support plate 40. Therefore, after the processing by the hot plate 2 is completed, the wafer W can be quickly cooled by the support plate 40 and excessive reaction can be prevented. In addition, since there is no need to provide time required for cooling the support plate 40 after the processing by the hot plate 2 is completed, a decrease in productivity can be prevented. In addition, the timing for switching the support plate 40 from the heating state to the cooling state is not limited to the above example. For example, it may be before the wafer W is received to the lift pin 31, or the support plate 40 may be moved outward. After the area is moved.

又，在上述的熱處理裝置1所致之處理中，係晶圓W被載置於支撐板40的同時，支撐板40成為加熱狀態而開始升溫。當晶圓W急遽上升至比較高的溫度時，則擔心該晶圓W發生翹曲。而且，在熱處理裝置1中，有因該翹曲而晶圓W之面內各部的反應產生差異之虞。但是，如上述般，由於是在載置晶圓W的時間點開始加熱支撐板40，因此，可防止像那樣的不良情形。In addition, during the processing by the heat treatment apparatus 1 described above, while the wafer W is placed on the support plate 40, the support plate 40 enters a heated state and starts to rise in temperature. When the temperature of the wafer W rises rapidly to a relatively high temperature, the wafer W may be warped. Furthermore, in the heat treatment apparatus 1, the warpage may cause differences in reactions at various parts of the surface of the wafer W. However, as described above, since the heating of the support plate 40 is started at the time when the wafer W is placed, such a malfunction can be prevented.

又，由於是在像這樣的時間點，針對依序被搬送至熱處理裝置1之各晶圓W進行支撐板40的加熱，因此，在晶圓W間，從開始以支撐板40進行加熱起至被收授於熱板40且結束以支撐板40進行加熱為止的時間長度成為一致。因此，如上述般，對支撐板40之升溫開始的時間點進行控制，係亦成為在晶圓W間進行高均勻性的處理。另外，雖說明了載置晶圓W的時間點與支撐板40切換成加熱狀態的時間點為同時，但亦可在從晶圓W被載置於支撐板40起經過預定時間後，進行支撐板40向加熱狀態的切換。In addition, since the support plate 40 is heated for each wafer W sequentially transported to the heat treatment apparatus 1 at such a time point, the wafers W are heated from the start with the support plate 40 to The length of time required to be received by the hot plate 40 and until heating with the support plate 40 is completed is consistent. Therefore, as described above, controlling the timing at which the temperature rise of the support plate 40 starts can also result in highly uniform processing among the wafers W. In addition, although the timing of placing the wafer W and the timing of switching the support plate 40 to the heating state have been described, the support may be performed after a predetermined time has elapsed since the wafer W was placed on the support plate 40 . Switching of the plate 40 to the heating state.

然而，亦考慮例如為了從熱處理裝置1搬出先前的晶圓W，在藉由支撐板40進行冷卻後且將後續的晶圓W載置於支撐板40之前，使支撐板40的溫度上升而成為預定溫度，並將後續的晶圓W載置於成為了該預定溫度之支撐板40且進行加熱。亦即，如上述般，在將複數個晶圓W依序搬送至熱處理裝置1且進行處理之際，亦可在將各晶圓W搬送至支撐板40之前，以使支撐板40成為預定溫度的方式，進行加熱。但是，在該情況下，依搬送機構A5之各晶圓W的搬送狀況不同，係考慮在朝熱處理裝置1搬送晶圓W時，支撐板40未達到預定溫度且該搬送機構A5必需使晶圓W不收授至支撐板40而待機。因此，為了防止產生像那樣的待機時間且使生產率提高，支撐板40從冷卻狀態向加熱狀態之切換，係如前述般，在朝支撐板40載置晶圓W後或與載置同時進行為較佳。However, for example, in order to unload the previous wafer W from the heat treatment apparatus 1, it is also conceivable that the temperature of the support plate 40 is increased after cooling by the support plate 40 and before the subsequent wafer W is placed on the support plate 40. The subsequent wafer W is placed on the support plate 40 at the predetermined temperature and heated. That is, as described above, when a plurality of wafers W are sequentially transported to the thermal processing apparatus 1 and processed, the supporting plate 40 may be brought to a predetermined temperature before each wafer W is transported to the supporting plate 40 way to heat. However, in this case, the transportation status of each wafer W by the transportation mechanism A5 is different. It is considered that when the wafer W is transported to the heat treatment apparatus 1, the support plate 40 does not reach the predetermined temperature and the transportation mechanism A5 must move the wafer W. W is not transferred to the support plate 40 and is on standby. Therefore, in order to prevent such waiting time and improve productivity, the support plate 40 is switched from the cooling state to the heating state as described above, after the wafer W is placed on the support plate 40 or simultaneously with the placement. Better.

又，為了在晶圓W之面內及複數個晶圓W間進行均勻的處理，係於藉由支撐板40所加熱之晶圓W的溫度為上述之第2溫度且穩定的狀態下，將晶圓W搬入烘箱(使其位於熱板2之上方區域)為較佳。亦即，確保晶圓W之溫度達到第2溫度後直至被搬入烘箱為止有充分時間為較佳。但是，當晶圓W載置於支撐板40後直至被搬入烘箱為止的時間過長時，則有導致生產率下降而光阻膜變質之虞。因此，以因應將晶圓W搬入烘箱之預定的時間點，調整載置了晶圓W的支撐板40從冷卻狀態向加熱狀態之切換之時間點的方式，進行控制為較佳。換言之，以使「晶圓W被搬入烘箱的時間點與開始由支撐板40進行加熱的時間點之時間成為預定時間」的方式，進行控制為較佳。In addition, in order to perform uniform processing within the surface of the wafer W and among the plurality of wafers W, the temperature of the wafer W heated by the support plate 40 is the above-mentioned second temperature and is stable. It is better to move the wafer W into the oven (so that it is located in the area above the hot plate 2). That is, it is preferable to ensure sufficient time after the temperature of the wafer W reaches the second temperature until it is moved into the oven. However, if the time from when the wafer W is placed on the support plate 40 until it is moved into the oven is too long, productivity may decrease and the photoresist film may deteriorate. Therefore, it is preferable to control the timing of switching of the support plate 40 on which the wafer W is placed from the cooling state to the heating state in accordance with a predetermined time when the wafer W is loaded into the oven. In other words, it is preferable to perform the control so that "the time when the wafer W is loaded into the oven and the time when heating by the support plate 40 starts becomes a predetermined time."

敍述像這樣的控制之具體之一例。例如，在熱板2之溫度的變更中，係無法將晶圓W搬入烘箱。當晶圓W被載置於支撐板40時，藉由上述之一連串的動作，在支撐板40位於上方區域之預定的時間點與無法將晶圓W搬入烘箱之期間重疊的情況下，於該無法搬入之期間結束後，以使支撐板40位於上方區域的方式，使加熱狀態之切換的時間點延遲。亦即，並非在與將晶圓W載置於支撐板40的同時進行支撐板40之加熱，而是在使其待機於支撐板40後開始該加熱，並使從開始該加熱直至搬入烘箱為止的時間不會從預定的時間偏移。Describe a specific example of such control. For example, while the temperature of the hot plate 2 is changing, the wafer W cannot be moved into the oven. When the wafer W is placed on the support plate 40, through the above-mentioned series of actions, if the predetermined time point when the support plate 40 is located in the upper area overlaps with the period when the wafer W cannot be moved into the oven, at that time After the period of being unable to carry in is over, the timing of switching the heating state is delayed so that the support plate 40 is located in the upper area. That is, instead of heating the support plate 40 while placing the wafer W on the support plate 40 , the heating is started after the wafer W is placed on the support plate 40 , and the heating is continued from the start until the wafer is loaded into the oven. The time will not be offset from the scheduled time.

熱處理裝置1，係亦可分別個別地具備有：搬送臂4，將晶圓W加熱且收授至熱板2；及搬送臂4，接收由熱板2加熱之晶圓W並進行冷卻。例如，如圖10所示般，在熱板2之前方側上下層積地設置加熱臂4A與冷卻臂4B以代替圖1、圖2所示之熱處理裝置1的搬送臂4。加熱臂4A與冷卻臂4B，係分別具備有支撐板400，在加熱臂4A之支撐板40，係只要埋設加熱器41A即可，在冷卻臂4B，係例如只要埋設構成為可使冷卻水流通的水冷管41B即可。The heat treatment device 1 may be provided with a transfer arm 4 that heats the wafer W and transfers it to the hot plate 2, and a transfer arm 4 that receives the wafer W heated by the hot plate 2 and cools it. For example, as shown in FIG. 10 , a heating arm 4A and a cooling arm 4B are stacked up and down on the front side of the hot plate 2 instead of the transport arm 4 of the heat treatment apparatus 1 shown in FIGS. 1 and 2 . The heating arm 4A and the cooling arm 4B each have a support plate 400. The heater 41A only needs to be embedded in the support plate 40 of the heating arm 4A, and the cooling arm 4B only needs to be embedded in the support plate 40 to allow cooling water to flow. The water cooling pipe 41B is enough.

而且，只要構成為可分別在外側區域與熱板2的上方區域之間個別移動即可。圖10中42A、42B，係分別支撐加熱臂4A、冷卻臂4B之支撐板40的支撐部，430，係使加熱臂4A、冷卻臂4B個別移動的移動機構。另外，在圖10之例子中，係設置與升降銷31相同構成的升降銷34，並將升降銷34經由升降板35連接至升降機構36。而且，構成為藉由升降銷34與外部之搬送機構的協同作用進行收授。Moreover, it only needs to be configured so as to be individually movable between the outer area and the upper area of the hot plate 2 . In FIG. 10 , 42A and 42B are support portions of the support plate 40 that respectively support the heating arm 4A and the cooling arm 4B, and 430 is a moving mechanism that moves the heating arm 4A and the cooling arm 4B individually. In addition, in the example of FIG. 10 , a lifting pin 34 having the same structure as the lifting pin 31 is provided, and the lifting pin 34 is connected to the lifting mechanism 36 via the lifting plate 35 . Furthermore, it is configured to perform reception and reception by the cooperation between the lift pin 34 and an external conveyance mechanism.

而且，將加熱處理前的晶圓W載置於設成為23℃之溫度的加熱臂4A，其後，從23℃升溫至40℃。而且，使加熱臂4A移動至上方區域，將晶圓W收授至熱板2。而且，以冷卻臂4B接收加熱處理後之晶圓W，並冷卻至23℃。而且，在將晶圓W從冷卻臂4B收授至外部的搬送機構之際，係只要使加熱臂4A移動至熱板2的上方區域，以升降銷34將被載置於冷卻臂4B之晶圓W上推，並收授至外部的搬送機構即可。又，如此一來，將對晶圓W進行加熱且搬送的加熱臂4A與對晶圓W且進行冷卻且搬送的冷卻臂4B上下配置，藉此，即便在熱處理裝置1內設置了複數個搬送臂4的情況下，亦具有可避免裝置之佔置空間大型化的效果。而且，如圖1、圖2般，以構成為可藉由1台搬送臂4切換晶圓W之加熱狀態與冷卻狀態的方式，則不需個別設置將晶圓W加熱至第2溫度之搬送臂4與冷卻至第3溫度之搬送臂4，且具有可抑制裝置大型化的效果。Then, the wafer W before heat processing is placed on the heating arm 4A set to a temperature of 23°C, and then the temperature is raised from 23°C to 40°C. Then, the heating arm 4A is moved to the upper area, and the wafer W is transferred to the hot plate 2 . Then, the heat-processed wafer W is received by the cooling arm 4B and cooled to 23°C. When transferring the wafer W from the cooling arm 4B to the external transport mechanism, the heating arm 4A is moved to an area above the hot plate 2 and the wafer W placed on the cooling arm 4B is lifted by the lifting pin 34 . Just push the circle W up and send it to the external transport mechanism. In addition, in this way, the heating arm 4A for heating and conveying the wafer W and the cooling arm 4B for cooling and conveying the wafer W are arranged vertically. Therefore, even if a plurality of conveying arms are provided in the heat treatment apparatus 1 In the case of the arm 4, it also has the effect of avoiding enlargement of the installation space of the device. Furthermore, as shown in FIGS. 1 and 2 , if the heating state and the cooling state of the wafer W can be switched by one transfer arm 4 , there is no need to separately provide a transfer method for heating the wafer W to the second temperature. The arm 4 and the transfer arm 4 cooled to the third temperature also have the effect of suppressing an increase in the size of the device.

又，亦可在支撐板40內埋設調溫水的配管及冷卻水的配管或加熱器及冷卻機構。在圖1、圖2所示之熱處理裝置1中，係設置泊耳帖元件部41，該泊耳帖元件部41，係藉由被供給至支撐板40之電流的流向，切換加熱與冷卻。因此，不需個別設置將晶圓W加熱至第2溫度之加熱機構與冷卻至第3溫度之冷卻機構，且可避免裝置大型化或佈局的複雜化。Furthermore, pipes for temperature control water, pipes for cooling water, or a heater and a cooling mechanism may be embedded in the support plate 40 . The heat treatment apparatus 1 shown in FIGS. 1 and 2 is provided with a Peltier element unit 41 that switches heating and cooling based on the flow of electric current supplied to the support plate 40 . Therefore, there is no need to separately provide a heating mechanism for heating the wafer W to the second temperature and a cooling mechanism for cooling the wafer W to the third temperature, and it is possible to avoid an increase in the size of the device or a complicated layout.

又，由於將曝光後之光阻膜載置於熱板2且進行加熱時的加熱溫度，係110℃左右，因此，在以支撐板40加熱晶圓W時，係只要設成為高於氛圍溫度的第2溫度，例如從20℃加熱至70℃即可。一般而言，熱板2之加熱溫度，雖係由每一光阻種類的推薦處理溫度來決定，但嚴格來說，光阻膜，係從比其低的溫度開始產生不少反應。換言之，光阻膜的反應起始溫度，係低於熱板2之加熱溫度。亦即，第2溫度，係至少高於常溫(裝置內氛圍溫度)且應為光阻膜的反應起始溫度以上，如本次般，有時被設定為相對於熱板2之加熱溫度低20%以上。In addition, since the heating temperature when placing the exposed photoresist film on the hot plate 2 and heating is about 110°C, when heating the wafer W with the support plate 40, it only needs to be set higher than the ambient temperature. The second temperature may be, for example, heated from 20°C to 70°C. Generally speaking, the heating temperature of the hot plate 2 is determined by the recommended processing temperature of each photoresist type, but strictly speaking, the photoresist film starts to produce many reactions from a lower temperature than that. In other words, the reaction starting temperature of the photoresist film is lower than the heating temperature of the hot plate 2 . That is, the second temperature should be at least higher than normal temperature (ambient temperature within the device) and should be above the reaction starting temperature of the photoresist film. Like this time, it may be set lower than the heating temperature of the hot plate 2. More than 20%.

而且，在將晶圓W載置於熱板2且進行加熱處理的期間，將支撐板40切換成第3溫度例如23℃的冷卻狀態而進行降溫為較佳。藉由像這樣之構成，可在收授至支撐板40後立即快速地冷卻以熱板2加熱的晶圓W。 又，雖將加熱處理後之晶圓W收授至搬送臂4且冷卻至低於第2溫度的第3溫度，但該第3溫度，係指在將晶圓W持續載置於搬送臂4時最終達到的溫度，且該溫度是只要低於第2溫度即可。因此，即便為「在將加熱處理後之晶圓W收授至搬送臂4後，趁著晶圓W的溫度還未下降至第2溫度以下時，將晶圓W收授至熱處理裝置1之外部」的構成，亦包含於本揭示之範圍。Furthermore, while the wafer W is placed on the hot plate 2 and the heating process is performed, it is preferable to switch the support plate 40 to a cooling state with a third temperature, for example, 23° C. to lower the temperature. With this configuration, the wafer W heated by the hot plate 2 can be quickly cooled immediately after being transferred to the support plate 40 . Furthermore, although the heat-processed wafer W is transferred to the transfer arm 4 and cooled to a third temperature lower than the second temperature, the third temperature refers to the time when the wafer W is continuously placed on the transfer arm 4 is the temperature finally reached, and the temperature only needs to be lower than the second temperature. Therefore, even if "after the heat-processed wafer W is transferred to the transfer arm 4, before the temperature of the wafer W has dropped below the second temperature, the wafer W is transferred to the heat treatment device 1 The composition of "external" is also included in the scope of this disclosure.

又，亦可在將晶圓W搬送至熱處理裝置1之前，進行晶圓W之溫度的測定，並基於測定溫度，在從外部接收晶圓W時，調整支撐板40之溫度。例如，如圖11所示般，在該搬送機構A5設置用以測定被保持於外部的搬送機構A5之晶圓W之溫度的溫度測定部96，該溫度測定部96，係被構成為將相當於測定溫度的測定信號輸出至控制部9。而且，只要以控制部9，基於測定信號來調整輸入至泊耳帖元件部41的電流即可。作為一例，係採用如下述手法：由於在所檢測到之晶圓W的測定溫度低於某一基準之情況下，係需要更大的溫度變化量，因此，提升支撐板之初期溫度或在加熱時逐漸提升溫度。但是，考慮以不引起基板溫度超過預定溫度之過沖的方式，在加熱後半段中降低像那樣所提升之支撐板的溫度等。反之，在晶圓W之測定溫度高於某一基準的情況下，雖係為了保持加熱前半段之加熱速率，而考慮與上述相同地改變初期溫度或加熱時溫度變化，但過沖之風險與其加熱後半段之對策亦可說是相同。Alternatively, the temperature of the wafer W may be measured before the wafer W is transferred to the heat treatment apparatus 1, and based on the measured temperature, the temperature of the support plate 40 may be adjusted when the wafer W is received from the outside. For example, as shown in FIG. 11 , the transfer mechanism A5 is provided with a temperature measuring unit 96 for measuring the temperature of the wafer W held by the external transfer mechanism A5. The temperature measuring unit 96 is configured to be equivalent to The measurement signal at the measured temperature is output to the control unit 9 . Furthermore, the control unit 9 only needs to adjust the current input to the Peltier element unit 41 based on the measurement signal. As an example, the following method is adopted: when the measured temperature of the wafer W is lower than a certain reference, a larger temperature change is required. Therefore, the initial temperature of the support plate is raised or the heating is performed. Gradually increase the temperature. However, it is considered to lower the temperature of the support plate raised in this way in the second half of heating so as not to cause overshoot of the substrate temperature exceeding a predetermined temperature. On the other hand, when the measured temperature of the wafer W is higher than a certain standard, in order to maintain the heating rate in the first half of the heating, the initial temperature or the temperature change during heating may be changed in the same manner as above, but the risk of overshoot is the same. The countermeasures for the second half of heating can also be said to be the same.

而且，亦可設置蓋板，該蓋板，係在將晶圓W載置於支撐板40並升溫至第2溫度時，將支撐板40上之晶圓W之周圍的空間從周邊隔離。藉由像這樣的構成，由於可對晶圓W之周圍的空間進行隔離斷熱，因此，具有可促進晶圓W之升溫的效果。在冷卻晶圓W時，係亦可使該蓋板上升。蓋板，係亦可構成為與熱板2側之蓋板24成為一體而進行升降，此時，亦可在支撐板側的蓋板與蓋板24之連接部分隔著例如陶瓷板等的斷熱材料。Furthermore, a cover plate may be provided that isolates the space around the wafer W on the support plate 40 from the periphery when the wafer W is placed on the support plate 40 and heated to the second temperature. With such a structure, the space around the wafer W can be insulated and thermally insulated, thereby having the effect of promoting the temperature rise of the wafer W. When cooling the wafer W, the cover may also be raised. The cover plate may be integrated with the cover plate 24 on the hot plate 2 side and raised and lowered. In this case, a break such as a ceramic plate may be interposed between the connection portion of the cover plate on the support plate side and the cover plate 24. Thermal materials.

接著，簡單地敍述關於組入有上述之熱處理裝置1之塗佈、顯像裝置的整體構成。塗佈、顯像裝置，係如圖12及圖13所示，被構成為直線狀地連接載體區塊B1、處理區塊B2及介面區塊B3。在介面區塊B3，係更連接有曝光站B4。Next, the overall structure of the coating and developing device incorporating the above-mentioned heat treatment device 1 will be briefly described. The coating and developing device is configured to linearly connect the carrier block B1, the processing block B2, and the interface block B3 as shown in FIGS. 12 and 13 . In interface block B3, the system is connected to exposure station B4.

載體區塊B1，係具有從收納複數片製品用之基板即例如直徑300mm之晶圓W的搬送容器即載體C(例如FOUP)搬入搬出至裝置內的功能，並具備有：載體C的載置平台101；門102；及搬送臂103，用以從載體C搬送晶圓W。 處理區塊B2，係被構成為從下方依序層積有用以對晶圓W進行液處理的第1~第6單位區塊D1~D6，各單位區塊D1~D6，係除了由後述之液處理單元110供給至晶圓W的處理液不同以外，大致為相同之構成。The carrier block B1 has a function of loading and unloading a carrier C (for example, a FOUP), which is a transfer container for storing a plurality of substrates for wafer products, that is, wafers W with a diameter of 300 mm, into the device, and is equipped with: the placement of the carrier C The platform 101; the door 102; and the transport arm 103 are used to transport the wafer W from the carrier C. The processing block B2 is configured such that the first to sixth unit blocks D1 to D6 for performing liquid processing on the wafer W are sequentially stacked from below. Each of the unit blocks D1 to D6 is composed of the following components. The liquid processing unit 110 has substantially the same structure except that the processing liquid supplied to the wafer W is different.

圖13代表性地顯示出單位區塊D5之構成，在單位區塊D5，係設置有：搬送機構A5，在從載體區塊B1側朝向介面區塊B3之直線狀的搬送區域R3移動；及液處理單元110，具備有罩杯模組111，且例如用以將顯像液供給至晶圓W。另外，單位區塊D1(D2)，係在液處理單元110中，將成為反射防止膜的處理液塗佈於晶圓W，在單位區塊D3(D4)，係在液處理單元110中，將光阻液塗佈於晶圓W。又，在棚架單元U1~U6，係層積有前述的熱處理裝置1。在搬送區域R5之載體區塊B1側，係設置有棚架單元U7，該棚架單元U7，係藉由相互層積的複數個模組所構成。搬送臂103與搬送機構A5之間的晶圓W之收授，係經由棚架單元U7之收授模組與搬送臂104而進行。FIG. 13 representatively shows the structure of the unit block D5. The unit block D5 is provided with: a transport mechanism A5 that moves in a linear transport area R3 from the carrier block B1 side toward the interface block B3; and The liquid processing unit 110 is provided with a cup module 111 and is used to supply a developing liquid to the wafer W, for example. In addition, the unit block D1 (D2) is in the liquid processing unit 110, and a processing liquid that becomes an antireflection film is applied to the wafer W. The unit block D3 (D4) is in the liquid processing unit 110. The photoresist liquid is applied to the wafer W. In addition, the aforementioned heat treatment device 1 is stacked on the shelf units U1 to U6. A shelf unit U7 is provided on the carrier block B1 side of the transport area R5. The shelf unit U7 is composed of a plurality of modules stacked on each other. The transfer of wafers W between the transfer arm 103 and the transfer mechanism A5 is performed through the transfer module of the shelf unit U7 and the transfer arm 104 .

介面區塊B3，係用以在處理區塊B2與曝光站B4之間進行晶圓W的收授者，且具備有相互層積了複數個處理模組的棚架單元U8、U9、U10。另外，圖中105、106，係分別用以在棚架單元U8、U9間、棚架單元U9、U10間進行晶圓W之收授的搬送臂，圖中107，係用以在棚架單元U10與曝光站B4之間進行晶圓W之收授的搬送臂。The interface block B3 is used to receive and receive the wafer W between the processing block B2 and the exposure station B4, and is provided with rack units U8, U9, and U10 in which a plurality of processing modules are stacked on each other. In addition, 105 and 106 in the figure are transport arms used to receive and receive wafers W between the scaffold units U8 and U9, and between the scaffold units U9 and U10 respectively. 107 in the figure is used to transfer the wafer W between the scaffold units U8 and U9. A transfer arm that receives and receives wafer W between U10 and exposure station B4.

簡單地說明關於由塗佈、顯像裝置及曝光站B4所構成之系統之晶圓W之搬送路經的概要。晶圓W，係依下述順序流動：載體C→搬送臂103→棚架單元U7之收授模組→搬送臂104→棚架單元U7之收授模組→單位區塊D1(D2)→單位區塊D3(D4)→介面區塊B3→曝光站B4。藉此，反射防止膜及光阻膜被塗佈於晶圓W之表面，而且，對光阻膜的表面進行曝光處理。而且，進行了曝光處理之晶圓W，係經由介面區塊B3被搬送至單位區塊D5(D6)。 而且，在單位區塊D5(D6)中，進行被搬送至熱處理裝置1之前述的熱處理，其次，被搬送至液處理單元110而進行顯像處理。其後，晶圓W，係依下述順序流動：棚架單元U7之收授模組TRS→搬送臂103→載體C。 如前述般，曝光後之晶圓W，係被要求均勻地對晶圓W進行熱處理。因此，將本實施形態之熱處理裝置1應用於對曝光後之晶圓W進行加熱的熱處理裝置1，藉此，可獲得較大的效果。An outline of the transfer path of the wafer W in the system including the coating, developing device, and exposure station B4 will be briefly described. The wafer W flows in the following order: carrier C → transfer arm 103 → receiving and receiving module of the scaffolding unit U7 → transporting arm 104 → receiving and receiving module of the scaffolding unit U7 → unit block D1 (D2) → Unit block D3 (D4) → interface block B3 → exposure station B4. Thereby, the anti-reflection film and the photoresist film are coated on the surface of the wafer W, and the surface of the photoresist film is exposed. Then, the exposed wafer W is transferred to the unit block D5 (D6) via the interface block B3. Then, in the unit block D5 (D6), the unit block D5 (D6) is transferred to the heat treatment device 1 to perform the heat treatment described above, and then is transferred to the liquid processing unit 110 to perform development processing. Thereafter, the wafer W flows in the following sequence: the receiving and receiving module TRS of the shelf unit U7 → the transfer arm 103 → the carrier C. As mentioned above, after exposure, the wafer W is required to be heat-treated evenly. Therefore, a greater effect can be obtained by applying the heat treatment apparatus 1 of this embodiment to the heat treatment apparatus 1 for heating the exposed wafer W.

又，本實施形態之熱處理裝置1，係除了在晶圓W之曝光處理後進行加熱的熱處理裝置以外，例如亦可應用於在將塗佈了光阻膜之晶圓W搬送至曝光站B4之前進行加熱的熱處理裝置1。亦即，亦可用於進行PAB(預先烘烤)。但是，關於上述之PEB，係由於光阻膜反應之變化量相對於溫度的誤差較大且在晶圓W之面內被要求高精度的溫度控制，因此，作為熱處理裝置1，係使用於PEB為特佳。In addition, the heat treatment device 1 of this embodiment is a heat treatment device that heats the wafer W after the exposure process. For example, it can also be applied before the wafer W coated with the photoresist film is transported to the exposure station B4. Heat treatment device 1 for heating. In other words, it can also be used for PAB (pre-baking). However, regarding the above-mentioned PEB, since the change amount of the photoresist film reaction has a large error with respect to the temperature and high-precision temperature control is required within the surface of the wafer W, the heat treatment device 1 is used for PEB. Very good.

另外，作為熱處理裝置1，係亦可應用於化學增幅型光阻膜之加熱以外的處理。亦即，亦可使用於形成了化學增幅型光阻以外之光阻膜之晶圓W的加熱處理，或亦可應用於「將塗佈了反射防止膜形成用之藥液或絕緣膜形成用之藥液的晶圓W加熱而形成該些反射防止膜及絕緣膜」的情形。又，作為熱處理裝置1，係不限於上述之構成。亦可為「不設置蓋板24，在熱板2之一端側、另一端側設置氣體供給部、排氣部，並形成熱板2之一端側朝向另一端側的氣流，對晶圓W進行加熱」的構成。In addition, the heat treatment device 1 can also be applied to treatments other than heating of chemically amplified photoresist films. That is, it can also be used for the heat treatment of the wafer W on which a photoresist film other than the chemical amplification type photoresist is formed, or it can also be used for "coating a chemical solution for forming an antireflection film or an insulating film forming The wafer W containing the chemical solution is heated to form these anti-reflective films and insulating films. In addition, the heat treatment apparatus 1 is not limited to the above-mentioned structure. It is also possible to "not provide the cover plate 24, but provide a gas supply part and an exhaust part on one end side and the other end side of the hot plate 2, and form a gas flow from one end side of the hot plate 2 to the other end side, and perform the wafer W "Heating" composition.

如以上所探討般，本次所揭示之實施形態，係在所有方面皆為例示，吾人應瞭解該等例示並非用以限制本發明。上述之實施形態，係亦可在不脫離添附之申請專利範圍及其主旨的情況下，以各種形態進行省略、置換、變更。As discussed above, the embodiments disclosed this time are examples in all respects, and it should be understood that these examples are not intended to limit the present invention. The above-mentioned embodiments may be omitted, replaced, or modified in various forms without departing from the appended patent scope and the gist thereof.

1:熱處理裝置 2:熱板 4:搬送臂 40:支撐板 41:泊耳帖元件部1:Heat treatment device 2:Hot plate 4:Conveying arm 40:Support plate 41: Peltier component department

[圖1]表示本實施形態之熱處理裝置的縱剖側視圖。 [圖2]表示前述熱處理裝置的平面圖。 [圖3]表示被設置於前述熱處理裝置之控制部的構成圖。 [圖4]表示前述熱處理裝置之作用的說明圖。 [圖5]表示前述熱處理裝置之作用的說明圖。 [圖6]表示前述熱處理裝置之作用的說明圖。 [圖7]表示前述熱處理裝置之作用的說明圖。 [圖8]表示前述熱處理裝置之作用的說明圖。 [圖9]表示前述熱處理裝置之作用的說明圖。 [圖10]表示本實施形態之熱處理裝置之其他例的縱剖側視圖。 [圖11]表示熱處理裝置之另外其他例所設置之控制部的構成圖。 [圖12]表示設置有前述熱處理裝置之塗佈、顯像裝置的立體圖。 [圖13]前述塗佈、顯像裝置的平面圖。[Fig. 1] Fig. 1 is a longitudinal sectional side view showing the heat treatment apparatus according to this embodiment. [Fig. 2] shows a plan view of the heat treatment apparatus. [Fig. 3] Fig. 3 is a block diagram showing a control unit provided in the heat treatment apparatus. [Fig. 4] An explanatory diagram showing the operation of the heat treatment device. [Fig. 5] An explanatory diagram showing the operation of the heat treatment device. [Fig. 6] An explanatory diagram showing the operation of the heat treatment device. [Fig. 7] An explanatory diagram showing the operation of the heat treatment device. [Fig. 8] An explanatory diagram showing the operation of the heat treatment device. [Fig. 9] An explanatory diagram showing the operation of the heat treatment device. [Fig. 10] A longitudinal sectional side view showing another example of the heat treatment apparatus according to this embodiment. [Fig. 11] Fig. 11 is a block diagram showing a control unit provided in another example of the heat treatment apparatus. [Fig. 12] A perspective view showing a coating and developing device equipped with the heat treatment device. [Fig. 13] A plan view of the coating and developing device.

1:熱處理裝置 1:Heat treatment device

2:熱板 2:Hot plate

4:搬送臂 4:Conveying arm

11:殼體 11: Shell

12:搬送口 12:Transportation port

21:加熱器 21:Heater

22:間隙銷 22: Clearance pin

23:支撐柱 23:Support column

24:蓋板 24:Cover

25:支撐部 25:Support part

26:升降機構 26:Lifting mechanism

30:貫通孔 30:Through hole

31:升降銷 31: Lift pin

32:升降板 32:Lifting plate

33:升降機構 33:Lifting mechanism

40:支撐板 40:Support plate

41:泊耳帖元件部 41: Peltier component department

42:支撐構件 42:Supporting members

43:移動機構 43:Mobile mechanism

94:電源部 94:Power supply department

95:冷暖切換部 95: Heating and cooling switching department

Claims (13)

一種熱處理裝置，其特徵係，具備有：熱板，將所載置之基板加熱至第1溫度；搬送體，具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板；收授機構，在前述上方區域中之前述搬送體與前述熱板之間收授前述基板；加熱機構，將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度；及冷卻機構，以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻，前述支撐部，係共用於前述加熱機構與前述冷卻機構，前述加熱機構及前述冷卻機構，係相互切換加熱狀態與冷卻狀態，該加熱狀態，係以使所支撐之前述基板成為前述第2溫度的方式，加熱前述支撐部，該冷卻狀態，係以使所支撐之前述基板成為前述第3溫度的方式，冷卻前述支撐部，設置有輸出控制信號之控制部，在前述基板被支撐於前述支撐部的同時或被支撐於前述支撐部後，為了使該基板成為前述第2溫度，而以進行 從前述冷卻狀態向前述加熱狀態之切換的方式，輸出前述控制信號。 A heat treatment device, characterized in that it is provided with: a hot plate that heats a placed substrate to a first temperature; and a transport body that is provided with a support portion that supports the substrate, and is provided in an area above the hot plate and from the upper area. The substrate is conveyed between outer regions that are spaced apart in the lateral direction; a receiving and receiving mechanism receives and receives the substrate between the conveying body and the hot plate in the upper region; and a heating mechanism supports the substrate in the outer region by the support The substrate before being heated by the aforementioned hot plate is heated to a second temperature lower than the aforementioned first temperature; and a cooling mechanism is provided so that the heating by the aforementioned hot plate is completed and is supported on the aforementioned support portion in order to be transported toward the aforementioned outer area. The substrate is cooled to a third temperature lower than the second temperature. The support portion is used in common for the heating mechanism and the cooling mechanism. The heating mechanism and the cooling mechanism mutually switch the heating state and the cooling state. The heating state heats the support portion so that the supported substrate reaches the second temperature, and the cooling state cools the support such that the supported substrate reaches the third temperature. The section is provided with a control section that outputs a control signal, and when the substrate is supported on the supporting section or after being supported on the supporting section, in order to make the substrate reach the second temperature, The control signal is output in a manner of switching from the cooling state to the heating state. 一種熱處理裝置，其特徵係，具備有：熱板，將所載置之基板加熱至第1溫度；搬送體，具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板；收授機構，在前述上方區域中之前述搬送體與前述熱板之間收授前述基板；加熱機構，將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度；及冷卻機構，以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻，前述支撐部，係共用於前述加熱機構與前述冷卻機構，前述加熱機構及前述冷卻機構，係相互切換加熱狀態與冷卻狀態，該加熱狀態，係以使所支撐之前述基板成為前述第2溫度的方式，加熱前述支撐部，該冷卻狀態，係以使所支撐之前述基板成為前述第3溫度的方式，冷卻前述支撐部，設置有輸出控制信號之控制部，以使從前述冷卻狀態向前述加熱狀態切換之時間點成 為「因應支撐前述基板之前述搬送體位於前述上方區域的預定時間點」之時間點的方式，輸出前述控制信號。 A heat treatment device, characterized in that it is provided with: a hot plate that heats a placed substrate to a first temperature; and a transport body that is provided with a support portion that supports the substrate, and is provided in an area above the hot plate and from the upper area. The substrate is conveyed between outer regions that are spaced apart in the lateral direction; a receiving and receiving mechanism receives and receives the substrate between the conveying body and the hot plate in the upper region; and a heating mechanism supports the substrate in the outer region by the support The substrate before being heated by the aforementioned hot plate is heated to a second temperature lower than the aforementioned first temperature; and a cooling mechanism is provided so that the heating by the aforementioned hot plate is completed and is supported on the aforementioned support portion in order to be transported toward the aforementioned outer area. The substrate is cooled to a third temperature lower than the second temperature. The support portion is used in common for the heating mechanism and the cooling mechanism. The heating mechanism and the cooling mechanism mutually switch the heating state and the cooling state. The heating state heats the support portion so that the supported substrate reaches the second temperature, and the cooling state cools the support such that the supported substrate reaches the third temperature. The unit is provided with a control unit that outputs a control signal so that the time point for switching from the cooling state to the heating state is The control signal is output in a manner corresponding to a time point "at a predetermined time point when the transport body is positioned in the upper area before supporting the substrate." 一種熱處理裝置，其特徵係，具備有：熱板，將所載置之基板加熱至第1溫度；搬送體，具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板；收授機構，在前述上方區域中之前述搬送體與前述熱板之間收授前述基板；加熱機構，將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度；及冷卻機構，以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻，前述支撐部，係共用於前述加熱機構與前述冷卻機構，前述加熱機構及前述冷卻機構，係相互切換加熱狀態與冷卻狀態，該加熱狀態，係以使所支撐之前述基板成為前述第2溫度的方式，加熱前述支撐部，該冷卻狀態，係以使所支撐之前述基板成為前述第3溫度的方式，冷卻前述支撐部，設置有輸出控制信號之控制部，該控制部，係以取得關於被載置於前述支撐部之前之 前述基板的溫度之資訊，並使搬送前述基板時之前述支撐部的溫度成為與該基板的溫度相對應之溫度的方式，輸出前述控制信號。 A heat treatment device, characterized in that it is provided with: a hot plate that heats a placed substrate to a first temperature; and a transport body that is provided with a support portion that supports the substrate, and is provided in an area above the hot plate and from the upper area. The substrate is conveyed between outer regions that are spaced apart in the lateral direction; a receiving and receiving mechanism receives and receives the substrate between the conveying body and the hot plate in the upper region; and a heating mechanism supports the substrate in the outer region by the support The substrate before being heated by the aforementioned hot plate is heated to a second temperature lower than the aforementioned first temperature; and a cooling mechanism is provided so that the heating by the aforementioned hot plate is completed and is supported on the aforementioned support portion in order to be transported toward the aforementioned outer area. The substrate is cooled to a third temperature lower than the second temperature. The support portion is used in common for the heating mechanism and the cooling mechanism. The heating mechanism and the cooling mechanism mutually switch the heating state and the cooling state. The heating state heats the support portion so that the supported substrate reaches the second temperature, and the cooling state cools the support such that the supported substrate reaches the third temperature. The part is provided with a control part that outputs a control signal, and the control part is capable of obtaining information about the device placed in front of the aforementioned support part. Information on the temperature of the substrate is obtained, and the control signal is output in such a manner that the temperature of the support portion becomes a temperature corresponding to the temperature of the substrate when the substrate is transported. 一種熱處理裝置，其特徵係，具備有：熱板，將所載置之基板加熱至第1溫度；搬送體，具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板；收授機構，在前述上方區域中之前述搬送體與前述熱板之間收授前述基板；加熱機構，將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度；及冷卻機構，以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻，前述搬送體，係具備有：第1搬送體與第2搬送體，其分別具備有前述支撐部且相互獨立，藉由前述加熱機構、前述冷卻機構，分別調整前述第1搬送體之支撐部的溫度、前述第2搬送體的溫度。 A heat treatment device, characterized in that it is provided with: a hot plate that heats a placed substrate to a first temperature; and a transport body that is provided with a support portion that supports the substrate, and is provided in an area above the hot plate and from the upper area. The substrate is conveyed between outer regions that are spaced apart in the lateral direction; a receiving and receiving mechanism receives and receives the substrate between the conveying body and the hot plate in the upper region; and a heating mechanism supports the substrate in the outer region by the support The substrate before being heated by the aforementioned hot plate is heated to a second temperature lower than the aforementioned first temperature; and a cooling mechanism is provided so that the heating by the aforementioned hot plate is completed and is supported on the aforementioned support portion in order to be transported toward the aforementioned outer area. The substrate is cooled to a third temperature lower than the second temperature. The transport body is provided with: a first transport body and a second transport body, each of which is provided with the support portion and is independent of each other. The heating mechanism and the cooling mechanism adjust the temperature of the support portion of the first conveying body and the temperature of the second conveying body respectively. 如請求項2~4中任一項之熱處理裝置，其中，設置有輸出控制信號之控制部， 在前述基板被支撐於前述支撐部的同時或被支撐於前述支撐部後，為了使該基板成為前述第2溫度，而以進行從前述冷卻狀態向前述加熱狀態之切換的方式，輸出前述控制信號。 The heat treatment device according to any one of claims 2 to 4, wherein a control unit for outputting a control signal is provided, While the substrate is supported on the support part or after being supported on the support part, the control signal is output in order to switch the substrate from the cooling state to the heating state in order to bring the substrate to the second temperature. . 如請求項1、3或4中任一項之熱處理裝置，其中，設置有輸出控制信號之控制部，以使從前述冷卻狀態向前述加熱狀態切換之時間點成為「因應支撐前述基板之前述搬送體位於前述上方區域的預定時間點」之時間點的方式，輸出前述控制信號。 The heat treatment apparatus according to any one of claims 1, 3, or 4, wherein a control unit outputting a control signal is provided so that the time point of switching from the cooling state to the heating state becomes "in response to the transportation of the substrate before supporting it". The control signal is outputted in a manner that the body is located at a time point "the predetermined time point in the upper area". 如請求項1、2或4中任一項之熱處理裝置，其中，設置有輸出控制信號之控制部，前述控制部，係以取得關於被載置於前述支撐部之前之前述基板的溫度之資訊，並使搬送前述基板時之前述支撐部的溫度成為與該基板的溫度相對應之溫度的方式，輸出前述控制信號。 The heat treatment device according to any one of Claims 1, 2 or 4, wherein a control unit that outputs a control signal is provided, and the control unit is capable of obtaining information on the temperature of the substrate before being placed on the support unit. and output the control signal so that the temperature of the support portion becomes a temperature corresponding to the temperature of the substrate when the substrate is transported. 如請求項1~4中任一項之熱處理裝置，其中，設置有輸出控制信號之控制部，在前述基板被載置於前述熱板的期間，以使前述支撐部呈前述冷卻狀態且降溫的方式，輸出前述控制信號。 The heat treatment apparatus according to any one of claims 1 to 4, wherein a control unit is provided that outputs a control signal to cause the support unit to assume the cooling state and lower the temperature while the substrate is placed on the hot plate. mode, output the aforementioned control signal. 如請求項1~3中任一項之熱處理裝置，其中， 前述搬送體，係具備有：第1搬送體與第2搬送體，其分別具備有前述支撐部且相互獨立，藉由前述加熱機構、前述冷卻機構，分別調整前述第1搬送體之支撐部的溫度、前述第2搬送體的溫度。 The heat treatment device as claimed in any one of items 1 to 3, wherein, The above-mentioned transport body is provided with: a first transport body and a second transport body, each of which has the above-mentioned support part and is independent of each other, and the above-mentioned heating mechanism and the above-mentioned cooling mechanism adjust the support part of the above-mentioned first transport body respectively. temperature, the temperature of the second transport body. 如請求項1~4中任一項之熱處理裝置，其中，前述第2溫度，係20℃~70℃。 The heat treatment device of any one of claims 1 to 4, wherein the aforementioned second temperature is 20°C to 70°C. 一種熱處理方法，其特徵係，包含有：將被載置於熱板之基板加熱至第1溫度的工程；具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板的工程；在前述上方區域中之前述搬送體與前述熱板之間收授前述基板的工程；將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度的工程；及以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻的工程，相互切換加熱狀態與冷卻狀態的工程，該加熱狀態，係以使所支撐之前述基板成為前述第2溫度的方式，加熱前述支撐部，該冷卻狀態，係以使所支撐之前述基板成為 前述第3溫度的方式，冷卻前述支撐部；及在前述基板被支撐於前述支撐部的同時或被支撐於前述支撐部後，為了使該基板成為前述第2溫度而進行從前述冷卻狀態向前述加熱狀態之切換的工程。 A heat treatment method, characterized in that it includes: a process of heating a substrate placed on a hot plate to a first temperature; and a support portion for supporting the substrate, in an area above the hot plate and toward the area from the upper area. The process of transporting the substrate between the laterally distant outer areas; the process of receiving and receiving the substrate between the transport body and the hot plate in the upper area; and the process of transporting the substrate supported by the support portion in the outer area in the above-mentioned upper area. The hot plate performs a process of heating the substrate before heating to a second temperature lower than the first temperature; and so that the substrate heated by the hot plate and supported on the support part for transportation to the outer area becomes low A cooling process is performed at a third temperature of the second temperature, and a heating state and a cooling state are switched mutually. The heating state is to heat the support in such a manner that the supported substrate reaches the second temperature. part, this cooling state is such that the supported substrate becomes The method of the above-mentioned third temperature is to cool the above-mentioned support part; and while the above-mentioned substrate is supported on the above-mentioned support part or after being supported on the above-mentioned support part, in order to bring the substrate to the above-mentioned second temperature, proceed from the above-mentioned cooling state to the above-mentioned temperature. The process of switching the heating state. 一種熱處理方法，其特徵係，包含有：將被載置於熱板之基板加熱至第1溫度的工程；具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板的工程；在前述上方區域中之前述搬送體與前述熱板之間收授前述基板的工程；將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度的工程；以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻的工程；及相互切換加熱狀態與冷卻狀態的工程，該加熱狀態，係以使所支撐之前述基板成為前述第2溫度的方式，加熱前述支撐部，該冷卻狀態，係以使所支撐之前述基板成為前述第3溫度的方式，冷卻前述支撐部，從前述冷卻狀態向前述加熱狀態切換之時間點，係「因應支撐前述基板之前述搬送體位於前述上方區域的預定時間點」之時間點。 A heat treatment method, characterized in that it includes: a process of heating a substrate placed on a hot plate to a first temperature; and a support portion for supporting the substrate, in an area above the hot plate and toward the area from the upper area. The process of transporting the substrate between the laterally distant outer areas; the process of receiving and receiving the substrate between the transport body and the hot plate in the upper area; and the process of transporting the substrate supported by the support portion in the outer area in the above-mentioned upper area. The hot plate performs a process of heating the substrate before heating to a second temperature lower than the first temperature; so that the substrate heated by the hot plate and supported on the support portion for transportation to the outer area becomes lower than the first temperature. A process of cooling at a third temperature of the second temperature; and a process of switching a heating state and a cooling state mutually. The heating state is to heat the support in such a way that the supported substrate reaches the second temperature. part, the cooling state is to cool the supporting part in such a manner that the supported substrate reaches the third temperature, and the time point of switching from the cooling state to the heating state is "in response to the transport body supporting the substrate The time point located at the "predetermined time point" in the above-mentioned upper area. 一種熱處理方法，其特徵係，包含有：將被載置於熱板之基板加熱至第1溫度的工程；具備有支撐前述基板之支撐部，在前述熱板的上方區域與從該上方區域朝橫方向遠離的外側區域之間搬送該基板的工程；在前述上方區域中之前述搬送體與前述熱板之間收授前述基板的工程；將前述外側區域中被支撐於前述支撐部之以前述熱板進行加熱前的基板加熱至低於前述第1溫度之第2溫度的工程；以使由前述熱板加熱完成且為了朝前述外側區域搬送而被支撐於前述支撐部的前述基板成為低於前述第2溫度之第3溫度的方式，進行冷卻的工程；相互切換加熱狀態與冷卻狀態的工程，該加熱狀態，係以使所支撐之前述基板成為前述第2溫度的方式，加熱前述支撐部，該冷卻狀態，係以使所支撐之前述基板成為前述第3溫度的方式，冷卻前述支撐部；取得關於被載置於前述支撐部之前之前述基板的溫度之資訊的工程；及使搬送前述基板時之前述支撐部的溫度成為與前述基板的溫度相對應之溫度的工程。 A heat treatment method, characterized in that it includes: a process of heating a substrate placed on a hot plate to a first temperature; and a support portion for supporting the substrate, in an area above the hot plate and toward the area from the upper area. The process of transporting the substrate between the laterally distant outer areas; the process of receiving and receiving the substrate between the transport body and the hot plate in the upper area; and the process of transporting the substrate supported by the support portion in the outer area in the above-mentioned upper area. The hot plate performs a process of heating the substrate before heating to a second temperature lower than the first temperature; so that the substrate heated by the hot plate and supported on the support portion for transportation to the outer area becomes lower than the first temperature. A process of cooling at a third temperature of the second temperature; a process of switching a heating state and a cooling state mutually. The heating state is to heat the supporting portion in such a way that the supported substrate reaches the second temperature. , the cooling state is a process of cooling the supporting portion so that the supported substrate reaches the third temperature; obtaining information on the temperature of the substrate before being placed on the supporting portion; and transporting the aforementioned substrate. In the case of the substrate, the temperature of the support portion becomes a temperature corresponding to the temperature of the substrate.
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