TWI830529B - Laser processing device and method - Google Patents

Laser processing device and method Download PDF

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TWI830529B
TWI830529B TW111146980A TW111146980A TWI830529B TW I830529 B TWI830529 B TW I830529B TW 111146980 A TW111146980 A TW 111146980A TW 111146980 A TW111146980 A TW 111146980A TW I830529 B TWI830529 B TW I830529B
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laser processing
sheet
roller group
processing unit
unit
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TW111146980A
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Chinese (zh)
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TW202423589A (en
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王奕碩
吳龍興
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信力特科技股份有限公司
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Abstract

A device, used for laser processing a film, the device comprising: a first unwinding unit used to coordinate the transfer of a film to a first laser processing unit; the first laser processing unit used for ablating a first surface of the film and outputting the film to the first roller group; the first roller group used for turning the film upside down and outputting the film to a second roller group; the second roller group receiving the film and outputting the film to a second laser processing unit; the second laser processing unit used for ablating a second surface of the film and outputting the film to a third roller group; a second unwinding unit used for coordinate the transfer of a base material to the third roller group; the third roller group outputting the film and the base material to a third laser processing unit; the third laser processing unit comprising a sucking unit for sucking the film so that the film could be abutted against base material properly, the third laser processing unit laser cutting the film and outputting the film and the base material to a fourth roller group; and the fourth roller group separating the film and the base material.

Description

雷射加工裝置與方法 Laser processing device and method

本發明係關於一雷射加工裝置與方法,主要提供複數組雷射加工單元與滾輪組,以便能在片材持續移動的狀況下對其進行雷射加工。 The present invention relates to a laser processing device and method, which mainly provides a plurality of sets of laser processing units and roller sets so that the sheet can be laser processed while the sheet is continuously moving.

傳統的雷射加工裝置,如果要對一片材進行表面圖案消融或蝕刻,通常的步驟都是當要消融一位置的圖案時,需要將片材的移動停止,等消融出圖案後,將片材往前移動,然後將片材停止,再進行下一位置的圖案消融。但是此種裝置與方法將使得整體的製程時間拉長,造成生產成本增加。 With traditional laser processing devices, if you want to ablate or etch a surface pattern on a piece of material, the usual steps are to stop the movement of the sheet when you want to ablate the pattern at a certain position. After the pattern is ablated, move the sheet Move the sheet forward, then stop the sheet, and then perform pattern ablation at the next position. However, such devices and methods will lengthen the overall process time and increase production costs.

一雷射加工裝置,用以將一片材進行雷射加工,該裝置包括:一第一放料單元,用以配合輸出該片材至一第一雷射加工單元;該第一雷射加工單元,用以消融將該片材之一第一面並將之輸出至一第一滾輪組;該第一滾輪組,用以將該片材進行上下面翻轉並將之輸出至一第二滾輪組;該第二滾輪組接收該片材並將之輸出至一第二雷射加工單元;該第二雷射加工單元,用以消融該片材之一第二面並將之輸出至一第三滾輪組;一第二放料單元,用以配合輸出一底材至該第三滾輪組;該第三滾輪組,將該片材與該底材輸出至一第三雷射加工單元;該第三雷射加工單元,包含一吸取單元用以吸取該片材使得該片材與該底材適當抵合,該第三雷射加工單元將該片材進行雷射切割後將該片材與該底材輸出至一第四滾輪組;以及該第四滾輪組,將該片材與該底材分離。 A laser processing device for laser processing a piece of material. The device includes: a first unloading unit for outputting the sheet to a first laser processing unit; the first laser processing unit The unit is used to ablate a first side of the sheet and output it to a first roller group; the first roller group is used to flip the sheet up and down and output it to a second roller group; the second roller group receives the sheet and outputs it to a second laser processing unit; the second laser processing unit is used to ablate a second side of the sheet and output it to a first Three roller groups; a second unloading unit for outputting a base material to the third roller group; the third roller group outputs the sheet and the base material to a third laser processing unit; the The third laser processing unit includes a suction unit for sucking the sheet so that the sheet and the base material fit properly. The third laser processing unit performs laser cutting on the sheet and then combines the sheet with the base material. The substrate is output to a fourth roller group; and the fourth roller group separates the sheet from the substrate.

本發明之雷射加工裝置中,控制該第一滾輪組與該第二滾輪組之一旋轉速度比,以維持該片材於該第一雷射加工單元進行消融時之適當張力。 In the laser processing device of the present invention, the rotation speed ratio of the first roller group and the second roller group is controlled to maintain appropriate tension of the sheet when the first laser processing unit performs ablation.

本發明之雷射加工裝置中,控制該第二滾輪組與該第三滾輪組之一旋轉速度比,以維持該片材於該第二雷射加工單元進行消融時之適當張力。 In the laser processing device of the present invention, the rotation speed ratio of the second roller group and the third roller group is controlled to maintain appropriate tension of the sheet when the second laser processing unit performs ablation.

本發明之雷射加工裝置中,設定該第一雷射加工單元之一第一進料距離,當該進料單元量得該片材已前進該第一進料距離時,則控制該第一雷射加工單元對該片材之該第一面進行消融,產生至少一第一圖形,此時該片材仍維持一連續進料狀態。 In the laser processing device of the present invention, a first feeding distance of the first laser processing unit is set. When the feeding unit measures that the sheet has advanced the first feeding distance, the first feeding distance is controlled. The laser processing unit ablates the first surface of the sheet to generate at least a first pattern, while the sheet still maintains a continuous feeding state.

本發明之雷射加工裝置中,更包含一第一檢測單元位於該第一雷射單元與該第一滾輪組之間,用以檢測該片材於該第一雷射加工單元進行各次消融第一圖形之間距是否正確。 The laser processing device of the present invention further includes a first detection unit located between the first laser unit and the first roller group for detecting each ablation of the sheet in the first laser processing unit. Is the spacing between the first graphics correct?

本發明之雷射加工裝置中,設定該第二雷射加工單元之一第二進料距離,當該進料單元量得該片材已前進該第二進料距離時,則控制該第二雷射加工單元對該片材之該第二面進行消融,產生第二圖形,此時該片材仍維持一連續進料狀態。 In the laser processing device of the present invention, a second feeding distance of the second laser processing unit is set. When the feeding unit measures that the sheet has advanced the second feeding distance, the second feeding distance is controlled. The laser processing unit ablates the second surface of the sheet to produce a second pattern, while the sheet still maintains a continuous feeding state.

本發明之雷射加工裝置中,更包含一第二檢測單元位於該第二雷射加工單元與該第三滾輪組之間,用以檢測該片材於該第二雷射加工單元進行各次消融第二圖形之間距是否正確。 The laser processing device of the present invention further includes a second detection unit located between the second laser processing unit and the third roller group for detecting each time the sheet is processed by the second laser processing unit. Is the spacing between the second ablated graphics correct?

本發明之雷射加工裝置中,該第二檢測單元更可修正該第一雷射加工單元與該第二雷射加工單元進行消融時之一相對位置誤差。 In the laser processing device of the present invention, the second detection unit can further correct a relative position error between the first laser processing unit and the second laser processing unit during ablation.

本發明之雷射加工裝置中,控制該第三滾輪組與該第四滾輪組之一旋轉速度比,以維持該片材於該第三雷射加工單元進行切割時之適當張力。 In the laser processing device of the present invention, the rotation speed ratio of the third roller group and the fourth roller group is controlled to maintain appropriate tension of the sheet when the third laser processing unit is cutting.

本發明之雷射加工裝置中,更包含一第三檢測單元位於該第三滾輪組與該第三雷射加工單元之間,該第三檢測單元用以檢測該片材於該第二雷射加工單元中消融之一位置資訊並將之輸出至該第三雷射加工單元,使得該第三雷射加工單元根據該位置資訊以將該片材進行切割。 The laser processing device of the present invention further includes a third detection unit located between the third roller group and the third laser processing unit. The third detection unit is used to detect the movement of the sheet under the second laser. The processing unit ablates a piece of position information and outputs it to the third laser processing unit, so that the third laser processing unit cuts the sheet according to the position information.

本發明之雷射加工裝置中,更包含一第四檢測單元位於該第三雷射加工單元與該第四滾輪組之間,用以檢測該第三雷射加工單元將該片材進行切割之一第三圖形並據以調整該第三雷射加工單元。 The laser processing device of the present invention further includes a fourth detection unit located between the third laser processing unit and the fourth roller group for detecting when the third laser processing unit cuts the sheet. a third pattern and adjust the third laser processing unit accordingly.

本發明之雷射加工裝置中,其中該底材為紙質。 In the laser processing device of the present invention, the substrate is paper.

本發明之雷射加工裝置中,更包括:一第一清潔單元,用以接收並清潔該第四滾輪組輸出之該片材,並將之輸出至一第五滾輪組;該第五滾輪組,用以接收該片材並將該片材輸出至一第二清潔單元;以及該第二清潔單元,用以接收並清潔該片材,並將之輸出至一第六滾輪組;其中,控制該第四滾輪組、第五滾輪組與該第六滾輪組之一旋轉速度比,使得該片材於該第一清潔單元與該第二清潔單元中維持適當張力。 The laser processing device of the present invention further includes: a first cleaning unit for receiving and cleaning the sheet output by the fourth roller group, and outputting it to a fifth roller group; the fifth roller group , for receiving the sheet and outputting the sheet to a second cleaning unit; and the second cleaning unit for receiving and cleaning the sheet, and outputting it to a sixth roller group; wherein, control The rotation speed ratio of the fourth roller group, the fifth roller group and the sixth roller group enables the sheet to maintain appropriate tension in the first cleaning unit and the second cleaning unit.

本發明之雷射加工裝置中,更包括:一第三放料單元,用以輸出一PET材至該第六滾輪組;該第六滾輪組用以接收該片材與該PET材並輸出至一靜電產生單元;該靜電產生單元,用以產生一靜電使得該片材與該PET材緊密貼合。 The laser processing device of the present invention further includes: a third discharge unit for outputting a PET material to the sixth roller group; the sixth roller group is used to receive the sheet and the PET material and output them to A static electricity generating unit; the static electricity generating unit is used to generate static electricity to make the sheet material and the PET material closely adhere to each other.

本發明之雷射加工裝置中,更包括一複檢裝置,用以接收該靜電產生單元所輸出之該片材,並複檢該片材上之切割精度。 The laser processing device of the present invention further includes a rechecking device for receiving the sheet output from the static electricity generating unit and rechecking the cutting accuracy on the sheet.

101:放料單元 101: Unloading unit

1011:伺服馬達 1011:Servo motor

1013:張力輪 1013: Tension wheel

102:片材 102:Sheet

103:放料單元 103: Unloading unit

1031:放料伺服馬達 1031: Discharging servo motor

1033:張力輪 1033: Tension wheel

104:底材 104:Substrate

105:收料單元 105: Receiving unit

1051:收料伺服馬達 1051: Rewinding servo motor

1053:張力輪 1053: Tension wheel

106:隔離材 106:Isolation material

107:放料單元 107: Unloading unit

1071:放料伺服馬達 1071: Discharging servo motor

1073:張力輪 1073: Tension wheel

109:複捲單元 109: Rewinding unit

111,113,115:雷射加工單元 111,113,115:Laser processing unit

1112,1132,1152:雷射頭 1112,1132,1152:Laser head

141,142,143,144,145,146,147,148,149:滾輪組 141,142,143,144,145,146,147,148,149: Roller set

151,153,155,157:檢測單元 151,153,155,157: Detection unit

121,123:清潔單元 121,123:Cleaning unit

131:複檢裝置 131:Recheck device

133:靜電產生棒 133: Static electricity generating rod

X:固定進料距離 X: Fixed feeding distance

A,B,C:圖案 A,B,C: Pattern

第1圖係本發明之雷射加工裝置的示意圖。 Figure 1 is a schematic diagram of the laser processing device of the present invention.

第2圖係第1圖中之雷射加工單元111的局部放大圖。 Figure 2 is a partial enlarged view of the laser processing unit 111 in Figure 1 .

第3圖係片材102自放料至雷射加工單元111進行雷射消融的示意圖。 Figure 3 is a schematic diagram of the sheet 102 being discharged to the laser processing unit 111 for laser ablation.

第4圖係第1圖中之雷射加工單元113的局部放大圖。 Figure 4 is a partial enlarged view of the laser processing unit 113 in Figure 1 .

第5圖係第4圖中進行雷射消融的示意圖。 Figure 5 is a schematic diagram of laser ablation in Figure 4.

第6圖係第1圖中之雷射加工單元115的局部放大圖。 Figure 6 is a partial enlarged view of the laser processing unit 115 in Figure 1 .

第7圖係第6圖中進行雷射切割的示意圖。 Figure 7 is a schematic diagram of laser cutting in Figure 6.

第8圖係第1圖中對片材102進行清潔的示意圖。 Figure 8 is a schematic diagram of cleaning the sheet 102 in Figure 1 .

第9圖係本發明對片材102進行複捲前之複檢的示意圖。 Figure 9 is a schematic diagram of the re-inspection of the sheet 102 before rewinding according to the present invention.

請參考第1圖為本發明的一實施例的示意圖,片材102(例如膠材、電路軟片或電池之陽極或陰極片材...等)從左上角的放料單元101開始放料,藉由放料單元101的放料伺服馬達1011及張力輪1013得以隨時監控並調整片材102的張力,並藉由尋邊機構可使片材102在放料時維持在穩定的位置。 Please refer to Figure 1, which is a schematic diagram of an embodiment of the present invention. The sheet 102 (such as adhesive material, circuit film, or battery anode or cathode sheet, etc.) starts to be discharged from the discharge unit 101 in the upper left corner. The unwinding servo motor 1011 and the tension wheel 1013 of the unwinding unit 101 can monitor and adjust the tension of the sheet 102 at any time, and the edge finding mechanism can maintain the sheet 102 in a stable position during unwinding.

接著,請參考第2圖,其為第1圖的局部放大圖。雷射加工單元111包含一雷射頭1112,片材102透過滾輪組142進入雷射加工單元111,並由雷射頭1112對片材102的第一面進行雷射加工後,片材102接著進入滾輪組141,使得片材102的第二面朝上以再次進入滾輪組142。滾輪組142與滾輪組141分別設置在雷射加工單元111的上下游,藉由設定它們不同的轉速比(speed ratio),可控制片材102在雷射加工單元111中維持一適當張力,使得片材102在保持穩定移動的狀況下,雷射頭1112可持續對片材102進行雷射加工消融以形成圖案。 Next, please refer to Figure 2, which is a partially enlarged view of Figure 1. The laser processing unit 111 includes a laser head 1112. The sheet 102 enters the laser processing unit 111 through the roller group 142, and after the laser head 1112 performs laser processing on the first side of the sheet 102, the sheet 102 is then Enter the roller set 141 with the second side of the sheet 102 facing up to re-enter the roller set 142 . The roller group 142 and the roller group 141 are respectively arranged upstream and downstream of the laser processing unit 111. By setting their different speed ratios, the sheet 102 can be controlled to maintain an appropriate tension in the laser processing unit 111, so that While the sheet 102 maintains stable movement, the laser head 1112 can continue to perform laser processing and ablation on the sheet 102 to form patterns.

為了進一步說明如何使得片材102在移動下對其進行加工,請參考第3圖。經由設定雷射加工單元111一個固定的進料距離X,每當本加工裝置量得片材102前進了進料距離X後,則雷射加工單元111就會對材料表面進行消融以形成圖案A,此時片材102仍維持連續進料狀態(未靜止),而圖案A的形狀則是可由使用者輸入至雷射頭1112以設定之。檢測單元151,例如為CCD,則可檢測圖案A的位置,以確保各圖案A間的距離是否為X,若產生誤差,則可調整雷射頭1112的消融時間以校正之。當然,根據圖案A的位置與分佈,可設置多個檢測單元151以進行更精確之檢測與調整。 To further illustrate how to process the sheet 102 while moving, please refer to Figure 3 . By setting a fixed feeding distance X for the laser processing unit 111, each time the processing device measures that the sheet 102 has advanced the feeding distance , at this time, the sheet 102 still maintains a continuous feeding state (not stationary), and the shape of the pattern A can be set by the user input to the laser head 1112 . The detection unit 151, such as a CCD, can detect the position of the pattern A to ensure whether the distance between the patterns A is X. If an error occurs, the ablation time of the laser head 1112 can be adjusted to correct it. Of course, according to the position and distribution of pattern A, multiple detection units 151 can be provided for more accurate detection and adjustment.

接著請參考第1圖,當片材102由滾輪組142輸出後接著進入滾輪組143以進入雷射加工單元113,在其下游設置了滾輪組144,其中類似的,可藉由調整滾輪組143與滾輪組144的旋轉速度比以調整片材102在雷射加工單元113中之張力。若為了節省整體裝置的成本與空間,亦可省略滾輪組143,此時則是透過調整滾輪組142與滾輪組144的旋轉速度比以調整片材102在雷射加工單元113中之張力。 Next, please refer to Figure 1. When the sheet 102 is output from the roller group 142, it then enters the roller group 143 to enter the laser processing unit 113. A roller group 144 is provided downstream. Similarly, the roller group 143 can be adjusted by adjusting the roller group 144. The ratio with the rotation speed of the roller group 144 is used to adjust the tension of the sheet 102 in the laser processing unit 113 . In order to save the cost and space of the entire device, the roller group 143 can also be omitted. In this case, the tension of the sheet 102 in the laser processing unit 113 is adjusted by adjusting the rotation speed ratio of the roller group 142 and the roller group 144 .

接著請同時參考第4圖與第5圖。雷射加工單元113亦包含雷射頭1132,用以針對片材102之第二面進行消融以產生一圖案B。與第3圖中的控制方式類似,在第5圖中,亦設定設定雷射加工單元113一個固定的進料距離X,每當本加工裝置已量得片材102前進了進料距離X後,則雷射加工單元113就會對材料表面進行消融以形成圖案B,此時片材102仍維持連續進料狀態(未靜止),而圖案B的形狀則是可由使用者輸入至雷射頭1132以設定之,其中,圖案B與圖案A的形狀可以相同或相異。 Then please refer to Figure 4 and Figure 5 at the same time. The laser processing unit 113 also includes a laser head 1132 for ablating the second surface of the sheet 102 to generate a pattern B. Similar to the control method in Figure 3, in Figure 5, a fixed feeding distance X is also set for the laser processing unit 113. Whenever the processing device has measured that the sheet 102 has advanced the feeding distance X , the laser processing unit 113 will ablate the material surface to form pattern B. At this time, the sheet 102 still maintains a continuous feeding state (not stationary), and the shape of pattern B can be input to the laser head by the user. 1132 to set it, wherein the shapes of pattern B and pattern A can be the same or different.

檢測單元153位於雷射加工單元113與滾輪組144之間,其除了可檢測雷射加工單元113消融出的各圖案B之間距是否正確外,亦可修正雷射加工單元113與雷射加工單元111相對位置之誤差,使其相對位置隨時保持正確且穩定。同樣的,根據圖案B的位置與分佈,可設置多個檢測單元153以進行更精確之檢測與調整。 The detection unit 153 is located between the laser processing unit 113 and the roller group 144. In addition to detecting whether the distance between the patterns B ablated by the laser processing unit 113 is correct, it can also correct the laser processing unit 113 and the laser processing unit. 111 relative position error, so that its relative position remains correct and stable at all times. Similarly, according to the position and distribution of pattern B, multiple detection units 153 can be provided for more accurate detection and adjustment.

接著請參考第6圖,雷射加工單元115具備雷射頭1152與吸取單元1154,在此階段中雷射頭1152係用以將片材102進行一圖案C的切割全斷,此與前述雷射加工單元111與雷射加工單元113進行片材102的表面消融加工方式不同,而是要將片材102進行雷射加工穿透。但是當片材102進行雷射的切割全斷之後,整體片材102會變得過軟而影響後續的製程,所以在此階段必須搭配一底材104以對片材102進行適當貼抵支撐。但是如果片材102其表面之鍍層為碳粉的狀況下,其極容易被沾黏或接觸而散離,故底材不可具有黏性,在本實施例中可以使用紙質材料來做為底材104,因其不具備黏性但又有一定的透氣性與支撐性。 Next, please refer to Figure 6. The laser processing unit 115 is equipped with a laser head 1152 and a suction unit 1154. At this stage, the laser head 1152 is used to completely cut the sheet 102 in a pattern C. This is different from the aforementioned laser. The laser processing unit 111 and the laser processing unit 113 perform surface ablation processing on the sheet 102 in different ways. Instead, they perform laser processing and penetration on the sheet 102 . However, after the sheet 102 is completely cut by laser, the entire sheet 102 will become too soft and affect the subsequent manufacturing process. Therefore, a base material 104 must be used at this stage to properly support the sheet 102. However, if the coating on the surface of the sheet 102 is made of carbon powder, it will be easily adhered or separated by contact, so the substrate cannot be sticky. In this embodiment, paper material can be used as the substrate. 104, because it is not sticky but has certain breathability and support.

接著請參考第1圖,放料單元103其本身的放料伺服馬達1031及張力輪1033得以隨時監控及調整底材104之張力,並藉由尋邊機構可使底材104在 放料時維持在穩定的位置。請同時參考第1圖與第6圖,放料單元103將底材104放料出至滾輪組144,使得片材102與底材104一起送至雷射加工單元115,此時吸取單元1154進行吸取使得片材102與底材104貼抵。 Next, please refer to Figure 1. The unwinding servo motor 1031 and tension wheel 1033 of the unwinding unit 103 can monitor and adjust the tension of the substrate 104 at any time, and the edge-finding mechanism can make the substrate 104 Maintain a stable position when discharging. Please refer to Figures 1 and 6 at the same time. The unloading unit 103 unloads the substrate 104 to the roller group 144, so that the sheet 102 and the substrate 104 are sent to the laser processing unit 115. At this time, the suction unit 1154 performs The suction makes the sheet 102 and the substrate 104 touch each other.

請參考第6圖與第7圖,檢測單元155可檢測前一站雷射加工單元113在片材102表面消融出的圖案B的位置,並將此位置資訊送至雷射加工單元115,使雷射加工單元115可以依據設定對片材102進行對位切割。接著,輸出至滾輪組145後再將片材102與底材104分離,此時片材102將進入清潔單元121,而底材104則透過收料單元105進行收料。收料單元105其本身的收料伺服馬達1051及張力輪1053可隨時監控及調整底材104之張力,視加工實際需求,可另藉由尋邊機構可使底材104在收料時維持在穩定的位置。同樣地,透過調整滾輪組144與滾輪組145的旋轉速度比可以調整片材102與底材104在雷射加工單元115中之張力。 Please refer to Figures 6 and 7. The detection unit 155 can detect the position of the pattern B ablated by the laser processing unit 113 of the previous station on the surface of the sheet 102, and send this position information to the laser processing unit 115, so that The laser processing unit 115 can perform alignment cutting on the sheet 102 according to settings. Then, after being output to the roller group 145, the sheet 102 and the base material 104 are separated. At this time, the sheet 102 will enter the cleaning unit 121, and the base material 104 will be collected through the collection unit 105. The rewinding servo motor 1051 and tension wheel 1053 of the rewinding unit 105 can monitor and adjust the tension of the substrate 104 at any time. Depending on the actual processing requirements, an edge-finding mechanism can be used to maintain the substrate 104 at the same position during rewinding. stable position. Similarly, by adjusting the rotation speed ratio of the roller group 144 and the roller group 145, the tension of the sheet 102 and the substrate 104 in the laser processing unit 115 can be adjusted.

檢測單元157位於雷射加工單元115與滾輪組145之間,其可檢測雷射加工單元115切割精度確認及修正,確保切割精度隨時保持正確且穩定。同樣的,根據圖案C的位置與分佈,可設置多個檢測單元157以進行更精確之檢測與調整。 The detection unit 157 is located between the laser processing unit 115 and the roller group 145. It can detect the cutting accuracy of the laser processing unit 115, confirm and correct it, and ensure that the cutting accuracy remains correct and stable at all times. Similarly, according to the position and distribution of pattern C, multiple detection units 157 can be provided for more accurate detection and adjustment.

繼續參考第8圖,當片材102由滾輪組145離開後將依序進入清潔單元121、滾輪組146、清潔單元123與滾輪組147。其中,滾輪組145與滾輪組146可使用其旋轉速度比以調整片材102在清潔單元121中之張力,而滾輪組146與滾輪組147可使用其旋轉速度比以調整片材102在清潔單元123中之張力。在本實施例中,清潔單元121與清潔單元123可使用皮帶式清潔機構,以轉動方式將位於片材102上之殘屑清除乾淨。待清除完畢後,後續將進入最終的複檢與複捲成捲材 之製程,但若此片材102其表面鍍層為容易被散離或沾黏之材料,例如碳粉(或易碎裂、過軟......等等),則此時複捲之前需先加一層隔離材106,其材料可為例如PET等。隔離材106係由放料單元107所放出,其本身的放料伺服馬達1071及張力輪1073得以隨時監控及調整隔離材106之張力,並視加工實際需求,可藉由尋邊機構可使隔離材106在放料時維持在穩定的位置。 Continuing to refer to FIG. 8 , when the sheet 102 leaves the roller group 145 , it will sequentially enter the cleaning unit 121 , the roller group 146 , the cleaning unit 123 and the roller group 147 . Among them, the roller group 145 and the roller group 146 can use their rotation speed ratio to adjust the tension of the sheet 102 in the cleaning unit 121 , and the roller group 146 and the roller group 147 can use their rotation speed ratio to adjust the tension of the sheet 102 in the cleaning unit 121 . Tension in 123. In this embodiment, the cleaning unit 121 and the cleaning unit 123 can use a belt-type cleaning mechanism to clean the debris on the sheet 102 in a rotational manner. After the cleaning is completed, the final re-inspection and rewinding into rolls will follow. process, but if the surface coating of the sheet 102 is made of materials that are easily scattered or sticky, such as carbon powder (or easily broken, too soft, etc.), then before rewinding A layer of isolation material 106 needs to be added first, and its material can be, for example, PET. The isolation material 106 is released by the unwinding unit 107. Its own unwinding servo motor 1071 and tension wheel 1073 can monitor and adjust the tension of the isolation material 106 at any time. Depending on the actual processing needs, the isolation can be achieved through the edge search mechanism. The material 106 is maintained in a stable position during discharge.

繼續參考第9圖,當片材102與隔離材106離開滾輪組146後,此時需要先經過一靜電產生棒133,使得片材102與隔離材106得以因靜電緊密貼合後,再依序經過滾輪組148、複檢裝置131、滾輪組149,同樣的滾輪組148與滾輪組149可使用其旋轉速度比以調整片材102在此階段製程中之張力。複檢裝置131可即時對片材102進行切割尺寸精度複檢並將複檢資料傳至FTP伺服電腦儲存。最後,透過複捲單元109將片材102與隔離材106複捲成捲材。 Continuing to refer to Figure 9, when the sheet 102 and the spacer 106 leave the roller group 146, they need to pass through a static electricity generating rod 133 first, so that the sheet 102 and the spacer 106 can be closely adhered to each other due to static electricity. After the roller group 148, the re-inspection device 131, and the roller group 149, the same roller group 148 and the roller group 149 can use their rotation speed ratio to adjust the tension of the sheet 102 at this stage of the process. The re-inspection device 131 can re-inspect the cutting size accuracy of the sheet 102 in real time and transmit the re-inspection data to the FTP server computer for storage. Finally, the sheet 102 and the separator 106 are rewinded into a roll through the rewinding unit 109 .

雖然本發明的技術內容已經揭露如上述段落,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神下所之更動與潤飾,皆應涵蓋於本發明範疇內,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although the technical content of the present invention has been disclosed in the above paragraphs, it is not intended to limit the present invention. Any modifications and modifications made by those skilled in the art without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, The scope of protection of this creation shall be determined by the scope of the patent application attached.

101:放料單元 101: Unloading unit

103:放料單元 103: Unloading unit

105:收料單元 105: Receiving unit

107:放料單元 107: Unloading unit

109:複捲單元 109: Rewinding unit

102:片材 102:Sheet

104:底材 104:Substrate

106:隔離材 106:Isolation material

111:雷射加工單元 111:Laser processing unit

113:雷射加工單元 113:Laser processing unit

115:雷射加工單元 115:Laser processing unit

141,142,143,144,145,146,147,148,149:滾輪組 141,142,143,144,145,146,147,148,149: Roller set

133:靜電產生棒 133: Static electricity generating rod

131:複檢裝置 131:Recheck device

Claims (15)

一雷射加工裝置,用以將一片材進行雷射加工,該雷射加工裝置的操作方法包括:一第一放料單元,用以輸出該片材至一第一雷射加工單元;該第一雷射加工單元,用以消融將該片材之一第一面並將之輸出至一第一滾輪組;該第一滾輪組,用以將該片材進行上下面翻轉並將之輸出至一第二滾輪組;該第二滾輪組接收該片材並將之輸出至一第二雷射加工單元;該第二雷射加工單元,用以消融該片材之一第二面並將之輸出至一第三滾輪組;一第二放料單元,用以輸出一底材至該第三滾輪組;該第三滾輪組,將該片材與該底材輸出至一第三雷射加工單元;該第三雷射加工單元,包含一吸取單元用以吸取該片材使得該片材與該底材適當抵合,該第三雷射加工單元將該片材進行雷射切割後將該片材與該底材輸出至一第四滾輪組;以及該第四滾輪組,將該片材與該底材分離。 A laser processing device is used to perform laser processing on a piece of material. The operating method of the laser processing device includes: a first unloading unit for outputting the sheet to a first laser processing unit; The first laser processing unit is used to ablate a first side of the sheet and output it to a first roller group; the first roller group is used to flip the sheet up and down and output it to a second roller group; the second roller group receives the sheet and outputs it to a second laser processing unit; the second laser processing unit is used to ablate a second side of the sheet and output to a third roller group; a second discharging unit is used to output a substrate to the third roller group; the third roller group outputs the sheet and the substrate to a third laser Processing unit; the third laser processing unit includes a suction unit for sucking the sheet so that the sheet is properly in contact with the base material. The third laser processing unit laser-cuts the sheet. The sheet and the substrate are output to a fourth roller group; and the fourth roller group separates the sheet from the substrate. 如請求項1之該雷射加工裝置,其中,控制該第一滾輪組與該第二滾輪組之一旋轉速度比,以維持該片材於該第一雷射加工單元進行消融時之適當張力。 The laser processing device of claim 1, wherein the rotation speed ratio of the first roller group and the second roller group is controlled to maintain appropriate tension of the sheet when the first laser processing unit performs ablation. . 如請求項1之該雷射加工裝置,其中,控制該第二滾輪組與該第三滾輪組之一旋轉速度比,以維持該片材於該第二雷射加工單元進行消融時之適當張力。 The laser processing device of claim 1, wherein the rotation speed ratio of the second roller group and the third roller group is controlled to maintain appropriate tension of the sheet when the second laser processing unit performs ablation. . 如請求項1之該雷射加工裝置,其中,設定該第一雷射加工單元之一第一進料距離,當該進料單元量得該片材已前進該第一進料距離時,則控制該第一雷射加工單元對該片材之該第一面進行消融,產生至少一第一圖形,此時該片材仍維持一連續進料狀態。 The laser processing device of claim 1, wherein a first feeding distance of the first laser processing unit is set, and when the feeding unit measures that the sheet has advanced the first feeding distance, then The first laser processing unit is controlled to ablate the first surface of the sheet to generate at least a first pattern, while the sheet still maintains a continuous feeding state. 如請求項4之該雷射加工裝置,更包含一第一檢測單元位於該第一雷射單元與該第一滾輪組之間,用以檢測該片材於該第一雷射加工單元進行各次消融該第一圖形之間距是否正確。 The laser processing device of claim 4 further includes a first detection unit located between the first laser unit and the first roller group for detecting the sheet when the first laser processing unit performs each step. Whether the spacing between the first graphics is correct. 如請求項1之該雷射加工裝置,其中,設定該第二雷射加工單元之一第二進料距離,當該進料單元量得該片材已前進該第二進料距離時,則控制該第二雷射加工單元對該片材之該第二面進行消融,產生第二圖形,此時該片材仍維持一連續進料狀態。 The laser processing device of claim 1, wherein a second feeding distance of the second laser processing unit is set, and when the feeding unit measures that the sheet has advanced the second feeding distance, then The second laser processing unit is controlled to ablate the second surface of the sheet to generate a second pattern. At this time, the sheet still maintains a continuous feeding state. 如請求項6之該雷射加工裝置,更包含一第二檢測單元位於該第二雷射加工單元與該第三滾輪組之間,用以檢測該片材於該第二雷射加工單元進行各次消融該第二圖形之間距是否正確。 The laser processing device of claim 6 further includes a second detection unit located between the second laser processing unit and the third roller group for detecting the sheet being processed by the second laser processing unit. Whether the distance between the second graphics for each ablation is correct. 如請求項7之該雷射加工裝置,該第二檢測單元更可修正該第一雷射加工單元與該第二雷射加工單元進行消融時之一相對位置誤差。 As in the laser processing device of claim 7, the second detection unit can further correct a relative position error between the first laser processing unit and the second laser processing unit during ablation. 如請求項1之該雷射加工裝置,其中,控制該第三滾輪組與該第四滾輪組之一旋轉速度比,以維持該片材於該第三雷射加工單元進行切割時之適當張力。 The laser processing device of claim 1, wherein the rotation speed ratio of the third roller group and the fourth roller group is controlled to maintain appropriate tension of the sheet when the third laser processing unit is cutting. . 如請求項9之該雷射加工裝置,更包含一第三檢測單元位於該第三滾輪組與該第三雷射加工單元之間,該第三檢測單元用以檢測該片材於該第二雷射加工單元中消融之一位置資訊,並將之輸出至該 第三雷射加工單元,使得該第三雷射加工單元根據該位置資訊以將該片材進行切割。 The laser processing device of claim 9 further includes a third detection unit located between the third roller group and the third laser processing unit, and the third detection unit is used to detect the movement of the sheet on the second ablation position information in the laser processing unit and output it to the The third laser processing unit enables the third laser processing unit to cut the sheet according to the position information. 如請求項10之該雷射加工裝置,更包含一第四檢測單元位於該第三雷射加工單元與該第四滾輪組之間,用以檢測該第三雷射加工單元將該片材進行切割之一第三圖形,並據以調整該第三雷射加工單元。 The laser processing device of claim 10 further includes a fourth detection unit located between the third laser processing unit and the fourth roller group for detecting the processing of the sheet by the third laser processing unit. Cut a third pattern and adjust the third laser processing unit accordingly. 如請求項1之該雷射加工裝置,其中該底材為紙質。 The laser processing device of claim 1, wherein the substrate is paper. 如請求項1之該雷射加工裝置,更包括:一第一清潔單元,用以接收並清潔該第四滾輪組輸出之該片材,並將之輸出至一第五滾輪組;該第五滾輪組,用以接收該片材並將該片材輸出至一第二清潔單元;以及該第二清潔單元,用以接收並清潔該片材,並將之輸出至一第六滾輪組;其中,控制該第四滾輪組、第五滾輪組與該第六滾輪組之一旋轉速度比,使得該片材於該第一清潔單元與該第二清潔單元中維持適當張力。 The laser processing device of claim 1 further includes: a first cleaning unit for receiving and cleaning the sheet output by the fourth roller group, and outputting it to a fifth roller group; the fifth roller group The roller group is used to receive the sheet and output the sheet to a second cleaning unit; and the second cleaning unit is used to receive and clean the sheet and output it to a sixth roller group; wherein , controlling the rotation speed ratio of the fourth roller group, the fifth roller group and the sixth roller group so that the sheet maintains appropriate tension in the first cleaning unit and the second cleaning unit. 如請求項13之該雷射加工裝置,更包括:一第三放料單元,用以輸出一PET材至該第六滾輪組;該第六滾輪組用以接收該片材與該PET材並輸出至一靜電產生單元; 該靜電產生單元,用以產生一靜電使得該片材與該PET材緊密貼合。 The laser processing device of claim 13 further includes: a third discharge unit for outputting a PET material to the sixth roller group; the sixth roller group is used to receive the sheet and the PET material and Output to a static electricity generating unit; The static electricity generating unit is used to generate static electricity to make the sheet material and the PET material closely adhere to each other. 如請求項14之該雷射加工裝置,更包括一複檢裝置,用以接收該靜電產生單元所輸出之該片材,並複檢該片材上之切割精度。 The laser processing device of claim 14 further includes a rechecking device for receiving the sheet output from the static electricity generating unit and rechecking the cutting accuracy on the sheet.
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CN100398249C (en) * 2003-01-21 2008-07-02 丰田钢铁中心株式会社 Laser cutting device, laser cutting method and laser cutting system
TWI367140B (en) * 2004-04-08 2012-07-01 Hitachi Via Mechanics Ltd Laser machining apparatus for sheet-like workpiece
CN113333968A (en) * 2021-06-04 2021-09-03 广州新可激光设备有限公司 Laser processing system of volume to volume control
JP2022034813A (en) * 2020-08-19 2022-03-04 株式会社アマダ Laser processing machine
CN215966925U (en) * 2019-09-24 2022-03-08 大族激光科技产业集团股份有限公司 Laser processing system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100398249C (en) * 2003-01-21 2008-07-02 丰田钢铁中心株式会社 Laser cutting device, laser cutting method and laser cutting system
TWI367140B (en) * 2004-04-08 2012-07-01 Hitachi Via Mechanics Ltd Laser machining apparatus for sheet-like workpiece
CN215966925U (en) * 2019-09-24 2022-03-08 大族激光科技产业集团股份有限公司 Laser processing system
JP2022034813A (en) * 2020-08-19 2022-03-04 株式会社アマダ Laser processing machine
CN113333968A (en) * 2021-06-04 2021-09-03 广州新可激光设备有限公司 Laser processing system of volume to volume control

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