JP7097666B2 - Film manufacturing method and vacuum film forming equipment - Google Patents

Description

The present invention relates to a film manufacturing method including a step of forming a thin film on a film substrate in a reduced pressure environment and a step of forming markings on the surface of the film after the thin film is formed, and a vacuum film forming apparatus used thereof.

In the film manufacturing process, while transporting a long film in the longitudinal direction, defects are detected by an in-line inspection device, and markings are formed on the film surface at the defect detection site on the downstream side in the transport direction. .. By forming the marking on the defect detection portion, after the film is cut to a predetermined size in the subsequent process, the defective portion including the defect can be easily excluded from the product by using the marking as a mark.

For marking on the film, a method of attaching an ink layer to the surface of the film by using a pen or an inkjet marker is generally used. Since the ink layer attached to the defective portion can be easily detected by a camera or the like and by human visual inspection, the defective portion can be reliably and easily removed in the subsequent process.

On the other hand, in a vacuum film forming process such as sputtering, CVD, or vacuum deposition, the solvent evaporates instantaneously, so that marking with ink cannot be applied. Therefore, as a method for forming markings on a film in a vacuum process, marking by laser processing has been proposed (for example, Patent Document 1). In the laser method, concave markings are formed on the film surface by irradiating the defect detection site or its periphery with a laser.

Japanese Unexamined Patent Publication No. 2013-216965

Laser marking equipment is expensive to install. Further, in a reduced pressure environment, droplets generated by laser processing tend to reattach to the film, which causes new defects in non-defective parts. In particular, optical films for displays such as antireflection films and transparent electrode films are also poor in quality due to minute defects caused by laser-processed droplets and the like. Therefore, there is a need for a marking forming method that can form markings on the film surface even in a reduced pressure environment and does not generate foreign substances such as processing droplets during marking formation.

In the marking forming method of the present invention, defects contained in the film are detected while the long film substrate is conveyed along the longitudinal direction, and marking is made on the film surface of the region including the detected defects in the marking forming portion. Form. In the marking forming portion, marking is formed by pressing an embossing roll on the film surface to perform embossing.

In the film manufacturing method of the present invention, a thin film such as a metal, a metal oxide, or a semiconductor is formed on the film substrate while the long film substrate is conveyed in the longitudinal direction in a reduced pressure environment. Such films include antireflection films in which a metal oxide thin film is formed on a transparent film substrate, and transparent electrode films in which a conductive thin film is formed on a transparent film substrate; films. Flexible semiconductor devices such as solar cells and film organic EL devices; gas barrier films and the like can be mentioned. Examples of the method for forming a thin film on the film substrate include vacuum processes such as a sputtering method, an ion plating method, a vacuum vapor deposition method, and a CVD method.

In the method for producing a film of the present invention, defects are detected during or after the thin film is formed on the film substrate. Markings are formed by pressing an embossing roll to emboss the film surface in the region containing the detected defects. The marking is preferably formed on the surface of the film on the thin film forming surface side.

In one embodiment, the marking forming portion includes a backup roll and an embossed roll, and the film is conveyed to the downstream side by traveling in contact with the backup roll. Disadvantages The embossed roll is separated from the film while the non-detection site is running on the backup roll. While the defect detection site is running on the backup roll, embossing is performed by pressing the embossing roll onto the film to form markings.

Further, the present invention relates to a vacuum film forming apparatus for producing a film having a thin film on a film substrate. The vacuum film forming apparatus is configured to form markings on the film surface by applying the above marking forming method.

The vacuum film forming apparatus includes an unwinding roll that continuously unwinds a long film substrate and supplies it to the downstream side, a film forming section that forms a thin film on the film substrate, and an inspection section that detects defects contained in the film. , A marking forming portion for forming markings on the film surface in the region containing the detected defects, and a take-up roll for winding the film after passing through the marking forming portions. The marking forming portion includes a backup roll and an embossing roll. The embossed roll is configured to be movable and moves so as to abut or separate from the film running on the backup roll based on the presence or absence of detection of defects in the inspection unit. That is, the embossed roll is separated from the film while the defect non-detection portion is running on the backup roll, and the film is pressed to perform emboss marking while the defect detection portion is running on the backup roll. To move.

The marking forming portion preferably includes a plurality of embossed rolls provided along the width direction of the film. By pressing the embossed rolls provided at the corresponding positions in the width direction onto the film based on the position information of the detected defects, the marking can be regioselectively formed in the width direction.

The formation of markings by embossing can be performed in a reduced pressure environment such as in a vacuum film forming apparatus in the same manner as in a normal pressure environment. Further, since the concave marking is formed over the entire predetermined region of the film, the visibility of the marking by visual inspection is high. Further, since foreign matter and the like are not generated during marking formation, it can be suitably applied to a film manufacturing process in which there is a strict requirement for reducing defects such as an optical film.

It is a block diagram of the roll-to-roll sputtering film formation apparatus. It is a schematic perspective view which shows the structural example of the marking forming part and the film which made the marking.

FIG. 1 is a structural conceptual diagram of a roll-to-roll sputtering film forming apparatus which is a form of a vacuum film forming apparatus. The film forming apparatus 100 has an unwinding chamber 10, a film forming chamber 30, and a winding chamber 50. The vacuum film forming apparatus is provided with an exhaust mechanism (not shown) for creating a decompression environment in these rooms. In one form of the film manufacturing method using this film forming apparatus, the winding body 61 of the long film base material is set on the unwinding roll 11 in the unwinding chamber 10. By rotating the unwinding roll 11, the film base material 62 is continuously unwound and supplied to the downstream side of the film transport path. The film base material 62 unwound from the winding body 61 is conveyed onto the film forming roll 31 in the film forming chamber 30.

A film forming portion for forming a thin film by a sputtering method is provided in the film forming chamber 30. In the film forming portion, a cathode 33 is provided along the circumferential direction of the film forming roll 31, and a target 34 is arranged on the cathode 33 so as to face the film forming roll 31. The cathode 33 is connected to the power supply 41. A gas supply nozzle 37 for supplying a film-forming gas such as argon or oxygen is provided in the film-forming chamber 30. The gas supply nozzle 37 is connected to a mass flow controller 47 provided outside the film forming chamber, and the amount of gas supplied to the film forming chamber is adjusted.

A thin film is formed on the film base material 62 on the film forming roll 31. The laminated film 63 having a thin film provided on the film substrate is guided to the winding chamber 50. In the winding chamber 50, an inspection unit 70 and a marking forming unit 80 are provided from the upstream side of the film transport path. The film 64 after passing through the marking forming portion 80 is wound by a winding roll 51 provided on the downstream side, and a winding body 65 is obtained.

The inspection unit 70 detects the presence or absence of defects in the film. Defects are parts that should not be included in the product and include foreign substances such as foreign substances, bubbles, and dirt; deformed parts such as dents and scratches; thin film film thickness, optical characteristics, electrical characteristics, etc. However, non-standard parts are included. The defects to be detected by the inspection unit are not limited to those generated in the process of forming the thin film, and may include defects contained in the film substrate before the thin film is formed.

Such defects are detected by using an optical method, an electrical method, or the like. For example, foreign matter, deformation of the film, etc. are detected by photographing the film with a camera. The film thickness of the thin film can be calculated based on the spectrum of reflected light and the like. The resistance of the electrode can be measured by a method of bringing a resistance measuring roll into contact with the surface of the thin film, a non-contact resistance measuring machine, or the like.

The detection of defects in the inspection unit 70 may be carried out by using a plurality of methods. For example, in the form shown in FIG. 1, the inspection unit 70 includes a reflected light inspection machine 71 that detects the spectrum of reflected light from the film surface, and a transmitted light inspection machine 72 that detects the spectrum of transmitted light. The inspection machines 71 and 72 are interlocked with the control unit 90, and the control unit 90 determines the presence or absence of a defect based on the detection result. When a plurality of inspection machines are used, the presence or absence of points may be determined based on the inspection results of each inspection machine, or the presence or absence of defects may be determined by integrating the plurality of inspection results.

It is preferable that the inspection unit 70 monitors the entire width direction of the film to detect defects. Therefore, it is preferable that a plurality of inspection machines 71 and 72 are installed in the width direction or are installed so as to be able to reciprocate in the width direction.

The marking forming portion 80 performs embossing by pressing the embossing roll against the defect detection portion of the film. In the form shown in FIG. 1, the marking forming unit 80 includes a backup roll 81 and an embossed roll 83. The emboss roll 83 is connected to the actuator 85 linked with the control unit 90, and is configured to be movable in the vertical direction.

The film 63 conveyed from the film forming chamber 30 to the winding chamber 50 runs on the backup roll 81 after the inspection unit 70 detects a defect. The embossed roll 83 is separated from the film 63 while the defect is not detected in the film and the defect non-detection portion runs on the backup roll 81. Since the surface of the backup roll 81 is smooth, the film 63 is conveyed to the downstream side without being processed on the backup roll, and the film 64 after passing over the backup roll 81 is wound by the take-up roll 51.

If it is determined that there is a defect based on the inspection result of the inspection unit 70, the control unit 90 transmits a defect detection signal to the marking forming unit 80. When the defect detection signal is received, the emboss roll 83 moves to the backup roll 81 side (upper in FIG. 1) by the operation of the actuator 85 of the marking forming unit 80, and the film is pressed between the backup roll 81 and the emboss roll 83. Is pressed (dotted line in FIG. 1). Since the embossed roll 83 has a convex portion on the surface, when the embossed roll 83 is pressed in a state of being in contact with the film surface, concave markings are formed on the film surface.

The marking forming unit 80 continues to form markings with the embossed roll 83 pressed onto the film while receiving the defect detection signal. That is, while the defect detecting portion is running on the backup roll 81, the state in which the embossed roll is pressed against the film is maintained. When the reception of the defect detection signal is stopped, the operation of the actuator 85 causes the embossing roll 83 to move away from the backup roll 81, and the formation of the marking is completed.

It is preferable to provide a predetermined delay time between the defect detection and the transmission of the defect detection signal, or between the reception of the defect detection signal and the start of marking formation. The delay time may be set according to the distance of the film transport path from the inspection section 70 to the marking forming section 80 and the film transport speed. By providing an appropriate delay time, the positional relationship between the defect detection site and the marking forming region in the longitudinal direction can be accurately matched.

The method of controlling the marking forming portion based on the presence or absence of defect detection is not limited to the above, and may be appropriately set according to the type of defect, detection information, and the like. For example, when the detection start signal from the control unit is received at the time of defect detection, the emboss roll 83 is moved so as to be pressed onto the film, and when the defect detection end signal is received, the emboss roll 83 is separated from the film. You may move it like this. Such a control method is suitable for marking defects that tend to occur continuously in the longitudinal direction of the film, such as non-standard components such as film thickness, optical characteristics, and electrical characteristics.

Since embossing does not require foreign substances such as ink, marking can be easily formed even under reduced pressure as in normal pressure. Since scratch processing and laser processing are processes that scrape off the film, processing droplets and the like can cause new defects (contaminated parts). On the other hand, since the embossing process does not generate droplets derived from the film, the risk of new defects caused by marking can be significantly reduced. Further, in the embossing process, since the concave marking is formed on the entire surface of the machined surface pressed by the embossing roll, the visibility of the marking is high and it is easy to remove the defect detection portion in the subsequent process. In the winding body 65 wound by the winding roll 51, the defect detection portion where the marking by embossing is formed has a small contact area with the film on the outer or inner circumference. Therefore, blocking is unlikely to occur, and the occurrence of new defects due to the transfer of defects such as stains can be suppressed.

The marking by embossing may be formed on either the thin film forming surface or the thin film non-forming surface (film-forming roll contact surface) of the film. Quality inspection of the film after thin film formation, removal of defective products, etc. are often performed by observing the reflected light from the thin film forming surface side. Therefore, from the viewpoint of improving the visibility of the marking, it is preferable that the marking is formed on the thin film forming surface. In particular, when a thin film is formed on the surface of the transparent film, the embossed marking formed on the thin film forming surface is excellent in visual visibility. The transparent film preferably has a visible light transmittance of 80% or more, and examples thereof include polyester resins such as polyethylene terephthalate, cellulosic resins such as triacetyl cellulose, cycloolefin resins, and polycarbonate resins. A light-absorbing film such as a polarizing element or an opaque film may be bonded to the surface of the transparent film opposite to the thin film forming surface.

A process material such as a surface protective film may be temporarily attached to the thin film non-formed surface side of the film base material. When the thin film is formed with the process material temporarily attached to the film substrate, the marking can be detected even after the process material is peeled off in the subsequent process, so that the marking is formed on the thin film forming surface. Is preferable.

The shape of the convex portion of the embossed roll is not particularly limited. Since the area ratio of the embossed region can be adjusted by adjusting the press pressure or the like, it is preferable that the cross-sectional shape is tapered toward the tip of the convex portion. Examples of the shape of the tip portion of the convex portion include a round shape, a square shape, a rhombus shape, a hexagonal shape, and a wedge shape. The size and shape of the convex portion may be constant or non-uniform. The press pressure of the embossed roll at the time of marking may be adjusted according to the thickness and hardness (elastic modulus) of the film.

Embossing markings formed on the surface of an antireflection film having an antireflection layer sputter-deposited on the surface of a transparent film having a thickness of about 100 μm by pressing emboss rolls having different shapes and heights of convex portions on the surface of the antireflection film. It was confirmed that the area ratio of the recesses and the visibility of the marking by visual inspection were good or bad. The results are shown in Table 1. At each level, the press pressure of the embossed roll was adjusted so that a convex shape was not formed on the surface opposite to the marking forming surface of the film. The visibility of the marking by visual inspection is that the marking was easy to see when the film cut out in 10 cm square was placed still under a fluorescent lamp and visually observed from a position 80 cm away. Those that could be confirmed were marked as ○.

From the results in Table 1, by pressing the embossed roll having a large convex portion with a pressing pressure that does not cause show-through, the area ratio of the concave portion in the marking forming region (embossed region) becomes small, and the area ratio of the concave portion becomes small. It can be seen that the visibility of the marking is enhanced. The area ratio of the recesses in the embossed region is preferably 1 to 50%, more preferably 2 to 30%, and particularly preferably 3 to 10%. As described above, the area ratio of the concave portion can be adjusted to a desired range by adjusting the shape and height of the convex portion of the embossed roll, the area ratio of the convex portion, the pressing pressure of the embossed roll, and the like. The depth of the recesses of the embossed film is preferably 80% or less, more preferably 60% or less, still more preferably 50% or less of the thickness of the film. By setting the embossing depth within the above range, it is possible to suppress the transfer of the convex shape formed on the back surface side of the embossed surface to the outer or inner peripheral film in the winding body 65.

In FIG. 1, an example of detecting the presence or absence of a defect by inspection machines 71 and 72 provided in the winding chamber 50 is shown, but the defect is detected at any stage on the upstream side of the marking forming portion 80. This may be done, and an inspection machine may be provided in the film forming chamber 30. Defects may be detected during thin film formation.

Examples of the method for detecting defects during thin film formation include a method for monitoring discharge abnormalities and plasma emission abnormalities. In sputter film formation, discharge abnormality may occur due to adhesion of particles to the target surface, and the film quality of the thin film deteriorates in the portion where the discharge abnormality occurs. Such a discharge abnormality can be monitored by an arc counter or the like of the sputtering power supply 43, and when an abnormal discharge is detected, it can be determined that there is a "defect". When sputter film formation is performed while supplying a reactive gas such as oxygen, the film characteristics and the film formation rate change greatly depending on the reaction state. Therefore, the mass flow controller 47 controls the supply amount of the reactive gas while monitoring the plasma emission of the sputter film formation (plasma emission monitoring: PEM). When the plasma emission amount is out of the control range, it can be judged that there is a "defect" because there is a high possibility that an abnormality in the film quality or the film thickness has occurred.

In the film manufacturing process, both defect detection during thin film formation and defect detection after thin film formation may be performed. The necessity of marking may be determined based on the inspection result in the inspection unit 70 after the thin film formation, and the inspection result in the inspection unit 70 may be fed back to the film forming condition in the film forming unit. For example, based on the measurement result of the film thickness based on the reflection spectrum, the power supplied from the power supply 43, the valve opening degree in the mass flow controller 47 (the amount of gas supplied to the film forming chamber), and the rotation speed of the film forming roll 31 (of the film). By adjusting the transport speed) and the like, it is possible to form a film having excellent uniformity in the longitudinal direction.

In FIG. 1, one cathode 33 and a target 34 are arranged around the film forming roll 31, but a plurality of cathodes and targets may be arranged along the circumferential direction of one film forming roll. Further, the vacuum film forming apparatus may be provided with a plurality of film forming chambers, and each film forming chamber may be provided with a film forming roll. According to such a configuration, a multilayer thin film can be formed on the film substrate. Further, a plurality of cathodes and targets may be provided in the width direction. By providing a plurality of cathodes and targets in the width direction and controlling each film formation condition independently, it is possible to form a thin film having high quality uniformity in the width direction.

The method for forming the thin film is not limited to the sputtering method, and the present invention can be applied to various vacuum processes such as an ion plating method, a vacuum vapor deposition method, and a CVD method. Further, the marking forming method of the present invention can be applied to other than the process of forming a thin film in a reduced pressure environment. The marking forming method of the present invention is a step of detecting defects contained in a film while transporting a long film substrate along the longitudinal direction, and pressing an emboss roll on the film surface of a region containing the detected defects. Has a process of embossing. The marking device used to form the markings is an unwinding roll that continuously unwinds a long film substrate and supplies it to the downstream side, an inspection unit that detects defects contained in the film, and a region containing the detected defects. A marking forming portion for forming a marking on the film surface and a take-up roll for winding the film after passing through the marking forming portion are provided.

Defect detection and marking may be performed in multiple regions in the width direction. FIG. 2 is a perspective view showing a configuration example of a marking forming portion for dividing a film into three regions in the width direction for marking. In FIG. 2, the top and bottom of FIG. 1 are interchanged for easy understanding of the configuration of the marking forming portion 80, and a state in which the film runs from the right side to the left side of the figure is shown.

The marking forming unit 80 has one backup roll 81 and three embossed rolls 831, 832, 833. The backup roll 81 is provided so as to extend over the entire width direction of the film. The three embossed rolls 831, 832, 833 are arranged along the width direction of the film and are connected to the actuator 85 linked with the control unit. Each embossed roll is configured to be able to move up and down independently.

The inspection unit 70 detects defects at a plurality of points in the width direction. If it is determined that there is a defect based on the detection result of the inspection unit 70, the control unit 90 transmits a defect detection signal to the marking forming unit 80. This defect detection signal includes position information in the width direction of the defect occurrence position. The position information in the width direction is typically the coordinates in the width direction (x-coordinate in FIG. 2) of the defect detection position. Instead of the coordinates, the corresponding embossed roll number may be used as the position information. For example, by dividing the film into three regions A, B, and C corresponding to each of the embossed rolls 831, 832, 833, and identifying which region contains the defect, the corresponding embossed roll can be used. The number can be used as location information.

The marking forming unit 80 presses the embossed rolls provided at the corresponding positions in the width direction onto the film based on the position information of the detected defects. In the form shown in FIG. 2, the marking forming region 891 is provided on the film surface in a state where the first embossed roll 831 corresponding to the region A is pressed against the film. On the other hand, since the second embossed roll 832 corresponding to the region B and the third embossed roll 833 corresponding to the region C are separated from the film, no marking is formed on the regions B and C. As described above, by pressing the embossed rolls provided at the corresponding positions in the width direction on the film based on the position information of the detected defects, the marking can be regioselectively formed in the width direction.

By dividing the width direction into a plurality of regions to detect defects and form markings in a regioselective manner in the width direction, the yield of the product can be improved. With reference to FIG. 2, the improvement of the yield of the product by the regioselective marking will be described. In FIG. ₂ , in the longitudinal region L1, the marking forming region 893 is provided _only in the width region C, and in the longitudinal region L2, the marking forming region 891 is provided in the width region A and the region C. , 893 are provided, and in the longitudinal region L3 _, the marking forming region 891 is provided only in the widthwise region A.

The long film formed by roll-to-roll is cut to a predetermined size in a subsequent process. For example, an optical film for a display such as an antireflection film or a transparent electrode film is cut into a size corresponding to the screen size of the display. In the longitudinal region L1, no markings are formed on the regions _A and B, so that the film in these regions can be recovered as a good product after being cut to a predetermined size. Similarly, in the longitudinal region L2 _, the film in the region _B can be recovered as a good product, and in the longitudinal region L3, the films in the regions B and C can be recovered as good products. When marking is formed on the entire width direction, it is determined that the entire width direction is defective when selecting products based on the presence or absence of marking, whereas the marking is regioselectively marked as shown in FIG. Once formed, the area that can be recovered as a non-defective product increases, so that the yield of the product can be improved.

In FIG. 2, an example in which the film is divided into three regions A, B, and C in the width direction is shown, but the number of divisions in the width direction is not particularly limited as long as it is 2 or more. As the width of the film increases, the airflow and the discharge density in the vicinity of both ends in the width direction of the film-forming portion tend to become non-uniform. When regioselective marking is performed by dividing into three areas, both ends in the width direction and the center part, even if markings are formed due to defects at both ends in the width direction, there are defects in the center part in the width direction. If no marking is formed on the film in the central portion, it can be recovered as a good product in a subsequent process. Therefore, the film in the central portion can be recovered as a non-defective product without being affected by the film forming conditions at both ends in the width direction and the instability of quality, and the yield of the film can be improved. Therefore, the number of divisions in the width direction is preferably 3 or more. As the number of divisions in the width direction is larger, the regioselectivity of the marking is enhanced, and the yield tends to be improved accordingly. Therefore, the upper limit of the number of divisions is not particularly limited.

In the ink application method and the laser method marking, it is necessary to move the marking head in order to form the marking in a regioselective manner in the width direction. Therefore, when defects are detected in a plurality of regions in the width direction at the same time, it tends to be difficult to form markings at all positions, or the movement control of the head tends to be complicated. By providing a plurality of marking heads in the width direction, it is possible to form regioselective markings in the width direction without moving the marking heads in the width direction, but the film is cut into minute chips in a subsequent process. In order to cope with the case, it is necessary to provide a large number of marking heads depending on the number of divisions in the width direction.

On the other hand, in the present invention, by providing a plurality of embossing rolls in the width direction, regioselective marking is possible without moving the embossing roll as the marking means in the width direction. Further, by pressing the embossed roll onto the film, the marking forming region 891 as a surface is provided in the entire area of the embossed roll 831 in the width extending direction, so that the film may be cut into minute chips in a subsequent step. Correspondence is also easy. Further, since the marking forming region is planar, it has an advantage that the visibility of the marking is high.

100 Vacuum film forming equipment 10 Unwinding chamber 11 Unwinding roll 30 Film forming chamber 31 Film forming roll 70 Inspection unit 71,72 Inspection machine 80 Marking forming unit 81 Backup roll 83,831,832,833 Embossed roll 50 Winding chamber 51 Take-up roll

Claims (4)

A method for manufacturing a film having a thin film on a film substrate.
In a reduced pressure environment, while continuously unwinding the long film substrate from the unwinding roll and transporting it along the longitudinal direction,
The process of forming a thin film on the film substrate in the film formation section ;
The step of detecting defects contained in the film at the inspection unit during or after thin film formation;
A step of forming markings on the film surface of a region containing detected defects in the marking forming portion ,
Was carried out,
In the inspection section, defects are detected at a plurality of points in the width direction of the film, and defects are detected.
The marking forming portion includes a plurality of embossing rolls provided along the width direction of the film, and a backup roll extending in the entire width direction of the film .
In the marking forming portion,
The film is conveyed to the downstream side by traveling in contact with the backup roll, and is conveyed to the downstream side.
Disadvantages While the non-detection site is running on the backup roll, the plurality of embossed rolls are separated from the film.
While the defect detecting portion is running on the backup roll, the embossing roll provided at the corresponding position in the width direction is pressed against the film to perform embossing based on the position information of the detected defect. A method of manufacturing a film, in which markings are selectively formed in a position-selective manner in the width direction . The method for producing a film according to claim 1 , wherein the marking is formed on the surface of the film on the thin film forming surface side. The method for producing a film according to claim 1 or 2 , wherein a thin film is formed on a film substrate by a sputtering method. Unwinding roll that continuously unwinds a long film substrate and supplies it to the downstream side; a film forming section that forms a thin film on the film substrate; an inspection section that detects defects contained in the film; A marking forming portion for forming a marking on the film surface of the including region; and a take-up roll for winding the film after passing through the marking forming portion.
The inspection unit is configured to be able to detect defects at a plurality of locations in the film width direction.
The marking forming portion includes a plurality of embossing rolls provided along the width direction of the film , and a backup roll extending in the entire width direction of the film.
Each of the plurality of embossed rolls is configured to be movable so as to be in contact with or separated from the film running on the backup roll based on the presence / absence of detection of defects in the inspection unit and the position information of the defects. Vacuum film forming equipment.

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