TWI830358B - Circuit board pressing structure and retractable board equipment - Google Patents
Circuit board pressing structure and retractable board equipment Download PDFInfo
- Publication number
- TWI830358B TWI830358B TW111132933A TW111132933A TWI830358B TW I830358 B TWI830358 B TW I830358B TW 111132933 A TW111132933 A TW 111132933A TW 111132933 A TW111132933 A TW 111132933A TW I830358 B TWI830358 B TW I830358B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- adjustment mechanism
- frame
- pressing
- lifting
- Prior art date
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 43
- 238000003860 storage Methods 0.000 claims abstract description 25
- 238000012546 transfer Methods 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims description 60
- 125000006850 spacer group Chemical group 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Abstract
本發明「電路板之壓制組構及收放板設備」,該壓制組構包括有一框體與一壓板,其間能提供電路板容置定位以利進行濺鍍工序;該收放板設備包括有兩暫存區、一移載單元與一取放單元,該移載單元能用以將電路板進行搬移,配合該取放單元用以就壓制組構之壓板進行置放或拿取,以達成收放作業。本案之自動化技術能提升效率與產能,減少人力使用,滿足廠商實際需求。 According to the "circuit board pressing structure and retractable board equipment" of the present invention, the pressing structure includes a frame and a pressure plate, which can provide accommodating and positioning of the circuit board to facilitate the sputtering process; the retractable board equipment includes Two temporary storage areas, a transfer unit and a pick-and-place unit. The transfer unit can be used to move circuit boards, and the pick-and-place unit is used to place or pick up the pressure plate of the pressing structure to achieve Putting away work. The automation technology in this case can improve efficiency and production capacity, reduce the use of manpower, and meet the actual needs of manufacturers.
Description
本發明「電路板之壓制組構及收放板設備」,涉及一種自動化技術,特別涉及電路板濺鍍用之壓制組構與收放板設備者。 The present invention "circuit board pressing structure and retracting board equipment" relates to an automation technology, especially to the pressing structure and retracting board equipment for circuit board sputtering.
坊間電路板產製過程之其中一種濺鍍工序,需將一電路板半成品平置於一框體中,經人工藉膠帶或夾具使電路板定位於該框體後,才能進行濺鍍作業。傳統工序都是以人工進行,耗時費工,效能有限;加上作業完成後還要再次以人工將膠帶或夾具取離,導致人力無法精減,產能受到限制。 One of the sputtering processes in the circuit board manufacturing process requires a semi-finished circuit board to be placed flat in a frame. After the circuit board is manually positioned in the frame with tape or clamps, the sputtering operation can be carried out. Traditional processes are performed manually, which is time-consuming and labor-intensive, and has limited efficiency. In addition, after the operation is completed, the tape or clamp must be manually removed again, resulting in the inability to reduce manpower and limiting production capacity.
顯見,現有習知電路板進行濺鍍作業時之相關設備,仍不理想完善,實有改進的必要。 Obviously, the existing related equipment for sputtering circuit boards is still not ideal and perfect, and there is a need for improvement.
發明人有鑑於此,特以研創成本案,期能藉本案之提出,俾改進現有電路板進行濺鍍時之相關設備,期使相關濺鍍設備之功能得以更臻完善且理想,符合實際需求。 In view of this, the inventor specially researched and created this case, hoping to use the proposal of this case to improve the related equipment for sputtering existing circuit boards, hoping to make the functions of the related sputtering equipment more perfect and ideal, and meet the actual needs. .
為改善前述習知電路板進行濺鍍作業須以人工方式將電路板結合於框體內之缺失,本發明主要目的在於:提供一種「電路板之壓制組構及收放板設備」,其設計有一電路板壓制組構,能將電路板定位於該壓制組構內,以利後續進行濺鍍作業,摒棄使用膠帶與夾具,獲致提升作業效率與增進產能等目的。 In order to improve the above-mentioned shortcomings of the conventional circuit board sputtering operation that requires manual integration of the circuit board into the frame, the main purpose of the present invention is to provide a "circuit board pressing structure and retractable board equipment", which is designed with a The circuit board pressing structure can position the circuit board within the pressing structure to facilitate subsequent sputtering operations, eliminating the use of tapes and clamps, thereby improving work efficiency and increasing production capacity.
本發明另一主要目的在於:提供一種「電路板之壓制組構及收放板設備」,該收放板設備能以自動化方式進行電路板之搬移作業,特別是能將電路板相對於壓制組構進行置放或取收;藉此,本案收、放作業皆無需使用人力,能獲致提升作業效率與增進產能等目的。 Another main object of the present invention is to provide a "circuit board pressing structure and retractable board equipment", which can carry out the moving operation of the circuit board in an automated manner, and in particular can move the circuit board relative to the pressing assembly. The structure can be placed or collected; thereby, no manpower is required for the collection and placement operations in this case, which can achieve the purpose of improving operating efficiency and increasing production capacity.
為達成上述目的,本案具體之手段為:該電路板之壓制組構,包括有一框體與一壓板,其間能提供一電路板容置定位以利進行濺鍍工序;該框體,為一頂部呈開放狀且週緣有擋邊之立體結構,該框體之一底面穿設有複數穿孔,且更設置有複數個定位孔;該壓板,略呈口字狀結構,中央呈鏤空狀,該壓板之一底面適當設置有一個或兩個以上的定位塊,且該壓板結構之內端緣設置有一個或兩個以上的壓制元件,該壓制元件之斷面呈L字狀。 In order to achieve the above purpose, the specific means in this case are: the circuit board pressing structure includes a frame and a pressing plate, which can provide a circuit board accommodation and positioning to facilitate the sputtering process; the frame is a top It is an open three-dimensional structure with ribs on the periphery. The bottom surface of the frame is provided with a plurality of perforations and a plurality of positioning holes. The pressure plate has a slightly cross-shaped structure with a hollow center. One or more positioning blocks are appropriately provided on one of the bottom surfaces, and one or more pressing elements are arranged on the inner edge of the pressure plate structure, and the cross-section of the pressing elements is L-shaped.
較佳的其中一種實施例,該收放板設備,包括 有兩暫存區、一移載單元與一取放單元。該移載單元能用以將電路板進行搬移,配合該取放單元用以就壓制組構之壓板進行拿取或放置,以達成收放板作業。 In one of the preferred embodiments, the retractable plate equipment includes There are two temporary storage areas, a transfer unit and a pick-and-place unit. The transfer unit can be used to move the circuit board, and cooperates with the pick-and-place unit to pick up or place the pressing plate of the pressing structure to achieve the board retracting and placing operation.
較佳的其中一種實施例,該第一暫存區,用以提供一個或兩個以上的第一盒體堆疊置放用,該各第一盒體,頂部呈開放狀,其能提供複數電路板與間隔片上下交錯置放。 In a preferred embodiment, the first temporary storage area is used to provide one or more first boxes for stacking. Each first box has an open top and can provide a plurality of circuits. The plates and spacers are staggered up and down.
較佳的其中一種實施例,該第二暫存區,鄰設於該第一暫存區旁,用以提供一個或兩個以上的第二盒體堆疊置放用,該各第二盒體,頂部呈開放狀,其能提供複數電路板與間隔片上下交錯置放。 In a preferred embodiment, the second temporary storage area is located adjacent to the first temporary storage area to provide one or more second boxes for stacking. Each second box , the top is open, and it can provide multiple circuit boards and spacers for staggered placement up and down.
較佳的其中一種實施例,該移載單元,設於第一暫存區、第二暫存區與取放單元側邊;該移載單元包括有一第一調整機構,該第一調整機構之側面設置有一第二調整機構,且該第二調整機構能相對於該第一調整機構水平滑移;該第二調整機構下方設置有一第三調整機構,該第三調整機構底部設置有一可升降之吸盤機構;該吸盤機構可藉第一調整機構、第二調整機構與第三調整機構進行位移與升降;其中,該第一調整機構能進行水平X軸之橫向位移,該第二調整機構能進行水平Y軸之橫向位移,至於該第三調整機構則是能就垂直之Z軸進行升降位移,另該吸盤機構具有旋轉之角度調整功能。 In a preferred embodiment, the transfer unit is provided on the side of the first temporary storage area, the second temporary storage area and the pick-and-place unit; the transfer unit includes a first adjustment mechanism, and the first adjustment mechanism A second adjustment mechanism is provided on the side, and the second adjustment mechanism can slide horizontally relative to the first adjustment mechanism; a third adjustment mechanism is provided below the second adjustment mechanism, and a lifting mechanism is provided at the bottom of the third adjustment mechanism. Suction cup mechanism; the suction cup mechanism can be displaced and lifted by the first adjustment mechanism, the second adjustment mechanism and the third adjustment mechanism; wherein, the first adjustment mechanism can perform lateral displacement of the horizontal X-axis, and the second adjustment mechanism can perform As for the lateral displacement of the horizontal Y-axis, the third adjustment mechanism can perform lifting and lowering displacements on the vertical Z-axis. In addition, the suction cup mechanism has a rotation angle adjustment function.
較佳的其中一種實施例,該取放單元,設於該移載單元一末端旁緣處,該取放單元約略與該第一盒體和第二盒體位於同一軸線上,且該取放單元面對該第一盒體;該取放單元,包括一本體,該本體呈直立板片狀;該本體一側設置有至少一滑軌,且該本體頂部設置有一升降動力元件,該升降動力元件底部連接有一伸縮元件,該伸縮元件底部連接有一連結元件,該連結元件連設有一升降板,該升降板一側面能用以相對於該滑軌上下滑移;該升降板另一側面設置有一翻轉動力元件,該翻轉動力元件之一出力軸設置有一主動輸體,該主動輪體套接有一皮帶,該皮帶又同時套接有一被動輪體;該被動輪體之軸心連結有一轉軸,該轉軸被定位於兩軸承間,該軸承係設置於該升降板上;該轉軸上連設有一支架,該支架之外側緣設置有一吸盤組構。 In a preferred embodiment, the pick-and-place unit is located at an end edge of the transfer unit. The pick-and-place unit is approximately on the same axis as the first box body and the second box body, and the pick-and-place unit is located at an end edge of the transfer unit. The unit faces the first box; the pick-and-place unit includes a body, which is in the shape of an upright plate; at least one slide rail is provided on one side of the body, and a lifting power component is provided on the top of the body. The bottom of the element is connected to a telescopic element, and the bottom of the telescopic element is connected to a connecting element. The connecting element is connected with a lifting plate. One side of the lifting plate can be used to slide up and down relative to the slide rail; the other side of the lifting plate is provided with a Turning power element, one of the output shafts of the turning power element is provided with a driving transmission body, the driving wheel body is connected with a belt, and the belt is connected with a passive wheel body at the same time; the axis of the passive wheel body is connected with a rotating shaft, and the driving wheel body is connected with a rotating shaft. The rotating shaft is positioned between two bearings, and the bearing is arranged on the lifting plate; a bracket is connected to the rotating shaft, and a suction cup structure is arranged on the outer edge of the bracket.
較佳的其中一種實施例,該吸盤組構與該吸盤機構,外部連接有一習知抽真空機,以提供該些吸盤抽真空之吸力。 In a preferred embodiment, the suction cup structure and the suction cup mechanism are externally connected to a conventional vacuum machine to provide the suction force for vacuuming the suction cups.
較佳的其中一種實施例,該間隔片,係為聚酯薄膜所製成之片體,但不以此為限。 In a preferred embodiment, the spacer is made of polyester film, but it is not limited to this.
1:壓制組構 1: Suppress organization
11:框體 11:Frame
111:穿孔 111:Perforation
112:定位孔 112: Positioning hole
12:壓板 12: Pressure plate
121:定位塊 121: Positioning block
122:壓制元件 122: Pressed components
2:第一暫存區 2: The first temporary storage area
21:第一盒體 21:The first box
3:第二暫存區 3: Second temporary storage area
31:第二盒體 31: The second box
4:移載單元 4: Transfer unit
41:第一調整機構 41:First adjustment mechanism
42:第二調整機構 42:Second adjustment mechanism
43:第三調整機構 43:Third adjustment agency
44:吸盤機構 44:Suction cup mechanism
5:取放單元 5: Pick and place unit
51:本體 51:Ontology
52:滑軌 52:Slide rail
53:升降動力元件 53: Lifting power components
531:伸縮元件 531:Telescopic element
532:連結元件 532:Connection component
54:升降板 54:Lifting plate
55:翻轉動力元件 55: Flip power element
551:主動輪體 551: Driving wheel body
552:皮帶 552:Belt
553:被動輪體 553: Passive wheel body
56:轉軸 56:Rotating axis
561:軸承 561:Bearing
57:支架 57:Bracket
58:吸盤組構 58:Suction cup structure
8:間隔片 8: Spacer
9:電路板 9:Circuit board
第一圖:係為本發明壓制組構之實施示意圖;第二圖:係為本發明壓制組構之實施剖面示意圖;第三圖:係為本發明收板設備之立體外觀圖;第四圖:係為本發明就間隔片進行移取之動作示意圖;第五圖:係為本發明就電路板移取至框體之動作示意圖;第六圖:係為本發明置放壓板於框架上之動作示意圖;第七圖:係為本發明吸取壓板上移之動作示意圖;第八圖:係為完成作業後將電路送出之示意圖。 The first figure is a schematic diagram of the implementation of the pressing structure of the present invention; the second figure is a schematic cross-sectional view of the pressing structure of the present invention; the third figure is a three-dimensional appearance view of the plate closing equipment of the present invention; the fourth figure is : It is a schematic diagram of the action of removing the spacer according to the present invention; The fifth figure is a schematic diagram of the action of removing the circuit board to the frame according to the present invention; The sixth figure is the action of placing the pressure plate on the frame according to the present invention. The schematic diagram of the operation; the seventh diagram is a schematic diagram of the movement of the suction pressure plate of the present invention; the eighth diagram is a schematic diagram of sending the circuit out after the operation is completed.
茲謹就本發明「電路板之壓制組構及收放板設備」其結構組成,及所能產生的功效,配合圖式,舉一本案之較佳實施例詳細說明如下。 Hereby, we would like to give a detailed description of the structure and composition of the "circuit board pressing structure and retractable board equipment" of the present invention, as well as the effects it can produce, with reference to the drawings, and give a detailed description of the preferred embodiment of the case as follows.
首請參閱第一圖所示,本案中之該壓制組構1,包括有一框體11與一壓板12,其間能提供一電路板9容置定位以利進行濺鍍工序;該框體11,為一頂部呈開放狀且週緣有擋邊之立體結構,該框體11之一底面穿設有複數穿孔111,該些穿孔111能提供流體通過;且更設置有複數個定位孔112;該壓板12,略呈口字狀結構,中央呈鏤空狀,該壓板12之一底面適當設置有一個或兩個以上的定位塊121,且該壓板12結構之內端緣設置有一個或兩個以上的壓制元件122,該壓制元件122之斷面呈L字狀。該壓板12能用以置入該框體11中,且該定位塊121能用以伸探於該定位孔
112中,並藉壓制元件122壓制該電路板9。
Please refer to the first figure. The
再請配合第二圖,該收放板設備包括有一第一暫存區2、一第二暫存區3、一移載單元4與一取放單元5。其中,該移載單元4能用以將電路板9進行搬移,配合該取放單元5用以就壓制組構1之壓板12進行拿取或放置,以達成收放板作業。
Please refer to the second figure, the retractable board equipment includes a first
前述該第一暫存區2,用以提供一個或兩個以上的第一盒體21堆疊置放用,該各第一盒體21,頂部呈開放狀,其能提供複數電路板9與間隔片8(請再配合第三圖)上下交錯置放;該間隔片8係為聚酯薄膜所製成之片體,但不以此為限。
The aforementioned first
前述該第二暫存區3,鄰設於該第一暫存區2旁,用以提供一個或兩個以上的第二盒體31堆疊置放用,該各第二盒體31,頂部呈開放狀,其能提供複數電路板9與間隔片8上下交錯置放。
The aforementioned second
前述該移載單元4,設於第一暫存區2、該第二暫存區3與該取放單元5側邊;該移載單元4包括有一第一調整機構41,該第一調整機構41之側面設置有一第二調整機構42,且該第二調整機構42能相對於該第一調整機構41水平滑移;該第二調整機構42下方設置有一第三調整機構43,該第三調整機構43底部設置有一可升降之吸盤機構44;該吸盤機構44可藉該第一調整機構41、該第二調整機構42
與該第三調整機構43進行位移與升降;其中,該第一調整機構41能進行水平X軸之橫向位移,該第二調整機構42能進行水平Y軸之橫向位移,至於該第三調整機構43則是能就垂直之Z軸進行升降位移;另該吸盤機構44具有旋轉之角度調整功能。
The
前述該取放單元5,設於該移載單元4一末端旁緣處,該取放單元5約略與該第一盒體21和第二盒體31位於同一軸線上,且該取放單元5面對該第一盒體21;該取放單元5,包括一本體51,該本體51呈直立板片狀;該本體51一側設置有至少一滑軌52,且該本體51頂部設置有一升降動力元件53,該升降動力元件53底部連接有一伸縮元件531,該伸縮元件531底部連接有一連結元件532,該連結元件532連設有一升降板54,該升降板54一側面能用以相對於該滑軌52上下滑移;該升降板54另一側面設置有一翻轉動力元件55,該翻轉動力元件55之一出力軸設置有一主動輪體551,該主動輪體551套接有一皮帶552,該皮帶552又同時套接有一被動輪體553;該被動輪體553之軸心連結有一轉軸56,該轉軸56被定位於兩軸承561間,該軸承561係設置於該升降板54上;該轉軸56上連設有一支架57,該支架57之外側緣設置有一吸盤組構58。前述該吸盤組構58與該吸盤機構44外部皆連接有一習知抽真空機(圖中未示),以提供該些吸盤抽真空之吸力。
The aforementioned pick-and-
本案實施時,如第一圖,將一電路板9以人工或自動化機械,置放於該框體11與壓板12之間的壓制組構1內,利用壓板12本身的重量,配合該壓板12之複數定位塊121會插入框體11之定位孔112,可完成框體11與壓板12之定位關係;加上該些壓制元件122之設置,電路板9能穩定的定位其間;以利進行濺鍍工序。
When this project is implemented, as shown in the first figure, a
當全程要以本案之收放板設備進行自動化收放作業時,如第二圖,該第一暫存區2之第一盒體21中已置放有複數交錯置放的電路板9與間隔片8。令該移載單元4作動,吸盤機構44位移到第一盒體21頂部後下降,一般第一盒體21的最上面為間隔片8,利用吸盤機構44配合移載單元4將該間隔片8吸移到第二盒體31處(第三圖);而後第一盒體21的最上面已成為電路板9,利用吸盤機構44配合移載單元4將該電路板9吸移到框體11處(第四圖),而後吸盤機構44歸位去進行下一次的吸移;令該取放單元5之翻轉動力元件55作動以便使支架57、吸盤組構58和壓板12都呈平置狀(如第五圖),並令升降動力元件53作動,伸縮元件531下伸連動升降板54下移,就能將壓板12下降並置放於框體11內(即第一圖之狀態),以利後續進行濺鍍工序。
When the whole process of automatic retracting and unfolding operations is to be carried out with the retracting and placing board equipment of this case, as shown in the second figure, a plurality of staggered
當完成濺鍍等工序後,要再次取出電路板9,請參閱第六圖,令該升降動力元件53作動,伸縮元件531下伸連動升降板54下移,利用將該吸盤組構58壓貼於壓板12
頂部抽真空後(如第七圖),升降動力元件53再次作動,使伸縮元件531上縮連動升降板54上移,而後翻轉動力元件55作動以便使支架57和吸盤組構58歸位成直立狀,最後令移載單元4位移,利用其吸盤機構44將電路板9吸取移回第二盒體31(第八圖),即可完成將複數片加工後且移出壓制組構1的電路板9進行堆疊收板。
After the sputtering and other processes are completed, the
綜上所述,本案「電路板之壓制組構及收放板設備」,其技術內容完全符合發明專利之取得要件。本案在產業上確實得以利用,於申請前未曾見於刊物或公開使用,且非為公眾所知悉之技術。再者,本案有效解決先前技術中長期存在的問題並達成相關使用者與消費者長期的需求,得佐證本新型並非能輕易完成。本案富具專利法規定之「產業利用性」、「新穎性」與「進步性」等要件,爰依法提請專利,懇請 鈞局詳查,並儘早為准予專利之審定,以保護申請人之智慧財產權,俾勵創新。 In summary, the technical content of this case "circuit board pressing structure and retractable board equipment" fully meets the requirements for obtaining an invention patent. This case has indeed been utilized in industry. It has not been published in publications or publicly used before the application, and it is not a technology known to the public. Furthermore, this case effectively solves the long-standing problems in the previous technology and meets the long-term needs of relevant users and consumers, which proves that this new technology cannot be easily completed. This case is full of the requirements of "industrial applicability", "novelty" and "progressivity" stipulated in the patent law. A patent is filed in accordance with the law. We sincerely request the Office to conduct a detailed investigation and approve the patent as soon as possible to protect the applicant's wisdom. Property rights encourage innovation.
本發明已藉由上述之實施例及變化例來詳加描述。然而,熟習該項技術者當了解的是,本發明之所有的實施例在此僅為例示性而非為限制性,亦即,在不脫離本發明實質精神及範圍之內,基於上述所述及之其他變化例及修正例均為本發明所涵蓋,本發明係由後附之申請專利範圍所加以界定。 The present invention has been described in detail through the above-mentioned embodiments and variations. However, those skilled in the art should understand that all embodiments of the present invention are only illustrative and not restrictive. That is, without departing from the essential spirit and scope of the present invention, based on the above description, and other variations and modifications are all covered by the present invention, and the present invention is defined by the appended patent scope.
1:壓制組構 1: Suppress organization
11:框體 11:Frame
111:穿孔 111:Perforation
112:定位孔 112: Positioning hole
12:壓板 12: Pressure plate
121:定位塊 121: Positioning block
122:壓制元件 122: Pressed components
9:電路板 9:Circuit board
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111132933A TWI830358B (en) | 2022-08-31 | 2022-08-31 | Circuit board pressing structure and retractable board equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111132933A TWI830358B (en) | 2022-08-31 | 2022-08-31 | Circuit board pressing structure and retractable board equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI830358B true TWI830358B (en) | 2024-01-21 |
TW202412568A TW202412568A (en) | 2024-03-16 |
Family
ID=90459174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111132933A TWI830358B (en) | 2022-08-31 | 2022-08-31 | Circuit board pressing structure and retractable board equipment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI830358B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200715593A (en) * | 2005-09-27 | 2007-04-16 | Sony Chem & Inf Device Corp | Functional element package and manufacturing method thereof |
US20200221582A1 (en) * | 2019-01-07 | 2020-07-09 | Delta Electronics (Shanghai) Co., Ltd. | Power module, chip-embedded package module and manufacturing method of chip-embedded package module |
US20200229295A1 (en) * | 2019-01-11 | 2020-07-16 | Tactotek Oy | Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node |
-
2022
- 2022-08-31 TW TW111132933A patent/TWI830358B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200715593A (en) * | 2005-09-27 | 2007-04-16 | Sony Chem & Inf Device Corp | Functional element package and manufacturing method thereof |
US20200221582A1 (en) * | 2019-01-07 | 2020-07-09 | Delta Electronics (Shanghai) Co., Ltd. | Power module, chip-embedded package module and manufacturing method of chip-embedded package module |
US20200229295A1 (en) * | 2019-01-11 | 2020-07-16 | Tactotek Oy | Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110761542B (en) | Vertical automatic wall tile sticking device for building construction | |
TWI830358B (en) | Circuit board pressing structure and retractable board equipment | |
TW201925067A (en) | Mask container apparatus and mask storage and removal method | |
CN109318533B (en) | Automatic internal connection paper pasting device for gift box | |
TW202412568A (en) | Circuit board pressing structure and retractable board equipment | |
CN112331601A (en) | Chip production is with location clamping equipment | |
CN211544032U (en) | Make things convenient for sticking film machine of notebook production packing usefulness | |
CN112721023A (en) | Automatic feeding device | |
CN208761659U (en) | A kind of plate carrying gantry plane | |
CN106427053A (en) | Automatic forming apparatus for small paper boxes | |
CN216064013U (en) | Sealing ring laying tool and fuel cell bipolar plate dispensing equipment | |
CN214025215U (en) | Glass cover plate peripheral polishing jig and peripheral polishing machine | |
CN110901998A (en) | Notebook touch pad pasting positioning jig | |
TWI780424B (en) | Improving accuracy and speed of bonding apparatus | |
CN211457549U (en) | Automatic intelligent feeding equipment for PCB double-width boards | |
TWI628134B (en) | Plate and spacer moving stacking method and structure thereof | |
CN207724871U (en) | A kind of Novel rotary disk mold lifting mechanism | |
CN220787393U (en) | Rotary multilayer material stacking device | |
CN218288322U (en) | Automatic box opening device | |
CN211208470U (en) | Automatic solar cell assembly device | |
CN219443708U (en) | Four-side edge cutter for aluminum substrate | |
CN214082935U (en) | Folding box cover machine | |
TWI810848B (en) | Method and equipment for threading and withdrawing circuit board serial components | |
CN213410448U (en) | Punching device for automobile part plate | |
CN214279934U (en) | Chip production in-process transfer device |