TWI828314B - 光迴路基板及使用該光迴路基板的光學零件安裝構造體 - Google Patents

光迴路基板及使用該光迴路基板的光學零件安裝構造體 Download PDF

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Publication number
TWI828314B
TWI828314B TW111134551A TW111134551A TWI828314B TW I828314 B TWI828314 B TW I828314B TW 111134551 A TW111134551 A TW 111134551A TW 111134551 A TW111134551 A TW 111134551A TW I828314 B TWI828314 B TW I828314B
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TW
Taiwan
Prior art keywords
cladding layer
optical
aforementioned
core
cladding
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TW111134551A
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English (en)
Chinese (zh)
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TW202314304A (zh
Inventor
中臣義徳
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日商京瓷股份有限公司
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Publication of TW202314304A publication Critical patent/TW202314304A/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1228—Tapered waveguides, e.g. integrated spot-size transformers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
TW111134551A 2021-09-13 2022-09-13 光迴路基板及使用該光迴路基板的光學零件安裝構造體 TWI828314B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021148694 2021-09-13
JP2021-148694 2021-09-13

Publications (2)

Publication Number Publication Date
TW202314304A TW202314304A (zh) 2023-04-01
TWI828314B true TWI828314B (zh) 2024-01-01

Family

ID=85506473

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134551A TWI828314B (zh) 2021-09-13 2022-09-13 光迴路基板及使用該光迴路基板的光學零件安裝構造體

Country Status (5)

Country Link
US (1) US20240402424A1 (https=)
JP (1) JP7788203B2 (https=)
KR (1) KR20240038136A (https=)
TW (1) TWI828314B (https=)
WO (1) WO2023038132A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003207684A (ja) * 2002-01-15 2003-07-25 Nec Corp 光結合器及びその製造方法
CN101669053A (zh) * 2007-04-27 2010-03-10 日立化成工业株式会社 光电复合基板的制造方法、由该方法制造的光电复合基板和使用该基板的光电复合组件
TW201937223A (zh) * 2017-12-18 2019-09-16 美商羅司米爾股份有限公司 混合光纖整合式ｓｏｉ／ｉｉｉ-ｖ模組
US20200057192A1 (en) * 2016-11-07 2020-02-20 Ntt Electronics Corporation Optical circuit board, optical device, and alignment method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05249331A (ja) * 1992-01-09 1993-09-28 Nippon Telegr & Teleph Corp <Ntt> 導波路形ビームスポット変換素子およびその製造方法
JP2001083346A (ja) 1999-09-10 2001-03-30 Nippon Telegr & Teleph Corp <Ntt> 電気光混載配線板及び電気光混載モジュール並びにその製造方法
US6870987B2 (en) * 2002-08-20 2005-03-22 Lnl Technologies, Inc. Embedded mode converter
JP2009008766A (ja) 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 光モジュール
JP2009288614A (ja) 2008-05-30 2009-12-10 Hitachi Ltd 平面型光導波路アレイモジュールとその製造方法
WO2012114866A1 (ja) 2011-02-21 2012-08-30 日本電気株式会社 スポットサイズ変換器及びその製造方法
US9698564B1 (en) * 2016-02-09 2017-07-04 Oracle International Corporation Hybrid integrated MCM with waveguide-fiber connector
JP7009962B2 (ja) 2017-12-05 2022-01-26 日本電信電話株式会社 モードフィールド変換器の設計方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003207684A (ja) * 2002-01-15 2003-07-25 Nec Corp 光結合器及びその製造方法
CN101669053A (zh) * 2007-04-27 2010-03-10 日立化成工业株式会社 光电复合基板的制造方法、由该方法制造的光电复合基板和使用该基板的光电复合组件
US20200057192A1 (en) * 2016-11-07 2020-02-20 Ntt Electronics Corporation Optical circuit board, optical device, and alignment method
TW201937223A (zh) * 2017-12-18 2019-09-16 美商羅司米爾股份有限公司 混合光纖整合式ｓｏｉ／ｉｉｉ-ｖ模組

Also Published As

Publication number Publication date
TW202314304A (zh) 2023-04-01
KR20240038136A (ko) 2024-03-22
JP7788203B2 (ja) 2025-12-18
JPWO2023038132A1 (https=) 2023-03-16
WO2023038132A1 (ja) 2023-03-16
US20240402424A1 (en) 2024-12-05

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