WO2023038132A1 - 光回路基板およびそれを用いた光学部品実装構造体 - Google Patents

光回路基板およびそれを用いた光学部品実装構造体 Download PDF

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Publication number
WO2023038132A1
WO2023038132A1 PCT/JP2022/033987 JP2022033987W WO2023038132A1 WO 2023038132 A1 WO2023038132 A1 WO 2023038132A1 JP 2022033987 W JP2022033987 W JP 2022033987W WO 2023038132 A1 WO2023038132 A1 WO 2023038132A1
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WIPO (PCT)
Prior art keywords
clad
optical
core
circuit board
optical circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/033987
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English (en)
French (fr)
Japanese (ja)
Inventor
義徳 中臣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to US18/690,899 priority Critical patent/US20240402424A1/en
Priority to JP2023547017A priority patent/JP7788203B2/ja
Priority to KR1020247008228A priority patent/KR20240038136A/ko
Publication of WO2023038132A1 publication Critical patent/WO2023038132A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1228—Tapered waveguides, e.g. integrated spot-size transformers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present invention relates to an optical circuit board and an optical component mounting structure using the same.
  • optical fibers capable of high-speed communication of large amounts of data have been used for information communication (for example, Patent Document 1).
  • Optical signals are transmitted and received between this optical fiber and an optical element (silicon photonics device).
  • An optical circuit board includes a wiring board having an upper surface and an optical waveguide.
  • a part of the upper surface of the wiring board is a mounting area for optical components.
  • the optical waveguide is positioned adjacent to the mounting area of the optical component on the wiring board and includes a core, a first clad and a second clad.
  • the core includes a first portion having a first upper surface and a first lower surface and a second portion having a second upper surface and a second lower surface.
  • the first clad is positioned to sandwich the first upper surface and the first lower surface of the first portion of the core, and the second clad is positioned to sandwich the second upper surface and the second lower surface of the second portion of the core.
  • the width of the second portion is greater than the width of the first portion, and the thickness of the second portion is greater than the thickness of the first portion.
  • the refractive index of the second clad is higher than the refractive index of the first clad.
  • An optical component mounting structure includes the above optical circuit board and an optical component mounted in the mounting area.
  • FIG. 1 is a plan view showing an optical component mounting structure in which a silicon photonics device and electronic components are mounted on an optical circuit board according to an embodiment of the present disclosure
  • FIG. FIG. 2 is an enlarged explanatory view for explaining a cross section when cut in the longitudinal direction in a region X shown in FIG. 1
  • FIG. 3 is an enlarged explanatory view for explaining the cross-sectional shape of the core when cut in the extension direction of the core in the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining a planar shape of a core in a region Y shown in FIG. 2
  • FIG. 5 is an explanatory diagram for explaining the positional relationship between the first clad and the second clad when cut in the extension direction of the core;
  • FIG. 5 is an explanatory diagram for explaining the positional relationship between the first clad and the second clad when cut in the extension direction of the core;
  • FIG. 5 is an explanatory diagram for explaining the positional relationship between the first clad and the second clad when cut in the extension direction of the core;
  • FIG. 5 is an explanatory diagram for explaining the positional relationship between the first clad and the second clad when cut in the extension direction of the core;
  • MFD mode field diameter
  • the width of the second portion is greater than the width of the first portion, and the thickness of the second portion is greater than the thickness of the first portion. Furthermore, the refractive index of the second clad is higher than the refractive index of the first clad.
  • FIG. 1 is a plan view showing an optical component mounting structure 10 in which a silicon photonics device (optical component) 4 is mounted on an optical circuit board 1 according to one embodiment of the present disclosure.
  • An optical circuit board 1 includes a wiring board 2 and an optical waveguide 3.
  • a wiring board generally used for an optical circuit board can be used.
  • a part of the upper surface of the wiring board 2 is a mounting area where the optical component 4 is mounted.
  • such a wiring board 2 includes, for example, a core board and buildup layers laminated on both sides of the core board.
  • the core substrate is not particularly limited as long as it is an insulating material. Examples of insulating materials include resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, and polyphenylene ether resins. These resins may be used in combination of two or more.
  • the core substrate usually has through-hole conductors for electrically connecting the upper and lower surfaces of the core substrate.
  • the core substrate may contain a reinforcing material.
  • reinforcing materials include insulating cloth materials such as glass fibers, glass nonwoven fabrics, aramid nonwoven fabrics, aramid fibers, and polyester fibers. Two or more reinforcing materials may be used in combination.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the core substrate.
  • the buildup layer has a structure in which insulating layers and conductor layers are alternately laminated.
  • a portion of the outermost conductor layer (the conductor layer positioned on the upper surface of the wiring board) includes a first conductor layer 21a on which the optical waveguide 3 is positioned.
  • the conductor layer is a metal layer made of metal such as copper.
  • the insulating layer included in the buildup layer is not particularly limited as long as it is an insulating material, like the core substrate. Examples of insulating materials include resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, and polyphenylene ether resins. These resins may be used in combination of two or more.
  • each insulating layer may be made of the same resin or different resins.
  • the insulating layer and the core substrate included in the buildup layer may be made of the same resin or different resins.
  • the buildup layers usually have via-hole conductors for electrically connecting the layers.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the insulating layer included in the buildup layer.
  • the optical waveguide 3 included in the optical circuit board 1 is located on the surface of the first conductor layer 21a on the surface of the wiring board 2 . More specifically, the optical waveguide 3 is located adjacent to the silicon photonics device (optical component) 4 on the wiring board 2 (adjacent to the mounting area of the optical component 4 on the wiring board 2).
  • FIG. 2 is an enlarged explanatory view for explaining a cross section when cut in the longitudinal direction in the region X shown in FIG.
  • the optical waveguide 3 has a structure in which a clad 32, a core 31 and a clad 32 are laminated in this order from the first conductor layer 21a side.
  • a core 31 included in the optical waveguide 3 is a portion through which an optical signal entering the optical waveguide 3 propagates.
  • the material forming the core 31 is not limited, and is appropriately set in consideration of, for example, light transmittance and wavelength characteristics of propagating light. Examples of materials include epoxy resin and silicone resin.
  • the refractive index of the core 31 is higher than that of the clad 32 , and the optical signal propagates through the core 31 due to such a refractive index difference.
  • the core 31 is positioned at one end of the optical waveguide 3 so as to face a silicon waveguide (Si waveguide) 41 included in the silicon photonics device 4 . That is, the side surface of the Si waveguide 41 and the side surface of the core 31 of the optical waveguide 3 are positioned to face each other. Optical signals are transmitted and received between the core 31 and the Si waveguide 41 at this end.
  • One optical waveguide 3 has a plurality of cores 31 as shown in FIG.
  • FIG. 3 is an enlarged explanatory view for explaining the cross-sectional shape of the core when cut in the extension direction of the core in the region Y shown in FIG.
  • FIG. 4 is an enlarged explanatory view for explaining the planar shape of the core in the region Y shown in FIG.
  • the core 31 includes a first portion 31a having a first upper surface 31a1 and a first lower surface 31a2, a second portion 31b having a second upper surface 31b1 and a second lower surface 31b2, and a tapered portion 31c. .
  • the first portion 31 a is positioned closer to the optical component 4
  • the second portion 31 b is positioned farther from the optical component 4 .
  • the width and thickness of the first portion 31a in plan view and cross-section view (hereinafter sometimes simply referred to as “width and thickness”) are, for example, the width and thickness of the Si waveguide 41 included in the silicon photonics device 4. set accordingly.
  • the width and thickness of the first portion 31a are determined so that the MFD (mode field diameter) of the Si waveguide 41 and the MFD of the first portion 31a facing the Si waveguide 41 are approximated. A determination method will be described later.
  • the length of the first portion 31a is not limited.
  • the first portion 31a has a relatively small width and a small adhesion force with the clad 32 . Therefore, the thickness is preferably 20 ⁇ m or more and 500 ⁇ m or less from the viewpoint of reducing peeling during exposure and development, which are steps of forming the first portion 31a, for example.
  • the width and thickness of the second portion 31b are greater than the width and thickness of the first portion 31a.
  • the first portion 31a and the second portion 31b are connected via a tapered portion 31c.
  • the tapered portion 31c has a width and thickness substantially the same as the width and thickness of the first portion 31a at the end on the first portion 31a side, and the width and thickness of the second portion 31b at the end on the second portion 31b side. They have approximately the same width and thickness.
  • the presence of the tapered portion 31c makes it difficult for the optical signal passing through the core 31 to be reflected, and the loss can be further reduced.
  • the central axis of the first portion 31a and the central axis of the second portion 31b may be on the same axis.
  • the transmission efficiency of optical signals is further improved.
  • the upper surface of the first portion 31a may be flush with the upper surface of the second portion 31b, and the center of the width of the first portion 31a and the center of the width of the second portion 31b may coincide in plan view. . Even with such a configuration, the transmission efficiency of the optical signal is further improved.
  • the cross-sectional shape of the first portion 31a and the second portion 31b when cut in the transverse direction is not limited, and examples thereof include polygonal shapes such as squares and rectangles, circular shapes, and elliptical shapes. Among these, a square shape is preferable in terms of optical signal transmission efficiency.
  • Cladding 32 includes a first clad 32a and a second clad 32b, as shown in FIGS.
  • the first clad 32a is positioned to sandwich the first upper surface 31a1 and the first lower surface 31a2 of the first portion 31a of the core 31, and the second clad 32b is positioned to sandwich the second upper surface 31b1 and the second upper surface 31b1 of the second portion 31b of the core 31. 2 are positioned so as to sandwich the lower surface 31b2.
  • the material forming the first clad 32a is not limited, and examples thereof include epoxy resin and silicone resin.
  • the material forming the second clad 32b is also not limited, and examples thereof include epoxy resin and silicone resin.
  • the refractive index of the second clad 32b should be made higher than the refractive index of the first clad 32a.
  • the clad 32 sandwiching the tapered portion 31c is not particularly limited, and may be either the first clad 32a or the second clad 32b. For example, a portion of the tapered portion 31 may be sandwiched between the first clads 32a and the remaining portion may be sandwiched between the second clads 32b.
  • the first clad 32a located on the side of the first lower surface 31a2 of the first portion 31a has a groove 321 along the end of the first portion 31a on the optical component 4 side, as shown in FIG. may have. Due to the presence of such a groove 321, when the sealing resin is filled between the optical component 4 and the first clad 32a located on the first lower surface 31a2 side of the first portion 31a, excess sealing resin is generated. It collects in the groove 321 . As a result, it becomes difficult for the sealing resin to flow into the opposing surfaces of the Si waveguide 41 and the first portion 31a, and transmission and reception of optical signals are less likely to be hindered.
  • the first clads 32a are positioned so as to sandwich the first upper surface 31a1 and the first lower surface 31a2 of the first portion 31a of the core 31, and the second clads 32b are located on the core 31.
  • the first clad top surface of the first clad 32a located on the first top surface 31a1 side of the first portion 31a is the second clad 32b located on the second top surface 31b1 side of the second portion 31b. may be flush with the upper surface of the second clad.
  • the height of the optical waveguide 3 can be reduced. As a result, the optical circuit board 1 can be made more compact.
  • the first clad 32a positioned on the side of the first upper surface 31a1 of the first portion 31a is located on the side of the second upper surface 31b1 of the second portion 31b. part may be covered.
  • the first clad 32a located on the first upper surface 31a1 side of the first portion 31a presses the second clad 32b located on the second upper surface 31b1 side of the second portion 31b. It will be.
  • peeling and lifting of the second clad 32b can be prevented.
  • the transmission characteristics of the optical signal can be improved.
  • the first clad 32a covers the entire second clad upper surface of the second clad 32b, the above effects are likely to be obtained.
  • the second clad 32b located on the side of the second upper surface 31b1 of the second portion 31b is located on the side of the first upper surface 31a1 of the first portion 31a. part may be covered.
  • the second clad 32b located on the second upper surface 31b1 side of the second portion 31b presses the first clad 32a located on the first upper surface 31a1 side of the first portion 31a. It will be.
  • peeling and lifting of the first clad 32a can be prevented.
  • the transmission characteristics of the optical signal can be improved.
  • the second clad 32b covers the entire first clad upper surface of the first clad 32a, the above effects are likely to be obtained.
  • the second clad 32b positioned on the second lower surface 31b2 side of the second portion 31b is positioned between the wiring board 2 and the first clad 32a positioned on the first lower surface 31a2 side of the first portion 31a.
  • the optical waveguide 3 is obtained, for example, by the following method. First, on the surface of the first conductor layer 21a located on the surface of the wiring board 2, a resin, which is the material of the second clad 32b, is placed. The resin may be arranged by coating, or may be arranged by laminating plate-like bodies such as resin films. Next, the resin, which is the material of the second clad 32b, is exposed, developed, and cured so that the second clad 32b positioned on the second lower surface 31b2 side of the second portion 31b is formed.
  • a resin which is the material of the first clad 32a, is applied so as to cover the surface of the first conductor layer 21a exposed by exposure and development and the second clad 32b located on the second lower surface 31b2 side of the second portion 31b.
  • the resin may be arranged by coating, or may be arranged by laminating plate-like bodies such as resin films.
  • the resin used as the material of the first clad 32a has a lower refractive index than the resin used as the material of the second clad 32b.
  • the resin that is the material of the first clad 32a is exposed, developed, and cured so that the first clad 32a positioned on the first lower surface 31a2 side of the first portion 31a is formed.
  • the first clad 32a By forming the first clad 32a to partially cover the second clad 32b, the thickness of the second portion 31b of the core 31 in cross section is made larger than the thickness of the first portion 31a of the core 31. can be done.
  • the end surface of the first clad 32a located on the surface of the second clad 32b may be vertical or inclined. By inclining this end face, the tapered portion 31c can be formed.
  • a resin as a material of the core 31 is arranged so as to cover the first clad 32a and the second clad 32b.
  • the resin may be arranged by coating, or may be arranged by laminating plate-like bodies such as resin films.
  • the core 31 is formed by exposing, developing, and hardening the resin that is the material of the core 31 .
  • the core 31 positioned in the first clad 32a corresponds to the first portion 31a
  • the core 31 positioned in the second clad 32b corresponds to the second portion 31b.
  • a resin which is the material of the second clad 32b, is arranged so as to cover the core 31.
  • the resin may be arranged by coating, or may be arranged by laminating plate-like bodies such as resin films.
  • the resin, which is the material of the second clad 32b is exposed, developed, and cured so that the second clad 32b located on the second upper surface 31b1 side of the second portion 31b is formed.
  • a resin which is the material of the first clad 32a, is arranged so as to cover the core 31 and the second clad 32b located on the second upper surface 31b1 side of the second portion 31b.
  • the resin may be arranged by coating, or may be arranged by laminating plate-like bodies such as resin films.
  • the resin, which is the material of the first clad 32a is exposed, developed, and cured so that the first clad 32a located on the first upper surface 31a1 side of the first portion 31a is formed.
  • the end face of the first portion 31a that is, the end face on the optical component 4 side is formed by, for example, laser processing. Furthermore, a groove 321 may be formed along the end of the first portion 31a on the optical component 4 side. Thus, the optical waveguide 3 is formed.
  • a method of adjusting the core 31 and the numerical aperture (NA) of the optical waveguide 3 is as follows.
  • the numerical aperture (NA) is a value calculated from the refractive index difference between the core and the clad, and is a parameter that determines the MFD.
  • the MFD is specified from the size of the Si waveguide 41 included in the silicon photonics device 4 .
  • the MFD of the optical waveguide 3 is determined from the MFD of the Si waveguide 41 .
  • the NA range is determined (for example, 0.1 or more).
  • a realizable diameter of core 31 (diameter of first portion 31a and diameter of second portion 31b) and NA are determined from the range of NA.
  • the necessary refractive index difference (the difference between the refractive index of the first portion 31a of the core 31 and the refractive index of the first clad 32a, the refractive index of the second portion 31b of the core 31 and the refractive index of the second clad 32b ) is determined. Based on this refractive index difference, the diameter of the first portion 31a, the diameter of the second portion 31b, the material of the first clad 32a, and the material of the second clad 32b are determined.
  • An optical component mounting structure 10 has a structure in which a silicon photonics device 4 and an electronic component 6 are mounted on an optical circuit board 1 according to an embodiment.
  • Examples of the electronic component 6 include an ASIC (Application Specific Integrated Circuit) and a driver IC.
  • the silicon photonics device 4 is electrically connected to the electrode 21b located in the optical component mounting area of the wiring board 2 via the solder 7.
  • the electrode 21 b is a part of the conductor layer located on the upper surface of the wiring board 2 and is located so as to be exposed through the opening of the solder resist 8 .
  • the silicon photonics device 4 is, for example, a type of optical waveguide having a core made of silicon (Si) and a clad made of silicon dioxide (SiO 2 ).
  • the silicon photonics device 4 includes the Si waveguide 41 as described above, and further includes a passivation film, a light source section, a photodetector section, and the like (not shown).
  • the Si waveguide 41 is positioned at one end of the optical waveguide 3 so as to face the first portion 31 a of the core 31 included in the optical waveguide 3 .
  • an electrical signal from the wiring board 2 is propagated through the solder 7 to the light source included in the silicon photonics device 4 .
  • the light source unit that receives the propagated electrical signal emits light.
  • the emitted optical signal is propagated through the Si waveguide 41 for signal propagation and the core 31 of the optical waveguide 3 to the optical fiber 5 connected via the optical connector 5a.
  • the optical circuit board according to the present disclosure is not limited to the optical circuit board 1 according to the embodiment described above.
  • the groove 321 is provided in the first clad 32a located on the lower surface side of the first portion 31a of the core 31 .
  • the groove is not an essential component and may be provided as necessary.
  • a tapered portion 31c exists between the first portion 31a of the core 31 and the second portion 31b of the core 31 .
  • the tapered portion 31c may not exist, and the first portion 31a and the second portion 31b may be directly connected.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
PCT/JP2022/033987 2021-09-13 2022-09-12 光回路基板およびそれを用いた光学部品実装構造体 Ceased WO2023038132A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US18/690,899 US20240402424A1 (en) 2021-09-13 2022-09-12 Optical circuit board and optical component mounting structure using same
JP2023547017A JP7788203B2 (ja) 2021-09-13 2022-09-12 光回路基板およびそれを用いた光学部品実装構造体
KR1020247008228A KR20240038136A (ko) 2021-09-13 2022-09-12 광회로 기판 및 그것을 사용한 광학 부품 실장 구조체

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JP2021148694 2021-09-13
JP2021-148694 2021-09-13

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WO2023038132A1 true WO2023038132A1 (ja) 2023-03-16

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US (1) US20240402424A1 (https=)
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KR (1) KR20240038136A (https=)
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WO (1) WO2023038132A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05249331A (ja) * 1992-01-09 1993-09-28 Nippon Telegr & Teleph Corp <Ntt> 導波路形ビームスポット変換素子およびその製造方法
JP2003207684A (ja) * 2002-01-15 2003-07-25 Nec Corp 光結合器及びその製造方法
JP2005538426A (ja) * 2002-08-20 2005-12-15 エルエヌエル・テクノロジーズ・インコーポレイテッド 埋め込みモードコンバータ
JP2009008766A (ja) * 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 光モジュール
WO2012114866A1 (ja) * 2011-02-21 2012-08-30 日本電気株式会社 スポットサイズ変換器及びその製造方法
US9698564B1 (en) * 2016-02-09 2017-07-04 Oracle International Corporation Hybrid integrated MCM with waveguide-fiber connector
JP2019101283A (ja) * 2017-12-05 2019-06-24 日本電信電話株式会社 モードフィールド変換器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001083346A (ja) 1999-09-10 2001-03-30 Nippon Telegr & Teleph Corp <Ntt> 電気光混載配線板及び電気光混載モジュール並びにその製造方法
JP2009058923A (ja) * 2007-04-27 2009-03-19 Hitachi Chem Co Ltd 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール
JP2009288614A (ja) 2008-05-30 2009-12-10 Hitachi Ltd 平面型光導波路アレイモジュールとその製造方法
JP6585578B2 (ja) * 2016-11-07 2019-10-02 Ｎｔｔエレクトロニクス株式会社 光デバイス、およびアライメント方法
US20190187373A1 (en) * 2017-12-18 2019-06-20 Roshmere, Inc. Hybrid fiber integrated soi/iii-v module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05249331A (ja) * 1992-01-09 1993-09-28 Nippon Telegr & Teleph Corp <Ntt> 導波路形ビームスポット変換素子およびその製造方法
JP2003207684A (ja) * 2002-01-15 2003-07-25 Nec Corp 光結合器及びその製造方法
JP2005538426A (ja) * 2002-08-20 2005-12-15 エルエヌエル・テクノロジーズ・インコーポレイテッド 埋め込みモードコンバータ
JP2009008766A (ja) * 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 光モジュール
WO2012114866A1 (ja) * 2011-02-21 2012-08-30 日本電気株式会社 スポットサイズ変換器及びその製造方法
US9698564B1 (en) * 2016-02-09 2017-07-04 Oracle International Corporation Hybrid integrated MCM with waveguide-fiber connector
JP2019101283A (ja) * 2017-12-05 2019-06-24 日本電信電話株式会社 モードフィールド変換器

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