TWI820910B - Liquid cooling module - Google Patents
Liquid cooling module Download PDFInfo
- Publication number
- TWI820910B TWI820910B TW111134809A TW111134809A TWI820910B TW I820910 B TWI820910 B TW I820910B TW 111134809 A TW111134809 A TW 111134809A TW 111134809 A TW111134809 A TW 111134809A TW I820910 B TWI820910 B TW I820910B
- Authority
- TW
- Taiwan
- Prior art keywords
- filter element
- frame
- filter
- liquid
- cooling module
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 105
- 239000007788 liquid Substances 0.000 title claims abstract description 96
- 239000012809 cooling fluid Substances 0.000 claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 claims description 41
- 238000000605 extraction Methods 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 210000004905 finger nail Anatomy 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Abstract
Description
本揭露係有關於一種液冷模組。This disclosure relates to a liquid cooling module.
現有電子元件(例如:CPU)的液冷模組以電子元件的散熱底板為基底,配合入液側以及出液側做內部的循環迴路做熱交換後以達到電子元件散熱的效果。Existing liquid-cooling modules for electronic components (such as CPUs) use the heat dissipation bottom plate of the electronic component as the base, and use the liquid inlet side and the liquid outlet side to create an internal circulation loop for heat exchange to achieve the cooling effect of the electronic component.
然而,由於現有的液冷模組大多為一進一出的設計(即,一個入液側以及一個出液側的結構配置)。液冷模組內的電子元件可能因材質或者所使用的冷卻流體的成分因素,當液冷模組的使用時間一久,隨著冷卻流體流動時所析出或產生的雜質、碎屑或汙染物,將會殘留於液冷模組內,並造成散熱效能變差,最終將可能導致伺服器效能變差及當機問題。However, most of the existing liquid cooling modules have a one-inlet and one-out design (that is, a structural configuration of one liquid inlet side and one liquid outlet side). The electronic components in the liquid cooling module may be affected by the material or the composition of the cooling fluid used. When the liquid cooling module is used for a long time, impurities, debris or pollutants may be precipitated or generated as the cooling fluid flows. It will remain in the liquid cooling module and cause poor cooling performance, which may ultimately lead to poor server performance and crashes.
因此,如何提出一種液冷模組來達成延長電子元件的使用壽命的功效,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose a liquid cooling module to extend the service life of electronic components is one of the problems that the industry is currently eager to invest in research and development resources to solve.
有鑑於此,本揭露之一目的在於提出一種可有解決上述問題的液冷模組。In view of this, one purpose of the present disclosure is to provide a liquid cooling module that can solve the above problems.
為了達到上述目的,依據本揭露之一實施方式,一種液冷模組包含冷卻裝置以及過濾元件。冷卻裝置包含散熱底板、蓋體、入液部以及出液部。蓋體設置於散熱底板上方。蓋體與散熱底板之間形成腔體。腔體配置以流通冷卻流體。入液部設置於蓋體上並配置以接受冷卻流體。出液部設置於蓋體上並配置以接受來自腔體之冷卻流體。過濾元件設置於冷卻裝置上並穿過腔體。過濾元件位於入液部與出液部之間。In order to achieve the above object, according to an embodiment of the present disclosure, a liquid cooling module includes a cooling device and a filter element. The cooling device includes a heat dissipation bottom plate, a cover, a liquid inlet part and a liquid outlet part. The cover is arranged above the heat dissipation bottom plate. A cavity is formed between the cover and the heat dissipation bottom plate. The cavity is configured to circulate cooling fluid. The liquid inlet portion is provided on the cover body and configured to receive cooling fluid. The liquid outlet is disposed on the cover and configured to receive cooling fluid from the cavity. The filter element is arranged on the cooling device and passes through the cavity. The filter element is located between the liquid inlet part and the liquid outlet part.
於本揭露的一或多個實施方式中,蓋體具有凹槽配置以容置過濾元件。In one or more embodiments of the present disclosure, the cover has a groove configuration to accommodate the filter element.
於本揭露的一或多個實施方式中,冷卻裝置進一步包含散熱鰭片設置於散熱底板上。In one or more embodiments of the present disclosure, the cooling device further includes heat dissipation fins disposed on the heat dissipation base plate.
於本揭露的一或多個實施方式中,冷卻裝置進一步包含密封件設置於散熱底板與蓋體之間。In one or more embodiments of the present disclosure, the cooling device further includes a seal disposed between the heat dissipation bottom plate and the cover.
於本揭露的一或多個實施方式中,密封件係環繞腔體設置。In one or more embodiments of the present disclosure, the sealing member is disposed around the cavity.
於本揭露的一或多個實施方式中,液冷模組進一步包含數個鎖固件,且散熱底板藉由鎖固件與蓋體結合。In one or more embodiments of the present disclosure, the liquid cooling module further includes a plurality of fasteners, and the heat dissipation bottom plate is combined with the cover through the fasteners.
於本揭露的一或多個實施方式中,過濾元件包含框體具有數個過濾孔,且過濾孔連通腔體。In one or more embodiments of the present disclosure, the filter element includes a frame with a plurality of filter holes, and the filter holes are connected to the cavity.
於本揭露的一或多個實施方式中,過濾元件進一步包含防水元件設置於框體上,且防水元件係環繞框體設置。In one or more embodiments of the present disclosure, the filter element further includes a waterproof element disposed on the frame, and the waterproof element is disposed around the frame.
於本揭露的一或多個實施方式中,框體進一步包含數個提取部。提取部之間具有凹部。In one or more embodiments of the present disclosure, the frame further includes a plurality of extraction parts. There are concave parts between the extraction parts.
於本揭露的一或多個實施方式中,過濾元件進一步具有提取孔設置於框體上。In one or more embodiments of the present disclosure, the filter element further has an extraction hole provided on the frame.
綜上所述,在本揭露之液冷模組中,由於冷卻裝置的散熱底板以及蓋體之間形成配置以流通冷卻流體的腔體,所以冷卻流體可以帶走冷卻裝置上從電子裝置產生的熱。在本揭露之液冷模組中,由於散熱鰭片設置於散熱底板上,使得散熱鰭片可以將散熱底板上從電子裝置產生的熱傳遞至冷卻流體。在本揭露之液冷模組中,由於密封件設置於散熱底板與蓋體之間並環繞腔體設置,使得密封件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件具有過濾孔連通腔體,所以流通於腔體中的冷卻流體的碎屑或汙染物可以藉由過濾孔被攔截,出液部便可以接受來自腔體的經過濾冷卻流體。在本揭露之液冷模組中,由於防水元件設置於過濾元件的框體上,使得防水元件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件的數個提取部之間具有凹部,使用者可以以凹部作為施力點以方便地將過濾元件自冷卻裝置上取出。在本揭露之液冷模組中,由於過濾元件進一步具有提取孔,使用者可以利用額外的提取件與提取孔結合以方便地將過濾元件自冷卻裝置上取出。To sum up, in the liquid cooling module of the present disclosure, since a cavity is formed between the heat dissipation bottom plate and the cover of the cooling device to circulate the cooling fluid, the cooling fluid can take away the heat generated from the electronic device on the cooling device. hot. In the liquid cooling module of the present disclosure, since the heat dissipation fins are disposed on the heat dissipation base plate, the heat dissipation fins can transfer the heat generated from the electronic device on the heat dissipation base plate to the cooling fluid. In the liquid cooling module of the present disclosure, since the sealing member is disposed between the heat dissipation bottom plate and the cover and surrounds the cavity, the sealing member can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since the filter element has filter holes connected to the cavity, debris or contaminants of the cooling fluid flowing in the cavity can be intercepted through the filter holes, and the liquid outlet can receive the liquid cooling module from the cavity. Filtered cooling fluid of the chamber. In the liquid cooling module of the present disclosure, since the waterproof element is disposed on the frame of the filter element, the waterproof element can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since there are recesses between the extraction parts of the filter element, the user can use the recess as a force application point to conveniently take out the filter element from the cooling device. In the liquid cooling module of the present disclosure, since the filter element further has an extraction hole, the user can use an additional extraction piece combined with the extraction hole to conveniently remove the filter element from the cooling device.
以上所述僅係用以闡述本揭露所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本揭露之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above is only used to describe the problems to be solved by the present disclosure, the technical means to solve the problems, the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation modes and related drawings.
以下將以圖式揭露本揭露之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。在所有圖式中相同的標號將用於表示相同或相似的元件。A plurality of implementation manners of the present disclosure will be disclosed below with drawings. For clarity of explanation, many practical details will be explained together in the following description. However, it should be understood that these practical details should not be used to limit the disclosure. That is to say, in some implementations of the present disclosure, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components will be illustrated in a simple schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.
以下將詳細介紹本實施方式之液冷模組100所包含的各元件的結構、功能以及各元件之間的連接關係。The structure and function of each component included in the
請參考第1圖。第1圖為根據本揭露之一實施方式之液冷模組100的示意圖。在本實施方式中,在第1圖中,提供了一種應用於發熱元件(未繪示)的散熱的液冷模組100。具體來說,發熱元件(例如,中央處理單元(Central Processing Unit;CPU))設置於例如PCB上,且發熱元件接觸液冷模組100。換言之,發熱元件位於上述PCB與液冷模組100之間。在一使用情境中,使用者可以將液冷模組100覆蓋發熱元件,再將液冷模組100固定於上述PCB上,以使設置於PCB上的發熱元件可以接觸液冷模組100。在本實施方式中,如第1圖所示,液冷模組100包含冷卻裝置110以及過濾元件120。過濾元件120係設置於冷卻裝置110上。Please refer to picture 1. Figure 1 is a schematic diagram of a
請參考第2圖以及第3圖。第2圖以及第3圖分別為根據本揭露之一實施方式之液冷模組100的爆炸圖以及剖面圖。第2圖以及第3圖繪示了更詳細的液冷模組100的各元件的結構以及各元件之間的連接關係。如第2圖以及第3圖所示,冷卻裝置110包含散熱底板112、散熱鰭片114、蓋體116、入液部117A、出液部117B以及密封件118。過濾元件120包含框體122,且框體122具有數個過濾孔124。散熱鰭片114設置於散熱底板112上。蓋體116設置於散熱底板112上方。如第3圖所示,蓋體116與散熱底板112之間形成腔體S,且腔體S配置以流通冷卻流體LQ。如第2圖所示,蓋體116具有凹槽G配置以容置過濾元件120。在一些實施方式中,凹槽G連通腔體S,因此當過濾元件120與凹槽G銜接後,係延伸至腔體S內。入液部117A設置於蓋體116上並配置以接受冷卻流體LQ。過濾元件120與凹槽G銜接後,過濾元件120可阻擋腔體S內流動的冷卻流體LQ由凹槽G流出冷卻裝置110外。出液部117B設置於蓋體116上並配置以接受來自腔體S之冷卻流體LQ。入液部117A以及出液部117B連通腔體S。如第3圖所示,過濾元件120設置於冷卻裝置110上穿過腔體S,且過濾元件120位於入液部117A與出液部117B之間。如第3圖所示,過濾孔124連通腔體S。如第3圖所示,當冷卻流體LQ自入液部117A流入腔體S並通過過濾元件120,過濾元件120可以過濾冷卻流體LQ,使得流經過濾元件120的冷卻流體LQ轉變為經過濾冷卻流體LQ’。密封件118設置於散熱底板112與蓋體116之間。在一些實施方式中,密封件118係環繞腔體S設置。Please refer to Picture 2 and Picture 3. Figures 2 and 3 are respectively an exploded view and a cross-sectional view of the
在本實施方式中,如第2圖以及第3圖所示,液冷模組100進一步包含數個鎖固件F。如第2圖以及第3圖所示,散熱底板112可以藉由鎖固件F與蓋體116結合。In this embodiment, as shown in FIGS. 2 and 3 , the
在一些實施方式中,散熱底板112直接接觸上述發熱元件。在一些實施方式中,散熱底板112於靠近腔體S的一側可以包含鰭片配置以傳遞來自發熱元件的熱。In some embodiments, the heat
在一些實施方式中,密封件118的形狀為環狀或其他類似的形狀。In some embodiments,
在一些實施方式中,鎖固件F為鎖固螺絲或其他可以將散熱底板112與蓋體116結合的固定元件。In some embodiments, the fastener F is a locking screw or other fixing element that can combine the heat
藉由前述結構配置,液冷模組100接觸發熱元件,以使發熱元件的熱藉由散熱底板112傳遞至散熱鰭片114。當冷卻流體LQ自入液部117A流入腔體S時,過濾元件120可以過濾冷卻流體LQ,具體來說,過濾元件120可以藉由過濾孔124攔截冷卻流體LQ中的碎屑或汙染物,使得流經過濾元件120的冷卻流體LQ轉變為經過濾冷卻流體LQ’。藉此,液冷模組100可以延長發熱元件的使用壽命。Through the aforementioned structural configuration, the
接著將詳細說明本揭露的過濾元件120所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第4圖。第4圖為根據本揭露之一實施方式之過濾元件120的示意圖。如第4圖所示,在一些實施方式中,過濾孔124沿著第一方向(例如,方向X)穿過框體122。在一些實施方式中,過濾孔124沿著第二方向(例如,方向Y)於框體122上排列。在一些實施方式中,過濾孔124沿著第三方向(例如,方向Z)拉長延伸。在一些實施方式中,過濾孔124係等間隔地設置。在一些實施方式中,過濾孔124的形狀為長條狀。Please refer to Figure 4. Figure 4 is a schematic diagram of a
接著將詳細說明本揭露的過濾元件220所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第5圖。第5圖為根據本揭露之一實施方式之過濾元件220的示意圖。在本實施方式中,過濾元件220可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第5圖所示,過濾元件220包含框體222,且框體222具有數個過濾孔224。第4圖的過濾元件120以及第5圖的過濾元件220的結構配置大致相同。過濾元件220與過濾元件120的不同之處,在於過濾孔224與過濾孔124的形狀不同。如第5圖所示,在一些實施方式中,過濾孔224的形狀為圓形。如第5圖所示,在一些實施方式中,過濾孔224沿著第一方向(例如,方向X)穿過框體222。在一些實施方式中,過濾孔224沿著第二方向(例如,方向Y)於框體222上排列。在一些實施方式中,過濾孔224的孔徑為2毫米。在一些實施方式中,如第5圖所示,過濾孔224沿著第二方向(例如,方向Y)以及第三方向(例如,方向Z)等間隔地設置。Please refer to Figure 5. Figure 5 is a schematic diagram of a
接著將詳細說明本揭露的過濾元件320所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第6圖。第6圖為根據本揭露之一實施方式之過濾元件320的示意圖。在本實施方式中,過濾元件320可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第6圖所示,過濾元件320包含框體322,且框體322具有數個過濾孔324。第4圖的過濾元件120以及第6圖的過濾元件320的結構配置大致相同。過濾元件320與過濾元件120的不同之處,在於過濾孔324與過濾孔124的形狀不同。如第6圖所示,在一些實施方式中,過濾孔324的形狀為斜方型。如第6圖所示,在一些實施方式中,過濾孔324沿著第一方向(例如,方向X)穿過框體322。在一些實施方式中,過濾孔324沿著第二方向(例如,方向Y)於框體322上排列。在一些實施方式中,如第6圖所示,過濾孔324沿著第二方向(例如,方向Y)等間隔地設置。Please refer to Figure 6. Figure 6 is a schematic diagram of a
接著將詳細說明本揭露的過濾元件420所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第7圖。第7圖為根據本揭露之一實施方式之過濾元件420的示意圖。在本實施方式中,過濾元件420可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第7圖所示,過濾元件420包含框體422,且框體422具有數個過濾孔424。第4圖的過濾元件120以及第7圖的過濾元件420的結構配置大致相同。過濾元件420與過濾元件120的不同之處,在於過濾孔424與過濾孔124的形狀不同。如第7圖所示,在一些實施方式中,過濾孔424的形狀為菱形。如第7圖所示,在一些實施方式中,過濾孔424沿著第一方向(例如,方向X)穿過框體422。在一些實施方式中,過濾孔424沿著第二方向(例如,方向Y)以及第三方向(例如,方向Z)於框體422上排列。Please refer to Figure 7. Figure 7 is a schematic diagram of a
接著將詳細說明本揭露的過濾元件520所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第8圖。第8圖為根據本揭露之一實施方式之過濾元件520的示意圖。在本實施方式中,過濾元件520可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第8圖所示,過濾元件520包含框體522,且框體522具有數個過濾孔524。第4圖的過濾元件120以及第8圖的過濾元件520的結構配置大致相同。過濾元件520與過濾元件120的不同之處,在於過濾元件520進一步包含防水元件526。如第8圖所示,防水元件526設置於框體522上。防水元件526環繞框體522設置。如第8圖所示,防水元件526設置於框體522的表面上而不覆蓋過濾孔524。Please refer to Figure 8. Figure 8 is a schematic diagram of a
接著將詳細說明本揭露的過濾元件620所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第9圖。第9圖為根據本揭露之一實施方式之過濾元件620的示意圖。在本實施方式中,過濾元件620可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第9圖所示,過濾元件620包含框體622,且框體622具有數個過濾孔624。過濾元件620進一步包含防水元件626。第8圖的過濾元件520以及第9圖的過濾元件620的結構配置大致相同。過濾元件620與過濾元件520的不同之處,在於過濾元件620進一步包含數個提取部623。如第9圖所示,提取部623自框體622延伸。在一些實施方式中,當過濾元件620與凹槽G銜接後,提取部623係自冷卻裝置110的外表面突伸。在一使用情境中,由於過濾元件620位於凹槽G中時係自冷卻裝置110的外表面突伸,當使用者欲更換過濾元件620,使用者可以手持提取部623(例如,使用者以指腹夾持提取部623)以提取過濾元件620,以將過濾元件620自液冷模組100卸下。如第9圖所示,提取部623之間進一步具有凹部R以利過濾元件620的更換操作。在一使用情境中,若使用者欲更換過濾元件620,使用者可以利用凹部R作為施力點,再例如以指甲或其他合適的額外元件勾動凹部R以使過濾元件620部分地離開凹槽G。接著,使用者再手持提取部623(例如,使用者以指腹夾持提取部623)提取過濾元件620,以將過濾元件620自液冷模組100卸下。Please refer to Figure 9. Figure 9 is a schematic diagram of a
如第9圖所示,在一些實施方式中,防水元件626環繞框體622以及提取部623設置。如第8圖所示,防水元件626設置於框體622的表面上而不覆蓋過濾孔624。As shown in FIG. 9 , in some embodiments, the
接著將詳細說明本揭露的過濾元件720所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the
請參考第10圖。第10圖為根據本揭露之一實施方式之過濾元件720的示意圖。在本實施方式中,過濾元件720可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第10圖所示,過濾元件720包含框體722,且框體722具有數個過濾孔724。過濾元件720進一步包含防水元件726。第8圖的過濾元件520以及第10圖的過濾元件720的結構配置大致相同。過濾元件720與過濾元件520的不同之處,在於過濾元件720進一步具有提取孔728。如第10圖所示,提取孔728自框體722延伸,且提取孔728設置於框體722上以利過濾元件720的更換操作。在一使用情境中,若使用者欲更換過濾元件720,使用者可以利用額外的提取件(未繪示)與提取孔728結合,再利用上述提取件與提取孔728之間的摩擦力帶動過濾元件720,以將過濾元件720自液冷模組100卸下。在一些實施方式中,上述提取件可以是類似於退卡針(Ejection Pin)的機構,但本揭露不以此為限。Please refer to Figure 10. Figure 10 is a schematic diagram of a
如第10圖所示,在一些實施方式中,防水元件726環繞框體722設置。如第8圖所示,防水元件726設置於框體722的表面上而不覆蓋提取孔728。As shown in FIG. 10 , in some embodiments, the
在一些實施方式中,框體122、框體222、框體322、框體422、框體522、框體622以及框體722可以內置有孔徑比過濾孔124、過濾孔224、過濾孔324、過濾孔424、過濾孔524、過濾孔624以及過濾孔724的孔徑更小的濾網(未繪示)。在一些實施方式中,上述濾網係平行於過濾元件120、過濾元件220、過濾元件320、過濾元件420、過濾元件520、過濾元件620以及過濾元件720延伸。在一些實施方式中,上述濾網係由多層交叉縱橫的波形組合,且濾網的雙面並有交叉鋼條提供補強以及支撐的功能,以增加濾網的堅固性。設置有上述濾網的過濾元件120、過濾元件220、過濾元件320、過濾元件420、過濾元件520、過濾元件620以及過濾元件720可以加長過濾時間,更符合經濟效益。更詳細地說,過濾孔124、過濾孔224、過濾孔324、過濾孔424、過濾孔524、過濾孔624以及過濾孔724的作用是用於阻擋大顆粒的碎屑或汙染物,而濾網的作用是用於阻擋小顆粒的碎屑或汙染物。設置有上述濾網的過濾元件120、過濾元件220、過濾元件320、過濾元件420、過濾元件520、過濾元件620以及過濾元件720提供了許多優點,其可反覆使用且具有高透風性以及低壓損等特性。藉由自內至外的孔徑大小不同,可以阻擋不同大小的碎屑或汙染物,以延長液冷模組100的使用壽命。In some embodiments, the
在一些實施方式中,上述濾網可以是包含複數層的折疊網。在一些實施方式中,上述濾網的材料可以是金、鋁或其他合適的材料。In some embodiments, the above-mentioned filter mesh may be a folded mesh including multiple layers. In some embodiments, the material of the above-mentioned filter screen may be gold, aluminum or other suitable materials.
在一些實施方式中,框體122、框體222、框體322、框體422、框體522、框體622以及框體722的材料可以是鋁合金、不鏽鋼或其他合適的材料。In some embodiments, the material of the
在一些實施方式中,防水元件526、防水元件626以及防水元件726的材料可以是橡膠或其他合適的防水材料。In some embodiments, the material of the
由以上對於本揭露之具體實施方式之詳述,可以明顯地看出,在本揭露之液冷模組中,由於冷卻裝置的散熱底板以及蓋體之間形成配置以流通冷卻流體的腔體,所以冷卻流體可以帶走冷卻裝置上從電子裝置產生的熱。在本揭露之液冷模組中,由於散熱鰭片設置於散熱底板上,使得散熱鰭片可以將散熱底板上從電子裝置產生的熱傳遞至冷卻流體。在本揭露之液冷模組中,由於密封件設置於散熱底板與蓋體之間並環繞腔體設置,使得密封件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件具有過濾孔連通腔體,所以流通於腔體中的冷卻流體的碎屑或汙染物可以藉由過濾孔被攔截,出液部便可以接受來自腔體的經過濾冷卻流體。在本揭露之液冷模組中,由於防水元件設置於過濾元件的框體上,使得防水元件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件的數個提取部之間具有凹部,使用者可以以凹部作為施力點以方便地將過濾元件自冷卻裝置上取出。在本揭露之液冷模組中,由於過濾元件進一步具有提取孔,使用者可以利用額外的提取件與提取孔結合以方便地將過濾元件自冷卻裝置上取出。From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the liquid cooling module of the present disclosure, since a cavity is formed between the heat dissipation bottom plate and the cover of the cooling device for circulating cooling fluid, So the cooling fluid can carry away the heat generated from the electronic device on the cooling device. In the liquid cooling module of the present disclosure, since the heat dissipation fins are disposed on the heat dissipation base plate, the heat dissipation fins can transfer the heat generated from the electronic device on the heat dissipation base plate to the cooling fluid. In the liquid cooling module of the present disclosure, since the sealing member is disposed between the heat dissipation bottom plate and the cover and surrounds the cavity, the sealing member can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since the filter element has filter holes connected to the cavity, debris or contaminants of the cooling fluid flowing in the cavity can be intercepted through the filter holes, and the liquid outlet can receive the liquid cooling module from the cavity. Filtered cooling fluid of the chamber. In the liquid cooling module of the present disclosure, since the waterproof element is disposed on the frame of the filter element, the waterproof element can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since there are recesses between the extraction parts of the filter element, the user can use the recess as a force application point to conveniently take out the filter element from the cooling device. In the liquid cooling module of the present disclosure, since the filter element further has an extraction hole, the user can use an additional extraction piece combined with the extraction hole to conveniently remove the filter element from the cooling device.
在本揭露的一實施方式中,本揭露之液冷模組係可應用於伺服器,該伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present disclosure, the liquid cooling module of the present disclosure can be applied to a server. The server can be used for artificial intelligence (AI) computing, edge computing (edge computing), and can also be used as a server. Used as 5G server, cloud server or Internet of Vehicles server.
雖然本揭露已以實施方式揭露如上,然其並不用以限定本揭露,任何熟習此技藝者,在不脫離本揭露的精神和範圍內,當可作各種的更動與潤飾,因此本揭露的保護範圍當視後附的申請專利範圍所界定者為準。Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection of the disclosure is The scope shall be determined by the appended patent application scope.
100:液冷模組
110:冷卻裝置
112:散熱底板
114:散熱鰭片
116:蓋體
117A:入液部
117B:出液部
118:密封件
120,220,320,420,520,620,720:過濾元件
122,222,322,422,522,622,722:框體
124,224,324,424,524,624,724:過濾孔
526,626,726:防水元件
623:提取部
728:提取孔
F:鎖固件
G:凹槽
LQ:冷卻流體
LQ’:經過濾冷卻流體
R:凹部
S:腔體
X,Y,Z:方向
100:Liquid cooling module
110: Cooling device
112: Cooling base plate
114: Cooling fins
116:
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖繪示根據本揭露之一實施方式之液冷模組的示意圖。 第2圖繪示根據本揭露之一實施方式之液冷模組的爆炸圖。 第3圖繪示根據本揭露之一實施方式之液冷模組的剖面圖。 第4圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第5圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第6圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第7圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第8圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第9圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第10圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the accompanying drawings are described as follows: Figure 1 is a schematic diagram of a liquid cooling module according to an embodiment of the present disclosure. Figure 2 illustrates an exploded view of a liquid cooling module according to an embodiment of the present disclosure. Figure 3 illustrates a cross-sectional view of a liquid cooling module according to an embodiment of the present disclosure. Figure 4 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 5 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 6 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 7 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 8 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 9 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 10 is a schematic diagram of a filter element according to an embodiment of the present disclosure.
100:液冷模組 100:Liquid cooling module
110:冷卻裝置 110: Cooling device
112:散熱底板 112: Cooling base plate
114:散熱鰭片 114: Cooling fins
116:蓋體 116: Cover
117A:入液部 117A: Liquid entry part
117B:出液部 117B: Liquid outlet
118:密封件 118:Seals
120:過濾元件 120:Filter element
122:框體 122:Frame
124:過濾孔 124:Filter hole
F:鎖固件 F:Lock firmware
G:凹槽 G: Groove
X,Y,Z:方向 X,Y,Z: direction
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111134809A TWI820910B (en) | 2022-09-14 | 2022-09-14 | Liquid cooling module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111134809A TWI820910B (en) | 2022-09-14 | 2022-09-14 | Liquid cooling module |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI820910B true TWI820910B (en) | 2023-11-01 |
TW202412226A TW202412226A (en) | 2024-03-16 |
Family
ID=89722329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111134809A TWI820910B (en) | 2022-09-14 | 2022-09-14 | Liquid cooling module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI820910B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI254608B (en) * | 2001-09-04 | 2006-05-01 | Hitachi Ltd | Water cooling device for electronic apparatus |
TW201238453A (en) * | 2011-03-03 | 2012-09-16 | Chroma Ate Inc | Liquid cooling heat dissipation structure |
US20150173251A1 (en) * | 2013-12-18 | 2015-06-18 | International Business Machines Corporation | Liquid-cooling apparatus with integrated coolant filter |
TW201826077A (en) * | 2018-02-08 | 2018-07-16 | 黃崇賢 | Water cooling radiator with impurity filtration function having a filter net in a selected flow channel for isolating and filtering impurities in the cooling liquid |
CN114518795A (en) * | 2022-02-28 | 2022-05-20 | 英业达科技有限公司 | Water cooling plate assembly |
TWI765680B (en) * | 2021-01-27 | 2022-05-21 | 黃崇賢 | Vertical liquid cooling radiator |
-
2022
- 2022-09-14 TW TW111134809A patent/TWI820910B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI254608B (en) * | 2001-09-04 | 2006-05-01 | Hitachi Ltd | Water cooling device for electronic apparatus |
TW201238453A (en) * | 2011-03-03 | 2012-09-16 | Chroma Ate Inc | Liquid cooling heat dissipation structure |
US20150173251A1 (en) * | 2013-12-18 | 2015-06-18 | International Business Machines Corporation | Liquid-cooling apparatus with integrated coolant filter |
TW201826077A (en) * | 2018-02-08 | 2018-07-16 | 黃崇賢 | Water cooling radiator with impurity filtration function having a filter net in a selected flow channel for isolating and filtering impurities in the cooling liquid |
TWI765680B (en) * | 2021-01-27 | 2022-05-21 | 黃崇賢 | Vertical liquid cooling radiator |
CN114518795A (en) * | 2022-02-28 | 2022-05-20 | 英业达科技有限公司 | Water cooling plate assembly |
Also Published As
Publication number | Publication date |
---|---|
TW202412226A (en) | 2024-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9818671B2 (en) | Liquid-cooled heat sink for electronic devices | |
US20180308786A1 (en) | Liquid-Cooled Heat Sink | |
TW201916547A (en) | Electronic device with liquid cooling function and liquid cooling module and radiator thereof | |
US8804336B2 (en) | Heat disspating apparatus and electronic device | |
CN101212887A (en) | Heat radiator | |
US20090205810A1 (en) | Liquid cooling device | |
US11402163B2 (en) | Heat dissipation device and fin structure | |
TWI820910B (en) | Liquid cooling module | |
TW202038045A (en) | Liquid cooling sink | |
CN206147496U (en) | Be used for solid state hard drives heat dissipation to use annular heat abstractor | |
CN205644413U (en) | Heat sink | |
CN209728754U (en) | A kind of wireless access mould group hardware | |
CN107037864B (en) | Computer network assembly control box heat dissipation mechanism | |
US20230136407A1 (en) | Liquid cooling module and electronic device | |
CN117715355A (en) | Liquid cooling module | |
WO2016201676A1 (en) | Tablet computer mainboard | |
CN213122890U (en) | Radiating mechanism for single chip microcomputer | |
CN211403352U (en) | Uniform heat dissipation's main frame placer | |
CN219698285U (en) | Heat dissipation module | |
CN205485830U (en) | Computer case | |
CN212873420U (en) | Computer heat abstractor | |
CN216437822U (en) | Radiating mechanism with good radiating effect | |
TWI813324B (en) | Liquid cooling device and electronic assembly | |
CN219068721U (en) | Heat radiation structure of image sensor | |
CN213991531U (en) | Monitor cooling fin |