TWI820910B - Liquid cooling module - Google Patents

Liquid cooling module Download PDF

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TWI820910B
TWI820910B TW111134809A TW111134809A TWI820910B TW I820910 B TWI820910 B TW I820910B TW 111134809 A TW111134809 A TW 111134809A TW 111134809 A TW111134809 A TW 111134809A TW I820910 B TWI820910 B TW I820910B
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filter element
frame
filter
liquid
cooling module
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TW111134809A
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Chinese (zh)
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TW202412226A (en
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陳柏安
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英業達股份有限公司
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Abstract

A liquid cooling system includes a cooling device and a filtering element. The cooling device includes a dissipating bottom plate, a cover body, a liquid inlet portion, and a liquid outlet portion. The cover body is disposed over the dissipating bottom plate. A cavity is formed between the cover body and the dissipating bottom plate. The cavity is configured to circulate a cooling fluid. The liquid inlet portion is disposed on the cover body and is configured to receive the cooling fluid. The liquid outlet portion is disposed on the cover body and is configured to receive the cooling fluid from the cavity. The filtering element is disposed on the cooling device and passes through the cavity. The filtering element is located between the liquid inlet portion and the liquid outlet portion.

Description

液冷模組Liquid cooling module

本揭露係有關於一種液冷模組。This disclosure relates to a liquid cooling module.

現有電子元件(例如:CPU)的液冷模組以電子元件的散熱底板為基底,配合入液側以及出液側做內部的循環迴路做熱交換後以達到電子元件散熱的效果。Existing liquid-cooling modules for electronic components (such as CPUs) use the heat dissipation bottom plate of the electronic component as the base, and use the liquid inlet side and the liquid outlet side to create an internal circulation loop for heat exchange to achieve the cooling effect of the electronic component.

然而,由於現有的液冷模組大多為一進一出的設計(即,一個入液側以及一個出液側的結構配置)。液冷模組內的電子元件可能因材質或者所使用的冷卻流體的成分因素,當液冷模組的使用時間一久,隨著冷卻流體流動時所析出或產生的雜質、碎屑或汙染物,將會殘留於液冷模組內,並造成散熱效能變差,最終將可能導致伺服器效能變差及當機問題。However, most of the existing liquid cooling modules have a one-inlet and one-out design (that is, a structural configuration of one liquid inlet side and one liquid outlet side). The electronic components in the liquid cooling module may be affected by the material or the composition of the cooling fluid used. When the liquid cooling module is used for a long time, impurities, debris or pollutants may be precipitated or generated as the cooling fluid flows. It will remain in the liquid cooling module and cause poor cooling performance, which may ultimately lead to poor server performance and crashes.

因此,如何提出一種液冷模組來達成延長電子元件的使用壽命的功效,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose a liquid cooling module to extend the service life of electronic components is one of the problems that the industry is currently eager to invest in research and development resources to solve.

有鑑於此,本揭露之一目的在於提出一種可有解決上述問題的液冷模組。In view of this, one purpose of the present disclosure is to provide a liquid cooling module that can solve the above problems.

為了達到上述目的,依據本揭露之一實施方式,一種液冷模組包含冷卻裝置以及過濾元件。冷卻裝置包含散熱底板、蓋體、入液部以及出液部。蓋體設置於散熱底板上方。蓋體與散熱底板之間形成腔體。腔體配置以流通冷卻流體。入液部設置於蓋體上並配置以接受冷卻流體。出液部設置於蓋體上並配置以接受來自腔體之冷卻流體。過濾元件設置於冷卻裝置上並穿過腔體。過濾元件位於入液部與出液部之間。In order to achieve the above object, according to an embodiment of the present disclosure, a liquid cooling module includes a cooling device and a filter element. The cooling device includes a heat dissipation bottom plate, a cover, a liquid inlet part and a liquid outlet part. The cover is arranged above the heat dissipation bottom plate. A cavity is formed between the cover and the heat dissipation bottom plate. The cavity is configured to circulate cooling fluid. The liquid inlet portion is provided on the cover body and configured to receive cooling fluid. The liquid outlet is disposed on the cover and configured to receive cooling fluid from the cavity. The filter element is arranged on the cooling device and passes through the cavity. The filter element is located between the liquid inlet part and the liquid outlet part.

於本揭露的一或多個實施方式中,蓋體具有凹槽配置以容置過濾元件。In one or more embodiments of the present disclosure, the cover has a groove configuration to accommodate the filter element.

於本揭露的一或多個實施方式中,冷卻裝置進一步包含散熱鰭片設置於散熱底板上。In one or more embodiments of the present disclosure, the cooling device further includes heat dissipation fins disposed on the heat dissipation base plate.

於本揭露的一或多個實施方式中,冷卻裝置進一步包含密封件設置於散熱底板與蓋體之間。In one or more embodiments of the present disclosure, the cooling device further includes a seal disposed between the heat dissipation bottom plate and the cover.

於本揭露的一或多個實施方式中,密封件係環繞腔體設置。In one or more embodiments of the present disclosure, the sealing member is disposed around the cavity.

於本揭露的一或多個實施方式中,液冷模組進一步包含數個鎖固件,且散熱底板藉由鎖固件與蓋體結合。In one or more embodiments of the present disclosure, the liquid cooling module further includes a plurality of fasteners, and the heat dissipation bottom plate is combined with the cover through the fasteners.

於本揭露的一或多個實施方式中,過濾元件包含框體具有數個過濾孔,且過濾孔連通腔體。In one or more embodiments of the present disclosure, the filter element includes a frame with a plurality of filter holes, and the filter holes are connected to the cavity.

於本揭露的一或多個實施方式中,過濾元件進一步包含防水元件設置於框體上,且防水元件係環繞框體設置。In one or more embodiments of the present disclosure, the filter element further includes a waterproof element disposed on the frame, and the waterproof element is disposed around the frame.

於本揭露的一或多個實施方式中,框體進一步包含數個提取部。提取部之間具有凹部。In one or more embodiments of the present disclosure, the frame further includes a plurality of extraction parts. There are concave parts between the extraction parts.

於本揭露的一或多個實施方式中,過濾元件進一步具有提取孔設置於框體上。In one or more embodiments of the present disclosure, the filter element further has an extraction hole provided on the frame.

綜上所述,在本揭露之液冷模組中,由於冷卻裝置的散熱底板以及蓋體之間形成配置以流通冷卻流體的腔體,所以冷卻流體可以帶走冷卻裝置上從電子裝置產生的熱。在本揭露之液冷模組中,由於散熱鰭片設置於散熱底板上,使得散熱鰭片可以將散熱底板上從電子裝置產生的熱傳遞至冷卻流體。在本揭露之液冷模組中,由於密封件設置於散熱底板與蓋體之間並環繞腔體設置,使得密封件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件具有過濾孔連通腔體,所以流通於腔體中的冷卻流體的碎屑或汙染物可以藉由過濾孔被攔截,出液部便可以接受來自腔體的經過濾冷卻流體。在本揭露之液冷模組中,由於防水元件設置於過濾元件的框體上,使得防水元件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件的數個提取部之間具有凹部,使用者可以以凹部作為施力點以方便地將過濾元件自冷卻裝置上取出。在本揭露之液冷模組中,由於過濾元件進一步具有提取孔,使用者可以利用額外的提取件與提取孔結合以方便地將過濾元件自冷卻裝置上取出。To sum up, in the liquid cooling module of the present disclosure, since a cavity is formed between the heat dissipation bottom plate and the cover of the cooling device to circulate the cooling fluid, the cooling fluid can take away the heat generated from the electronic device on the cooling device. hot. In the liquid cooling module of the present disclosure, since the heat dissipation fins are disposed on the heat dissipation base plate, the heat dissipation fins can transfer the heat generated from the electronic device on the heat dissipation base plate to the cooling fluid. In the liquid cooling module of the present disclosure, since the sealing member is disposed between the heat dissipation bottom plate and the cover and surrounds the cavity, the sealing member can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since the filter element has filter holes connected to the cavity, debris or contaminants of the cooling fluid flowing in the cavity can be intercepted through the filter holes, and the liquid outlet can receive the liquid cooling module from the cavity. Filtered cooling fluid of the chamber. In the liquid cooling module of the present disclosure, since the waterproof element is disposed on the frame of the filter element, the waterproof element can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since there are recesses between the extraction parts of the filter element, the user can use the recess as a force application point to conveniently take out the filter element from the cooling device. In the liquid cooling module of the present disclosure, since the filter element further has an extraction hole, the user can use an additional extraction piece combined with the extraction hole to conveniently remove the filter element from the cooling device.

以上所述僅係用以闡述本揭露所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本揭露之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above is only used to describe the problems to be solved by the present disclosure, the technical means to solve the problems, the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation modes and related drawings.

以下將以圖式揭露本揭露之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。在所有圖式中相同的標號將用於表示相同或相似的元件。A plurality of implementation manners of the present disclosure will be disclosed below with drawings. For clarity of explanation, many practical details will be explained together in the following description. However, it should be understood that these practical details should not be used to limit the disclosure. That is to say, in some implementations of the present disclosure, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components will be illustrated in a simple schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.

以下將詳細介紹本實施方式之液冷模組100所包含的各元件的結構、功能以及各元件之間的連接關係。The structure and function of each component included in the liquid cooling module 100 of this embodiment as well as the connection relationship between the components will be introduced in detail below.

請參考第1圖。第1圖為根據本揭露之一實施方式之液冷模組100的示意圖。在本實施方式中,在第1圖中,提供了一種應用於發熱元件(未繪示)的散熱的液冷模組100。具體來說,發熱元件(例如,中央處理單元(Central Processing Unit;CPU))設置於例如PCB上,且發熱元件接觸液冷模組100。換言之,發熱元件位於上述PCB與液冷模組100之間。在一使用情境中,使用者可以將液冷模組100覆蓋發熱元件,再將液冷模組100固定於上述PCB上,以使設置於PCB上的發熱元件可以接觸液冷模組100。在本實施方式中,如第1圖所示,液冷模組100包含冷卻裝置110以及過濾元件120。過濾元件120係設置於冷卻裝置110上。Please refer to picture 1. Figure 1 is a schematic diagram of a liquid cooling module 100 according to an embodiment of the present disclosure. In this embodiment, in Figure 1, a liquid cooling module 100 for heat dissipation of a heating element (not shown) is provided. Specifically, the heating element (eg, central processing unit (Central Processing Unit; CPU)) is disposed on, for example, a PCB, and the heating element contacts the liquid cooling module 100 . In other words, the heating element is located between the PCB and the liquid cooling module 100 . In one usage scenario, the user can cover the heating element with the liquid cooling module 100, and then fix the liquid cooling module 100 on the PCB, so that the heating element disposed on the PCB can contact the liquid cooling module 100. In this embodiment, as shown in FIG. 1 , the liquid cooling module 100 includes a cooling device 110 and a filter element 120 . The filter element 120 is disposed on the cooling device 110 .

請參考第2圖以及第3圖。第2圖以及第3圖分別為根據本揭露之一實施方式之液冷模組100的爆炸圖以及剖面圖。第2圖以及第3圖繪示了更詳細的液冷模組100的各元件的結構以及各元件之間的連接關係。如第2圖以及第3圖所示,冷卻裝置110包含散熱底板112、散熱鰭片114、蓋體116、入液部117A、出液部117B以及密封件118。過濾元件120包含框體122,且框體122具有數個過濾孔124。散熱鰭片114設置於散熱底板112上。蓋體116設置於散熱底板112上方。如第3圖所示,蓋體116與散熱底板112之間形成腔體S,且腔體S配置以流通冷卻流體LQ。如第2圖所示,蓋體116具有凹槽G配置以容置過濾元件120。在一些實施方式中,凹槽G連通腔體S,因此當過濾元件120與凹槽G銜接後,係延伸至腔體S內。入液部117A設置於蓋體116上並配置以接受冷卻流體LQ。過濾元件120與凹槽G銜接後,過濾元件120可阻擋腔體S內流動的冷卻流體LQ由凹槽G流出冷卻裝置110外。出液部117B設置於蓋體116上並配置以接受來自腔體S之冷卻流體LQ。入液部117A以及出液部117B連通腔體S。如第3圖所示,過濾元件120設置於冷卻裝置110上穿過腔體S,且過濾元件120位於入液部117A與出液部117B之間。如第3圖所示,過濾孔124連通腔體S。如第3圖所示,當冷卻流體LQ自入液部117A流入腔體S並通過過濾元件120,過濾元件120可以過濾冷卻流體LQ,使得流經過濾元件120的冷卻流體LQ轉變為經過濾冷卻流體LQ’。密封件118設置於散熱底板112與蓋體116之間。在一些實施方式中,密封件118係環繞腔體S設置。Please refer to Picture 2 and Picture 3. Figures 2 and 3 are respectively an exploded view and a cross-sectional view of the liquid cooling module 100 according to an embodiment of the present disclosure. Figures 2 and 3 illustrate a more detailed structure of each component of the liquid cooling module 100 and the connection relationship between the components. As shown in FIGS. 2 and 3 , the cooling device 110 includes a heat dissipation bottom plate 112 , heat dissipation fins 114 , a cover 116 , a liquid inlet 117A, a liquid outlet 117B, and a seal 118 . The filter element 120 includes a frame 122, and the frame 122 has a plurality of filter holes 124. The heat dissipation fins 114 are disposed on the heat dissipation bottom plate 112 . The cover 116 is disposed above the heat dissipation bottom plate 112 . As shown in FIG. 3 , a cavity S is formed between the cover 116 and the heat dissipation bottom plate 112 , and the cavity S is configured to circulate the cooling fluid LQ. As shown in FIG. 2 , the cover 116 has a groove G configured to accommodate the filter element 120 . In some embodiments, the groove G communicates with the cavity S, so when the filter element 120 is connected to the groove G, it extends into the cavity S. The liquid inlet portion 117A is provided on the cover 116 and configured to receive the cooling fluid LQ. After the filter element 120 is connected to the groove G, the filter element 120 can prevent the cooling fluid LQ flowing in the cavity S from flowing out of the cooling device 110 through the groove G. The liquid outlet 117B is provided on the cover 116 and configured to receive the cooling fluid LQ from the cavity S. The liquid inlet part 117A and the liquid outlet part 117B communicate with the cavity S. As shown in FIG. 3 , the filter element 120 is disposed on the cooling device 110 and passes through the cavity S, and the filter element 120 is located between the liquid inlet part 117A and the liquid outlet part 117B. As shown in Figure 3, the filter hole 124 is connected to the cavity S. As shown in Figure 3, when the cooling fluid LQ flows into the cavity S from the liquid inlet 117A and passes through the filter element 120, the filter element 120 can filter the cooling fluid LQ, so that the cooling fluid LQ flowing through the filter element 120 is transformed into filtered cooling Fluid LQ'. The seal 118 is disposed between the heat dissipation bottom plate 112 and the cover 116 . In some embodiments, seal 118 is disposed around cavity S.

在本實施方式中,如第2圖以及第3圖所示,液冷模組100進一步包含數個鎖固件F。如第2圖以及第3圖所示,散熱底板112可以藉由鎖固件F與蓋體116結合。In this embodiment, as shown in FIGS. 2 and 3 , the liquid cooling module 100 further includes a plurality of fasteners F. As shown in Figures 2 and 3, the heat dissipation bottom plate 112 can be combined with the cover 116 through the fastener F.

在一些實施方式中,散熱底板112直接接觸上述發熱元件。在一些實施方式中,散熱底板112於靠近腔體S的一側可以包含鰭片配置以傳遞來自發熱元件的熱。In some embodiments, the heat dissipation bottom plate 112 directly contacts the above-mentioned heating element. In some embodiments, the heat dissipation bottom plate 112 may include a fin configuration on a side close to the cavity S to transfer heat from the heating element.

在一些實施方式中,密封件118的形狀為環狀或其他類似的形狀。In some embodiments, seal 118 is shaped like an annular or other similar shape.

在一些實施方式中,鎖固件F為鎖固螺絲或其他可以將散熱底板112與蓋體116結合的固定元件。In some embodiments, the fastener F is a locking screw or other fixing element that can combine the heat dissipation bottom plate 112 and the cover 116 .

藉由前述結構配置,液冷模組100接觸發熱元件,以使發熱元件的熱藉由散熱底板112傳遞至散熱鰭片114。當冷卻流體LQ自入液部117A流入腔體S時,過濾元件120可以過濾冷卻流體LQ,具體來說,過濾元件120可以藉由過濾孔124攔截冷卻流體LQ中的碎屑或汙染物,使得流經過濾元件120的冷卻流體LQ轉變為經過濾冷卻流體LQ’。藉此,液冷模組100可以延長發熱元件的使用壽命。Through the aforementioned structural configuration, the liquid cooling module 100 contacts the heating element, so that the heat of the heating element is transferred to the heat dissipation fins 114 through the heat dissipation bottom plate 112 . When the cooling fluid LQ flows into the cavity S from the liquid inlet 117A, the filter element 120 can filter the cooling fluid LQ. Specifically, the filter element 120 can intercept debris or contaminants in the cooling fluid LQ through the filter holes 124, so that The cooling fluid LQ flowing through the filter element 120 is converted into filtered cooling fluid LQ′. Thereby, the liquid cooling module 100 can extend the service life of the heating element.

接著將詳細說明本揭露的過濾元件120所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 120 of the present disclosure, as well as the connection relationship between the elements will be described in detail.

請參考第4圖。第4圖為根據本揭露之一實施方式之過濾元件120的示意圖。如第4圖所示,在一些實施方式中,過濾孔124沿著第一方向(例如,方向X)穿過框體122。在一些實施方式中,過濾孔124沿著第二方向(例如,方向Y)於框體122上排列。在一些實施方式中,過濾孔124沿著第三方向(例如,方向Z)拉長延伸。在一些實施方式中,過濾孔124係等間隔地設置。在一些實施方式中,過濾孔124的形狀為長條狀。Please refer to Figure 4. Figure 4 is a schematic diagram of a filter element 120 according to an embodiment of the present disclosure. As shown in FIG. 4 , in some embodiments, the filter holes 124 pass through the frame 122 along a first direction (eg, direction X). In some embodiments, the filter holes 124 are arranged on the frame 122 along the second direction (eg, direction Y). In some embodiments, the filter holes 124 extend elongated along a third direction (eg, direction Z). In some embodiments, the filter holes 124 are arranged at equal intervals. In some embodiments, the shape of the filter holes 124 is elongated.

接著將詳細說明本揭露的過濾元件220所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 220 of the present disclosure, as well as the connection relationship between the elements will be described in detail.

請參考第5圖。第5圖為根據本揭露之一實施方式之過濾元件220的示意圖。在本實施方式中,過濾元件220可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第5圖所示,過濾元件220包含框體222,且框體222具有數個過濾孔224。第4圖的過濾元件120以及第5圖的過濾元件220的結構配置大致相同。過濾元件220與過濾元件120的不同之處,在於過濾孔224與過濾孔124的形狀不同。如第5圖所示,在一些實施方式中,過濾孔224的形狀為圓形。如第5圖所示,在一些實施方式中,過濾孔224沿著第一方向(例如,方向X)穿過框體222。在一些實施方式中,過濾孔224沿著第二方向(例如,方向Y)於框體222上排列。在一些實施方式中,過濾孔224的孔徑為2毫米。在一些實施方式中,如第5圖所示,過濾孔224沿著第二方向(例如,方向Y)以及第三方向(例如,方向Z)等間隔地設置。Please refer to Figure 5. Figure 5 is a schematic diagram of a filter element 220 according to an embodiment of the present disclosure. In this embodiment, the filter element 220 can be received in the groove G of the cover 116 to be combined with the cooling device 110 . As shown in FIG. 5 , the filter element 220 includes a frame 222 , and the frame 222 has a plurality of filter holes 224 . The filter element 120 in FIG. 4 and the filter element 220 in FIG. 5 have substantially the same structural arrangement. The difference between the filter element 220 and the filter element 120 lies in the different shapes of the filter holes 224 and the filter holes 124 . As shown in Figure 5, in some embodiments, the shape of the filter hole 224 is circular. As shown in FIG. 5 , in some embodiments, the filter holes 224 pass through the frame 222 along a first direction (eg, direction X). In some embodiments, the filter holes 224 are arranged on the frame 222 along the second direction (eg, direction Y). In some embodiments, filter pores 224 have a pore diameter of 2 mm. In some embodiments, as shown in FIG. 5 , the filter holes 224 are equally spaced along the second direction (eg, direction Y) and the third direction (eg, direction Z).

接著將詳細說明本揭露的過濾元件320所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 320 of the present disclosure, as well as the connection relationship between the elements will be described in detail.

請參考第6圖。第6圖為根據本揭露之一實施方式之過濾元件320的示意圖。在本實施方式中,過濾元件320可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第6圖所示,過濾元件320包含框體322,且框體322具有數個過濾孔324。第4圖的過濾元件120以及第6圖的過濾元件320的結構配置大致相同。過濾元件320與過濾元件120的不同之處,在於過濾孔324與過濾孔124的形狀不同。如第6圖所示,在一些實施方式中,過濾孔324的形狀為斜方型。如第6圖所示,在一些實施方式中,過濾孔324沿著第一方向(例如,方向X)穿過框體322。在一些實施方式中,過濾孔324沿著第二方向(例如,方向Y)於框體322上排列。在一些實施方式中,如第6圖所示,過濾孔324沿著第二方向(例如,方向Y)等間隔地設置。Please refer to Figure 6. Figure 6 is a schematic diagram of a filter element 320 according to an embodiment of the present disclosure. In this embodiment, the filter element 320 can be received in the groove G of the cover 116 to be combined with the cooling device 110 . As shown in FIG. 6 , the filter element 320 includes a frame 322 , and the frame 322 has a plurality of filter holes 324 . The filter element 120 in FIG. 4 and the filter element 320 in FIG. 6 have substantially the same structural arrangement. The difference between the filter element 320 and the filter element 120 lies in the different shapes of the filter holes 324 and the filter holes 124 . As shown in Figure 6, in some embodiments, the shape of the filter hole 324 is a rhomboid shape. As shown in FIG. 6 , in some embodiments, the filter holes 324 pass through the frame 322 along a first direction (eg, direction X). In some embodiments, the filter holes 324 are arranged on the frame 322 along the second direction (eg, direction Y). In some embodiments, as shown in FIG. 6 , the filter holes 324 are disposed at equal intervals along the second direction (eg, direction Y).

接著將詳細說明本揭露的過濾元件420所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 420 of the present disclosure, as well as the connection relationship between the elements will be described in detail.

請參考第7圖。第7圖為根據本揭露之一實施方式之過濾元件420的示意圖。在本實施方式中,過濾元件420可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第7圖所示,過濾元件420包含框體422,且框體422具有數個過濾孔424。第4圖的過濾元件120以及第7圖的過濾元件420的結構配置大致相同。過濾元件420與過濾元件120的不同之處,在於過濾孔424與過濾孔124的形狀不同。如第7圖所示,在一些實施方式中,過濾孔424的形狀為菱形。如第7圖所示,在一些實施方式中,過濾孔424沿著第一方向(例如,方向X)穿過框體422。在一些實施方式中,過濾孔424沿著第二方向(例如,方向Y)以及第三方向(例如,方向Z)於框體422上排列。Please refer to Figure 7. Figure 7 is a schematic diagram of a filter element 420 according to an embodiment of the present disclosure. In this embodiment, the filter element 420 can be received in the groove G of the cover 116 to be combined with the cooling device 110 . As shown in FIG. 7 , the filter element 420 includes a frame 422 , and the frame 422 has a plurality of filter holes 424 . The filter element 120 in FIG. 4 and the filter element 420 in FIG. 7 have substantially the same structural arrangement. The difference between the filter element 420 and the filter element 120 lies in the different shapes of the filter holes 424 and the filter holes 124 . As shown in Figure 7, in some embodiments, the filter hole 424 is shaped like a diamond. As shown in FIG. 7 , in some embodiments, the filter holes 424 pass through the frame 422 along a first direction (eg, direction X). In some embodiments, the filter holes 424 are arranged on the frame 422 along the second direction (eg, direction Y) and the third direction (eg, direction Z).

接著將詳細說明本揭露的過濾元件520所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 520 of the present disclosure and the connection relationship between the elements will be described in detail.

請參考第8圖。第8圖為根據本揭露之一實施方式之過濾元件520的示意圖。在本實施方式中,過濾元件520可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第8圖所示,過濾元件520包含框體522,且框體522具有數個過濾孔524。第4圖的過濾元件120以及第8圖的過濾元件520的結構配置大致相同。過濾元件520與過濾元件120的不同之處,在於過濾元件520進一步包含防水元件526。如第8圖所示,防水元件526設置於框體522上。防水元件526環繞框體522設置。如第8圖所示,防水元件526設置於框體522的表面上而不覆蓋過濾孔524。Please refer to Figure 8. Figure 8 is a schematic diagram of a filter element 520 according to an embodiment of the present disclosure. In this embodiment, the filter element 520 can be received in the groove G of the cover 116 to be combined with the cooling device 110 . As shown in FIG. 8 , the filter element 520 includes a frame 522 , and the frame 522 has a plurality of filter holes 524 . The filter element 120 in FIG. 4 and the filter element 520 in FIG. 8 have substantially the same structural arrangement. The difference between the filter element 520 and the filter element 120 is that the filter element 520 further includes a waterproof element 526 . As shown in FIG. 8 , the waterproof component 526 is provided on the frame 522 . The waterproof element 526 is arranged around the frame 522 . As shown in FIG. 8 , the waterproof element 526 is disposed on the surface of the frame 522 without covering the filter hole 524 .

接著將詳細說明本揭露的過濾元件620所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 620 of the present disclosure, as well as the connection relationship between the elements will be described in detail.

請參考第9圖。第9圖為根據本揭露之一實施方式之過濾元件620的示意圖。在本實施方式中,過濾元件620可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第9圖所示,過濾元件620包含框體622,且框體622具有數個過濾孔624。過濾元件620進一步包含防水元件626。第8圖的過濾元件520以及第9圖的過濾元件620的結構配置大致相同。過濾元件620與過濾元件520的不同之處,在於過濾元件620進一步包含數個提取部623。如第9圖所示,提取部623自框體622延伸。在一些實施方式中,當過濾元件620與凹槽G銜接後,提取部623係自冷卻裝置110的外表面突伸。在一使用情境中,由於過濾元件620位於凹槽G中時係自冷卻裝置110的外表面突伸,當使用者欲更換過濾元件620,使用者可以手持提取部623(例如,使用者以指腹夾持提取部623)以提取過濾元件620,以將過濾元件620自液冷模組100卸下。如第9圖所示,提取部623之間進一步具有凹部R以利過濾元件620的更換操作。在一使用情境中,若使用者欲更換過濾元件620,使用者可以利用凹部R作為施力點,再例如以指甲或其他合適的額外元件勾動凹部R以使過濾元件620部分地離開凹槽G。接著,使用者再手持提取部623(例如,使用者以指腹夾持提取部623)提取過濾元件620,以將過濾元件620自液冷模組100卸下。Please refer to Figure 9. Figure 9 is a schematic diagram of a filter element 620 according to an embodiment of the present disclosure. In this embodiment, the filter element 620 can be received in the groove G of the cover 116 to be combined with the cooling device 110 . As shown in FIG. 9 , the filter element 620 includes a frame 622 , and the frame 622 has a plurality of filter holes 624 . Filter element 620 further includes a waterproof element 626. The filter element 520 in FIG. 8 and the filter element 620 in FIG. 9 have substantially the same structural arrangement. The difference between the filter element 620 and the filter element 520 is that the filter element 620 further includes a plurality of extraction parts 623 . As shown in FIG. 9 , the extraction part 623 extends from the frame 622 . In some embodiments, after the filter element 620 is connected to the groove G, the extraction portion 623 protrudes from the outer surface of the cooling device 110 . In a usage scenario, since the filter element 620 protrudes from the outer surface of the cooling device 110 when it is located in the groove G, when the user wants to replace the filter element 620, the user can hold the extraction part 623 (for example, the user points with his finger). The abdomen clamps the extraction part 623) to extract the filter element 620, so as to remove the filter element 620 from the liquid cooling module 100. As shown in FIG. 9 , there are further recesses R between the extraction parts 623 to facilitate the replacement operation of the filter element 620 . In a usage scenario, if the user wants to replace the filter element 620, the user can use the recess R as a force application point, and then, for example, use a fingernail or other suitable additional element to hook the recess R to partially remove the filter element 620 from the groove. G. Then, the user holds the extraction part 623 (for example, the user holds the extraction part 623 with fingertips) to extract the filter element 620 to remove the filter element 620 from the liquid cooling module 100 .

如第9圖所示,在一些實施方式中,防水元件626環繞框體622以及提取部623設置。如第8圖所示,防水元件626設置於框體622的表面上而不覆蓋過濾孔624。As shown in FIG. 9 , in some embodiments, the waterproof element 626 is provided around the frame 622 and the extraction part 623 . As shown in FIG. 8 , the waterproof element 626 is disposed on the surface of the frame 622 without covering the filter hole 624 .

接著將詳細說明本揭露的過濾元件720所包含的各元件的結構、功能以及各元件之間的連接關係。Next, the structure and function of each element included in the filter element 720 of the present disclosure, as well as the connection relationship between the elements will be described in detail.

請參考第10圖。第10圖為根據本揭露之一實施方式之過濾元件720的示意圖。在本實施方式中,過濾元件720可以容置於蓋體116的凹槽G內以與冷卻裝置110結合。如第10圖所示,過濾元件720包含框體722,且框體722具有數個過濾孔724。過濾元件720進一步包含防水元件726。第8圖的過濾元件520以及第10圖的過濾元件720的結構配置大致相同。過濾元件720與過濾元件520的不同之處,在於過濾元件720進一步具有提取孔728。如第10圖所示,提取孔728自框體722延伸,且提取孔728設置於框體722上以利過濾元件720的更換操作。在一使用情境中,若使用者欲更換過濾元件720,使用者可以利用額外的提取件(未繪示)與提取孔728結合,再利用上述提取件與提取孔728之間的摩擦力帶動過濾元件720,以將過濾元件720自液冷模組100卸下。在一些實施方式中,上述提取件可以是類似於退卡針(Ejection Pin)的機構,但本揭露不以此為限。Please refer to Figure 10. Figure 10 is a schematic diagram of a filter element 720 according to an embodiment of the present disclosure. In this embodiment, the filter element 720 can be received in the groove G of the cover 116 to be combined with the cooling device 110 . As shown in Figure 10, the filter element 720 includes a frame 722, and the frame 722 has a plurality of filter holes 724. Filter element 720 further includes a waterproof element 726. The filter element 520 in FIG. 8 and the filter element 720 in FIG. 10 have substantially the same structural arrangement. The difference between the filter element 720 and the filter element 520 is that the filter element 720 further has an extraction hole 728 . As shown in Figure 10, the extraction hole 728 extends from the frame 722, and the extraction hole 728 is provided on the frame 722 to facilitate the replacement operation of the filter element 720. In a usage scenario, if the user wants to replace the filter element 720, the user can use an additional extraction piece (not shown) to be combined with the extraction hole 728, and then use the friction between the extraction piece and the extraction hole 728 to drive the filter. element 720 to remove the filter element 720 from the liquid cooling module 100 . In some embodiments, the extraction component may be a mechanism similar to an ejection pin, but the present disclosure is not limited thereto.

如第10圖所示,在一些實施方式中,防水元件726環繞框體722設置。如第8圖所示,防水元件726設置於框體722的表面上而不覆蓋提取孔728。As shown in FIG. 10 , in some embodiments, the waterproof element 726 is disposed around the frame 722 . As shown in FIG. 8 , the waterproof element 726 is disposed on the surface of the frame 722 without covering the extraction hole 728 .

在一些實施方式中,框體122、框體222、框體322、框體422、框體522、框體622以及框體722可以內置有孔徑比過濾孔124、過濾孔224、過濾孔324、過濾孔424、過濾孔524、過濾孔624以及過濾孔724的孔徑更小的濾網(未繪示)。在一些實施方式中,上述濾網係平行於過濾元件120、過濾元件220、過濾元件320、過濾元件420、過濾元件520、過濾元件620以及過濾元件720延伸。在一些實施方式中,上述濾網係由多層交叉縱橫的波形組合,且濾網的雙面並有交叉鋼條提供補強以及支撐的功能,以增加濾網的堅固性。設置有上述濾網的過濾元件120、過濾元件220、過濾元件320、過濾元件420、過濾元件520、過濾元件620以及過濾元件720可以加長過濾時間,更符合經濟效益。更詳細地說,過濾孔124、過濾孔224、過濾孔324、過濾孔424、過濾孔524、過濾孔624以及過濾孔724的作用是用於阻擋大顆粒的碎屑或汙染物,而濾網的作用是用於阻擋小顆粒的碎屑或汙染物。設置有上述濾網的過濾元件120、過濾元件220、過濾元件320、過濾元件420、過濾元件520、過濾元件620以及過濾元件720提供了許多優點,其可反覆使用且具有高透風性以及低壓損等特性。藉由自內至外的孔徑大小不同,可以阻擋不同大小的碎屑或汙染物,以延長液冷模組100的使用壽命。In some embodiments, the frame 122, the frame 222, the frame 322, the frame 422, the frame 522, the frame 622 and the frame 722 may have built-in aperture ratio filter holes 124, 224, 324, The filter holes 424 , 524 , 624 and 724 are filters with smaller pore sizes (not shown). In some embodiments, the above-mentioned filter mesh extends parallel to the filter element 120 , the filter element 220 , the filter element 320 , the filter element 420 , the filter element 520 , the filter element 620 and the filter element 720 . In some embodiments, the above-mentioned filter screen is composed of multiple layers of intersecting vertical and horizontal corrugated shapes, and cross steel bars are provided on both sides of the filter screen to provide reinforcement and support functions to increase the solidity of the filter screen. The filter element 120, the filter element 220, the filter element 320, the filter element 420, the filter element 520, the filter element 620 and the filter element 720 provided with the above-mentioned filter screen can extend the filtration time and be more economical. In more detail, the filter holes 124, 224, 324, 424, 524, 624 and 724 are used to block large particles of debris or pollutants, and the filter screen The purpose is to block small particles of debris or contaminants. The filter element 120, the filter element 220, the filter element 320, the filter element 420, the filter element 520, the filter element 620 and the filter element 720 provided with the above-mentioned filter nets provide many advantages. They can be used repeatedly and have high ventilation and low pressure loss. and other characteristics. By having different hole sizes from the inside to the outside, debris or contaminants of different sizes can be blocked, thereby extending the service life of the liquid cooling module 100 .

在一些實施方式中,上述濾網可以是包含複數層的折疊網。在一些實施方式中,上述濾網的材料可以是金、鋁或其他合適的材料。In some embodiments, the above-mentioned filter mesh may be a folded mesh including multiple layers. In some embodiments, the material of the above-mentioned filter screen may be gold, aluminum or other suitable materials.

在一些實施方式中,框體122、框體222、框體322、框體422、框體522、框體622以及框體722的材料可以是鋁合金、不鏽鋼或其他合適的材料。In some embodiments, the material of the frame 122, the frame 222, the frame 322, the frame 422, the frame 522, the frame 622 and the frame 722 may be aluminum alloy, stainless steel or other suitable materials.

在一些實施方式中,防水元件526、防水元件626以及防水元件726的材料可以是橡膠或其他合適的防水材料。In some embodiments, the material of the waterproof element 526, the waterproof element 626, and the waterproof element 726 may be rubber or other suitable waterproof materials.

由以上對於本揭露之具體實施方式之詳述,可以明顯地看出,在本揭露之液冷模組中,由於冷卻裝置的散熱底板以及蓋體之間形成配置以流通冷卻流體的腔體,所以冷卻流體可以帶走冷卻裝置上從電子裝置產生的熱。在本揭露之液冷模組中,由於散熱鰭片設置於散熱底板上,使得散熱鰭片可以將散熱底板上從電子裝置產生的熱傳遞至冷卻流體。在本揭露之液冷模組中,由於密封件設置於散熱底板與蓋體之間並環繞腔體設置,使得密封件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件具有過濾孔連通腔體,所以流通於腔體中的冷卻流體的碎屑或汙染物可以藉由過濾孔被攔截,出液部便可以接受來自腔體的經過濾冷卻流體。在本揭露之液冷模組中,由於防水元件設置於過濾元件的框體上,使得防水元件可以防止冷卻流體自冷卻裝置洩漏。在本揭露之液冷模組中,由於過濾元件的數個提取部之間具有凹部,使用者可以以凹部作為施力點以方便地將過濾元件自冷卻裝置上取出。在本揭露之液冷模組中,由於過濾元件進一步具有提取孔,使用者可以利用額外的提取件與提取孔結合以方便地將過濾元件自冷卻裝置上取出。From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the liquid cooling module of the present disclosure, since a cavity is formed between the heat dissipation bottom plate and the cover of the cooling device for circulating cooling fluid, So the cooling fluid can carry away the heat generated from the electronic device on the cooling device. In the liquid cooling module of the present disclosure, since the heat dissipation fins are disposed on the heat dissipation base plate, the heat dissipation fins can transfer the heat generated from the electronic device on the heat dissipation base plate to the cooling fluid. In the liquid cooling module of the present disclosure, since the sealing member is disposed between the heat dissipation bottom plate and the cover and surrounds the cavity, the sealing member can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since the filter element has filter holes connected to the cavity, debris or contaminants of the cooling fluid flowing in the cavity can be intercepted through the filter holes, and the liquid outlet can receive the liquid cooling module from the cavity. Filtered cooling fluid of the chamber. In the liquid cooling module of the present disclosure, since the waterproof element is disposed on the frame of the filter element, the waterproof element can prevent the cooling fluid from leaking from the cooling device. In the liquid cooling module of the present disclosure, since there are recesses between the extraction parts of the filter element, the user can use the recess as a force application point to conveniently take out the filter element from the cooling device. In the liquid cooling module of the present disclosure, since the filter element further has an extraction hole, the user can use an additional extraction piece combined with the extraction hole to conveniently remove the filter element from the cooling device.

在本揭露的一實施方式中,本揭露之液冷模組係可應用於伺服器,該伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present disclosure, the liquid cooling module of the present disclosure can be applied to a server. The server can be used for artificial intelligence (AI) computing, edge computing (edge computing), and can also be used as a server. Used as 5G server, cloud server or Internet of Vehicles server.

雖然本揭露已以實施方式揭露如上,然其並不用以限定本揭露,任何熟習此技藝者,在不脫離本揭露的精神和範圍內,當可作各種的更動與潤飾,因此本揭露的保護範圍當視後附的申請專利範圍所界定者為準。Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection of the disclosure is The scope shall be determined by the appended patent application scope.

100:液冷模組 110:冷卻裝置 112:散熱底板 114:散熱鰭片 116:蓋體 117A:入液部 117B:出液部 118:密封件 120,220,320,420,520,620,720:過濾元件 122,222,322,422,522,622,722:框體 124,224,324,424,524,624,724:過濾孔 526,626,726:防水元件 623:提取部 728:提取孔 F:鎖固件 G:凹槽 LQ:冷卻流體 LQ’:經過濾冷卻流體 R:凹部 S:腔體 X,Y,Z:方向 100:Liquid cooling module 110: Cooling device 112: Cooling base plate 114: Cooling fins 116: Cover 117A: Liquid entry part 117B: Liquid outlet 118:Seals 120,220,320,420,520,620,720: filter element 122,222,322,422,522,622,722:frame 124,224,324,424,524,624,724: Filter holes 526,626,726: Waterproof components 623:Extraction Department 728:Extraction hole F:Lock firmware G: Groove LQ: cooling fluid LQ’: filtered cooling fluid R: concave part S: cavity X,Y,Z: direction

為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖繪示根據本揭露之一實施方式之液冷模組的示意圖。 第2圖繪示根據本揭露之一實施方式之液冷模組的爆炸圖。 第3圖繪示根據本揭露之一實施方式之液冷模組的剖面圖。 第4圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第5圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第6圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第7圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第8圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第9圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 第10圖繪示根據本揭露之一實施方式之過濾元件的示意圖。 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the accompanying drawings are described as follows: Figure 1 is a schematic diagram of a liquid cooling module according to an embodiment of the present disclosure. Figure 2 illustrates an exploded view of a liquid cooling module according to an embodiment of the present disclosure. Figure 3 illustrates a cross-sectional view of a liquid cooling module according to an embodiment of the present disclosure. Figure 4 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 5 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 6 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 7 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 8 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 9 is a schematic diagram of a filter element according to an embodiment of the present disclosure. Figure 10 is a schematic diagram of a filter element according to an embodiment of the present disclosure.

100:液冷模組 100:Liquid cooling module

110:冷卻裝置 110: Cooling device

112:散熱底板 112: Cooling base plate

114:散熱鰭片 114: Cooling fins

116:蓋體 116: Cover

117A:入液部 117A: Liquid entry part

117B:出液部 117B: Liquid outlet

118:密封件 118:Seals

120:過濾元件 120:Filter element

122:框體 122:Frame

124:過濾孔 124:Filter hole

F:鎖固件 F:Lock firmware

G:凹槽 G: Groove

X,Y,Z:方向 X,Y,Z: direction

Claims (8)

一種液冷模組,包含:一冷卻裝置,包含:一散熱底板;一蓋體,設置於該散熱底板上方,該蓋體與該散熱底板之間形成一腔體,且該腔體配置以流通一冷卻流體;一入液部,設置於該蓋體上並配置以接受該冷卻流體;以及一出液部,設置於該蓋體上並配置以接受來自該腔體之該冷卻流體;以及一過濾元件,設置於該冷卻裝置上並穿過該腔體,且該過濾元件位於該入液部與該出液部之間,其中該過濾元件進一步包含一框體與一防水元件,該框體具有複數個過濾孔,且該些過濾孔連通該腔體,該防水元件設置於該框體上,且該防水元件係環繞該框體設置。 A liquid cooling module includes: a cooling device, including: a heat dissipation bottom plate; a cover disposed above the heat dissipation bottom plate, a cavity is formed between the cover and the heat dissipation bottom plate, and the cavity is configured to circulate A cooling fluid; a liquid inlet, which is provided on the cover and configured to receive the cooling fluid; and a liquid outlet, which is provided on the cover and configured to receive the cooling fluid from the cavity; and a liquid outlet. A filter element is provided on the cooling device and passes through the cavity, and the filter element is located between the liquid inlet part and the liquid outlet part, wherein the filter element further includes a frame and a waterproof element, the frame There are a plurality of filter holes, and the filter holes are connected to the cavity. The waterproof element is arranged on the frame, and the waterproof element is arranged around the frame. 如請求項1所述之液冷模組,其中該蓋體具有一凹槽配置以容置該過濾元件。 The liquid cooling module of claim 1, wherein the cover has a groove configuration to accommodate the filter element. 如請求項1所述之液冷模組,其中該冷卻裝置進一步包含一散熱鰭片設置於該散熱底板上。 The liquid cooling module of claim 1, wherein the cooling device further includes a heat dissipation fin disposed on the heat dissipation base plate. 如請求項1所述之液冷模組,其中該冷卻 裝置進一步包含一密封件設置於該散熱底板與該蓋體之間。 The liquid cooling module as described in claim 1, wherein the cooling The device further includes a sealing member disposed between the heat dissipation bottom plate and the cover. 如請求項4所述之液冷模組,其中該密封件係環繞該腔體設置。 The liquid cooling module of claim 4, wherein the sealing member is disposed around the cavity. 如請求項1所述之液冷模組,進一步包含複數個鎖固件,且該散熱底板藉由該些鎖固件與該蓋體結合。 The liquid cooling module of claim 1 further includes a plurality of fasteners, and the heat dissipation bottom plate is combined with the cover through the fasteners. 如請求項1所述之液冷模組,其中該框體進一步包含複數個提取部,且該些提取部之間具有一凹部。 The liquid cooling module of claim 1, wherein the frame further includes a plurality of extraction parts, and there is a recess between the extraction parts. 如請求項1所述之液冷模組,其中該過濾元件進一步具有一提取孔設置於該框體上。 The liquid cooling module of claim 1, wherein the filter element further has an extraction hole disposed on the frame.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254608B (en) * 2001-09-04 2006-05-01 Hitachi Ltd Water cooling device for electronic apparatus
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US20150173251A1 (en) * 2013-12-18 2015-06-18 International Business Machines Corporation Liquid-cooling apparatus with integrated coolant filter
TW201826077A (en) * 2018-02-08 2018-07-16 黃崇賢 Water cooling radiator with impurity filtration function having a filter net in a selected flow channel for isolating and filtering impurities in the cooling liquid
CN114518795A (en) * 2022-02-28 2022-05-20 英业达科技有限公司 Water cooling plate assembly
TWI765680B (en) * 2021-01-27 2022-05-21 黃崇賢 Vertical liquid cooling radiator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254608B (en) * 2001-09-04 2006-05-01 Hitachi Ltd Water cooling device for electronic apparatus
TW201238453A (en) * 2011-03-03 2012-09-16 Chroma Ate Inc Liquid cooling heat dissipation structure
US20150173251A1 (en) * 2013-12-18 2015-06-18 International Business Machines Corporation Liquid-cooling apparatus with integrated coolant filter
TW201826077A (en) * 2018-02-08 2018-07-16 黃崇賢 Water cooling radiator with impurity filtration function having a filter net in a selected flow channel for isolating and filtering impurities in the cooling liquid
TWI765680B (en) * 2021-01-27 2022-05-21 黃崇賢 Vertical liquid cooling radiator
CN114518795A (en) * 2022-02-28 2022-05-20 英业达科技有限公司 Water cooling plate assembly

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