CN117715355A

CN117715355A - Liquid cooling module

Info

Publication number: CN117715355A
Application number: CN202211090614.4A
Authority: CN
Inventors: 陈柏安
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2022-09-07
Filing date: 2022-09-07
Publication date: 2024-03-15

Abstract

The invention provides a liquid cooling module, wherein the liquid cooling module comprises: the cooling device comprises a radiating bottom plate, a cover body, a liquid inlet part and a liquid outlet part, wherein the cover body is arranged above the radiating bottom plate, a cavity is formed between the cover body and the radiating bottom plate, the cavity is configured to circulate cooling fluid, the liquid inlet part is arranged on the cover body and is configured to receive the cooling fluid, the liquid outlet part is arranged on the cover body and is configured to receive the cooling fluid from the cavity, the filter assembly is arranged on the cooling device and penetrates through the cavity, and the filter assembly is positioned between the liquid inlet part and the liquid outlet part.

Description

Liquid cooling module

Technical Field

The invention relates to the technical field of equipment manufacturing, in particular to a liquid cooling module.

Background

The liquid cooling module of the existing electronic component (for example, CPU) uses the heat dissipation bottom plate of the electronic component as a substrate, and is matched with the liquid inlet side and the liquid outlet side to serve as internal circulation loops for heat exchange so as to achieve the heat dissipation effect of the electronic component.

However, most of the existing liquid cooling modules are designed in a one-in-one-out manner (i.e., one liquid-in side and one liquid-out side are configured). The electronic components in the liquid cooling module may be due to the material or the component factor of the cooling fluid used, and as the cooling fluid flows for a long time, impurities, fragments or pollutants precipitated or generated during the flowing of the cooling fluid will remain in the liquid cooling module, and cause the heat dissipation efficiency to be poor, which may eventually lead to the server performance to be poor and the problem of shutdown.

Therefore, how to provide a liquid cooling module to achieve the effect of prolonging the service life of the electronic component is one of the problems to be solved by the research and development resources in the industry.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a liquid cooling module that can solve the above-mentioned problems.

According to an embodiment of the invention, a liquid cooling module comprises a cooling device and a filtering component, wherein the cooling device comprises a radiating bottom plate, a cover body, a liquid inlet part and a liquid outlet part, the cover body is arranged above the radiating bottom plate, a cavity is formed between the cover body and the radiating bottom plate, the cavity is configured to circulate cooling fluid, the liquid inlet part is arranged on the cover body and is configured to receive the cooling fluid, the liquid outlet part is arranged on the cover body and is configured to receive the cooling fluid from the cavity, the filtering component is arranged on the cooling device and penetrates through the cavity, and the filtering component is positioned between the liquid inlet part and the liquid outlet part.

In an embodiment of the invention, the cover has a groove configured to accommodate the filter assembly.

In an embodiment of the invention, the cooling device further includes a heat dissipation fin, and the heat dissipation fin is disposed on the heat dissipation base plate.

In an embodiment of the invention, the cooling device further includes a sealing member disposed between the heat dissipation base plate and the cover body.

In one embodiment of the invention, the seal is disposed around the cavity.

In an embodiment of the invention, the heat dissipating base further includes a plurality of locking members, and the heat dissipating base is combined with the cover body by the plurality of locking members.

In an embodiment of the invention, the filtering component includes a frame, the frame has a plurality of filtering holes, and the plurality of filtering holes are communicated with the cavity.

In an embodiment of the invention, the filtering component further includes a waterproof component, the waterproof component is disposed on the frame, and the waterproof component is disposed around the frame.

In an embodiment of the invention, the frame further includes a plurality of extraction portions, and a recess is disposed between the plurality of extraction portions.

In an embodiment of the invention, the filtering component further includes an extraction hole, and the extraction hole is disposed on the frame body.

As described above, in the liquid cooling module according to the present invention, the cavity configured to circulate the cooling fluid is formed between the heat radiation bottom plate and the cover of the cooling device, so that the cooling fluid can remove heat generated from the electronic device on the cooling device. In the liquid cooling module of the invention, the radiating fins are arranged on the radiating bottom plate, so that the radiating fins can transfer heat generated from the electronic device on the radiating bottom plate to the cooling fluid. In the liquid cooling module, the sealing element is arranged between the radiating bottom plate and the cover body and surrounds the cavity, so that the sealing element can prevent cooling fluid from leaking from the cooling device. In the liquid cooling module, since the filtering assembly is provided with the filtering holes communicated with the cavity, fragments or pollutants of the cooling fluid flowing in the cavity can be intercepted by the filtering holes, and the liquid outlet part can receive the filtered cooling fluid from the cavity. In the liquid cooling module, the waterproof component is arranged on the frame body of the filter component, so that the waterproof component can prevent cooling fluid from leaking from the cooling device. In the liquid cooling module of the invention, since the concave parts are arranged among the plurality of extraction parts of the filter assembly, a user can take the concave parts as force application points so as to conveniently take out the filter assembly from the cooling device. In the liquid cooling module of the present invention, since the filter assembly further has the extraction hole, a user can use an additional extraction member in combination with the extraction hole to conveniently take out the filter assembly from the cooling device.

Drawings

FIG. 1 is a schematic diagram of a liquid cooling module according to an embodiment of the invention;

FIG. 2 is an exploded view of a liquid cooling module according to an embodiment of the invention;

FIG. 3 is a cross-sectional view of a liquid cooling module according to an embodiment of the invention;

FIG. 4 is a schematic diagram of a filter assembly of a liquid cooling module according to an embodiment of the invention;

FIG. 5 is a schematic diagram of a filter assembly of a liquid cooling module according to an embodiment of the invention;

FIG. 6 is a schematic diagram of a filter assembly of the liquid cooling module according to an embodiment of the invention;

FIG. 7 is a schematic diagram of a filter assembly of a liquid cooling module according to an embodiment of the invention;

FIG. 8 is a schematic diagram of a filter assembly of a liquid cooling module according to an embodiment of the invention;

FIG. 9 is a schematic diagram of a filter assembly of a liquid cooling module according to an embodiment of the invention;

FIG. 10 is a schematic diagram of a filter assembly of a liquid cooling module according to an embodiment of the invention.

Description of element reference numerals

100. Liquid cooling module

110. Cooling device

112. Radiating bottom plate

114. Heat radiation fin

116. Cover body

117A liquid inlet part

117B liquid outlet portion

118. Sealing element

120. 220, 320, 420, 520, 620, 720 filter assembly

122. 222, 322, 422, 522, 622, 722 frame

124. 224, 324, 424, 524, 624, 724 filter holes

526. 626, 726 waterproof assembly

623. Extraction unit

728. Extraction hole

F locking piece

G groove

LQ cooling fluid

LQ' filtered cooling fluid

R concave part

S cavity

X, Y, Z direction

Detailed Description

Other advantages and effects of the present invention will become apparent to those skilled in the art from the following description of the invention, which is provided by way of specific embodiments. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.

It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

Please refer to fig. 1. Fig. 1 is a schematic diagram of a liquid cooling module 100 according to an embodiment of the invention. In the present embodiment, in fig. 1, a liquid cooling module 100 for heat dissipation of a heat generating component (not shown) is provided. Specifically, a heat generating component (e.g., a central processing unit (Central Processing Unit; CPU)) is disposed on, for example, a PCB, and the heat generating component contacts the liquid cooling module 100. In other words, the heat generating component is located between the above-described PCB and the liquid cooling module 100. In a use scenario, a user may cover the liquid cooling module 100 with the heat generating component, and then fix the liquid cooling module 100 on the PCB, so that the heat generating component disposed on the PCB may contact the liquid cooling module 100. In the present embodiment, as shown in fig. 1, the liquid cooling module 100 includes a cooling device 110 and a filter assembly 120. The filter assembly 120 is disposed on the cooling device 110.

Please refer to fig. 2 and fig. 3. Fig. 2 and 3 are an exploded view and a cross-sectional view, respectively, of a liquid cooling module 100 according to an embodiment of the present invention. Fig. 2 and 3 show the structure of each component of the liquid cooling module 100 and the connection relationship between each component in more detail. As shown in fig. 2 and 3, the cooling device 110 includes a heat dissipation base 112, heat dissipation fins 114, a cover 116, a liquid inlet 117A, a liquid outlet 117B, and a sealing member 118. The filter assembly 120 includes a frame 122, and the frame 122 has a plurality of filter holes 124. The heat dissipation fins 114 are disposed on the heat dissipation base 112. The cover 116 is disposed above the heat dissipating bottom 112. As shown in fig. 3, a cavity S is formed between the cover 116 and the heat dissipation base 112, and the cavity S is configured to circulate the cooling fluid LQ. As shown in fig. 2, the cover 116 has a recess G configured to receive the filter assembly 120. In some embodiments, the groove G communicates with the cavity S and thus extends into the cavity S when the filter assembly 120 is engaged with the groove G. The liquid inlet portion 117A is provided on the cover 116 and configured to receive the cooling fluid LQ. After the filter assembly 120 engages with the groove G, the filter assembly 120 can block the cooling fluid LQ flowing in the cavity S from flowing out of the cooling device 110 through the groove G. The liquid outlet 117B is disposed on the cover 116 and configured to receive the cooling fluid LQ from the chamber S. The liquid inlet portion 117A and the liquid outlet portion 117B communicate with the chamber S. As shown in fig. 3, the filter assembly 120 is disposed on the cooling device 110 and passes through the cavity S, and the filter assembly 120 is located between the liquid inlet 117A and the liquid outlet 117B. As shown in fig. 3, the filter hole 124 communicates with the chamber S. As shown in fig. 3, when the cooling fluid LQ flows from the liquid inlet portion 117A into the cavity S and through the filter assembly 120, the filter assembly 120 may filter the cooling fluid LQ such that the cooling fluid LQ flowing through the filter assembly 120 is converted into a filtered cooling fluid LQ'. The seal 118 is disposed between the heat sink base 112 and the cover 116. In some embodiments, the seal 118 is disposed around the cavity S.

In the present embodiment, as shown in fig. 2 and 3, the liquid cooling module 100 further includes a plurality of locking members F. As shown in fig. 2 and 3, the heat dissipation base 112 may be combined with the cover 116 by the locking member F.

In some embodiments, the heat sink base 112 directly contacts the heat generating components described above. In some embodiments, the heat dissipating base 112 may include a fin arrangement on a side proximate to the cavity S to transfer heat from the heat generating component.

In some embodiments, the seal 118 is annular in shape or other similar shape.

In some embodiments, the locking member F is a locking screw or other fixing component that can combine the heat dissipating base 112 with the cover 116.

With the above configuration, the liquid cooling module 100 contacts the heat generating component, so that the heat of the heat generating component is transferred to the heat dissipating fins 114 through the heat dissipating bottom plate 112. When the cooling fluid LQ flows into the cavity S from the liquid inlet portion 117A, the filtering component 120 may filter the cooling fluid LQ, specifically, the filtering component 120 may intercept the chips or pollutants in the cooling fluid LQ through the filtering holes 124, so that the cooling fluid LQ flowing through the filtering component 120 is converted into the filtered cooling fluid LQ'. Thereby, the liquid cooling module 100 can prolong the service life of the heating component.

The structure, function, and connection relationship between the components included in the filtering component 120 of the present invention will be described in detail.

Please refer to fig. 4. Fig. 4 is a schematic diagram of a filter assembly 120 according to an embodiment of the invention. As shown in fig. 4, in some embodiments, the filter aperture 124 passes through the frame 122 along a first direction (e.g., direction X). In some embodiments, the filter apertures 124 are aligned along a second direction (e.g., direction Y) on the frame 122. In some embodiments, the filter apertures 124 extend elongated along a third direction (e.g., direction Z). In some embodiments, the filter holes 124 are equally spaced. In some embodiments, the filter apertures 124 are elongated in shape.

The structure, function, and connection relationship between the components included in the filtering component 220 of the present invention will be described in detail.

Please refer to fig. 5. Fig. 5 is a schematic diagram of a filter assembly 220 according to an embodiment of the invention. In this embodiment, the filter assembly 220 may be received in the groove G of the cover 116 to be coupled with the cooling device 110. As shown in fig. 5, the filter assembly 220 includes a frame 222, and the frame 222 has a plurality of filter holes 224. The structural configuration of the filter assembly 120 of fig. 4 and the filter assembly 220 of fig. 5 is substantially the same. Filter assembly 220 differs from filter assembly 120 in that the shape of filter apertures 224 is different from filter apertures 124. In some embodiments, as shown in fig. 5, the filter holes 224 are circular in shape. As shown in fig. 5, in some embodiments, the filter aperture 224 passes through the frame 222 along a first direction (e.g., direction X). In some embodiments, the filter holes 224 are aligned along a second direction (e.g., direction Y) on the frame 222. In some embodiments, the filter apertures 224 have a pore size of 2 millimeters. In some embodiments, as shown in fig. 5, the filter holes 224 are equally spaced along the second direction (e.g., direction Y) and the third direction (e.g., direction Z).

The structure, function, and connection relationship between the components included in the filtering component 320 of the present invention will be described in detail.

Please refer to fig. 6. Fig. 6 is a schematic diagram of a filter assembly 320 according to an embodiment of the invention. In this embodiment, the filter assembly 320 may be received in the groove G of the cover 116 to be coupled with the cooling device 110. As shown in fig. 6, the filter assembly 320 includes a frame 322, and the frame 322 has a plurality of filter holes 324. The structural configuration of filter assembly 120 of fig. 4 and filter assembly 320 of fig. 6 is substantially the same. Filter assembly 320 differs from filter assembly 120 in that filter apertures 324 differ from filter apertures 124 in shape. As shown in fig. 6, in some embodiments, the filter holes 324 are beveled in shape. As shown in fig. 6, in some embodiments, the filter apertures 324 pass through the frame 322 along a first direction (e.g., direction X). In some embodiments, the filter holes 324 are aligned along a second direction (e.g., direction Y) on the frame 322. In some embodiments, as shown in fig. 6, the filter holes 324 are equally spaced along the second direction (e.g., direction Y).

The structure, function, and connection relationship between the components included in the filtering component 420 of the present invention will be described in detail.

Please refer to fig. 7. Fig. 7 is a schematic diagram of a filter assembly 420 according to an embodiment of the invention. In this embodiment, the filter assembly 420 may be received in the groove G of the cover 116 to be combined with the cooling device 110. As shown in fig. 7, the filter assembly 420 includes a frame 422, and the frame 422 has a plurality of filter holes 424. The structural configuration of the filter assembly 120 of fig. 4 and the filter assembly 420 of fig. 7 is substantially the same. Filter assembly 420 differs from filter assembly 120 in that the shape of filter aperture 424 is different from filter aperture 124. As shown in fig. 7, in some embodiments, the filter aperture 424 is diamond-shaped in shape. As shown in fig. 7, in some embodiments, the filter aperture 424 passes through the frame 422 along a first direction (e.g., direction X). In some embodiments, the filter holes 424 are aligned along a second direction (e.g., direction Y) and a third direction (e.g., direction Z) on the frame 422.

The structure, function, and connection relationship of the components included in the filtering component 520 of the present invention will be described in detail.

Please refer to fig. 8. Fig. 8 is a schematic diagram of a filter assembly 520 according to an embodiment of the invention. In this embodiment, the filter assembly 520 may be received in the groove G of the cover 116 to be coupled with the cooling device 110. As shown in fig. 8, the filter assembly 520 includes a frame 522, and the frame 522 has a plurality of filter holes 524. The structural configuration of filter assembly 120 of fig. 4 and filter assembly 520 of fig. 8 is substantially the same. The filter assembly 520 differs from the filter assembly 120 in that the filter assembly 520 further includes a waterproof assembly 526. As shown in fig. 8, the waterproof component 526 is disposed on the frame 522. A waterproof assembly 526 is disposed around the frame 522. As shown in fig. 8, the waterproof member 526 is disposed on the surface of the frame 522 without covering the filter hole 524.

The structure, function, and connection relationship between the components included in the filtering component 620 of the present invention will be described in detail.

Please refer to fig. 9. Fig. 9 is a schematic diagram of a filter assembly 620 according to an embodiment of the invention. In this embodiment, the filter assembly 620 may be received in the groove G of the cover 116 to be coupled with the cooling device 110. As shown in fig. 9, the filter assembly 620 includes a frame 622, and the frame 622 has a plurality of filter holes 624. The filter assembly 620 further includes a waterproof assembly 626. The structural configuration of the filter assembly 520 of fig. 8 and the filter assembly 620 of fig. 9 is substantially the same. Filter element 620 differs from filter element 520 in that filter element 620 further includes a plurality of extraction portions 623. As shown in fig. 9, the extracting portion 623 extends from the housing 622. In some embodiments, extraction portion 623 protrudes from the outer surface of cooling device 110 after filter assembly 620 engages groove G. In a use scenario, since the filter element 620 protrudes from the outer surface of the cooling device 110 when being located in the groove G, when the user wants to replace the filter element 620, the user can hold the extraction portion 623 (for example, the user holds the extraction portion 623 with his or her finger) to extract the filter element 620, so as to detach the filter element 620 from the liquid cooling module 100. As shown in fig. 9, and the extracting portion 623 further has a recess R therebetween to facilitate the replacement operation of the filter element 620. In one use scenario, if the user wishes to replace the filter element 620, the user may use the recess R as a point of application and then, for example, use a nail or other suitable additional element to hook the recess R to partially disengage the filter element 620 from the groove G. Next, the user holds the extracting portion 623 again (e.g., the user holds the extracting portion 623 with his or her finger) to extract the filter element 620, so as to detach the filter element 620 from the liquid cooling module 100.

As shown in fig. 9, in some embodiments, a waterproof component 626 is disposed around the frame 622 and the extraction portion 623. As shown in fig. 8, the waterproof member 626 is disposed on the surface of the frame 622 without covering the filter hole 624.

The structure, function, and connection relationship of the components included in the filtering component 720 of the present invention will be described in detail.

Please refer to fig. 10. Fig. 10 is a schematic diagram of a filter assembly 720 according to an embodiment of the invention. In this embodiment, the filter assembly 720 may be accommodated in the groove G of the cover 116 to be combined with the cooling device 110. As shown in fig. 10, the filter assembly 720 includes a frame 722, and the frame 722 has a plurality of filter holes 724. The filter assembly 720 further includes a waterproofing assembly 726. The structural configuration of the filter assembly 520 of fig. 8 and the filter assembly 720 of fig. 10 is substantially the same. The filter assembly 720 differs from the filter assembly 520 in that the filter assembly 720 further has extraction holes 728. As shown in fig. 10, the extraction hole 728 extends from the frame 722, and the extraction hole 728 is provided on the frame 722 to facilitate replacement operation of the filter assembly 720. In one usage scenario, if the user wants to replace the filter assembly 720, the user can use an additional extraction member (not shown) to combine with the extraction hole 728, and then use the friction between the extraction member and the extraction hole 728 to drive the filter assembly 720, so as to detach the filter assembly 720 from the liquid cooling module 100. In some embodiments, the extracting member may be a mechanism similar to an ejector Pin (ejector Pin), but the invention is not limited thereto.

As shown in fig. 10, in some embodiments, a waterproof component 726 is disposed around the frame 722. As shown in fig. 8, the waterproof member 726 is disposed on the surface of the housing 722 without covering the extraction hole 728.

In some embodiments, the frames 122, 222, 322, 422, 522, 622, and 722 may house a screen (not shown) having a smaller pore size than the pore sizes of the filter holes 124, 224, 324, 424, 524, 624, and 724. In some embodiments, the filter screen extends parallel to filter assemblies 120, 220, 320, 420, 520, 620, and 720. In some embodiments, the filter screen is composed of a plurality of layers of cross-wave shapes, and the double sides of the filter screen are combined with cross steel bars to provide reinforcement and support, so that the firmness of the filter screen is increased. The filter assemblies 120, 220, 320, 420, 520, 620 and 720 with the above filter screen can lengthen the filtering time, which is more economical. In more detail, the filter holes 124, 224, 324, 424, 524, 624 and 724 function to block large particle debris or contaminants, while the filter screen functions to block small particle debris or contaminants. The filter assemblies 120, 220, 320, 420, 520, 620, 720 provided with the above-described filter screen provide a number of advantages, including being reusable and having high air permeability and low pressure loss. By varying the pore size from inside to outside, debris or contaminants of varying sizes may be blocked to extend the useful life of the liquid cooling module 100.

In some embodiments, the screen may be a pleated screen comprising a plurality of layers. In some embodiments, the material of the screen may be gold, aluminum, or other suitable material.

In some embodiments, the materials of frame 122, frame 222, frame 322, frame 422, frame 522, frame 622, and frame 722 may be aluminum alloys, stainless steel, or other suitable materials.

In some embodiments, the materials of the flashing components 526, 626, and 726 may be rubber or other suitable flashing materials.

As is apparent from the above description of the embodiments of the present invention, in the liquid cooling module of the present invention, since the cavity configured to circulate the cooling fluid is formed between the heat radiation bottom plate and the cover of the cooling device, the cooling fluid can remove heat generated from the electronic device on the cooling device. In the liquid cooling module of the invention, the radiating fins are arranged on the radiating bottom plate, so that the radiating fins can transfer heat generated from the electronic device on the radiating bottom plate to the cooling fluid. In the liquid cooling module, the sealing element is arranged between the radiating bottom plate and the cover body and surrounds the cavity, so that the sealing element can prevent cooling fluid from leaking from the cooling device. In the liquid cooling module, since the filtering assembly is provided with the filtering holes communicated with the cavity, fragments or pollutants of the cooling fluid flowing in the cavity can be intercepted by the filtering holes, and the liquid outlet part can receive the filtered cooling fluid from the cavity. In the liquid cooling module, the waterproof component is arranged on the frame body of the filter component, so that the waterproof component can prevent cooling fluid from leaking from the cooling device. In the liquid cooling module of the invention, since the concave parts are arranged among the plurality of extraction parts of the filter assembly, a user can take the concave parts as force application points so as to conveniently take out the filter assembly from the cooling device. In the liquid cooling module of the present invention, since the filter assembly further has the extraction hole, a user can use an additional extraction member in combination with the extraction hole to conveniently take out the filter assembly from the cooling device.

In an embodiment of the present invention, the liquid cooling module of the present invention may be applied to a server, which may be used for artificial intelligence (Artificial Intelligence, abbreviated as AI) operation, edge computing (edge computing), and may also be used as a 5G server, a cloud server, or a vehicle networking server.

While the invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention, and it is intended that the scope of the invention be limited only by the terms of the appended claims.

Claims

1. A liquid cooling module, comprising:

a cooling device, comprising:

a heat dissipation base plate;

the cover body is arranged above the heat dissipation bottom plate, a cavity is formed between the cover body and the heat dissipation bottom plate, and the cavity is configured to circulate a cooling fluid;

a liquid inlet part arranged on the cover body and configured to receive the cooling fluid; and

a liquid outlet part arranged on the cover body and configured to receive the cooling fluid from the cavity;

and the filter component is arranged on the cooling device and penetrates through the cavity, and is positioned between the liquid inlet part and the liquid outlet part.

2. The liquid cooling module of claim 1, wherein the cover has a recess configured to receive the filter assembly.

3. The liquid cooling module according to claim 1, wherein the cooling device further comprises a heat sink fin disposed on the heat sink base plate.

4. The liquid cooling module of claim 1, wherein the cooling device further comprises a sealing member disposed between the heat sink base and the cover.

5. The liquid cooling module of claim 4, wherein the seal is disposed around the cavity.

6. The liquid cooling module of claim 1, further comprising a plurality of locking members, and wherein the heat sink base plate is coupled to the cover by the plurality of locking members.

7. The liquid cooling module of claim 1, wherein the filter assembly comprises a frame having a plurality of filter holes, and wherein the plurality of filter holes are in communication with the cavity.

8. The liquid cooling module according to claim 7, wherein the filter assembly further comprises a waterproof assembly, the waterproof assembly is disposed on the frame, and the waterproof assembly is disposed around the frame.

9. The liquid cooling module according to claim 7, wherein the frame further comprises a plurality of extraction portions, and a recess is provided between the plurality of extraction portions.

10. The liquid cooling module according to claim 7, wherein the filter assembly further comprises an extraction aperture, the extraction aperture being disposed on the housing.