TWI813324B - Liquid cooling device and electronic assembly - Google Patents
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- TWI813324B TWI813324B TW111121180A TW111121180A TWI813324B TW I813324 B TWI813324 B TW I813324B TW 111121180 A TW111121180 A TW 111121180A TW 111121180 A TW111121180 A TW 111121180A TW I813324 B TWI813324 B TW I813324B
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- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 239000007788 liquid Substances 0.000 title claims abstract description 53
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 238000013473 artificial intelligence Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本發明係關於一種液冷裝置及電子組件,特別係關於一種包含組裝架的液冷裝置及電子組件。The present invention relates to a liquid cooling device and an electronic component, and in particular to a liquid cooling device and an electronic component including an assembly rack.
隨著電子元件技術的快速發展,伺服器中設置在主機板上之熱源所發出的熱不斷增加。有鑑於此,廠商常常會使用水冷裝置來對伺服器中的熱源進行散熱,以透過高比熱的水來有效地逸散熱源所發出的熱。在這樣的情況中,通常會透過與熱源熱接觸的水冷頭來有效地吸收熱源所發出的熱。這樣的水冷頭通常包含基座、蓋板以及多個螺絲。蓋板設置於基座的一側而與基座共同形成流動空間。螺絲則將蓋板固定在主機板。With the rapid development of electronic component technology, the heat generated by the heat source installed on the motherboard in the server continues to increase. In view of this, manufacturers often use water-cooling devices to dissipate heat sources in servers to effectively dissipate the heat generated by the heat sources through water with high specific heat. In such a situation, the heat emitted by the heat source is usually effectively absorbed through a water block that is in thermal contact with the heat source. Such a water block usually consists of a base, a cover, and a number of screws. The cover plate is arranged on one side of the base and forms a flow space together with the base. The screws secure the cover to the motherboard.
然,在傳統的水冷頭中,螺絲係透過不可拆卸的方式直接固定在蓋板。因此,為了將水冷頭安裝於不同尺寸或不同散熱需求的熱源,會需要準備多個模具來製造不同規格的水冷頭。也就是說,傳統的水冷頭有難以共用於不同尺寸或不同散熱需求的熱源之問題。However, in a traditional water block, the screws are directly fixed to the cover in a non-detachable manner. Therefore, in order to install the water-cooling head on heat sources of different sizes or with different heat dissipation requirements, it is necessary to prepare multiple molds to manufacture water-cooling heads of different specifications. In other words, traditional water blocks have the problem of being difficult to share with heat sources of different sizes or with different heat dissipation requirements.
本發明在於提供一種液冷裝置及電子組件,以使液冷裝置能共用於不同尺寸或不同散熱需求的熱源。The present invention provides a liquid cooling device and an electronic component, so that the liquid cooling device can be used for heat sources of different sizes or different heat dissipation requirements.
本發明一實施例所揭露之液冷裝置用以固定於一主機板並熱接觸於一熱源。液冷裝置包含一基座、一蓋板、一第一接頭、一第二接頭、一組裝架以及多個緊固件。基座用以熱接觸於熱源。蓋板設置於基座的一側而與基座共同形成一流動空間。蓋板包含一入口以及一出口。入口透過流動空間連通於出口。第一接頭以及第二接頭設置於蓋板且分別連通於入口及出口。組裝架可拆卸地安裝於蓋板遠離基座的一側。緊固件固定於組裝架並用以固定於主機板。A liquid cooling device disclosed in one embodiment of the present invention is used to be fixed on a motherboard and in thermal contact with a heat source. The liquid cooling device includes a base, a cover, a first connector, a second connector, an assembly frame and a plurality of fasteners. The base is used for thermal contact with the heat source. The cover plate is arranged on one side of the base and forms a flow space together with the base. The cover includes an inlet and an outlet. The entrance is connected to the exit through the flow space. The first joint and the second joint are provided on the cover plate and communicate with the inlet and the outlet respectively. The assembly frame is detachably installed on the side of the cover away from the base. The fastener is fixed on the assembly frame and used to fix it on the motherboard.
本發明另一實施例所揭露之電子組件包含一主機板、一熱源以及一液冷裝置。熱源設置並電性連接於主機板。液冷裝置包含一基座、一蓋板、一第一接頭、一第二接頭、一組裝架以及多個緊固件。基座熱接觸於熱源。蓋板設置於基座的一側而與基座共同形成一流動空間。蓋板包含一入口以及一出口。入口透過流動空間連通於出口。第一接頭以及一第二接頭設置於蓋板且分別連通於入口及出口。組裝架可拆卸地安裝於蓋板遠離基座的一側。緊固件固定於組裝架以及主機板。An electronic component disclosed in another embodiment of the present invention includes a motherboard, a heat source and a liquid cooling device. The heat source is set and electrically connected to the motherboard. The liquid cooling device includes a base, a cover, a first connector, a second connector, an assembly frame and a plurality of fasteners. The base is in thermal contact with the heat source. The cover plate is arranged on one side of the base and forms a flow space together with the base. The cover includes an inlet and an outlet. The entrance is connected to the exit through the flow space. A first joint and a second joint are provided on the cover plate and connected to the inlet and the outlet respectively. The assembly frame is detachably installed on the side of the cover away from the base. The fasteners are fixed on the assembly frame and the motherboard.
根據上述實施例所揭露之液冷裝置及電子組件,組裝架可拆卸地安裝於蓋板,且緊固件固定於組裝架以及主機板。因此,當熱源的尺寸改變時,根據本發明的液冷裝置僅需替換組裝架及緊固件而不用替換水冷板。當熱源的發熱量改變時,根據本發明的液冷裝置僅需替換水冷板的基座及散熱鰭片組而不用替換組裝架及緊固件。如此一來,液冷裝置便能共用於不同尺寸或不同散熱需求的熱源。According to the liquid cooling device and electronic components disclosed in the above embodiments, the assembly frame is detachably installed on the cover, and the fasteners are fixed on the assembly frame and the motherboard. Therefore, when the size of the heat source changes, the liquid cooling device according to the present invention only needs to replace the assembly frame and fasteners without replacing the water cooling plate. When the calorific value of the heat source changes, the liquid cooling device according to the present invention only needs to replace the base of the water cooling plate and the heat dissipation fin group without replacing the assembly frame and fasteners. In this way, liquid cooling devices can be used with heat sources of different sizes or different cooling needs.
以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。Detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation mode. The content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and based on the disclosure of this specification With the content, patent scope and drawings, anyone with ordinary knowledge in the art can easily understand the relevant objects and advantages of the present invention. The following examples further illustrate the aspects of the present invention in detail, but do not limit the scope of the present invention in any way.
請參閱圖1至圖3,圖1為根據本發明第一實施例的電子組件之立體圖。圖2為圖1中的電子組件之分解圖。圖3為圖1中的電子組件之剖面示意圖。Please refer to FIGS. 1 to 3 . FIG. 1 is a perspective view of an electronic component according to a first embodiment of the present invention. FIG. 2 is an exploded view of the electronic component in FIG. 1 . FIG. 3 is a schematic cross-sectional view of the electronic component in FIG. 1 .
電子組件10包含一主機板100、一熱源200以及一液冷裝置300。熱源200設置並電性連接於主機板100。熱源200例如為中央處理器或圖形處理器。The
於本實施例中,液冷裝置300例如為水冷頭且包含水冷板305、一組裝架350以及多個緊固件360。水冷板305包含一基座310、一蓋板320、一第一接頭330及一第二接頭340。In this embodiment, the
基座310熱接觸於熱源200。於本實施例中,蓋板320包含一板體321、一第一凸部322以及一第二凸部323。板體321設置於基座310的一側並與基座310共同形成流動空間315。流動空間315用以供如水之冷卻液流動。第一凸部322及第二凸部323從板體321遠離流動空間315的一側凸出。蓋板320包含一入口325以及一出口326。入口325透過流動空間315連通於出口326。入口325貫穿第一凸部322以及板體321。出口326貫穿第二凸部323以及板體321。第一接頭330及第二接頭340分別設置於第一凸部322及第二凸部323而分別連通於入口325以及出口326。The
組裝架350可拆卸地安裝於蓋板320遠離基座310的一側。舉例來說,組裝架350得以透過螺鎖、卡扣、緊配等可拆卸的方式安裝於蓋板320。於本實施例中,組裝架350包含一第一部分351以及一第二部分352。第一部分351以及第二部分352例如為一體成型。第一部分351包含一橫向板353以及一縱向板354。第二部分352包含二橫向板355、356以及一縱向板357。第一部分351的橫向板353與第二部分352的橫向板355、356彼此平行,且第一部分351的縱向板354與第二部分352的縱向板357彼此平行。第一部分351的縱向板354之相對兩側分別連接於第一部分351的橫向板353以及第二部分352的橫向板355。第二部分352的橫向板355位於第一部分351的縱向板354與第二部分352的縱向板357之間。第二部分352的縱向板357之相對兩側分別連接於第二部分352的橫向板355、356。The
於本實施例中,第一部分351的縱向板354包含一第一讓位孔3540,且第二部分352的縱向板357包含一第二讓位孔3570。第一接頭330以及第二接頭340分別位於第一讓位孔3540以及第二讓位孔3570。需注意的是,於其他實施例中,第一部分的縱向板亦可無須包含第一讓位孔3540且第二部分的縱向板亦可無須包含第二讓位孔3570。在這樣的實施例中,第一接頭以及第二接頭亦可分離於組裝架。In this embodiment, the
緊固件360例如為螺絲且固定於組裝架350以及主機板100。於本實施例中,部分的緊固件360固定於第一部分351的橫向板353,且其餘的緊固件360固定於第二部分352的橫向板355。The
於本實施例中,液冷裝置300的水冷板305更包含二第一密封件365。其中一個第一密封件365夾設於第一凸部322遠離板體321的一側以及第一接頭330之間。另一個第一密封件365夾設於第二凸部323遠離板體321的一側以及第二接頭340之間。於其他實施例中,水冷板亦可無須包含第一密封件365。In this embodiment, the
於本實施例中,液冷裝置300的水冷板305更包含二第二密封件370。其中一個第二密封件370夾設於板體321遠離流動空間315的一側以及第一接頭330之間。另一個第二密封件370夾設於板體321遠離流動空間315的一側以及第二接頭340之間。於其他實施例中,水冷板亦可無須包含第二密封件370。In this embodiment, the
於本實施例中,液冷裝置300的水冷板305更包含一第三密封件375。第三密封件375夾設於蓋板320的板體321以及基座310之間並環繞流動空間315。於其他實施例中,水冷板亦可無須包含第三密封件375。In this embodiment, the
於本實施例中,液冷裝置300的水冷板305更包含一散熱鰭片組380。散熱鰭片組380設置於基座310並位於流動空間315中,以增加冷卻液與熱源200之間的熱交換效率。於其他實施例中,液冷裝置亦可無須包含散熱鰭片組380。In this embodiment, the
此外,請參閱圖3及圖4,本實施例中的熱源200具有較高的發熱量而使用體積較大的基座310來容置體積較大的散熱鰭片組380。In addition, please refer to FIG. 3 and FIG. 4 . The
請參閱圖5,圖5為根據本發明第二實施例的電子組件之立體圖。本實施例之電子組件10a包含圖1中的主機板100、熱源200a及液冷裝置300a。本實施例之熱源200a的尺寸較圖1中的熱源200之尺寸大。因此,電子組件10a之液冷裝置300a的組裝架350a更包含一第三部分3500a。第三部分3500a包含一縱向板3501a以及一橫向板3502a。第二部分352的橫向板356介於第二部分352的縱向板357及第三部分3500a的縱向板3501a之間。縱向板3501a的相對兩端分別連接於第二部分352的橫向板356以及第三部分3500a的橫向板3502a。部分的緊固件360a固定於第一部分351的橫向板353,且其餘的緊固件360a固定於第三部分3500a的橫向板3502a。電子組件10a之液冷裝置300a包含圖1至圖4中的水冷板305。也就是說,當熱源的尺寸改變時,根據本發明的液冷裝置僅需替換組裝架及緊固件而不用替換水冷板。Please refer to FIG. 5 , which is a perspective view of an electronic component according to a second embodiment of the present invention. The
請參閱圖6,圖6為根據本發明第三實施例的液冷裝置的下視圖。本實施例之液冷裝置300b所應用於的熱源(未繪示)的發熱量較圖1中的熱源200之發熱量小。因此,相較於圖1中的液冷裝置300來說,本實施例之液冷裝置300b包含體積較小的基座310b來容置體積較小的散熱鰭片組380b。也就是說,當熱源的發熱量改變時,根據本發明的液冷裝置僅需替換水冷板的基座及散熱鰭片組而不用替換組裝架及緊固件。Please refer to FIG. 6 , which is a bottom view of a liquid cooling device according to a third embodiment of the present invention. The heat source (not shown) used in the liquid cooling device 300b of this embodiment has a smaller calorific value than the
根據上述實施例所揭露之液冷裝置及電子組件,組裝架可拆卸地安裝於蓋板,且緊固件固定於組裝架以及主機板。因此,當熱源的尺寸改變時,根據本發明的液冷裝置僅需替換組裝架及緊固件而不用替換水冷板。當熱源的發熱量改變時,根據本發明的液冷裝置僅需替換水冷板的基座及散熱鰭片組而不用替換組裝架及緊固件。如此一來,液冷裝置便能共用於不同尺寸或不同散熱需求的熱源。According to the liquid cooling device and electronic components disclosed in the above embodiments, the assembly frame is detachably installed on the cover, and the fasteners are fixed on the assembly frame and the motherboard. Therefore, when the size of the heat source changes, the liquid cooling device according to the present invention only needs to replace the assembly frame and fasteners without replacing the water cooling plate. When the calorific value of the heat source changes, the liquid cooling device according to the present invention only needs to replace the base of the water cooling plate and the heat dissipation fin group without replacing the assembly frame and fasteners. In this way, liquid cooling devices can be used with heat sources of different sizes or different cooling needs.
在本發明的一實施例中,本發明之液冷裝置及電子組件係可應用於伺服器,該伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(Edge Computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present invention, the liquid cooling device and electronic components of the present invention can be applied to a server, and the server can be used for artificial intelligence (Artificial Intelligence, referred to as AI) computing, edge computing (Edge Computing), and also It can be used as a 5G server, cloud server or Internet of Vehicles server.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.
10:電子組件
100:主機板
200:熱源
300:液冷裝置
305:水冷板
310:基座
315:流動空間
320:蓋板
321:板體
322:第一凸部
323:第二凸部
325:入口
326:出口
330:第一接頭
340:第二接頭
350:組裝架
351:第一部分
352:第二部分
353:橫向板
354:縱向板
3540:第一讓位孔
355, 356:橫向板
357:縱向板
3570:第二讓位孔
360:緊固件
365:第一密封件
370:第二密封件
375:第三密封件
380:散熱鰭片組
10a:電子組件
200a:熱源
300a:液冷裝置
350a:組裝架
3500a:第三部分
3501a:縱向板
3502a:橫向板
360a:緊固件
300b:液冷裝置
310b:基座
380b:散熱鰭片組
10: Electronic components
100: Motherboard
200:Heat source
300:Liquid cooling device
305:Water cooling plate
310:Pedestal
315:Flow space
320:Cover
321:Plate body
322: First convex part
323:Second convex part
325: Entrance
326:Export
330:First joint
340:Second connector
350:Assembly rack
351:Part One
352:Part 2
353:Transverse plate
354:Longitudinal plate
3540: The
圖1為根據本發明第一實施例的電子組件之立體圖。 圖2為圖1中的電子組件之分解圖。 圖3為圖1中的電子組件之剖面示意圖。 圖4為圖1中的電子組件之液冷裝置的下視圖。 圖5為根據本發明第二實施例的電子組件之立體圖。 圖6為根據本發明第三實施例的液冷裝置的下視圖。 FIG. 1 is a perspective view of an electronic component according to a first embodiment of the present invention. FIG. 2 is an exploded view of the electronic component in FIG. 1 . FIG. 3 is a schematic cross-sectional view of the electronic component in FIG. 1 . FIG. 4 is a bottom view of the liquid cooling device of the electronic component in FIG. 1 . FIG. 5 is a perspective view of an electronic component according to a second embodiment of the present invention. Figure 6 is a bottom view of a liquid cooling device according to a third embodiment of the present invention.
10:電子組件 10: Electronic components
100:主機板 100: Motherboard
200:熱源 200:Heat source
300:液冷裝置 300:Liquid cooling device
305:水冷板 305:Water cooling plate
350:組裝架 350:Assembly rack
351:第一部分 351:Part One
352:第二部分 352:Part 2
353:橫向板 353:Transverse plate
354:縱向板 354:Longitudinal plate
355,356:橫向板 355,356: Horizontal plate
357:縱向板 357:Longitudinal plate
360:緊固件 360:Fasteners
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW111121180A TWI813324B (en) | 2022-06-08 | 2022-06-08 | Liquid cooling device and electronic assembly |
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TW202349171A TW202349171A (en) | 2023-12-16 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM571514U (en) * | 2018-12-11 | Water-cooled head buckle structure | ||
TWM592638U (en) * | 2019-11-21 | 2020-03-21 | 大陸商深圳興奇宏科技有限公司 | Water-cooling head device fastening structure |
US20200340767A1 (en) * | 2019-04-25 | 2020-10-29 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US20210216121A1 (en) * | 2021-03-26 | 2021-07-15 | Intel Corporation | Technologies for liquid cooling interfaces |
US20210378106A1 (en) * | 2020-05-29 | 2021-12-02 | Google Llc | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies |
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- 2022-06-08 TW TW111121180A patent/TWI813324B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM571514U (en) * | 2018-12-11 | Water-cooled head buckle structure | ||
US20200340767A1 (en) * | 2019-04-25 | 2020-10-29 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
TWM592638U (en) * | 2019-11-21 | 2020-03-21 | 大陸商深圳興奇宏科技有限公司 | Water-cooling head device fastening structure |
US20210378106A1 (en) * | 2020-05-29 | 2021-12-02 | Google Llc | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies |
US20210216121A1 (en) * | 2021-03-26 | 2021-07-15 | Intel Corporation | Technologies for liquid cooling interfaces |
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