TWI813324B - Liquid cooling device and electronic assembly - Google Patents

Abstract

This disclosure provides a liquid cooling device and an electronic assembly. Liquid cooling device is configured to be fixed on a motherboard and in thermal contact with a heat source. Liquid cooling device includes a base, a cover, a first joint, a second joint, a mount and fasteners. Base is configured to be in thermal contact with heat source. Cover is disposed on a side of the base to form a flowing space with the base. Cover includes inlet and outlet. Inlet is connected to outlet via flowing space. First and second joints are disposed on cover and respectively connected to inlet and outlet. Mount is detachably mounted on a side of cover located away from base. Fasteners are fixed to mount and motherboard.

Description

Liquid cooling devices and electronic components

The present invention relates to a liquid cooling device and an electronic component, and in particular to a liquid cooling device and an electronic component including an assembly rack.

With the rapid development of electronic component technology, the heat generated by the heat source installed on the motherboard in the server continues to increase. In view of this, manufacturers often use water-cooling devices to dissipate heat sources in servers to effectively dissipate the heat generated by the heat sources through water with high specific heat. In such a situation, the heat emitted by the heat source is usually effectively absorbed through a water block that is in thermal contact with the heat source. Such a water block usually consists of a base, a cover, and a number of screws. The cover plate is arranged on one side of the base and forms a flow space together with the base. The screws secure the cover to the motherboard.

However, in a traditional water block, the screws are directly fixed to the cover in a non-detachable manner. Therefore, in order to install the water-cooling head on heat sources of different sizes or with different heat dissipation requirements, it is necessary to prepare multiple molds to manufacture water-cooling heads of different specifications. In other words, traditional water blocks have the problem of being difficult to share with heat sources of different sizes or with different heat dissipation requirements.

The present invention provides a liquid cooling device and an electronic component, so that the liquid cooling device can be used for heat sources of different sizes or different heat dissipation requirements.

A liquid cooling device disclosed in one embodiment of the present invention is used to be fixed on a motherboard and in thermal contact with a heat source. The liquid cooling device includes a base, a cover, a first connector, a second connector, an assembly frame and a plurality of fasteners. The base is used for thermal contact with the heat source. The cover plate is arranged on one side of the base and forms a flow space together with the base. The cover includes an inlet and an outlet. The entrance is connected to the exit through the flow space. The first joint and the second joint are provided on the cover plate and communicate with the inlet and the outlet respectively. The assembly frame is detachably installed on the side of the cover away from the base. The fastener is fixed on the assembly frame and used to fix it on the motherboard.

An electronic component disclosed in another embodiment of the present invention includes a motherboard, a heat source and a liquid cooling device. The heat source is set and electrically connected to the motherboard. The liquid cooling device includes a base, a cover, a first connector, a second connector, an assembly frame and a plurality of fasteners. The base is in thermal contact with the heat source. The cover plate is arranged on one side of the base and forms a flow space together with the base. The cover includes an inlet and an outlet. The entrance is connected to the exit through the flow space. A first joint and a second joint are provided on the cover plate and connected to the inlet and the outlet respectively. The assembly frame is detachably installed on the side of the cover away from the base. The fasteners are fixed on the assembly frame and the motherboard.

According to the liquid cooling device and electronic components disclosed in the above embodiments, the assembly frame is detachably installed on the cover, and the fasteners are fixed on the assembly frame and the motherboard. Therefore, when the size of the heat source changes, the liquid cooling device according to the present invention only needs to replace the assembly frame and fasteners without replacing the water cooling plate. When the calorific value of the heat source changes, the liquid cooling device according to the present invention only needs to replace the base of the water cooling plate and the heat dissipation fin group without replacing the assembly frame and fasteners. In this way, liquid cooling devices can be used with heat sources of different sizes or different cooling needs.

Detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation mode. The content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and based on the disclosure of this specification With the content, patent scope and drawings, anyone with ordinary knowledge in the art can easily understand the relevant objects and advantages of the present invention. The following examples further illustrate the aspects of the present invention in detail, but do not limit the scope of the present invention in any way.

Please refer to FIGS. 1 to 3 . FIG. 1 is a perspective view of an electronic component according to a first embodiment of the present invention. FIG. 2 is an exploded view of the electronic component in FIG. 1 . FIG. 3 is a schematic cross-sectional view of the electronic component in FIG. 1 .

The electronic component 10 includes a motherboard 100 , a heat source 200 and a liquid cooling device 300 . The heat source 200 is provided and electrically connected to the motherboard 100 . The heat source 200 is, for example, a central processing unit or a graphics processor.

In this embodiment, the liquid cooling device 300 is, for example, a water cooling head and includes a water cooling plate 305 , an assembly bracket 350 and a plurality of fasteners 360 . The water cooling plate 305 includes a base 310, a cover 320, a first connector 330 and a second connector 340.

The base 310 is in thermal contact with the heat source 200 . In this embodiment, the cover 320 includes a plate body 321 , a first protrusion 322 and a second protrusion 323 . The plate 321 is disposed on one side of the base 310 and forms a flow space 315 together with the base 310 . The flow space 315 is used for cooling liquid such as water to flow. The first protrusion 322 and the second protrusion 323 protrude from the side of the plate body 321 away from the flow space 315 . The cover 320 includes an inlet 325 and an outlet 326 . The inlet 325 is connected to the outlet 326 through the flow space 315. The inlet 325 penetrates the first protrusion 322 and the plate body 321 . The outlet 326 penetrates the second protrusion 323 and the plate body 321 . The first connector 330 and the second connector 340 are respectively provided on the first protrusion 322 and the second protrusion 323 and communicate with the inlet 325 and the outlet 326 respectively.

The assembly frame 350 is detachably installed on the side of the cover 320 away from the base 310 . For example, the assembly frame 350 can be detachably installed on the cover 320 through screw locks, buckles, tight fitting, etc. In this embodiment, the assembly frame 350 includes a first part 351 and a second part 352. The first part 351 and the second part 352 are, for example, integrally formed. The first part 351 includes a transverse plate 353 and a longitudinal plate 354. The second part 352 includes two transverse plates 355, 356 and a longitudinal plate 357. The transverse plates 353 of the first part 351 and the transverse plates 355, 356 of the second part 352 are parallel to each other, and the longitudinal plates 354 of the first part 351 and the longitudinal plates 357 of the second part 352 are parallel to each other. Opposite sides of the longitudinal plate 354 of the first part 351 are respectively connected to the transverse plate 353 of the first part 351 and the transverse plate 355 of the second part 352. The transverse plate 355 of the second part 352 is located between the longitudinal plate 354 of the first part 351 and the longitudinal plate 357 of the second part 352 . Opposite sides of the longitudinal plate 357 of the second part 352 are connected to the transverse plates 355 and 356 of the second part 352 respectively.

In this embodiment, the longitudinal plate 354 of the first part 351 includes a first relief hole 3540, and the longitudinal plate 357 of the second part 352 includes a second relief hole 3570. The first connector 330 and the second connector 340 are respectively located in the first relief hole 3540 and the second relief hole 3570. It should be noted that in other embodiments, the longitudinal plate of the first part may not include the first relief hole 3540 and the longitudinal plate of the second part may not include the second relief hole 3570 . In such an embodiment, the first connector and the second connector can also be separated from the assembly frame.

The fasteners 360 are, for example, screws and are fixed to the assembly frame 350 and the motherboard 100 . In this embodiment, some of the fasteners 360 are fixed to the transverse plate 353 of the first part 351 , and the remaining fasteners 360 are fixed to the transverse plate 355 of the second part 352 .

In this embodiment, the water cooling plate 305 of the liquid cooling device 300 further includes two first seals 365 . One of the first sealing members 365 is sandwiched between the side of the first protrusion 322 away from the plate body 321 and the first joint 330 . Another first seal 365 is sandwiched between the side of the second protrusion 323 away from the plate body 321 and the second joint 340 . In other embodiments, the water-cooling plate does not need to include the first seal 365 .

In this embodiment, the water cooling plate 305 of the liquid cooling device 300 further includes two second seals 370 . One of the second sealing members 370 is sandwiched between the side of the plate body 321 away from the flow space 315 and the first joint 330 . Another second seal 370 is sandwiched between the side of the plate 321 away from the flow space 315 and the second joint 340 . In other embodiments, the water-cooling plate does not need to include the second sealing member 370 .

In this embodiment, the water cooling plate 305 of the liquid cooling device 300 further includes a third seal 375 . The third sealing member 375 is sandwiched between the plate body 321 of the cover plate 320 and the base 310 and surrounds the flow space 315 . In other embodiments, the water-cooling plate does not need to include the third seal 375 .

In this embodiment, the water cooling plate 305 of the liquid cooling device 300 further includes a heat dissipation fin set 380 . The heat dissipation fin set 380 is disposed on the base 310 and located in the flow space 315 to increase the heat exchange efficiency between the coolant and the heat source 200 . In other embodiments, the liquid cooling device may not include the heat dissipation fin set 380 .

In addition, please refer to FIG. 3 and FIG. 4 . The heat source 200 in this embodiment has a relatively high calorific value and uses a larger base 310 to accommodate the larger heat dissipation fin set 380 .

Please refer to FIG. 5 , which is a perspective view of an electronic component according to a second embodiment of the present invention. The electronic component 10a of this embodiment includes the motherboard 100, the heat source 200a and the liquid cooling device 300a in FIG. 1 . The size of the heat source 200a of this embodiment is larger than the size of the heat source 200 in FIG. 1 . Therefore, the assembly frame 350a of the liquid cooling device 300a of the electronic component 10a further includes a third part 3500a. The third part 3500a includes a longitudinal plate 3501a and a transverse plate 3502a. The transverse plate 356 of the second portion 352 is interposed between the longitudinal plate 357 of the second portion 352 and the longitudinal plate 3501a of the third portion 3500a. Opposite ends of the longitudinal plate 3501a are respectively connected to the transverse plate 356 of the second part 352 and the transverse plate 3502a of the third part 3500a. Part of the fastener 360a is secured to the transverse plate 353 of the first part 351, and the remainder of the fastener 360a is secured to the transverse plate 3502a of the third part 3500a. The liquid cooling device 300a of the electronic component 10a includes the water cooling plate 305 in FIGS. 1 to 4 . That is to say, when the size of the heat source changes, the liquid cooling device according to the present invention only needs to replace the assembly frame and fasteners without replacing the water cooling plate.

Please refer to FIG. 6 , which is a bottom view of a liquid cooling device according to a third embodiment of the present invention. The heat source (not shown) used in the liquid cooling device 300b of this embodiment has a smaller calorific value than the heat source 200 in FIG. 1 . Therefore, compared with the liquid cooling device 300 in FIG. 1 , the liquid cooling device 300b of this embodiment includes a smaller base 310b to accommodate the smaller heat dissipation fin set 380b. That is to say, when the calorific value of the heat source changes, the liquid cooling device according to the present invention only needs to replace the base of the water cooling plate and the heat dissipation fin group without replacing the assembly frame and fasteners.

According to the liquid cooling device and electronic components disclosed in the above embodiments, the assembly frame is detachably installed on the cover, and the fasteners are fixed on the assembly frame and the motherboard. Therefore, when the size of the heat source changes, the liquid cooling device according to the present invention only needs to replace the assembly frame and fasteners without replacing the water cooling plate. When the calorific value of the heat source changes, the liquid cooling device according to the present invention only needs to replace the base of the water cooling plate and the heat dissipation fin group without replacing the assembly frame and fasteners. In this way, liquid cooling devices can be used with heat sources of different sizes or different cooling needs.

In an embodiment of the present invention, the liquid cooling device and electronic components of the present invention can be applied to a server, and the server can be used for artificial intelligence (Artificial Intelligence, referred to as AI) computing, edge computing (Edge Computing), and also It can be used as a 5G server, cloud server or Internet of Vehicles server.

Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.

10: Electronic components 100: Motherboard 200:Heat source 300:Liquid cooling device 305:Water cooling plate 310:Pedestal 315:Flow space 320:Cover 321:Plate body 322: First convex part 323:Second convex part 325: Entrance 326:Export 330:First joint 340:Second connector 350:Assembly rack 351:Part One 352:Part 2 353:Transverse plate 354:Longitudinal plate 3540: The first relief hole 355, 356: Transverse plate 357:Longitudinal plate 3570: Second relief hole 360:Fasteners 365:First seal 370: Second seal 375:Third seal 380: Cooling fin set 10a: Electronic components 200a:Heat source 300a: Liquid cooling device 350a:Assembly rack 3500a:Part 3 3501a: Longitudinal plate 3502a: Transverse plate 360a: Fasteners 300b: Liquid cooling device 310b: base 380b: Cooling fin set

FIG. 1 is a perspective view of an electronic component according to a first embodiment of the present invention. FIG. 2 is an exploded view of the electronic component in FIG. 1 . FIG. 3 is a schematic cross-sectional view of the electronic component in FIG. 1 . FIG. 4 is a bottom view of the liquid cooling device of the electronic component in FIG. 1 . FIG. 5 is a perspective view of an electronic component according to a second embodiment of the present invention. Figure 6 is a bottom view of a liquid cooling device according to a third embodiment of the present invention.

10: Electronic components

100: Motherboard

200:Heat source

300:Liquid cooling device

305:Water cooling plate

350:Assembly rack

351:Part One

352:Part 2

353:Transverse plate

354:Longitudinal plate

355,356: Horizontal plate

357:Longitudinal plate

360:Fasteners

Claims (10)

A liquid cooling device used to be fixed on a motherboard and thermally contacted with a heat source. The liquid cooling device includes: a base used for thermal contact with the heat source; a cover plate disposed on one side of the base. Together with the base, a flow space is formed. The cover plate includes an inlet and an outlet. The inlet is connected to the outlet through the flow space. A first joint and a second joint are provided on the cover plate and connected to the outlet respectively. The inlet and the outlet; an assembly frame, detachably installed on the side of the cover away from the base, the assembly frame includes a first part and a second part, the first part includes a transverse plate and a longitudinal plate , the second part includes two transverse plates and a longitudinal plate, the transverse plates of the first part are parallel to the two transverse plates of the second part, and the longitudinal plates of the first part are parallel to the second part. A longitudinal plate; and a plurality of fasteners fixed to the assembly frame and used to fix the motherboard. The liquid cooling device of claim 1, wherein the assembly frame includes a first relief hole and a second relief hole, and the first connector and the second connector are respectively located at the first relief hole and the third relief hole. Two giving holes. The liquid cooling device of claim 1, wherein the assembly frame includes a first part and a second part, the first part and the second part are integrally formed, part of the fasteners are fixed to the first part, and the rest The fasteners are fixed on the second part. The liquid cooling device according to claim 1, wherein the cover plate includes a plate body, a first convex part and a second convex part, the plate body is disposed on one side of the base and is formed together with the base. The flow space, the first convex part and the second convex part protrude from the side of the plate body away from the flow space, the inlet of the cover plate penetrates the first convex part and the plate body, and the cover plate The outlet penetrates the second protruding part and the plate body, and the first joint and the second joint are respectively provided on the first protruding part and the second protruding part and communicate with the inlet and the outlet respectively. The liquid cooling device according to claim 4, further comprising two first seals, one of which is sandwiched between the side of the first protrusion away from the plate body and the first joint, and the other of the first seals. A first sealing member is sandwiched between the side of the second protrusion away from the plate body and the second joint. The liquid cooling device of claim 5, further comprising two second seals, one of which is sandwiched between the side of the plate away from the flow space and the first joint, and the other of which is sandwiched between the side of the plate away from the flow space and the first joint. The second sealing member is sandwiched between the side of the plate away from the flow space and the second joint. The liquid cooling device of claim 6 further includes a third sealing member, the third sealing member is sandwiched between the cover plate and the base and surrounds the flow space. The liquid cooling device of claim 1 further includes a heat dissipation fin set, the heat dissipation fin set is disposed on the base and located in the flow space. An electronic component includes: a motherboard; A heat source is disposed and electrically connected to the motherboard; and a liquid cooling device includes a base that is in thermal contact with the heat source; a cover plate is disposed on one side of the base and together with the base forms a A flow space, the cover plate includes an inlet and an outlet, the inlet is connected to the outlet through the flow space; a first joint and a second joint, are provided on the cover plate and are connected to the inlet and the outlet respectively; a The assembly frame is detachably installed on the side of the cover away from the base. The assembly frame includes a first part and a second part. The first part includes a transverse plate and a longitudinal plate. The second part includes two a transverse plate and a longitudinal plate, the transverse plate of the first part is parallel to the two transverse plates of the second part, and the longitudinal plate of the first part is parallel to the longitudinal plate of the second part; and a plurality of tight Firmware is fixed on the assembly frame and the motherboard. The electronic component of claim 9, wherein the assembly frame includes a first relief hole and a second relief hole, and the first connector and the second connector are respectively located in the first relief hole and the second relief hole. Make way for the hole.

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