TWI819791B - Probe head, probe assembly and spring-type probe structure composed of - Google Patents
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- 239000000523 sample Substances 0.000 title claims abstract description 134
- 238000003032 molecular docking Methods 0.000 claims abstract description 53
- 238000012360 testing method Methods 0.000 claims abstract description 29
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 230000004308 accommodation Effects 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 230000026676 system process Effects 0.000 claims description 9
- 239000010948 rhodium Substances 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000011572 manganese Substances 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- -1 called a bump Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
一種探針頭、探針組件及所組成的彈簧式探針結構,該探針頭包括相連的至少一接觸部及對接部,該探針組件由該探針頭與一管件組裝而成,該接觸部位於該對接部一端,該接觸部用於與被測物接觸;該對接部周邊具有呈多邊形或圓形的可變形部,該可變形部於軸向方向分佈著至少一對接區,該對接區徑向尺寸小於該可變形部的徑向尺寸;該管件一端具有至少一個凸部,組裝時該凸部設置於相對應的該對接區內,該可變形部受外力施壓得變形且形成變形部包覆該凸部,使該管件與該探針頭無法分離,藉此本發明探針組件能牢固地對接,且在測試時具有較高電流傳輸效果及低阻值穩定性。A probe head, a probe assembly and a spring probe structure thereof. The probe head includes at least one connected contact part and a docking part. The probe assembly is assembled from the probe head and a pipe fitting. The contact part is located at one end of the butt part, and the contact part is used to contact the object to be measured; the butt part has a polygonal or circular deformable part around its periphery, and the deformable part has at least butt areas distributed in the axial direction, and the The radial size of the docking area is smaller than the radial size of the deformable part; one end of the pipe has at least one convex part, and the convex part is disposed in the corresponding docking area during assembly, and the deformable part is deformed by external force and The deformation part is formed to cover the convex part, so that the pipe and the probe head cannot be separated, so that the probe assembly of the present invention can be firmly connected, and has high current transmission effect and low resistance stability during testing.
Description
本發明為一種用於電性測試的探針之技術領域,尤其指一種組裝後的牢固性佳且具較高電流傳輸的探針頭及其探針組件。The present invention is in the technical field of probes for electrical testing, and in particular, to an assembled probe head with good stability and high current transmission and its probe assembly.
晶圓經半導體製程完成後,需要透過電性接觸測試訊號傳輸是否能正常操作或運算,以確定眾多之晶粒的品質。一般而言,要測試晶粒線路的電性連接是否確實,或者是訊號傳輸是否有問題,通常利用探針作為測試裝置與待測晶片之間的測試介面,藉由訊號傳輸以及電性訊號分析,獲得待測晶粒的測試結果。After the wafer is completed through the semiconductor process, it is necessary to test whether the signal transmission can operate or operate normally through electrical contact to determine the quality of the numerous chips. Generally speaking, to test whether the electrical connection of the chip circuit is reliable or whether there is a problem with the signal transmission, probes are usually used as the test interface between the test device and the chip under test, through signal transmission and electrical signal analysis. , to obtain the test results of the grain to be tested.
在某些應用中,探針裝置在測試時並非在本質上平面的結構執行,例如接觸墊,而是在三維接觸結構上,三維接觸結構的形狀為導體材料的球,稱為凸塊,或金屬柱(特別是銅),稱為凸柱,其突出自待測物的一表面。而運用於上述的測試作業中,較優選的方案是使用一彈簧式探針。In some applications, the probe device performs testing not on an essentially planar structure, such as a contact pad, but on a three-dimensional contact structure in the shape of a ball of conductive material, called a bump, or Metal pillars (especially copper), called bosses, protrude from a surface of the object to be tested. When applied to the above-mentioned testing operations, a more preferred solution is to use a spring-loaded probe.
如圖1所示,為習用彈簧式探針的示意圖。該彈簧式探針是於一長管狀的殼體90兩端分別延伸出一上頂針91及一下頂針92,該上頂針91及該下頂針92雖能短距離移動但無法脫離該殼體90,該殼體90 內另設有一彈簧93,該彈簧93兩端分別與該上頂針91及下頂針92接觸,使接觸時具有緩衝的彈性,在測試時該上頂針91與探針測試裝置的電路相接觸,該下頂針92則與待測物接觸,該待測物如晶圓中分佈的晶粒。隨著晶圓晶粒的尺寸及愈來愈小,此類該彈簧式探針已不符合要求。As shown in Figure 1, it is a schematic diagram of a conventional spring-type probe. The spring-type probe has an
探針是測試作業中負責電性接觸的主要元件,隨著晶圓中分佈之晶粒數目愈來愈多,相鄰晶粒間隙的不斷縮小,探針尺寸也被不斷地要求縮小,有些探針已利用微機電系統製程形成所需的探針頭形狀,以滿足所需之要求,但微小探針頭須再結合金屬管件、彈簧、頂針等結構,才能形成一完整的彈簧式探針,隨著探針頭尺寸微小化,也讓加工組裝上困難度也提高,因為探針不僅須要具備高電流傳輸性,且在不斷地反覆電性接觸與分離的測試作業中,構件之間的牢固性也必須維持。如何在加工組裝過程中,確保成品具備極佳的牢固性,且在後續測試作業中具備高電流傳輸及低阻值穩定性,則是本發明此次研究設計的重點。Probes are the main components responsible for electrical contact in test operations. As the number of die distributed in the wafer increases, the gap between adjacent die continues to shrink, and the probe size is also constantly required to be reduced. Some probes are The needle has been formed into the required probe head shape using a micro-electromechanical system process to meet the required requirements. However, the tiny probe head must be combined with metal pipe fittings, springs, thimbles and other structures to form a complete spring-type probe. With the miniaturization of the size of the probe head, the difficulty of processing and assembly has also increased, because the probe not only needs to have high current transmission properties, but also needs to be firmly connected between components during the test operation of repeated electrical contact and separation. Sex must also be maintained. How to ensure that the finished product has excellent solidity during the processing and assembly process, and has high current transmission and low resistance stability in subsequent testing operations, is the focus of this research and design of the present invention.
本發明之主要目的是提供一種探針頭及其探針組件,能讓探針頭與管件在組裝上更為方便,且組裝後牢固性佳,在探針長時間運用於測試中也不會有構件分離的情形,且滿足高電流傳輸效果及低阻值穩定性的要求。The main purpose of the present invention is to provide a probe head and its probe assembly, which can make the assembly of the probe head and pipe fittings more convenient, and have good stability after assembly, and will not cause problems when the probe is used for testing for a long time. There are cases of component separation, and it meets the requirements of high current transmission effect and low resistance stability.
為實現前述目的,本發明採用了如下技術方案:In order to achieve the aforementioned objectives, the present invention adopts the following technical solutions:
本發明為一種探針頭,用於電性測試的探針組件中,該探針頭包括相連的至少一接觸部及至少一對接部,該接觸部位於該對接部一端,且隨著遠離該對接部愈遠尺寸愈小,該接觸部用於與被測物接觸;該對接部呈柱狀,且周邊具有呈多邊形或圓形的可變形部,該可變形部於軸向方向分佈著至少一對接區,該對接區的徑向尺寸小於該可變形部的徑向尺寸且形成內凹狀空間。The present invention is a probe head used in a probe assembly for electrical testing. The probe head includes at least one connected contact portion and at least a mating portion. The contact portion is located at one end of the mating portion and moves away from the mating portion. The size of the docking part becomes smaller as it is farther away. This contact part is used to contact the object to be measured. The docking part is columnar and has a polygonal or circular deformable part around it. The deformable part is distributed in the axial direction with at least A butt area, the radial size of the butt area is smaller than the radial size of the deformable part and forms a concave space.
作為較佳優選實施方案之一,該對接部具有500維氏硬度或小於500維氏硬度的硬度。As one of the better preferred embodiments, the butt portion has a hardness of 500 Vickers hardness or less than 500 Vickers hardness.
作為較佳優選實施方案之一,該對接部具有小於或等於該接觸部硬度的硬度。As one of the better preferred embodiments, the butt portion has a hardness less than or equal to the hardness of the contact portion.
作為較佳優選實施方案之一,該對接區的開口尺寸具有10微米或大於10微米。As one of the better preferred embodiments, the opening size of the docking area is 10 microns or greater.
作為較佳優選實施方案之一,該對接部為等於或大於國際退火銅標準的30%的材料。As one of the better preferred embodiments, the butt portion is made of a material equal to or greater than 30% of the international annealed copper standard.
作為較佳優選實施方案之一,該材料包含以下至少一種元素:銅 (Cu)、銀 (Ag)、金 (Au)、碳 (C)、鉑 (Pt)、鈀 (Pd)、鎢 (W)、鋁 (Al)、錫 (Sn)、銠 (Rh)、銥 (Ir)、銦 (In)及釕 (Ru)。As one of the better preferred embodiments, the material contains at least one of the following elements: copper (Cu), silver (Ag), gold (Au), carbon (C), platinum (Pt), palladium (Pd), tungsten (W) ), aluminum (Al), tin (Sn), rhodium (Rh), iridium (Ir), indium (In) and ruthenium (Ru).
作為較佳優選實施方案之一,該探針頭由微機電系統製程所製成堆疊在一起的該接觸部及對接部 。As one of the better preferred embodiments, the probe head is made of a micro-electromechanical system process, with the contact portion and the docking portion stacked together.
作為較佳優選實施方案之一,還包括一第一身部,該第一身部位於該接觸部及該對接部之間。As one of the better preferred embodiments, a first body part is also included, and the first body part is located between the contact part and the butt part.
作為較佳優選實施方案之一,該第一身部是由微機電系統製程所製成,該第一身部為圓形或多邊形的柱狀,該第一身部的徑向尺寸小於該對接部的徑向尺寸。As one of the better preferred embodiments, the first body is made by a micro-electromechanical system process, the first body is circular or polygonal, and the radial size of the first body is smaller than the butt joint. radial size of the part.
作為較佳優選實施方案之一,該探針頭還包括一第二身部,該第二身部位於該對接部遠離該接觸部的一端。As one of the better preferred embodiments, the probe head further includes a second body part, and the second body part is located at an end of the docking part away from the contact part.
作為較佳優選實施方案之一,該第二身部是由微機電系統製程所製成,該第二身部為圓形或多邊形的柱狀,該第二身部的徑向尺寸小於或等於該容置空間的最小徑向尺寸。As one of the better preferred embodiments, the second body is made by a micro-electromechanical system process, the second body is circular or polygonal, and the radial size of the second body is less than or equal to The minimum radial size of the accommodation space.
作為較佳優選實施方案之一,還包括一限位部,該限位部位於該接觸部與該對接部之間,該限位部的徑向尺寸大於或等於該管件的內徑。 As one of the better preferred embodiments, a limiting portion is also included, the limiting portion is located between the contact portion and the butt portion, and the radial size of the limiting portion is greater than or equal to the inner diameter of the pipe.
作為較佳優選實施方案之一,該探針頭還包括一第一身部,該第一身部位於該限位部及該對接部之間,該第一身部的徑向尺寸小於該可變形部的最大徑向尺寸。 As one of the better preferred embodiments, the probe head further includes a first body part, the first body part is located between the limiting part and the butt part, and the radial size of the first body part is smaller than the possible The maximum radial dimension of the deformation part.
本發明為一種探針組件,包括:該探針頭及與其對接的一管件,該管件於內形成一容置空間,一端還具有至少一個軸向方向凸起延伸的凸部,該凸部與該探針頭的該對接區相對應,該可變形部的徑向尺寸大於該管件的外徑,使得該可變形部受外力施壓得變形且形成變形部,由該變形部部份包覆該凸部外周邊表面的至少一部份,使該探針頭與該管件無法分離。 The present invention is a probe assembly, which includes: a probe head and a pipe fitting connected thereto. The pipe member forms a receiving space inside, and has at least one convex portion extending convexly in the axial direction at one end. The convex portion is connected to the probe head. Corresponding to the docking area of the probe head, the radial size of the deformable part is larger than the outer diameter of the pipe, so that the deformable part is deformed by external force and forms a deformed part, which is partially covered by the deformed part At least part of the outer peripheral surface of the protrusion makes it impossible to separate the probe head from the pipe.
作為較佳優選實施方案之一,該對接區寬度等於或大於該凸部寬度,使該凸部設置於該對接區之內。 As one of the better preferred embodiments, the width of the butt area is equal to or greater than the width of the convex portion, so that the convex portion is disposed within the butt area.
作為較佳優選實施方案之一,該可變形部受外力施壓變形時於該凸部所在位置形成至少一個該變形部,該變形部包覆該凸部的外周邊表面至少一部份。 As one of the better preferred embodiments, when the deformable part is deformed by external force, at least one deformation part is formed at the position of the convex part, and the deformation part covers at least part of the outer peripheral surface of the convex part.
作為較佳優選實施方案之一,該變形部數量為數個時,包覆於該凸部不同位置的該變形部面積為相同或不同。 As one of the better preferred embodiments, when the number of the deformation parts is several, the areas of the deformation parts covering different positions of the convex part are the same or different.
作為較佳優選實施方案之一,該凸部具有700微米或小於700微米的長度。 As one of the better preferred embodiments, the convex portion has a length of 700 microns or less.
作為較佳優選實施方案之一,該凸部數量為數個時,兩個相鄰的該凸部之間距離為5微米或大於5微米。 As one of the preferred embodiments, when the number of the protrusions is several, the distance between two adjacent protrusions is 5 microns or greater than 5 microns.
作為較佳優選實施方案之一,該管件於相鄰兩個該凸部之間還形成一擋壁,該擋壁所在位置低於該凸部頂緣,且徑向尺寸小於該可變形部的徑向尺寸。As one of the better preferred embodiments, the pipe also forms a blocking wall between two adjacent convex portions. The blocking wall is located lower than the top edge of the convex portion and has a radial size smaller than that of the deformable portion. Radial dimensions.
本發明為一種彈簧式探針結構,包括:該探針頭及與其該管件;一可移動的頂針,設置於該管件的容置空間內,該頂針尺寸較小的一針部能伸出該管件外,但該頂針可於該管件內移動但無法脫離;一彈性件,為可壓縮彈簧,該彈性件設置於該容置空間內,兩端分別會與該頂針及該探針頭接觸。The present invention is a spring-type probe structure, which includes: a probe head and a pipe fitting; a movable thimble, which is arranged in the accommodation space of the pipe fitting; a smaller needle part of the thimble can extend out of the pipe fitting Outside, the ejector pin can move within the pipe but cannot be detached; an elastic member is a compressible spring. The elastic member is disposed in the accommodation space, and its two ends are in contact with the ejector pin and the probe head respectively.
由以上可知,本發明探針頭及其探針組件,是利用該探針頭所形成的該可變形部與該對接區,配合該管件的凸部,在對接時由該凸部設置於對接區內後,施予外力使該可變形部變形且形成該變形部包覆該凸部,就能達到極佳的牢固性,讓該管件與該探針頭無法分離,以滿足測試時高電流傳輸效果及低阻值穩定性的要求。As can be seen from the above, the probe head and its probe assembly of the present invention utilize the deformable part and the docking area formed by the probe head to match the convex part of the pipe fitting, and the convex part is arranged on the docking part during docking. After being in the zone, external force is applied to deform the deformable part and form the deformable part to cover the convex part, so that excellent firmness can be achieved, so that the pipe fitting and the probe head cannot be separated to meet the high current during testing. Transmission effect and low resistance stability requirements.
下面將結合具體實施例和附圖,對本發明的技術方案進行清楚、完整地描述。需要說明的是,當元件被稱為「安裝於或固定於」另一個元件,意指它可以直接在另一個元件上或者也可以存在居中的元件。當一個元件被認為是「連接」另一個元件,意指它可以是直接連接到另一個元件或者可能同時存在居中元件。在所示出的實施例中,方向表示上、下、左、右、前和後等是相對的,用於解釋本案中不同部件的結構和運動是相對的。當部件處於圖中所示的位置時,這些表示是恰當的。但是,如果元件位置的說明發生變化,那麼認為這些表示也將相應地發生變化。The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments and drawings. It should be noted that when an element is referred to as being "mounted or secured to" another element, it means that it can be directly on the other element or intervening elements may also be present. When an element is said to be "connected" to another element, this means that it can be directly connected to the other element or that intervening elements may also be present. In the illustrated embodiment, directions indicating up, down, left, right, front and back, etc. are relative and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the parts are in the position shown in the figures. However, if the description of a component's location changes, it is assumed that these representations will change accordingly.
除非另有定義,本文所使用的所有技術和科學術語與屬於本發明技術領域的技術人員通常理解的含義相同。本文中所使用的術語只是為了描述具體實施例的目的,不是旨在限制本發明。本文所使用的術語「和/或」包括一個或多個相關的所列項目的任意的和所有的組合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
如圖2及圖3所示,分別為本發明第一實施例的分解圖及立體圖。本發明探針頭及其探針組件,探針組件包括一探針頭10及與其對接的一管件20,該探針頭10包括相連的至少一接觸部11及對接部13,該接觸部11位於該對接部13一端,且隨著遠離該對接部13愈遠尺寸愈小,該接觸部11用於與被測物接觸。該對接部13呈柱狀,周邊為呈多邊形或圓形的可變形部131,該可變形部131於軸向方向分佈著至少一對接區132,該對接區132的徑向尺寸小於該可變形部131的徑向尺寸且形成內凹狀的空間,該對接部13可具有大於或等於國際退火銅標準 (IACS)的30%的電導率材料;該管件20於管內形成一容置空間21,一端還具有至少一個軸向凸起延伸的凸部22,組裝時該凸部22設置於相對應的該對接區132內,該可變形部131受外力施壓形成至少一個變形部133,且該變形部133包覆該凸部22外周邊表面的至少一部份,使該管件20與該探針頭10無法分離,藉此讓本發明探針結構中的探針頭10與該管件20能牢牢地固接在一起,且在測試時能承受較高電流傳輸及低阻值的穩定性。As shown in Figures 2 and 3, they are an exploded view and a perspective view of the first embodiment of the present invention respectively. The probe head and its probe assembly of the present invention include a
如圖4所示,本發明探針組件是應用於一彈簧式探針結構的分解圖,該彈簧式探針包括該探針頭10、該管件20、一彈性件30及一可移動的頂針40。該管件20的該容置空間21供該頂針40置入,並使該頂針40尺寸較小的一針部41能伸出該管件20外,但該頂針40可於該管件20內短距離移動但無法由下方脫離該容置空間21。該彈性件30為一可壓縮彈簧,當該彈性件30設置於該容置空間21內,兩端分別會與該頂針40及該探針頭10接觸。在該探針頭10鉚接於該管件20頂端時,即封閉該管件20且固定整體的型態。測試時由數個該彈簧式探針安裝一測試座(圖中未畫出)上,兩端分別為由該探針頭10與被測試物接觸,該頂針40電性連接於電路板上相對應的線路,以進行所需之測試作業,後續各實施例皆能以相同結構運作,故不再一一說明。As shown in Figure 4, the probe assembly of the present invention is an exploded view of a spring-type probe structure. The spring-type probe includes the
接著就本發明各構件的作一詳細的說明,如圖2及圖3所示:Next, a detailed description of each component of the present invention is given, as shown in Figures 2 and 3:
本發明之探針頭10包括依序堆疊而成的接觸部11及對接部13,是以微機電系統(microelectromechanical systems, MEMS)製程所製造而成,首先是形成該接觸部11,之後於該接觸部11上一體成型形成該對接部13,後續依成型的時間控制該對接部13的軸向尺寸,此製程方式是利用半導體製程中先於基板蝕刻預定圖案後,之後依序沉積對應導電材料,最後去除多餘材料,即形成本發明之探頭針10結構。The
該接觸部11及該對接部13雖皆由導電性佳的材料所構成,但材料並不需完全相同。該接觸部11負責在電性測試時重複與待測物接觸,由可耐磨耗佳及較硬材料所構成,例如為鎳及鎳合金且該鎳合金包含鎳以及選自由以下組成的群組中的至少一種合金元素:鐵 (Fe)、鎢 (W)、銅 (Cu)、硼 (B)、磷 (P)、碳 (C)、鈷 (Co)、銀 (Ag)、錳 (Mn)、鈀 (Pd)及銠 (Rh)。該接觸部11形狀會隨著離該對接部13愈遠尺寸漸漸縮小,形狀可為圓錐狀、四邊型的金字塔狀、或多邊型的立體斜錐狀。該接觸部11的數量在本實施例中僅畫出一個,但並不以此為限亦可為多個,如圖5A及圖5B所示,在圖5B中該接觸部11即為四邊型的金字塔狀。該接觸部11數量為一個時,高度小於525微米,該接觸部11尖端最大徑向尺寸小於25微米,該接觸部11亦可選用具有中磨耗、低阻值的鈀、鈀合金材料,且該鈀合金包含鈀 (Pd)以及選自由以下組成的群組中的至少一種合金元素:鎳 (Ni)、銅 (Cu)、鈷 (Co)、鉬 (Mo)、銀 (Ag)、銦 (In)、錳 (Mn)及碳 (C)。該接觸部11數量為多個時,彼此間隔距離至少為10微米。Although the
該對接部13由等於或大於30%國際退火銅標準(IACS)之導電率的材料所構成,該材料包括以下至少一種元素的材料:銅 (Cu)、銀 (Ag)、金 (Au)、碳 (C)、鉑 (Pt)、鈀 (Pd)、鎢 (W)、鋁 (Al)、錫 (Sn)、銠 (Rh)、銥 (Ir)、銦 (In)及釕 (Ru)。該對接部13具有500維氏硬度或小於500維氏硬度的硬度。該對接部13徑向尺寸小於700微米,高度小於1000微米,用以對接該管件20。本發明主要針對該對接部13進行改良,以利組裝時能與該管件20迅速對接及固定,組裝後具備極佳的牢固性,且增加與管件的接合面積,在測試時,具有高電流傳輸效果及低阻值穩定性表現。該對接部13形狀為柱狀,周邊為呈多邊形或圓形的可變形部131,該可變形部131於軸向方向分佈著至少一對接區132,該對接區132的徑向尺寸小於該可變形部131的徑向尺寸,以形成一內凹的空間,該對接區132的數量及位置是對應於該凸部22,在實施例中該凸部22具有700微米或小於700微米的長度。該對接區132及該凸部22的數量最好達2個以上且位置平均分佈於該對接部13周邊。該凸部22為數個時,兩個相鄰的該凸部22之間距離為5微米或大於5微米。另該對接區132的開口尺寸具有10微米或大於10微米。另外在本實施例中,該對接區132寬度等於或大於該凸部22的寬度,使該凸部22可設置於該對接區132之內。
The
如圖6A所示,組裝對接時,該凸部22設置於該對接區132內,以機械輔助施加外力,例如以機械鉗夾持,讓該可變形部131得以受外力施壓形成至少一個變形部133,且該變形部133為由該可變形部131部份材料延伸包覆該凸部22外周邊表面的至少一部份,讓兩者達到良好的鉚合固定效果。另外該對接部13的硬度小於或等於該接觸部11。如圖6B所示,當然如果機械外力過大,位於該對接區132內的該凸部22也可以變形,使得該變形部133與該凸部22結合後的牢固性更佳。另外在本實施例中,該可變形部131受外力施壓變形時是於每個該凸部22所在位置形成至少兩個該變形部133,至少兩個該變形部133以不同方向包覆該凸部22外圍,且兩個該變形部133之間的最小距離小於該對接區132的開口寬度,例如兩個該變形部133之間的最小距離小於200微米或等於200微米,如圖中所示,位於同一個該凸部22處的兩個變形部133之間並未接觸且存在一段距離,但並不以此為限,若機械施力的外力較大,也能使兩個該變形部133完全對接接觸,此時牢固性更佳。另外該可變形部131受外力施壓變形,也可僅於每個該凸部22所在位置形成一個該變形部133,由該變形部133包覆該凸部22外周邊表面的至少一部份,且遮蔽了該對接區132的開口。As shown in FIG. 6A , during assembly and docking, the protruding
該管件20是供該探針頭10安裝於此,以便於後續組裝成彈簧式探針。為了便於快速定位,該管件20於相鄰兩該凸部22之間還形成一擋壁23,該擋壁23所在位置低於該凸部22頂緣,且徑向尺寸小於該可變形部131的最大徑向尺寸,組裝時當該擋壁23與該可變形部131接觸,該對接部13即無法再被軸向移動,並確保該凸部22位於該接對區132內,有利後續的鉚接固定。The
本發明探針頭10是由以微機電系統(microelectromechanical systems, MEMS)製程所製造而成,軸向尺寸愈短,相對地工序較少,成本較低。但該探針頭10軸向尺寸愈短相對地對組裝的對準及加工的難度也會提高,為此本發明提供下列幾種不同實施例,以解決所述之問題。The
如圖7所示,為本發明第二實施例的分解圖。第二實施例結構類似於第一實施例,不同之處在:該探針頭10a的軸向尺寸增加。在本實施例中,探針組件仍由該探針頭10a及該管件20所構成,但該探針頭10a除了包括該接觸部11、該對接部13外,還包括第一身部14及第二身部15,整個該探針頭10a仍是由是以微機電系統(microelectromechanical systems, MEMS)製程所製造而成,該第一身部14一體成型於該接觸部11與該對接部13之間,該第二身部15一體成型於該對接部13遠離該第一身部14的一端。該第一身部14的形狀可為多邊形或圓形的柱狀,在該對接部13徑向尺寸大於該第一身部14的徑向尺寸,以利該可變形部131被施力變形包覆該凸部22時,不會影響到該第一身部14的外觀。該第二身部15的形狀也可為多邊形或圓形的柱狀,但其徑向尺寸小於或等於該容置空間21的徑向尺寸,避免影響該凸部22對接於該對接區132。上述實施例是藉由增加該第一身部14及該第二身部15以增加該探針頭10的軸向尺寸,有利後續的組裝或對準位置,當然也能自由選擇只增加其中一個,如圖8所示,為本發明第三實施例圖,該探針頭10b僅增加了該第一身部14。如圖9所示,為本發明第四實施例圖,該探針頭10c僅增加了該第二身部15。As shown in Figure 7, it is an exploded view of the second embodiment of the present invention. The structure of the second embodiment is similar to the first embodiment, except that the axial dimension of the
如圖10所示,為本發明第五實施例圖。本實施例該探針頭10d的將該對接部13的軸向尺寸依設計者的需求增加,隨著該對接部13軸向高度增加,相對地該對接部13的該可變形部131高度增加,使鉚合時,軸向的鉚合位置精密度可接受較大的容許誤差,降低鉚合精密度的要求,提高鉚合組裝良率,另外,該可變形部131的面積變大,將形成更多及面積更大的該變形部133包覆該凸部22,可具有更強的䤝合強度以及在測試時,提供更穩定的低阻值表現。As shown in Figure 10, it is a diagram of the fifth embodiment of the present invention. In this embodiment, the axial size of the
如圖11所示,為本發明第六實施例圖。在本實施例中該探針頭10e仍包括該接觸部11、該對接部13、該第一身部14及該第二身部15,但該對接部13的數量設有兩個,兩個對接部13分別位於該第二身部15上下相對位置,因此,其軸向的該可變形部131數量也增加,可降低軸向鉚合精密度要求,提升鉚合組裝良率,且利用不同位置的該可變形部131在受力時能形成數個該變形部 133包覆該凸部22,具有更強的牢固效果 。As shown in Figure 11, it is a diagram of the sixth embodiment of the present invention. In this embodiment, the
綜合以上所述,本發明探針頭因增設該第一身部14、第二身部15,有於與管件20相對接,增加該對接部13數量,有助於獲得更強的牢固性,增加該對接部13的軸向長度,則可接受較大的容許誤差,降低鉚合精密度的要求,且能提高鉚合組裝良率,因此讓探針頭的總長度增加,成本增加,但在組裝的方便性、牢固性皆具有相對的優點,且可提高組裝成品的良率,減少組裝不佳所額外增加的成本,另外在上述實施例中,原則上該對接部13徑向尺寸大於其他構件,藉此在輔助機械施工讓該可變形部131變形時,不影響該第一身部14或第二身部15的外型。Based on the above, the probe head of the present invention is added with the
在上述實施例中該探針頭10與該管件20的對接限位,是由該擋壁23所負責,但並不以此為限。如圖12所示,為本發明第七實施例圖,在本實施例中則由該探針頭10f負責組裝的限位。在本實施例中,該探針頭10f除了由該接觸部11、該對接部13及該第二身部15外,還包括一限位部16,該限位部16位於該接觸部11與該對接部13之間,且該限位部16的徑向尺寸大於或等於該管件20的內徑。該限位部16可為圓形、多邊形之柱狀。在組裝中,該凸部22插入該對接區132內,之後持續移動就會頂制於該限位部16的徑向斷面,暫時確保管件20與該探針頭10f的相對位置,便於後續施予鉚合固定作業。其中該限位部16仍由微機電系統製程所製造而成。
In the above embodiment, the
如圖13,為本發明第八實施例圖。本實施例中是相似於第七實施例。本實施例中該探頭頭10g於該限位部16及該對接部13之間增加該第一身部14,以增加該探針頭10g的軸向尺寸。
As shown in Figure 13, it is a diagram of the eighth embodiment of the present invention. This embodiment is similar to the seventh embodiment. In this embodiment, the
綜合以上所述,本發明用於電性測試的探針組件是利用微機電系統製程製造出形狀特殊且尺寸微小的該探針頭10,再配合於該管件20所具有的數個該凸部22,在兩者對接後得輔助機械施加外力讓該探針頭10之可變形部131變形且形成該變形部133包覆該凸部22,使兩者牢牢地固定在一起,此方式能因構件之間接合牢固緊實,在測試時能承受較高電流傳輸及低阻值的穩定性,滿足探針本身的需求。
Based on the above, the probe assembly for electrical testing of the present invention uses a micro-electromechanical system process to manufacture the
以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施例之範圍。即凡依本發明申請專利範圍所作的均等變化及修飾,皆為本發明之專利範圍所涵蓋。 The above are only preferred embodiments of the present invention and are not intended to limit the scope of the embodiments of the present invention. That is to say, all equivalent changes and modifications made in accordance with the patentable scope of the present invention are covered by the patentable scope of the present invention.
10:探針頭
10a、10b、10c、10d、10e、10f、10g:探針頭
11:接觸部
13:對接部
131:可變形部
132:對接區
133:變形部
14:第一身部
15:第二身部
16:限位部
20:管件
21:容置空間
22:凸部
23:擋壁
30:彈性件
40:頂針
41:針部
90:殼體
91:上頂針
92:下頂針
93:彈簧
10: Probe
圖1為習用彈簧式探針的剖面示意圖。Figure 1 is a schematic cross-sectional view of a conventional spring-type probe.
圖2為本發明第一實施例之分解圖。Figure 2 is an exploded view of the first embodiment of the present invention.
圖3為本發明第一實施例之立體圖。Figure 3 is a perspective view of the first embodiment of the present invention.
圖4為本發明應用於彈簧式探針的分解圖。Figure 4 is an exploded view of the present invention applied to a spring-type probe.
圖5A為本發明探針頭的另一實施例圖。Figure 5A is a diagram of another embodiment of the probe head of the present invention.
圖5B為本發明探針頭的再一實施例圖。Figure 5B is a diagram of yet another embodiment of the probe head of the present invention.
圖6A為本發明第一實施例的剖面放大圖(一)。Figure 6A is an enlarged cross-sectional view (1) of the first embodiment of the present invention.
圖6B為本發明第一實施例的剖面放大圖(二)。Figure 6B is an enlarged cross-sectional view (2) of the first embodiment of the present invention.
圖7為本發明第二實施例的分解圖。Figure 7 is an exploded view of the second embodiment of the present invention.
圖8為本發明第三實施例之探針頭的立體圖。Figure 8 is a perspective view of the probe head according to the third embodiment of the present invention.
圖9為本發明第四實施例之探針頭的立體圖。Figure 9 is a perspective view of the probe head according to the fourth embodiment of the present invention.
圖10為本發明第五實施例之探針頭的立體圖。Figure 10 is a perspective view of the probe head according to the fifth embodiment of the present invention.
圖11為本發明第六實施例之探針頭的立體圖Figure 11 is a perspective view of the probe head according to the sixth embodiment of the present invention.
圖12為本發明第七實施例的分解圖。Figure 12 is an exploded view of the seventh embodiment of the present invention.
圖13為本發明第八實施例的分解圖。Figure 13 is an exploded view of the eighth embodiment of the present invention.
10:探針頭 10: Probe head
11:接觸部 11:Contact Department
13:對接部 13: docking department
131:可變形部 131:Deformable part
132:對接區 132: docking area
20:管件 20:Pipe fittings
21:容置空間 21: Accommodation space
22:凸部 22:convex part
23:擋壁 23: retaining wall
Claims (21)
Priority Applications (1)
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TW111134558A TWI819791B (en) | 2022-09-13 | 2022-09-13 | Probe head, probe assembly and spring-type probe structure composed of |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW111134558A TWI819791B (en) | 2022-09-13 | 2022-09-13 | Probe head, probe assembly and spring-type probe structure composed of |
Publications (2)
Publication Number | Publication Date |
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TWI819791B true TWI819791B (en) | 2023-10-21 |
TW202411658A TW202411658A (en) | 2024-03-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW111134558A TWI819791B (en) | 2022-09-13 | 2022-09-13 | Probe head, probe assembly and spring-type probe structure composed of |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5974662A (en) * | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
TWM317015U (en) * | 2007-01-25 | 2007-08-11 | Global Master Tech Co Ltd | Test probe |
US7587244B2 (en) * | 2004-04-05 | 2009-09-08 | Biotronik Gmbh & Co. Kg | Spring contact element |
TWI626454B (en) * | 2017-11-20 | 2018-06-11 | Probe device and method of manufacturing same |
-
2022
- 2022-09-13 TW TW111134558A patent/TWI819791B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5974662A (en) * | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
US7587244B2 (en) * | 2004-04-05 | 2009-09-08 | Biotronik Gmbh & Co. Kg | Spring contact element |
TWM317015U (en) * | 2007-01-25 | 2007-08-11 | Global Master Tech Co Ltd | Test probe |
TWI626454B (en) * | 2017-11-20 | 2018-06-11 | Probe device and method of manufacturing same |
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