TWI818757B - Yaw and pitch angle automatically adjusting mechanism for wedge error compenation (wec) between wafer edge and mask - Google Patents

Abstract

The invention includes an annular upper frame, an intermediate supporting plate, a base unit, a plurality of suspension support units and a plurality of limiting guide units. The annular upper frame is installed on the middle supporting plate and is provided with a plurality of connecting devices; each connecting device has a horizontal abutment part, a vertical guide part and a plurality of suspension pivot parts. A plurality of suspension support units are installed between the wafer edge carrying unit and the base unit. Each suspension support unit has a single point contact part, a support column, a support crossbar part and two elastic parts; the single point contact part provides The top of the support column abuts the horizontal abutment portion; the support crossbar portion is passed through the support column. The two elastic parts are pivoted between the suspension pivot part and the support crossbar part; the support column is inserted into the base unit. The limiting guide unit is fixed to the base unit, and a roller is provided to abut the vertical guide part. This case has a suspension design that can be adjusted up and down and horizontally, a longitudinal sliding design that can improve the precision of horizontal adjustment, a three-point fine-tuning positioning that has high precision, and an auxiliary fine-tuning that can improve the precision of receiving.

Description

The level and pitch of wedge error compensation between the wafer edge of the exposure machine and the photomask Elevation angle automatic leveling mechanism

The invention relates to an automatic horizontal and pitch angle leveling mechanism for wedge error compensation between the wafer edge and the photomask of an exposure machine. In particular, it relates to a suspension design that can be adjusted up and down and horizontally, and a longitudinal sliding design that can improve the level. The adjustment precision, three-point fine-tuning and positioning precision are high, and the horizontal and pitch angle automatic leveling mechanism with auxiliary fine-tuning can improve the wedge error compensation between the wafer edge and the photomask of the exposure machine.

When the exposure machine performs the exposure operation, it first moves the photomask horizontally to a predetermined position, and then moves a wafer upward (pushed upward by the support base) to contact the photomask. When the edge of the wafer is in contact with the mask, if the mask is slightly tilted, the wafer may not be completely in contact after moving up. At this time, the horizontal (yaw) and pitch (pitch) angles of the wafer will still be slightly slightly. If the error occurs, subsequent angle and position adjustments must be made.

Since both the mask and the wafer are very precise components, when the wafer support is not designed to automatically fine-tune, it will cause errors in the corresponding positions between the wafer and the mask, which will then cause errors in subsequent related processing. , leading to an increase in the defective rate of products.

In view of this, it is necessary to develop technology that can solve the above conventional shortcomings.

The purpose of the present invention is to provide an automatic horizontal and pitch angle leveling mechanism for wedge error compensation between the wafer edge and the photomask of an exposure machine, which has a suspension design that can be adjusted up and down and horizontally, and a longitudinal sliding design that can improve It has the advantages of high precision of horizontal adjustment, high precision of three-point fine-tuning positioning, and auxiliary fine-tuning to improve the precision of undertaking. In particular, the problem that the present invention aims to solve is that when the edge of the wafer is in contact with the photomask, if the photomask is slightly tilted, the wafer may not be completely in contact after moving up. At this time, the level of the wafer There are still some slight errors in the (yaw) and pitch (pitch) angles, and the mask and the wafer are very precise components. When the wafer support is not designed to automatically fine-tune, the gap between the wafer and the mask will be caused. The corresponding position will produce errors, which will cause errors in subsequent related processing, leading to problems such as an increase in the defective rate of products.

The technical means to solve the above problems is to provide an automatic horizontal and pitch angle leveling mechanism for wedge error compensation between the wafer edge and the photomask of the exposure machine, which includes: a wafer edge carrying unit, which includes an annular upper frame , a plurality of connecting columns and an intermediate supporting plate; the annular upper frame has a plurality of connecting devices; each connecting device in the plurality of connecting devices has a horizontal abutment part, a vertical guide part and a plurality of suspension pivot joints the plurality of connecting pillars are evenly distributed around the periphery of the annular upper frame and vertically connect the annular upper frame and the intermediate supporting plate; a base unit is provided under the wafer edge bearing unit, and the base unit is It has a plurality of erection devices; a plurality of suspension support units are supported between the wafer edge bearing unit and the base unit; each suspension support unit in the plurality of suspension support units has a single point contact portion, a A support column, a support crossbar part and two elastic parts; the single point contact part is located at the top of the support column for the support column to push against the horizontal abutment part; the support column has a transverse through hole, and the support crossbar part is passed through the transverse perforation; the two elastic parts are pivoted at one end to the corresponding suspension pivot joint part, and the two elastic parts are respectively The other end is hooked to both ends of the support crossbar; each support column is inserted into the corresponding erection device and can be relatively telescopically adjusted; and a plurality of limiting guide units are located on the Between the wafer edge carrying unit and the base unit; each limit guide unit in the plurality of limit guide units includes a limit post and a roller; the bottom end of each limit post is fixed In the erection device, the roller is rotatably mounted on the top of the limiting column so that the limiting column can abut the vertical guide portion and be relatively moved and adjusted.

The above objects and advantages of the present invention can be easily understood from the following detailed description of selected embodiments and the accompanying drawings.

The present invention is described in detail below with the following examples and drawings:

10: Wafer edge carrying unit

11: Ring-shaped upper frame

12:Connecting column

13: Intermediate supporting plate

20: Base unit

21:Erection device

211:Insert socket

212:Lever

213: Steering source

21A:Lock hole

30: Suspension support unit

31:Single point contact part

32:Support column

321: Lateral perforation

33: Support crossbar part

34:Elastic part

40: Limit guide unit

41:Limiting column

42:Roller

50: Coarse and fine adjustment unit

51: Rough perforation

52: Coarse and fine adjustment holes

53: Coarse and fine adjustment screws

531: Fine-tuning pressed parts

60: Fine adjustment unit

61: Elastic support

611: Buffer tank

612: Buffer spring

613:Support

62: Fine adjustment screw hole

63: Fine adjustment screw

M: connecting device

M1: Horizontal abutment

M2: Vertical guide part

M3: Suspension pivot joint

M31: Suspension longitudinal hole

M32: Suspension transverse hole

M33: Suspension transverse fixing hole

M34: elastic part pivot

Figure 1 is an exploded schematic diagram of the present invention.

Figure 2 is an enlarged schematic diagram of part of the structure of Figure 1.

Figure 3 is a schematic diagram of the partial structure of Figure 1 combined.

Figure 4 is a top view of Figure 3.

Figure 5 is a schematic diagram of the present invention after assembly.

Figure 6 is a plan view of Figure 5 from the first angle.

Figure 7 is a plan view of Figure 5 from the second angle.

Figure 8A is a partial cross-sectional view of Figure 7.

Figure 8B is an operational schematic diagram of part of the structure of Figure 8A.

Figure 9 is an enlarged schematic diagram of part of the structure of Figure 7.

Figure 10 is a schematic view of Figure 9 from other angles.

Figure 11A is a cross-sectional view of the XIA-XIA position in Figure 10.

Figure 11B is a cross-sectional view of the XIB-XIB position in Figure 10.

Figure 12 is a partially exploded schematic diagram of other structures of the present invention.

Figure 13 is a schematic diagram of the combination of Figure 12.

Figure 14 is a cross-sectional view of the XIV-XIV position in Figure 13.

Referring to Figures 1, 2, 3, 4, 5, 6, 7, 8A, 9, 10, 11A and 11B, the present invention is a wafer edge and The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between photomasks includes: a wafer edge carrying unit 10, which includes an annular upper frame 11, a plurality of connecting posts 12 and an intermediate supporting plate 13. The annular upper frame 11 has a plurality of connecting devices M; each connecting device M of the plurality of connecting devices M has a horizontal abutment part M1, a vertical guide part M2 and a plurality of suspension pivot parts M3. The plurality of connecting posts 12 are evenly distributed around the periphery of the annular upper frame 11 and vertically connect the annular upper frame 11 and the middle supporting plate 13 .

A base unit 20 is provided under the wafer edge carrying unit 10 , and the base unit 20 has a plurality of erection devices 21 .

A plurality of suspension support units 30 are supported between the wafer edge carrying unit 10 and the base unit 20 . Each of the plurality of suspension support units 30 has a single point contact part 31 , a support column 32 , a support crossbar part 33 and two elastic parts 34 . The single point contact portion 31 is located at the top of the support column 32 for the support column 32 to push against the horizontal abutment portion M1; the support column 32 has a transverse through hole 321, and the support crossbar portion 33 is passed through the transverse through hole 321. Through holes 321; one end of the two elastic parts 34 is pivoted on the corresponding suspension pivot part M3, and the other ends of the two elastic parts 34 are respectively hooked on the two ends of the support crossbar part 33. Each support column 32 is inserted into the corresponding erection device 21 and can be relatively telescopically adjusted.

A plurality of limiting guide units 40 are provided between the wafer edge carrying unit 10 and the base unit 20 . Each limit guide unit 40 in the plurality of limit guide units 40 includes a limit column 41 and a roller 42; the bottom end of each limit column 41 is fixed to the erection device 21. The roller 42 is rotatably mounted on the top of the limiting column 41 so that the limiting column 41 can abut the vertical guide portion M2 and can be relatively moved and adjusted.

In practice, the annular upper frame 11 is used to carry the wafer.

Referring to Figures 2, 8A, 11A and 11B, each of the plurality of suspension pivot joints M3 includes a suspension longitudinal hole M31, a suspension transverse hole M32, a suspension Hang the horizontal fixing hole M33 and an elastic part pivot M34. The suspension longitudinal hole M31 penetrates the corresponding position of the annular upper frame 11 longitudinally, the suspension transverse hole M32 and the suspension transverse fixing hole M33 transversely penetrates the corresponding position of the annular upper frame 11, and The suspension longitudinal hole M31 is coaxially connected. The elastic part pivot M34 is inserted into the suspension transverse hole M32 and the suspension transverse fixing hole M33, and traverses the suspension longitudinal hole M31.

Thereby, the corresponding end of the elastic part 34 extends into the suspension longitudinal hole M31, is hooked on the elastic part pivot M34, and can slide relative to the elastic part pivot M34.

The elastic part 34 can be a tension spring.

Referring to Figures 3, 8A and 8B, each of the plurality of erection devices 21 includes an insertion hole base 211, a detent 212 and a detent source 213. The insertion hole base 211 has a detent hole 21A. The latch member 212 can perform one of the actions of withdrawing from and extending into the insertion hole base 211 through the latch hole 21A; the latch source 213 is connected to drive the latch member 212.

Thereby, when the braking source 213 controls the actuating member 212 to withdraw from the insertion hole base 211, each support column 32 can be inserted into the corresponding insertion hole base 211, and can be adjusted in relative expansion and contraction. When the height reaches a predetermined height, the actuating member 212 is controlled by the actuating source 213 to extend into the insertion hole base 211, so that the supporting column 32 can be pushed up and fixed.

The driving source 213 can be at least one of an electric cylinder and a hydraulic cylinder.

The single point contact portion 31 can be one of steel balls or beads with structural strength.

The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the photomask of the exposure machine may further include (as shown in Figures 12, 13 and 14): a coarse and fine adjustment unit 50, which includes A coarse through hole 51 , a coarse and fine adjustment hole 52 and a coarse and fine adjustment screw 53 . The coarse through hole 51 is penetrated through the middle supporting plate 13 and is adjacent to the corresponding limiting column 41; the coarse and fine adjustment hole member 52 is erected on the base unit 20 and is coaxial with the coarse through hole 51. The fine adjustment screw 53 has a fine adjustment pressing part 531 (actually a screw head). The coarse fine adjustment screw 53 is used to pass through the coarse through hole 51 and is screwed to the coarse fine adjustment hole piece 52, and the coarse fine adjustment screw 53 is Movable relative to the rough through hole 51 , the finely adjusted pressing part 531 is used to contact the middle supporting plate 13 .

Thereby, when the coarse and fine adjustment screw 53 performs one of the actions of screwing in the coarse and fine adjustment hole member 52 and unscrewing the coarse and fine adjustment hole member 52, the fine adjustment pressing part 531 performs fine adjustment and compression of the intermediate supporting plate 13 and fine adjustment respectively. Loosen one of the coarse and fine adjustment movements of the middle supporting plate 13 .

A fine adjustment unit 60 includes an elastic support member 61 , a fine adjustment screw hole 62 and a fine adjustment screw 63 . The elastic support member 61 is erected on the base unit 20 and is adjacent to the corresponding coarse and fine adjustment hole member 52; the fine and fine adjustment screw holes 62 are longitudinally penetrated through the middle support plate 13 and connected with the elastic support member 61 Coaxially and adjacent to the corresponding support column 32, the fine adjustment screw 63 is used for screw locking and passing through the fine adjustment screw hole 62 to contact the elastic support member 61 and retreat from the elastic support member 61. A kind of action; and one of the fine-tuning actions of fine-tuning to raise the middle supporting plate 13 and fine-tuning to lower the middle supporting plate 13 can be performed respectively.

The elastic support member 61 may include a buffer groove 611, a buffer spring 612 and a support member 613. The buffer groove 611 is erected on the base unit 20, and the buffer spring 612 is located in the buffer groove 611. The support member 613 is supported between the fine adjustment screw 63 and the buffer spring 612 and is located in the buffer groove 611 .

What needs to be explained here is that the relevant industry knows that when the edge of the wafer of the exposure machine (actually the edge of the wafer located on the annular upper frame 11) comes into contact with the photomask, the photomask may not necessarily be level. If there is a slight inclination, the annular upper frame 11 that receives the wafer must automatically adjust the wafer to the photomask until it is in close contact with the photomask. This type of adjustment is commonly known as "Wedge ERROR" in the industry. COMPENATION, referred to as WEC) (well-known technology, will not be described in detail, and will be stated first.).

In this case, for this part, the connecting column 12, the erection device 21, the suspension support unit 30 and the limit guide unit 40 are all correspondingly set into a plurality of (3) groups, and are evenly distributed along the middle supporting plate 13 (Every 120 degrees is a group), and has the following "automatic adjustment" technology:

[a] The suspension design facilitates adjustment: each elastic portion 34 is hooked up and down to the corresponding elastic portion pivot M34 and the support crossbar portion 33 respectively. Furthermore, the annular upper frame 11 can be "supported" and "suspended" like a shock absorber ("automatic" up and down adjustment, that is, pitch angle adjustment, not shown in the figure, but this effect can be achieved. ) function, further, each elastic part 34 can at least slide relatively with the corresponding elastic part pivot M34 ("automatic" horizontal adjustment, that is, horizontal angle adjustment, not shown in the figure, but this effect can be achieved. ).

[b] Longitudinal rolling auxiliary adjustment: The roller 42 on the limiting column 41 abuts the corresponding vertical guide part M2 and can slide relatively, which can improve the precision of the aforementioned suspension positioning (especially is a horizontal adjustment).

[c] Three-point positioning: After the aforementioned adjustments are completed, perform three-point positioning. Refer to Figures 8A, 11A, and 11B. Each of the three points is located at the horizontal abutment M1 of the annular upper frame 11. According to the position of the wafer, the corresponding single-point contact portion 31 is pressed, so that the support column 32 and the insertion hole seat 211 are relatively telescopic and moved to the position, and then the activation source 213 is used to control the extension of the activation member 212. Into the socket 211, you can push the Fixing the support column 32 completes single-point positioning. Of course, since the wafer is clamped and moved according to predetermined coordinates by the robot arm, two-point collinear positioning can be completed first according to the predetermined coordinates. Then, a third point is used for the annular upper frame 11 to contact the wafer, and is adjusted to the same angle as the wafer, and then fixed.

[d] Auxiliary fine adjustment: Through the coarse and fine adjustment unit 50 and the fine fine adjustment unit 60, the intermediate supporting plate 13 is finally assisted in coarse and fine adjustment.

The advantages and effects of the present invention can be summarized as follows:

[1] The suspension design can be adjusted up, down and horizontally. Each elastic part of the present invention is hooked up and down on the corresponding elastic part pivot rod and the support crossbar part. When the annular upper frame receives the wafer, it can produce "supporting" and "suspension" (that is, pitch angle adjustment) functions, and each elastic part can slide relative to the elastic part pivot (the annular upper frame The upper frame can be fine-tuned horizontally corresponding to the wafer, that is, horizontal angle adjustment). Therefore, the suspension design can be adjusted up, down and horizontally.

[2] The vertical sliding design can improve the precision of horizontal adjustment. Through the design that the roller on the limiting column abuts the vertical guide part and can slide relatively, the precision of horizontal adjustment during suspension adjustment can be improved. Therefore, the longitudinal sliding design can improve the precision of horizontal adjustment.

[3] Three-point fine-tuning positioning has high precision. At each of the three points in this case, the horizontal abutment portion of the annular upper frame is used to cooperate with the wafer to press the corresponding single-point contact portion, so that the support column and the insertion hole seat can expand and contract relative to each other. After fine-tuning, it is fixed, thereby improving the accuracy of the ring-shaped upper frame for receiving the wafer. Therefore, the three-point fine-tuning positioning precision is high.

[4] Equipped with auxiliary fine-tuning to improve the precision of undertaking. Through the coarse and fine adjustment unit and the fine fine adjustment unit, the intermediate supporting plate can be assisted in coarse and fine adjustment to improve the precision of the undertaking. Therefore, having auxiliary fine-tuning can improve the precision of undertaking.

The above is only a detailed description of the present invention through preferred embodiments. Any simple modifications and changes made to the embodiments do not deviate from the spirit and scope of the present invention.

10: Wafer edge carrying unit

11: Ring-shaped upper frame

12:Connecting column

13: Intermediate supporting plate

20: Base unit

21:Erection device

213: Steering source

30: Suspension support unit

32:Support column

33: Support crossbar part

40: Limit guide unit

41:Limiting column

42:Roller

60: Fine adjustment unit

63: Fine adjustment screw

M: connecting device

M2: Vertical guide part

M3: Suspension pivot joint

Claims (7)

A horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the photomask of an exposure machine, which includes: a wafer edge bearing unit, which includes an annular upper frame, a plurality of connecting columns and an intermediate bearing board; the annular upper frame has a plurality of connecting devices; each connecting device in the plurality of connecting devices has a horizontal abutment part, a vertical guide part and a plurality of suspension pivot parts; the plurality of connecting columns are evenly spaced Distributed on the periphery of the annular upper frame, and vertically connected to the annular upper frame and the intermediate supporting plate; a base unit is provided under the wafer edge bearing unit, and the base unit has a plurality of erection devices; a plurality of suspensions The support unit is supported between the wafer edge carrying unit and the base unit; each suspension support unit in the plurality of suspension support units has a single point contact part, a support column, and a support crossbar part And two elastic parts; the single-point contact part is located at the top of the support column for the support column to push against the horizontal abutment part; the support column has a transverse through hole, and the support crossbar part is passed through the transverse through hole; One end of the two elastic parts is pivoted on the corresponding suspension pivot part, and the other end of the two elastic parts is hooked on the two ends of the support crossbar part; each support column is inserted into is provided in the corresponding erection device and can be relatively telescopically adjusted; and a plurality of limit guide units is provided between the wafer edge carrying unit and the base unit; each of the plurality of limit guide units is A limit guide unit includes a limit column and a roller; the bottom end of each limit column is fixed on the erection device, and the roller is rotatably installed on the top of the limit column; The limiting column is used to abut the vertical guide part and can be moved and adjusted relative to the vertical guide part. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge of the exposure machine and the photomask as described in claim 1, wherein: each of the plurality of suspension pivot joints is It includes a suspension longitudinal hole, a suspension transverse hole, a suspension transverse fixing hole and an elastic part pivot rod; the suspension longitudinal hole penetrates the corresponding position of the annular upper frame longitudinally; the suspension transverse hole and The suspension transverse fixing holes transversely penetrate the corresponding positions of the annular upper frame and are coaxially connected to the suspension longitudinal holes; and the elastic part pivot rod is inserted into the suspension transverse hole and the suspension transverse fixation. hole, and traverses the suspension longitudinal hole; thereby, the end of the corresponding elastic part extends into the suspension longitudinal hole, and is hooked on the elastic part pivot rod, and can be opposite to the elastic part pivot rod Slide. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge of the exposure machine and the photomask as described in claim 2, wherein the elastic part is a tension spring. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge of the exposure machine and the photomask as described in claim 1, wherein: each of the plurality of erection devices includes an insertion hole base , a detent and a detent source; the insertion hole base has a detent hole; the detent can perform one of the actions of withdrawing from and extending into the insertion hole holder through the detent hole; and The actuating source is connected and used to drive the actuating member; Thereby, when the detent source controls the detent to exit the insertion hole base, each support column can be inserted into the corresponding insertion hole base, and when the relative expansion and contraction is adjusted to a predetermined height, the support column can be retracted to a predetermined height. The actuating element is controlled by the actuating source to extend into the insertion hole base, thereby pushing up and fixing the support column. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge of the exposure machine and the photomask as described in claim 4, wherein: the actuating source is one of an electric cylinder and a hydraulic cylinder; The single point contact part is one of steel balls and beads with structural strength. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge of the exposure machine and the photomask as described in claim 1, which further includes: a coarse and fine adjustment unit, which includes a coarse through hole and a coarse and fine adjustment hole. and a coarse and fine adjustment screw. The coarse through hole is penetrated through the middle supporting plate and adjacent to the corresponding limiting column; the coarse and fine adjustment hole is erected on the base unit and is coaxial with the coarse through hole; The coarse and fine adjustment screw has a fine adjustment pressing part. The coarse and fine adjustment screw is used to pass through the coarse through hole and is screwed to the coarse and fine adjustment hole piece. The coarse and fine adjustment screw can move relative to the coarse through hole. The fine adjustment screw is The parts are used to contact the intermediate support plate; when the coarse and fine adjustment screws perform one of the actions of screwing in the coarse and fine adjustment hole parts and unscrewing the coarse and fine adjustment hole parts, the fine adjustment pressing parts are respectively finely adjusted to suppress the intermediate support. plate, fine-tuning and loosening one of the coarse and fine-adjustment actions of the intermediate supporting plate; and a fine-fine adjustment unit, which includes an elastic support member, a fine-adjustment screw hole and a fine-fine adjustment screw; the elastic support member is erected on the base unit , and adjacent to the corresponding coarse and fine adjustment holes; the fine and fine adjustment screw holes are longitudinally penetrated through the middle bearing plate, coaxial with the elastic support member, and adjacent to the corresponding support column, and the fine and fine adjustment screws are After screwing through the fine adjustment screw hole, push against the elastic support member , one of the actions of retreating from the elastic support member; and one of the fine-tuning actions of fine-tuning to raise the middle supporting plate and fine-tuning to lower the middle supporting plate can be performed respectively. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge of the exposure machine and the photomask as described in claim 6, wherein: the elastic support member includes a buffer groove, a buffer spring and a support member ; The buffer groove is erected on the base unit; the buffer spring is located in the buffer groove; and the support member is supported between the fine adjustment screw and the buffer spring and is located in the buffer groove.

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