TWM637580U - Yaw and pitch angle automatically adjusting mechanism for wedge error compenation (wec) between wafer edge and mask - Google Patents

Abstract

This creation system includes a ring-shaped upper frame, a middle bearing plate, a base unit, multiple suspension support units and multiple limit guide units. The ring-shaped upper frame is set on the middle bearing plate, and a plurality of connection devices are provided; each connection device has a horizontal abutment part, a vertical guide part and a plurality of suspension pivot parts. A plurality of suspension support units are erected between the wafer edge carrying unit and the base unit, each suspension support unit has a single point contact part, a support column, a support bar part and two elastic parts; the single point contact part provides The support column pushes against the horizontal abutment part; the support cross bar part passes through the support column. The two elastic parts are pivotally arranged between the suspension pivotal part and the supporting cross bar part; the supporting column is inserted in the base unit. The position-limiting guide unit is fixed on the base unit, and a roller is set against the vertical guide part. This case has a suspension design for vertical and horizontal adjustments, a vertical sliding design for improved horizontal adjustment precision, three-point fine-tuning for high positioning precision, and auxiliary fine-tuning for high-acceptance precision.

Description

The level and elevation of the wedge error compensation between the wafer edge and the mask of the exposure machine Elevation automatic leveling mechanism

This creation is about an automatic horizontal and pitch angle leveling mechanism for wedge-shaped error compensation between the wafer edge and the mask of an exposure machine, especially a suspension design that can be adjusted up and down and horizontally, and a vertical sliding design that can improve the level Adjustment precision, three-point fine-tuning positioning precision is high, and there is an automatic leveling mechanism for leveling and pitching angle compensation for wedge-shaped error compensation between the edge of the wafer and the mask of the exposure machine with auxiliary fine-tuning to improve the precision of the exposure machine.

When the exposure machine is performing an exposure operation, it first moves the mask horizontally to a predetermined position, and then moves a wafer upward (pushed upward by the support seat) to contact the mask. When the edge of the wafer is in contact with the mask, if the mask is slightly tilted, the wafer may not be completely attached after moving up. At this time, the horizontal (yaw) and pitch (pitch) angles of the wafer are still slightly If there is any error, subsequent angle and position adjustments must be made.

Since both the mask and the wafer are very precise components, when the support seat of the wafer is not designed to be automatically fine-tuned, it will cause errors in the corresponding positions between the wafer and the mask, which in turn will cause errors in subsequent related processing , leading to an increase in the defective rate of the product.

In view of this, must develop the technology that can solve above-mentioned conventional shortcoming.

The purpose of this creation is to provide a horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the mask of the exposure machine. The precision of horizontal adjustment, the positioning precision of three-point fine-tuning are high, and it has the advantages of auxiliary fine-tuning to improve the precision of receiving. In particular, the problem that this creation intends to solve is that when the edge of the wafer is in contact with the mask, if the mask is slightly inclined, the wafer may not be completely close after moving up. At this time, the level of the wafer (yaw) and pitch (pitch) angles still have some slight errors, and the mask and the wafer are very precise components. Errors occur in the corresponding position, which in turn causes errors in subsequent related processing, leading to problems such as an increase in the defective rate of the product.

The technical means to solve the above problems is to provide a horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the mask of the exposure machine, which includes: a wafer edge carrying unit, which includes a ring-shaped upper frame , a plurality of connecting columns and an intermediate bearing plate; the annular upper frame has a plurality of connecting devices; each connecting device in the plurality of connecting devices has a horizontal abutment part, a vertical guide part and a plurality of suspension pivot joints part; the plurality of connection columns are evenly distributed on the periphery of the ring-shaped upper frame, and vertically connect the ring-shaped upper frame and the intermediate support plate; a base unit is arranged under the wafer edge bearing unit, and the base unit is It has a plurality of erecting devices; a plurality of suspension support units are supported between the wafer edge carrying unit and the base unit; each suspension support unit in the plurality of suspension support units has a single point contact part, a A support column, a support bar part and two elastic parts; the single point contact part is located at the top of the support column, for the support column to push against the horizontal abutting part; the support column has a transverse perforation, and the support bar part The two elastic parts are connected to the corresponding suspension pivot joint with one end, and the two elastic parts are respectively connected with The other end is hooked on the two ends of the supporting crossbar; each supporting column is inserted into the corresponding erecting device, and can be adjusted relatively telescopically; and a plurality of limit guide units are arranged on the Between the wafer edge carrying unit and the base unit; each limit guide unit in the plurality of limit guide units includes a limit column and a roller; the bottom end of each limit column is fixed In the erecting device, the roller is rotatably installed on the top of the limiting column, so that the limiting column can abut against the vertical guide and can be adjusted by relative movement.

The above-mentioned purposes and advantages of this creation are not difficult to obtain a deep understanding from the detailed description and accompanying drawings of the following selected embodiments.

This creation is hereafter described in detail with the following embodiments and in conjunction with the drawings:

10: Wafer edge carrying unit

11: Ring upper frame

12: Connecting column

13: Middle bearing plate

20: Base unit

21: erection device

211: insert hole seat

212: Detent

213: braking source

21A: Detent hole

30: Suspension support unit

31: Single point contact part

32: Support column

321: horizontal perforation

33: Support cross bar

34: elastic part

40: Limit guide unit

41: limit column

42: Roller

50: Coarse and fine adjustment unit

51: Coarse perforation

52:Coarse and fine adjustment holes

53: Coarse fine adjustment screw

531: fine-tuning pressed parts

60: fine tuning unit

61: elastic support

611: buffer tank

612: buffer spring

613: support

62: fine adjustment screw hole

63: fine adjustment screw

M: connection device

M1: Horizontal abutment

M2: vertical guide

M3: Suspension pivot joint

M31: Suspension longitudinal hole

M32: horizontal hole for suspension

M33: horizontal fixing hole for suspension

M34: Elastic Pivot

Figure 1 is a schematic diagram of the decomposition of this creation.

Figure 2 is an enlarged schematic view of part of the structure in Figure 1.

Figure 3 is a combined schematic diagram of the partial structures in Figure 1.

Figure 4 is a top view of Figure 3.

Figure 5 is a schematic diagram of the combination of this creation.

Figure 6 is a plan view of the first angle of Figure 5.

Figure 7 is a plan view of the second angle of Figure 5.

Figure 8A is a partial sectional view of Figure 7.

Figure 8B is a schematic diagram of the action of part of the structure in Figure 8A.

Figure 9 is an enlarged schematic view of part of the structure in Figure 7.

Figure 10 is a schematic diagram of other angles of Figure 9.

Figure 11A is a cross-sectional view of XIA-XIA in Figure 10.

Figure 11B is a cross-sectional view of XIB-XIB in Figure 10.

Figure 12 is a schematic diagram of partial decomposition of other structures of this creation.

Fig. 13 is a combined schematic diagram of Fig. 12.

Figure 14 is a cross-sectional view of XIV-XIV in Figure 13.

Referring to Figures 1, 2, 3, 4, 5, 6, 7, 8A, 9, 10, 11A and 11B, this creation is a wafer edge and The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between reticles includes: a wafer edge carrying unit 10 including an annular upper frame 11 , a plurality of connecting columns 12 and a middle support plate 13 . The annular upper frame 11 has a plurality of connecting devices M; each connecting device M in the plurality of connecting devices M has a horizontal abutting part M1, a vertical guiding part M2 and a plurality of suspension pivot parts M3. The plurality of connecting columns 12 are evenly distributed on the periphery of the annular upper frame 11 , and vertically connect the annular upper frame 11 and the middle supporting plate 13 .

A base unit 20 is arranged under the wafer edge carrying unit 10 , and the base unit 20 has a plurality of erecting devices 21 .

A plurality of suspension support units 30 are supported between the wafer edge carrying unit 10 and the base unit 20 . Each suspension support unit 30 of the plurality of suspension support units 30 has a single point contact portion 31 , a support column 32 , a support cross bar portion 33 and two elastic portions 34 . The single-point contact portion 31 is located at the top of the support column 32 for the support column 32 to abut against the horizontal abutting portion M1; the support column 32 has a transverse perforation 321, and the support bar portion 33 is passed through the horizontal direction Perforation 321; the two elastic parts 34 are all pivotally arranged on the corresponding suspension pivot joint M3 with one end, and the two elastic parts 34 are respectively hooked on the other end with their other ends. Support the two ends of the cross bar portion 33 . Each support column 32 is inserted into the corresponding erection device 21 and can be adjusted relatively telescopically.

A plurality of limit guide units 40 are arranged between the wafer edge carrying unit 10 and the base unit 20 . Each limit guide unit 40 in the plurality of limit guide units 40 includes a limit post 41 and a roller 42; the bottom end of each limit post 41 is fixed on the erection device 21, the The roller 42 is rotatably mounted on the top of the limiting column 41 ; for the limiting column 41 to abut against the vertical guide part M2 , and can be adjusted by relative movement.

In practice, the ring-shaped upper frame 11 is used to carry wafers.

Referring to Figures 2, 8A, 11A and 11B, each suspension pivot M3 in the plurality of suspension pivots M3 includes a suspension longitudinal hole M31, a suspension transverse hole M32, a suspension Hang the horizontal fixing hole M33 and an elastic pivot M34. The suspension longitudinal hole M31 runs through the corresponding position of the annular upper frame 11 longitudinally, the suspension transverse hole M32 and the suspension transverse fixing hole M33 respectively transversely penetrates the corresponding position of the annular upper frame 11, and The suspension longitudinal hole M31 is coaxially connected. The pivot rod M34 of the elastic part is inserted into the suspension transverse hole M32 and the suspension transverse fixing hole M33, and traverses the suspension longitudinal hole M31.

Thereby, the end of the corresponding elastic portion 34 extends into the suspension longitudinal hole M31, is hooked on the elastic portion pivot M34, and can slide relative to the elastic portion pivot M34.

The elastic portion 34 can be a tension spring.

Referring to Figures 3, 8A and 8B, each erection device 21 of the plurality of erection devices 21 includes an insertion hole seat 211 , a detent 212 and a detent source 213 . The insertion hole seat 211 has a locking hole 21A. The detent 212 can pass through the detent hole 21A to perform one of the actions of withdrawing or extending into the insertion hole 211 ; the detent source 213 is connected to drive the detent 212 to move.

Thereby, when the detent source 213 controls the detent 212 to withdraw from the insertion hole seat 211, each support column 32 can be inserted into the corresponding insertion hole seat 211, and when relatively telescopically adjusted To a predetermined height, control the triggering member 212 to extend into the insertion hole seat 211 through the triggering source 213, so as to push and fix the support column 32.

The braking source 213 can be at least one of an electric cylinder and a hydraulic cylinder.

The single-point contact portion 31 can be one of steel balls and balls with structural strength.

The horizontal and pitch angle automatic leveling mechanism for wedge-shaped error compensation between the wafer edge of the exposure machine and the mask can further include (as shown in the 12th, 13th and 14th figures): a coarse and fine adjustment unit 50, which includes A coarse perforation 51 , a coarse and fine adjustment hole 52 and a coarse and fine adjustment screw 53 . The coarse perforation 51 is set through the middle bearing plate 13 and is adjacent to the corresponding limit post 41; the coarse and fine adjustment hole 52 is erected on the base unit 20 and is coaxial with the coarse perforation 51. The fine-tuning screw 53 has a fine-tuning pressing part 531 (actually a screw head), and the coarse and fine-tuning screw 53 is used to pass through the coarse perforation 51 and screw-locked on the coarse and fine-tuning hole 52, and the coarse and fine-tuning screw 53 is The fine-tuning pressed part 531 can be moved relative to the coarse perforation 51 , and is used to touch the middle support plate 13 .

In this way, when the coarse and fine adjustment screw 53 is screwed into the coarse and fine adjustment hole 52 or unscrewed from the coarse and fine adjustment hole 52, the fine adjustment pressing part 531 is respectively fine-tuned to press the intermediate support plate 13, fine-tuned Loosen one of the coarse and fine adjustment actions of the middle bearing plate 13 .

A fine adjustment unit 60 includes an elastic support member 61 , a fine adjustment screw hole 62 and a fine adjustment screw 63 . The elastic supporting member 61 is erected on the base unit 20 and adjacent to the corresponding coarse and fine adjustment hole member 52; Coaxial, and adjacent to the corresponding support column 32, the fine adjustment screw 63 is used for screw locking and passing through the fine adjustment screw hole 62, to touch the elastic support 61 and withdraw from the elastic support 61. one of the actions ; And can carry out one of fine-tuning actions of fine-tuning to prop up the intermediate bearing plate 13 and fine-tuning to lower the intermediate bearing plate 13 respectively.

The elastic support member 61 may include a buffer groove 611 , a buffer spring 612 and a support member 613 . The buffer groove 611 is erected on the base unit 20, the buffer spring 612 is located in the buffer groove 611, the support member 613 is supported between the fine adjustment screw 63 and the buffer spring 612, and is located in the buffer Inside the groove 611.

The part to be explained here is that, as known in the relevant industry, when the edge of the wafer of the exposure machine (actually the edge of the wafer located on the ring-shaped upper frame 11) contacts the photomask, the photomask may not be horizontal because the photomask is not necessarily horizontal. If there is a slight inclination, the ring-shaped upper frame 11 that accepts the wafer must automatically adjust the wafer to match the mask so that it can be closely attached to the mask. This type of adjustment is commonly called "wedge error compensation" (WEDGE ERROR) in the industry. COMPENATION (abbreviated as WEC) (well-known technology, without repeating details, together first stated.).

In this case, for this part, the connecting column 12, the erecting device 21, the suspension support unit 30 and the position-limiting guide unit 40 are all correspondingly arranged in plural (3) groups, and are evenly distributed along the intermediate bearing plate 13 (Every 120 degrees is a group), and then has the following "automatic adjustment" technology:

[a] Suspension design is convenient for adjustment: each elastic portion 34 is hooked up and down on the corresponding elastic portion pivot M34 and the supporting cross bar portion 33 respectively. Furthermore, the ring-shaped upper frame 11 can be "supported" and "suspended" like a shock absorber ("automatic" up and down adjustment, that is, pitch angle adjustment, not shown in the figure, but this effect must be achieved. ) function, further, each elastic portion 34 can at least slide relative to the corresponding elastic portion pivot M34 ("automatic" horizontal adjustment, that is, horizontal angle adjustment, not shown in the figure, but this effect must be achieved. ).

[b] Auxiliary adjustment of longitudinal rolling: through the roller 42 on the limit post 41 abutting against the corresponding vertical guide M2, the design can be relatively slidable, which can improve the precision of the aforementioned suspension positioning (especially is the horizontal adjustment).

[c] Three-point positioning: After the aforementioned adjustments are completed, perform three-point positioning. Refer to Figures 8A, 11A, and 11B. Each of the three points is based on the horizontal abutting portion M1 of the annular upper frame 11 Press and touch the corresponding single-point contact part 31 according to the position of the wafer, make the support column 32 and the insertion hole seat 211 move to the position, and then control the extension of the trigger member 212 through the trigger source 213 Insert the insertion hole seat 211 to push and fix the support column 32 to complete single-point positioning. Of course, since the wafer is clamped and displaced by the mechanical arm according to the predetermined coordinates, two points can be completed first according to the predetermined coordinates. Collinear positioning. Furthermore, the ring-shaped upper frame 11 contacts the wafer at a third point, and is adjusted to the same angle as the wafer, and then fixed.

[d] Auxiliary fine-tuning: through the coarse-fine-tuning unit 50 and the fine-fine-tuning unit 60 , the intermediate support plate 13 is assisted in coarse-fine-tuning and fine-tuning.

The advantages and effects of this creation can be summarized as follows:

[1] Suspension design can be adjusted up and down and horizontally. Each of the elastic parts of the invention is hooked up and down on the corresponding elastic part pivot and the supporting cross bar. When the ring-shaped upper frame receives the wafer, it can produce the functions of "supporting" and "suspension" (that is, adjusting the pitch angle), and each elastic part can slide relative to the pivot of the elastic part (the ring-shaped The upper frame can be fine-tuned horizontally corresponding to the wafer, that is, the horizontal angle adjustment). Therefore, the suspension design can be adjusted up and down and horizontally.

[2] Vertical sliding design can improve the precision of horizontal adjustment. Through the design that the roller on the limit post abuts against the vertical guide part and can slide relative to each other, the precision of horizontal adjustment during suspension adjustment can be improved. Therefore, the vertical sliding design can improve the precision of horizontal adjustment.

[3] Three-point fine-tuning has high positioning precision. For each of the three points in this case, use the horizontal abutting part of the annular upper frame to cooperate with the wafer to press and touch the corresponding single-point contact part, so that the support column and the insertion hole seat are relatively stretchable Fixing after fine-tuning can improve the accuracy of the ring-shaped upper frame for receiving wafers. Therefore, the positioning precision of the three-point fine-tuning is high.

[4] Auxiliary fine-tuning can improve the precision of undertaking. Through the coarse and fine adjustment unit and the fine and fine adjustment unit, coarse and fine adjustments and fine and fine adjustments can be assisted on the intermediate support plate, so as to improve the receiving precision. Therefore, having auxiliary fine-tuning can improve the accuracy of receiving.

The above is only a detailed description of this creation by means of a preferred embodiment, and any simple modifications and changes made to this embodiment will not depart from the spirit and scope of this creation.

10: Wafer edge carrying unit

11: Ring upper frame

12: Connecting column

13: Middle bearing plate

20: Base unit

21: erection device

213: braking source

30: Suspension support unit

32: Support column

33: Support cross bar

40: Limit guide unit

41: limit column

42: Roller

60: fine tuning unit

63: fine adjustment screw

M: connection device

M2: vertical guide

M3: Suspension pivot joint

Claims (7)

An automatic horizontal and pitch angle leveling mechanism for wedge-shaped error compensation between the wafer edge and the mask of an exposure machine, including: a wafer edge carrying unit, including an annular upper frame, a plurality of connecting columns and an intermediate support plate; the ring-shaped upper frame has a plurality of connection devices; each connection device in the plurality of connection devices has a horizontal abutment part, a vertical guide part and a plurality of suspension hinge parts; the plurality of connection columns are average Distributed on the periphery of the ring-shaped upper frame, and vertically connect the ring-shaped upper frame and the intermediate support plate; a base unit is arranged under the wafer edge bearing unit, and the base unit has multiple erection devices; multiple suspensions The support unit is supported between the wafer edge carrying unit and the base unit; each suspension support unit in the plurality of suspension support units has a single-point contact portion, a support column, and a support cross bar and two elastic parts; the single-point contact part is located at the top of the support column, for the support column to press against the horizontal abutting part; the support column has a transverse through hole, and the support cross bar part is passed through the transverse through hole; One end of the two elastic parts is pivoted to the corresponding suspension pivot joint, and the other end of the two elastic parts is respectively hooked to the two ends of the support crossbar part; each support column is inserted It is installed in the corresponding erecting device and can be adjusted relatively telescopically; and the plurality of position-limiting guide units are arranged between the wafer edge carrying unit and the base unit; each of the plurality of position-limiting guide units A limit guide unit includes a limit column and a roller; the bottom end of each limit column is fixed on the erection device, and the roller is rotatably mounted on the top of the limit column; The limit column is provided to abut against the vertical guide part, and can be adjusted by relative movement. The horizontal and pitch angle automatic leveling mechanism for compensation of the wedge-shaped error between the wafer edge and the mask of the exposure machine as described in claim 1, wherein: each of the plurality of suspension pivot joints is a suspension pivot joint It includes a suspension longitudinal hole, a suspension transverse hole, a suspension transverse fixing hole and an elastic part pivot; the suspension longitudinal hole runs through the corresponding position of the annular upper frame longitudinally; the suspension transverse hole and The suspension horizontal fixing holes respectively transversely pass through the corresponding positions of the annular upper frame, and are coaxially connected with the suspension longitudinal holes; hole, and traverse the suspension longitudinal hole; thereby, the end of the corresponding elastic part is extended into the suspension longitudinal hole, and hooked on the elastic part pivot, and can be opposite to the elastic part pivot slide. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the edge of the wafer and the mask of the exposure machine as described in claim 2, wherein the elastic part is a tension spring. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the mask of the exposure machine as described in claim 1, wherein: each of the plurality of erecting devices includes an insertion hole seat 1. A detent member and a detent source; the insertion hole seat has a detent hole; the detent member can perform one of the actions of withdrawing and extending into the insertion hole seat through the detent hole; and the detent source is linked to drive the detent; In this way, when the braking source controls the trigger member to withdraw from the insertion hole seat, each support column can be inserted into the corresponding insertion hole seat, and when it is relatively stretched and adjusted to a predetermined height, it will resume. Controlling the triggering member to extend into the insertion hole seat through the braking source, so as to push and fix the supporting column. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the mask of the exposure machine as described in claim 4, wherein: the braking source is one of an electric cylinder and a hydraulic cylinder; the The single-point contact part is either a steel ball or a ball body with structural strength. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the mask of the exposure machine as described in claim 1, which further includes: a coarse and fine adjustment unit, which includes a coarse perforation and a coarse and fine adjustment hole and a coarse and fine adjustment screw, the coarse perforation is set through the middle bearing plate and is adjacent to the corresponding limit column; the coarse and fine adjustment hole is erected on the base unit and is coaxial with the coarse perforation; The coarse and fine adjustment screw system has a fine adjustment pressing part, the coarse and fine adjustment screw system is used to pass through the coarse perforation, and screwed to the coarse and fine adjustment hole, and the coarse and fine adjustment screw system can move relatively with the coarse perforation hole, the fine adjustment press When the coarse and fine adjustment screw is screwed into the coarse and fine adjustment hole and screwed back from the coarse and fine adjustment hole, the fine adjustment pressing part is respectively fine-tuned and pressed against the intermediate bearing. One of the coarse and fine adjustment actions of the middle bearing plate is loosened by fine adjustment; and a fine and fine adjustment unit is composed of an elastic support, a fine and fine adjustment screw hole and a fine and fine adjustment screw; the elastic support is erected on the base unit , and adjacent to the corresponding coarse and fine adjustment holes; the fine and fine adjustment screw holes are arranged longitudinally through the middle bearing plate, coaxial with the elastic support, and adjacent to the corresponding support columns, the fine and fine adjustment screws are used After using the screw lock and passing through the fine adjustment screw hole, touch the elastic support 1. One of the actions of retreating from the elastic support member; and one of the fine-tuning actions of fine-tuning to raise the intermediate support plate and fine-tuning to lower the intermediate support plate can be performed correspondingly. The horizontal and pitch angle automatic leveling mechanism for wedge error compensation between the wafer edge and the mask of the exposure machine as described in claim 6, wherein: the elastic support includes a buffer groove, a buffer spring and a support member ; the buffer slot is erected on the base unit; the buffer spring is located in the buffer slot;

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