TWI816820B - 微機械構件和製造微機械構件的方法 - Google Patents
微機械構件和製造微機械構件的方法 Download PDFInfo
- Publication number
- TWI816820B TWI816820B TW108122586A TW108122586A TWI816820B TW I816820 B TWI816820 B TW I816820B TW 108122586 A TW108122586 A TW 108122586A TW 108122586 A TW108122586 A TW 108122586A TW I816820 B TWI816820 B TW I816820B
- Authority
- TW
- Taiwan
- Prior art keywords
- spring
- sub
- spring sub
- functional layer
- elements
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000002346 layers by function Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 19
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 24
- 230000005484 gravity Effects 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 230000010355 oscillation Effects 0.000 description 11
- 238000005452 bending Methods 0.000 description 8
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0059—Constitution or structural means for controlling the movement not provided for in groups B81B3/0037 - B81B3/0056
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/007—For controlling stiffness, e.g. ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00658—Treatments for improving the stiffness of a vibrating element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5733—Structural details or topology
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0163—Spring holders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Radar, Positioning & Navigation (AREA)
- Mechanical Engineering (AREA)
- Remote Sensing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Gyroscopes (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018210482.4A DE102018210482B4 (de) | 2018-06-27 | 2018-06-27 | Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements |
| DE102018210482.4 | 2018-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202017846A TW202017846A (zh) | 2020-05-16 |
| TWI816820B true TWI816820B (zh) | 2023-10-01 |
Family
ID=68886009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108122586A TWI816820B (zh) | 2018-06-27 | 2019-06-27 | 微機械構件和製造微機械構件的方法 |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110642218B (de) |
| DE (1) | DE102018210482B4 (de) |
| TW (1) | TWI816820B (de) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993014409A1 (en) * | 1992-01-21 | 1993-07-22 | Alliedsignal Inc. | Micromachined rate and acceleration sensor |
| US20030200807A1 (en) * | 2002-04-29 | 2003-10-30 | Hulsing Rand H. | Closed loop analog gyro rate sensor |
| US20050066728A1 (en) * | 2003-09-25 | 2005-03-31 | Kionix, Inc. | Z-axis angular rate micro electro-mechanical systems (MEMS) sensor |
| US20150377623A1 (en) * | 2014-06-26 | 2015-12-31 | Lumedyne Technologies Incorporated | Systems and Methods for Determining Rotation from Nonlinear Periodic Signals |
| TW201700393A (zh) * | 2015-05-15 | 2017-01-01 | 村田製作所股份有限公司 | 多層微機械結構的製造方法 |
| TW201807393A (zh) * | 2016-07-27 | 2018-03-01 | 美商路梅戴尼科技公司 | 利用具有多重自由度之振動加速計偵測慣性參數之系統及方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4241045C1 (de) | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
| DE4317274A1 (de) | 1993-05-25 | 1994-12-01 | Bosch Gmbh Robert | Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen |
| DE19537814B4 (de) | 1995-10-11 | 2009-11-19 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
| JP3724432B2 (ja) | 2001-04-19 | 2005-12-07 | 株式会社ニコン | 薄膜弾性構造体及びその製造方法並びにこれを用いたミラーデバイス及び光スイッチ |
| US6785039B2 (en) | 2002-06-03 | 2004-08-31 | Pts Corporation | Optical routing elements |
| TW593125B (en) | 2002-08-09 | 2004-06-21 | Ind Tech Res Inst | MEMS type differential actuator |
| US7550855B2 (en) | 2005-12-02 | 2009-06-23 | Palo Alto Research Center Incorporated | Vertically spaced plural microsprings |
| DE102011080978B4 (de) | 2011-08-16 | 2020-03-19 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Struktur |
| DE102014215038A1 (de) * | 2014-07-31 | 2016-02-04 | Robert Bosch Gmbh | Mikromechanischer Sensor und Verfahren zur Herstellung eines mikromechanischen Sensors |
| JP6550866B2 (ja) * | 2015-04-01 | 2019-07-31 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
-
2018
- 2018-06-27 DE DE102018210482.4A patent/DE102018210482B4/de active Active
-
2019
- 2019-06-27 CN CN201910566253.8A patent/CN110642218B/zh active Active
- 2019-06-27 TW TW108122586A patent/TWI816820B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993014409A1 (en) * | 1992-01-21 | 1993-07-22 | Alliedsignal Inc. | Micromachined rate and acceleration sensor |
| US20030200807A1 (en) * | 2002-04-29 | 2003-10-30 | Hulsing Rand H. | Closed loop analog gyro rate sensor |
| US20050066728A1 (en) * | 2003-09-25 | 2005-03-31 | Kionix, Inc. | Z-axis angular rate micro electro-mechanical systems (MEMS) sensor |
| US20150377623A1 (en) * | 2014-06-26 | 2015-12-31 | Lumedyne Technologies Incorporated | Systems and Methods for Determining Rotation from Nonlinear Periodic Signals |
| TW201700393A (zh) * | 2015-05-15 | 2017-01-01 | 村田製作所股份有限公司 | 多層微機械結構的製造方法 |
| TW201807393A (zh) * | 2016-07-27 | 2018-03-01 | 美商路梅戴尼科技公司 | 利用具有多重自由度之振動加速計偵測慣性參數之系統及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202017846A (zh) | 2020-05-16 |
| DE102018210482A1 (de) | 2020-01-02 |
| CN110642218B (zh) | 2024-06-04 |
| DE102018210482B4 (de) | 2022-07-07 |
| CN110642218A (zh) | 2020-01-03 |
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