TWI815662B - Device for abutting against electronic component - Google Patents

Device for abutting against electronic component Download PDF

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Publication number
TWI815662B
TWI815662B TW111134924A TW111134924A TWI815662B TW I815662 B TWI815662 B TW I815662B TW 111134924 A TW111134924 A TW 111134924A TW 111134924 A TW111134924 A TW 111134924A TW I815662 B TWI815662 B TW I815662B
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Taiwan
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resisting
carrier
electronic components
image capturing
component
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TW111134924A
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Chinese (zh)
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TW202415265A (en
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林清儒
黃聖哲
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斯託克精密科技股份有限公司
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Priority to TW111134924A priority Critical patent/TWI815662B/en
Priority to CN202310674541.1A priority patent/CN117712238A/en
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Publication of TWI815662B publication Critical patent/TWI815662B/en
Publication of TW202415265A publication Critical patent/TW202415265A/en

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Abstract

A device for abutting against electronic components includes a mounting frame, an abutting member and an image capturing member. The mounting frame is configured to mount a flexible carrier, and an electronic component is disposed on the flexible carrier. The abutting member is disposed adjacent to the mounting frame and adapted to be driven by an actuating mechanism to perform an abutting movement toward the mounting carrier. The image capturing member is configured to capture a position of the electronic component to generate position information. A relative position between the abutting member and the image capturing member in a horizontal direction parallel to the mounting frame is retained, and the abutting member performs the abutting movement according to the position information.

Description

用於頂抵電子元件的設備Equipment used to press against electronic components

本發明提供一種用於頂抵電子元件的設備,且特別是關於一種可減少頂抵位置與偵測位置間相對誤差的用於頂抵電子元件的設備。The present invention provides a device for pushing against an electronic component, and particularly relates to a device for pushing against an electronic component that can reduce the relative error between the pushing position and the detection position.

二極體面板顯示器為目前市面上主流的顯示裝置之一。一般而言,二極體面板產品在製作過程中,需要經過磊晶、巨量轉移、固晶接合等流程。在巨量轉移的過程中,會透過微機電陣列技術將發光二極體配置於目標面板或基板上,並且透過焊料等固著方式將配置的發光二極體固定於目標面板或基板,如此一來即可使面板具有高密度排列的發光二極體,在通電時各個發光二極體分別激發出不同色光,進而提供高飽和度的視覺感受。Diode panel display is one of the mainstream display devices currently on the market. Generally speaking, the production process of diode panel products requires processes such as epitaxy, mass transfer, and die bonding. In the process of mass transfer, the light-emitting diodes will be arranged on the target panel or substrate through micro-electromechanical array technology, and the arranged light-emitting diodes will be fixed on the target panel or substrate through fixing methods such as solder. This allows the panel to have a high-density arrangement of light-emitting diodes. When powered, each light-emitting diode emits light of different colors, thereby providing a highly saturated visual experience.

但在轉移的過程中,部份的二極體晶片有可能本身具有缺陷,因此需要在轉移前針對欲轉移的晶片進行檢測,例如是透過可導電的探針接觸欲進行偵測的晶片,從而測試這些晶片是否能正常發光,又或者是當晶片配置於正確位置時,需要透過元件將晶片頂抵於目標基板的特定位置並同時加工。然而,現有技術中用於偵測上述位置的影像擷取裝置以及實際執行頂抵動作的頂抵裝置為彼此獨立的機構且具有各自的定位座標系,因此當頂抵裝置依據固定的影像擷取裝置的定位資訊移動時,容易因為移動時所產生的位置偏差從而導致偵測失敗機率提昇或者是產品良率下降,且當頂抵裝置需要進行複數次移動時,上述的偏差會逐漸累積並使得這種現象更為明顯。此外,當頂抵裝置的座標系與影像擷取裝置的座標系種類不同時,即使經過多次的校正或補償,仍然難以將頂抵裝置定位至偵測到的正確位置,因此對檢測或加工流程都造成嚴重的影響。However, during the transfer process, some diode wafers may themselves have defects. Therefore, the wafer to be transferred needs to be inspected before transfer, for example, by contacting the wafer to be inspected with a conductive probe. To test whether these wafers can emit light normally, or when the wafers are placed in the correct position, it is necessary to press the wafers against specific positions on the target substrate through components and process them at the same time. However, in the prior art, the image capturing device used to detect the above-mentioned position and the pushing device that actually performs the pushing action are independent mechanisms and have their own positioning coordinate systems. Therefore, when the pushing device captures images based on a fixed When the positioning information of the device moves, it is easy to increase the probability of detection failure or decrease the product yield due to the position deviation generated during the movement. And when the device needs to be moved multiple times, the above deviations will gradually accumulate and cause This phenomenon is more obvious. In addition, when the coordinate system of the pushing device is different from the coordinate system of the image capturing device, even after multiple corrections or compensations, it is still difficult to position the pushing device to the correct detected position, so it is difficult for inspection or processing. processes are severely affected.

發明人遂竭其心智悉心研究,進而研發出一種可減少頂抵位置與偵測位置間相對誤差的用於頂抵電子元件的設備,以期達到提高檢測正確率以及產品良率的效果。The inventor then devoted his mind to research and developed a device for pushing against electronic components that can reduce the relative error between the pushing position and the detection position, in order to improve the detection accuracy and product yield.

本發明提供一種用於頂抵電子元件的設備,包括一承載架、一頂抵元件以及一影像擷取元件。承載架用以承載一可撓性載體,且可撓性載體上配置有一電子元件;頂抵元件鄰近於承載架配置且適於受一致動機構驅動而朝承載架執行一頂抵動作;影像擷取元件用以擷取電子元件的位置而產生一位置資訊。此外,頂抵元件以及影像擷取元件在平行於承載架的一水平方向上的相對位置固定,且頂抵元件依據位置資訊朝承載架執行頂抵動作。The invention provides a device for resisting electronic components, including a carrier, a resisting component and an image capturing component. The carrier is used to carry a flexible carrier, and an electronic component is disposed on the flexible carrier; the resisting component is disposed adjacent to the carrier and is adapted to be driven by an actuating mechanism to perform a resisting action toward the carrier; image capture The retrieval component is used to retrieve the position of the electronic component and generate a position information. In addition, the relative positions of the resisting element and the image capturing element are fixed in a horizontal direction parallel to the carrier, and the resisting element performs a resisting action toward the carrier according to the position information.

在一實施例中,上述的頂抵元件以及影像擷取元件共同配置於一支架上。In one embodiment, the above-mentioned resisting element and image capturing element are jointly arranged on a bracket.

在一實施例中,上述的頂抵元件以及該影像擷取元件適於在水平方向上同步移動。In one embodiment, the above-mentioned resisting element and the image capturing element are adapted to move synchronously in the horizontal direction.

在一實施例中,上述的頂抵元件可透光。In one embodiment, the above-mentioned resisting element is light-transmissive.

在一實施例中,用於頂抵電子元件的設備還包括一能量產生裝置,且能量產生裝置用以產生射向承載架的能量束。In one embodiment, the device for resisting electronic components further includes an energy generating device, and the energy generating device is used to generate an energy beam directed toward the carrier.

在一實施例中,上述的頂抵元件可透光,且能量束透過頂抵元件射向承載架。In one embodiment, the above-mentioned resisting element is light-transmissive, and the energy beam passes through the resisting element and is directed to the carrier.

在一實施例中,上述的能量產生裝置為雷射產生器。In one embodiment, the energy generating device is a laser generator.

藉此,本發明的用於頂抵電子元件的設備由於頂抵元件以及影像擷取元件在水平方向上的相對位置固定,因此頂抵元件可與影像擷取元件共享相同的定位座標系以及位置資訊,減少定位時所產生的誤差,從而達到提高檢測正確率以及產品良率的效果。Thereby, in the device for resisting electronic components of the present invention, since the relative positions of the resisting component and the image capturing component are fixed in the horizontal direction, the resisting component and the image capturing component can share the same positioning coordinate system and position. information to reduce errors generated during positioning, thereby improving detection accuracy and product yield.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

有關本發明之前述及其它技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚地呈現。值得一提的是,以下實施例所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明,而非對本發明加以限制。此外,在下列的實施例中,相同或相似的元件將採用相同或相似的標號。The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative rather than limiting. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.

請參考圖1及圖2,其中圖1為本發明的用於頂抵電子元件的設備的一實施例的側視示意圖,而圖2為本發明的用於頂抵電子元件的設備的一實施例頂抵電子元件時的側視示意圖。本實施例的用於頂抵電子元件的設備1適於頂抵一電子元件2,且包括一承載架100、一頂抵元件200以及一影像擷取元件300,其中承載架100用以承載一可撓性載體3,且可撓性載體3上配置有電子元件2,頂抵元件200鄰近於承載架100配置,且影像擷取元件300用以擷取電子元件2的位置。Please refer to Figures 1 and 2. Figure 1 is a schematic side view of an embodiment of a device for resisting electronic components according to the present invention, and Figure 2 is an implementation of a device for resisting electronic components according to the present invention. A side view of an example when it is pressed against an electronic component. The device 1 for pressing against an electronic component in this embodiment is suitable for pressing against an electronic component 2 and includes a carrying frame 100, a pressing element 200 and an image capturing element 300, wherein the carrying frame 100 is used to carry an The flexible carrier 3 is provided with an electronic component 2 on the flexible carrier 3. The resisting component 200 is disposed adjacent to the carrier 100, and the image capturing component 300 is used to capture the position of the electronic component 2.

詳細而言,承載架100例如是一載體框,而可撓性載體3例如是一藍膜。藉此,電子元件2可貼附於可撓性載體3上並透過承載架100的固持以執行加工或檢測等流程,從而轉移至圖1中的基板4上。In detail, the carrier 100 is, for example, a carrier frame, and the flexible carrier 3 is, for example, a blue film. Thereby, the electronic component 2 can be attached to the flexible carrier 3 and held by the carrier 100 to perform processes such as processing or inspection, and then transferred to the substrate 4 in FIG. 1 .

如圖1所示,頂抵元件200例如是一頂針,且適於受一致動機構5驅動而朝承載架執行一頂抵動作。具體而言,致動機構5可包括一水平致動機構52以及一頂抵致動機構54,其中水平致動機構52與頂抵致動機構54例如是伺服馬達、音圈馬達或步進馬達,可分別用以選擇性地驅動頂抵元件200在一水平方向H上移動或是朝承載架100執行一頂抵動作,且頂抵承載架100的方式例如是單獨使頂抵元件200產生位移從而抵接可撓性載體3上的電子元件2,或者是直接驅動配置頂抵元件200的機構使其整體一併朝承載架100移動,本發明對此不加以限制。As shown in FIG. 1 , the pushing element 200 is, for example, an ejector pin, and is adapted to be driven by an actuating mechanism 5 to perform a pushing action toward the carrier. Specifically, the actuating mechanism 5 may include a horizontal actuating mechanism 52 and a pushing actuating mechanism 54, where the horizontal actuating mechanism 52 and the pushing actuating mechanism 54 are, for example, servo motors, voice coil motors or stepper motors. , can be used to selectively drive the resisting element 200 to move in a horizontal direction H or to perform a resisting action toward the carrier 100 , and the method of resisting the carrier 100 is, for example, to separately displace the resisting element 200 Thereby, the electronic component 2 on the flexible carrier 3 is contacted, or the mechanism arranged to abut the component 200 is directly driven to move the entire body toward the carrier 100 , which is not limited by the present invention.

另一方面,影像擷取元件300例如包括一電荷耦合元件(CCD),可擷取電子元件2在承載架100上的位置而產生一位置資訊。較佳地,用於頂抵電子元件的設備1還包括一控制單元(未繪示),其中控制單元例如是一工業電腦或一可程式化邏輯控制器(PLC),且頂抵元件200、影像擷取元件300以及致動機構5電性連接於控制單元。藉此,影像擷取元件300可將擷取的電子元件2的位置以及產生的位置資訊傳輸至控制單元,並由控制單元控制頂抵元件200位移或透過致動機構5驅動頂抵元件200執行頂抵動作,使得原本獨立的各個元件得以協同作用。On the other hand, the image capturing element 300 includes, for example, a charge coupled device (CCD), which can capture the position of the electronic component 2 on the carrier 100 to generate position information. Preferably, the device 1 for resisting electronic components also includes a control unit (not shown), where the control unit is, for example, an industrial computer or a programmable logic controller (PLC), and the resisting component 200, The image capturing element 300 and the actuating mechanism 5 are electrically connected to the control unit. Thereby, the image capturing element 300 can transmit the captured position of the electronic component 2 and the generated position information to the control unit, and the control unit can control the displacement of the resisting element 200 or drive the resisting element 200 through the actuating mechanism 5 for execution. The pushing action allows the originally independent components to work together.

為了克服過往頂抵裝置以及影像擷取裝置因為相對位移而產生的誤差,本實施例的頂抵元件200以及影像擷取元件300在平行於承載架100的水平方向H上的相對位置固定,且頂抵元件200依據影像擷取元件300所產生的位置資訊朝承載架100執行頂抵動作。詳細而言,用於頂抵電子元件的設備1還可包括一支架400,且頂抵元件200以及影像擷取元件300共同配置於支架400上。藉此,當支架400移動時,頂抵元件200以及影像擷取元件300適於在水平方向H上同步移動,因此頂抵元件200不會因為移動而產生定位誤差。上述的同步移動,指的是頂抵元件200與影像擷取元件300在相同時間點具有相同的運動量,且彼此間的相對位置保持恆定,但依據訊號傳遞的時間差,頂抵元件200與影像擷取元件300兩者間的作動可能有數毫秒至數十毫秒的延遲,這依然在本發明的容許範圍內。較佳地,頂抵元件200移動所使用的座標系以及影像擷取元件300所使用的座標系為同一座標系,如此一來即使頂抵元件200執行多次移動或頂抵,頂抵元件200與影像擷取元件300之間的位置誤差不會持續累積,可提高檢測或加工的精度。In order to overcome the errors caused by the relative displacement of the previous resisting devices and the image capturing devices, the relative positions of the resisting element 200 and the image capturing element 300 in this embodiment are fixed in the horizontal direction H parallel to the carrier 100, and The resisting element 200 performs a resisting action toward the carrier 100 based on the position information generated by the image capturing element 300 . In detail, the device 1 for resisting electronic components may further include a bracket 400 , and the resisting element 200 and the image capturing element 300 are jointly arranged on the bracket 400 . Therefore, when the bracket 400 moves, the resisting element 200 and the image capturing element 300 are adapted to move synchronously in the horizontal direction H, so that the resisting element 200 does not cause positioning errors due to movement. The above-mentioned synchronous movement means that the resisting element 200 and the image capturing element 300 have the same amount of movement at the same point in time, and their relative positions remain constant. However, according to the time difference in signal transmission, the resisting element 200 and the image capturing element 300 move at the same time. There may be a delay of several milliseconds to tens of milliseconds between the actions of the component 300, which is still within the allowable range of the present invention. Preferably, the coordinate system used by the resisting element 200 to move and the coordinate system used by the image capturing element 300 are the same coordinate system. In this way, even if the resisting element 200 performs multiple movements or resisting, the resisting element 200 will not move. The position error between the image capturing element 300 and the image capturing element 300 will not continue to accumulate, which can improve the accuracy of detection or processing.

在其它可能的實施例,頂抵元件200以及影像擷取元件300也可以不透過支架400彼此連接,而是兩者直接一體成型為同一個機械構件。舉例而言,影像擷取元件300可以直接配置於頂抵元件200上,或者是與頂抵元件200沿垂直於承載架100的方向同軸配置,且結合的方式可包括嵌合、黏合、鎖固或焊接,如此一來也可達到相同的效果。In other possible embodiments, the resisting element 200 and the image capturing element 300 may not be connected to each other through the bracket 400, but they may be directly integrated into the same mechanical component. For example, the image capturing element 300 can be directly disposed on the resisting element 200, or can be coaxially disposed with the resisting element 200 in a direction perpendicular to the carrier 100, and the combination method can include fitting, gluing, and locking. Or welding, which can achieve the same effect.

在一可能的實施例中,用於頂抵電子元件的設備1還包括一能量產生裝置500,其中能量產生裝置500例如是雷射產生器且架設於頂抵元件200上方。具體而言,本實施例的能量產生裝置500可直接配置於支架400或頂抵元件200搭載的機構上,或者是與支架400保持適當的距離,且能量產生裝置500能夠產生射向承載架100的能量束510,用以檢測或加工電子元件2。In a possible embodiment, the device 1 for resisting electronic components further includes an energy generating device 500 , where the energy generating device 500 is, for example, a laser generator and is installed above the resisting component 200 . Specifically, the energy generating device 500 of this embodiment can be directly disposed on the bracket 400 or the mechanism mounted on the resisting element 200 , or it can be kept at an appropriate distance from the bracket 400 , and the energy generating device 500 can generate energy directed toward the carrier 100 The energy beam 510 is used to detect or process the electronic component 2.

較佳地,頂抵元件200使用透光材質製成且可透光。詳細而言,頂抵元件200可使用玻璃、石英或鑽石等材質製成,且能量束510可透過頂抵元件200射向承載架100。透過這樣的配置,當影像擷取元件300偵測到電子元件2位於正確位置時,控制單元可驅動致動機構5,使致動機構5進一步驅動頂抵元件200朝承載架100的方向頂抵電子元件2,從而將電子元件2暫時地固定於承載架100或可撓性載體3的表面。之後,能量產生裝置500可產生能量束510,並調整能量束510使其透過頂抵元件200射向可撓性載體3上的電子元件2,藉此可在頂抵的同時固定並加工電子元件2,大幅提高加工時的效率。Preferably, the resisting element 200 is made of a light-transmitting material and can be light-transmissive. Specifically, the resisting element 200 can be made of glass, quartz, diamond, or other materials, and the energy beam 510 can be emitted to the carrier 100 through the resisting element 200 . Through such a configuration, when the image capturing element 300 detects that the electronic component 2 is in the correct position, the control unit can drive the actuating mechanism 5 so that the actuating mechanism 5 further drives the resisting element 200 to resist in the direction of the carrier 100 The electronic component 2 is temporarily fixed to the surface of the carrier 100 or the flexible carrier 3 . After that, the energy generating device 500 can generate the energy beam 510 and adjust the energy beam 510 so that it passes through the resisting element 200 and shoots towards the electronic component 2 on the flexible carrier 3, whereby the electronic component can be fixed and processed while resisting. 2. Greatly improve processing efficiency.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,上述實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。且應注意的是,舉凡與上述實施例等效之變化與置換,均應視為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in preferred embodiments above. However, those skilled in the art should understand that the above embodiments are only used to illustrate the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions that are equivalent to the above embodiments should be deemed to be within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope of the patent application.

1:用於頂抵電子元件的設備 100:承載架 200:頂抵元件 300:影像擷取元件 400:支架 500:能量產生裝置 510:能量束 2:電子元件 3:可撓性載體 4:基板 5:致動機構 52:水平致動機構 54:頂抵致動機構 H:水平方向1: Equipment used to resist electronic components 100: Bearing frame 200: Push against components 300:Image capture component 400: Bracket 500: Energy generating device 510:Energy Beam 2: Electronic components 3: Flexible carrier 4:Substrate 5: Actuating mechanism 52: Horizontal actuation mechanism 54: Push against the actuating mechanism H: horizontal direction

圖1為本發明的用於頂抵電子元件的設備的一實施例的側視示意圖。 圖2為本發明的用於頂抵電子元件的設備的一實施例頂抵電子元件時的側視示意圖。 FIG. 1 is a schematic side view of an embodiment of a device for resisting electronic components according to the present invention. FIG. 2 is a schematic side view of an apparatus for resisting electronic components according to an embodiment of the present invention when resisting electronic components.

1:用於頂抵電子元件的設備 1: Equipment used to resist electronic components

100:承載架 100: Bearing frame

200:頂抵元件 200: Push against components

300:影像擷取元件 300:Image capture component

400:支架 400: Bracket

500:能量產生裝置 500: Energy generating device

2:電子元件 2: Electronic components

3:可撓性載體 3: Flexible carrier

4:基板 4:Substrate

5:致動機構 5: Actuating mechanism

52:水平致動機構 52: Horizontal actuation mechanism

54:頂抵致動機構 54: Push against the actuating mechanism

H:水平方向 H: horizontal direction

Claims (7)

一種用於頂抵電子元件的設備,包括: 一承載架,用以承載一可撓性載體,且該可撓性載體上配置有一電子元件; 一頂抵元件,鄰近於該承載架配置且適於受一致動機構驅動而朝該承載架執行一頂抵動作;以及 一影像擷取元件,用以擷取該電子元件的位置而產生一位置資訊; 其中,該頂抵元件以及該影像擷取元件在平行於該承載架的一水平方向上的相對位置固定,且該頂抵元件依據該位置資訊朝該承載架執行該頂抵動作。 A device used to push against electronic components, including: A carrying frame is used to carry a flexible carrier, and an electronic component is configured on the flexible carrier; a pushing element, configured adjacent to the carrier and adapted to be driven by an actuating mechanism to perform a pushing action toward the carrier; and An image capture component used to capture the position of the electronic component to generate a position information; Wherein, the relative positions of the resisting element and the image capturing element are fixed in a horizontal direction parallel to the carrier, and the resisting element performs the resisting action toward the carrier based on the position information. 如請求項1所述的用於頂抵電子元件的設備,其中該頂抵元件以及該影像擷取元件共同配置於一支架上。The device for resisting electronic components as described in claim 1, wherein the resisting component and the image capturing component are jointly arranged on a bracket. 如請求項1所述的用於頂抵電子元件的設備,其中該頂抵元件以及該影像擷取元件適於在該水平方向上同步移動。The device for pushing against electronic components as claimed in claim 1, wherein the pushing element and the image capturing element are adapted to move synchronously in the horizontal direction. 如請求項1所述的用於頂抵電子元件的設備,其中該頂抵元件可透光。The device for resisting electronic components as described in claim 1, wherein the resisting component is light-transmissive. 如請求項1所述的用於頂抵電子元件的設備,還包括一能量產生裝置,且該能量產生裝置用以產生射向該承載架的能量束。The device for resisting electronic components as described in claim 1 further includes an energy generating device, and the energy generating device is used to generate an energy beam directed toward the carrier. 如請求項5所述的用於頂抵電子元件的設備,其中該頂抵元件可透光,且該能量束透過該頂抵元件射向該承載架。The device for resisting electronic components as described in claim 5, wherein the resisting element is light-transmissive, and the energy beam is emitted to the carrier through the resisting element. 如請求項5所述的用於頂抵電子元件的設備,其中該能量產生裝置為雷射產生器。The device for resisting electronic components as claimed in claim 5, wherein the energy generating device is a laser generator.
TW111134924A 2022-09-15 2022-09-15 Device for abutting against electronic component TWI815662B (en)

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TW111134924A TWI815662B (en) 2022-09-15 2022-09-15 Device for abutting against electronic component
CN202310674541.1A CN117712238A (en) 2022-09-15 2023-06-08 Device for propping against an electronic component

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Application Number Priority Date Filing Date Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201430360A (en) * 2013-01-25 2014-08-01 Hon Tech Inc Electronic component operating device and detection equipment using the same
TW201708829A (en) * 2015-08-25 2017-03-01 京元電子股份有限公司 Image testing device of semiconductor and testing apparatus thereof
TW201727241A (en) * 2016-01-27 2017-08-01 Mpi Corp Probe card capable of replacing daughter board and method of using thereof applicable to high frequency testing
TW202117332A (en) * 2019-10-21 2021-05-01 思達科技股份有限公司 Method of operating a probing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201430360A (en) * 2013-01-25 2014-08-01 Hon Tech Inc Electronic component operating device and detection equipment using the same
TW201708829A (en) * 2015-08-25 2017-03-01 京元電子股份有限公司 Image testing device of semiconductor and testing apparatus thereof
TW201727241A (en) * 2016-01-27 2017-08-01 Mpi Corp Probe card capable of replacing daughter board and method of using thereof applicable to high frequency testing
TW202117332A (en) * 2019-10-21 2021-05-01 思達科技股份有限公司 Method of operating a probing apparatus

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