TWI815662B - Device for abutting against electronic component - Google Patents
Device for abutting against electronic component Download PDFInfo
- Publication number
- TWI815662B TWI815662B TW111134924A TW111134924A TWI815662B TW I815662 B TWI815662 B TW I815662B TW 111134924 A TW111134924 A TW 111134924A TW 111134924 A TW111134924 A TW 111134924A TW I815662 B TWI815662 B TW I815662B
- Authority
- TW
- Taiwan
- Prior art keywords
- resisting
- carrier
- electronic components
- image capturing
- component
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Abstract
Description
本發明提供一種用於頂抵電子元件的設備,且特別是關於一種可減少頂抵位置與偵測位置間相對誤差的用於頂抵電子元件的設備。The present invention provides a device for pushing against an electronic component, and particularly relates to a device for pushing against an electronic component that can reduce the relative error between the pushing position and the detection position.
二極體面板顯示器為目前市面上主流的顯示裝置之一。一般而言,二極體面板產品在製作過程中,需要經過磊晶、巨量轉移、固晶接合等流程。在巨量轉移的過程中,會透過微機電陣列技術將發光二極體配置於目標面板或基板上,並且透過焊料等固著方式將配置的發光二極體固定於目標面板或基板,如此一來即可使面板具有高密度排列的發光二極體,在通電時各個發光二極體分別激發出不同色光,進而提供高飽和度的視覺感受。Diode panel display is one of the mainstream display devices currently on the market. Generally speaking, the production process of diode panel products requires processes such as epitaxy, mass transfer, and die bonding. In the process of mass transfer, the light-emitting diodes will be arranged on the target panel or substrate through micro-electromechanical array technology, and the arranged light-emitting diodes will be fixed on the target panel or substrate through fixing methods such as solder. This allows the panel to have a high-density arrangement of light-emitting diodes. When powered, each light-emitting diode emits light of different colors, thereby providing a highly saturated visual experience.
但在轉移的過程中,部份的二極體晶片有可能本身具有缺陷,因此需要在轉移前針對欲轉移的晶片進行檢測,例如是透過可導電的探針接觸欲進行偵測的晶片,從而測試這些晶片是否能正常發光,又或者是當晶片配置於正確位置時,需要透過元件將晶片頂抵於目標基板的特定位置並同時加工。然而,現有技術中用於偵測上述位置的影像擷取裝置以及實際執行頂抵動作的頂抵裝置為彼此獨立的機構且具有各自的定位座標系,因此當頂抵裝置依據固定的影像擷取裝置的定位資訊移動時,容易因為移動時所產生的位置偏差從而導致偵測失敗機率提昇或者是產品良率下降,且當頂抵裝置需要進行複數次移動時,上述的偏差會逐漸累積並使得這種現象更為明顯。此外,當頂抵裝置的座標系與影像擷取裝置的座標系種類不同時,即使經過多次的校正或補償,仍然難以將頂抵裝置定位至偵測到的正確位置,因此對檢測或加工流程都造成嚴重的影響。However, during the transfer process, some diode wafers may themselves have defects. Therefore, the wafer to be transferred needs to be inspected before transfer, for example, by contacting the wafer to be inspected with a conductive probe. To test whether these wafers can emit light normally, or when the wafers are placed in the correct position, it is necessary to press the wafers against specific positions on the target substrate through components and process them at the same time. However, in the prior art, the image capturing device used to detect the above-mentioned position and the pushing device that actually performs the pushing action are independent mechanisms and have their own positioning coordinate systems. Therefore, when the pushing device captures images based on a fixed When the positioning information of the device moves, it is easy to increase the probability of detection failure or decrease the product yield due to the position deviation generated during the movement. And when the device needs to be moved multiple times, the above deviations will gradually accumulate and cause This phenomenon is more obvious. In addition, when the coordinate system of the pushing device is different from the coordinate system of the image capturing device, even after multiple corrections or compensations, it is still difficult to position the pushing device to the correct detected position, so it is difficult for inspection or processing. processes are severely affected.
發明人遂竭其心智悉心研究,進而研發出一種可減少頂抵位置與偵測位置間相對誤差的用於頂抵電子元件的設備,以期達到提高檢測正確率以及產品良率的效果。The inventor then devoted his mind to research and developed a device for pushing against electronic components that can reduce the relative error between the pushing position and the detection position, in order to improve the detection accuracy and product yield.
本發明提供一種用於頂抵電子元件的設備,包括一承載架、一頂抵元件以及一影像擷取元件。承載架用以承載一可撓性載體,且可撓性載體上配置有一電子元件;頂抵元件鄰近於承載架配置且適於受一致動機構驅動而朝承載架執行一頂抵動作;影像擷取元件用以擷取電子元件的位置而產生一位置資訊。此外,頂抵元件以及影像擷取元件在平行於承載架的一水平方向上的相對位置固定,且頂抵元件依據位置資訊朝承載架執行頂抵動作。The invention provides a device for resisting electronic components, including a carrier, a resisting component and an image capturing component. The carrier is used to carry a flexible carrier, and an electronic component is disposed on the flexible carrier; the resisting component is disposed adjacent to the carrier and is adapted to be driven by an actuating mechanism to perform a resisting action toward the carrier; image capture The retrieval component is used to retrieve the position of the electronic component and generate a position information. In addition, the relative positions of the resisting element and the image capturing element are fixed in a horizontal direction parallel to the carrier, and the resisting element performs a resisting action toward the carrier according to the position information.
在一實施例中,上述的頂抵元件以及影像擷取元件共同配置於一支架上。In one embodiment, the above-mentioned resisting element and image capturing element are jointly arranged on a bracket.
在一實施例中,上述的頂抵元件以及該影像擷取元件適於在水平方向上同步移動。In one embodiment, the above-mentioned resisting element and the image capturing element are adapted to move synchronously in the horizontal direction.
在一實施例中,上述的頂抵元件可透光。In one embodiment, the above-mentioned resisting element is light-transmissive.
在一實施例中,用於頂抵電子元件的設備還包括一能量產生裝置,且能量產生裝置用以產生射向承載架的能量束。In one embodiment, the device for resisting electronic components further includes an energy generating device, and the energy generating device is used to generate an energy beam directed toward the carrier.
在一實施例中,上述的頂抵元件可透光,且能量束透過頂抵元件射向承載架。In one embodiment, the above-mentioned resisting element is light-transmissive, and the energy beam passes through the resisting element and is directed to the carrier.
在一實施例中,上述的能量產生裝置為雷射產生器。In one embodiment, the energy generating device is a laser generator.
藉此,本發明的用於頂抵電子元件的設備由於頂抵元件以及影像擷取元件在水平方向上的相對位置固定,因此頂抵元件可與影像擷取元件共享相同的定位座標系以及位置資訊,減少定位時所產生的誤差,從而達到提高檢測正確率以及產品良率的效果。Thereby, in the device for resisting electronic components of the present invention, since the relative positions of the resisting component and the image capturing component are fixed in the horizontal direction, the resisting component and the image capturing component can share the same positioning coordinate system and position. information to reduce errors generated during positioning, thereby improving detection accuracy and product yield.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.
有關本發明之前述及其它技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚地呈現。值得一提的是,以下實施例所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明,而非對本發明加以限制。此外,在下列的實施例中,相同或相似的元件將採用相同或相似的標號。The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative rather than limiting. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.
請參考圖1及圖2,其中圖1為本發明的用於頂抵電子元件的設備的一實施例的側視示意圖,而圖2為本發明的用於頂抵電子元件的設備的一實施例頂抵電子元件時的側視示意圖。本實施例的用於頂抵電子元件的設備1適於頂抵一電子元件2,且包括一承載架100、一頂抵元件200以及一影像擷取元件300,其中承載架100用以承載一可撓性載體3,且可撓性載體3上配置有電子元件2,頂抵元件200鄰近於承載架100配置,且影像擷取元件300用以擷取電子元件2的位置。Please refer to Figures 1 and 2. Figure 1 is a schematic side view of an embodiment of a device for resisting electronic components according to the present invention, and Figure 2 is an implementation of a device for resisting electronic components according to the present invention. A side view of an example when it is pressed against an electronic component. The
詳細而言,承載架100例如是一載體框,而可撓性載體3例如是一藍膜。藉此,電子元件2可貼附於可撓性載體3上並透過承載架100的固持以執行加工或檢測等流程,從而轉移至圖1中的基板4上。In detail, the
如圖1所示,頂抵元件200例如是一頂針,且適於受一致動機構5驅動而朝承載架執行一頂抵動作。具體而言,致動機構5可包括一水平致動機構52以及一頂抵致動機構54,其中水平致動機構52與頂抵致動機構54例如是伺服馬達、音圈馬達或步進馬達,可分別用以選擇性地驅動頂抵元件200在一水平方向H上移動或是朝承載架100執行一頂抵動作,且頂抵承載架100的方式例如是單獨使頂抵元件200產生位移從而抵接可撓性載體3上的電子元件2,或者是直接驅動配置頂抵元件200的機構使其整體一併朝承載架100移動,本發明對此不加以限制。As shown in FIG. 1 , the pushing
另一方面,影像擷取元件300例如包括一電荷耦合元件(CCD),可擷取電子元件2在承載架100上的位置而產生一位置資訊。較佳地,用於頂抵電子元件的設備1還包括一控制單元(未繪示),其中控制單元例如是一工業電腦或一可程式化邏輯控制器(PLC),且頂抵元件200、影像擷取元件300以及致動機構5電性連接於控制單元。藉此,影像擷取元件300可將擷取的電子元件2的位置以及產生的位置資訊傳輸至控制單元,並由控制單元控制頂抵元件200位移或透過致動機構5驅動頂抵元件200執行頂抵動作,使得原本獨立的各個元件得以協同作用。On the other hand, the
為了克服過往頂抵裝置以及影像擷取裝置因為相對位移而產生的誤差,本實施例的頂抵元件200以及影像擷取元件300在平行於承載架100的水平方向H上的相對位置固定,且頂抵元件200依據影像擷取元件300所產生的位置資訊朝承載架100執行頂抵動作。詳細而言,用於頂抵電子元件的設備1還可包括一支架400,且頂抵元件200以及影像擷取元件300共同配置於支架400上。藉此,當支架400移動時,頂抵元件200以及影像擷取元件300適於在水平方向H上同步移動,因此頂抵元件200不會因為移動而產生定位誤差。上述的同步移動,指的是頂抵元件200與影像擷取元件300在相同時間點具有相同的運動量,且彼此間的相對位置保持恆定,但依據訊號傳遞的時間差,頂抵元件200與影像擷取元件300兩者間的作動可能有數毫秒至數十毫秒的延遲,這依然在本發明的容許範圍內。較佳地,頂抵元件200移動所使用的座標系以及影像擷取元件300所使用的座標系為同一座標系,如此一來即使頂抵元件200執行多次移動或頂抵,頂抵元件200與影像擷取元件300之間的位置誤差不會持續累積,可提高檢測或加工的精度。In order to overcome the errors caused by the relative displacement of the previous resisting devices and the image capturing devices, the relative positions of the resisting
在其它可能的實施例,頂抵元件200以及影像擷取元件300也可以不透過支架400彼此連接,而是兩者直接一體成型為同一個機械構件。舉例而言,影像擷取元件300可以直接配置於頂抵元件200上,或者是與頂抵元件200沿垂直於承載架100的方向同軸配置,且結合的方式可包括嵌合、黏合、鎖固或焊接,如此一來也可達到相同的效果。In other possible embodiments, the resisting
在一可能的實施例中,用於頂抵電子元件的設備1還包括一能量產生裝置500,其中能量產生裝置500例如是雷射產生器且架設於頂抵元件200上方。具體而言,本實施例的能量產生裝置500可直接配置於支架400或頂抵元件200搭載的機構上,或者是與支架400保持適當的距離,且能量產生裝置500能夠產生射向承載架100的能量束510,用以檢測或加工電子元件2。In a possible embodiment, the
較佳地,頂抵元件200使用透光材質製成且可透光。詳細而言,頂抵元件200可使用玻璃、石英或鑽石等材質製成,且能量束510可透過頂抵元件200射向承載架100。透過這樣的配置,當影像擷取元件300偵測到電子元件2位於正確位置時,控制單元可驅動致動機構5,使致動機構5進一步驅動頂抵元件200朝承載架100的方向頂抵電子元件2,從而將電子元件2暫時地固定於承載架100或可撓性載體3的表面。之後,能量產生裝置500可產生能量束510,並調整能量束510使其透過頂抵元件200射向可撓性載體3上的電子元件2,藉此可在頂抵的同時固定並加工電子元件2,大幅提高加工時的效率。Preferably, the resisting
本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,上述實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。且應注意的是,舉凡與上述實施例等效之變化與置換,均應視為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in preferred embodiments above. However, those skilled in the art should understand that the above embodiments are only used to illustrate the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions that are equivalent to the above embodiments should be deemed to be within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope of the patent application.
1:用於頂抵電子元件的設備 100:承載架 200:頂抵元件 300:影像擷取元件 400:支架 500:能量產生裝置 510:能量束 2:電子元件 3:可撓性載體 4:基板 5:致動機構 52:水平致動機構 54:頂抵致動機構 H:水平方向1: Equipment used to resist electronic components 100: Bearing frame 200: Push against components 300:Image capture component 400: Bracket 500: Energy generating device 510:Energy Beam 2: Electronic components 3: Flexible carrier 4:Substrate 5: Actuating mechanism 52: Horizontal actuation mechanism 54: Push against the actuating mechanism H: horizontal direction
圖1為本發明的用於頂抵電子元件的設備的一實施例的側視示意圖。 圖2為本發明的用於頂抵電子元件的設備的一實施例頂抵電子元件時的側視示意圖。 FIG. 1 is a schematic side view of an embodiment of a device for resisting electronic components according to the present invention. FIG. 2 is a schematic side view of an apparatus for resisting electronic components according to an embodiment of the present invention when resisting electronic components.
1:用於頂抵電子元件的設備 1: Equipment used to resist electronic components
100:承載架 100: Bearing frame
200:頂抵元件 200: Push against components
300:影像擷取元件 300:Image capture component
400:支架 400: Bracket
500:能量產生裝置 500: Energy generating device
2:電子元件 2: Electronic components
3:可撓性載體 3: Flexible carrier
4:基板 4:Substrate
5:致動機構 5: Actuating mechanism
52:水平致動機構 52: Horizontal actuation mechanism
54:頂抵致動機構 54: Push against the actuating mechanism
H:水平方向 H: horizontal direction
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111134924A TWI815662B (en) | 2022-09-15 | 2022-09-15 | Device for abutting against electronic component |
CN202310674541.1A CN117712238A (en) | 2022-09-15 | 2023-06-08 | Device for propping against an electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111134924A TWI815662B (en) | 2022-09-15 | 2022-09-15 | Device for abutting against electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI815662B true TWI815662B (en) | 2023-09-11 |
TW202415265A TW202415265A (en) | 2024-04-01 |
Family
ID=88966098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111134924A TWI815662B (en) | 2022-09-15 | 2022-09-15 | Device for abutting against electronic component |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN117712238A (en) |
TW (1) | TWI815662B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201430360A (en) * | 2013-01-25 | 2014-08-01 | Hon Tech Inc | Electronic component operating device and detection equipment using the same |
TW201708829A (en) * | 2015-08-25 | 2017-03-01 | 京元電子股份有限公司 | Image testing device of semiconductor and testing apparatus thereof |
TW201727241A (en) * | 2016-01-27 | 2017-08-01 | Mpi Corp | Probe card capable of replacing daughter board and method of using thereof applicable to high frequency testing |
TW202117332A (en) * | 2019-10-21 | 2021-05-01 | 思達科技股份有限公司 | Method of operating a probing apparatus |
-
2022
- 2022-09-15 TW TW111134924A patent/TWI815662B/en active
-
2023
- 2023-06-08 CN CN202310674541.1A patent/CN117712238A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201430360A (en) * | 2013-01-25 | 2014-08-01 | Hon Tech Inc | Electronic component operating device and detection equipment using the same |
TW201708829A (en) * | 2015-08-25 | 2017-03-01 | 京元電子股份有限公司 | Image testing device of semiconductor and testing apparatus thereof |
TW201727241A (en) * | 2016-01-27 | 2017-08-01 | Mpi Corp | Probe card capable of replacing daughter board and method of using thereof applicable to high frequency testing |
TW202117332A (en) * | 2019-10-21 | 2021-05-01 | 思達科技股份有限公司 | Method of operating a probing apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN117712238A (en) | 2024-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI505901B (en) | Transfer equipment | |
US6208419B1 (en) | Method of and apparatus for bonding light-emitting element | |
JP2002368494A (en) | Electric component mounting system and positional error detecting method in the same system | |
WO2013108368A1 (en) | Electronic component mounting device and electronic component mounting method | |
KR20190029697A (en) | Device and method for bonding alignment | |
CN114005778B (en) | Bonding system and bonding compensation method | |
CN107134419B (en) | Flip chip bonding device and bonding method thereof | |
JP2015190826A (en) | Substrate inspection device | |
CN113990790B (en) | Bonding system and bonding method | |
TW201824443A (en) | Chip positioning device comprising an absolute precision marking member, a chip attachment body, an image capturing member, an attaching member, and a positioning adjustment member | |
TW202123792A (en) | Material for positional error compensation in assembly of discrete components | |
TWI815662B (en) | Device for abutting against electronic component | |
JP4593429B2 (en) | Die bonder | |
CN111508861B (en) | Semiconductor element bonding apparatus | |
JP7463153B2 (en) | Mounting method and mounting device | |
US20180261491A1 (en) | Wafer clamp and a method of clamping a wafer | |
US20220262688A1 (en) | Adhesion device, micro device optical inspection and repairing equipment and optical inspection and repairing method | |
TW202415265A (en) | Device for abutting against electronic component | |
KR102326855B1 (en) | Laser welding device and method for semicnductor components | |
KR102172744B1 (en) | Die bonding apparatus | |
TWI810673B (en) | Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of a light-emitting diode panel | |
TWI783589B (en) | Apparatus for transferring electronic device | |
US11136202B2 (en) | Direct transfer apparatus for electronic components | |
TWI830366B (en) | Pick-and-place apparatus of micro led chip for chip-repairing of micro led display | |
WO2024018937A1 (en) | Joining method and joining apparatus |