TWI810673B - Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of a light-emitting diode panel - Google Patents

Abstract

An electronic component transfer apparatus is used to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutting element, an actuating mechanism, an energy generating device, and an optical sensing module. The first frame is used to carry the flexible carrier. The second frame is used to carry the target substrate. The abutting element is arranged adjacent to the flexible carrier. The actuating mechanism is used for actuating the abutting element to move the abutting element in the direction of the flexible carrier, so that the abutting end of the abutting element abuts against the flexible carrier. The energy generating device can generate an energy beam, the energy beam penetrates at least a portion of the abutting element, and is directed toward the flexible carrier from the abutting end of the abutting element. The optical sensing module performs sensing through the abutting element.

Description

Electronic component transfer device, electronic component transfer method, and manufacturing method of light emitting diode panel

The invention relates to an electronic component transfer device, an electronic component transfer method, and a manufacturing method of a light-emitting diode panel.

In the manufacturing process of electronic products, there are often related electronic component transfer steps. For example, in the manufacturing process of light-emitting diode display panels (LED displays), light-emitting diodes are often placed on thin-film transistor array substrates (TFT arrays) by pick-and-place apparatus. substrate), and then the light-emitting diodes on the thin film transistor array substrate are fixed and electrically connected to the thin film transistor array substrate. However, in the above-mentioned manner, if the environment or equipment vibrates slightly after the light-emitting diodes are placed on the thin-film transistor array substrate and before the light-emitting diodes are fixed on the thin-film transistor array substrate, it may Potential for misalignment of unfixed LEDs. Also, the throughput of the above method may be low.

The invention provides an electronic component transfer device and an electronic component transfer method, which can be used for transferring electronic components.

The electronic component transfer device of the present invention is used to transfer the electronic components on the flexible carrier to the target substrate. The electronic component transfer device includes a first frame, a second frame, an abutting element, an actuating mechanism, an energy generating device and an optical sensing module. The first frame is used for carrying the flexible carrier. The second frame is used for carrying the target substrate, and makes the target substrate and the flexible carrier relatively arranged. The abutting element is disposed adjacent to the flexible carrier, it is light-permeable, and has an abutting end. The actuating mechanism is used for actuating the abutting element, so that the abutting element moves toward the direction of the flexible carrier, so that the abutting end of the abutting element abuts against the flexible carrier. The energy generating device can generate an energy beam, and the energy beam passes through at least a part of the abutting element, and shoots to the flexible carrier from the abutting end of the abutting element. The optical sensing module senses through the resisting element.

The method for transferring electronic components of the present invention comprises the following steps: providing a flexible carrier with electronic components on one of its surfaces; providing a target substrate with soldering pads on one of its surfaces; making the flexible carrier The surface carrying the electronic components is arranged opposite to the surface of the target substrate with the solder pads, and at least one of the electronic components and the solder pads is provided with solder; a resisting component is provided, which is light-permeable and located at the original position , to make the abutting element leave the original position, move to the surface of the flexible carrier that does not carry electronic components, and abut against the surface, so that the flexible carrier is deformed, causing the electronic component to move to the target substrate; providing a sensing beam, Make the sensing beam reach the flexible carrier and the electronic component through the resisting element, and generate the first reflected light signal; provide the energy beam, make the energy beam pass through the resisting element, melt the solder between the electronic component and the pad, and pass The solder fixes the electronic components on the target substrate; returns the resisting components to the original position, and generates the second reflected light signal from the above-mentioned sensing beam; and compares the first reflected light signal with the second reflected light signal to confirm the electronic Whether the component is transferred to the target substrate.

The method for transferring electronic components of the present invention comprises the following steps: providing a flexible carrier with electronic components on one of its surfaces; providing a target substrate with soldering pads on one of its surfaces; making the flexible carrier The surface carrying the electronic components is arranged opposite to the surface of the target substrate with the solder pads, and at least one of the electronic components and the solder pads is provided with solder; a resisting component is provided, which is light-permeable and located at the original position , so that the abutment element leaves the original position, moves to the surface of the flexible carrier that does not carry electronic components, and pushes against the surface, so that the flexible carrier is deformed, causing the electronic component to move to the target substrate; through the abutment element Take the image of the electronic component to obtain the first image; provide the energy beam, so that the energy beam passes through the abutment component, melts the solder between the electronic component and the pad, and solders the electronic component to the target substrate through the solder; makes the top The abutment component is returned to the original position, and the image of the electronic component is captured through the abutment component to obtain a second image; and the first image and the second image are compared to confirm whether the electronic component is transferred to the target substrate.

The manufacturing method of the light-emitting diode panel of the present invention includes the following steps: using the aforementioned method for transferring electronic components, transferring the light-emitting diode wafer to the target substrate.

Based on the above, the electronic component transfer device and electronic component transfer method of the present invention can be adapted to transfer the electronic components on the flexible carrier to the target substrate.

The contents of the following examples are illustrative and not limiting. Also, descriptions of well-known devices, methods and materials may be omitted so as not to obscure the description of the various principles of the invention. Directional terms (eg, up, down, top, bottom) used herein refer only to the pictorial use or corresponding idiom and are not intended to imply absolute orientation. In addition, unless the content clearly indicates otherwise, the singular forms "a", "an", "the" or forms not expressly expressing a quantity may include one or a plurality of forms, ie, include "at least one".

In some drawings, for the sake of clarity, some elements or film layers may be enlarged, reduced or omitted. Similar components are denoted by the same reference numerals, and have similar functions, materials, or formation methods, and descriptions thereof are omitted. It will be apparent to those skilled in the art to which this invention pertains that, from the context of the embodiments and the corresponding illustrations, the invention may be practiced in other embodiments that depart from the specific details disclosed herein.

Referring to FIG. 1A , an electronic component transfer apparatus 100 suitable for transferring electronic components 720 is provided. In this embodiment, the electronic component transfer apparatus 100 can transfer the electronic component 720 from the flexible carrier 710 and solder it to the target substrate 740 (details will be described later). That is, the electronic component transfer device 100 may be called a transfer soldering device. The electronic component transfer device 100 includes a first frame 121 , a second frame 122 , a resisting element 140 , an actuating mechanism 130 , an energy generating device 111 and an optical sensing module 112 . The first frame 121 is used for carrying the flexible carrier 710 . The second frame 122 is used to carry the target substrate 740 so that the target substrate 740 and the flexible carrier 710 are disposed opposite to each other. The actuating mechanism 130 is used to actuate the abutment element 140 . The resisting element 140 is made of light-permeable material. The resisting element 140 is disposed adjacent to the flexible carrier 710 , and the actuating mechanism 130 can make the resisting element 140 move toward the resisting direction D1 of the flexible carrier 710 . Moreover, the abutting end portion 147 of the abutting element 140 can be abutted against the flexible carrier 710 , so that the electronic component 720 on the flexible carrier 710 is abutted against the target substrate 740 .

In this embodiment, the electronic component transfer apparatus 100 may further include a control system 150 . The control system 150 can be connected to the corresponding components, elements or units (such as: the first frame 121, the second frame 122, the actuator 130 , the energy generating device 111 , the optical sensing module 112 and/or the subsequent light receiving element 160 , but not limited), but the present invention is not limited thereto. In an embodiment, the control system 150 may be connected to corresponding components, elements or units by means of wireless signal transmission. That is to say, the electronic component transfer device 100 including the control system 150 and the first frame 121, the second frame 122, the actuating mechanism 130, the energy generating device 111 and the optical sensing module 112 connected thereto are the same equipment or Machine. In addition, the signal connection mentioned in the present invention can generally refer to the connection mode of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection methods to be the same or different.

In this embodiment, the control system 150 may include corresponding hardware or software.

In one embodiment, the control system 150 includes, for example, an input unit, an output unit, a computing unit and/or a storage unit. The input unit includes, for example, a keyboard, a mouse, a touch screen, a signal receiving terminal (such as a corresponding data port or an antenna) and/or other similar units suitable for data input. The output unit includes, for example, a screen, a printer, a signal output terminal (such as a corresponding data port or an antenna) and/or other similar units suitable for data output. The computing unit includes, for example, a central processing unit (Central Processing Unit; CPU), a graphics processing unit (Graphics Processing Unit), a physical processing unit (Physics Processing Unit; PPU), or other devices suitable for computing, logic judgment, signal analysis and/or data Similar units of processing. Storage units include, for example, memory, hard drives, disk arrays, databases and/or other similar units suitable for permanent or temporary data storage.

In an embodiment, the control system 150 can also be connected to the cloud system with signals. The cloud system can perform input, output, calculation, storage, monitoring, data collection, statistics and/or other appropriate controls through the control system 150 by way of remote control. The aforementioned cloud system includes, for example, an Advanced Planning and Scheduling System (APS system), a Factory Monitoring System (Facility Monitoring Control System; FMCS system) or other suitable industrial control systems (Industrial control system; ICS). , but the present invention is not limited thereto.

In one embodiment, the control system 150 includes, for example, software suitable for logic judgment or a platform (platform) and/or programmable logic controller (programmable logic controller) suitable for advanced process control (Advanced Process Control; APC). ; PLC), but the present invention is not limited thereto.

In this embodiment, the material of the first frame 121 may include metal, glass or plastic, but the invention is not limited thereto. In one embodiment, the first frame 121 may include corresponding fixing elements (such as clamps and/or clips; but not limited thereto), and may be suitable for directly and/or indirectly fixing the flexible carrier 710 . For example, the first frame 121 can indirectly fix the flexible carrier 710 through the carrier frame 123 . For another example, where the first frame 121 is in contact with the flexible carrier 710 , the flexible carrier 710 can be directly fixed by mutual friction or other suitable methods.

In one embodiment, the first frame 121 may include corresponding transmission elements (eg, rollers; but not limited thereto), so that the flexible carrier 710 may be transported along a proper direction. It should be noted that the aforementioned fixing element and the aforementioned transmission element may be the same component or different components. For example, the flexible carrier 710 can be sandwiched between two rollers, and in the state of not rotating the rollers, the flexible carrier 710 can be correspondingly fixed; while in the state of rotating the rollers, the flexible carrier 710 can Carrier 710 may be transferred accordingly.

In one embodiment, the first frame 121 may be fixed or erected on the movable unit. In this way, the first frame 121 can move and/or rotate in a corresponding direction according to design requirements. The movable unit can include movable modules commonly used in the design of movable mechanisms (such as: horizontal movement module, vertical movement module, rotation movement module or a combination of the above), which can contain corresponding hardware or software, or Incorporate accessories further. For example, the movable module may have a power supply device, a motor, a belt, a gear, and other related components, which are not limited in the present invention. The aforementioned related components include, for example, communication components, power components, etc., which are not limited in the present invention. The foregoing software includes, for example, spatial position calculation software, error recording software, communication software, etc., which are not limited in the present invention. The foregoing auxiliary components include, for example, moving rails, moving shafts, shock absorbing elements, positioning devices, etc., which are not limited in the present invention.

In this embodiment, the flexible carrier 710 may include UV tape or blue tape, but the invention is not limited thereto. In one embodiment, the carrier frame 123 may be called a blue film frame, but the invention is not limited thereto.

In one embodiment, the flexible carrier 710 may be a composite material. For example, the flexible carrier 710 may have a polymer film or ultra-thin glass covered with an adhesive layer.

In this embodiment, the actuating mechanism 130 may include movable modules commonly used in the design of movable mechanisms (such as: horizontal moving module, vertical moving module, rotating moving module or a combination of the above), which may include corresponding hardware or software, or to further combine auxiliary components. For example, the movable module may have a power supply device, a motor, a belt, a gear, and other related components, which are not limited in the present invention. The aforementioned related components include, for example, communication components, power components, etc., which are not limited in the present invention. The foregoing software includes, for example, spatial position calculation software, error recording software, communication software, etc., which are not limited in the present invention. The foregoing auxiliary components include, for example, moving rails, moving shafts, shock absorbing elements, positioning devices, etc., which are not limited in the present invention. In this way, the resisting element 140 directly or indirectly fixed to the actuating mechanism 130 can move and/or rotate in a corresponding direction according to design requirements.

In one embodiment, the resisting element 140 may be indirectly fixed to the actuating mechanism 130 , but the invention is not limited thereto. For example, the actuating mechanism 130 can be configured via common fixing parts (not shown; such as: screws, buckles, adhesives and/or corresponding threads between the two components; but not limited) and/or elastic parts (not shown). Shown; eg: O-ring (O-ring) and/or spring; but not limited to) indirectly fixes the resisting element 140 .

In this embodiment, the light source of the electronic component transfer device 100 includes an energy generating device 111 and an optical sensing module 112 . The energy generating device 111 is suitable for projecting the energy beam L1, and the optical sensing module 112 is suitable for projecting the sensing light beam L2 through its light generating element. At least a portion of the light path of the energy beam L1 is different from at least a portion of the light path of the sensing beam L2. For example, the energy beam L1 can pass through the apron 171 to strike the abutting element 140 , and the sensing beam L2 can be reflected by the apron 171 to strike the abutting element 140 . It should be noted that, for the sake of clarity, in FIG. 1A or other similar figures, the corresponding arrows schematically represent a part of the optical path of the energy beam L1 and a part of the optical path of the sensing beam L2, and the above representation is not limited. The energy, wavelength, optical path, and overall optical path of the energy beam L1 and the sensing beam L2 are projected simultaneously or asynchronously. For example, other suitable optical elements (such as: light reflection elements, lenses, filters, apertures, etc.; but not limited) may be arranged on the corresponding optical paths of each light beam.

In one embodiment, the optical sensing module 112 may include an image capturing device, but the invention is not limited thereto.

In this embodiment, the material of the resisting element 140 may be suitable for allowing the energy beam L1 and/or the sensing beam L2 to pass through. The transmittance of the energy beam L1 and/or the sensing beam L2 to the material of the resisting element 140 is, for example: greater than or equal to 50%; greater than or equal to 60%; greater than or equal to 70%; greater than or equal to 75%; greater than or equal to 80% or greater; 85% or greater; 90% or greater; 95% or greater; or 98% or greater. In one embodiment, the resisting element 140 may be made of quartz, but the invention is not limited thereto. In an embodiment, the material of the resisting element 140 may include sapphire (eg: artificial sapphire) or diamond (eg: artificial diamond). It is worth noting that the present invention does not limit the penetration rate of the energy beam L1 to the material of the resisting element 140 to be the same as that of the sensing beam L2 to the material of the resisting element 140 .

In this embodiment, the resisting element 140 can be a homogeneous material, and the aforementioned homogeneous material can no longer be detached into components by mechanical methods (such as crushing, shearing, cutting, sawing, grinding, etc.). different single materials. In other words, there may not be an interface formed by different materials, different processes (eg, adhesion) and/or different objects (eg, inserts) inside the resisting element 140 .

Further, in this embodiment, the energy beam L1 and/or the sensing beam L2 may at least partially penetrate the flexible carrier 710 . For example, the flexible carrier 710 may have a first surface 710a and a second surface 710b, the second surface 710b is opposite to the first surface 710a, the electronic component 720 is located on the second surface 710b, the energy beam L1 and/or the sensing The light beam L2 may at least partially penetrate the flexible carrier 710 from the direction from the first surface 710a to the second surface 710b.

Further, in this embodiment, the optical sensing module 112 may include a corresponding light receiving element 160 , and the flexible carrier 710 and the electronic element 720 may reflect part of the sensing light beam L2. The light receiving element 160 can detect the reflected light signal reflected from the flexible carrier 710 or the electronic component 720 .

In an embodiment, the light receiving element 160 may be disposed on the optical sensing module 112 . The light path direction of the reflected light may be substantially parallel to and/or substantially opposite to the light path direction of the sensing light beam L2 to be sensed by the light receiving element 160 . In addition, for the sake of clarity, the optical path of the reflected light is not directly shown in FIG. 1A or other similar figures.

In one embodiment, the energy beam L1 and/or the sensing beam L2 may be a laser beam. In an embodiment, the energy beam L1 and/or the sensing beam L2 may be an infrared beam (eg, a beam with a wavelength of about 1064 nanometers (nm); but not limited thereto). For example, the energy beam L1 may be an infrared laser beam.

In one embodiment, the energy beam has a different wavelength than the sensing beam. In this way, the signal-to-noise ratio (SNR or S/N) of the light receiving element 160 can be improved. For example, the energy beam can be an infrared laser beam, and the sensing beam can be a laser beam in the green range (eg, with a wavelength of about 532 nm).

In this embodiment, the second frame 122 may be opaque. The material of the second frame 122 may include metal, plastic or other materials suitable for supporting or fixing the target substrate 740 .

In one embodiment, the second frame 122 may be fixed or erected on a movable unit (not directly shown). In this way, the second frame 122 can move and/or rotate in a corresponding direction according to design requirements.

In this embodiment, the target substrate 740 may include corresponding lines, wherein the lines may include corresponding pads 741 exposed to the outside. In one embodiment, the target substrate 740 may include a rigid circuit board or a flexible circuit board, but the invention is not limited thereto. In one embodiment, the target substrate 740 may be a circuit board further including active components (such as a TFT array substrate, but not limited thereto).

In one embodiment, the pads 741 may be suitable (but not limited to necessary) for solder to be disposed thereon. Therefore, the pad 741 may also be referred to as a bonding pad.

In this embodiment, the electronic component 720 may include a die and a conductive connector 729 disposed on the die, but the invention is not limited thereto. The die may include a light emitting die (such as: a light emitting diode die; but not limited thereto) or an integrated circuit (integrated circuit; IC), but the present invention is not limited thereto. At least one kind of light beam projected by the energy generating device 111 (for example: one kind of energy beam L1 ) may be suitable for melting at least part of the conductive connection part 729 . In one embodiment, the conductive connecting member 729 includes solder, but the invention is not limited thereto.

In an unillustrated embodiment, the electronic component 720 may include a die similar to the aforementioned die, and the target substrate 740 may have a corresponding conductive connector similar to the aforementioned conductive connector 729 .

The method of transferring the electronic component 720 from the flexible carrier 710 to the target substrate 740 by the electronic component transfer apparatus 100 can be as follows. However, it should be noted that the present invention is not limited to the methods described later.

Referring to FIG. 1A , an electronic component transferring device 100 is provided. Then, the following steps are performed in any order: disposing the target substrate 740 on the second frame 122 of the electronic component transfer device 100, and disposing the flexible carrier 710 having at least one electronic component 720 disposed thereon on the first frame 121 on. Moreover, the electronic component 720 disposed on the flexible carrier 710 is arranged to face the target substrate 740 with a corresponding distance therebetween. It should be noted that, in FIG. 1A , the quantity and/or arrangement of the electronic components 720 arranged on the flexible carrier 710 are only shown for example, and are not limited in the present invention. It should be noted that in FIG. 1A , the manner in which the target substrate 740 is disposed on the second frame 122 of the electronic component transfer device 100 and/or the manner in which the flexible carrier 710 is disposed on the first frame 121 is only an example. It is illustratively shown and not limited in the present invention.

In one embodiment, after the flexible carrier 710 with at least one electronic component 720 disposed thereon and the target substrate 740 are disposed at corresponding positions, the electronic component 721 (such as : one of the electronic components 720 ) projects the energy beam L1 ; and/or can selectively project the sensing beam L2 to the electronic component 721 through the optical sensing module 112 .

In an embodiment, the energy beam L1 may include a preheating beam, but the invention is not limited thereto.

In one embodiment, the sensing beam L2 can be used for alignment or scanning.

In one embodiment, please refer to FIG. 1A and FIG. 1H at the same time. When the electronic component 721 is well disposed on the flexible carrier 710, a part of the sensing light beam L2 can be reflected by the flexible carrier 710, and A corresponding first reflected light is generated; and another part of the sensing light beam L2 can be reflected by the electronic component 721 on the flexible carrier 710 to generate a corresponding second reflected light. Therefore, as shown in FIG. 1H , the first time difference T1 between the first reflected light and the second reflected light can be analyzed through an appropriate analysis method (eg, function fitting). Moreover, the optical path difference corresponding to the aforementioned first time difference T1 may be basically the same as or close to the thickness of the flexible carrier 710 . In this way, it can be used to judge whether the electronic component 721 is properly arranged on the flexible carrier 710 . It should be noted that the optical signal intensity of the first reflected light fitting waveform and the optical signal intensity of the second reflected light fitting waveform shown in FIG. Electronic components or other possible conditions make the light signal intensity of the second reflected light fitting waveform greater than the light signal intensity of the first reflected light fitting waveform, and the present invention is not limited thereto.

In one embodiment, when the flexible carrier 710 is extremely thin (such as: the judgment method or result of the time difference is less than the detection limit), the aforementioned first time difference T1 and/or the corresponding optical path difference can be 0 or close to 0.

In an embodiment, please refer to FIG. 1A and FIG. 1J at the same time, the reflected sensing light beam L2 may form an image. As shown in FIG. 1J , under the condition that the electronic component 721 is well arranged on the flexible carrier 710, in the image formed by the sensing light beam L2 (such as: the same or similar to the image in FIG. 1J ), you can It has a flexible carrier 710 and corresponding electronic components 721 .

It is worth noting that the above-mentioned judging method is only an example, and the present invention does not limit the detection and/or corresponding judging method of the light receiving element 160 . For example, when the flexible carrier 710 and the electronic component 721 have different thicknesses, materials and/or height positions, the aforementioned first reflected light and the aforementioned second reflected light may have different optical characteristics (such as : with corresponding diffraction fringes). In this way, it can be used to judge whether the electronic component 721 is properly arranged on the flexible carrier 710 .

Referring to FIGS. 1A to 1B , the abutting element 140 of the electronic component transfer device 100 is brought closer to the flexible carrier 710 in the abutting direction D1 to further abut against the abutting end 147 of the abutting element 140 A side of the flexible carrier 710 that does not carry the electronic component 720 (eg, the first surface 710 a ).

Please refer to FIG. 1B and FIG. 1H/FIG. 1J. When the abutting element 140 abuts against the flexible carrier 710, it can be selectively determined whether the electronic component 721 is properly arranged on the flexible carrier 710 by the aforementioned method. . In one embodiment, it is possible to continuously determine whether the electronic component 721 is still on the flexible carrier 710 in the aforementioned manner until it is confirmed that the electronic component 721 has been properly arranged on the target substrate 740 .

1B to 1C, the abutment element 140 can be further abutted against the flexible carrier 710, so that the flexible carrier 710 produces a corresponding deformation (that is, the flexible carrier 710 moves toward the target substrate 740 direction bending). Moreover, an electronic component 721 corresponding to the resisting element 140 can be brought close to the target substrate 740 by means of the resisting element 140 approaching the target substrate 740 . In this way, as shown in FIG. 1D , the electronic component 721 corresponding to the resisting component 140 against the flexible carrier 710 can be made to contact the target substrate 740 .

In this embodiment, in a direction parallel to the resisting direction D1 , the resisting element 140 may be a moving part, and the first frame 121 and the second frame 122 are not moving parts, but the present invention is not limited thereto. In an unillustrated embodiment, in a direction parallel to the abutting direction D1, the first frame 121 and the second frame 122 may be moving parts, and the abutting element 140 is not a moving part. In an unillustrated embodiment, in a direction parallel to the resisting direction D1, the resisting element 140, the first frame 121 and the second frame 122 may all be moving parts.

Please refer to FIG. 1D , when the abutting element 140 abuts against the flexible carrier 710, and when and/or after the abutting element 140 contacts the corresponding electronic component 721 to the target substrate 740, the flexible The electronic component 721 on the sex carrier 710 projects the energy beam L1. The energy beam L1 may include a heating beam. The heating beam can pass through at least a part of the abutment element 140 and emit from the abutment end 147 of the abutment element 140, so that the conductive connector 729 of the electronic component 721 corresponding to the abutment element 140 is at least partially melted, and At least a portion of the melted conductive connection member 729 can contact the corresponding pad 741 on the target substrate 740 . Then, the projection of the heating beam can be stopped, and the heat can be dissipated in a suitable way (such as: by a fan or other active heat dissipation methods; or a passive heat dissipation method of standing for a period of time), so that the electronic components 721 can be soldered. on the target substrate 740 and electrically connected to corresponding lines on the target substrate 740 .

Please refer to FIG. 1D and FIG. 1H , at this time, it is possible to selectively determine whether the electronic component 721 is properly arranged on the flexible carrier 710 through the aforementioned method.

Referring to FIG. 1D and FIG. 1K , at this time, the reflected sensing light beam L2 can form an image. As shown in FIG. 1K, when the electronic component 721 is well disposed on the flexible carrier 710 and the corresponding pad 741, the image formed by the sensing light beam L2 (for example: the same or similar to FIG. 1K In the image of ), there may be an electronic component 721 and a corresponding pad 741 .

Referring to FIG. 1D to FIG. 1E , the resisting element 140 is kept away from the target substrate 740 so that the flexible carrier 710 with proper elasticity/flexibility can return to its original shape as shown in FIG. 1F . And, because after the electronic component 721 is soldered and solidified on the target substrate 740, the bonding force between the electronic component 721 and the target substrate 740 is greater than the bonding force between the electronic component 721 and the flexible carrier 710, and the soldering can be achieved. The electronic components 721 on the target substrate 740 are detached from the flexible carrier 710 . In this way, the transfer action and soldering action of the electronic component 721 can be completed through the aforementioned single steps.

Through the above exemplary manner, the electronic component 721 can be transferred from the flexible carrier 710 to the target substrate 740 by the electronic component transfer apparatus 100 .

In one embodiment, please refer to FIG. 1F and FIG. 1I at the same time. When the electronic component 721 is well transferred to the target substrate 740, a part of the sensing light beam L2 can be reflected by the flexible carrier 710 to generate a corresponding and another part of the sensing light beam L2 can be reflected by the electronic component 721 on the flexible carrier 710 to generate a corresponding fourth reflected light. Therefore, as shown in FIG. 1I , the second time difference T2 between the third reflected light and the fourth reflected light can be analyzed by an appropriate analytical method (eg, function fitting). Moreover, the optical path difference corresponding to the aforementioned second time difference T2 may be substantially the same or similar to the distance between the electronic component 721 transferred to the target substrate 740 and the flexible carrier 710 . In this way, it can be used to judge whether the electronic component 721 is well transferred to the target substrate 740 . It should be noted that the optical signal intensity of the third reflected light fitting waveform and the optical signal intensity of the fourth reflected light fitting waveform shown in FIG. Electronic components or other possible conditions, etc., make the light signal intensity of the fourth reflected light fitting waveform greater than the light signal intensity of the third reflected light fitting waveform, and the present invention is not limited thereto.

In an embodiment, please refer to FIG. 1A and FIG. 1L at the same time, the reflected sensing light beam L2 may form an image. As shown in FIG. 1L, under the condition that the electronic components 721 are well disposed on the target substrate 740, in the image formed by the sensing light beam L2 (such as: the same or similar to the image in FIG. 1L), there are originally electrons The position of the component 721 (indicated by the dotted line in FIG. 1L ) may not have a corresponding electronic component 721 . In this way, it can be confirmed whether the electronic component 721 is well transferred to the target substrate 740 by comparing the images.

It should be noted that the above-mentioned judging methods are only illustrative examples. Similar to the aforementioned method, it can be judged whether the electronic component 721 is well transferred to the target substrate 740 by corresponding optical features (eg, having corresponding diffraction fringes).

1F to 1G, if the electronic component 721 has been well transferred to the target substrate 740, the first frame 121, the second frame 122, the actuator 130, the energy generating device 111 and/or the optical sensor can be The module 112 moves in an appropriate direction (eg, a direction D2 perpendicular to the abutting direction D1 ), so as to carry out another electronic component 722 (the other one of the electronic components 720 ) in the same or similar manner as described above. transfer.

FIG. 2 is a schematic side view of a partial operation of an electronic component transfer device according to a second embodiment of the present invention. The electronic component transfer device 200 of the embodiment in FIG. 2 is similar to the electronic component transfer device 100 of the first embodiment, and its similar components are denoted by the same reference numerals, and have similar functions, materials or operation methods, and descriptions thereof are omitted.

Referring to FIG. 2 , the electronic component transfer device 200 includes a first frame 121 , a second frame 122 , an actuating mechanism 130 , an energy generating device 111 and an optical sensing module 112 . Similar to the aforementioned method, the electronic component transfer apparatus 200 can transfer the electronic component 720 from the flexible carrier 710 and be soldered to the target substrate 740 .

In this embodiment, the energy beam L1 can be directed toward the abutting element 140 through the reflection of the apron 171 , and the sensing beam L2 can penetrate the apron and be directed toward the abutting element 140 .

In this embodiment, the light receiving element 160 may be disposed on the energy generating device 111 . The reflected light (such as: the first reflected light, the second reflected light, the third reflected light or the fourth reflected light) can be sensed by the light receiving element 160 along the direction parallel and/or opposite to the light path direction of the energy beam L1. Measurement.

FIG. 3 is a schematic side view of a partial operation of an electronic component transfer device according to a third embodiment of the present invention. The electronic component transfer device 300 of the embodiment in FIG. 3 is similar to the electronic component transfer device 100 of the first embodiment, and its similar components are denoted by the same reference numerals, and have similar functions, materials or operation methods, and descriptions thereof are omitted.

Referring to FIG. 3 , the electronic component transfer device 300 includes a first frame 121 , a second frame 122 , an actuating mechanism 130 , an energy generating device 111 and an optical sensing module 112 . Similar to the aforementioned method, the electronic component transferring device 300 can transfer the electronic component 720 from the flexible carrier 710 and be soldered to the target substrate 740 .

In this embodiment, the energy beam L1 can pass through the semi-transmitting mirror 372 to be directed toward the abutting element 140 , and the sensing beam L2 can be reflected by the half-transmitting mirror 372 to be directed toward the abutting element 140 . In one embodiment, the aforementioned semi-transmissive mirror 372 is one of beam combiners.

FIG. 4 is a schematic side view of a partial operation of an electronic component transfer device according to a fourth embodiment of the present invention. The electronic component transfer device 400 of the embodiment in FIG. 4 is similar to the electronic component transfer device 100 of the first embodiment, and its similar components are denoted by the same reference numerals, and have similar functions, materials or operation methods, and descriptions thereof are omitted.

Referring to FIG. 4 , the electronic component transfer device 400 includes a first frame 121 , a second frame 122 , an actuating mechanism 130 , an energy generating device 111 and an optical sensing module 112 . Similar to the aforementioned method, the electronic component transfer apparatus 400 can transfer the electronic component 720 from the flexible carrier 710 and be soldered to the target substrate 740 .

In this embodiment, the energy beam L1 can pass through the beam L1 to strike the resisting element 140 , and the sensing beam L2 can be reflected by the beam 471 and the beam 473 to strike the resisting component 140 .

FIG. 5 is a partial side view of an electronic component transfer device 100 according to a fifth embodiment of the present invention. It should be noted that, in the operation mode of this embodiment, the electronic component transferring device 100 of the first embodiment is used as an example, but the present invention is not limited thereto.

1D to FIG. 5, in a possible situation, the electronic component 721 may not be soldered on the target substrate 740, therefore, after the flexible carrier 710 returns to its original state, the electronic component 721 may still be flexible. Carrier 710. Therefore, the first reflected light generated by the flexible carrier 710 and the second reflected light generated by the electronic component 721 or the corresponding images may not have the pattern shown in FIG. 1I or FIG. 1L .

Please refer to FIG. 5, if the electronic component 721 is not well transferred to the target substrate 740, the first frame 121, the second frame 122, the actuating mechanism 130, the energy generating device 111 and/or the energy generating device 112 can be properly positioned. direction (such as: a direction D2 perpendicular to the abutment direction D1), so that another electronic component 723 (the other one of the electronic components 720) corresponds to the original transfer position, and by the same or similar to the aforementioned way to transfer another electronic component 723 .

The method for transferring electronic components in the above embodiments can be applied to any suitable electronic device. For example, the electronic component 720 may include an LED wafer, and the above transfer method may be a part of the manufacturing process of the LED panel.

In summary, the electronic component transfer device and the electronic component transfer method of the present invention can be adapted to transfer the electronic components on the flexible carrier to the target substrate.

100, 200, 300, 400: electronic component transfer device 111: Energy generating device 112: Optical sensing module 121: First frame 122: Second frame 123: carrier frame 130: actuating mechanism 140: Resisting element 147: push against the end 150: Control system 159: Signal line 160: Light receiving element 171, 471, 473: 稜鏡 372: half mirror 710: flexible carrier 710a, 710b: surfaces 720, 721, 722, 723: electronic components 729: Conductive connector 740: target substrate 741: Pad D1: Arriving direction D2: A direction perpendicular to the pushing direction L1: energy beam L2: Sensing beam T1, T2: time difference

1A to 1G are partial side views of an electronic component transfer device according to a first embodiment of the present invention. FIG. 1H and FIG. 1I are schematic diagrams of timing sequences of some sensing signals of an optical sensing module of an electronic device transfer device according to an embodiment of the present invention. 1J to 1L are schematic diagrams of partial sensing images of an optical sensing module of an electronic component transfer device according to an embodiment of the present invention. FIG. 2 is a schematic side view of a partial operation of an electronic component transfer device according to a second embodiment of the present invention. FIG. 3 is a schematic side view of a partial operation of an electronic component transfer device according to a third embodiment of the present invention. FIG. 4 is a schematic side view of a partial operation of an electronic component transfer device according to a fourth embodiment of the present invention. FIG. 5 is a schematic side view of a partial operation of an electronic component transfer device according to a fifth embodiment of the present invention.

100: Electronic component transfer device

111: Energy generating device

112: Optical sensing module

121: First frame

122: Second frame

123: carrier frame

130: actuating mechanism

140: Resisting element

147: push against the end

150: Control system

159: Signal line

160: Light receiving element

171: 稜鏡

710: flexible carrier

710a: first surface

710b: second surface

720, 721: Electronic components

729: Conductive connector

740: target substrate

741: Pad

D1: Arriving direction

L1: energy beam

L2: Sensing beam

Claims (9)

An electronic component transfer device is used to transfer an electronic component on a flexible carrier to a target substrate, comprising: a first frame, which is used to carry the flexible carrier; a second frame, which is used to carry the target substrate, and make the target substrate and the flexible carrier relatively arranged; an abutting element disposed adjacent to the flexible carrier, which is light-transmissive and has an abutting end; an actuating mechanism, which is used to actuate the abutting element, so that the abutting element moves toward the direction of the flexible carrier, so that the abutting end of the abutting element abuts against the flexible carrier; An energy generating device capable of generating an energy beam that passes through at least a part of the abutting element and is directed toward the flexible carrier from the abutting end of the abutting element; and An optical sensing module is used for sensing through the resisting element. The electronic component transfer device as claimed in claim 1, wherein the energy generating device is a laser generating device, and the energy beam generated by the laser generating device is a laser beam. The electronic component transfer device as claimed in item 1, wherein the optical sensing module includes a light generating element and a light receiving element, the light generating element can project a sensing light beam, and the sensing light beam is transmitted through the top At least a part of the abutting element is irradiated from the abutting end of the abutting element to the flexible carrier, and the light receiving element can receive the reflected light signal generated after the sensing light beam is projected. The electronic component transferring device as claimed in claim 1, wherein the optical sensing module is an image capturing device, which captures an image through the resisting component. A method for transferring electronic components, comprising: providing a flexible carrier on which an electronic component is carried on one surface; providing a target substrate with a solder pad on one of its surfaces; The surface of the flexible carrier carrying the electronic component is arranged opposite to the surface of the target substrate provided with the pad, and at least one of the electronic component and the pad is provided with a solder; Provide a resisting element, which is light-permeable, and located at an original position, so that the resisting element moves away from the original position, moves to a surface of the flexible carrier that does not carry electronic components, and abuts against the surface , causing the flexible carrier to deform, causing the electronic component to move toward the target substrate; providing a sensing beam so that the sensing beam reaches the flexible carrier and the electronic component through the resisting element to generate a first reflected light signal; providing an energy beam, causing the energy beam to pass through the resisting element, melting the solder between the electronic component and the pad, and soldering the electronic component on the target substrate by the solder; return the resisting element to the original position, and generate a second reflected light signal from the sensing light beam; and comparing the first reflected light signal with the second reflected light signal to confirm whether the electronic component is transferred to the target substrate. The method for transferring electronic components as claimed in claim 5, wherein the sensing light beam is continuously provided from when the resisting component is located at the original position to when it returns to the original position. The electronic component transfer method as described in claim 5, wherein the sensing light beam is provided at any time when the resisting component is located at the original position and resists the electronic component to the pad on the target substrate, and then The resisting element is provided when returning to the original position. A method for transferring electronic components, comprising: providing a flexible carrier on which an electronic component is carried on one surface; providing a target substrate with a solder pad on one of its surfaces; The surface of the flexible carrier carrying the electronic component is arranged opposite to the surface of the target substrate provided with the pad, and at least one of the electronic component and the pad is provided with a solder; Provide a resisting element, which is light-permeable, and located at an original position, so that the resisting element moves away from the original position, moves to a surface of the flexible carrier that does not carry electronic components, and abuts against the surface , causing the flexible carrier to deform, causing the electronic component to move toward the target substrate; capturing an image of the electronic component through the resisting component to obtain a first image; providing an energy beam, making the energy beam pass through the resisting element, melting the solder between the electronic component and the pad, and soldering the electronic component on the target substrate by the solder; return the resisting element to the original position, and capture the image of the electronic component through the resisting element to obtain a second image; and Comparing the first image and the second image to confirm whether the electronic component is transferred to the target substrate. A method for manufacturing a light-emitting diode panel, which includes using the electronic component transfer method described in any one of Claims 5 to 8 to transfer a light-emitting diode wafer to a target substrate.

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