TW201727241A - Probe card capable of replacing daughter board and method of using thereof applicable to high frequency testing - Google Patents

Abstract

A probe card includes a mother board, an intermediate body, a daughter board installed above a daughter board corresponding zone of the mother board with electronic components, and a probe head installed with probe needles. Wherein the upper surface of the mother board has electrical connections that divides a first test zone, a second test zone located between the corresponding zone towards the daughter board and the first test zone, and an intermediate body connection zone located inside the daughter board corresponding zone; the electrical connections include a first test connection, a second test connection, and an intermediate connection located respectively in the aforementioned zones; the lower surface of the daughter board is installed with an intermediate connection, and the intermediate body connects the intermediate connections of the mother board and the daughter board; a portion of the first, second test connections and the probe needles are electrically connected to the daughter board, and each probe needle is electrically connected to the first or second test connection. Accordingly, the probe card meets the requirement of high frequency testing, and is able to replace a daughter board whenever a different test is needed, thereby saving cost.

Description

Replaceable daughter board probe card and method of use thereof

The present invention relates to probe cards, and more particularly to a probe card for a replaceable daughter board and method of use thereof.

Please refer to the Chinese Patent No. 577988. The probe card provided by the patent mainly comprises a mother board, a probe head disposed on the bottom surface of the motherboard and having a probe, and a daughter board disposed on the top surface of the motherboard. The top surface of the motherboard is provided with a plurality of test contacts for electrically connecting to the test, and the processing circuit formed by the internal circuits of the motherboard and the daughter board and the electronic components disposed on the motherboard and the daughter board. The test contacts are electrically connected to the probes, respectively. The probe card is mainly used for the electronic component of at least part of the processing circuit to be disposed on the daughter board, so as to solve the problem that the probe card of the daughterless board is insufficient for the test contact and the processing circuit.

As the operating conditions of electronic components of electronic products become higher and higher, the performance requirements of probe cards become higher and higher, and the probe card must be able to efficiently transmit high-frequency test signals between the tested electronic components and the tester. In order to accurately reflect the test results. However, the conventional probe card having the sub- and mother boards does not have a design that meets the requirements for high-frequency testing, and therefore needs to be improved.

In view of the above-mentioned deficiencies, the main object of the present invention is to provide a probe card with a replaceable daughter board that meets the requirements of high frequency testing.

To achieve the above object, the probe card of the replaceable daughter board provided by the present invention comprises a mother board, a daughter board, at least one intermediate body, and a probe head. The motherboard has an upper surface and a lower surface facing in opposite directions, a plurality of electrical contacts disposed on the upper surface, a sub-plate corresponding region, and a probe region located in a corresponding region of the sub-board, the electric The sexual contact distinguishes the upper surface of the motherboard from a first test area adjacent to a peripheral edge of the motherboard, at least a second test area between the corresponding area of the sub-board and the first test area, and is located at the sub-test At least one intermediate connection area in the corresponding area of the board, the electrical contact of the motherboard includes a plurality of first test contacts located in the first test area, and a plurality of second test contacts located in the second test area. And a plurality of intermediaries connection points located in the interposer connection area. The sub-board is provided with at least one electronic component, the sub-board has an upper surface and a lower surface facing in opposite directions, and the lower surface of the sub-board has at least one intermediate connection area, and the intermediate connection area of the sub-board is provided with plural Intermediary connection point. The interposer connects the interposer connection point of the motherboard and the interposer connection point of the sub-board such that the sub-board is disposed with the lower surface facing the upper surface of the motherboard and corresponding to the corresponding area of the sub-board. A portion of the first test contact and the second test contact are electrically connected to the intermediate connection point of the motherboard and electrically connected to the sub-board through the interposer. The probe head is disposed on a lower surface of the motherboard, and the probe head is provided with a plurality of probes corresponding to the probe area, and the probes are connected to the first test contacts and the second test At least one of the points is electrically connected, and a part of the probe is electrically connected to the sub-board through the motherboard and the interposer.

Thereby, a part of the first test contact and the second test contact can transmit the test signal to the daughter board first, so that the test signal is processed by the electronic component on the daughter board and then transmitted to the probe; And the other part of the first test contact and the second test contact can transmit the test signal directly to the probe without the sub-board, and the signal transmission path without the sub-board is short, and the test signal can be made. It is subject to less electromagnetic interference and is therefore suitable for transmitting high frequency signals. In addition, the second test contacts are closer to the daughter board and the probes than the first test contacts, so the signal transmission path via the second test contact is also shorter, especially the unconnected The second test contact of the board electrical connection can meet the high frequency test requirements.

Preferably, the second test zone and the interposer connection zone of the motherboard may surround the probe zone together. For example, the motherboard may have a plurality of the second test zone and a plurality of the mediator connection zones, and each of the mediator connection zones is located between the second test zones. Thereby, the second test area and the probe area are separated from each other by the intermediary connection, so that the second test contact is closer to the daughter board and the probe, thereby shortening the signal transmission path, and the probe can even directly The electrical contact soldered to the lower surface of the motherboard corresponds to the electrical contact of the second test zone, and is not affected by the electrical contact of the lower surface of the motherboard corresponding to the connection region of the intermediate body, and does not increase the complexity of the needle. Degree, the signal transmission path can be shortened.

More preferably, the mother board may have two second test areas on opposite sides of the probe area, and two intermediate connection areas on the other opposite sides of the probe area, the mother board being capable of defining Forming a first imaginary line substantially passing through the center of each of the second test zones and a second imaginary line substantially perpendicular to the first imaginary line, the second imaginary line substantially passing through the intermediary of the motherboard The center of the body connection zone; in other words, the center position of the adjacent second test zone and the intermediate body connection zone is about 90 degrees apart. The design makes the electrical contacts of the motherboard more compact, which not only improves space utilization. Sex, and can reduce the complexity of the needle. In addition, the motherboard may have an intermediate region separating the second test zone and the intermediate connection zone from the first test; the design is such that the electrical contacts of the motherboard are more compact and reduced. The needle is complex and can be provided with electronic components or other electrical contacts in the intermediate zone.

Preferably, the daughter board can have an electronic component area corresponding to the probe area, and a plurality of the intermediate body connection area located at the periphery of the electronic component area, and the at least one electronic component is disposed in the electronic component area. The mother board has a plurality of the intermediate body connection areas located at the periphery of the probe area, and the intermediate body connection area of the daughter board is respectively connected to the intermediate body connection area of the mother board by a plurality of the intermediate bodies. Thereby, the interposer connection region of the sub-board is separated from the electronic component and located at the periphery of the electronic component region, so that the distribution of the interposer connection point and the electronic component of the sub-board is more concise, and an external portion is required between the sub-boards. Jumpers can be more concise and systematic. In other words, the upper surface of the sub-board may be, but not limited to, provided with a plurality of electrical contacts, the electrical contact locations corresponding to the interposer connection regions of the sub-boards and respectively connected to the interposer of the sub-board The connection is made to electrically connect the intermediate connection points to the electronic components by providing external jumpers between the electrical contacts on the surface of the daughterboard and the electronic components.

Preferably, the number of first test contacts electrically connected to the interposer connection point is greater than the number of second test contacts electrically connected to the interposer connection point. The design is such that a greater number of signal transmission paths through the daughter board are located in the first test area, so that the first test area mainly transmits medium and low frequency signals and the second test area mainly transmits high frequency signals.

Preferably, the second test contact that is not electrically connected to the daughter board occupies a proportion of all the second test contacts higher than the first test contact that is not electrically connected to the daughter board. The proportion of a test contact. The design is such that the ratio of the shorter signal transmission path of the second test area is greater than the ratio of the shorter signal transmission path of the first test area, so that the probe card has a relatively short number of signal transmission paths to further To meet the needs of high frequency testing.

Preferably, the motherboard may have a light transmission hole below the probe region, and the daughter plate has a position corresponding to the light transmission hole above the light transmission hole. Thereby, the probe card can be applied to a detection operation of an image sensing element such as a CIS (CMOS image sensor) or other photoelectric element.

Preferably, the interposer can be one of a circuit board having an elastic thimble, a connecting plate having a plurality of elastic members, and an anisotropic conductive adhesive.

By using the following method, the probe card of the replaceable daughter board provided by the invention can replace the daughter board with different test requirements, thereby saving cost.

The method for using the probe card of the replaceable daughterboard provided by the present invention comprises the following steps:

a) using the probe card to test a first test object;

b) preparing another sub-board suitable for testing a second object to be tested;

c) remove the daughter board of the probe card;

d) mounting the other daughter board to the probe card;

e) testing the second analyte using a probe card provided with the other daughter board.

In addition, depending on the use requirements, it is more, but not limited to, to replace the probe head with another probe head suitable for testing the second analyte before the step e).

Therefore, the sub-board of the probe card can be replaced with a sub-board suitable for the object to be tested, or the probe head of the probe card can be replaced with a probe head suitable for the object to be tested, and other parts. Different test objects can be tested without replacement, which saves the cost of purchasing different probe cards for different objects to be tested.

Preferably, in the step a) and the step e), the frequency of a test signal and the test signal are selectively selected as a single-ended signal or a differential signal. The test signal is transmitted to the first test zone or the second test zone.

Preferably, when the test signal is a high frequency signal or a differential signal, the test signal is transmitted to the second test area.

The detailed construction, features, assembly or use of the probe card relating to the replaceable daughter board provided by the present invention and its method of use will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below.

Referring to FIG. 1 to FIG. 4, the probe card 10 of the replaceable daughter board according to the first preferred embodiment of the present invention includes a motherboard 20, a daughter board 30, two interposers 40, and a probe. Needle 50.

The motherboard 20 is a circuit board having an upper surface 21 and a lower surface 22 facing in opposite directions, and a plurality of electrical contacts 23, 24, 25 disposed on the upper surface 21. The motherboard 20 has a sub-board corresponding region 26 corresponding to the shape of the sub-board 30, and a probe region 27 located in the corresponding region 26 of the sub-board and located substantially in the center of the motherboard 20, according to the electrical connection The position of the points 23, 24, 25, the upper surface 21 of the motherboard 20 can distinguish a first test area 211 (with electrical contacts 23) adjacent to the periphery 28 of the motherboard 20 and is annular, located at Two second test areas 212 (with electrical contacts 24) between the sub-board corresponding area 26 and the first test area 211, and two inter-body connection areas 213 located in the corresponding area 26 of the sub-board The electrical contact 25), and an intermediate portion 214 separating the second test area 212 and the intermediate connection area 213 from the first test area 211, the intermediate area 214 may be an annular intermediate ring. The width of the annular intermediate portion 214 is greater than the distance between the two electrical contacts 23 or the two electrical contacts 24. In other words, the electrical contacts of the motherboard 20 include a plurality of first test contacts 23 located in the first test area 211 and a plurality of second test areas located in the second test areas 212. Point 24, and a plurality of interposer connection points 25 for electrically connecting to the daughter board 30 are located at the intermediate body connection regions 213.

The daughter board 30 is a circuit board having an upper surface 31 and a lower surface 32 facing in opposite directions. Referring to FIG. 5, the lower surface 32 of the sub-board 30 has two interposer connection regions 322, and the shape and position of the two inter-body connection regions 322 correspond to the inter-body connection region 213 of the motherboard 20, and the sub-interface The interposer connection region 322 of the board 30 is provided with a plurality of interposer connection points 324 corresponding to the number and location of the interposer connection points 25 of the motherboard 20.

The two interposers 40 are respectively disposed between the two interposer connection regions 213 of the motherboard 20 and the two interposer connection regions 322 of the sub-board 30, and the two interposers 40 are connected to the motherboard 20 The interposer connection point 25 and the interposer connection point 324 of the sub-board 30 are disposed such that the sub-board 30 is disposed above the motherboard 20 with its lower surface 32 facing the upper surface 21 of the motherboard 20, and the sub-board The position of 30 corresponds to the sub-board corresponding area 26. Only one of the interposers 40, that is, the interposer 40 disposed on the left interposer connecting region 213 in Fig. 4, is shown in Fig. 2, and the other interposing body 40 is disposed on the right side in Fig. 4 The interposer connection area 213 is not shown in the drawing.

For example, each of the interposers 40 can be a circuit board provided with an elastic thimble on the upper and lower surfaces. As shown in FIG. 6, the electrical contact 41 on the upper surface of the circuit board of the interposer 40 extends with an elastic thimble 41a, and the electrical contact 42 of the lower surface extends with an elastic thimble 42a, and through the internal wiring of the circuit board. (not shown), the elastic thimble 42a is electrically connected to the elastic thimble 41a. When the interposer 40 is installed, the elastic thimble 41a on the surface of the circuit board electrically connects the intermediate connection point 324 of the sub-board 30, and the elastic ejector pin 42a on the lower surface of the circuit board electrically connects the female The interposer of the board is connected to the point 25, and the daughter board 30 is locked to the motherboard 20 by a plurality of screws (not shown), so that the intermediate connection point 25 of the motherboard 20 will pass through the intermediary. The body 40 is electrically connected to the sub-board 30. It should be noted that the manner in which the daughter board 30 is mechanically fixed to the motherboard 30 is not limited to the use of a locking member such as a screw, and may be achieved, for example, by using a clip, a press-fit, an adhesive, or the like.

Next, as shown in FIG. 7, each of the intermediate bodies 40 may be a connecting plate having a plurality of elastic members 44 (for example, elastic conductive pins), so that the upper and lower ends of the elastic members 44 are respectively The interposer connection point 324 of the sub-board 30 and the interposer connection point 25 of the motherboard 20 are electrically connected to the sub-board 30.

Furthermore, as shown in FIG. 8, each of the interposers 40 may also be an anisotropic conductive film (ACF), and the interposers of the motherboard 20 are connected by the conductive particles 46 therein. Point 25 is electrically connected to the sub-board 30. In this case, the sub-board 30 can be directly fixed to the mother board 20 by the anisotropic conductive paste without using a locking member such as a screw or a clip.

As shown in FIG. 2 and FIG. 3, a part of the first test contact 23 and the second test contact 24 are connected to the intermediate body of the motherboard 20 by the internal circuit of the motherboard 20. (not shown in the second and third figures to simplify the drawing) is electrically connected, and is electrically connected to the sub-board 30 through the interposer 40. In other words, the remaining first test contact 23 and second test contact 24 are not electrically connected to the interposer 40 and the sub-board 30. In detail, as shown in FIGS. 1 and 3, some of the second test contacts 24 can be electrically connected to the motherboard 20 through the line 20a inside the motherboard 20 (see FIG. 1). The body is connected to the point 25 and electrically connected to the sub-board 30 through the interposer 40.

As shown in FIG. 1, the sub-board 30 has an electronic component area 33 corresponding to the probe area 27, and at least one electronic component 34 (such as a resistor, an inductor, a capacitor, a relay, etc.) disposed in the electronic component area 33. The electronic component 34 is used to adjust and process the signal transmitted to the daughter board 30. In this embodiment, the sub-board 30 is provided with six electronic components 34, and the electronic components 34 are located on the upper surface 31. However, the number of the electronic components 34 of the sub-board 30 is not limited and may be set under the Surface 32. In fact, the motherboard 20 may also be provided with electronic components (not shown) for adjusting and processing signals, such as, but not limited to, being disposed in the intermediate region 214.

As shown in FIG. 2 and FIG. 3, the probe head 50 includes a probe holder 52 fixed to the lower surface 22 of the motherboard 20, and a plurality of probes 54 disposed on the probe holder 52. The articles belong to the prior art and are not described in detail by the applicant. The positions of the probes 54 correspond to the probe regions 27, and the probes 54 are soldered to electrical contacts (not shown) of the lower surface 22 of the motherboard 20, and the motherboard is supported by the motherboard. The internal circuit of 20 or the intermediate body 40 and the sub-board 30 are electrically connected to at least one of the first and second test contacts 23, 24. The first and second test contacts 23 and 24 are electrically connected to a test machine (not shown) for transmitting the test signal sent by the test machine to the probe 54 for transmission to the object to be tested ( The signal is not shown in the figure, and the signal of the reaction test result is transmitted back to the test machine. The following will describe the function of the present invention only by transmitting a test signal to the probe by the test machine, and the signals transmitted from the test object to the test machine are similar, and the details are not repeated.

In other words, the probes 54 are electrically connected to the first test contact 23 or the second test contact 24 to receive the test signal transmitted by the first test contact 23 or the second test contact 24. However, only a portion of the probes 54 are electrically connected to the sub-board 30 through the motherboard 20 and the interposer 40 to receive test signals adjusted and processed by the electronic components 34 of the sub-board 30. The probe 54 is not electrically connected to the interposer 40 and the daughter board 30 to receive test signals that are not adjusted and processed by the electronic component 34 of the daughter board 30.

For example, the electronic component 34 of the daughter board 30 can include a relay that can selectively transmit test signals to one of the two or more probes 54 and can selectively receive a probe 54. One of two or more test signals. The electronic component 34 of the daughter board 30 can include resistors, inductors, capacitors, etc., to achieve voltage regulation, filtering, AC couple or other electrical functions, space, path or signal conversion, and the like.

As shown in FIG. 2, in the signal transmission path (also referred to as the signal transmission path of the first test area 211) passing through the first test contact 23, the signal transmission path 61 without the sub-board 30 is generally more meticulous. The signal transmission path 62 of the board 30 is shorter. As shown in FIG. 3, in the signal transmission path (also referred to as the signal transmission path of the second test area 212) passing through the second test contact 24, the signal transmission path 63 without the sub-board 30 is generally more meticulous. The signal transmission path 64 of the board 30 is shorter. In addition, the second test contacts 24 are closer to the daughter board 30 and the probes 54 than the first test contacts 23, so the signal transmission path of the second test area 212 may be shorter. The shorter the signal transmission path, the less electromagnetic interference the test signal is subjected to, and the more suitable it is to transmit high frequency signals (for example, signals from 1 GHz to 5 GHz). Therefore, the probe card 10 of the present invention can transmit medium and low frequency signals on a longer signal transmission path and transmit high frequency signals on a shorter signal transmission path, especially without the second test area 212 of the sub-board 30. The signal transmission path 63 is more compatible with high frequency testing requirements. The signal transmission paths 61, 62, 63, 64 in FIGS. 2 and 3 are not drawn according to actual conditions, but are illustrated by simple lines for explanation; wherein the signal transmission path 64 of FIG. 3 actually has After passing through the interposer 40, the interposer 40 is not located on the cross section shown in FIG.

In the motherboard 20 of the probe card 10 of the present invention, the number of the first test contacts 23 (such as the signal transmission path 62 passing through FIG. 2) electrically connected to the interposer connection point 25 may be greater than the interposer. The number of second test contacts 24 (such as the signal transmission path 64 passer in FIG. 3) to which the connection point 25 is electrically connected. The design is such that a greater number of signal transmission paths through the sub-board 30 are located in the first test area 211, so that the first test area 211 is mainly (but not limited to) transmitting medium and low frequency signals, and the second test area 212 is mainly (but not limited to) transmitting high frequency signals.

In the motherboard 20 of the probe card 10 of the present invention, the second test contact 24 (such as the signal transmission path 63 passing through FIG. 3) that is not electrically connected to the daughter board 30 is in all the second test contacts. The proportion of 24 may be higher than the first test contact 23 (such as the signal transmission path 61 passing through FIG. 2) that is not electrically connected to the sub-board 30, and is occupied by all the first test contacts 23. The ratio. The design allows the ratio of the shorter signal transmission paths of the second test area 212 to be larger than the ratio of the shorter signal transmission paths of the first test area 211, so that the probe card 10 has a relatively small number of extremely short signal transmission paths. (ie, without the signal transmission path of the second test area 212 of the sub-board 30), it is more in line with the high frequency test requirements.

In this embodiment, the second test area 212 and the interposer connection area 213 of the motherboard 20 are alternately annularly surrounding the probe area 27, and the second test area 212 and the interposer connection area 213 are staggered. That is, each of the interposer connection regions 213 is located between the second test regions 212 and is located in the periphery of an imaginary inner circumference. The design is such that each of the second test regions 212 and the probe region 27 is not separated by the interposer connection region 213, so that the second test contact 24 is closer to the sub-board 30 and the probe 54, thus shortening the signal transmission path, and the probe 54 can be directly soldered to the motherboard 20 The lower surface position corresponds to the electrical contact of the second test area 212 (not shown), and is not affected by the electrical contact of the lower surface of the motherboard 20 corresponding to the intermediate connection area 213 (not shown) The impact will not increase the complexity of the needle, but also shorten the signal transmission path.

In this embodiment, the two second test areas 212 of the motherboard 20 are located on opposite sides of the probe area 27 (upper side and lower side in FIG. 4), and the two interposers of the motherboard 20 The connection area 213 is located on the other opposite side of the probe area 27 (left side and right side in FIG. 4), and the planar direction of the mother board 20 can define a substantially through the center of each of the second test areas 212. An imaginary line L1 and a second imaginary line L2 substantially perpendicular to the first imaginary line L1, and the second imaginary line L2 substantially passes through the center of each of the intermediate body connection regions 213 of the motherboard 20, in other words, The adjacent second test zone 213 is approximately 90 degrees out of center with the intermediate connection zone 213. The design makes the electrical contacts of the motherboard 20 more compact, which not only improves space utilization, but also reduces the complexity of the needle.

However, as shown in FIG. 9, a second preferred embodiment of the present invention, and a third preferred embodiment of the present invention shown in FIG. 10, the second test area 212 of the motherboard 20 and the interposer are connected. The area 213 may not surround the probe area 27, and the second test area 212 and the intermediate connection area 213 of the motherboard 20 are not limited to two, and each may have only one or two or more. It is not limited to staggered settings. In addition, the motherboard 20 may not have the intermediate portion 214 as described above, but the intermediate portion 214 is designed to make the electrical contacts of the motherboard 20 more compact, reduce the complexity of the needle, and be available for electronics. Elements or other electrical contacts are provided in the intermediate region 214.

The interposer 40 and the interposer connection region 322 of the sub-board 30 are adjusted in the same number and position as the inter-body connection region 213 of the motherboard 20 described above. In the foregoing first preferred embodiment, the motherboard 20 has a plurality of the intermediate connection regions 213 located at the periphery of the probe region 27, and the daughter board 30 correspondingly has a plurality of the periphery of the electronic component region 33. The interposer connection region 322, the interposer connection region 322 of the sub-board 30 is connected to the interposer connection region 213 of the motherboard 20 by a plurality of the interposers 40, respectively. Thereby, the interposer connection region 322 of the sub-board 30 is separated from the electronic component region 33 and located at the periphery of the electronic component region 33, and the second test region 212 and the interposer connection region 322 are also alternately ring-shaped around the electronic component region 33. The distribution of the interposer connection point 324 and the electronic component 34 of the sub-board 30 can be made simpler, and an external jumper can be provided between the two, which can be more compact and systematic, or even no external jumper. In other words, the upper surface 31 of the sub-board 30 can be, but is not limited to, provided with a plurality of electrical contacts 312 (as shown in FIG. 1 ). The positions of the electrical contacts 312 correspond to the inter-body connections of the sub-board 30 . The regions 322 are electrically connected to the interposer connection points 324 of the sub-board 30 respectively to enable the intervening by providing external jumpers between the electrical contacts 312 on the upper surface of the sub-board 30 and the electronic components 34. The body connection point 324 is electrically connected to the electronic component 34. However, the electronic components 34 can also be electrically connected to the interposer connection point 324 by internal wiring of the sub-board 30 without external jumpers.

As shown in Figures 11 and 12, a fourth preferred embodiment of the present invention, the motherboard 20 can have a probe area 27 (position corresponding to the electronic component region 33 of the daughter board 30). The light hole 29 has a position corresponding to the light transmission hole 35 above the light transmission hole 29. Thereby, the probe card can be applied to the detection operation of an image sensing component such as a CIS (CMOS image sensor) or other photoelectric components; that is, the probe card can transmit light through the upper and lower sides during the detection operation. The light holes 35, 29 are irradiated to the object to be tested, so that the light is received by the object to be tested, converted into an electrical signal, and then transmitted back to the testing machine to measure whether the signal of the object to be tested receives the light source.

In addition to the aforementioned advantages, the probe card of the present invention can be applied to different inspection operations by the following methods of use, thereby saving costs.

The method for using the probe card of the replaceable daughter board provided by the present invention comprises the following steps:

a) Using the probe card 10 to test a first test object (not shown). That is, the probe 54 is used to touch the electrical contact of the first object to be tested, and the test signal sent by the test machine is transmitted to the first object to be tested, and the signal of the reaction test result is transmitted back to the test machine.

b) Prepare another sub-board (not shown) for testing a second object (not shown). The structure of the other sub-board is similar to that of the original sub-board 30, but different electronic components are provided for the signal processing required for the second object to be tested. This step can also be performed before step a).

c) Remove the daughter board 30 of the probe card 10. For the installation and removal of the sub-board 30, the technical means commonly used in general machinery can be used. For example, reference may be made to the Chinese Patent No. 577988 described in the prior art, which is hereby incorporated by reference.

d) Mounting the other daughter board to the probe card 10. That is, steps c) and d) replace the daughter boards of the probe card 10.

e) testing the second object to be tested using the probe card 10 provided with the other daughter board. That is, the probe 54 is used to touch the electrical contact of the second test object to transmit the test signal sent by the test machine to the second test object, and then the signal of the reaction test result is transmitted back to the test machine.

In addition, depending on the use requirements, it is more (but not limited to) to replace the probe head 50 with another probe head suitable for testing the second analyte before the step e).

Therefore, the sub-board of the probe card can be replaced with a sub-board suitable for the object to be tested, or the probe head of the probe card can be replaced with a probe head suitable for the object to be tested, and other parts. Different test objects can be tested without replacement, which saves the cost of purchasing different probe cards for different objects to be tested. For example, for different wafers of different generations, models or styles of LCD drivers, if the position or function of the wafer is not much different, the same motherboard can be used with different styles of sub-boards to test different models. The wafer to be tested can save a lot of cost due to the reuse of the motherboard.

In addition, in the step a) and the step e), the test may be selectively performed according to the frequency of a test signal and the test signal being a single-ended signal or a differential signal. The signal is transmitted to the first test zone 211 or the second test zone 212. Preferably, when the test signal is a high frequency signal or a differential signal, the test signal is transmitted to the second test area 212, and the better way is to use the signal transmission path 63 as shown in FIG. The test signal is transmitted directly from the motherboard 20 to the probe 54 without passing through the daughter board 30, so that the signal attenuation is minimized due to the short signal transmission path.

Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. It is to be noted that, in addition, in the method embodiment, if the implementation is possible, the steps may not be in a sequential relationship, and may be performed in whole or in part simultaneously.

10‧‧‧ probe card
20‧‧‧ Motherboard
20a‧‧‧ lines
21‧‧‧ upper surface
211‧‧‧First test area
212‧‧‧Second test area
213‧‧‧Intermediate connection area
214‧‧‧Intermediate area
22‧‧‧ Lower surface
23‧‧‧Electrical contacts (first test contact)
24‧‧‧Electrical contact (second test contact)
25‧‧‧Electrical contacts (intermediate connection points)
26‧‧‧Sub-corresponding area
27‧‧‧ probe area
28‧‧‧Weekly
29‧‧‧low light hole
30‧‧‧Slate board
31‧‧‧ upper surface
312‧‧‧Electrical contacts
32‧‧‧ lower surface
322‧‧‧Intermediary connection area
324‧‧‧Intermediary connection points
33‧‧‧Electronic component area
34‧‧‧Electronic components
35‧‧‧Upper light hole
40‧‧‧Intermediary
41, 42‧‧‧Electrical contacts
41a, 42a‧‧‧elastic thimble
44‧‧‧Flexible parts
46‧‧‧Electrical particles
50‧‧‧ probe head
52‧‧‧ probe base
54‧‧‧Probe
61, 62, 63, 64‧‧‧ signal transmission path
L1‧‧‧ first imaginary straight line
L2‧‧‧Second imaginary straight line

1 is a top plan view of a probe card of a replaceable daughter board according to a first preferred embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line 2-2 of Fig. 1. Fig. 3 is a cross-sectional view taken along line 3-3 of Fig. 1. 4 is a top plan view of one of the motherboards of the probe card of the replaceable daughter board according to the first preferred embodiment of the present invention. Figure 5 is a bottom plan view of one of the daughter card of the replaceable daughter board of the first preferred embodiment of the present invention. 6-8 are schematic cross-sectional views showing an intermediary of a probe card of a replaceable daughterboard according to the first preferred embodiment of the present invention, showing an intermediary of three different aspects. Figure 9 is a top plan view of a motherboard of a probe card of a replaceable daughter board according to a second preferred embodiment of the present invention. Figure 10 is a top plan view of a motherboard of a probe card of a replaceable daughter board according to a third preferred embodiment of the present invention. Figure 11 is a top plan view of a probe card of a replaceable daughter board according to a fourth preferred embodiment of the present invention. Figure 12 is a cross-sectional view taken along line 12-12 of Figure 11.

10‧‧‧ probe card

20‧‧‧ Motherboard

20a‧‧‧ lines

21‧‧‧ upper surface

211‧‧‧First test area

212‧‧‧Second test area

214‧‧‧Intermediate area

23‧‧‧Electrical contacts (first test contact)

24‧‧‧Electrical contact (second test contact)

28‧‧‧Weekly

30‧‧‧Slate board

31‧‧‧ upper surface

312‧‧‧Electrical contacts

33‧‧‧Electronic component area

34‧‧‧Electronic components

Claims (16)

A probe card for a replaceable daughter board, comprising: a mother board having an upper surface and a lower surface facing in opposite directions, a plurality of electrical contacts disposed on the upper surface, a corresponding area of a sub-board, and a The sub-board corresponds to a probe area in the area, and the electrical contacts distinguish the upper surface of the motherboard from a first test area adjacent to a peripheral edge of the motherboard, and are located in the corresponding area of the sub-board and the first test area. At least one second test area between the two, and at least one intermediate connection area located in the corresponding area of the daughter board, the electrical contact of the motherboard includes a plurality of first test contacts located in the first test area, a plurality of second test contacts located in the second test zone, and a plurality of intermediate connection points located in the intermediate connection zone; a daughter board provided with at least one electronic component having an upper surface facing in an opposite direction And a surface of the sub-board having at least one interposer connection region, the inter-body connection region of the sub-board is provided with a plurality of inter-body connection points; at least one interposer is connected to the inter-body connection point of the motherboard Intermediary connection of the daughter board a point such that the sub-board is disposed above the motherboard with its lower surface facing the upper surface of the motherboard and corresponding to the corresponding area of the sub-board, and some of the first test contact and the second test contact are Electrically connecting with the intermediate body connection point of the motherboard and electrically connected to the sub-board through the interposer; and a probe head is disposed on the lower surface of the motherboard, and the probe head is provided with a position corresponding a plurality of probes in the probe region, each of the probes being electrically connected to at least one of the first test contacts and the second test contacts, and a portion of the probes are transmitted through the motherboard and the interposer And electrically connected to the daughter board. The probe card of the replaceable daughterboard according to claim 1, wherein the second test zone and the intermediate connection zone of the motherboard jointly surround the probe zone. The probe card of the replaceable daughter board according to claim 2, wherein the motherboard has a plurality of the second test zone and a plurality of the mediator connection zones, wherein each of the mediator connection zones is located at the second Between test areas. The probe card of the replaceable daughter board according to claim 3, wherein the mother board has two second test areas on opposite sides of the probe area, and the other two in the probe area. On the opposite side of the interposer connection region, the motherboard can define a first imaginary line substantially passing through the center of each of the second test areas and a second imaginary line substantially perpendicular to the first imaginary line. The second imaginary line passes substantially through the center of each of the intermediate body connection regions of the motherboard. The probe card of the replaceable daughter board according to claim 2, wherein the mother board has an intermediate area separating the second test area and the intermediate connection area from the first test. The probe card of the replaceable daughter board according to claim 1, wherein the daughter board has an electronic component area corresponding to the probe area, and a plurality of the intermediate connection area located at the periphery of the electronic component area. The at least one electronic component is disposed in the electronic component region, the motherboard has a plurality of the intermediate connection regions located at a periphery of the probe region, and the intermediate connection region of the daughterboard is respectively connected to the intermediary by The intermediate body connection area of the motherboard. The probe card of the replaceable daughter board according to claim 1, wherein the number of the first test contacts electrically connected to the intermediate body connection point is greater than the second test electrically connected to the intermediate body connection point. The number of contacts. The probe card of the replaceable daughter board according to the first aspect of the patent application, wherein the ratio of the second test contact that is not electrically connected to the daughter board in all the second test joints is higher than that of the second test joint. The ratio of the first test contact electrically connected to the daughter board to all of the first test contacts. The probe card of the replaceable daughter board according to claim 1, wherein the motherboard has a light transmission hole below the probe area, and the daughter board has a position corresponding to the lower light transmission hole. Light transmission hole. The probe card of the replaceable sub-board of claim 1, wherein the upper surface of the sub-board is provided with a plurality of electrical contacts, and the positions of the electrical contacts correspond to the inter-body connection area of the sub-board And electrically connected to the interposer connection point of the sub-board. The probe card of the replaceable sub-board of claim 1, wherein the interposer is a circuit board having an elastic ejector pin, a connecting plate with a plurality of elastic members, and an anisotropic conductive adhesive One of them. A method for using a probe card of a replaceable sub-board as described in claim 1 includes the following steps: a) testing a first test object using the probe card; b) preparing for testing a further sub-board of the second object to be tested; c) disassembling the daughter card of the probe card; d) mounting the other daughter board to the probe card; and e) using the other sub-board The needle card tests the second object to be tested. The method of using the probe card of the replaceable daughter board according to claim 12, wherein before the step e), the method further comprises: replacing the probe head with the test object for testing the second object to be tested Another probe head. The method of using the probe card of the replaceable daughter board according to claim 12, wherein in the step a) and the step e), the frequency of the test signal and the test signal are single-ended signals or The differential signal selectively transmits the test signal to the first test zone or the second test zone. The method of using the probe card of the replaceable daughter board according to claim 14, wherein when the test signal is a high frequency signal or a differential signal, the test signal is transmitted to the second test area. A probe card for a replaceable daughter board includes: a mother board having a corresponding area of the daughter board, a first test area adjacent to a peripheral edge of the mother board, and a corresponding test area of the sub-board and the first test area a second test area between the two; a sub-board disposed in the corresponding area of the sub-board, the sub-board having an electronic component area and two inter-body connection areas, the two second test areas being interleaved with the two inter-body connection areas Surrounding the electronic component area; two interposers, the two interposer connection regions connecting the sub-board and the motherboard; and a probe head disposed on a lower surface of the motherboard, the probe head is provided with a complex probe Each of the probes is electrically connected to the first test zone or each of the second test zones, and a part of the probes are electrically connected to the daughterboard through the motherboard and the intermediate body.