TWI812511B - Single crystal diameter control method and device, single crystal silicon crystal pulling furnace - Google Patents
Single crystal diameter control method and device, single crystal silicon crystal pulling furnace Download PDFInfo
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- 239000013078 crystal Substances 0.000 title claims abstract description 244
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004033 diameter control Methods 0.000 title claims abstract description 33
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 20
- 238000001514 detection method Methods 0.000 claims abstract description 49
- 238000005070 sampling Methods 0.000 claims abstract description 11
- 238000012937 correction Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 9
- 238000004590 computer program Methods 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 239000007788 liquid Substances 0.000 description 14
- 230000005499 meniscus Effects 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 238000010899 nucleation Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/22—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
- C30B15/26—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal using television detectors; using photo or X-ray detectors
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
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Abstract
本發明提供了一種單晶體直徑控制方法及裝置、單晶矽拉晶爐,屬於半導體技術領域。單晶體直徑控制裝置包括:直徑檢測模組,用於對該多晶熔液和晶體的交界處進行圖像取樣,獲得原始圖像,對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例,根據該面積比例得到該晶體的直徑資料值;控制模組,用於將該直徑資料值與預設直徑資料值進行比較,並根據比較結果控制該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。The invention provides a single crystal diameter control method and device, a single crystal silicon pulling furnace, and belongs to the field of semiconductor technology. The single crystal diameter control device includes: a diameter detection module for image sampling at the interface between the polycrystalline melt and the crystal to obtain an original image, and binarizing the original image to obtain a black and white image. Calculate the area ratio of the white area to the black area in the black and white image, and obtain the diameter data value of the crystal based on the area ratio; the control module is used to compare the diameter data value with the preset diameter data value, and based on the comparison The result controls the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater.
Description
本發明屬於半導體技術領域,特別是指一種單晶體直徑控制方法及裝置、單晶矽拉晶爐。The invention belongs to the field of semiconductor technology, and in particular refers to a method and device for controlling the diameter of a single crystal, and a single crystal silicon pulling furnace.
單晶矽作為一種半導體材料,一般用於製造積體電路和其他電子元件。在製備矽單晶過程中,將直徑較小的籽晶浸入矽熔體中,通過引晶生長出一段直徑較細的細晶來排出位錯以達到生長零位元錯晶體的目的。之後會通過放肩過程,使得晶體由細晶長大到目標直徑,再通過等徑生長獲得所需要尺寸的晶體,最終通過收尾步驟,使晶棒與液面分離進而得到完整晶體。As a semiconductor material, single crystal silicon is generally used to manufacture integrated circuits and other electronic components. In the process of preparing silicon single crystal, a seed crystal with a smaller diameter is immersed in a silicon melt, and a section of fine crystal with a smaller diameter is grown through seeding to expel dislocations to achieve the purpose of growing zero-dislocation crystals. Afterwards, the crystal will grow from fine crystals to the target diameter through the shoulder releasing process, and then the crystal of the required size will be obtained through equal diameter growth. Finally, through the finishing step, the crystal rod will be separated from the liquid surface to obtain a complete crystal.
等徑過程是長晶過程中極為關鍵的步驟過程,也是保證晶體品質良率的關鍵。晶體的直徑則是保證晶體生長穩定性的前提以及產品良率的保證;晶體直徑自動控制裝置則是保證晶體生長過程中直徑自動控制的關鍵;目前主要使用光學高溫計感測器以及電荷耦合器件(Charge Coupled Device,CCD)光學相機來對晶體直徑進行檢測,其中前者以其具備較小的採光視角,且受熱場部件干涉較小等優點,在複雜熱場結構系統中應用較多;晶體直徑自動控制裝置的工作原理是:通過光學感測器監控晶體生長過程中所產生光圈的亮度值,以及監控感測器的位置進行直徑控制;簡單來說就是通過一固定位置(與晶體的目標直徑對應)感測器的監控,來回饋晶體直徑的變化資訊。但實際生產過程中,隨著晶體長度的變化以及熱場內部結構的變化,晶體與液面處的光圈信號值會發生較大的變化,這主要是因為感測器所採集到的光圈亮度值實際是晶體與液面交匯處由於表面張力形成的彎月面,憑藉熔液以及石英坩堝內壁或者其他熱場部件的光學反射而形成一具有一定光亮的光圈;直徑監控感測器監控範圍內光圈亮度值的變化一方面是由於實際直徑的大小波動,另一方面則是由於光源-即熱場內部亮度發生變化,從而使得彎月面反射的光亮值產生變化;而,光源-即熱場內部亮度發生變化的主要原因是因為晶體在實際生長過程中,坩堝內的剩熔液量、坩堝內壁露出面積、加熱器功率、以及生長過程中液面與導流筒之間距離等參數都會隨著晶體生長發生相應變化,因此通過彎月面反射到感測器的光亮值也會產生很大的變化,這種情況下就會極大影響設備對直徑的控制進而最終影響生長拉速以及產品品質。The equal diameter process is an extremely critical step in the crystal growth process and is also the key to ensuring crystal quality and yield. The diameter of the crystal is the prerequisite to ensure the stability of crystal growth and the guarantee of product yield; the automatic crystal diameter control device is the key to ensuring automatic diameter control during the crystal growth process; currently, optical pyrometer sensors and charge-coupled devices are mainly used (Charge Coupled Device, CCD) optical camera is used to detect the crystal diameter. The former is widely used in complex thermal field structure systems because of its small lighting viewing angle and small interference from thermal field components. Crystal diameter The working principle of the automatic control device is to monitor the brightness value of the aperture generated during the crystal growth process through an optical sensor, and monitor the position of the sensor for diameter control; simply speaking, it controls the diameter through a fixed position (corresponding to the target diameter of the crystal). Corresponding) sensor monitoring to feed back information on changes in crystal diameter. However, in the actual production process, as the length of the crystal changes and the internal structure of the thermal field changes, the aperture signal value between the crystal and the liquid surface will change greatly. This is mainly due to the aperture brightness value collected by the sensor. In fact, the meniscus formed by surface tension at the intersection of the crystal and the liquid surface forms an aperture with a certain brightness due to the optical reflection of the melt and the inner wall of the quartz crucible or other thermal field components; within the monitoring range of the diameter monitoring sensor On the one hand, the change in the brightness value of the aperture is due to the fluctuation of the actual diameter; on the other hand, it is due to the change in the internal brightness of the light source - that is, the thermal field, which causes the change in the brightness value reflected by the meniscus; and, the light source - that is, the thermal field The main reason for the change in internal brightness is that during the actual growth process of the crystal, parameters such as the amount of remaining melt in the crucible, the exposed area of the inner wall of the crucible, the heater power, and the distance between the liquid level and the guide tube during the growth process will all change. As the crystal grows, the brightness value reflected to the sensor through the meniscus will also change greatly. In this case, it will greatly affect the diameter control of the equipment and ultimately affect the growth rate and product. Quality.
本發明要解決的技術問題是提供一種單晶體直徑控制方法及裝置、單晶矽拉晶爐,能夠監控晶體生成過程中晶體的直徑,保證晶體品質的穩定可控性。The technical problem to be solved by the present invention is to provide a single crystal diameter control method and device, and a single crystal silica pulling furnace, which can monitor the diameter of the crystal during the crystal generation process and ensure the stable controllability of the crystal quality.
為解決上述技術問題,本發明的實施例提供技術方案如下: 一方面,本發明實施例提供一種單晶體直徑控制裝置,應用於單晶矽拉晶爐,該單晶矽拉晶爐包括爐體,該爐體內設置有坩堝和加熱器,以及位於該坩堝上方的籽晶提拉結構,該坩堝用於盛裝多晶熔液,該單晶體直徑控制裝置包括: 直徑檢測模組,用於對該多晶熔液和晶體的交界處進行圖像取樣,獲得原始圖像,對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例,根據該面積比例得到該晶體的直徑資料值; 控制模組,用於將該直徑資料值與預設直徑資料值進行比較,並根據比較結果控制該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。 In order to solve the above technical problems, embodiments of the present invention provide the following technical solutions: On the one hand, embodiments of the present invention provide a single crystal diameter control device for use in a single crystal silica pulling furnace. The single crystal silica pulling furnace includes a furnace body. The furnace body is provided with a crucible and a heater, and a furnace located above the crucible. Seed crystal pulling structure, the crucible is used to hold polycrystalline melt, the single crystal diameter control device includes: The diameter detection module is used to sample the image at the interface between the polycrystalline melt and the crystal, obtain the original image, perform binarization processing on the original image, obtain a black and white image, and calculate the The area ratio of the white area to the black area, and the diameter data value of the crystal is obtained based on this area ratio; The control module is used to compare the diameter data value with the preset diameter data value, and control the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater according to the comparison results.
一些實施例中,該控制模組具體用於在該直徑資料值大於該預設直徑資料值時,提高該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率;在該直徑資料值小於該預設直徑資料值時,降低該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。In some embodiments, the control module is specifically used to increase the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater when the diameter data value is greater than the preset diameter data value; When the data value is less than the preset diameter data value, the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater is reduced.
一些實施例中,還包括: 設置在該坩堝上方的導軌; 該直徑檢測模組設置在該導軌上,能夠沿該導軌移動。 In some embodiments, it also includes: A guide rail provided above the crucible; The diameter detection module is arranged on the guide rail and can move along the guide rail.
一些實施例中,該直徑檢測模組包括: 攝像單元,用於對該多晶熔液和晶體的交界處進行圖像取樣,獲得原始圖像; 計算單元,用於對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例L,L=S1/S2,其中S1為白色區域的面積,S2為黑色區域的面積; 矯正單元,用於利用矯正係數對該面積比例進行矯正,得到該直徑資料值。 In some embodiments, the diameter detection module includes: a camera unit, used for image sampling at the interface between the polycrystalline melt and the crystal to obtain the original image; The calculation unit is used to binarize the original image to obtain a black and white image, and calculate the area ratio L of the white area to the black area in the black and white image, L=S1/S2, where S1 is the area of the white area. , S2 is the area of the black area; The correction unit is used to correct the area ratio using the correction coefficient to obtain the diameter data value.
本發明的實施例還提供了一種單晶矽拉晶爐,包括爐體,該爐體內設置有坩堝和加熱器,以及位於該坩堝上方的籽晶提拉結構,該坩堝用於盛裝多晶熔液,還包括如上所述之單晶體直徑控制裝置。Embodiments of the present invention also provide a single crystal silicon crystal pulling furnace, which includes a furnace body. The furnace body is provided with a crucible and a heater, and a seed crystal pulling structure located above the crucible. The crucible is used to contain polycrystalline melt. The liquid also includes a single crystal diameter control device as described above.
本發明的實施例還提供了一種單晶體直徑控制方法,應用於單晶矽拉晶爐,該單晶矽拉晶爐包括爐體,該爐體內設置有坩堝和加熱器,以及位於該坩堝上方的籽晶提拉結構,該坩堝用於盛裝多晶熔液,該單晶體直徑控制方法包括: 對該多晶熔液和晶體的交界處進行圖像取樣,獲得原始圖像,對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例,根據該面積比例得到該晶體的直徑資料值; 將該直徑資料值與預設直徑資料值進行比較,並根據比較結果控制該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。 Embodiments of the present invention also provide a method for controlling the diameter of a single crystal, which is applied to a single crystal silica pulling furnace. The single crystal silica pulling furnace includes a furnace body with a crucible and a heater, and a furnace located above the crucible. The seed crystal pulling structure is used to hold the polycrystalline melt. The single crystal diameter control method includes: Image sampling is performed at the interface between the polycrystalline melt and the crystal to obtain the original image. The original image is binarized to obtain a black and white image. The area of the white area and the black area in the black and white image is calculated. Ratio, based on the area ratio, the diameter data value of the crystal is obtained; The diameter data value is compared with a preset diameter data value, and the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater is controlled according to the comparison result.
一些實施例中,該方法具體包括: 在該直徑資料值大於該預設直徑資料值時,提高該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率;在該直徑資料值小於該預設直徑資料值時,降低該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。 In some embodiments, the method specifically includes: When the diameter data value is greater than the preset diameter data value, increase the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater; when the diameter data value is less than the preset diameter data value, decrease The crystal pulling speed of the seed crystal pulling structure and/or the power of the heater.
一些實施例中,該據該面積比例得到該晶體的直徑資料值包括: 利用矯正係數對該面積比例進行矯正,得到該直徑資料值。 In some embodiments, obtaining the diameter data value of the crystal based on the area ratio includes: Use the correction coefficient to correct the area ratio to obtain the diameter data value.
本發明的實施例還提供了一種電腦可讀存儲介質,該電腦可讀存儲介質上存儲有電腦程式,該電腦程式被處理器執行時實現如上所述之單晶體直徑控制方法的步驟。Embodiments of the present invention also provide a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the steps of the single crystal diameter control method as described above are implemented.
本發明的實施例具有以下有益效果: 上述方案中,通過對多晶熔液和晶體的交界處進行監測,可以監控晶體生成過程中晶體的直徑,並即時調整籽晶提拉結構的晶體提拉速度和/或加熱器的功率,使得晶體的直徑能夠達到目標直徑,本實施例能夠確保晶體生長過程中得到的晶體直徑的真實性,保證晶體提拉速度的穩定性,可提升晶體品質的穩定可控性。 Embodiments of the present invention have the following beneficial effects: In the above scheme, by monitoring the interface between the polycrystalline melt and the crystal, the diameter of the crystal during the crystal generation process can be monitored, and the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be adjusted in real time, so that The diameter of the crystal can reach the target diameter. This embodiment can ensure the authenticity of the crystal diameter obtained during the crystal growth process, ensure the stability of the crystal pulling speed, and improve the stability and controllability of the crystal quality.
為利 貴審查委員了解本發明之技術特徵、內容與優點及其所能達到之功效,茲將本發明配合附圖及附件,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的申請範圍,合先敘明。In order to help the review committee understand the technical features, content and advantages of the present invention and the effects it can achieve, the present invention is described in detail below in the form of embodiments with the accompanying drawings and attachments, and the drawings used therein are , its purpose is only for illustration and auxiliary description, and may not represent the actual proportions and precise configurations after implementation of the present invention. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited to the actual implementation of the present invention. The scope shall be stated first.
在本發明實施例的描述中,需要理解的是,術語“長度”、“寬度”、“上”、“下”、“前”、“後”、“左”、“右”、“垂直”、“水平”、“頂”、“底”“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明實施例和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical" The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description. , rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be construed as a limitation of the present invention.
此外,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更多個所述特徵。在本發明實施例的描述中,“多個”的含義是兩個或兩個以上,除非另有明確具體的限定。In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.
本發明實施例提供一種單晶體直徑控制方法及裝置、單晶矽拉晶爐,能夠監控晶體生成過程中晶體的直徑,保證晶體品質的穩定可控性。Embodiments of the present invention provide a method and device for controlling the diameter of a single crystal, and a single crystal silicon pulling furnace, which can monitor the diameter of the crystal during the crystal generation process and ensure stable controllability of the crystal quality.
本發明實施例提供一種單晶體直徑控制裝置,應用於單晶矽拉晶爐,該單晶矽拉晶爐包括爐體,如圖1所示,該爐體內設置有坩堝30和加熱器(未圖示),以及位於該坩堝30上方的籽晶提拉結構(未圖示),該坩堝30用於盛裝多晶熔液40,該單晶體直徑控制裝置10包括: 直徑檢測模組,用於對該多晶熔液40和晶體50的交界處60進行圖像取樣,獲得原始圖像,對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例,根據該面積比例得到該晶體的直徑資料值; 控制模組,用於將該直徑資料值與預設直徑資料值進行比較,並根據比較結果控制該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。 Embodiments of the present invention provide a single crystal diameter control device for use in a single crystal silicon pulling furnace. The single crystal silicon pulling furnace includes a furnace body, as shown in Figure 1. The furnace body is provided with a crucible 30 and a heater (not shown). (shown), and a seed crystal pulling structure (not shown) located above the crucible 30. The crucible 30 is used to hold the polycrystalline melt 40. The single crystal diameter control device 10 includes: The diameter detection module is used to sample the image at the junction 60 of the polycrystalline melt 40 and the crystal 50 to obtain an original image, perform binarization processing on the original image to obtain a black and white image, and calculate the black and white image. The area ratio of the white area to the black area in the image, and the diameter data value of the crystal is obtained based on this area ratio; The control module is used to compare the diameter data value with the preset diameter data value, and control the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater according to the comparison result.
本實施例中,通過對多晶熔液和晶體的交界處進行監測,可以監控晶體生成過程中晶體的直徑,並即時調整籽晶提拉結構的晶體提拉速度和/或加熱器的功率,使得晶體的直徑能夠達到目標直徑,本實施例能夠確保晶體生長過程中得到的晶體直徑的真實性,保證晶體提拉速度的穩定性,可提升晶體品質的穩定可控性。In this embodiment, by monitoring the interface between the polycrystalline melt and the crystal, the diameter of the crystal during the crystal generation process can be monitored, and the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be adjusted in real time. Allowing the diameter of the crystal to reach the target diameter, this embodiment can ensure the authenticity of the crystal diameter obtained during the crystal growth process, ensure the stability of the crystal pulling speed, and improve the stability and controllability of the crystal quality.
在拉晶過程中,多晶矽被裝進坩堝30內加熱熔化變為多晶熔液40,把一個具有特定晶向的晶體固定在籽晶夾頭結構的下端,拉制單晶矽棒時,首先將晶體與多晶熔液熔接,開始進入引晶階段;接著通過調整多晶熔液的溫度、晶體向上的提升速度等,使單晶矽經過放肩階段和轉肩階段不斷長大,最終拉制出單晶矽棒。其中,導流筒20用於將液面處溫度與晶棒外周環境分開,以保證合適的晶體生長溫度梯度;坩堝30可以是石英或者塢等材料製成,內壁較為光滑,具有一定光反射作用;生長出來的晶體50的晶體邊緣501(包含凸出的晶線)與多晶熔液40熔接。During the crystal pulling process, polycrystalline silicon is put into the crucible 30 and heated and melted to become a polycrystalline melt 40. A crystal with a specific crystal orientation is fixed at the lower end of the seed chuck structure. When pulling a single crystal silicon rod, first The crystal is welded to the polycrystalline melt and begins to enter the seeding stage; then by adjusting the temperature of the polycrystalline melt, the upward lifting speed of the crystal, etc., the single crystal silicon continues to grow through the shoulder-releasing stage and the shoulder-turning stage, and is finally drawn Single crystal silicon rod is produced. Among them, the flow guide tube 20 is used to separate the liquid surface temperature from the crystal rod's peripheral environment to ensure a suitable temperature gradient for crystal growth; the crucible 30 can be made of quartz or dock, and the inner wall is relatively smooth and has a certain light reflection. Function: The crystal edge 501 (including protruding crystal lines) of the grown crystal 50 is welded to the polycrystalline melt 40.
晶體生長過程中,在晶體50與多晶熔液40的交界處60,固液面由於熔液的表面張力形成彎月面結構,由於晶體結晶潛熱以及周邊光亮環境,從一定角度觀看,該彎月面結構會發出亮度高於周邊的光,稱其為光圈,直徑檢測模組對多晶熔液40和晶體50的交界處60進行圖像取樣,也就是對光圈進行圖像取樣。During the crystal growth process, at the junction 60 of the crystal 50 and the polycrystalline melt 40, the solid-liquid surface forms a meniscus structure due to the surface tension of the melt. Due to the latent heat of crystallization and the surrounding light environment, when viewed from a certain angle, the meniscus structure The moon surface structure will emit light with a brightness higher than that of the surrounding area, which is called an aperture. The diameter detection module performs image sampling on the junction 60 of the polycrystalline melt 40 and the crystal 50 , that is, image sampling of the aperture.
如圖2所示,單晶體直徑控制裝置10包括設置在坩堝上方的導軌102,直徑檢測模組101設置在該導軌102上,能夠沿該導軌102移動。As shown in FIG. 2 , the single crystal diameter control device 10 includes a guide rail 102 disposed above the crucible. The diameter detection module 101 is disposed on the guide rail 102 and can move along the guide rail 102 .
一些實施例中,該直徑檢測模組包括: 攝像單元,用於對該多晶熔液和晶體的交界處進行圖像取樣,獲得原始圖像; 計算單元,用於對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例L,L=S1/S2,其中S1為白色區域的面積,S2為黑色區域的面積; 矯正單元,用於利用矯正係數對該面積比例進行矯正,得到該直徑資料值。 In some embodiments, the diameter detection module includes: a camera unit, used for image sampling at the interface between the polycrystalline melt and the crystal to obtain the original image; The calculation unit is used to binarize the original image to obtain a black and white image, and calculate the area ratio L of the white area to the black area in the black and white image, L=S1/S2, where S1 is the area of the white area. , S2 is the area of the black area; The correction unit is used to correct the area ratio using the correction coefficient to obtain the diameter data value.
本實施例中,直徑檢測模組101按照目標角度固定設置在導軌102上,直徑檢測模組101在導軌102上的位置可以根據設定的晶體的目標直徑來確定,可以根據實際需求調整直徑檢測模組101在導軌102上的位置。直徑檢測模組101工作過程中,攝像單元對光圈部位即固液交界處進行取樣,得到原始圖像。圖3為本發明實施例晶體徑向截面(包括邊緣和晶線)以及檢測視野的示意圖,其中包括,晶體邊緣501、凸出晶線502。如圖4所示,其中,原始圖像1031為直徑檢測模組101的檢測視野103內取得的原始圖像,對原始圖像1031進行二值化處理,即設定一灰階閾值,將原始圖像1031的每一圖元的灰階值與該灰階閾值進行比對,若圖元的灰階值大於或等於該灰階閾值,則將該圖元調整為白色圖元,若圖元的灰階值小於該灰階閾值,則將該圖元調整為黑色圖元;或者,若圖元的灰階值大於該灰階閾值,則將該圖元調整為白色圖元,若圖元的灰階值小於或等於該灰階閾值,則將該圖元調整為黑色圖元,進而得到黑白圖像1032。結合黑白圖元點的差值,擬合出黑白區域的邊界,可以看出檢測視野內的黑白圖像由黑白兩部分組成,計算白色區域與黑色區域的面積比例L,L=S1/S2,其中S1為白色區域的面積,S2為黑色區域的面積,S1代表檢測視野內晶體所占部分,S2代表檢測視野內晶體之外的部分,通過L能夠體現晶體的直徑大小。本實施例中,通過對原始圖像進行二值化處理得到黑白圖像,可以實現資料降噪功能,避免晶體表面晶線對檢測結果的干擾。In this embodiment, the diameter detection module 101 is fixedly arranged on the guide rail 102 according to the target angle. The position of the diameter detection module 101 on the guide rail 102 can be determined according to the set target diameter of the crystal. The diameter detection module can be adjusted according to actual needs. Position of group 101 on rail 102. During the working process of the diameter detection module 101, the camera unit samples the aperture part, that is, the solid-liquid interface, to obtain the original image. Figure 3 is a schematic diagram of a crystal radial cross section (including edges and crystal lines) and a detection field of view according to an embodiment of the present invention, which includes crystal edges 501 and protruding crystal lines 502. As shown in Figure 4, the original image 1031 is an original image obtained within the detection field of view 103 of the diameter detection module 101. The original image 1031 is binarized, that is, a grayscale threshold is set, and the original image is The grayscale value of each primitive in image 1031 is compared with the grayscale threshold. If the grayscale value of the primitive is greater than or equal to the grayscale threshold, the primitive is adjusted to a white primitive. If the grayscale value of the primitive is If the gray-scale value is less than the gray-scale threshold, the primitive will be adjusted to a black primitive; or if the gray-scale value of the primitive is greater than the gray-scale threshold, the primitive will be adjusted to a white primitive. If the gray-scale value of the primitive If the grayscale value is less than or equal to the grayscale threshold, the primitive is adjusted to a black primitive, and a black and white image 1032 is obtained. Combined with the difference between black and white primitive points, the boundary of the black and white area is fitted. It can be seen that the black and white image in the detection field of view consists of black and white parts. Calculate the area ratio L of the white area to the black area, L=S1/S2, Among them, S1 is the area of the white area, S2 is the area of the black area, S1 represents the part occupied by the crystal in the detection field of view, S2 represents the part outside the crystal in the detection field of view, and L can reflect the diameter of the crystal. In this embodiment, by performing binary processing on the original image to obtain a black and white image, the data noise reduction function can be achieved and the interference of the crystal lines on the crystal surface on the detection results can be avoided.
一些實施例中,為了降低資料處理量,可以在對原始圖像進行二值化處理之前,去除原始圖像中的背景。In some embodiments, in order to reduce the amount of data processing, the background in the original image can be removed before binarizing the original image.
當直徑檢測模組101以設定角度固定在導軌102設定位置時,認為該位置下,直徑檢測模組101所檢測到的液麵點與目標直徑所對應,參考圖1所示的位置,所檢測到的視野內白色區域與黑色區域的面積比為標準值,記為L1,當晶體直徑偏大時,檢測視野內白色區域會增大,此時L>L1,反之,L<L1。由於熔液量的減少以坩堝位置變化所導致熱場內環境光亮變化對檢測結果會產生干擾,因此,可以引入矯正係數對面積比例進行矯正,得到直徑資料值。比如,可以引入係數α將L放大,得到直徑資料值D=α × L(D非實際直徑,只代表或回饋直徑的變化趨勢),D值的變化可以回饋晶體的直徑變化,本實施例中,通過係數矯正,可以最大程度減小由於熔液量的減少以坩堝位置變化所導致熱場內環境光亮變化對檢測結果的干擾。When the diameter detection module 101 is fixed at the set position of the guide rail 102 at a set angle, it is considered that at this position, the liquid level point detected by the diameter detection module 101 corresponds to the target diameter. Referring to the position shown in Figure 1, the detected The area ratio of the white area to the black area in the field of view is the standard value, recorded as L1. When the crystal diameter is larger, the white area in the detection field of view will increase. At this time, L>L1, conversely, L<L1. Since the decrease in the amount of melt and the change in ambient light in the thermal field caused by the change in the position of the crucible will interfere with the detection results, a correction coefficient can be introduced to correct the area ratio and obtain the diameter data value. For example, the coefficient α can be introduced to amplify L, and the diameter data value D=α , through coefficient correction, the interference on the detection results caused by changes in ambient light in the thermal field caused by the reduction in melt volume and changes in the position of the crucible can be minimized.
在得到直徑資料值後,可以依據直徑資料值對晶體生成過程進行控制。一些實施例中,該控制模組具體用於在該直徑資料值大於該預設直徑資料值時,提高該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率;在該直徑資料值小於該預設直徑資料值時,降低該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。After obtaining the diameter data value, the crystal generation process can be controlled based on the diameter data value. In some embodiments, the control module is specifically used to increase the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater when the diameter data value is greater than the preset diameter data value; When the data value is less than the preset diameter data value, the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater is reduced.
在該直徑資料值大於該預設直徑資料值時,表示晶體的實際直徑大於目標直徑,可以提高該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率,保證實際直徑與目標直徑相近或相等;在該直徑資料值小於該預設直徑資料值時,表示晶體的實際直徑小於目標直徑,可以降低該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率,保證實際直徑與目標直徑相近或相等。When the diameter data value is greater than the preset diameter data value, it means that the actual diameter of the crystal is greater than the target diameter. The crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be increased to ensure that the actual diameter is consistent with the target diameter. The diameters are similar or equal; when the diameter data value is smaller than the preset diameter data value, it means that the actual diameter of the crystal is smaller than the target diameter, and the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be reduced. Ensure that the actual diameter is close to or equal to the target diameter.
本發明的實施例還提供了一種單晶矽拉晶爐,包括爐體,該爐體內設置有坩堝和加熱器,以及位於該坩堝上方的籽晶提拉結構,該坩堝用於盛裝多晶熔液,還包括如上所述之單晶體直徑控制裝置。Embodiments of the present invention also provide a single crystal silicon crystal pulling furnace, which includes a furnace body. The furnace body is provided with a crucible and a heater, and a seed crystal pulling structure located above the crucible. The crucible is used to contain polycrystalline melt. The liquid also includes a single crystal diameter control device as described above.
本發明的實施例還提供了一種單晶體直徑控制方法,應用於單晶矽拉晶爐,該單晶矽拉晶爐包括爐體,該爐體內設置有坩堝和加熱器,以及位於該坩堝上方的籽晶提拉結構,該坩堝用於盛裝多晶熔液,如圖5所示,該單晶體直徑控制方法包括: 步驟S01:對該多晶熔液和晶體的交界處進行圖像取樣,獲得原始圖像,對該原始圖像進行二值化處理,得到黑白圖像,計算該黑白圖像中白色區域與黑色區域的面積比例,根據該面積比例得到該晶體的直徑資料值; 步驟S02:將該直徑資料值與預設直徑資料值進行比較,並根據比較結果控制該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。 Embodiments of the present invention also provide a method for controlling the diameter of a single crystal, which is applied to a single crystal silica pulling furnace. The single crystal silica pulling furnace includes a furnace body with a crucible and a heater, and a furnace located above the crucible. Seed crystal pulling structure, the crucible is used to hold polycrystalline melt, as shown in Figure 5. The single crystal diameter control method includes: Step S01: Perform image sampling at the interface between the polycrystalline melt and the crystal to obtain an original image, perform binarization processing on the original image to obtain a black and white image, and calculate the difference between the white area and the black area in the black and white image. The area ratio of the region, based on which the diameter data value of the crystal is obtained; Step S02: Compare the diameter data value with the preset diameter data value, and control the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater according to the comparison result.
本實施例中,通過對多晶熔液和晶體的交界處進行監測,可以監控晶體生成過程中晶體的直徑,並即時調整籽晶提拉結構的晶體提拉速度和/或加熱器的功率,使得晶體的直徑能夠達到目標直徑,本實施例能夠確保晶體生長過程中得到的晶體直徑的真實性,保證晶體提拉速度的穩定性,可提升晶體品質的穩定可控性。In this embodiment, by monitoring the interface between the polycrystalline melt and the crystal, the diameter of the crystal during the crystal generation process can be monitored, and the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be adjusted in real time. Allowing the diameter of the crystal to reach the target diameter, this embodiment can ensure the authenticity of the crystal diameter obtained during the crystal growth process, ensure the stability of the crystal pulling speed, and improve the stability and controllability of the crystal quality.
在拉晶過程中,多晶矽被裝進坩堝30內加熱熔化變為多晶熔液40,把一個具有特定晶向的晶體固定在籽晶夾頭結構的下端,拉制單晶矽棒時,首先將晶體與多晶熔液熔接,開始進入引晶階段;接著通過調整多晶熔液的溫度、晶體向上的提升速度等,使單晶矽經過放肩階段和轉肩階段不斷長大,最終拉制出單晶矽棒。其中,導流筒20用於將液面處溫度與晶棒外周環境分開,以保證合適的晶體生長溫度梯度;坩堝30可以是石英或者塢等材料製成,內壁較為光滑,具有一定光反射作用;生長出來的晶體50的晶體邊緣501(包含凸出的晶線)與多晶熔液40熔接。During the crystal pulling process, polycrystalline silicon is put into the crucible 30 and heated and melted to become a polycrystalline melt 40. A crystal with a specific crystal orientation is fixed at the lower end of the seed chuck structure. When pulling a single crystal silicon rod, first The crystal is welded to the polycrystalline melt and begins to enter the seeding stage; then by adjusting the temperature of the polycrystalline melt, the upward lifting speed of the crystal, etc., the single crystal silicon continues to grow through the shoulder-releasing stage and the shoulder-turning stage, and is finally drawn Single crystal silicon rod is produced. Among them, the flow guide tube 20 is used to separate the liquid surface temperature from the crystal rod's peripheral environment to ensure a suitable temperature gradient for crystal growth; the crucible 30 can be made of quartz or dock, and the inner wall is relatively smooth and has a certain light reflection. Function: The crystal edge 501 (including protruding crystal lines) of the grown crystal 50 is welded to the polycrystalline melt 40.
晶體生長過程中,在晶體50與多晶熔液40的交界處60,固液面由於熔液的表面張力形成彎月面結構,由於晶體結晶潛熱以及周邊光亮環境,從一定角度觀看,該彎月面結構會發出亮度高於周邊的光,稱其為光圈,直徑檢測模組對多晶熔液40和晶體50的交界處60進行圖像取樣,也就是對光圈進行圖像取樣。During the crystal growth process, at the junction 60 of the crystal 50 and the polycrystalline melt 40, the solid-liquid surface forms a meniscus structure due to the surface tension of the melt. Due to the latent heat of crystallization and the surrounding light environment, when viewed from a certain angle, the meniscus structure The moon surface structure will emit light with a brightness higher than that of the surrounding area, which is called an aperture. The diameter detection module performs image sampling on the junction 60 of the polycrystalline melt 40 and the crystal 50 , that is, image sampling of the aperture.
如圖2所示,單晶體直徑控制裝置10包括設置在坩堝上方的導軌102,直徑檢測模組101設置在該導軌102上,能夠沿該導軌102移動。As shown in FIG. 2 , the single crystal diameter control device 10 includes a guide rail 102 disposed above the crucible. The diameter detection module 101 is disposed on the guide rail 102 and can move along the guide rail 102 .
本實施例中,直徑檢測模組101按照目標角度固定設置在導軌102上,直徑檢測模組101在導軌102上的位置可以根據設定的晶體的目標直徑來確定,可以根據實際需求調整直徑檢測模組101在導軌102上的位置。直徑檢測模組101工作過程中,攝像單元對光圈部位即固液交界處進行取樣,得到原始圖像。圖3為本發明實施例晶體徑向截面(包括邊緣和晶線)以及檢測視野的示意圖,其中包含晶體邊緣501、凸出晶線502。如圖4所示,其中,原始圖像1031為直徑檢測模組101的檢測視野103內取得的原始圖像,對原始圖像1031進行二值化處理,即設定一灰階閾值,將原始圖像1031的每一圖元的灰階值與該灰階閾值進行比對,若圖元的灰階值大於或等於該灰階閾值,則將該圖元調整為白色圖元,若圖元的灰階值小於該灰階閾值,則將該圖元調整為黑色圖元;或者,若圖元的灰階值大於該灰階閾值,則將該圖元調整為白色圖元,若圖元的灰階值小於或等於該灰階閾值,則將該圖元調整為黑色圖元,進而得到黑白圖像1032。結合黑白圖元點的差值,擬合出黑白區域的邊界,可以看出檢測視野內的黑白圖像由黑白兩部分組成,計算白色區域與黑色區域的面積比例L,L=S1/S2,其中S1為白色區域的面積,S2為黑色區域的面積,S1代表檢測視野內晶體所占部分,S2代表檢測視野內晶體之外的部分,通過L能夠體現晶體的直徑大小。本實施例中,通過對原始圖像進行二值化處理得到黑白圖像,可以實現資料降噪功能,避免晶體表面晶線對檢測結果的干擾。In this embodiment, the diameter detection module 101 is fixedly arranged on the guide rail 102 according to the target angle. The position of the diameter detection module 101 on the guide rail 102 can be determined according to the set target diameter of the crystal. The diameter detection module can be adjusted according to actual needs. Position of group 101 on rail 102. During the working process of the diameter detection module 101, the camera unit samples the aperture part, that is, the solid-liquid interface, to obtain the original image. Figure 3 is a schematic diagram of a crystal radial cross section (including edges and crystal lines) and a detection field of view according to an embodiment of the present invention, which includes crystal edges 501 and protruding crystal lines 502. As shown in Figure 4, the original image 1031 is an original image obtained within the detection field of view 103 of the diameter detection module 101. The original image 1031 is binarized, that is, a grayscale threshold is set, and the original image is The grayscale value of each primitive in image 1031 is compared with the grayscale threshold. If the grayscale value of the primitive is greater than or equal to the grayscale threshold, the primitive is adjusted to a white primitive. If the grayscale value of the primitive is If the gray-scale value is less than the gray-scale threshold, the primitive will be adjusted to a black primitive; or if the gray-scale value of the primitive is greater than the gray-scale threshold, the primitive will be adjusted to a white primitive. If the gray-scale value of the primitive If the grayscale value is less than or equal to the grayscale threshold, the primitive is adjusted to a black primitive, and a black and white image 1032 is obtained. Combined with the difference between black and white primitive points, the boundary of the black and white area is fitted. It can be seen that the black and white image in the detection field of view consists of black and white parts. Calculate the area ratio L of the white area to the black area, L=S1/S2, Among them, S1 is the area of the white area, S2 is the area of the black area, S1 represents the part occupied by the crystal in the detection field of view, S2 represents the part outside the crystal in the detection field of view, and L can reflect the diameter of the crystal. In this embodiment, by performing binary processing on the original image to obtain a black and white image, the data noise reduction function can be achieved and the interference of the crystal lines on the crystal surface on the detection results can be avoided.
一些實施例中,為了降低資料處理量,可以在對原始圖像進行二值化處理之前,去除原始圖像中的背景。In some embodiments, in order to reduce the amount of data processing, the background in the original image can be removed before binarizing the original image.
當直徑檢測模組101以設定角度固定在導軌102設定位置時,認為該位置下,直徑檢測模組101所檢測到的液麵點與目標直徑所對應,參考圖1所示的位置,所檢測到的視野內白色區域與黑色區域的面積比為標準值,記為L1,當晶體直徑偏大時,檢測視野內白色區域會增大,此時L>L1,反之,L<L1。由於熔液量的減少以坩堝位置變化所導致熱場內環境光亮變化對檢測結果會產生干擾,因此,可以引入矯正係數對面積比例進行矯正,得到直徑資料值。比如,可以引入係數α將L放大,得到直徑資料值D=α × L(D非實際直徑,只代表或回饋直徑的變化趨勢),D值的變化可以回饋晶體的直徑變化,本實施例中,通過係數矯正,可以最大程度減小由於熔液量的減少以坩堝位置變化所導致熱場內環境光亮變化對檢測結果的干擾。When the diameter detection module 101 is fixed at the set position of the guide rail 102 at a set angle, it is considered that at this position, the liquid level point detected by the diameter detection module 101 corresponds to the target diameter. Referring to the position shown in Figure 1, the detected The area ratio of the white area to the black area in the field of view is the standard value, recorded as L1. When the crystal diameter is larger, the white area in the detection field of view will increase. At this time, L>L1, conversely, L<L1. Since the decrease in the amount of melt and the change in ambient light in the thermal field caused by the change in the position of the crucible will interfere with the detection results, a correction coefficient can be introduced to correct the area ratio and obtain the diameter data value. For example, the coefficient α can be introduced to amplify L, and the diameter data value D=α , through coefficient correction, the interference on the detection results caused by changes in ambient light in the thermal field caused by the reduction in melt volume and changes in the position of the crucible can be minimized.
在得到直徑資料值後,可以依據直徑資料值對晶體生成過程進行控制。一些實施例中,該方法具體包括: 在該直徑資料值大於該預設直徑資料值時,提高該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率;在該直徑資料值小於該預設直徑資料值時,降低該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率。 After obtaining the diameter data value, the crystal generation process can be controlled based on the diameter data value. In some embodiments, the method specifically includes: When the diameter data value is greater than the preset diameter data value, increase the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater; when the diameter data value is less than the preset diameter data value, decrease The crystal pulling speed of the seed crystal pulling structure and/or the power of the heater.
在該直徑資料值大於該預設直徑資料值時,表示晶體的實際直徑大於目標直徑,可以提高該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率,保證實際直徑與目標直徑相近或相等;在該直徑資料值小於該預設直徑資料值時,表示晶體的實際直徑小於目標直徑,可以降低該籽晶提拉結構的晶體提拉速度和/或該加熱器的功率,保證實際直徑與目標直徑相近或相等。When the diameter data value is greater than the preset diameter data value, it means that the actual diameter of the crystal is greater than the target diameter. The crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be increased to ensure that the actual diameter is consistent with the target diameter. The diameters are similar or equal; when the diameter data value is smaller than the preset diameter data value, it means that the actual diameter of the crystal is smaller than the target diameter, and the crystal pulling speed of the seed crystal pulling structure and/or the power of the heater can be reduced. Ensure that the actual diameter is close to or equal to the target diameter.
本發明的實施例還提供了一種電腦可讀存儲介質,該電腦可讀存儲介質上存儲有電腦程式,該電腦程式被處理器執行時實現如上所述之單晶體直徑控制方法的步驟。Embodiments of the present invention also provide a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the steps of the single crystal diameter control method as described above are implemented.
以上僅為本發明之較佳實施例,並非用來限定本發明之實施範圍,如果不脫離本發明之精神和範圍,對本發明進行修改或者等同替換,均應涵蓋在本發明申請專利範圍的保護範圍當中。The above are only preferred embodiments of the present invention and are not intended to limit the implementation scope of the present invention. If the present invention is modified or equivalently substituted without departing from the spirit and scope of the present invention, the protection shall be covered by the patent scope of the present invention. within the range.
10:單晶體直徑控制裝置 20:導流筒 30:坩堝 40:多晶熔液 50:晶體 60:交界處 101:直徑檢測模組 102:導軌 103:檢測視野 501:晶體邊緣 502:凸出晶線 1031:原始圖像 1032:黑白圖像 S01-S02:步驟 10:Single crystal diameter control device 20: guide tube 30:Crucible 40:Polycrystalline melt 50:Crystal 60:junction 101: Diameter detection module 102: Guide rail 103: Detection field of view 501: Crystal edge 502:Protruding crystal line 1031:Original image 1032: black and white image S01-S02: Steps
圖1為本發明實施例晶體生長的示意圖; 圖2為本發明實施例單晶體直徑控制裝置的結構示意圖; 圖3為本發明實施例晶體徑向截面(包括邊緣和晶線)以及檢測視野的示意圖; 圖4為本發明實施例對檢測視野內的圖像進行處理的示意圖; 圖5為本發明實施例單晶體直徑控制方法的流程示意圖。 Figure 1 is a schematic diagram of crystal growth according to an embodiment of the present invention; Figure 2 is a schematic structural diagram of a single crystal diameter control device according to an embodiment of the present invention; Figure 3 is a schematic diagram of the radial cross section of the crystal (including edges and crystal lines) and the detection field of view according to the embodiment of the present invention; Figure 4 is a schematic diagram of processing images within the detection field of view according to an embodiment of the present invention; Figure 5 is a schematic flowchart of a single crystal diameter control method according to an embodiment of the present invention.
S01-S02:步驟 S01-S02: Steps
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200396732Y1 (en) * | 2005-07-08 | 2005-09-27 | 퀄리플로나라테크 주식회사 | Silicon crystal growth controllar using image binarization |
DE102008044761B4 (en) * | 2007-08-29 | 2012-10-04 | Sumco Corp. | Siliciumeinkristallziehverfahren |
US9816199B2 (en) * | 2014-12-24 | 2017-11-14 | Sumco Corporation | Method of manufacturing single crystal |
CN110093663A (en) * | 2018-01-29 | 2019-08-06 | 上海新昇半导体科技有限公司 | A kind of automatic calibrating method and calibration system for crystal diameter measurement |
TW202140865A (en) * | 2020-04-20 | 2021-11-01 | 日商Sumco股份有限公司 | Single crystal manufacturing apparatus and single crystal manufacturing method |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2601930B2 (en) * | 1990-03-29 | 1997-04-23 | 信越半導体株式会社 | Method and apparatus for controlling diameter of single crystal neck |
JP2814035B2 (en) * | 1992-05-19 | 1998-10-22 | コマツ電子金属株式会社 | Method and apparatus for controlling diameter of semiconductor single crystal |
JP3611364B2 (en) * | 1995-03-03 | 2005-01-19 | 東海カーボン株式会社 | Single crystal diameter control method |
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US6030451A (en) * | 1998-01-12 | 2000-02-29 | Seh America, Inc. | Two camera diameter control system with diameter tracking for silicon ingot growth |
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JP2000264780A (en) * | 1999-03-19 | 2000-09-26 | Toshiba Ceramics Co Ltd | Melting detection method and detector for use in semiconductor single crystal pulling device |
JP4078156B2 (en) * | 2002-09-06 | 2008-04-23 | コバレントマテリアル株式会社 | Single crystal pulling apparatus and single crystal pulling method |
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---|---|---|---|---|
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DE102008044761B4 (en) * | 2007-08-29 | 2012-10-04 | Sumco Corp. | Siliciumeinkristallziehverfahren |
US9816199B2 (en) * | 2014-12-24 | 2017-11-14 | Sumco Corporation | Method of manufacturing single crystal |
CN110093663A (en) * | 2018-01-29 | 2019-08-06 | 上海新昇半导体科技有限公司 | A kind of automatic calibrating method and calibration system for crystal diameter measurement |
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