TWI812358B - Display module and image display device thereof - Google Patents

Abstract

A display module includes a circuit substrate, a plurality of image display units and at least one audio signal transmitting unit. The plurality of image display units are disposed on the circuit substrate in a matrix arrangement. The at least one audio signal transmitting unit is disposed at a position of the circuit substrate where there is no image display unit disposed thereon and is disposed between any two adjacent image display units.

Description

Display module and its image display

The present invention relates to a display module and its image display, and in particular, to a display module and its image display in which an image display unit and an audio transmission unit are arranged on the same circuit substrate.

Conventional portable electronic devices include a display module and an audio transmission unit. However, the display module and the audio transmission unit are installed separately, so the display area of the display module must be reduced for the audio transmission unit.

Therefore, one object of the present invention is to provide a display module and an image display thereof in which an image display unit and an audio transmission unit are disposed on the same circuit substrate, so as to solve the problem that the display area must be reduced.

According to an embodiment, the display module of the present invention includes a circuit substrate, a plurality of image display units, and at least one audio transmission unit. The plurality of image display units are arranged on the circuit substrate and arranged in a matrix. The at least one audio transmission unit is disposed at a position on the circuit substrate where the plurality of image display units are not disposed and is disposed between any two adjacent image display units.

According to another embodiment, an image display of the present invention includes the above-mentioned display module.

To sum up, the present invention adopts the design of arranging the audio transmission unit at a position on the circuit substrate where the image display unit is not installed (for example, between any two adjacent image display units, but is not limited to this). , thereby integrating the audio transmission unit and the image display unit on the same circuit substrate, thus solving the problem in the previous technology that the audio transmission unit and the display module must be installed separately.

The advantages and spirit of the present invention can be obtained from the following detailed description of the invention and the accompanying drawings. Learn more.

Z: Portable electronic device

C: border structure

CL: left end

CR: right end

CT: upper end

CB: lower side end

B: Surrounding light-shielding layer

D:Full screen image display

1: First display module

1L: left end

1R: Right end

1T: Upper end

1B: Lower side end

2: Second display module

2L: left end

2R: Right end

2T: Upper end

2B: Lower side end

20:Circuit substrate

21:Image display unit

210: Light emitting diode chip

22: Photometric sensor

221: The first light generating chip

222: The first light receiving chip

23: Proximity sensor

231: Second light generating chip

232: Second light receiving chip

24: Floodlight Projector

240: Infrared light generating chip

25: Draw point projector

250:Invisible light generating chip

26:The first image capture device

261: First image capture chip

262:First optical lens

P1: first plane

LV1: first vertical optical axis

LS1: first tilted optical axis

27: Second image capture device

271: Second image capture chip

272:Second optical lens

P2: Second plane

LV2: Second vertical optical axis

LS2: Second tilted optical axis

28: Speaker

280: Sound signal transmitting chip

29:Microphone

290: Sound signal receiving chip

θ 1, θ 2: angle

FIG. 1 is a schematic diagram of a portable electronic device according to a first embodiment of the present invention and a full-screen image display according to a second embodiment of the present invention.

FIG. 2 is an enlarged schematic diagram of part II of FIG. 1 .

FIG. 3 is an enlarged schematic diagram of part III of FIG. 1 .

FIG. 4 is an enlarged schematic diagram of part IV of FIG. 1 .

FIG. 5 is a schematic side view of a plurality of first optical lenses of the first image capture device provided in the full-screen image display according to the second embodiment of the present invention.

6 is a schematic side view of a plurality of second optical lenses of the second image capture device provided in the full-screen image display according to the second embodiment of the present invention.

The following is a description of the implementation of the "portable electronic device and its full-screen image display" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and advantages of the present invention from the content disclosed in this specification. Effect. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Referring to FIG. 1 , a first embodiment of the present invention provides a portable electronic device Z, which includes It includes a frame structure C and a full-screen image display D surrounded by the frame structure C, and the full-screen image display D includes a first display module 1 for providing a first image and a first display module 1 for providing a first image. A second display module 2 for two images. In addition, the first display module 1 and the second display module 2 can be adjacent to or connected to each other, so the first image generated by the first display module 1 and the second image generated by the second display module 2 can be Joined to form a continuous image or a complete image.

Furthermore, as shown in Figure 1, the frame structure C has a left end CL, a right end CR, an upper side CT and a lower end CB. The first display module 1 has a left end 1L and a right end. 1R, an upper end 1T and a lower end 1B, and the second display module 2 has a left end 2L, a right end 2R, an upper end 2T and a lower end 2B. Furthermore, the left end 1L of the first display module 1 is close to or very close to the left end CL of the frame structure C, so that there is no anything between the left end 1L of the first display module 1 and the left end CL of the frame structure C. Exposed electronic components (such as image capturers, sensors, etc.). The right end 1R of the first display module 1 is close to or very close to the right end CR of the frame structure C, so that there is no exposed electron between the right end 1R of the first display module 1 and the right end CR of the frame structure C. element. The lower end 1B of the first display module 1 is close to or very close to the lower end CB of the frame structure C, so that there is no arrangement between the lower end 1B of the first display module 1 and the lower end CB of the frame structure C. Any exposed electronic components. In addition, the left end 2L of the second display module 2 is close to or very close to the left end CL of the frame structure C, so that there is no exposure between the left end 2L of the second display module 2 and the left end CL of the frame structure C. of electronic components. The right end 2R of the second display module 2 is close to or very close to the right end CR of the frame structure C, so that there is no exposed electron between the right end 2R of the second display module 2 and the right end CR of the frame structure C. element. The upper end 2T of the second display module 2 is close or very close to the upper end CT of the frame structure C, so that there is no exposed electron between the upper end 2T of the second display module 2 and the upper end CT of the frame structure C. element. It is worth noting that the upper end 1T of the first display module 1 and the lower end 2B of the second display module 2 are adjacent to or connected to each other.

For example, as shown in Figure 1, the portable electronic device Z includes a continuous and non-perforated The surrounding light-shielding layer B will surround the first display module 1 and the second display module 2, and the surrounding light-shielding layer B will be surrounded by the frame structure C. Thereby, the area between the first display module 1 and the frame structure C will be shielded by the surrounding light-shielding layer B, and no electronic components (such as image capturers, sensors, etc.) will be exposed from the surrounding area. The light-shielding layer B is exposed. In addition, the area between the second display module 2 and the frame structure C will be shielded by the surrounding light-shielding layer B, and no electronic components (such as image capturers, sensors, etc.) will be exposed from the surrounding shape. The light-shielding layer B is exposed.

[Second Embodiment]

Referring to FIGS. 1 to 6 , a second embodiment of the present invention provides a full-screen image display D, which includes: a first display module 1 for providing a first image and a second image. a second display module 2.

For example, the first display module 1 can be an organic light emitting diode (OLED) display, a liquid crystal display (LCD), a light emitting diode (LED) for providing a first image. Light Emitting Diode (LED) display or other types of displays, and the second display module 2 can be a LED display or other types of displays for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to or connected to each other, so the first image generated by the first display module 1 and the second image generated by the second display module 2 can be and connected into a continuous image.

For example, as shown in FIGS. 1 to 4 , the second display module 2 includes a circuit substrate 20 , an image display unit 21 provided on the circuit substrate 20 , and a plurality of electronic units provided on the circuit substrate 20 . For example, multiple electronic units can be divided into a light sensing unit, a light projection unit, an image capture unit and an audio transmission unit, and the image display unit 21, the light sensing unit, the light projection unit, the image capture unit The retrieval unit and the audio transmission unit are both arranged on the circuit substrate 20 . It is worth mentioning that the image display unit 21 includes a plurality of light-emitting diode chips 210 disposed on the circuit substrate 20 , and the second image can be provided by the plurality of light-emitting diode chips 210 .

For example, as shown in FIGS. 1 to 3 , the light sensing unit includes an ambient light sensor 22 disposed on the circuit substrate 20 and a proximity sensor disposed on the circuit substrate 20 . twenty three. Furthermore, the photometric sensor 22 includes a first light generating chip 221 for generating a first light source and a first light receiving chip 222 for receiving the first light source (reflected first light source), and the photometric sensor The device 22 can utilize the cooperation of the first light generating chip 221 and the first light receiving chip 222 to obtain environmental brightness information. In addition, the proximity sensor 23 includes a second light generating chip 231 for generating a second light source and a second light receiving chip 232 for receiving the second light source (reflected second light source), and the proximity sensor 23 can utilize the cooperation of the second light generating chip 231 and the second light receiving chip 232 to obtain a depth of field information. In addition, the first light generating chip 221 can be disposed between any two adjacent light emitting diode wafers 210, and the first light receiving chip 222 can be disposed between any two adjacent light emitting diode wafers 210. The second light generating chip 231 can be disposed between any two adjacent light emitting diode wafers 210, and the second light receiving chip 232 can be disposed between any two adjacent light emitting diode wafers 210.

For example, as shown in FIGS. 1 , 2 and 4 , the light projection unit includes a flood illuminator 24 disposed on the circuit substrate 20 and a drawing point projector disposed on the circuit substrate 20 (dot projector)25. In addition, the flood light projector 24 includes a plurality of infrared light generating chips 240 arranged in a specific shape, and the drawing point projector 25 includes a plurality of invisible light generating chips 250 arranged in a specific shape. Furthermore, each infrared light generating chip 240 can be disposed between any two adjacent light emitting diode wafers 210, and each invisible light generating chip 250 can be disposed between any two adjacent light emitting diode wafers 210. between.

For example, as shown in FIGS. 1 , 2 and 4 , the image capture unit includes a first image capture device 26 disposed on the circuit substrate 20 and a second image capture device disposed on the circuit substrate 20 Device 27. In addition, the first image capture device 26 can be an infrared camera, and the first image capture device 26 includes a plurality of first image capture chips 261 for capturing invisible light and are respectively disposed on A plurality of first optical lenses 262 (optical components) above the plurality of first image capturing wafers 261 . In addition, the second image capture device 27 can be a front camera, and the second image capture device 27 includes a plurality of second image capture chips 271 for capturing visible light and are respectively disposed on multiple second image capturing chips 271 . A plurality of second optical lenses 272 (optical components) above the second image capture chip 271. Furthermore, each first image capturing chip 261 can be disposed between any two adjacent light emitting diode chips 210, and each second image capturing chip 271 can be disposed between any two adjacent light emitting diodes. between bulk wafers 210.

For example, as shown in FIGS. 1 and 3 , the audio transmission unit includes a speaker 28 disposed on the circuit substrate 20 and a microphone 29 disposed on the circuit substrate 20 . Furthermore, the speaker 28 includes a plurality of sound signal transmitting chips 280 arranged in a specific shape, and the microphone 29 includes a plurality of sound signal receiving chips 290 arranged in a specific shape. In addition, each sound signal transmitting chip 280 can be disposed between any two adjacent light-emitting diode wafers 210, and each sound signal receiving chip 290 can be disposed between any two adjacent light-emitting diode wafers 210. .

It should be noted that the element configuration design of the display module of the present invention is not limited to the above embodiment, and it can also adopt the method of only arranging the optical sensing element at a position on the circuit substrate where the image display unit is not arranged (for example, the optical sensing element The design can be arranged between any two adjacent image display units, but is not limited to this), thereby integrating the optical sensing element and the image display unit on the same circuit substrate, thereby solving the problem that the optical sensing module in the previous technology must be The problem of setting up the components (such as front camera lens, infrared projection sensor, fingerprint recognition component, etc.) separately from the display module.

That is to say, in another embodiment, the image display of the present invention may include a single display module (but is not limited to this). For example, the image display of the present invention may also include each other as described in the above embodiment. Two display modules are spliced, such as the first display module 1 and the second display module 2 as shown in Figure 1). The display module in this embodiment may include a circuit substrate and be disposed on the circuit substrate in a matrix manner. A plurality of image display units (such as light-emitting diode chips, but not limited to this) arranged, and at least one optical sensing element (such as complementary metal) disposed at a position where the image display unit is not disposed on the circuit substrate Complementary Metal-Oxide-Semiconductor (CMOS) photosensitive chip, but not limited thereto), as for other related descriptions of this embodiment (such as the arrangement design of optical sensing elements and image display units on the circuit substrate, The panel type of the display module, etc.) can be deduced with reference to the above embodiments and will not be described again here).

In practical applications, the proportional value of the number of the above-mentioned image display units and optical sensing elements is preferably between 1 and 100,000. For example, in an application where the optical sensing element is an image capture unit and is integrated with the image display unit on a circuit substrate, for example, the image capture unit can be 50,000 CMOS chips (each CMOS chip has 20 *20 pixel array) to form a front-facing camera lens that can provide a 20-megapixel camera function, and the image display unit can be 2.1 million light-emitting diode chips (such as red, green, and blue micro light-emitting diodes) (Micro LED)) to provide an image display function with a resolution of 2000*350, the ratio of the number of image display units and optical sensing elements can be equal to 42 (i.e. 2.1 million/50,000), that is to say, in In the above integrated application of image capture and image display, the ratio of the number of image display units and optical sensing elements can be between 10 and 100, but is not limited to this.

On the other hand, if the optical sensing element is a light projection unit, a light sensing element, or a combination of the two and is integrated with the image display unit on the circuit substrate, for example, the light projection unit and the light sensing element The combination can be 3500 CMOS chips (each CMOS chip has a 20*20 pixel array) to form an infrared projection sensor that can provide 1.4 million pixels infrared projection sensing function, and the image display unit can be 2.1 million light-emitting diode chips (such as red, green, and blue micro light-emitting diodes) to provide an image display function with a resolution of 2000*350, the proportion of the number of image display units and optical sensing elements can be Equal to 600 (i.e. 2.1 million/3500), that is to say, in the above integrated application of light projection and image display, the ratio of the number of image display units and optical sensing elements can be between 100 and 1000, but not This is the limit.

On the other hand, if the optical sensing element is a fingerprint recognition element and is integrated with the image display unit on the circuit substrate, for example, the optical sensing element can be 400 CMOS chips (each A CMOS chip has a 20*20 pixel array) to form a fingerprint identification element that can provide a 160,000-pixel fingerprint identification function, and the image display unit can be 2.1 million light-emitting diode chips (such as red, green, and blue micro light-emitting diode) to provide an image display function with a resolution of 2000*350, then the ratio of the number of image display units and optical sensing elements can be equal to 5250 (i.e. 2.1 million/400), that is to say, in In the above-mentioned integrated application of optical recognition and image display, the number ratio of the image display unit and the optical sensing element can be between 1,000 and 10,000, but is not limited to this.

It is worth noting that, as shown in FIGS. 2 and 5 , the plurality of first optical lenses 262 can be disposed separately from each other on the same first plane P1, and the plurality of first optical lenses 262 are arranged from the inside out (from the inside out). (circle toward the outer circle) gradually tilts outward. In addition, at least one first optical lens 262 has a first vertical optical axis LV1, and each of the remaining first optical lenses 262 has a first tilted optical axis LS1. In addition, the first vertical optical axis LV1 of at least one first optical lens 262 and the first tilted optical axis LS1 of each first optical lens 262 intersect with each other, and the plurality of first tilted optical axes of the plurality of first optical lenses 262 The angle (θ 1, θ 2) of LS1 relative to the first vertical optical axis LV1 will gradually increase from the inside out (that is, θ 1<θ 2). Furthermore, since a part of the image can be captured through the cooperation of the first image capturing chip 261 and the corresponding first optical lens 262, the plurality of first image capturing chips 261 are respectively connected with the corresponding first optical lens 262. The cooperation of multiple first optical lenses 262 can capture a complete image composed of multiple partial images.

It is worth noting that, as shown in FIG. 2 and FIG. 6 , the plurality of second optical lenses 272 can be disposed separately from each other on the same second plane P2, and the plurality of second optical lenses 272 are arranged from the inside out (from the inside out). (circle toward the outer circle) gradually tilts outward. In addition, at least one second optical lens 272 has a second vertical optical axis LV2, and each of the remaining second optical lenses 272 has a second inclined optical axis LS2. In addition, the second vertical optical axis LV2 of the at least one second optical lens 272 and the second tilted optical axis LS2 of each second optical lens 272 intersect with each other, and the plurality of second tilted optical axes of the plurality of second optical lenses 272 The angle (θ 1, θ 2) of LS2 relative to the second vertical optical axis LV2 will gradually increase from the inside out (that is, θ 1<θ 2). Even Furthermore, because a part of the image can be captured through the cooperation of the second image capturing chip 271 and the corresponding second optical lens 272, the plurality of second image capturing chips 271 are respectively connected with the corresponding plurality of images. With the cooperation of two second optical lenses 272, a complete image composed of multiple partial images can be captured.

[Beneficial effects of the embodiment]

One of the beneficial effects of the present invention is that the portable electronic device Z and its full-screen image display D provided by the present invention can be used to provide a first image through the "first display module 1, and the second The display module 2 is used to provide a second image." "The first display module 1 and the second display module 2 are adjacent to or connected to each other, and the first image and the second image are connected to form a continuous image." The two display modules 2 include a circuit substrate 20, an image display unit 21 provided on the circuit substrate 20, and a plurality of electronic units provided on the circuit substrate 20" and "the image display unit 21 includes an image display unit 21 provided on the circuit substrate 20. "A plurality of light-emitting diode chips 210, and the second image is provided by a plurality of light-emitting diode chips 210", so that the full-screen image display D provided by the present invention does not need to avoid multiple electronic units. The occupied area can provide full-screen continuous images.

The above are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the patentable scope of the present invention shall fall within the scope of the present invention.

C: border structure

B: Surrounding light-shielding layer

1: First display module

2: Second display module

20:Circuit substrate

21:Image display unit

210: Light emitting diode chip

23: Proximity sensor

231: Second light generating chip

232: Second light receiving chip

28: Speaker

280: Sound signal transmitting chip

29:Microphone

290: Sound signal receiving chip

Claims (8)

A display module, which includes: a circuit substrate; a plurality of image display units, which are provided on the circuit substrate and arranged in a matrix; and at least one audio transmission unit, which is provided on the circuit substrate without the The plurality of image display units are positioned between any two adjacent image display units. The display module as described in claim 1, wherein the ratio of the number of the plurality of image display units and the at least one audio transmission unit is between 1 and 100,000. The display module of claim 1, wherein the at least one audio transmission unit is a speaker. The display module of claim 1, wherein the at least one audio transmission unit is a microphone. An image display including the display module as described in any one of claims 1 to 4. The image display as claimed in claim 5, wherein the image display further includes another display module, and the display module is spliced to the other display module. The image display as claimed in claim 6, wherein the other display module is a liquid crystal display (Liquid Crystal Display, LCD) panel. The image display as claimed in claim 6, wherein the other display module is an organic light emitting diode (OLED) panel.

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