TWI779445B - Display module and image display device thereof - Google Patents

Abstract

A display module includes a circuit substrate, a plurality of image display units and at least one optical sensor. The plurality of image display units is disposed on the circuit substrate and is arranged in a matrix. The optical sensor is disposed at a position of the circuit substrate where there is no image display unit disposed thereon. A quantity ratio of the image display unit and the optical sensor is between 1 and 100000.

Description

Display module and its image display

The present invention relates to a display module and its image display, in particular to a display module and its image display in which an image display unit and an optical sensing element are arranged on the same circuit substrate.

A conventional portable electronic device includes a display module and an optical sensing module, but the display module and the optical sensing module are set separately, so that the display area of the display module must be reduced for optical sensing. Test module settings.

Therefore, one object of the present invention is to provide a display module and an image display thereof in which an image display unit and an optical sensing element are disposed on the same circuit substrate, so as to solve the above-mentioned problems.

According to an embodiment, the display module of the present invention includes a circuit substrate, a plurality of image display units, and at least one optical sensing element. The plurality of image display units are arranged on the circuit substrate and arranged in a matrix. The at least one optical sensing element is disposed on the circuit substrate where the plurality of image display units are not disposed, and the ratio of the plurality of image display units to the at least one optical sensing element is between 1 and 100,000 .

According to another embodiment, the image display of the present invention includes the above-mentioned display module.

In summary, the present invention adopts the method of disposing the optical sensing element at the position where the image display unit is not provided on the circuit substrate (for example, at a position between any two adjacent image display units, but not limited thereto). Designed to integrate the optical sensing element and the image display unit on the same circuit substrate, so as to solve the problem that the prior art must combine the optical sensing module (such as the front camera lens, infrared projection sensor, fingerprint recognition element, etc.) with the display Issues with separate settings for modules.

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

Z: Portable Electronic Devices

C: frame structure

CL: left end

CR: right side

CT: upper side

CB: lower side

B: Surrounding shading layer

D: Full screen video display

1: The first display module

1L: left end

1R: right side

1T: upper side

1B: Lower end

2: The second display module

2L: left end

2R: right side

2T: upper side

2B: Lower end

20: Circuit board

21: Image display unit

210: light emitting diode chip

22: Luminosity sensor

221: The first light generation chip

222: the first light receiving chip

23: Proximity sensor

231: the second light generation chip

232: the second light receiving chip

24: Flood projector

240:Infrared light generating chip

25: Draw a point projector

250: Invisible light generating wafer

26: The first image capture device

261: The first image capture chip

262: The first optical lens

P1: first plane

LV1: The first vertical optical axis

LS1: first inclined optical axis

27: The second image capture device

271: Second image capture chip

272: second optical lens

P2: second plane

LV2: Second vertical optical axis

LS2: second oblique optical axis

28:Speaker

280: Sound signal transmitter chip

29: Microphone

290: Sound signal receiving chip

θ 1, θ 2: angle

FIG. 1 is a schematic diagram of a portable electronic device according to a first embodiment of the present invention and a full-screen video display according to a second embodiment.

FIG. 2 is an enlarged schematic view of part II of FIG. 1 .

FIG. 3 is an enlarged schematic view of part III of FIG. 1 .

FIG. 4 is an enlarged schematic view of part IV of FIG. 1 .

5 is a schematic side view of a plurality of first optical lenses of the first image capture device provided by the full-screen image display according to the second embodiment of the present invention.

6 is a schematic side view of a plurality of second optical lenses of the second image capture device provided by the full-screen image display according to the second embodiment of the present invention.

The following is a description of the implementation of the "portable electronic device and its full-screen image display" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and disadvantages of the present invention from the content disclosed in this specification. Effect. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used in this article may include the associated listed Any one or combination of multiple items.

[first embodiment]

Referring to FIG. 1, the first embodiment of the present invention provides a portable electronic device Z, which includes a frame structure C and a full-screen image display D surrounded by the frame structure C, and the full-screen image display D It includes a first display module 1 for providing a first image and a second display module 2 for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to or connected to each other, so the first image generated by the first display module 1 and the second image generated by the second display module 2 can be And spliced into a continuous image or a complete image.

Furthermore, as shown in FIG. 1 , the frame structure C has a left end CL, a right end CR, an upper end CT and a lower end CB, and the first display module 1 has a left end 1L and a right end 1R, an upper end 1T and a lower end 1B, and the second display module 2 has a left end 2L, a right end 2R, an upper end 2T and a lower end 2B. Moreover, the left end 1L of the first display module 1 is close to or very close to the left end CL of the frame structure C, so that there is no any arrangement between the left end 1L of the first display module 1 and the left end CL of the frame structure C. Exposed electronic components (such as image capture devices, sensors, etc.). The right end 1R of the first display module 1 is close or very close to the right end CR of the frame structure C, so that no exposed electronics are provided between the right end 1R of the first display module 1 and the right end CR of the frame structure C. element. The lower end 1B of the first display module 1 is close to or very close to the lower end CB of the frame structure C, so that there is no gap between the lower end 1B of the first display module 1 and the lower end CB of the frame structure C. any exposed electronic components. In addition, the left end 2L of the second display module 2 is close or very close to the left end CL of the frame structure C, so that there is no exposed area between the left end 2L of the second display module 2 and the left end CL of the frame structure C. of electronic components. The right end 2R of the second display module 2 is close to or very close to the right end CR of the frame structure C, so that no exposed electronics are provided between the right end 2R of the second display module 2 and the right end CR of the frame structure C. element. The upper end 2T of the second display module 2 is close or very close to the upper end CT of the frame structure C, so that no exposed electronics are provided between the upper end 2T of the second display module 2 and the upper end CT of the frame structure C. element. It should be noted that the upper end 1T of the first display module 1 and the lower end 2B of the second display module 2 are adjacent to or connected to each other.

For example, as shown in FIG. 1 , the portable electronic device Z includes a continuous surrounding light-shielding layer B without perforations. The surrounding light-shielding layer B will surround the first display module 1 and the second display module 2, And the surrounding light-shielding layer B will be surrounded by the frame structure C. In this way, the area between the first display module 1 and the frame structure C will be shielded by the surrounding light-shielding layer B, without any electronic components (such as image capture devices, sensors, etc.) from surrounding Shaped shading layer B is exposed. In addition, the area between the second display module 2 and the frame structure C will be shielded by the surrounding light-shielding layer B, so that no electronic components (such as image capture devices, sensors, etc.) will be shielded from the surrounding shape. The light-shielding layer B is exposed.

[Second embodiment]

1 to 6, the second embodiment of the present invention provides a full-screen image display D, which includes: a first display module 1 for providing a first image and a second image for providing a second display module 2 .

For example, the first display module 1 can be an organic light emitting diode (Organic Light Emitting Diode, OLED) display, a liquid crystal display (Liquid Crystal Display, LCD), a light emitting diode ( Light Emitting Diode (LED) display or other types of displays, and the second display module 2 can be an LED display or other types of displays for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to or connected to each other, so the first image generated by the first display module 1 and the second image generated by the second display module 2 can be And connected into a continuous image.

For example, as shown in FIG. 1 to FIG. 4 , the second display module 2 includes a circuit substrate 20 , an image display unit 21 disposed on the circuit substrate 20 , and a plurality of electronic units disposed on the circuit substrate 20 . For example, multiple electronic units can be divided into a light sensing unit, a light projection unit, an image capture unit, and an audio transmission unit, and the image display unit 21, light sensing unit, light projection unit, image capture unit The fetching unit and the audio sending unit are both arranged on the circuit substrate 20. It is worth mentioning that the image display unit 21 includes a plurality of LED chips 210 disposed on the circuit substrate 20, and The second image can be provided by a plurality of LED chips 210 .

For example, as shown in FIG. 1 to FIG. 3 , the light sensing unit includes an ambient light sensor 22 disposed on the circuit substrate 20 and a proximity sensor disposed on the circuit substrate 20. twenty three. Furthermore, the photometric sensor 22 includes a first light generating chip 221 for generating a first light source and a first light receiving chip 222 for receiving the first light source (reflected first light source), and the photometric sensor The device 22 can utilize the cooperation of the first light-generating chip 221 and the first light-receiving chip 222 to obtain ambient brightness information. In addition, the proximity sensor 23 includes a second light generating chip 231 for generating a second light source and a second light receiving chip 232 for receiving the second light source (reflected second light source), and the proximity sensor 23 can utilize the cooperation of the second light generating chip 231 and the second light receiving chip 232 to obtain a depth of field information. In addition, the first light generating chip 221 can be disposed between any two adjacent LED chips 210 , and the first light receiving chip 222 can be disposed between any two adjacent LED chips 210 . The second light generating chip 231 can be disposed between any two adjacent LED chips 210 , and the second light receiving chip 232 can be disposed between any two adjacent LED chips 210 .

For example, as shown in FIG. 1 , FIG. 2 and FIG. 4 , the light projection unit includes a flood illuminator 24 disposed on the circuit substrate 20 and a drawing point projector disposed on the circuit substrate 20 (dot projector)25. In addition, the flood projector 24 includes a plurality of infrared light generating chips 240 arranged in a specific shape, and the drawing point projector 25 includes a plurality of invisible light generating chips 250 arranged in a specific shape. Furthermore, each infrared light generating chip 240 can be arranged between any two adjacent light emitting diode chips 210, and each invisible light generating chip 250 can be arranged between any two adjacent light emitting diode chips 210 between.

For example, as shown in FIG. 1 , FIG. 2 and FIG. 4 , the image capture unit includes a first image capture device 26 disposed on the circuit substrate 20 and a second image capture device disposed on the circuit substrate 20 device 27. In addition, the first image capture device 26 can be an infrared camera (Infrared camera), and the first image The image capture unit 26 includes a plurality of first image capture chips 261 for capturing invisible light, and a plurality of first optical lenses 262 (optical components) disposed above the plurality of first image capture chips 261 . In addition, the second image capture device 27 can be a front camera lens (Front camera), and the second image capture device 27 includes a plurality of second image capture chips 271 for capturing visible light and are respectively arranged in multiple A plurality of second optical lenses 272 (optical components) above the second image capture chip 271. Furthermore, each first image capture chip 261 can be disposed between any two adjacent LED chips 210, and each second image capture chip 271 can be disposed between any two adjacent LED chips. between bulk wafers 210.

For example, as shown in FIG. 1 and FIG. 3 , the audio transmission unit includes a speaker 28 disposed on the circuit substrate 20 and a microphone 29 disposed on the circuit substrate 20 . Furthermore, the speaker 28 includes a plurality of sound signal emitting chips 280 arranged in a specific shape, and the microphone 29 includes a plurality of sound signal receiving chips 290 arranged in a specific shape. In addition, each sound signal transmitting chip 280 can be arranged between any two adjacent light emitting diode chips 210, and each sound signal receiving chip 290 can be arranged between any two adjacent light emitting diode chips 210 .

It should be noted that the element configuration design of the display module of the present invention is not limited to the above-mentioned embodiments, and it can also adopt only the optical sensing element to be arranged on the position where the image display unit is not arranged on the circuit substrate (such as the optical sensing element It can be arranged between any two adjacent image display units, but not limited thereto), so as to integrate the optical sensing element and the image display unit on the same circuit substrate, so as to solve the problem that the prior art must integrate the optical sensing module Groups (such as front camera lenses, infrared projection sensors, fingerprint recognition components, etc.) are set separately from the display module.

That is to say, in another embodiment, the image display of the present invention may include a single display module (but not limited thereto, for example, the image display of the present invention may also include each other as described in the above-mentioned embodiments The two display modules that are spliced, such as the first display module 1 and the second display module 2 shown in Figure 1), the display module in this embodiment can include a circuit substrate, be arranged on the circuit substrate and form a matrix A plurality of image display units arranged (such as light-emitting diode chips, but not limited thereto), and arranged in At least one optical sensing element (such as complementary metal oxide semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS) photosensitive chip, but not limited to) at the position where the image display unit is not provided on the circuit substrate, as for this embodiment Other related descriptions (such as the arrangement design of the optical sensing element and the image display unit on the circuit substrate, the panel type of the display module, etc.), which can be deduced by referring to the above-mentioned embodiments, will not be repeated here).

In practical applications, the ratio of the number of the image display units to the optical sensing elements is preferably between 1 and 100,000. For example, if the optical sensing element is an image capture unit to be integrated with the image display unit on the circuit substrate, for example, the image capture unit can be 50,000 CMOS chips (each CMOS chip has 20 *20 pixel array) to form a front-facing camera lens that can provide 20 million pixel camera functions, and the image display unit can be 2.1 million light-emitting diode chips (such as red, green, blue micro light-emitting diodes (Micro LED)) to provide an image display function with a resolution of 2000*350, the ratio of the number of image display units to optical sensing elements can be equal to 42 (that is, 2.1 million/50,000), that is, in In the above-mentioned integrated application of image capture and image display, the ratio of the number of image display units to optical sensing elements can be between 10-100, but not limited thereto.

On the other hand, if the optical sensing element is a light projection unit, or a light sensing element, or a combination of the two to be integrated with the image display unit on the circuit substrate, for example, the light projection unit and the light sensing element The combination system can be 3500 CMOS chips (each CMOS chip has a pixel array of 20*20) to form an infrared projection sensor that can provide 1.4 million pixel infrared projection sensing function, and the image display unit can be 2.1 million light-emitting diode chips (such as red, green, and blue miniature light-emitting diodes) to provide an image display function with a resolution of 2000*350, the ratio of the number of image display units to optical sensing elements can be set It is equal to 600 (that is, 2.1 million/3500). That is to say, in the above-mentioned integrated application of light projection and image display, the ratio of the number of image display units to optical sensing elements can be between 100 and 1000, but not This is the limit.

On the other hand, if the optical sensing element is a fingerprint identification element and the image display unit In the application of co-integration on the circuit substrate, for example, the optical sensing element can be 400 CMOS chips (each CMOS chip has a 20*20 pixel array) to form a fingerprint recognition that can provide a fingerprint recognition function of 160,000 pixels Components, and the image display unit can be 2.1 million light-emitting diode chips (such as red, green, blue miniature light-emitting diodes) to provide an image display function with a resolution of 2000*350, then the image display unit and optical sense The setting quantity ratio of the measuring elements can be equal to 5250 (that is, 2.1 million/400), that is to say, in the above-mentioned integrated application of optical recognition and image display, the setting quantity ratio of the image display unit and the optical sensing element can be set between Between 1000~10000, but not limited to this.

It should be noted that, as shown in FIG. 2 and FIG. 5 , a plurality of first optical lenses 262 can be arranged on the same first plane P1 separately from each other, and the plurality of first optical lenses 262 are arranged from inside to outside (from inside to outside). circle to the outer circle) gradually slopes outward. In addition, at least one first optical lens 262 has a first vertical optical axis LV1, and each of the remaining first optical lenses 262 has a first oblique optical axis LS1. In addition, the first vertical optical axis LV1 of at least one first optical lens 262 and the first inclined optical axis LS1 of each first optical lens 262 intersect with each other, and the plurality of first inclined optical axes of the plurality of first optical lenses 262 The angle (θ 1 , θ 2 ) of LS1 relative to the first vertical optical axis LV1 gradually increases from inside to outside (ie, θ 1<θ 2 ). Furthermore, since a part of the image can be captured through the cooperation of the first image capture chip 261 and the corresponding first optical lens 262, so through the first image capture chip 261 and the corresponding first optical lens 262 respectively The cooperation of multiple first optical lenses 262 can capture a complete image composed of multiple partial images.

It should be noted that, in conjunction with what is shown in FIG. 2 and FIG. 6, a plurality of second optical lenses 272 can be arranged on the same second plane P2 separately from each other, and the plurality of second optical lenses 272 are arranged from inside to outside (from inside to outside). circle to the outer circle) gradually slopes outward. In addition, at least one second optical lens 272 has a second vertical optical axis LV2, and each of the remaining second optical lenses 272 has a second inclined optical axis LS2. In addition, the second vertical optical axis LV2 of at least one second optical lens 272 and the second inclined optical axis LS2 of each second optical lens 272 intersect with each other, and the plurality of second inclined optical axes of the plurality of second optical lenses 272 LS2 relative to the second vertical The angle (θ 1, θ 2) of the straight optical axis LV2 will gradually increase from inside to outside (that is, θ 1<θ 2). Furthermore, since a part of the image can be captured through the cooperation of the second image capture chip 271 and the corresponding second optical lens 272, so through the plurality of second image capture chips 271 and the corresponding The cooperation of multiple second optical lenses 272 can capture a complete image composed of multiple partial images.

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that the portable electronic device Z and its full-screen image display D provided by the present invention can be used to provide a first image through "the first display module 1, and the second The display module 2 is used to provide a second image", "the first display module 1 and the second display module 2 are adjacent to or connected to each other, and the first image and the second image are merged to form a continuous image", "the second The second display module 2 includes a circuit substrate 20, an image display unit 21 arranged on the circuit substrate 20, and a plurality of electronic units arranged on the circuit substrate 20" and "the image display unit 21 includes an image display unit 21 arranged on the circuit substrate 20 a plurality of light-emitting diode chips 210, and the second image is provided by a plurality of light-emitting diode chips 210", so that the full-screen image display D provided by the present invention does not need to avoid multiple electronic units The occupied area can provide full-screen continuous images.

The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Z: Portable Electronic Devices

C: frame structure

CL: left end

CR: right side

CT: upper side

CB: lower side

B: Surrounding shading layer

D: Full screen video display

1: The first display module

1L: left end

1R: right side

1T: upper side

1B: Lower end

2: The second display module

2L: left end

2R: right side

2T: upper side

2B: Lower end

Claims (12)

A display module, which includes: a circuit substrate; a plurality of image display units, which are arranged on the circuit substrate and arranged in a matrix; and at least one optical sensing element, which is arranged on the circuit substrate but not arranged The plurality of image display units are disposed between any two adjacent image display units, and the ratio of the plurality of image display units to the at least one optical sensing element is between 1 and 100,000. The display module according to claim 1, wherein the image display unit is a light emitting diode (Light emitting Diode, LED) chip. The display module according to claim 1, wherein the at least one optical sensing element is an image capture unit. The display module according to claim 3, wherein the ratio of the number of the plurality of image display units to the at least one optical sensing element is between 10-100. The display module according to claim 1, wherein the at least one optical sensing element is a light projection unit, or a light sensing element, or a combination of both. The display module according to claim 5, wherein the ratio of the number of the plurality of image display units to the at least one optical sensing element is between 100-1000. The display module according to claim 1, wherein the at least one optical sensing element is a fingerprint recognition element. The display module according to claim 7, wherein the ratio of the number of the plurality of image display units to the at least one optical sensing element is between 1000-10000. An image display, comprising the display module according to any one of Claims 1-8. The image display according to claim 9, wherein the image display further includes another display module, and the display module is spliced with the other display module. The video display as claimed in item 10, wherein the other display module is a liquid crystal display (Liquid Crystal Display, LCD) panel. The image display as claimed in claim 10, wherein the other display module is an organic light emitting diode (Organic Light Emitting Diode, OLED) panel.

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