CN213904818U - Display module and image display thereof - Google Patents

Abstract

The utility model relates to a display module and image display thereof. The display module comprises a circuit substrate, a plurality of image display units and at least one optical sensing component. The plurality of image display units are arranged on the circuit substrate and are arranged in a matrix manner. The optical sensing assembly is arranged at a position where the circuit substrate is not provided with the plurality of image display units.

Description

Display module and image display thereof

Technical Field

The present invention relates to a display module and an image display device thereof, and more particularly to a display module and an image display device thereof, in which an image display unit and an optical sensing module are disposed on a same circuit substrate.

Background

The conventional portable electronic device includes a display module and an optical sensing module, but the display module and the optical sensing module are separately disposed, so that the display area of the display module must be reduced for the optical sensing module to be disposed.

SUMMERY OF THE UTILITY MODEL

Therefore, one of the objectives of the present invention is to provide a display module and an image display thereof, in which an image display unit and an optical sensing assembly are disposed on the same circuit substrate, so as to solve the above-mentioned problems.

According to an embodiment, the display module of the present invention includes a circuit substrate, a plurality of image display units, and at least one optical sensing element. The plurality of image display units are arranged on the circuit substrate and are arranged in a matrix manner. The at least one optical sensing component is arranged at the position of the circuit substrate where the plurality of image display units are not arranged.

According to another embodiment, the image display of the present invention comprises the display module.

To sum up, the utility model discloses a set up the optical sensing subassembly in the circuit substrate not set up the position department of image display unit (for example set up the position department between arbitrary two adjacent image display units, but not so as to limit) the design to integrate optical sensing subassembly and image display unit on same circuit substrate, thereby solve the background art and must separately set up the problem of optical sensing module (like leading camera lens, infrared ray projection sensor, fingerprint identification subassembly etc.) and display module.

The advantages and spirit of the present invention can be further understood by the following detailed description of the embodiments and the accompanying drawings.

Drawings

Fig. 1 is a schematic view of a portable electronic device according to a first embodiment of the present invention and a full-screen image display according to a second embodiment of the present invention.

Fig. 2 is an enlarged schematic view of section II of fig. 1.

Fig. 3 is an enlarged schematic view of a portion III of fig. 1.

Fig. 4 is an enlarged schematic view of the portion IV of fig. 1.

Fig. 5 is a schematic side view of a plurality of first optical lenses of a first image capturing device provided in a full-screen image display according to a second embodiment of the present invention.

Fig. 6 is a schematic side view of a plurality of second optical lenses of a second image capture device provided in a full-screen image display according to a second embodiment of the present invention.

Reference numerals:

z-type portable electronic device

C is frame structure

CL left side end

CR, right side end

Upper side of CT

CB lower side end

B surrounding light shielding layer

D, full screen type image display

1: first display module

1L left side end

1R the right side end

1T upper side end

1B lower side end

2: second display module

2L left side end

2R right side terminal

2T upper side end

2B lower side end

20: circuit board

21 image display unit

210 light emitting diode chip

22 brightness sensor

221 first light source generating chip

222 first light source receiving chip

23 proximity sensor

231 second light source generating chip

232 second light source receiving chip

24 flood projector

240 infrared light generating chip

25-projection device for drawing points

250 invisible light generating chip

26 first image capturing device

261 first image capturing chip

262 first optical lens

P1 first plane

LV1 first vertical optical axis

LS1 first inclined optical axis

27 second image capturing device

271 second image capturing chip

272 second optical lens

P2 second plane

LV2 second perpendicular optical axis

LS2 second inclined optical axis

28 speaker

280 sound signal transmitting chip

29 microphone

290 sound signal receiving chip

Angle theta 1, theta 2

Detailed Description

The following description will be made of specific embodiments of the present invention with reference to the accompanying drawings, in which the present invention is disclosed in the form of "a portable electronic device and a full-screen image display thereof". The advantages and effects of the present invention can be understood by those skilled in the art from the disclosure of the present specification. The utility model discloses the concrete embodiment of accessible other differences is carried out or is used, and each item detail in this specification also can be based on different viewpoints and application, does not deviate from the utility model discloses a carry out various modifications and changes under the design. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1, a first embodiment of the present invention provides a portable electronic device Z, which includes a frame structure C and a full-screen image display D surrounded by the frame structure C, and the full-screen image display D includes a first display module 1 for providing a first image and a second display module 2 for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to each other or connected to each other, so that the first image generated by the first display module 1 and the second image generated by the second display module 2 can be spliced into a continuous image or a complete image.

More specifically, as shown in fig. 1, the frame structure C has a left side CL, a right side CR, an upper side CT and a lower side CB; the first display module 1 has a left side 1L, a right side 1R, an upper side 1T and a lower side 1B; the second display module 2 has a left side 2L, a right side 2R, an upper side 2T and a lower side 2B. Furthermore, the left side end 1L of the first display module 1 is close to or very close to the left side end CL of the frame structure C, so that no exposed electronic components (such as an image capturing device, a sensor, etc.) are disposed between the left side end 1L of the first display module 1 and the left side end CL of the frame structure C. The right side end 1R of the first display module 1 is close to or very close to the right side end CR of the frame structure C, so that no exposed electronic components are disposed between the right side end 1R of the first display module 1 and the right side end CR of the frame structure C. The lower side end 1B of the first display module 1 is close to or very close to the lower side end CB of the frame structure C, so that no exposed electronic component is disposed between the lower side end 1B of the first display module 1 and the lower side end CB of the frame structure C. In addition, the left end 2L of the second display module 2 is close to or very close to the left end CL of the frame structure C, so that no exposed electronic component is disposed between the left end 2L of the second display module 2 and the left end CL of the frame structure C. The right side end 2R of the second display module 2 is close or very close to the right side end CR of the frame structure C, so that no exposed electronic components are disposed between the right side end 2R of the second display module 2 and the right side end CR of the frame structure C. The upper side end 2T of the second display module 2 is close to or very close to the upper side end CT of the frame structure C, so that no exposed electronic component is disposed between the upper side end 2T of the second display module 2 and the upper side end CT of the frame structure C. It should be noted that the upper end 1T of the first display module 1 and the lower end 2B of the second display module 2 are adjacent to or connected to each other.

For example, as shown in fig. 1, the portable electronic device Z includes a continuous surrounding-shaped light shielding layer B without a through hole, the surrounding-shaped light shielding layer B surrounds the first display module 1 and the second display module 2, and the surrounding-shaped light shielding layer B is surrounded by the frame structure C. Thus, the area between the first display module 1 and the frame structure C is shielded by the surrounding light-shielding layer B, and no electronic component (such as an image capture device, a sensor, etc.) is exposed from the surrounding light-shielding layer B. In addition, the area between the second display module 2 and the frame structure C is shielded by the surrounding light-shielding layer B, and no electronic components (such as an image capture device, a sensor, etc.) are exposed from the surrounding light-shielding layer B.

Second embodiment

Referring to fig. 1 to 6, a second embodiment of the present invention provides a full-screen image display device D, which includes: a first display module 1 for providing a first image and a second display module 2 for providing a second image.

For example, the first Display module 1 may be an Organic Light Emitting Diode (OLED) Display, a Liquid Crystal Display (LCD), a Light Emitting Diode (LED) Display or other types of displays for providing a first image, and the second Display module 2 may be an LED Display or other types of displays for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to each other or connected to each other, so that the first image generated by the first display module 1 and the second image generated by the second display module 2 can be spliced into a continuous image.

For example, as shown in fig. 1 to 4, the second display module 2 includes a circuit substrate 20, an image display unit 21 disposed on the circuit substrate 20, and a plurality of electronic units disposed on the circuit substrate 20. For example, the electronic units can be divided into a light sensing unit, a light projecting unit, an image capturing unit and an audio transmitting unit, and the image display unit 21, the light sensing unit, the light projecting unit, the image capturing unit and the audio transmitting unit are disposed on the circuit substrate 20. It is worth mentioning that the image display unit 21 includes a plurality of light emitting diode chips 210 disposed on the circuit substrate 20, and the second image may be provided by the plurality of light emitting diode chips 210.

For example, as shown in fig. 1 to fig. 3, the photo sensing unit includes a brightness sensor (ambient light sensor)22 disposed on the circuit substrate 20 and a proximity sensor (proximity sensor)23 disposed on the circuit substrate 20. In addition, the luminance sensor 22 includes a first light source generating chip 221 for generating a first light source and a first source light receiving chip 222 for receiving the first light source (the reflected first light source), and the luminance sensor 22 can obtain an ambient luminance information by using the first light source generating chip 221 and the first light source receiving chip 222. In addition, the proximity sensor 23 includes a second light source generating chip 231 for generating a second light source and a second source light receiving chip 232 for receiving the second light source (the reflected second light source), and the proximity sensor 23 can obtain a depth of field information by using the second light source generating chip 231 and the second light source receiving chip 232. In addition, the first light source generating chip 221 can be disposed between any two adjacent light emitting diode chips 210, and the first light source receiving chip 222 can be disposed between any two adjacent light emitting diode chips 210. The second light source generating chip 231 can be disposed between any two adjacent light emitting diode chips 210, and the second light source receiving chip 232 can be disposed between any two adjacent light emitting diode chips 210.

For example, as shown in fig. 1, 2 and 4, the light projection unit includes a flood projector (flood projector) 24 disposed on the circuit substrate 20 and a dot projector (dot projector)25 disposed on the circuit substrate 20. In addition, the floodlight projector 24 includes a plurality of infrared light generating chips 240 arranged in a specific shape, and the drawing point projector 25 includes a plurality of invisible light generating chips 250 arranged in a specific shape. In addition, each infrared light generating chip 240 can be disposed between any two adjacent light emitting diode chips 210, and each invisible light generating chip 250 can be disposed between any two adjacent light emitting diode chips 210.

For example, referring to fig. 1, 2 and 4, the image capturing unit includes a first image capturing device 26 disposed on the circuit substrate 20 and a second image capturing device 27 disposed on the circuit substrate 20. In addition, the first image acquirer 26 may be an Infrared camera (Infrared camera), and the first image acquirer 26 includes a plurality of first image acquisition chips 261 for acquiring invisible light and a plurality of first optical lenses 262 (optical elements) respectively disposed above the plurality of first image acquisition chips 261. In addition, the second image acquirer 27 may be a Front camera lens (Front camera), and the second image acquirer 27 includes a plurality of second image acquisition chips 271 for acquiring visible light and a plurality of second optical lenses 272 (optical elements) respectively disposed above the plurality of second image acquisition chips 271. In addition, each of the first image acquisition chips 261 can be disposed between any two adjacent light emitting diode chips 210, and each of the second image acquisition chips 271 can be disposed between any two adjacent light emitting diode chips 210.

For example, as shown in fig. 1 and fig. 3, the audio transmission unit includes a speaker 28 disposed on the circuit substrate 20 and a microphone 29 disposed on the circuit substrate 20. In addition, the speaker 28 includes a plurality of sound signal emitting chips 280 arranged in a specific shape, and the microphone 29 includes a plurality of sound signal receiving chips 290 arranged in a specific shape. In addition, each of the sound signal emitting chips 280 can be disposed between any two adjacent light emitting diode chips 210, and each of the sound signal receiving chips 290 can be disposed between any two adjacent light emitting diode chips 210.

It should be noted that the present invention is not limited to the above embodiments, and the present invention can also adopt a design that only the optical sensing component is disposed at a position where the circuit substrate is not disposed with the image display unit (for example, the optical sensing component can be disposed between any two adjacent image display units, but not limited thereto), so as to solve the problem that the background art must separately dispose the optical sensing module (such as the front camera lens, the infrared projection sensor, the fingerprint identification component, etc.) and the display module by integrating the optical sensing component and the image display unit on the same circuit substrate.

That is, in another embodiment, the image display of the present invention may include a single display module (but not limited thereto, for example, the image display of the present invention may also include two display modules spliced with each other as described in the above embodiment, such as the first display module 1 and the second display module 2 shown in fig. 1). The display module of this embodiment may include a circuit substrate, a plurality of image display units (e.g., but not limited to led chips) disposed on the circuit substrate and arranged in a matrix manner, and at least one optical sensing device (e.g., but not limited to a CMOS (Complementary Metal-Oxide-Semiconductor) sensor chip) disposed at a position of the circuit substrate where no image display unit is disposed), as for other related descriptions related to this embodiment (e.g., arrangement design of the optical sensing device and the image display units on the circuit substrate, panel type of the display module, etc.), which may refer to the above embodiments and so on, and are not described herein again.

In practical applications, the ratio of the number of the image display units to the number of the optical sensing elements is preferably between 1 and 100000. For example, if the optical sensing device is an application in which the image capturing unit and the image display unit are integrated on the circuit substrate, for example, the image capturing unit may be 5 ten thousand CMOS chips (each CMOS chip has a pixel array of 20 × 20) to form a front camera lens capable of providing 2000 ten thousand pixel photographing functions, and the image display unit may be 210 ten thousand light emitting diode chips (e.g., red, green, and blue Micro LEDs) to provide an image display function with a resolution of 2000 × 350, the ratio of the number of the image display units to the number of the optical sensing device may be equal to 42 (i.e., 210 ten thousand/5 ten thousand). That is, in the integrated application of image capturing and image displaying, the ratio of the number of the image display units and the number of the optical sensing elements can be between 10 and 100, but not limited thereto.

On the other hand, if the optical sensing device is a light projection unit, a light sensing device, or a combination of the two and the image display unit are integrated on the circuit substrate, for example, the combination of the light projection unit and the light sensing device may be 3500 CMOS chips (each CMOS chip has a pixel array of 20 × 20) to form an infrared projection sensor capable of providing an infrared projection sensing function of 140 ten thousand pixels, and the image display unit may be 210 ten thousand light emitting diode chips (such as red, green, and blue micro light emitting diodes) to provide an image display function with a resolution of 2000 × 350, the ratio of the number of the image display units to the number of the optical sensing device may be equal to 600 (i.e., 210 ten thousand/3500). That is, in the integrated application of light projection and image display, the ratio of the number of the image display units and the number of the optical sensing elements can be between 100 and 1000, but not limited thereto.

On the other hand, if the optical sensing device is a fingerprint identification device and the image display unit is integrated on the circuit substrate, for example, the optical sensing device may be 400 CMOS chips (each CMOS chip has a pixel array of 20 × 20) to form a fingerprint identification device capable of providing a fingerprint identification function of 16 ten thousand pixels, and the image display unit may be 210 ten thousand light emitting diode chips (such as red, green, and blue micro light emitting diodes) to provide an image display function with a resolution of 2000 × 350, the ratio of the number of the image display units and the optical sensing device may be equal to 5250 (i.e., 210 ten thousand/400). That is, in the integrated application of optical recognition and image display, the ratio of the number of the image display units and the number of the optical sensing elements can be between 1000 and 10000, but not limited thereto.

It is noted that, as shown in fig. 2 and fig. 5, the plurality of first optical lenses 262 may be disposed on the same first plane P1 separately from each other, and the plurality of first optical lenses 262 are inclined gradually outward from inside to outside (from inner circle to outer circle). In addition, at least one of the first optical lenses 262 has a first vertical optical axis LV1, and each of the remaining first optical lenses 262 has a first tilted optical axis LS 1. In addition, the first vertical optical axis LV1 of the at least one first optical lens 262 and the first inclined optical axis LS1 of each first optical lens 262 intersect with each other, and the angles (θ 1, θ 2) of the first inclined optical axes LS1 of the first optical lenses 262 with respect to the first vertical optical axis LV1 gradually increase from inside to outside (that is, θ 1< θ 2). Furthermore, since a portion of the image can be captured through the cooperation of the first image capturing chips 261 and the corresponding first optical lenses 262, a complete image composed of a plurality of portions of the image can be captured through the cooperation of the plurality of first image capturing chips 261 and the corresponding plurality of first optical lenses 262.

It is noted that, as shown in fig. 2 and fig. 6, the plurality of second optical lenses 272 may be disposed on the same second plane P2 separately from each other, and the plurality of second optical lenses 272 are inclined gradually outward from inside to outside (from inner circle to outer circle). In addition, at least one of the second optical lenses 272 has a second vertical optical axis LV2, and each of the remaining second optical lenses 272 has a second tilted optical axis LS 2. In addition, the second vertical optical axis LV2 of the at least one second optical lens 272 and the second inclined optical axis LS2 of each second optical lens 272 intersect with each other, and the angles (θ 1, θ 2) of the second inclined optical axes LS2 of the second optical lenses 272 with respect to the second vertical optical axis LV2 gradually increase from inside to outside (that is, θ 1< θ 2). Furthermore, since a portion of the image can be captured by the cooperation of the second image capturing chips 271 and the corresponding second optical lenses 272, a complete image composed of a plurality of portions of the image can be captured by the cooperation of the plurality of second image capturing chips 271 and the corresponding second optical lenses 272.

Advantageous effects of the embodiments

The utility model discloses an one of them beneficial effect lies in, the utility model provides a portable electronic device Z and full screen formula image display D thereof, it can be used for providing a first image through "first display module 1, and second display module 2 is used for providing a second image", "first display module 1 is adjacent each other or links to each other with second display module 2, and first image splices into a continuous image with the second image", "second display module 2 includes a circuit substrate 20, an image display unit 21 of setting on circuit substrate 20 and a plurality of electronic unit" of setting on circuit substrate 20 and "image display unit 21 is including setting up a plurality of emitting diode chips 210 on circuit substrate 20, and the second image is provided by a plurality of emitting diode chips 210", so that the utility model provides a full screen formula image display D can provide the full screen without avoiding the region that a plurality of electronic unit occupy Continuous images in a curtain.

The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made according to the scope of the claims of the present invention should be covered by the present invention.

Claims (10)

1. A display module, comprising:

a circuit substrate;

a plurality of image display units disposed on the circuit substrate and arranged in a matrix manner; and

at least one optical sensing component is arranged at the position of the circuit substrate where the plurality of image display units are not arranged.

2. The display module of claim 1, wherein the image display unit is a light emitting diode chip.

3. The display module of claim 1, wherein the at least one optical sensing element is an image capture unit.

4. The display module of claim 1, wherein the at least one optical sensing element is a light projection unit or a light sensing element or a combination thereof.

5. The display module of claim 1, wherein the at least one optical sensing element is a fingerprint recognition element.

6. The display module of claim 1, wherein the at least one optical sensing element is disposed between any two adjacent image display units.

7. An image display comprising the display module according to any one of claims 1 to 6.

8. An image display as claimed in claim 7, further comprising a further display module, wherein the display module is tiled to the further display module.

9. An image display as claimed in claim 8, characterized in that the further display module is a liquid crystal display panel.

10. An image display as claimed in claim 8, characterized in that the further display module is an organic light-emitting diode panel.

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