TW202217367A - Image-capturing unit and optical assembly thereof - Google Patents

Abstract

A full-screen image display and an optical assembly thereof are provided. The optical assembly includes a plurality of optical substrateless lenses separately disposed on the same plane, the optical substrateless lenses are respectively directly contacting a plurality of image-capturing chips that separate from each other, and the optical substrateless lenses are gradually and outwardly inclined from their inner to their outer. At least one of the optical substrateless lenses has a vertical optical axis, and each of the other optical substrateless lenses has an inclined optical axis. The vertical optical axis of the at least one optical substrateless lens and the inclined optical axis of each of the other optical substrateless lenses are intersected with each other, and the angles of the inclined optical axes relative to the vertical optical axis are gradually increased. Therefore, a full image composed of a plurality of partial images can be obtained by correspondingly matching the image-capturing chips and the optical substrateless lenses.

Description

Image capture unit and its optical components

The present invention relates to an optical capture unit and its components, in particular to an image capture unit and its optical components.

The existing image capture chip is equipped with an optical lens to capture a complete image, the image capture chip and the optical lens are separated from each other, and the optical lens needs to use an additional support frame or a carrier substrate.

The technical problem to be solved by the present invention is to provide an image capturing unit and an optical component thereof in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an optical assembly, which includes a plurality of substrateless optical lenses disposed on the same plane separately from each other, and the plurality of substrateless optical lenses are respectively in direct contact with each other A plurality of separated image capture chips, a plurality of substrateless optical lenses are gradually inclined outward from the inside to the outside, at least one substrateless optical lens has a vertical optical axis, and each of the remaining substrateless optical lenses has an inclined optical axis, The vertical optical axis of at least one substrateless optical lens and the inclined optical axis of each substrateless optical lens intersect with each other, and the angles of the plurality of inclined optical axes relative to the vertical optical axis of the plurality of substrateless optical lenses gradually increase from the inside to the outside .

In order to solve the above-mentioned technical problem, another technical solution adopted by the present invention is to provide an image capturing unit, which includes: a first image capturing device and a second image capturing device. The first image capture device includes a plurality of first image capture chips for capturing invisible light and a plurality of first substrateless optical lenses respectively directly contacting the plurality of first image capture chips. The second image capture device includes a plurality of second image capture chips for capturing visible light and a plurality of second substrateless optical lenses respectively directly contacting the plurality of second image capture chips. Wherein, the plurality of first image capture chips and the plurality of second image capture chips are all disposed on the same circuit substrate. Wherein, the plurality of first non-substrate optical lenses are disposed on a first plane separated from each other, and the plurality of first non-substrate optical lenses are gradually inclined outward from the inside to the outside. Wherein, the plurality of second non-substrate optical lenses are disposed on a second plane separated from each other, and the plurality of second non-substrate optical lenses are gradually inclined outward from the inside to the outside. Wherein, at least one first substrateless optical lens has a first vertical optical axis, each of the remaining first substrateless optical lenses has a first inclined optical axis, and at least one first substrateless optical lens has a first vertical optical axis The first inclined optical axes of each of the first substrateless optical lenses intersect each other, and the angles of the plurality of first inclined optical axes relative to the first vertical optical axis of the plurality of first substrateless optical lenses gradually increase from the inside to the outside . Wherein, at least one second substrateless optical lens has a second vertical optical axis, each of the remaining second substrateless optical lenses has a second inclined optical axis, and at least one second substrateless optical lens has a second vertical optical axis The second oblique optical axes of each of the second substrateless optical lenses intersect with each other, and the angles of the second oblique optical axes of the plurality of second substrateless optical lenses with respect to the second vertical optical axis gradually increase from the inside to the outside .

In order to solve the above-mentioned technical problem, another technical solution adopted by the present invention is to provide an image capture unit, which includes: a first image capture device, and the first image capture device includes a plurality of first image capture devices A chip and a plurality of first substrateless optical lenses respectively disposed on the plurality of first image capturing chips. Wherein, at least one first substrateless optical lens has a first vertical optical axis, each of the remaining first substrateless optical lenses has a first inclined optical axis, and at least one first substrateless optical lens has a first vertical optical axis The first inclined optical axes of each of the first substrateless optical lenses intersect each other, and the angles of the plurality of first inclined optical axes relative to the first vertical optical axis of the plurality of first substrateless optical lenses gradually increase from the inside to the outside .

One of the beneficial effects of the present invention is that the image capture unit and its optical assembly provided by the present invention can directly contact a plurality of image capture chips separated from each other through "a plurality of substrateless optical lenses", "a plurality of The no-substrate optical lens is gradually inclined outward from the inside out", "the vertical optical axis of at least one no-substrate optical lens and the inclined optical axis of each no-substrate optical lens intersect with each other" and "a plurality of The angle of the inclined optical axis relative to the vertical optical axis gradually increases from the inside to the outside”, so that the present invention can pass through the corresponding cooperation of a plurality of image capture chips and a plurality of corresponding substrateless optical lenses to achieve A complete image composed of a plurality of partial images is captured.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific embodiments to illustrate the embodiments of the “image capturing unit and its optical assembly” disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Referring to FIG. 1 , a first embodiment of the present invention provides a portable electronic device Z, which includes a frame structure C and a full-screen image display D surrounded by the frame structure C, and the full-screen image display D It includes a first display module 1 for providing a first image and a second display module 2 for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to or connected to each other, so the first image generated by the first display module 1 and the second image generated by the second display module 2 can be And connected into a continuous image or a complete image.

Further, as shown in FIG. 1 , the frame structure C has a left end CL, a right end CR, an upper end CT and a lower end CB, and the first display module 1 has a left end 1L and a right end. 1R, an upper end 1T and a lower end 1B, and the second display module 2 has a left end 2L, a right end 2R, an upper end 2T and a lower end 2B. Furthermore, the left end 1L of the first display module 1 is close to or very close to the left end CL of the frame structure C, so that nothing is disposed between the left end 1L of the first display module 1 and the left end CL of the frame structure C. Exposed electronic components (eg image grabbers, sensors, etc.). The right end 1R of the first display module 1 is close to or very close to the right end CR of the frame structure C, so that there is no exposed electronic device between the right end 1R of the first display module 1 and the right end CR of the frame structure C. element. The lower end 1B of the first display module 1 is close to or very close to the lower end CB of the frame structure C, so that there is no setting between the lower end 1B of the first display module 1 and the lower end CB of the frame structure C any exposed electronic components. In addition, the left end 2L of the second display module 2 is close to or very close to the left end CL of the frame structure C, so that there is no exposure between the left end 2L of the second display module 2 and the left end CL of the frame structure C of electronic components. The right end 2R of the second display module 2 is close to or very close to the right end CR of the frame structure C, so that there is no exposed electronic device between the right end 2R of the second display module 2 and the right end CR of the frame structure C element. The upper end 2T of the second display module 2 is close to or very close to the upper end CT of the frame structure C, so that there is no exposed electronic device between the upper end 2T of the second display module 2 and the upper end CT of the frame structure C element. It should be noted that the upper end 1T of the first display module 1 and the lower end 2B of the second display module 2 are adjacent to or connected to each other.

For example, as shown in FIG. 1 , the portable electronic device Z includes a surrounding light-shielding layer B that is continuous and has no perforations. The surrounding light-shielding layer B surrounds the first display module 1 and the second display module 2 . And the surrounding light shielding layer B will be surrounded by the frame structure C. Thereby, the area between the first display module 1 and the frame structure C will be shielded by the surrounding light shielding layer B, and there will be no electronic components (such as image capturers, sensors, etc.) from surrounding The shading layer B is exposed. In addition, the area between the second display module 2 and the frame structure C will be shielded by the surrounding light shielding layer B, and no electronic components (such as image capturers, sensors, etc.) will be shielded from the surrounding shape. The light shielding layer B is exposed. However, the present invention is not limited to the above-mentioned examples.

[Second Embodiment]

Referring to FIGS. 1 to 6 , a second embodiment of the present invention provides a full-screen image display D, which includes: a first display module 1 for providing a first image and a second image for providing a second image a second display module 2 .

For example, the first display module 1 can be an organic light emitting diode (Organic Light Emitting Diode, OLED) display, a liquid crystal display (Liquid Crystal Display, LCD), a light emitting diode ( Light Emitting Diode (LED) display or other types of displays, and the second display module 2 may be an LED display or other types of displays for providing a second image. In addition, the first display module 1 and the second display module 2 can be adjacent to or connected to each other, so the first image generated by the first display module 1 and the second image generated by the second display module 2 can be And connected into a continuous image. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIGS. 1 to 4 , the second display module 2 includes a circuit substrate 20 , an image display unit 21 disposed on the circuit substrate 20 , and a plurality of electronic units disposed on the circuit substrate 20 . For example, a plurality of electronic units can be divided into a light sensing unit, a light projection unit, an image capture unit and an audio transmission unit, and the image display unit 21, the light sensor unit, the light projection unit, the image capture unit Both the pickup unit and the audio transmission unit are arranged on the circuit substrate 20 . It is worth mentioning that the image display unit 21 includes a plurality of light emitting diode chips 210 disposed on the circuit substrate 20 , and the second image can be provided by the plurality of light emitting diode chips 210 . However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIGS. 1 to 3 , the light sensing unit includes an ambient light sensor 22 disposed on the circuit substrate 20 and a proximity sensor disposed on the circuit substrate 20 . twenty three. Furthermore, the photometric sensor 22 includes a first light generating chip 221 for generating a first light source and a first light receiving chip 222 for receiving the first light source (reflected first light source), and the photometric sensor The device 22 can utilize the cooperation of the first light generating chip 221 and the first light receiving chip 222 to obtain an ambient brightness information. In addition, the proximity sensor 23 includes a second light generating chip 231 for generating a second light source and a second light receiving chip 232 for receiving the second light source (the reflected second light source), and the proximity sensor 23 can utilize the cooperation of the second light generating chip 231 and the second light receiving chip 232 to obtain a depth of field information. In addition, the first light generating wafer 221 can be disposed between any two adjacent light emitting diode wafers 210 , and the first light receiving wafer 222 can be disposed between any two adjacent light emitting diode wafers 210 . The second light generating wafer 231 can be disposed between any two adjacent light emitting diode wafers 210 , and the second light receiving wafer 232 can be disposed between any two adjacent light emitting diode wafers 210 . However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIG. 1 , FIG. 2 and FIG. 4 , the light projection unit includes a flood illuminator 24 disposed on the circuit substrate 20 and a drawing point projector disposed on the circuit substrate 20 (dot projector) 25. In addition, the flood projector 24 includes a plurality of infrared light generating wafers 240 arranged in a specific shape, and the drawing point projector 25 includes a plurality of invisible light generating wafers 250 arranged in a specific shape. Furthermore, each infrared light generating chip 240 can be disposed between any two adjacent light emitting diode chips 210, and each invisible light generating chip 250 can be disposed between any two adjacent light emitting diode chips 210. between. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIG. 1 , FIG. 2 and FIG. 4 , the image capture unit includes a first image capture device 26 disposed on the circuit substrate 20 and a second image capture device disposed on the circuit substrate 20 device 27. In addition, the first image capture device 26 can be an infrared camera (Infrared camera), and the first image capture device 26 includes a plurality of first image capture chips 261 for capturing invisible light and are respectively disposed in the plurality of first image capture devices 261 . A plurality of first substrateless optical lenses 262 (optical components) above the first image capture chip 261 . In addition, the second image capture device 27 may be a front camera lens, and the second image capture device 27 includes a plurality of second image capture chips 271 for capturing visible light and disposed in multiple A plurality of second substrateless optical lenses 272 (optical components) above the second image capture chips 271 . Furthermore, each first image capture chip 261 can be disposed between any two adjacent LED chips 210, and each second image capture chip 271 can be disposed between any two adjacent LED chips 210. between the bulk wafers 210 . However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIG. 1 and FIG. 3 , the audio transmission unit includes a speaker 28 disposed on the circuit substrate 20 and a microphone 29 disposed on the circuit substrate 20 . Furthermore, the speaker 28 includes a plurality of sound signal emitting chips 280 arranged in a specific shape, and the microphone 29 includes a plurality of sound signal receiving chips 290 arranged in a specific shape. In addition, each sound signal emitting chip 280 can be disposed between any two adjacent light-emitting diode chips 210, and each sound signal receiving chip 290 can be disposed between any two adjacent light-emitting diode chips 210 . However, the present invention is not limited to the above-mentioned examples.

It is worth noting that, as shown in FIG. 2 and FIG. 5 , the plurality of first substrateless optical lenses 262 can be disposed on the same first plane P1 separately from each other, and the plurality of first substrateless optical lenses 262 are formed from the inside The outside (from the inner ring to the outer ring) gradually slopes outward. In addition, at least one first substrateless optical lens 262 has a first vertical optical axis LV1, and each of the remaining first substrateless optical lenses 262 has a first inclined optical axis LS1. In addition, the first vertical optical axis LV1 of the at least one first substrateless optical lens 262 and the first inclined optical axis LS1 of each of the first substrateless optical lenses 262 intersect with each other, and the plurality of first substrateless optical lenses 262 The angles ( θ1 , θ2 ) of the first inclined optical axis LS1 relative to the first vertical optical axis LV1 will gradually increase from the inside to the outside (that is, θ1 < θ2 ). Furthermore, since a part of the image can be captured through the cooperation of the first image capture chip 261 and the corresponding first substrateless optical lens 262 , the plurality of first image capture chips 261 are respectively connected to the corresponding phase. A complete image composed of a plurality of partial images can be captured by the cooperation of the corresponding plurality of first substrateless optical lenses 262 .

It is worth noting that, as shown in FIG. 2 and FIG. 6 , a plurality of second substrateless optical lenses 272 can be disposed on the same second plane P2 separately from each other, and the plurality of second substrateless optical lenses 272 are formed from the inside The outside (from the inner ring to the outer ring) gradually slopes outward. In addition, at least one second substrateless optical lens 272 has a second vertical optical axis LV2, and each of the remaining second substrateless optical lenses 272 has a second inclined optical axis LS2. In addition, the second vertical optical axis LV2 of at least one second substrateless optical lens 272 and the second inclined optical axis LS2 of each second substrateless optical lens 272 intersect with each other, and the plurality of second substrateless optical lenses 272 The angles ( θ1 , θ2 ) of the second inclined optical axis LS2 relative to the second vertical optical axis LV2 will gradually increase from the inside to the outside (that is, θ1 < θ2 ). Furthermore, since a part of the image can be captured through the cooperation of the second image capture chip 271 and the corresponding second substrateless optical lens 272 , the plurality of second image capture chips 271 are respectively connected with the corresponding second image capture chip 271 . With the cooperation of the corresponding plurality of second substrateless optical lenses 272, a complete image composed of a plurality of partial images can be captured.

[Third Embodiment]

Referring to FIG. 7 to FIG. 16 , a third embodiment of the present invention provides an image capture unit, which includes: a first image capture unit 26 and a second image capture unit 27 . The first image capture device 26 includes a plurality of first image capture chips 261 and a plurality of first substrateless optical lenses 262 , and the second image capture device 27 includes a plurality of second image capture chips 271 and a plurality of first substrateless optical lenses 262 . Two substrateless optical lenses 272 . It can be seen from the comparison between FIG. 7 and FIG. 5 and the comparison between FIG. 8 and FIG. 6 , the biggest difference between the third embodiment and the second embodiment is that the plurality of first substrateless optical lenses 262 can be respectively arranged in the plurality of first non-substrate optical lenses 262 . On the image capturing chip 261 , and a plurality of second substrateless optical lenses 272 can be respectively disposed on the plurality of second image capturing chips 271 .

For example, as shown in FIG. 7 and FIG. 8 , when the plurality of first substrateless optical lenses 262 are respectively disposed on the plurality of first image capture chips 261 by means of adhesion, the plurality of first substrateless optical lenses 262 can directly contact the plurality of first image capturing chips 261 respectively. When the plurality of second substrateless optical lenses 272 are respectively disposed on the plurality of second image capture chips 271 by means of adhesion, the plurality of second substrateless optical lenses 272 can directly contact the plurality of second image capture chips respectively. 271. Furthermore, each first substrateless optical lens 262 has a first contact plane 2621 (contact plane) and a first convex curved surface 2622 (convex curved surface) connected to the first contact plane 2621 , and each The first contact plane 2621 of the first substrateless optical lens 262 can directly contact a first image sensing area 2610 (image sensing area) of the corresponding first image capturing chip 261 . In addition, each second substrateless optical lens 272 has a second contact plane 2721 (contact plane) and a second convex curved surface 2722 (convex curved surface) connected to the second contact plane 2721, and each second non- The second contact plane 2721 of the substrate optical lens 272 can directly contact a second image sensing area 2710 (image sensing area) of the corresponding second image capturing chip 271 . It is worth noting that the area of the first contact plane 2621 of the first substrateless optical lens 262 is larger than the area of the first image sensing region 2610 of the first image capture chip 261 , so the first image capture chip 261 has a An image sensing area 2610 is completely covered by the first contact plane 2621 of the first substrateless optical lens 262 . In addition, the area of the second contact plane 2721 of the second substrateless optical lens 272 is larger than the area of the second image sensing area 2710 of the second image capture chip 271 , so the second image sensor of the second image capture chip 271 has a larger area. The measurement area 2710 is completely covered by the second contact plane 2721 of the second substrateless optical lens 272 . However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIG. 9 to FIG. 12 , each first substrateless optical lens 262 has a first alignment symbol M1 corresponding to its own first vertical optical axis LV1 or first inclined optical axis LS1 bit symbol), and the first alignment symbol M1 of each first substrateless optical lens 262 corresponds to a first positioning symbol F1 (location symbol) provided on the circuit substrate 20, thereby determining each first image What is the first substrateless optical lens 262 to be used with the capture chip 261 (that is, different first image capture chips 261 need to be used with different first substrateless optical lenses 262 to provide correct and correct of the first optical image). Therefore, as shown in FIG. 11 and FIG. 12 , the plurality of first alignment symbols M1 are aligned with the mutual symbols of the plurality of first alignment symbols F1 (or optical alignment may also be used), so that the plurality of first alignment symbols M1 A substrateless optical lens 262 can be respectively disposed on the corresponding plurality of first image capturing chips 261 accurately and without error. However, the present invention is not limited to the above-mentioned examples.

For example, as shown in FIG. 13 to FIG. 16 , each second substrateless optical lens 272 has a second alignment symbol M2 corresponding to its own second vertical optical axis LV2 or second inclined optical axis LS2 (for bit symbol), and the second alignment symbol M2 of each second substrateless optical lens 272 corresponds to a second positioning symbol F2 (location symbol) disposed on the circuit substrate 20, thereby determining each second image What is the second non-substrate optical lens 272 that needs to be used with the capture chip 271 (that is, different second image capture chips 271 need to be used with different second non-substrate optical lenses 272 to provide correct and correct the second optical image). Therefore, as shown in FIG. 15 and FIG. 16 , a plurality of second alignment symbols M2 are aligned with each other (or optical alignment can also be used) with a plurality of second alignment symbols F2 respectively, so that a plurality of The two substrateless optical lenses 272 can be respectively disposed on the corresponding plurality of second image capturing chips 271 accurately and without error. However, the present invention is not limited to the above-mentioned examples.

It is worth noting that the first non-substrate optical lens 262 refers to an optical lens without a straight channel whose outer surface only includes the first contact plane 2621 and the first convex curved surface 2622, and the entire first non-substrate optical lens 262 is It can be used to adjust the optical path (refracting light) without having a straight channel that is only used to transmit light and cannot refract light. In addition, the second non-substrate optical lens 272 refers to an optical lens without a straight channel whose outer surface only includes the second contact plane 2721 and the second convex curved surface 2722, and the entire second non-substrate optical lens 272 can be used for Adjusts the optical path (refracting light) without having a straight channel that simply transmits light and does not refract light.

It is worth noting that the plurality of first substrateless optical lenses 262 are single single convex lenses, and each first substrateless optical lens 262 is used alone without any other reflective substrate or carrier substrate. . In addition, the plurality of second non-substrate optical lenses 272 are single single convex lenses, and each second non-substrate optical lens 272 is used alone without any other reflective substrate or carrier substrate.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the full-screen image display D and its optical components provided by the present invention can pass through "a plurality of non-substrate optical lenses (a plurality of first non-substrate optical lenses 262 or a plurality of second non-substrate optical lenses 262 or a plurality of second non-substrate optical lenses). The non-substrate optical lens 272) directly contacts a plurality of image capture chips (the first image capture chip 261 or the second image capture chip 271) separated from each other respectively. External tilt", "the vertical optical axis of at least one optical lens (the first vertical optical axis LV1 or the second vertical optical axis LV2) and the inclined optical axis of each optical lens (the first inclined optical axis LS1 or the second inclined optical axis LV2) LS2) intersect each other” and “the angles (θ1, θ2) of the plurality of inclined optical axes relative to the vertical optical axis of the plurality of substrateless optical lenses gradually increase from the inside to the outside”, so that the present invention can transmit through multiple The image capturing chip is respectively matched with a plurality of corresponding substrateless optical lenses to capture a complete image composed of a plurality of partial images.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

Z: Portable Electronic Device C: frame structure CL: Left end CR: right end CT: upper side CB: lower side B: Surrounding shading layer D: full-screen video display 1: The first display module 1L: Left end 1R: Right side 1T: upper side 1B: Lower side end 2: The second display module 2L: Left end 2R: Right end 2T: upper side 2B: Lower side end 20: circuit substrate 21: Image display unit 210: LED chip 22: Light sensor 221: first light generating wafer 222: the first light receiving chip 23: Proximity sensor 231: Second light generating wafer 232: Second light receiving chip 24: Flood Projector 240: Infrared light generating wafer 25: Draw Point Projector 250: Invisible light generating wafer 26: The first image grabber 261: The first image capture chip 2610: The first image sensing area 262: The first substrateless optical lens 2621: First contact plane 2622: First convex surface P1: first plane LV1: first vertical optical axis LS1: First inclined optical axis 27: Second Image Capturer 271: Second image capture chip 2710: Second image sensing area 272: Second Substrateless Optical Lens 2721: Second contact plane 2722: Second convex surface P2: Second plane LV2: Second vertical optical axis LS2: Second inclined optical axis 28: Speakers 280: sound signal transmitter chip 29: Microphone 290: sound signal receiving chip θ1, θ2: angle M1: The first pair of symbols M2: Second pair of symbols F1: The first positioning symbol F2: Second positioning symbol

FIG. 1 is a schematic diagram of a portable electronic device according to a first embodiment of the present invention and a full-screen image display according to a second embodiment.

FIG. 2 is an enlarged schematic view of part II of FIG. 1 .

FIG. 3 is an enlarged schematic view of part III of FIG. 1 .

FIG. 4 is an enlarged schematic view of part IV of FIG. 1 .

5 is a schematic side view of a plurality of first substrateless optical lenses of the first image capture device provided by the full-screen image display according to the second embodiment of the present invention.

6 is a schematic side view of a plurality of second substrateless optical lenses of the second image capture device provided by the full-screen image display according to the second embodiment of the present invention.

7 is a schematic side view of a first image capture device provided by an image capture unit according to a third embodiment of the present invention.

8 is a schematic side view of a second image capture device provided by the image capture unit according to the third embodiment of the present invention.

9 is a schematic top view of a plurality of first image capture chips of the first image capture device provided by the image capture unit according to the third embodiment of the present invention.

10 is a schematic top view of a plurality of first substrateless optical lenses of the first image capture device provided by the image capture unit according to the third embodiment of the present invention.

11 is a schematic top view of a first image capture device provided by an image capture unit according to a third embodiment of the present invention.

12 is a schematic side view of the first alignment symbol of the first substrateless optical lens and the first alignment symbol of the first image capture chip corresponding to each other according to the third embodiment of the present invention.

13 is a schematic top view of a plurality of second image capture chips of the second image capture device provided by the image capture unit according to the third embodiment of the present invention.

14 is a schematic top view of a plurality of second substrateless optical lenses of the second image capture device provided by the image capture unit according to the third embodiment of the present invention.

15 is a schematic top view of a second image capture device provided by the image capture unit according to the third embodiment of the present invention.

16 is a schematic side view of the second alignment symbol of the second substrateless optical lens and the second alignment symbol of the second image capturing chip corresponding to each other according to the third embodiment of the present invention.

20: circuit substrate

26: The first image grabber

261: The first image capture chip

2610: The first image sensing area

262: The first substrateless optical lens

2621: First contact plane

2622: First convex surface

LV1: first vertical optical axis

LS1: First inclined optical axis

θ1, θ2: angle

Claims (10)

An optical assembly comprising a plurality of substrateless optical lenses disposed on the same plane separately from each other, a plurality of the substrateless optical lenses respectively directly contacting a plurality of image capturing chips separated from each other, a plurality of the substrateless optical lenses respectively The lens is gradually inclined outward from the inside to the outside, at least one of the non-substrate optical lenses has a vertical optical axis, each of the other non-substrate optical lenses has an inclined optical axis, and all of the at least one of the non-substrate optical lenses have a vertical optical axis. The vertical optical axis and the oblique optical axis of each of the substrateless optical lenses intersect with each other, and the angles of the oblique optical axes of a plurality of the substrateless optical lenses relative to the vertical optical axis are outside gradually increased. The optical assembly of claim 1, wherein each of the substrateless optical lenses has a contact plane and a convex curved surface connected to the contact plane, the contact plane of each of the substrateless optical lenses directly contacting an image sensing area of the corresponding image capturing chip, and the area of the contact plane of the substrateless optical lens is larger than the area of the image sensing area of the image capturing chip; wherein , a plurality of the non-substrate optical lenses are single single convex lenses, and each of the non-substrate optical lenses is used alone without a reflective substrate or a carrier substrate. The optical assembly of claim 1, wherein each of the substrateless optical lenses has a pair of symbols corresponding to its own vertical optical axis or the oblique optical axis, and each of the substrateless optical lenses The alignment symbol of the lens corresponds to a positioning symbol provided on a circuit substrate. An image capture unit, comprising: A first image capture device, the first image capture device includes a plurality of first image capture chips for capturing invisible light and a plurality of first image capture chips respectively directly contacting the plurality of first image capture chips a substrateless optical lens; and a second image capture device, the second image capture device includes a plurality of second image capture chips for capturing visible light and a plurality of second image capture chips respectively directly contacting the plurality of second image capture chips No substrate optical lens; Wherein, a plurality of the first image capture chips and a plurality of the second image capture chips are disposed on the same circuit substrate; Wherein, the plurality of first substrateless optical lenses are disposed on a first plane separately from each other, and the plurality of first substrateless optical lenses are gradually inclined outwards from the inside to the outside; Wherein, a plurality of the second non-substrate optical lenses are disposed on a second plane separately from each other, and the plurality of the second non-substrate optical lenses are gradually inclined outward from the inside to the outside; Wherein, at least one of the first substrateless optical lenses has a first vertical optical axis, each of the remaining first substrateless optical lenses has a first inclined optical axis, and at least one of the first substrateless optical lenses has a first vertical optical axis. The first vertical optical axis and the first oblique optical axis of each of the first substrateless optical lenses intersect with each other, and a plurality of the first oblique optical lenses of the plurality of the first substrateless optical lenses The angle of the axis relative to the first vertical optical axis gradually increases from the inside to the outside; Wherein, at least one of the second substrateless optical lenses has a second vertical optical axis, each of the other second substrateless optical lenses has a second inclined optical axis, and at least one of the second substrateless optical lenses has a second vertical optical axis. The second vertical optical axis and the second oblique optical axis of each of the second substrateless optical lenses intersect with each other, and a plurality of the second oblique optical lenses of the second substrateless optical lenses The angle of the axis relative to the second vertical optical axis gradually increases from the inside to the outside. The image capturing unit of claim 4, wherein each of the first substrateless optical lenses has a first contact plane and a first convex curved surface connected to the first contact plane, and each of the first contact planes has a first convex surface. The first contact plane of the first substrateless optical lens directly contacts a corresponding first image sensing area of the first image capture chip, and the first contact surface of the first substrateless optical lens The area of the contact plane is larger than the area of the first image sensing area of the first image capture chip; wherein each of the second substrateless optical lenses has a second contact plane and is connected to the second a second convex curved surface of the contact plane, the second contact plane of each of the second substrateless optical lenses directly contacts a second image sensing area of the corresponding second image capture chip, and The area of the second contact plane of the second substrateless optical lens is larger than the area of the second image sensing region of the second image capture chip. The image capture unit of claim 4, wherein each of the first substrateless optical lenses has a first alignment corresponding to its own first vertical optical axis or the first inclined optical axis symbol, and the first alignment symbol of each of the first non-substrate optical lenses corresponds to a first alignment symbol disposed on the circuit substrate; wherein, each of the second non-substrate optical lenses has A second alignment symbol corresponding to its own second vertical optical axis or the second inclined optical axis, and the second alignment symbol of each of the second substrateless optical lenses corresponds to a A second positioning symbol on the circuit substrate. An image capture unit, comprising: a first image capture device, the first image capture device includes a plurality of first image capture chips and a plurality of first substrateless optical lenses respectively disposed on the plurality of first image capture chips; Wherein, at least one of the first substrateless optical lenses has a first vertical optical axis, each of the remaining first substrateless optical lenses has a first inclined optical axis, and at least one of the first substrateless optical lenses has a first vertical optical axis. The first vertical optical axis and the first oblique optical axis of each of the first substrateless optical lenses intersect with each other, and a plurality of the first oblique optical lenses of the plurality of the first substrateless optical lenses The angle of the axis relative to the first vertical optical axis gradually increases from the inside to the outside. The image capture unit according to claim 7, further comprising: a second image capture device, the second image capture device comprises a plurality of second image capture chips and is respectively disposed on the plurality of second image capture devices A plurality of second substrateless optical lenses on an image capture chip; wherein at least one of the second substrateless optical lenses has a second vertical optical axis, and each of the remaining second substrateless optical lenses has a first Two inclined optical axes, the second vertical optical axis of at least one of the second substrateless optical lenses and the second inclined optical axis of each of the second substrateless optical lenses intersect with each other, and a plurality of the The angles of the plurality of second inclined optical axes relative to the second vertical optical axis of the second substrateless optical lens gradually increase from the inside to the outside. The image capturing unit of claim 8, wherein each of the first substrateless optical lenses has a first contact plane and a first convex curved surface connected to the first contact plane, and each of the first contact planes has a first convex surface. The first contact plane of the first substrateless optical lens directly contacts a corresponding first image sensing area of the first image capture chip, and the first contact surface of the first substrateless optical lens The area of the contact plane is larger than the area of the first image sensing area of the first image capture chip; wherein each of the second substrateless optical lenses has a second contact plane and is connected to the second a second convex curved surface of the contact plane, the second contact plane of each of the second substrateless optical lenses directly contacts a second image sensing area of the corresponding second image capture chip, and The area of the second contact plane of the second substrateless optical lens is larger than the area of the second image sensing region of the second image capture chip. The image capture unit of claim 8, wherein a plurality of the first image capture chips and a plurality of the second image capture chips are disposed on the same circuit substrate; wherein each of the first image capture chips A substrateless optical lens has a first alignment sign corresponding to its first vertical optical axis or the first oblique optical axis, and the first pair of each of the first substrateless optical lenses The bit symbol corresponds to a first positioning symbol disposed on the circuit substrate; wherein, each of the second substrateless optical lenses has the second vertical optical axis or the second inclined optical axis corresponding to itself A second alignment mark of each of the second substrateless optical lenses corresponds to a second alignment mark disposed on the circuit substrate.

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