TWI810072B - Immersion liquid cooling apparatus - Google Patents

Abstract

An immersion liquid cooling apparatus is configured to store a first cooling liquid and dissipate heat to at least one server through the first cooling liquid. The immersion liquid cooling apparatus includes a box, a cover and a refrigeration device. The cover and the box together form a closed space. The closed space is at least partially configured to accommodate the first cooling liquid and the at least one server, and the closed space is divided into a liquid storage space and a gas storage space. The refrigeration device is located in the gas storage space. The refrigeration device includes a coil, a first liquid-cooled heat exchanger, and a refrigeration chip. The first liquid-cooled heat exchanger is connected to the coil to form a first circulation channel. The first circulation channel is configured to accommodate a second cooling liquid. The refrigeration chip has a cold end. The cold end of the refrigeration chip is thermally coupled to the first liquid-cooled heat exchanger.

Description

Immersion liquid cooling device

The invention relates to a liquid cooling device, in particular to an immersion type liquid cooling device.

With the advent of the big data era and the continuous development of cloud technology, all walks of life have higher and higher requirements for high-performance servers. While improving the integration and computing speed, they also greatly increase the heat flux and heat generation. Traditional air-cooling technology cannot meet its heat dissipation needs. In order to avoid the performance degradation of the device due to insufficient heat dissipation, it is necessary to adopt liquid cooling technology with higher heat dissipation efficiency. The immersion liquid cooling technology is to directly immerse the heat-generating components of the server, such as the central processing unit (CPU), graphics processing unit (GPU), dual in-line memory module (DIMM), etc., in the fluorinated liquid. The high-boiling fluorinated liquid takes away the heat generated by each heating element, transfers the heat to other cooling media or cooling equipment in the external heat exchanger, and then returns to the cabinet for circulation to dissipate heat.

However, the high-temperature fluorinated liquid will continue to evaporate in the confined space, and when the saturated humidity of the fluorinated liquid vapor is reached, the fluorinated liquid vapor will condense on the surface of the lower-temperature cabinet top cover. The fluorinated liquid vapor that has reached the saturated humidity may seep out from the gap after contacting the surface of the upper cover to generate condensation, and the seeped fluorinated liquid cannot continue to participate in the circulation and heat dissipation, resulting in waste or loss of resources. In addition, when the cabinet is opened, the fluorinated liquid condensed on the surface of the upper cover may flow out along the surface of the upper cover, and the outflowed fluorinated liquid cannot be returned to the cabinet, resulting in waste or loss of resources. Moreover, condensation on the glass surface of the upper cover will block the line of sight and affect the staff's monitoring of the internal conditions of the cabinet. Therefore, how to solve the problem of condensation has become a major design issue.

The present invention is to provide a submerged liquid cooling device, so that the cooling liquid vapor in the cabinet condenses on the cooling coil in the cabinet and drips back into the cabinet to recycle the cooling liquid, thereby preventing the cooling liquid from condensing on the top cover of the cabinet The surface causes the cooling liquid to lose in the gap or the waste caused by the loss when the cover is opened, and it can also prevent the cooling liquid from condensing on the glass surface of the cabinet cover and blocking the staff's line of sight to monitor the internal conditions of the cabinet.

The submerged liquid cooling device disclosed in an embodiment of the present invention is used to store a first cooling liquid, and dissipate heat to at least one heating device through the first cooling liquid. The immersion liquid cooling device includes a box body, a cover body and a refrigeration device. The cover body and the box body together form a closed space. The enclosed space is at least partially used to accommodate the first cooling liquid and at least one heating device, and the enclosed space is divided into a liquid storage space for the first cooling liquid and the at least one heating device and a gas storage space for not containing the cooling liquid. The refrigeration equipment is located in the gas storage space. The cooling device includes a coil, a first liquid-cooled heat exchanger and a cooling chip. The first liquid-cooled heat exchanger communicates with the coil to form a first circulation channel. The first circulation channel is used for accommodating a second coolant. The cooling chip has a cold end and a hot end. The cold end of the cooling chip is thermally coupled with the first liquid-cooled heat exchanger.

According to the submerged liquid cooling device of the above embodiment, since the cooling device is installed in the gas storage space of the submerged liquid cooling device, the cooling liquid vapor will first condense on the coil of the cooling device during the process of rising toward the cover. on, not condensation on the lid. In this way, after the coolant vapor condenses on the coil, it will first drip back into the submerged liquid cooling device. In addition to reducing the waste of coolant through the setting of the refrigeration equipment, it can also reduce the loss of coolant on the transparent window. The amount of adhesion makes it easy for the staff to clearly monitor the inside of the cabinet through the transparent window.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

See Figures 1 through 3. FIG. 1 is a schematic perspective view of an immersion liquid cooling device according to a first embodiment of the present invention. FIG. 2 is a schematic front view of the submerged liquid cooling device in FIG. 1 when the cover is opened. FIG. 3 is a partially enlarged perspective view of FIG. 2 .

The submerged liquid cooling device 10 of this embodiment includes a box body 11 , a cover body 12 and a refrigeration device 14 . The cover body 12 is detachably covered on the box body 11 , and the cover body 12 and the box body 11 together form a closed space S. The enclosed space S is divided into a liquid storage space S1 and a gas storage space S2. The liquid storage space S1 accommodates a first cooling liquid 13 and a plurality of heat generating devices 20 . The first cooling liquid 13 is, for example, fluorinated liquid or water. The heating device 20 is, for example, a server. The plurality of heat-generating devices 20 are submerged in the first cooling liquid 13 , and the heat generated by the plurality of heat-generating devices 20 is taken away by the first cooling liquid 13 .

See Figures 3 through 5. FIG. 4 is an enlarged perspective view of the refrigeration device in FIG. 3 . FIG. 5 is an exploded schematic diagram of FIG. 4 .

The refrigeration device 14 is located in the gas storage space S2. The cooling device 14 includes a coil pipe 141 , a first connecting pipe 142 , a first liquid-cooled heat exchanger 143 , a cooling chip 145 and a first pump 146 . The coiled tube 141 surrounds the periphery of the transparent window 121 . The first connecting pipe 142 is used for connecting the first liquid-cooled heat exchanger 143 and the first pump 146 . The first liquid-cooled heat exchanger 143 , the coil pipe 141 , the first connecting pipe 142 and the first pump 146 are connected to form a first circulation channel C1 . The first circulation channel C1 is used to accommodate a second cooling liquid 144 . The second cooling liquid 144 is, for example, fluorinated liquid or water. The first pump 146 drives the second coolant 144 to circulate in the first circulation channel C1.

The cooling chip 145 has a cold end T1 and a hot end T2. The cold end T1 of the cooling chip 145 is thermally coupled to the first liquid-cooled heat exchanger 143 . The so-called thermal coupling can transfer heat through heat conduction, heat convection or heat radiation. In this way, when the cooling chip 145 is running, the cold end T1 of the cooling chip 145 will continue to cool the second cooling liquid 144 in the first circulation channel C1 through the first liquid-cooled heat exchanger 143 . Next, the cooled second cooling liquid 144 flows through the coil pipe 141 to reduce the temperature of the coil pipe 141 . Since the temperature of the coil 141 is lowered by the low-temperature second cooling liquid 144, when the vapor of the first cooling liquid 13 rises toward the cover 12, it will first condense on the coil 141 of the refrigeration equipment instead of condensing on the on the cover 12. Therefore, the condensed first cooling liquid 13 will drip back into the submerged liquid cooling device 10 .

The immersion liquid cooling device 10 may further include a transparent window 121 . The transparent window 121 is located on the box body 11 . The enclosed space S is exposed to the outside through the transparent window 121 . The coil pipe 141 of the refrigeration equipment 14 is located on one side of the transparent window 121, for example, the coil pipe 141 of the refrigeration equipment 14 surrounds the periphery of the transparent window 121, or the coil pipe 141 of the refrigeration equipment 14 is entirely or partially located between the transparent window 121 and the first cooling liquid. Between 13. In this way, the staff can monitor the internal conditions of the cabinet through the transparent window 121 .

In this embodiment, the transparent window 121 of the submerged liquid cooling device 10 can also be located on the cover 12 .

In this embodiment, the immersion liquid cooling device 10 may further include a transparent window 121 , but it is not limited thereto. In other embodiments, the immersion liquid cooling device may not be provided with a transparent window.

The submerged liquid cooling device 10 may further include a heat dissipation device 15 for dissipating heat from the hot end T2 of the cooling chip 145 . The cooling device 15 includes a second liquid-cooled heat exchanger 151 , two cooling pipelines 152 , a second connecting pipe 153 and a second pump 154 . The second connecting pipe 153 is used for connecting the second liquid-cooled heat exchanger 151 and the second pump 154 . The second liquid-cooled heat exchanger 151 , the second cooling pipeline 152 , a second connecting pipe 153 , the second pump 154 and the tank 11 are connected to form a second circulation channel C2 . The second circulation channel C2 is used to accommodate the first cooling liquid 13 . The hot end T2 of the cooling chip 145 is thermally coupled with the second liquid-cooled heat exchanger 151 . The second pump 154 drives the first cooling liquid 13 to circulate in the second circulation channel C2, so that the first cooling liquid 13 flows through the second liquid-cooled heat exchanger 151, and the first cooling liquid 13 passes through the second liquid cooling The heat exchanger 151 dissipates heat to the hot end T2 of the cooling chip 145 . In this way, the hot end T2 of the cooling chip 145 can continue to operate through the continuous cooling of the first cooling liquid 13 in the second circulation channel C2, and the cooling chip 145 will not be damaged due to the temperature of the hot end T2 being too high.

In this embodiment, the purpose of disposing the cooling device 14 in the gas storage space S2 of the submerged liquid cooling device 10 is to arrange the cooling device 14 on the side of the cover 12 close to the first cooling liquid 13 . In this way, the vapor of the first cooling liquid 13 will first condense on the coil 141 of the refrigeration device instead of condensing on the cover 12 during the process of rising towards the cover 12 . Therefore, the waste caused by the loss of the first cooling liquid 13 in the gap or the loss of the first cooling liquid 13 when the cover 12 is opened due to the condensation of the first cooling liquid 13 vapor on the cover body 12 can be avoided, and the first cooling liquid 13 can also be reduced. The adhesion of the liquid 13 on the transparent window 121 is convenient for the staff to clearly monitor the inside of the submerged liquid cooling device 10 through the transparent window 121 . In addition, the heat dissipation device 15 of the submerged liquid cooling device 10 can circulate and cool the hot end T2 of the cooling chip 145 , so that the cooling chip 145 can maintain normal operation without being damaged due to overheating.

The refrigeration equipment 14 of the submerged liquid cooling device 10 may further include a temperature control device 147 . The temperature control device 147 includes a temperature sensor 1471 and a temperature controller 1472 . The temperature sensor 1471 is thermally coupled to the cooling chip 145 and senses the current temperature of the cooling chip 145 . The temperature controller 1472 is electrically connected to the cooling chip 145 , and controls the temperature of the cooling chip 145 through the current temperature of the cooling chip 145 sensed by the temperature sensor 1471 .

In this embodiment, the cooling equipment 14 of the submerged liquid cooling device 10 may further include a temperature control device 147 , but it is not limited thereto. In other embodiments, the refrigerating equipment of the immersion liquid cooling device may not be provided with a temperature control device.

In this embodiment, the immersion liquid cooling device 10 may further include a fan 16 . The fan 16 is located in the gas storage space S2. The fan 16 can generate a turbulent airflow, and the turbulent airflow drives the vapor of the first coolant 13 in the gas storage space S2 to flow. In this way, the vapor of the first cooling liquid 13 in the gas storage space S2 can quickly achieve uniform temperature, so that the vapor of the first cooling liquid 13 can uniformly condense on the coil 141 and drip back into the submerged liquid cooling device 10 .

In this embodiment, the number of fans 16 of the submerged liquid cooling device 10 is one, but it is not limited thereto. In other embodiments, the number of fans may also be multiple, or the submerged liquid cooling device may also have no fans.

The refrigeration equipment 14 of the submerged liquid cooling device 10 may further include a circuit module 148 . The circuit module 148 is electrically connected to the cooling chip 145, and transmits power to the cooling chip 145 through the circuit module 148, so that the cooling chip 145 generates a cold end T1 and a hot end T2 after being powered on.

See Figure 6. FIG. 6 is a system schematic diagram of the cooling cycle of the refrigeration equipment and cooling equipment in FIG. 1 .

In this embodiment, the cold end T1 of the cooling chip 145 is thermally coupled to the first liquid-cooled heat exchanger 143 and cools the second cooling liquid 144 flowing through the first liquid-cooled heat exchanger 143 . In this way, the cooled second coolant 144 flows through the coil 141 and cools the coil 141, so that the temperature of the coil 141 is lower than the vapor temperature of the first coolant 13, so the vapor of the first coolant 13 will condense first On the coil 141 instead of condensation on the surface of the cover 12 .

In this embodiment, the hot end T2 of the cooling chip 145 is thermally coupled to the second liquid-cooled heat exchanger 151, and the first cooling liquid 13 in the second circulation channel C2 flows through the second liquid-cooled heat exchanger 151, and cool the hot end T2 of the cooling chip 145. In this way, the hot end T2 of the cooling chip 145 can be continuously cooled by the first cooling liquid 13 without causing the temperature of the hot end T2 of the cooling chip 145 to be too high and causing the cooling chip 145 to be damaged.

According to the submerged liquid cooling device of the above embodiment, since the cooling device is installed in the gas storage space of the submerged liquid cooling device, the cooling liquid vapor will first condense on the coil of the cooling device during the process of rising toward the cover. on, not condensation on the lid. In this way, after the coolant vapor condenses on the coil, it will first drip back into the submerged liquid cooling device. In addition to reducing the waste of coolant through the setting of the refrigeration equipment, it can also reduce the loss of coolant on the transparent window. The amount of adhesion makes it easy for the staff to clearly monitor the inside of the cabinet through the transparent window.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10: Immersion liquid cooling device 11: Box 12: Cover body 121: transparent window 13: The first coolant 14: Refrigeration equipment 141: Coil 142: the first connecting pipe 143: The first liquid-cooled heat exchanger 144: Second coolant 145: cooling chip 146: The first pump 147: Temperature control device 1471: temperature sensor 1472: temperature controller 148: circuit module 15: cooling equipment 151: Second liquid-cooled heat exchanger 152: Cooling pipeline 153: the second connecting pipe 154: Second pump 16: fan 20: Heating equipment C1: the first circulation channel C2: Second circulation channel S: confined space S1: Liquid storage space S2: gas storage space T1: cold end T2: hot end

FIG. 1 is a schematic perspective view of an immersion liquid cooling device according to a first embodiment of the present invention. FIG. 2 is a schematic front view of the submerged liquid cooling device in FIG. 1 when the cover is opened. FIG. 3 is a partially enlarged perspective view of FIG. 2 . FIG. 4 is an enlarged perspective view of the refrigeration device in FIG. 3 . FIG. 5 is an exploded schematic diagram of FIG. 4 . FIG. 6 is a system schematic diagram of the cooling cycle of the refrigeration equipment and cooling equipment in FIG. 1 .

10: Immersion liquid cooling device

11: Box

12: Cover body

13: The first coolant

14: Refrigeration equipment

144: Second coolant

147: Temperature control device

1471: temperature sensor

1472: temperature controller

148: circuit module

15: cooling equipment

152: Cooling pipeline

154: Second pump

16: fan

20: Heating equipment

C1: the first circulation channel

C2: Second circulation channel

S: confined space

S1: Liquid storage space

S2: gas storage space

Claims (10)

An immersion liquid cooling device is used to store a first cooling liquid and dissipate heat to at least one heating device through the first cooling liquid. The immersion liquid cooling device includes: A box body; a cover body, the cover body and the box body together form a closed space, the closed space is at least partly used to accommodate the first cooling liquid and the at least one heating device, so that the closed space is divided into two parts for the The first cooling liquid and a liquid storage space accommodated by the at least one heating device and a gas storage space not accommodated by the cooling liquid; and a refrigeration device located in the gas storage space, comprising: a coil; a first liquid A cold heat exchanger, the first liquid-cooled heat exchanger communicates with the coil to form a first circulation channel, the first circulation channel is used to accommodate a second cooling liquid; and a cold chip, the The cooling chip has a cold end and a hot end, and the cold end of the cooling chip is thermally coupled with the first liquid-cooled heat exchanger. The immersion type liquid cooling device as described in claim 1 further comprises a transparent window, the transparent window is located on the box or the cover, and the enclosed space is exposed to the outside through the transparent window, the refrigeration equipment The coil is located on one side of the transparent window. The submerged liquid cooling device as described in claim 1, wherein the refrigeration equipment includes a first pump, the first pump communicates with the coil, and provides the second cooling liquid in the first circulation channel The power of circulation. The submerged liquid cooling device as described in claim 3 further includes a cooling device, the cooling device includes a second liquid-cooled heat exchanger and two cooling pipelines, the hot end of the cooling chip and the second The liquid-cooled heat exchanger is thermally coupled, and the second liquid-cooled heat exchanger, the two cooling pipelines, and the box are connected to form a second circulation channel, which is used to accommodate the first Coolant. The submerged liquid cooling device as described in Claim 4, wherein the cooling device includes a second pump, the second pump communicates with the two cooling pipelines, and provides the first cooling liquid in the second circulation The power of circulation in the channel. The submerged liquid cooling device as described in Claim 1, wherein the refrigeration equipment includes a temperature control device, the temperature control device includes a temperature sensor and a temperature controller, and the temperature sensor is thermally coupled to the cooling chip, And sensing the current temperature of the cooling chip, the temperature controller is electrically connected to the cooling chip, and controls the temperature of the cooling chip through the current temperature of the cooling chip sensed by the temperature sensor. The submerged liquid cooling device as described in claim 1, further comprising at least one fan, the at least one fan is located in the gas storage space, and the at least one fan generates a turbulent air flow, and the turbulent air flow drives the air in the gas storage space gas flow. The submerged liquid cooling device as described in Claim 1, wherein the cooling device includes a circuit module electrically connected to the cooling chip, and transmits power to the cooling chip through the circuit module. The submerged liquid cooling device according to claim 4, wherein the first cooling liquid is fluorinated liquid or water. The submerged liquid cooling device according to claim 1, wherein the second cooling liquid is fluorinated liquid or water.

Images