TWI808833B - Holding substrate and manufacturing method of display device - Google Patents

Abstract

An object of the present invention is to provide a holding substrate and a method of manufacturing a display device in which a plurality of first light-emitting elements held on a holding substrate do not easily come into contact with the transferred substrate even if they are transferred to the transferred substrate. The holding substrate has a plurality of first sections viewed from one direction as a first surface, and a second section viewed from one direction as a second surface. The first section holds a plurality of first light emitting elements on the first surface. The second surface is separated from the first surface in the depth direction of the first surface.

Description

Holding substrate and manufacturing method of display device

The disclosure relates to a manufacturing method for holding a substrate and a display device.

There are display devices in which red, green, blue, and other light-emitting elements are used as pixels. The display device transfers light-emitting elements of various colors from the holding substrate to form pixels.

As the density of display pixels increases, a large number of fine light-emitting elements are mounted on display devices. The light-emitting elements are required to be transferred from the holding substrate to the display device with high positioning accuracy. In the manufacturing process of a display device, a technique called direct transfer is sometimes used in which a light-emitting element is directly pressed against a display substrate while the light-emitting element is held on the holding substrate to transfer the light-emitting element.

Patent Document 1 discloses a technique in which a growth substrate including a light emitting device is pressed against a backplane substrate and the light emitting devices are transferred as a set. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2018-508972

[Problem to be solved by the invention]

When transferring the plurality of first light-emitting elements held by the holding substrate to the transferred substrate, the holding substrate and the transferred substrate are brought close to each other. At this time, the substrate to be transferred may come into contact with the holding substrate.

The present invention was made in view of the above-mentioned problems, and an object thereof is to provide a holding substrate and a method of manufacturing a display device that are less likely to come into contact with the transferred substrate even if a plurality of first light-emitting elements held on the holding substrate are transferred to the transferred substrate. [Technical means to solve the problem]

The holding substrate of the present disclosure used to achieve the above object is viewed from one direction and divided into a plurality of first regions having a first surface and a second region having a second surface. The first region is a region for holding a plurality of first light-emitting elements on the first surface. The second surface is separated from the first surface in the depth direction of the first surface.

The manufacturing method of the display device of the present disclosure for achieving the above object has the following steps: aligning the positions of the plurality of first light-emitting elements held on the first surface of the holding substrate at specific positions on the transferred surface having the plurality of protrusions of the transferred substrate; A plurality of first divisions, and a second division having a second surface, wherein the first division holds a plurality of first light emitting elements on the first surface, and the second surface is separated from the first surface in the depth direction of the first surface.

The manufacturing method of the display device of the present disclosure for achieving the above object has the following steps: after transferring the plurality of first light emitting elements from the first holding substrate to the first transferred area of the transferred substrate, aligning the position of the second holding substrate holding the plurality of first light emitting elements on the first surface at the specific position of the second transferred area of the aforementioned transferred substrate; and pressing the plurality of the first light emitting elements held by the aligned second holding substrate against the transferred surface of the transferred substrate; The above-mentioned first holding substrate and the above-mentioned second holding substrate respectively have a first region, and the first region includes a plurality of first regions having a first surface viewed from one direction, and a second region having a second surface; on the above-mentioned first surface of the first region, a plurality of the above-mentioned first light-emitting elements are held, and the above-mentioned second surface is separated from the above-mentioned first surface in a depth direction of the above-mentioned first surface. The direction is separated from the first surface, and the substrate to be transferred has a transfer area including the first transfer area and a second transfer area adjacent to the first transfer area on the transfer surface, and the transfer area is wider than the first area of the first holding substrate or the second holding substrate.

Embodiments (embodiments) for implementing the present disclosure will be described in detail with reference to the drawings. This disclosure is not limited by the contents described in the following embodiments. In addition, the constituent requirements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. In addition, the constituent requirements described below can be combined suitably. In addition, the disclosure is only an example, and those skilled in the art can easily conceive appropriate changes to ensure the disclosure, and of course they are included in the scope of the present disclosure. In addition, the drawings may schematically show the width, thickness, shape, etc. of each part compared with the actual form for clarification of the description, but these are just examples and do not limit the interpretation of the present disclosure. In addition, in this specification and each drawing, the same reference numerals are attached to the same elements as those described above for the drawings that have already appeared, and detailed description may be appropriately omitted.

The form for implementing the present disclosure will be described below with reference to FIGS. 1 to 16 . Fig. 1 is a conceptual plan view of a holding substrate according to a first embodiment. Fig. 2 is the conceptual arrow sectional view of Y1-Y1 sectional arrow of Fig. 1. Fig. 3 is a conceptual plan view of the substrate to be transferred according to the first embodiment. Fig. 4 is the conceptual arrow sectional view of the Y2-Y2 sectional arrow in Fig. 3 .

In addition, the constituent requirements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. In addition, the constituent requirements described below can be combined suitably.

＜First Embodiment＞ The plurality of first light emitting elements D1 held on the holding substrate 100 shown in FIGS. 1 and 2 are transferred to the transferred substrate 200 . In the first embodiment, the second light emitting element D2 and the third light emitting element D3 have already been transferred to the transferred substrate 200 on the transferred substrate 200 .

＜Display device＞ The display device 10 controls a plurality of pixels E to display an image. The pixel E includes a first light-emitting element D1 , a second light-emitting element D2 and a third light-emitting element D3 that emit light of a plurality of different colors. The display device 10 is configured by arranging the first light emitting element D1 , the second light emitting element D2 , and the third light emitting element D3 on the transferred substrate 200 .

The pixel E includes, for example, a first light emitting element D1 emitting blue light, a second light emitting element D2 emitting red light, and a third light emitting element D3 emitting green light. The pixels E are arranged in a matrix. Each pixel E is provided with a first light emitting element D1, a second light emitting element D2, and a third light emitting element D3. When the 1st light emitting element D1, the 2nd light emitting element D2, and the 3rd light emitting element D3 are not distinguished, it may be called a light emitting element D.

＜Light emitting element＞ The light emitting element D emits light of a specific color. The light-emitting element D is an inorganic light-emitting diode (LED: Light Emitting Diode) chip with a size of about 3 μm or more and 300 μm or less when viewed from the direction perpendicular to the first surface 101, and is called a micro LED (micro LED). A display device having a micro LED in each pixel is also called a micro LED display device. In addition, the miniaturization of micro-LEDs does not limit the size of inorganic light-emitting diodes. Moreover, the light emitting element D can also be a miniature LED. The height of the light emitting element D can have different heights according to the color of the light to be emitted.

The light-emitting element D has a laminated structure in which a first electrode connection layer, a light-emitting layer, and a second electrode connection layer (not shown) are sequentially laminated. In the light-emitting element D, semiconductor crystals are grown on a growth substrate to form the above-mentioned layered structure. When the light-emitting layer is a gallium nitride-based material (GaN), the first electrode connection layer is, for example, N-type GaN, and the second electrode connection layer is P-type GaN. By electrifying the first electrode connection layer and the second electrode connection layer of the light-emitting element D, the light-emitting layer emits light of a specific color. The light emitted by the light-emitting element D can be any color such as red, blue, yellow-green and green. Specifically, the central wavelength of the light of each color emitted from the light-emitting element D is about 610 nm in the case of red, about 470 nm in the case of blue, about 505 nm in the case of green, and 570 nm in the case of yellow-green.

＜Holding substrate＞ The holding substrate 100 of the first embodiment is a plate-shaped substrate. As shown in FIG. 1 , the holding substrate 100 has a first region 110 on a surface viewed from a direction perpendicular to the first surface 101 , that is, a direction. The first area 110 includes a first area 112 and a second area 114 . The first division 112 is the first surface 101 viewed from one direction. The second division 114 is the second surface 120 viewed from one direction. The holding substrate 100 holds a plurality of first light emitting elements D1 at a predetermined interval p on the first surface 101 of the first section 112 . The holding substrate 100 has a plurality of first alignment marks 103 on the first surface 101 outside the first region 110 . The holding substrate 100 is made of a material that transmits light of a specific wavelength at a specific transmittance or higher. It is desirable that the holding substrate 100 is made of a material that further has heat resistance and corrosion resistance.

The first region 110 is a region for holding the first light emitting element D1. The first region 110 of the first embodiment has the same size as the transferred region 210 of the transferred substrate 200 described later. The first region 110 may also be disposed at a specific distance from the edge 102 of the holding substrate 100 .

The first section 112 is a section having the first surface 101 when the holding substrate 100 is viewed from one direction. The size of the first region 112 viewed from the direction perpendicular to the surface of the first surface 101 to the first surface 101 is equal to or greater than the size of the first light emitting element D1. The first section 112 is provided in an area of the first area 110 corresponding to an area of the substrate to be transferred 200 that does not include the second light emitting element D2 and the third light emitting element D3.

The second section 114 is a section having the second surface 120 when the holding substrate 100 is viewed from one direction. The second surface 120 is a surface separated from the first surface 101 in the depth direction of the holding substrate 100 . The second section 114 is provided at least in a region of the first region 110 corresponding to the light emitting device D held on the transferred surface 201 of the transferred substrate 200 . The second section 114 does not hold the first light emitting element D1. The size of the second region 114 viewed from the direction perpendicular to the first surface 101 is larger than the size of the corresponding light emitting element D. As shown in FIG. The second section 114 holds, for example, the second section 114 having two light-emitting elements D on the first surface 101 of the substrate 100 when the transferred area 210 of the transferred surface 201 of the substrate 200 to be transferred holds two light-emitting elements D per one pixel E. Adjacent second regions 114 may be continuous with each other. In this case, the shape of the second surface 120 surrounding the first region 110 is a lattice shape.

When the holding substrate 100 holds the plurality of first light-emitting elements D1 on the first surface 101 and presses against the transferred substrate 200, the second surface 120 avoids the light-emitting elements D held on the transferred surface 201 of the transferred substrate 200 and does not collide with the light-emitting elements D. The second surface 120 is provided corresponding to the position of the light emitting element D held in the transferred substrate 200 of the light emitting element D of the transferred substrate 200 .

The width of the second region 114 along the direction of the second surface 120 is wider than the width of the light emitting element D of the transferred substrate 200 along the direction of the transferred surface 201 . Also, the second section 114 may be provided in a groove shape with a specific width. In this case, the width of the groove-shaped second region 114 along the direction of the second surface 120 is wider than the width of the surface of the light emitting element D facing the surface to be transferred 201, and the length in the longitudinal direction may be equal to or greater than the length of the side in the longitudinal direction of the parallel first regions 110.

The depth DP1 of the second surface 120 from the first surface 101 is greater than the difference δ1 between the height hD2 of the protrusion 220 provided on the transferred substrate 200 described later from the transfer surface 201 and the height hD1 of the first light emitting element D1 from the first surface 101 . That is, the depth DP1 of the second surface 120 from the first surface 101 is greater than the difference δ1 between the position of the front end of the protrusion 220 and the position of the front end of the first light emitting element D1 in a direction perpendicular to the first surface 101 .

The second surface 120 is provided by removing the first surface 101 in the first region 110 of the processing and holding substrate 100 . The method of removing the first surface 101 of the holding substrate 100 is not limited, for example, machining methods such as cutting or etching can be used. The second region 114 can also be formed by, for example, placing a mask on a portion corresponding to the first region 112 and performing dry etching by RIE (Reactive Ion Etching: Reactive Ion Etching) or the like from the surface direction of the first surface 101 . In addition, the second region 114 may also be formed together with the process of singulating the crystal film of the semiconductor used as the light-emitting element grown on the first surface 101 .

The holding substrate 100 is a so-called growth substrate for growing crystals of semiconductor thin films. The holding substrate 100 is, for example, a sapphire substrate. The holding substrate 100 can also be a so-called patterned sapphire substrate. When the holding substrate 100 is a patterned sapphire substrate, the first surface 101 has a structure that reflects light periodically formed in a conical, hemispherical, pyramidal, or columnar shape as a fine pattern. The patterned sapphire substrate is formed, for example, by placing a patterned mask on the first surface 101 of the sapphire substrate and performing dry etching by RIE (Reactive Ion Etching).

Either one of the process of forming the second surface 120 on the first surface 101 of the holding substrate 100 and the process of forming a plurality of first light-emitting elements D1 on the first surface 101 of the holding substrate 100 may be performed first. That is, after the second surface 120 of the second region 114 is formed on the first surface 101 of the holding substrate 100 , a plurality of first light emitting elements D1 are formed and held on the first surface 101 of the holding substrate 100 . Alternatively, the second surface 120 of the second region 114 may also be formed on the first surface 101 of the holding substrate 100 after forming and holding the plurality of first light emitting elements D1 on the first surface 101 of the holding substrate 100 .

In addition, the holding substrate 100 is not limited to a growth substrate, and may be a transfer substrate that temporarily holds the first light emitting element D1 for transfer. In this case, the holding substrate 100 is made of a plate material such as a glass-based material or a resin-based material, and the first light-emitting element D1 is held on the first surface 101 via, for example, an adhesive sheet. Hereinafter, the holding substrate 100 will be described as a growth substrate.

＜Substrate to be transferred＞ The transferred substrate 200 is, as shown in FIG. 3 , a board-shaped substrate. The transferred substrate 200 is, for example, an array substrate of the display device 10 . The transferred area 210 shown in FIG. 3 is the display area where all the light emitting elements D are transferred. The transferred substrate 200 becomes a peripheral region around the transferred region 210 to be a display region. The transferred area 210 is disposed at a specific distance from the edge 202 of the transferred substrate 200 . The transferred substrate 200 is, for example, an array substrate on which TFT (Thin Film Transistor: thin film transistor) circuits, signal lines, and scanning lines are formed in the display area. The transferred substrate 200 includes a plurality of second alignment marks 203 . As shown in FIG. 3 , the transferred area 210 of the substrate 200 to be transferred has a second light emitting element D2 and a third light emitting element D3 that are transferred earlier than the first light emitting element D1. In Embodiment 1, the second light emitting element D2 and the third light emitting element D3 are protrusions 220 .

As shown in FIG. 4 , the substrate to be transferred 200 has a transferred surface 201 . The surface on which the second light-emitting element D2 has been transferred, the surface on which the third light-emitting element D3 has been transferred, and the transferred surface 201 on which the first light-emitting element D1 has been transferred are different surfaces in plan view.

A plurality of second alignment marks 203 are formed on the transferred surface 201 . The second alignment mark 203 is formed together with the circuit. The position of the electrode to be connected to the light-emitting element D can be prescribed|regulated by the position of the 2nd alignment mark 203 on the board|substrate 200 to be transferred with high precision.

＜Protruding part＞ The plurality of protrusions 220 include the second light emitting element D2 and the third light emitting element D3. A plurality of second light emitting elements D2 and third light emitting elements D3 protrude from the direction perpendicular to the transferred surface 201 of the transferred region 210 shown in FIG. 3 . The second light emitting element D2 and the third light emitting element D3 have a specific height from the surface on which they are arranged. The positions of the front ends of the second light-emitting element D2 and the third light-emitting element D3 are in the direction perpendicular to the transfer surface 201 , and are at a predetermined height from the surface on which they are arranged. For example, the second light emitting element D2 has a specific height hD2 from the surface on which the second light emitting element D2 is arranged. That is, the position of the front end of the second light emitting element D2 is a position at a predetermined height hD2 from the surface on which the second light emitting element D2 is arranged in a direction perpendicular to the surface to be transferred 201 . Also, among the plurality of second light emitting elements D2 and third light emitting elements D3, the position of the front end of any one of the second light emitting element D2 and the third light emitting element D3 in the direction perpendicular to the transferred surface 201 may be different from the position of the front end of any other of the second light emitting element D2 and the third light emitting element D3 in the direction perpendicular to the transferred surface 201. A plurality of protrusions 220 are arranged on the transferred surface 201 of the transferred area 210 at specific intervals.

The second light emitting element D2 and the third light emitting element D3 form a pixel E together with the first light emitting element D1. A plurality of second light emitting elements D2 and third light emitting elements D3 are arranged in advance in the transferred area 210 of the transferred substrate 200 . The plurality of second light emitting elements D2 and third light emitting elements D3 are, for example, transferred to the surface for specific arrangement of the transferred substrate 200 before transferring the first light emitting elements D1. At least one of the second light emitting element D2 and the third light emitting element D3 is provided in one pixel E, for example.

<Manufacturing method of display device according to the first embodiment> Hereinafter, a method of manufacturing the display device according to the first embodiment will be described with reference to FIGS. 5 to 8 . Fig. 5 is a conceptual diagram showing the state of positioning the holding substrate with respect to the substrate to be transferred according to the first embodiment. Fig. 6 is a conceptual diagram showing a state in which the holding substrate is pressed against the substrate to be transferred according to the first embodiment. Fig. 7 is a conceptual diagram showing a state where the first light-emitting element of the first embodiment is connected to an electrode of a substrate to be transferred. Fig. 8 is a conceptual diagram showing a state where the first light-emitting element of the first embodiment is detached from the holding substrate.

First, as shown in FIG. 5 , positioning is performed to press the holding substrate 100 against the substrate to be transferred 200 . The positioning of the holding substrate 100 is performed at a specific height in the direction perpendicular to the surface to be transferred 201 . The positioning of the holding substrate 100 is performed by, for example, holding the holding substrate 100 by a transfer device not shown so that the first surface 101 faces the substrate 200 to be transferred, at a specific height in the direction perpendicular to the transferred surface 201, and observing it by an alignment device not shown from the side of the holding substrate 100 opposite to the first surface 101. The positioning of the holding substrate 100 is performed so that the position of the first light emitting element D1 held on the holding substrate 100 becomes a specific position of the transferred surface 201 of the transferred substrate 200 . The position of the first light-emitting element D1 positioned and held on the holding substrate 100 is, for example, a specific position of the pixel E formed in the transferred region 210 of the transferred substrate 200 . In addition, as shown in FIGS. 1 and 3 , the positioning of the holding substrate 100 can also be performed in such a way that the first alignment mark 103 of the holding substrate 100 overlaps with the second alignment mark 203 of the substrate 200 to be transferred.

Next, as shown in FIG. 6 , the positioned holding substrate 100 is lowered to approach the transferred substrate 200 , and the plurality of first light emitting elements D1 held on the first surface 101 are pressed against the transferred surface 201 of the transferred substrate 200 . Here, the holding substrate 100 presses the plurality of first light emitting elements D1 against the transferred surface 201 of the transferred substrate 200 with a specific force. Thereby, the plurality of first light-emitting elements D1 are brought into a state of being in contact with a plurality of electrodes (not shown) of the transfer surface 201 of the transfer target substrate 200 through the low-melting point metal member (not shown).

Next, as shown in FIG. 7 , heating laser light L1 of a specific wavelength is emitted from a heating laser irradiation device (not shown) provided on the surface opposite to the first surface 101 of the holding substrate 100 . Specifically, the heating laser light L1 is emitted from the heating laser irradiation device toward the irradiation surface which is the surface opposite to the first surface 101 of the holding substrate 100 . The heating laser light L1 is light that is easily absorbed by the low-melting point metal member and is not easily absorbed by the transferred substrate 200 and the light emitting element D. As shown in FIG. The heating laser light L1 is infrared light, near infrared light or green light. The emitted heating laser light L1 passes through the holding substrate 100, is irradiated to the low-melting-point metal member provided on the electrode of the transferred surface 201 of the transferred substrate 200, and is absorbed. The low-melting-point metal member absorbing the irradiated heating laser light L1 is heated to form a eutectic alloy, and connects the first light-emitting element D1 held on the holding substrate 100 and the electrode of the substrate 200 to be transferred. In addition, the irradiation of the heating laser light L1 may be performed by providing the light-shielding mask M1 having the opening A1 on the irradiation surface side of the holding substrate 100 . In this case, the heating laser light L1 is emitted from the heating laser irradiation device provided on the surface side of the light-shielding mask M2 opposite to the holding substrate 100 toward the surface of the holding substrate 100 opposite to the first surface 101, that is, the irradiation surface, passes through the opening A2 of the light-shielding mask M2, and is irradiated to the holding substrate 100.

Next, as shown in FIG. 8 , an ablation laser light L2 of a specific wavelength is emitted from an ablation laser irradiation device (not shown) provided on the surface opposite to the first surface 101 of the holding substrate 100 . Specifically, the ablation laser light L2 is emitted from the ablation laser irradiation device toward the irradiation surface which is the surface opposite to the first surface 101 of the holding substrate 100 , and the ablation laser light L2 is emitted. The ablation laser light L2 is light that is easily absorbed by the first light emitting element D1 and is not easily absorbed by the transferred substrate 200 . Excision laser light L2 is ultraviolet light, blue light or green light. The emitted ablation laser light L2 passes through the holding substrate 100 , is irradiated to the interface between the first light emitting element D1 held on the first surface 101 of the holding substrate 100 and the first surface 101 of the holding substrate 100 , and is absorbed. The interface portion of the first light emitting element D1 that absorbed the ablation laser light L2 is dissolved, and the first light emitting element D1 is separated from the holding substrate 100 . In addition, the irradiation of the ablation laser light L2 may be performed by providing the light-shielding mask M2 having the opening A2 on the irradiation surface side of the holding substrate 100 . In this case, the ablation laser light L2 is emitted from the ablation laser irradiation device provided on the surface side of the light-shielding mask M2 opposite to the holding substrate 100 toward the irradiation surface, which is the surface opposite to the first surface 101 of the holding substrate 100, and is irradiated to the holding substrate 100 after passing through the opening A2 of the light-shielding mask M2. In this manner, the first light emitting element D1 is transferred from the holding substrate 100 to the transferred substrate 200 .

(variation example) Fig. 9 is a conceptual arrow cross-sectional view of a substrate to be transferred according to a modification of the first embodiment. The protruding portion 220 is not limited to the light-emitting element D, and can also be a reflective wall 222 . Moreover, the protruding portion 220 may also be composed of both the plurality of light emitting elements D and the plurality of reflective walls 222 . In this case, the plurality of reflective walls 222 may also be arranged on a surface of the substrate 200 to be transferred that is different from the surface to be transferred 201 on which the plurality of first light-emitting elements D1 are transferred. In addition, the light emitting element D may further be provided on a surface different from the surface to be transferred 201 and different from the surface on which the reflective wall 222 is arranged. Furthermore, in this case, the positions of the front ends of the plurality of reflective walls 222 may be further away from the position of the transferred substrate 200 than the positions of the front ends of the plurality of light emitting elements D in the direction perpendicular to the surface to be transferred 201 .

The case where the protruding portion 220 is the reflective wall 222 will be described. The reflective wall 222 reflects the light emitted by the light emitting element D to the direction perpendicular to the transferred surface 201 . The reflection wall 222 is provided on the transferred surface 201 of the transferred substrate 200 as shown in FIG. 9 . The reflective wall 222 has a specific height hR in the direction perpendicular to the conveyed surface 201 . The position of the front end of the reflective wall 222 is the same as the case where the protruding portion 220 is the light emitting element D in FIG. As shown in FIG. 9 , a plurality of reflective walls 222 are arranged at predetermined intervals on the transferred surface 201 of the transferred substrate 200 . At least one pixel E is accommodated on the transferred surface 201 between a plurality of adjacent reflective walls 222 . The reflective wall 222 is disposed in the gap between the pixels E of the transferred area 210 of the transferred substrate 200 .

The side surface of the reflective wall 222 viewed from the direction perpendicular to the conveyed surface 201 becomes a smooth surface with an inclination. The side surface of the reflective wall 222 is a smooth surface inclined with respect to the direction perpendicular to the conveyed surface 201 . That is, the width of the reflective wall 222 along the direction of the transferred surface 201 decreases as it moves away from the transferred surface 201 in the direction perpendicular to the transferred surface 201 .

When viewed from one direction, the holding substrate 100 is divided into a plurality of first zones 112 having a first surface 101 and a second zone 114 having a second surface 120 . The first region 112 is a region for holding a plurality of first light emitting elements D1 on the first surface 101 . The second surface 120 is separated from the first surface 101 in the depth direction of the first surface 101 .

Thereby, the holding substrate 100 is divided into a plurality of first regions 112 having a first surface 101 and a second region 114 having a second surface 120. The first surface 101 holds a plurality of first light-emitting elements D1, and has a second surface 120 separated from the first surface 101 in the depth direction of the first surface 101. Therefore, in a state where the plurality of first light-emitting elements D1 are held on the first surface 101, they are pressed against the substrate. When transferring the transferred surface 201 of the substrate 200 , even when the transferred substrate 200 has the protrusion 220 on the transferred surface 201 , contact with the protrusion 220 can be avoided.

The plurality of first light emitting elements D1 can be pressed against the transferred substrate 200 having a surface for arranging the plurality of protrusions 220 while being held on the first surface 101 of the first section 112 . The second section 114 may be provided at a position of the holding substrate 100 corresponding to the position of the protrusion 220 of the substrate 200 to be transferred.

Thus, since the second section 114 of the holding substrate 100 is provided on the first surface 101 of the holding substrate 100 corresponding to the protrusions 220 of the transferred substrate 200, when the holding substrate 100 holds the plurality of first light-emitting elements D1 on the first surface 101 and is pressed against the transferred substrate 200 having a surface for disposing the plurality of protrusions 220, the second surface 12 of the holding substrate 100 0 avoids the protruding portion 220 of the substrate 200 to be transferred, so contact with the protruding portion 220 of the substrate 200 to be transferred can be avoided.

The depth of the second surface 120 from the first surface 101 may be larger than the difference δ1 between the height of the protrusion 220 from the conveyed surface 201 and the height of the first light emitting element D1 from the first surface 101 . That is, assuming that the surface on which the projections 220 are arranged and the first surface 101 are at the same position in the direction perpendicular to the first surface 101, the depth of the second surface 120 from the first surface 101 may be greater than the difference δ1 between the height of the projections 220 from the surface to be transferred 201 and the height of the first light emitting element D1 from the first surface 101.

Therefore, since the depth DP1 of the second surface 120 from the first surface 101 is greater than the difference δ1 between the position of the front end of the protrusion 220 and the position of the front end of the first light-emitting element D1 in a direction perpendicular to the first surface 101, when the holding substrate 100 holds the plurality of first light-emitting elements D1 on the first surface 101 and is pressed against the transferred substrate 200 having a surface for arranging the plurality of protrusions 220, By keeping the second surface 120 of the substrate 100 away from the protrusion 220 of the substrate 200 to be transferred, contact with the protrusion 220 of the substrate 200 to be transferred can be avoided. In other words, assuming that the surface for disposing the protrusions 220 and the first surface 101 are at the same position in the direction perpendicular to the first surface 101, the depth DP1 from the first surface 101 of the surface of the holding substrate 100 viewed from the direction perpendicular to the first surface 101 of the second section 114 is greater than the height hR of the protrusions 220 of the transferred substrate 200 from the transferred surface 201 and the height hR of the first light-emitting element D1. The difference δ1 of the height hD1 of the first surface 101 can avoid contact with the protrusion 220 of the transferred substrate 200 when pressing against the transferred substrate 200 while holding the plurality of first light emitting elements D1.

The substrate to be transferred 200 may include a plurality of protrusions 220 with different positions of the front ends. In the state where the first light-emitting element D1 is pressed against the transferred substrate 200 , the front end of a part of the plurality of protrusions 220 may be positioned on the side of the second surface 120 deeper than the first surface 101 . That is, the depth DP1 of the second surface 120 from the first surface 101 may be greater than the difference between the height of the highest protrusion 220 from the transferred surface 201 among the plurality of protrusions 220 of the transferred substrate 200 and the height hD1 of the first light emitting element D1 held on the first surface 101 from the first surface 101. In other words, when the surface for disposing the protrusions 220 and the first surface 101 are at the same position in the direction perpendicular to the first surface 101, and among the plurality of protrusions 220 of the transferred substrate 200, the protrusion 220 with the highest height from the transferred surface 201 is the second light-emitting element D2, the depth DP1 of the second surface 120 from the first surface 101 can be greater than the plurality of second light-emitting elements of the transferred substrate 200. The difference δ1 between the height hD2 of the second light emitting element D2 having the highest height from the transferred surface 201 of the element D2 and the height hD1 of the first light emitting element D1 held on the first surface 101 of the holding substrate 100 from the first surface 101 . Also, in the case where the protrusion 220 with the highest height from the transferred surface 201 among the plurality of protrusions 220 of the transferred substrate 200 is the reflective wall 222, the depth DP1 of the second surface 120 from the first surface 101 can be greater than the height hR of the reflective wall 222 from the transferred surface 201 among the plurality of protrusions 220 of the transferred substrate 200, and the first light-emitting element D1 held on the first surface 101 The height difference from the first surface 101.

Thereby, holding the substrate 100 in the state where the first light-emitting element D1 is pressed against the transferred substrate 200, even if the positions of the front ends of the plurality of protrusions 220 of the transferred substrate 200 are in different positions, since the front ends of some of the protrusions 220 are located on the side of the second surface 120 that is deeper than the first surface 101, the contact between the protrusions 220 of the transferred substrate 200 and the holding substrate 100 can be avoided. In other words, when the surface for disposing the protruding portion 220 and the first surface 101 are at the same position in the direction perpendicular to the first surface 101, since the depth DP1 of the second surface 120 from the first surface 101 is greater than the difference δ1 between the height hD2 of the second light-emitting element D2 from the transferred surface 201 and the height hD1 of the first light-emitting element D1 from the first surface 101, the difference δ1 is maintained. When the plurality of first light-emitting elements D1 are pressed against the transferred substrate 200 , it is possible to prevent the protrusion 220 of the transferred substrate 200 from contacting the holding substrate 100 .

The protruding part 220 can also be at least one of the light emitting element and the reflective wall 222 .

Thereby, when the substrate 100 to be transferred has at least one of the transferred light-emitting element D1 or the reflective wall 222 , the holding substrate 100 can hold the plurality of first light-emitting elements D1 on the first surface 101 and press against the transferred surface 201 of the substrate 200 to avoid contact with the transferred light-emitting element D or the reflective wall 222 of the transferred surface 201 .

The manufacturing method of the display device 10 has the following steps: aligning the positions of the plurality of first light-emitting elements D1 held on the first surface 101 of the holding substrate 100 at specific positions of the transferred substrate 200 having a plurality of protrusions 220; The holding substrate 100 is divided into a plurality of first zones 112 having the first surface 101 viewed from one direction, and a second zone 114 having the second surface 120 viewed from one direction. The first section 112 holds a plurality of first light emitting elements D1 on the first surface 101 , and the second surface 120 is separated from the first surface 101 in the depth direction of the first surface 101 .

Thus, the manufacturing method of the display device 10 is to press the first light-emitting element D1 against the transferred surface 201 having the protrusion 220 of the transferred substrate 200 in a state where the holding substrate 100 holds the plurality of first light-emitting elements D1 on the first surface 101, so that the surface of the holding substrate 100, that is, the position of the second section 114 separated from the first surface 101 in the depth direction by the second surface 120 is viewed from the direction perpendicular to the first surface 101. After aligning in a manner corresponding to the position of the transferred substrate 200 and the protrusion 220, the holding substrate 100 is pressed against the transferred surface 201 of the transferred substrate 200, so that the protrusion 220 and the holding substrate 100 can be prevented from contacting.

＜Second Embodiment＞ Hereinafter, a second embodiment will be described with reference to FIGS. 10 to 16 . Fig. 10 is a conceptual plan view of the holding substrate of the second embodiment. Fig. 11 is the conceptual arrow sectional view of the Y3-Y3 sectional arrow in Fig. 10 . Fig. 12 is a conceptual plan view of a substrate to be transferred according to the second embodiment. Fig. 13 is a conceptual arrow sectional view of the Y4-Y4 sectional arrow in Fig. 12 . Fig. 14 is a conceptual diagram showing the state of pressing the holding substrate against the first region of the substrate to be transferred according to the second embodiment. Fig. 15 is a conceptual diagram showing the state of positioning the holding substrate with respect to the transferred area of the transferred substrate according to the second embodiment. Fig. 16 is a conceptual diagram showing the state of pressing the holding substrate against the transferred area of the transferred substrate according to the second embodiment.

The difference between the holding substrate 130 of the second embodiment is that the third section 146 is provided. Also, the difference of the transferred substrate 230 in the second embodiment is that the size of the transferred region 240 is larger than the size of the first region 140 of the holding substrate 130, and the first light-emitting element is transferred by a plurality of holding substrates. In addition, regarding the description of the second embodiment, the description of the contents overlapping with the first embodiment will be omitted.

＜Holding substrate＞ In the holding substrate 130 of the second embodiment, as shown in FIGS. 10 and 11 , the first light emitting element D1 is held in the first section 142 of the first region 140 of the first surface 131 . Compared with the holding substrate 100 of the first embodiment, the holding substrate 130 further includes a second region that is a region other than the first region 140 on the first surface 131 . That is, the second region is a region between the edge 132 of the holding substrate 130 and the first region 140 . Hereinafter, the second area is referred to as a third division 146 . The third region 146 has a specific width w from the edge 132 of the holding substrate 130 to the first region 140 . The specific width w of the third region 146 is greater than the specific interval p for maintaining the first light emitting elements D1. In addition, as shown in FIG. 10 , when the shape of the substrate 130 viewed from the direction perpendicular to the first surface 131 is circular and the first region 140 is square, the width w of the third region 146 is the distance from the edge 132 of the first region 140 to the end of the first region 140 in the direction parallel to the side in the direction where the width w of the first region 140 is to be obtained.

The third section 146 has a third surface 148 having a predetermined depth DP2 from the first surface 131 . The specific depth DP2 of the third surface 148 of the third region 146 is, for example, greater than the difference δ2 between the height hD2 of the protrusion 220 provided on the transferred substrate 230 described later, such as the height hD2 of the second light emitting element D2 from the transferred surface 231, and the height hD1 of the first light emitting element D1 from the first surface 131 of the self-holding substrate 130. The third surface 148 can be connected to the outer peripheral surface (edge 132 ) of the holding substrate 130 . In this case, the thickness of the edge 132 of the holding substrate 130 connected to the third surface 148 is thinner by the depth DP2 of the third surface 148 than the thickness of the case where the third surface 148 is not connected to the edge 132 of the holding substrate 130 . The depth DP2 of the third surface 148 of the third section 146 may be the same as the depth DP1 of the second surface 150 of the second section 144 . The third surface 148 of the third region 146 can be formed in the same procedure as the second surface 150 of the second region 144 .

＜Substrate to be transferred＞ The transferred substrate 230 of the second embodiment has, as shown in FIG. 12 , a transferred area 240 larger than the first area 140 of the holding substrate 130 on the transferred surface 231 . The transferred area 240 is disposed at a specific distance from the edge 232 of the transferred substrate 230 . The transferred substrate 230 includes a first transferred area 242 and a second transferred area 244 in the transferred area 240 of the transferred surface 231 . The first transferred area 242 and the second transferred area 244 are each of a size capable of holding the plurality of first light emitting elements D1 transferred from the holding substrate 130 .

<Manufacturing method of display substrate according to the second embodiment> Hereinafter, a method of manufacturing the display device according to the second embodiment will be described with reference to FIGS. 13 to 16 . The manufacturing method of the display device of the second embodiment is performed using a plurality of holding substrates 130 , and the first light-emitting elements D1 held by each holding substrate 130 are sequentially pressed and transferred to each area of the transferred substrate 230 . In the following description, the plurality of holding substrates 130 are referred to as a first holding substrate 130A and a second holding substrate 130B.

First, as shown in FIG. 13 , positioning of the first holding substrate 130A is performed with respect to the transferred region 240 of the transferred substrate 230 . Here, the transferred substrate 230 holds a plurality of second light emitting elements D2 and third light emitting elements D3, and the plurality of second light emitting elements D2 and third light emitting elements D3 are arranged at predetermined intervals.

Next, as shown in FIG. 14 , the plurality of first light emitting elements D1 held on the first surface 131 of the first holding substrate 130A are pressed against the first transferred region 242 of the transferred surface 231 of the transferred substrate 230 . The pressed plurality of first light emitting elements D1 are in contact with the plurality of electrodes provided on the transferred surface 231 of the transferred substrate 230 via the low-melting point metal member. In this state, heating laser light L1 is irradiated from the surface of the first holding substrate 130A opposite to the first surface 131 as in the aspect shown in FIG. 7 . The low-melting-point metal member irradiated with the heating laser light L1 is melted, and the first light-emitting element D1 held on the first holding substrate 130A is connected to the electrodes on the transferred surface 231 of the transferred substrate 230 . In addition, similarly to the aspect shown in FIG. 8 , the ablation laser light L2 of a specific wavelength is irradiated from the surface of the first holding substrate 130A opposite to the first surface 131 to separate the first surface 131 of the first holding substrate 130A from the first light emitting element D1.

Next, as shown in FIG. 15 , the positioning of the second holding substrate 130B is performed with respect to the second transfer area 244 of the transfer target substrate 230 . The positioning of the second holding substrate 130B is performed so that the first light emitting element D1 held on the first surface 131 of the second holding substrate 130B becomes a specific position of the second transferred region 244 of the transferred surface 231 of the transferred substrate 230 at a specific height in the direction perpendicular to the transferred surface 231 of the transferred substrate 230 . The position of the first light-emitting element D1 positioned and held on the second holding substrate 130B is, for example, a specific position of the pixel E formed in the transferred region 240 of the transferred substrate 230 .

Furthermore, the position of the second holding substrate 130B may be positioned between the third light emitting element D3 closest to the second transferred region 244 among the plurality of second light emitting elements D2 and third light emitting elements D3 held on the first transferred region 242 of the transferred surface 231 of the transferred substrate 230 , and the second transferred region 244 pressed against the transferred surface 231 of the transferred substrate 230 from the second holding substrate 130B. Among the plurality of first light emitting elements D1, the first light emitting elements D1 closest to the first transfer region 242 side are aligned at a predetermined interval p.

In addition, as shown in FIGS. 10 and 12 , the positioning of the second holding substrate 130B can also be performed in such a way that the first alignment mark 133 previously provided on the second holding substrate 130B overlaps with the second alignment mark 233 previously provided on the transferred substrate 230 .

Next, as shown in FIG. 16 , the second holding substrate 130B is lowered, and the plurality of first light emitting elements D1 held on the first surface 131 of the second holding substrate 130B are pressed against the second transferred region 244 of the transferred surface 231 of the transferred substrate 230 . Here, the plurality of first light emitting elements D1 are pressed against the transferred surface 231 of the transferred substrate 230 with a specific force. The plurality of first light emitting elements D1 are in contact with the plurality of electrodes provided on the transferred surface 231 of the transferred substrate 230 through the low melting point metal member. In this state, similar to the aspect shown in FIG. 7 , the heating laser light L1 of a specific wavelength is emitted from the heating laser device provided on the surface of the second holding substrate 130B opposite to the first surface 131 toward the irradiation surface, which is the surface opposite to the first surface 131 of the second holding substrate 130B. The low-melting-point metal member absorbing the irradiated heating laser light L1 is melted, and the first light-emitting element D1 held on the second holding substrate 130B is connected to the electrode of the transferred substrate 230 . 8, after irradiating the heating laser light L1 to connect the first light-emitting element D1 to the electrode, the ablation laser light L2 of a specific wavelength is emitted toward the surface of the second holding substrate 130B opposite to the first surface 131 from the ablation laser device provided on the surface of the second holding substrate 130B opposite to the first surface 131. The interface between the first light-emitting element D1 and the first surface 131 that has absorbed the irradiated ablation laser light L2 is modified, and the first surface 131 is separated from the first light-emitting element D1. In this manner, the transfer of the first light emitting element D1 from the holding substrate 130 to the transfer target substrate 230 is performed.

The holding substrate 130 has a first region 140 including the first region 142 and the second region 144 , and a second region (third region 146 ) which is a region other than the first region 110 . The second area is the third surface 148 viewed from one direction, and the third surface 148 can be separated from the first surface 131 in the depth direction of the first surface 131 .

Thereby, because the second region (third region 146) outside the first region 140 of the first surface 131 in the holding substrate 130 is viewed from the direction perpendicular to the first surface 131, the surface of the first surface 131 is the third surface 148 separated from the first surface 131 in the depth direction, so the plurality of first light-emitting elements D1 are pressed against the transferred surface 23 of the transferred substrate 230 while being held on the first surface 101. 1, even if there is a protrusion 220 protruding from the transferred surface 231 on the transferred surface 231 of the transferred substrate 230 and the region between the edge 132 of the holding substrate 130 and the first region 140, that is, the region corresponding to the second region, the third surface 148 can avoid the raised portion 220 of the transferred surface 231. Also, the transferred area 240 for holding the first light emitting element D1 of the transferred surface 231 of the transferred substrate 230 for transferring the first light emitting element D1 is larger than the first area 140 of the holding substrate 130, even when the first light emitting element D1 is transferred by, for example, the first holding substrate 130A and the second holding substrate 130B, it is possible to hold the first light emitting element D1 transferred by the first holding substrate 130A. When the second transferred region 244 adjacent to the transferred region 242 is held by the second holding substrate 130B and the plurality of first light emitting elements D1 are pressed against the transferred substrate 230 and transferred, the protrusions 220 are prevented from contacting the holding substrate 130 .

The manufacturing method of the display device has the following steps: After transferring the plurality of first light-emitting elements D1 from the first holding substrate 130A to the first transferred region 242 of the transferred substrate 230, aligning the position of the second holding substrate 130B holding the plurality of first light-emitting elements D1 on the first surface 131 at a specific position in the second transferred region 244 of the transferred substrate 230; and holding the aligned second holding substrate 130B. The plurality of first light emitting elements D1 are pressed against the transferred surface 231 of the transferred substrate 230 . The first holding substrate 130A and the second holding substrate 130B each have a first region 140 including a plurality of first regions 142 having the first surface 131 viewed from one direction and a second region 144 having the second surface 150 viewed from one direction. The first holding substrate 130A and the second holding substrate 130B hold a plurality of first light emitting elements D1 on the first surface 131 of the first section 142 , and the second surface 150 is separated from the first surface 131 in the depth direction of the first surface 131 . The first holding substrate 130A and the second holding substrate 130B have a second region (third section 146 ) whose surface viewed from one direction is the third surface 148 outside the first region 140 , and the second region is separated from the first surface 131 in the depth direction of the first surface 131 . The transferred substrate 230 includes a first transferred region 242 and a second transferred region 244 adjacent to the first transferred region 242 on the transferred surface 231 . The transferred substrate 230 has a transferred region 240 wider than the first region 140 of the holding substrate 130 .

Thereby, the first holding substrate 130A and the second holding substrate 130B respectively have a first region 140 and a second region. The first region 140 includes a first region 142 viewed from one direction as the first surface 131 and a second region 144 viewed from one direction as the second surface 150. The surface of the second region viewed from one direction outside the first region 140 is the third surface 148; Separated in the depth direction of the first surface 131, when transferring the second transferred region 244 adjacent to the first transferred region 242 of the first light-emitting element D1 from the first holding substrate 130A, the second holding substrate 130B holds the first light-emitting element D1 on the first surface 131 and presses and transfers the first light-emitting element D1 in the first transferred region 242 to avoid contact with the second holding substrate 130B.

The position of the transferred surface 231 of the transferred substrate 230 for the alignment of the second holding substrate 130B is spaced between the first light-emitting element D1 on the first surface 131 of the second holding substrate 130B closest to the first transferred region 242 and the first light-emitting element D1 held on the first transferred region 242 closest to the second transferred region 244, and the plurality of first light-emitting elements D1 retained on the first holding substrate 130A. The light emitting elements D1 are spaced at the same distance from each other.

Thereby, even when the transferred region 240 of the transferred substrate 230 is wider than the first region 140 of the holding substrate 130 in the manufacturing method of the display device 10, because the holding substrate 130 has the third surface 148 separated from the first surface 131 in a specific depth direction in the third region 146 outside the first region 140 of the first surface 131, the transferred surface 231 of the transferred substrate 230 has been passed through the third region 146. 1 The holding substrate 130A holds the second transferred region 244 adjacent to the first transferred region 242 of the plurality of first light emitting elements D1, and does not change the interval between the first light emitting element D1 held on the side of the first transferred region 242 closest to the second transferred region 244 and the first light emitting element D1 held on the side of the second transferred region 244 closest to the first transferred region 242 to the first light emitting element D1 held on the holding substrate 130 The specific intervals are pressed against the transferred substrate 230 .

According to the present embodiment, when the second holding substrate 130B intends to press and transfer the plurality of first light-emitting elements D1 to the second transferred region 244 of the transferred substrate 230, since the width w of the third region 146 is greater than the specific interval p of the first light-emitting elements D1, there is a possibility that the first light-emitting elements D1 in the first transferred region 242 interfere with the third region 146. However, since the second holding substrate 130B of the present embodiment has the third surface 148 separated from the first surface 131 by a specific depth in the third region 146, the first light emitting element D1 in the first transferred region 242 can be avoided. Thereby, the position of the first light emitting element D1 transferred by the second holding substrate 130B can be set irrespective of the width of the third region 146 . The position of the first light emitting element D1 held in the first transferred area 242 and the first light emitting element D1 held in the second transferred area 244 can be transferred, for example, to a position at a specific interval p between the plurality of first light emitting elements D1 held in the first transferred area 242.

As mentioned above, although preferred embodiment was demonstrated, this indication is not limited to this embodiment. The content disclosed in the embodiment is only an example, and can be appropriately changed within the scope not departing from the gist of the present disclosure. Appropriate changes made within the scope not departing from the gist of this disclosure also belong to the technical scope of this disclosure.

10: Display device 100, 130, 130A, 130B: holding substrate 101,131: side 1 102,132: Fate 103,133: 1st alignment mark 110,140: Area 1 112,142: Division 1 114,144: Division 2 120,150: side 2 146:Second area/3rd division 148: Side 3 200, 230: transferred substrate 201,231: Transferred surface 202,232: Fate 203,233: 2nd alignment mark 210,240: Transferred area 220: protrusion 222: reflective wall 242: The first transferred area 244: The second transferred area A1, A2: opening D1: The first light-emitting element D2: The second light-emitting element D3: The third light-emitting element DP1: Depth of face 2 DP2: Depth of face 3 E: pixel hD1: Height of the first light-emitting element hD2: height of light emitting element hR: height of reflective wall L1: heating laser light L2: cutting laser light M1, M2: shading mask p: Keep the interval between multiple first light-emitting elements w: the width of the third division δ1: The difference between the position of the front end of the first light-emitting element and the position of the front end of the second light-emitting element δ2: The difference between the position of the front end of the first light-emitting element and the position of the front end of the protrusion

Fig. 1 is a conceptual plan view of a holding substrate according to a first embodiment. Fig. 2 is the conceptual arrow sectional view of Y1-Y1 sectional arrow of Fig. 1. Fig. 3 is a conceptual plan view of the substrate to be transferred according to the first embodiment. Fig. 4 is the conceptual arrow sectional view of the Y2-Y2 sectional arrow in Fig. 3 . Fig. 5 is a conceptual diagram showing the state of positioning the holding substrate with respect to the substrate to be transferred according to the first embodiment. Fig. 6 is a conceptual diagram showing a state in which the holding substrate is pressed against the substrate to be transferred according to the first embodiment. Fig. 7 is a conceptual diagram showing a state where the first light-emitting element of the first embodiment is connected to an electrode of a substrate to be transferred. Fig. 8 is a conceptual diagram showing a state where the first light-emitting element of the first embodiment is detached from the holding substrate. Fig. 9 is a conceptual arrow cross-sectional view of a substrate to be transferred according to a modification of the first embodiment. Fig. 10 is a conceptual plan view of the holding substrate of the second embodiment. Fig. 11 is the conceptual arrow sectional view of the Y3-Y3 sectional arrow in Fig. 10 . Fig. 12 is a conceptual plan view of a substrate to be transferred according to the second embodiment. Fig. 13 is a conceptual arrow sectional view of the Y4-Y4 sectional arrow in Fig. 12 . Fig. 14 is a conceptual diagram showing the state of pressing the holding substrate against the first transfer region of the substrate to be transferred according to the second embodiment. Fig. 15 is a conceptual diagram showing the state of positioning the holding substrate with respect to the second transfer area of the substrate to be transferred according to the second embodiment. Fig. 16 is a conceptual diagram showing the state of pressing the holding substrate against the second transfer region of the substrate to be transferred according to the second embodiment.

100: hold substrate

101: Side 1

120:Side 2

200: Substrate being transferred

201: Transferred surface

D1: The first light-emitting element

D2: The second light-emitting element

DP1: Depth of face 2

hD1: Height of the first light-emitting element

hD2: height of light emitting element

δ1: The difference between the position of the front end of the first light-emitting element and the position of the front end of the second light-emitting element

Claims (8)

A holding substrate, which is divided into a plurality of first divisions having a first surface and a second division having a second surface when viewed from one direction; and the first division is an area for holding a plurality of first light-emitting elements on the first surface; the second surface is separated from the first surface in the depth direction of the first surface; and the plurality of first light-emitting elements are held on the first surface of the first division and pressed against the substrate having a surface for arranging a plurality of protrusions The substrate is transferred; the above-mentioned second section is arranged at a position corresponding to the position of the above-mentioned protruding part. The holding substrate according to claim 1, wherein the depth of the second surface from the first surface is larger than the difference between the position of the front end of the protrusion and the position of the front end of the first light-emitting element in a direction perpendicular to the surface of the first surface. The holding substrate according to claim 1, wherein the substrate to be transferred has a plurality of protrusions with different front ends; and in a state where the first light-emitting element is pressed against the substrate to be transferred, the front ends of some of the plurality of protrusions are located at a position deeper on the side of the second surface than on the first surface. The holding substrate according to Claim 1 or 2, which has: a first area, which includes the above-mentioned first area and the above-mentioned second area; and a second area, which is an area other than the above-mentioned first area; and in the above-mentioned second area, it has a third surface viewed from the above-mentioned one direction; The third surface is separated from the first surface in the depth direction of the first surface. The holding substrate according to claim 1 or 2, wherein the protrusion is at least one of a light emitting element and a reflective wall. A method of manufacturing a display device, comprising the steps of: aligning the positions of a plurality of first light-emitting elements held on a holding substrate at specific positions on a transferred surface of a transferred substrate having a plurality of protrusions; and pressing the first light-emitting elements held on the holding substrate aligned relative to the transferred substrate against the transferred substrate; The first section holds a plurality of first light-emitting elements on the first surface; the second surface is separated from the first surface in the depth direction of the first surface; when the holding substrate holds the plurality of first light-emitting elements on the first surface and is pressed against the transferred surface of the transferred substrate; the second section is aligned with the transferred substrate in a manner corresponding to the position of the protrusion. A method for manufacturing a display device, comprising the following steps: after transferring a plurality of first light emitting elements from a first holding substrate to a first transferred area of a transferred substrate, aligning positions of a plurality of first light emitting elements held by a second holding substrate at specific positions on a transferred surface of the transferred substrate having a plurality of protrusions; and The plurality of the first light-emitting elements held by the aligned second holding substrate are pressed against the transferred surface of the transferred substrate; and the above-mentioned first holding substrate and the above-mentioned second holding substrate each have a first region, the first region includes a plurality of first regions with a first surface viewed from one direction, and a second region with a second surface; a plurality of the first light-emitting elements are held on the first surface of the first region, and the second surface is in the depth direction of the first surface and the first region. 1 surface is separated, and in addition to the above-mentioned first region, there is a second region that is viewed as a third surface from the above-mentioned one direction. The above-mentioned third surface is separated from the above-mentioned first surface in the depth direction of the above-mentioned first surface; When the holding substrate holds the plurality of first light-emitting elements on the first surface of the second holding substrate and is pressed against the transferred surface of the transferred substrate; the second division is aligned with the transferred substrate in a manner corresponding to the position of the protrusion. The manufacturing method of a display device according to claim 7, wherein the position of the second transferred region of the transferred substrate for aligning the second holding substrate is held at the same position between the first light-emitting element on the first surface of the second holding substrate and the closest to the first transferred region, the first light-emitting element held on the first transferred region and closest to the second transferred region, and the plurality of first light-emitting elements held on the first holding substrate.