JP2023028604A - Holding substrate and method of manufacturing display device - Google Patents

Abstract

To provide a holding substrate which is unlikely to touch a transfer destination substrate when multiple first light-emitting elements held by the holding substrate are transferred to the transfer destination substrate, and to provide a method of manufacturing display devices.SOLUTION: Viewing from one direction, a holding substrate provided herein has multiple first sections constituting a first surface and a second section constituting a second surface. The first sections have multiple first light-emitting elements on the first surface. The second surface lies away from the first surface in a depth direction of the first surface.SELECTED DRAWING: Figure 6

Description

The present disclosure relates to a method of manufacturing a holding substrate and a display device.

2. Description of the Related Art There are display devices that use red, green, and blue light-emitting elements as pixels. In the display device, pixels are formed by transferring light emitting elements of each color from a holding substrate.

2. Description of the Related Art As the density of display pixels increases, a large number of fine light-emitting elements are mounted on display devices. The light emitting element is required to be transferred from the holding substrate to the display device with high positioning accuracy. In the manufacturing process of the display device, a technique called direct transfer is sometimes used in which the light emitting element is directly pressed against the display substrate while being held by the holding substrate, and the light emitting element is transferred.

Patent Literature 1 discloses a technique of pressing a growth substrate provided with light emitting devices against a backplane substrate and transporting the light emitting devices as a group.

Japanese Patent Application Publication No. 2018-508972

When the plurality of first light emitting elements held by the holding substrate are transferred to the substrate to be transferred, the holding substrate and the substrate to be transferred come close to each other. At this time, the substrate to be transferred and the holding substrate may come into contact with each other.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a holding substrate and a display that are less likely to come into contact with a substrate to be transferred even when a plurality of first light emitting elements held by the holding substrate are transferred to the substrate to be transferred. It is an object of the present invention to provide a method of manufacturing an apparatus.

A holding substrate according to the present disclosure for achieving the above object is divided into a plurality of first sections having a first surface and second sections having a second surface when viewed from one direction, and the One section is a region in which a plurality of first light emitting elements are held on the first surface, and the second surface is separated from the first surface in the depth direction of the first surface.

A method of manufacturing a display device according to the present disclosure for achieving the above object is a transfer substrate provided with a plurality of protrusions of a substrate to be transferred, wherein positions of a plurality of first light-emitting elements held on a first surface of a holding substrate are adjusted. aligning the first light emitting element held on the first surface of the holding substrate aligned with the substrate to be transferred to the surface to be transferred of the substrate to be transferred; and the holding substrate is divided into a plurality of first sections having a first surface and second sections having a second surface when viewed from one direction, and the first The compartment holds a plurality of first light emitting elements on the first surface, and the second surface is separated from the first surface in the depth direction of the first surface.

A method of manufacturing a display device according to the present disclosure for achieving the above object is to transfer a plurality of first light-emitting elements from a first holding substrate to a first transfer area of a substrate to be transferred, and then transfer the plurality of first light-emitting elements a step of aligning a position of a second holding substrate holding a light emitting element on a first surface with a predetermined position of a second transfer area of the substrate to be transferred; and pressing the held plurality of first light emitting elements against the transferred surface of the transferred substrate, wherein the first holding substrate and the second holding substrate are arranged in a second direction when viewed from one direction. A first region including a plurality of first sections having one surface and a second section having a second surface, respectively, and holding a plurality of the first light emitting elements on the first surface of the first section. , the second surface is separated from the first surface in the depth direction of the first surface, and outside the first area, a second area that is a third surface when viewed from the one direction is provided. The third surface is separated from the first surface in the depth direction of the first surface, and the substrate to be transferred has a first area to be transferred and the first area to be transferred on the surface to be transferred. and a transferred region including a second transferred region adjacent to the substrate, wherein the transferred region is wider than the first region of the first holding substrate or the second holding substrate.

FIG. 1 is a conceptual plan view of a holding substrate according to the first embodiment. FIG. 2 is a conceptual cross-sectional view taken along the line Y1-Y1 in FIG. FIG. 3 is a conceptual plan view of the substrate to be transferred according to the first embodiment. FIG. 4 is a conceptual cross-sectional view along the Y2-Y2 cross-sectional view in FIG. FIG. 5 is a conceptual diagram showing how the holding substrate according to the first embodiment is positioned with respect to the substrate to be transferred. FIG. 6 is a conceptual diagram showing how the holding substrate according to the first embodiment is pressed against the substrate to be transferred. FIG. 7 is a conceptual diagram showing how the first light emitting element according to the first embodiment is connected to the electrode of the substrate to be transferred. FIG. 8 is a conceptual diagram showing how the first light emitting element according to the first embodiment is detached from the holding substrate. FIG. 9 is a conceptual cross-sectional view of a substrate to be transferred according to a modification of the first embodiment. FIG. 10 is a conceptual plan view of a holding substrate according to the second embodiment. FIG. 11 is a conceptual cross-sectional view along the Y3-Y3 cross-sectional view in FIG. FIG. 12 is a conceptual plan view of a substrate to be transferred according to the second embodiment. 13 is a conceptual cross-sectional view along the Y4-Y4 cross-sectional view in FIG. 12. FIG. FIG. 14 is a conceptual diagram showing how the holding substrate according to the second embodiment is pressed against the first transfer area of the substrate to be transferred. FIG. 15 is a conceptual diagram showing how the holding substrate according to the second embodiment is positioned with respect to the second transfer region of the substrate to be transferred. FIG. 16 is a conceptual diagram showing how the holding substrate according to the second embodiment is pressed against the second transfer region of the substrate to be transferred.

A form (embodiment) for carrying out the present disclosure will be described in detail with reference to the drawings. The present disclosure is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the components described below can be combined as appropriate. It should be noted that the disclosure is merely an example, and those that a person skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the disclosure are naturally included in the scope of the present disclosure. In addition, in order to make the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part compared to the actual embodiment, but this is only an example, and the interpretation of the present disclosure is not intended. It is not limited. In addition, in this specification and each figure, the same reference numerals may be given to the same elements as those described above with respect to the existing figures, and detailed description thereof may be omitted as appropriate.

Modes for carrying out the present disclosure are described below with reference to FIGS. FIG. 1 is a conceptual plan view of a holding substrate according to the first embodiment. FIG. 2 is a conceptual cross-sectional view taken along the line Y1-Y1 in FIG. FIG. 3 is a conceptual plan view of the substrate to be transferred according to the first embodiment. FIG. 4 is a conceptual cross-sectional view along the Y2-Y2 cross-sectional view in FIG.

In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the components described below can be combined as appropriate.

<First embodiment>
A plurality of first light emitting devices D1 held by the holding substrate 100 shown in FIGS. 1 and 2 are transferred to the substrate 200 to be transferred. In the first embodiment, the second light emitting element D2 and the third light emitting element D3 have already been transferred to the substrate 200 to be transferred.

<Display device>
The display device 10 controls a plurality of pixels E to display an image. The pixel E includes a first light emitting device D1, a second light emitting device D2 and a third light emitting device D3 that emit light of different colors. The display device 10 is configured by arranging a first light emitting element D1, a second light emitting element D2 and a third light emitting element D3 on a substrate 200 to be transferred.

The pixel E includes, for example, a first light emitting element D1 that emits blue light, a second light emitting element D2 that emits red light, and a third light emitting element D3 that emits green light. . Pixels E are arranged in a matrix. A first light emitting element D1, a second light emitting element D2, and a third light emitting element D3 are provided for each pixel E, respectively. The first light emitting device D1, the second light emitting device D2, and the third light emitting device D3 may be referred to as a light emitting device D when they are not distinguished from each other.

<Light emitting element>
The light emitting element D emits light of a predetermined color. The light emitting element D is an inorganic light emitting diode (LED: Light Emitting Diode) chip having a size of about 3 μm or more and 300 μm or less when viewed from the direction perpendicular to the surface of the first surface 101, and is also called a micro LED. Called. A display device with a micro LED in each pixel is also called a micro LED display device. Note that the micro of micro LED does not limit the size of the inorganic light emitting diode. Also, the light emitting element D may be a mini LED. The height of the light emitting element D may have different heights depending on the color of the emitted light.

The light-emitting element D has a laminated structure in which a first electrode connection layer, a light-emitting layer, and a second electrode connection layer (not shown) are laminated in this order. The light-emitting device D is formed by growing semiconductor crystals on a growth substrate to form the above-described laminated structure. When the light-emitting layer is made of gallium nitride-based material (GaN), the first electrode connection layer is, for example, N-type GaN, and the second electrode connection layer is P-type GaN. By energizing the first electrode connection layer and the second electrode connection layer of the light emitting element D, the light emitting layer emits light of a predetermined color. The light emitted by the light-emitting element D may be of any color such as red, blue, yellow-green, and green. Specifically, the center wavelength of each color light emitted from the light emitting element D is about 610 nm for red, about 470 nm for blue, about 505 nm for green, and 570 nm for yellowish green.

<Holding substrate>
The holding substrate 100 according to the first embodiment is a plate-shaped substrate. As shown in FIG. 1, the holding substrate 100 has a first region 110 on a surface viewed from one direction, which is a direction perpendicular to the first surface 101 . First region 110 includes first compartment 112 and second compartment 114 . The first section 112 is the first surface 101 viewed from one direction. The second section 114 is the second side 120 of the plane viewed from one direction. The holding substrate 100 holds the plurality of first light emitting elements D1 on the first surface 101 of the first section 112 at predetermined intervals p. The holding substrate 100 has a plurality of first alignment marks 103 on the first surface 101 outside the first region 110 . The holding substrate 100 is made of a transparent material that transmits light of a predetermined wavelength with a predetermined transmittance or more. It is desirable that the holding substrate 100 is made of a material having heat resistance and corrosion resistance.

The first region 110 is a region for holding the first light emitting element D1. The first area 110 according to the first embodiment has the same size as the transferred area 210 of the transferred substrate 200, which will be described later. The first region 110 may be provided at a predetermined distance from the edge 102 of the holding substrate 100 .

The first section 112 is a section having the first surface 101 when the holding substrate 100 is viewed from one direction. The size of the first section 112 when the first surface 101 is viewed from the direction orthogonal to the surface of the first surface 101 is equal to or larger than the size of the first light emitting element D1. The first section 112 is provided in a region of the first region 110 corresponding to the region where the substrate to be transferred 200 does not include the second light emitting device D2 and the third light emitting device D3.

The second section 114 is a section having a second surface 120 when the holding substrate 100 is viewed from one direction. The second surface 120 is a surface separated from the first surface 101 in the depth direction of the holding substrate 100 . The second section 114 is provided at least in a region of the first region 110 corresponding to the light emitting device D held on the transferred surface 201 of the transferred substrate 200 . The second section 114 does not hold the first light emitting element D1. The size of the second section 114 is larger than the size of the corresponding light emitting element D when viewed in the direction perpendicular to the first surface 101 . For example, when two light emitting elements D are held per pixel E in the region 210 to be transferred of the surface 201 to be transferred of the substrate 200 to be transferred, the second section 114 is formed on the first surface 101 of the holding substrate 100 comprises a second section 114 for two light emitting elements D. FIG. Adjacent second partitions 114 may be continuous. In this case, the shape of the second surface 120 surrounding the first region 110 is a lattice shape.

When the holding substrate 100 holds the plurality of first light emitting elements D1 on the first surface 101 and presses them against the substrate to be transferred 200, the second surface 120 is the light emitting elements D held on the surface to be transferred 201 of the substrate to be transferred 200. to avoid colliding with the light emitting element D. The second surface 120 is provided corresponding to the positions of the light emitting elements D held by the substrate 200 to be transferred, on the substrate 200 to be transferred.

The width of the second section 114 in the direction along the second surface 120 is wider than the width in the direction along the surface 201 to be transferred of the light emitting element D of the substrate 200 to be transferred. Also, the second section 114 may be provided in a groove shape with a predetermined width. In this case, the width of the groove-shaped second section 114 in the direction along the second surface 120 is wider than the width of the light emitting element D in the direction toward the surface to be transferred 201, and the length in the longitudinal direction is parallel. It may be equal to or longer than the length of the longitudinal side of the first region 110 .

The depth DP1 of the second surface 120 from the first surface 101 is, for example, the height hD2 from the transferred surface 201 of the protrusion 220 provided on the transferred substrate 200 described later, and the first depth of the first light emitting element D1. It is larger than the difference δ1 from the height hD1 from the surface 101 . That is, the depth DP1 of the second surface 120 from the first surface 101 is the difference δ1 in the direction orthogonal to the first surface 101 between the position of the tip of the protrusion 220 and the position of the tip of the first light emitting element D1. greater than

The second surface 120 is provided by removing the first surface 101 in the first region 110 of the holding substrate 100 . Any method can be used to remove the first surface 101 of the holding substrate 100, and for example, a processing method such as cutting or etching can be used. For example, the second section 114 may be formed by placing a mask on a portion corresponding to the first section 112 and performing dry etching such as RIE (Reactive Ion Etching) from the surface direction of the first surface 101 . In addition, the second section 114 may be formed along with the process of singulating the semiconductor crystal film grown on the first surface 101 to become the light emitting element.

The holding substrate 100 is a so-called growth substrate for growing a crystal of a semiconductor thin film. The holding substrate 100 is, for example, a sapphire substrate. The holding substrate 100 may be a so-called patterned sapphire substrate. When the holding substrate 100 is a patterned sapphire substrate, the first surface 101 has a structure that reflects light and is periodically formed as a fine pattern in a conical, hemispherical, pyramidal, or columnar shape. Prepare your body. The patterned sapphire substrate is formed, for example, by placing a patterned mask on the first surface 101 of the sapphire substrate and performing dry etching such as RIE (Reactive Ion Etching).

Either the step of forming the second surface 120 on the first surface 101 of the holding substrate 100 or the step of forming the plurality of first light emitting elements D1 on the first surface 101 of the holding substrate 100 may be performed first. That is, after the second surface 120 of the second section 114 is formed on the first surface 101 of the holding substrate 100, the plurality of first light emitting elements D1 are formed on the first surface 101 of the holding substrate 100 and held. Alternatively, after a plurality of first light emitting elements D1 are formed and held on the first surface 101 of the holding substrate 100, the second surface 120 of the second section 114 may be formed on the first surface 101 of the holding substrate 100. good.

Note that the holding substrate 100 is not limited to the growth substrate, and may be a transfer substrate that temporarily holds the first light emitting device D1 for transfer. In this case, the holding substrate 100 is made of a plate material such as a glass-based material or a resin-based material, and holds the first light emitting element D1 on the first surface 101 via an adhesive sheet, for example. Hereinafter, the holding substrate 100 will be described as a growth substrate.

<Substrate to be transferred>
The transferred substrate 200 is a plate-shaped substrate, as shown in FIG. The transferred substrate 200 is, for example, an array substrate of the display device 10 . A transferred area 210 shown in FIG. 3 becomes a display area after all the light emitting elements D are transferred. The transferred substrate 200 has a peripheral area around a transferred area 210 serving as a display area. The transferred region 210 is provided at a predetermined distance from the edge 202 of the transferred substrate 200 . The substrate to be transferred 200 is, for example, an array substrate in which TFT (Thin Film Transistor) circuits, signal lines, and scanning lines are formed in the display area. The transferred substrate 200 has a plurality of second alignment marks 203 . As shown in FIG. 3, the transferred region 210 of the transferred substrate 200 includes a second light emitting device D2 and a third light emitting device D3 that are transferred prior to the first light emitting device D1. The protrusions 220 are the second light emitting element D2 and the third light emitting element D3.

As shown in FIG. 4, the substrate to be transferred 200 has a surface to be transferred 201 . The surface to which the second light emitting device D2 has already been transferred, the surface to which the third light emitting device D3 has already been transferred, and the transferred surface 201 to which the first light emitting device D1 is transferred are different planes in plan view.

A plurality of second alignment marks 203 are formed on the transferred surface 201 . A second alignment mark 203 is formed with the circuit. In the substrate to be transferred 200 , the positions of the electrodes for connecting to the light emitting elements D can be defined with high accuracy by the positions of the second alignment marks 203 .

<Protrusion>
The multiple protrusions 220 include a second light emitting element D2 and a third light emitting element D3. A plurality of second light emitting elements D2 and third light emitting elements D3 are provided so as to protrude in a direction orthogonal to the transferred surface 201 of the transferred region 210 shown in FIG. The second light emitting element D2 and the third light emitting element D3 have a predetermined height from the surface on which they are arranged. The positions of the tips of the second light emitting element D2 and the third light emitting element D3 are positions that are at a predetermined height from the plane for arranging them in a direction perpendicular to the transferred surface 201 . For example, the second light emitting element D2 has a predetermined height hD2 from the surface on which the second light emitting element D2 is arranged. That is, the position of the tip of the second light emitting element D2 is a position at a predetermined height hD2 from the plane for arranging the second light emitting element D2 in the direction perpendicular to the transferred surface 201 . Further, among the plurality of second light emitting elements D2 and third light emitting elements D3, the position of the tip of either one of the second light emitting elements D2 and the third light emitting elements D3 in the direction perpendicular to the transferred surface 201 is The position of the tip of the other of the second light emitting element D2 and the third light emitting element D3 in the direction orthogonal to the transferred surface 201 may be different. A plurality of protrusions 220 are provided on the transfer surface 201 of the transfer area 210 at predetermined intervals.

The second light emitting element D2 and the third light emitting element D3 form a pixel E together with the first light emitting element D1. A plurality of second light emitting devices D2 and a plurality of third light emitting devices D3 are provided in the transfer region 210 of the transfer substrate 200 in advance. The plurality of second light emitting elements D2 and third light emitting elements D3 are transferred to a predetermined arrangement surface of the transferred substrate 200, for example, before the first light emitting elements D1 are transferred. At least one of the second light emitting element D2 and the third light emitting element D3 is provided in one pixel E, for example.

<Method for Manufacturing Display Device According to First Embodiment>
A method of manufacturing the display device according to the first embodiment will be described below with reference to FIGS. FIG. 5 is a conceptual diagram showing how the holding substrate according to the first embodiment is positioned with respect to the substrate to be transferred. FIG. 6 is a conceptual diagram showing how the holding substrate according to the first embodiment is pressed against the substrate to be transferred. FIG. 7 is a conceptual diagram showing how the first light emitting element according to the first embodiment is connected to the electrode of the substrate to be transferred. FIG. 8 is a conceptual diagram showing how the first light emitting element according to the first embodiment is detached from the holding substrate.

First, as shown in FIG. 5, positioning is performed by pressing the holding substrate 100 against the substrate to be transferred 200 . Positioning of the holding substrate 100 is performed at a predetermined height in the direction perpendicular to the surface 201 to be transferred. Positioning of the holding substrate 100 is performed by, for example, holding the holding substrate 100 by a transfer device (not shown) so that the first surface 101 faces the substrate to be transferred 200 , and holding the holding substrate 100 at a predetermined height in the direction perpendicular to the surface to be transferred 201 . Observation is performed by an alignment device (not shown) from the side of the substrate 100 opposite to the first surface 101 . Positioning of the holding substrate 100 is performed so that the position of the first light emitting element D1 held by the holding substrate 100 is at a predetermined position on the transfer surface 201 of the transfer substrate 200 . The position where the first light emitting element D1 held by the holding substrate 100 is positioned is, for example, a predetermined position in the pixel E formed in the transferred region 210 of the transferred substrate 200 . The holding substrate 100 may be positioned such that the first alignment marks 103 of the holding substrate 100 and the second alignment marks 203 of the substrate to be transferred 200 are aligned as shown in FIGS.

Next, as shown in FIG. 6, the positioned holding substrate 100 is lowered and brought closer to the substrate to be transferred 200, and the plurality of first light emitting elements D1 held on the first surface 101 are moved to the substrate to be transferred 200. As shown in FIG. is pressed against the surface 201 to be transferred. Here, the holding substrate 100 presses the plurality of first light emitting elements D1 against the transfer surface 201 of the transfer substrate 200 with a predetermined force. As a result, the plurality of first light emitting elements D1 are brought into contact with a plurality of electrodes (not shown) on the surface 201 to be transferred of the substrate 200 to be transferred via the low-melting-point metal member (not shown).

Next, as shown in FIG. 7, a heating laser beam L1 having a predetermined wavelength is emitted from a heating laser irradiation device (not shown) provided on the surface of the holding substrate 100 opposite to the first surface 101 . Specifically, the heating laser beam L1 is emitted from the heating laser irradiation device toward the irradiation surface opposite to the first surface 101 of the holding substrate 100 . The heating laser beam L1 is light that is easily absorbed by the low-melting-point metal member and is difficult to be absorbed by the transferred substrate 200 and the light-emitting element D. FIG. The heating laser beam L1 is infrared light, near-infrared light, or green light. The emitted heating laser beam L1 passes through the holding substrate 100, is irradiated to the low-melting-point metal member provided in the electrode of the transferred surface 201 of the transferred substrate 200, and is absorbed. The low-melting-point metal member that has absorbed the irradiated heating laser beam L1 is heated to become a eutectic alloy, and connects the first light-emitting element D1 held by the holding substrate 100 and the electrode of the substrate 200 to be transferred. Irradiation with the heating laser beam L1 may be performed by placing a light-shielding mask M1 having an opening A1 on the irradiation surface side of the holding substrate 100 . In this case, the heating laser beam L1 is emitted from a heating laser irradiation device provided on the side of the light shielding mask M2 opposite to the holding substrate 100 toward the irradiation surface opposite to the first surface 101 of the holding substrate 100. After passing through the opening A2 of the light shielding mask M2, the holding substrate 100 is irradiated with the light.

Next, as shown in FIG. 8, an ablation laser beam L2 having a predetermined wavelength is emitted from an ablation laser irradiation device (not shown) provided on the opposite surface of the holding substrate 100 from the first surface 101. As shown in FIG. Specifically, the ablation laser beam L2 is emitted from the ablation laser irradiation device toward the irradiation surface opposite to the first surface 101 of the holding substrate 100 . The ablation laser beam L2 is light that is easily absorbed by the first light emitting element D1 and is not easily absorbed by the substrate 200 to be transferred. The ablation laser light L2 is ultraviolet light, blue light, or green light. The emitted ablation laser beam L2 passes through the holding substrate 100 and irradiates the interface between the first light emitting element D1 held on the first surface 101 of the holding substrate 100 and the first surface 101 of the holding substrate 100. be absorbed. The interface portion of the first light emitting element D1 that has absorbed the ablation laser beam L2 melts, and the first light emitting element D1 and the holding substrate 100 are separated. Irradiation with the ablation laser beam L2 may be performed by placing a light-shielding mask M2 having an opening A2 on the irradiation surface side of the holding substrate 100 . In this case, the ablation laser beam L2 is emitted from the ablation laser irradiation device provided on the side of the light shielding mask M2 opposite to the holding substrate 100 toward the irradiation surface opposite to the first surface 101 of the holding substrate 100. After passing through the opening A2 of the light shielding mask M2, the holding substrate 100 is irradiated with the light. In this manner, the first light emitting device D1 is transferred from the holding substrate 100 to the transferred substrate 200. As shown in FIG.

(Modification)
FIG. 9 is a conceptual cross-sectional view of a substrate to be transferred according to a modification of the first embodiment. The projecting portion 220 is not limited to the light emitting element D, and may be the reflecting wall 222 . Also, the protrusion 220 may be composed of both the plurality of light emitting elements D and the plurality of reflecting walls 222 . In this case, the plurality of reflective walls 222 may be arranged on a surface of the substrate to be transferred 200 different from the surface to be transferred 201 to which the plurality of first light emitting devices D1 are transferred. Further, the light emitting element D may be provided on a surface different from the transferred surface 201 and different from the surface for arranging the reflecting wall 222 . Furthermore, in this case, the positions of the tips of the plurality of reflecting walls 222 are farther from the transferred substrate 200 than the positions of the tips of the plurality of light emitting elements D in the direction orthogonal to the surface to be transferred 201 . you can

A case where the protrusion 220 is the reflecting wall 222 will be described. The reflecting wall 222 reflects the light emitted by the light emitting element D in a direction orthogonal to the transferred surface 201 . The reflection wall 222 is provided on the transfer surface 201 of the transfer substrate 200, as shown in FIG. The reflecting wall 222 has a predetermined height hR in the direction perpendicular to the transferred surface 201 . The position of the tip of the reflecting wall 222 is deeper than the position of the first surface 101 and the second surface 120 in the orthogonal direction to the transferred surface 201, as in the case where the protrusion 220 in FIG. 6 is the light emitting element D. is. As shown in FIG. 9, a plurality of reflection walls 222 are arranged on the transfer surface 201 of the transfer substrate 200 at predetermined intervals. At least one pixel E is accommodated in the transferred surface 201 between the plurality of adjacent reflecting walls 222 . The reflective wall 222 is provided in the gap between the pixels E in the transferred region 210 of the transferred substrate 200 .

A side surface of the reflecting wall 222 viewed from the direction orthogonal to the transferred surface 201 is a smooth surface having an inclination. The side surface of the reflecting wall 222 is a smooth surface that is inclined with respect to the orthogonal direction of the transferred surface 201 . That is, the width of the reflection wall 222 in the direction along the transferred surface 201 decreases as the distance from the transferred surface 201 in the direction orthogonal to the transferred surface 201 increases.

The holding substrate 100 is partitioned into a plurality of first partitions 112 having first surfaces 101 and second partitions 114 having second surfaces 120 when viewed from one direction. The first section 112 is a region where the first surface 101 holds the plurality of first light emitting elements D1. The second surface 120 is separated from the first surface 101 in the depth direction of the first surface 101 .

Accordingly, the holding substrate 100 is divided into a plurality of first sections 112 having the first surface 101 and second sections 114 having the second surface 120, and the first surface 101 has a plurality of first light emitting elements D1. , and the second surface 120 separated from the first surface 101 in the depth direction of the first surface 101. Therefore, while the first surface 101 holds the plurality of first light emitting elements D1, the substrate to be transferred Even if the substrate to be transferred 200 has projections 220 on the surface to be transferred 201 , contact with the projections 220 can be avoided when the substrate 200 is pressed against the surface to be transferred 201 .

The plurality of first light emitting elements D1 may be pressed against the transferred substrate 200 having a surface for arranging the plurality of protrusions 220 while being held by the first surface 101 of the first section 112 . The second section 114 may be provided on the holding substrate 100 at a position corresponding to the position of the projection 220 on the transferred substrate 200 .

As a result, the holding substrate 100 is provided with the second sections 114 on the first surface 101 of the holding substrate 100 at positions corresponding to the projections 220 of the substrate to be transferred 200 , so that the holding substrate 100 can emit a plurality of first light-emitting elements. When the element D1 is held on the first surface 101 and pressed against the substrate to be transferred 200 having a surface for arranging the plurality of projections 220, the projections 220 of the substrate to be transferred 200 are moved to the second surface of the holding substrate 100. Since it is avoided by the surface 120, it is possible to avoid contact with the protrusion 220 of the substrate 200 to be transferred.

The depth of the second surface 120 from the first surface 101 may be greater than the difference δ1 between the height of the protrusion 220 from the transferred surface 201 and the height of the first light emitting element D1 from the first surface 101 . That is, if the surface on which the protrusion 220 is arranged is the surface of the same position in the orthogonal direction of the first surface 101 and the first surface 101, the second surface 120 from the first surface 101 The depth may be larger than the difference δ1 between the height of the protrusion 220 from the transferred surface 201 and the height of the first light emitting element D1 from the first surface 101 .

Accordingly, the depth DP1 of the second surface 120 from the first surface 101 is the direction perpendicular to the surface of the first surface 101 between the position of the tip of the protrusion 220 and the position of the tip of the first light emitting element D1. is greater than the difference δ1, so that when the holding substrate 100 holds the plurality of first light emitting elements D1 on the first surface 101 and presses it against the transferred substrate 200 having a surface for arranging the plurality of protrusions 220, Since the protrusion 220 of the substrate to be transferred 200 is avoided by the second surface 120 of the holding substrate 100, contact with the protrusion 220 of the substrate to be transferred 200 can be avoided. In other words, if the surfaces on which the protrusions 220 are arranged are the surfaces of the first surfaces 101 and 101 at the same position in the The depth DP1 from the first surface 101 of the surface viewed from the direction orthogonal to the first surface 101 of the transfer substrate 200 is the height hR of the protrusion 220 of the substrate 200 to be transferred from the surface 201 to be transferred and the depth hR of the first light emitting element D1. Since the difference .delta.1 from the height hD1 from the first surface 101 is larger than the difference .delta.1, contact with the projecting portion 220 of the substrate to be transferred 200 is avoided when the first light emitting elements D1 are held and pressed against the substrate to be transferred 200. It becomes possible to

The substrate to be transferred 200 may include a plurality of protrusions 220 with different tip positions. While the first light emitting element D1 is pressed against the substrate 200 to be transferred, the tips of some of the plurality of protrusions 220 are positioned deeper on the second surface 120 side than the first surface 101. It's okay. That is, the depth DP1 of the second surface 120 from the first surface 101 is the height of the projection 220 that is the highest from the surface 201 to be transferred among the plurality of projections 220 of the substrate 200 to be transferred, It may be larger than the difference from the height hD1 from the first surface 101 of the first light emitting element D1 held on the surface 101 . In other words, when the surfaces on which the projections 220 are arranged are the surfaces at the same position in the orthogonal direction between the first surface 101 and the first surface 101, the plurality of projections 220 of the substrate to be transferred 200 When the projection 220 having the highest height from the transferred surface 201 is the second light emitting element D2, the depth DP1 of the second surface 120 from the first surface 101 is equal to the depth DP1 of the transferred substrate 200. The height hD2 of the second light emitting element D2, which is the highest from the transferred surface 201 among the second light emitting elements D2, and the height hD2 of the first light emitting element D1 held on the first surface 101 of the holding substrate 100, It may be larger than the difference δ1 from the height hD1 from the surface 101 . Further, when the projection 220 having the highest height from the surface 201 to be transferred among the plurality of projections 220 of the substrate 200 to be transferred is the reflection wall 222, the depth of the second surface 120 from the first surface 101 is DP1 is the height hR of the reflecting wall 222 from the transferred surface 201 among the plurality of projections 220 of the transferred substrate 200 and the height hR of the first light emitting element D1 held on the first surface 101 from the first surface 101. It may be larger than the difference in height.

As a result, the holding substrate 100, in a state in which the first light-emitting element D1 is pressed against the substrate to be transferred 200, is uniform even if the positions of the tips of the projections 220 of the substrate to be transferred 200 are different. Since the tip of the projecting portion 220 of the portion is located deeper on the second surface 120 side than the first surface 101 , it is possible to avoid contact between the projecting portion 220 of the substrate to be transferred 200 and the holding substrate 100 . becomes. In other words, when the surfaces on which the protrusions 220 are arranged are the surfaces of the first surface 101 and the surfaces of the same position in the orthogonal direction of the first surface 101, the second surface 120 from the first surface 101 is the highest protrusion 220, for example, the difference δ1 between the height hD2 of the second light emitting element D2 from the transferred surface 201 and the height hD1 of the first light emitting element D1 from the first surface 101 Since it is large, it is possible to avoid contact between the protrusion 220 of the substrate to be transferred 200 and the holding substrate 100 when pressing the substrate to be transferred 200 while holding the plurality of first light emitting elements D1.

The protrusion 220 may be at least one of the light emitting element and the reflecting wall 222 .

Accordingly, even when the substrate to be transferred 200 has at least one of the light emitting elements already transferred and the reflecting walls 222, the holding substrate 100 holds the plurality of first light emitting elements D1 on the first surface 101. It is possible to avoid contact with the already transferred light emitting element D or the reflection wall 222 of the transferred surface 201 when pressing the transferred substrate 200 against the transferred surface 201 while keeping the transfer substrate 200 .

The manufacturing method of the display device 10 aligns the positions of the plurality of first light emitting elements D1 held on the first surface 101 of the holding substrate 100 with the predetermined positions of the transferred substrate 200 having the plurality of protrusions 220. and pressing the first light emitting element D1 held on the first surface 101 of the holding substrate 100 aligned with the substrate to be transferred 200 against the surface to be transferred 201 of the substrate to be transferred 200 . The holding substrate 100 is partitioned into a plurality of first compartments 112 having first surfaces 101 when viewed from one direction and second compartments 114 having second surfaces 120 when viewed from one direction. The first section 112 holds a plurality of first light emitting elements D1 on the first surface 101, and the second surface 120 is separated from the first surface 101 in the depth direction of the first surface 101. As shown in FIG.

As a result, the manufacturing method of the display device 10 is such that the holding substrate 100 holds the plurality of first light emitting elements D1 on the first surface 101, and the first light emitting elements D1 are transferred to the transfer substrate 200 having the projecting portions 220. When the holding substrate 100 is pressed against the surface 201 , the position of the second section 114 where the second surface 120 , which is the surface when the holding substrate 100 is viewed from the direction orthogonal to the first surface 101 , is separated from the first surface 101 in the depth direction is the position of the second section 114 . After the positions of the transfer substrate 200 and the protrusions 220 are aligned so as to correspond to each other, the holding substrate 100 is pressed against the transferred surface 201 of the substrate 200 to be transferred, thereby avoiding contact between the protrusions 220 and the holding substrate 100. It becomes possible to

<Second embodiment>
The second embodiment will be described below with reference to FIGS. 10 to 16. FIG. FIG. 10 is a conceptual plan view of a holding substrate according to the second embodiment. FIG. 11 is a conceptual cross-sectional view along the Y3-Y3 cross-sectional view in FIG. FIG. 12 is a conceptual plan view of a substrate to be transferred according to the second embodiment. 13 is a conceptual cross-sectional view along the Y4-Y4 cross-sectional view in FIG. 12. FIG. FIG. 14 is a conceptual diagram showing how the holding substrate according to the second embodiment is pressed against the first region of the substrate to be transferred. FIG. 15 is a conceptual diagram showing how the holding substrate according to the second embodiment is positioned with respect to the transfer area of the transfer substrate. FIG. 16 is a conceptual diagram showing how the holding substrate according to the second embodiment is pressed against the transfer area of the transfer substrate.

The holding substrate 130 according to the second embodiment differs in that it has a third section 146 . Further, in the transferred substrate 230 according to the second embodiment, the size of the transferred region 240 is larger than the size of the first region 140 of the holding substrate 130, and the first light emitting elements are transferred by a plurality of holding substrates. different in that respect. In addition, about description of 2nd Embodiment, description about the content which overlaps with 1st Embodiment is omitted.

<Holding substrate>
In the holding substrate 130 according to the second embodiment, the first light emitting element D1 is held in the first section 142 of the first region 140 of the first surface 131, as shown in FIGS. Compared to the holding substrate 100 according to the first embodiment, the holding substrate 130 further includes a second area outside the first area 140 on the first surface 131 . That is, the second area is the area between the edge 132 of the holding substrate 130 and the first area 140 . The second area is hereinafter referred to as the third section 146 . The third section 146 has a predetermined width w from the edge 132 of the holding substrate 130 to the first region 140 . The predetermined width w of the third section 146 is greater than the predetermined spacing p at which the first light emitting element D1 is held. In addition, as shown in FIG. 10 , when the shape of the holding substrate 130 when viewed from the direction perpendicular to the first surface 131 is circular and the first region 140 is rectangular, the The width w of the third section 146 is the width w of the first region 140 in the direction parallel to the side of the rectangular shape of the first region 140 at the position where the width w of the first region 140 is to be obtained. is the distance from the edge 132 of the first region 140 to the end of the first region 140 .

The third section 146 has a third surface 148 a predetermined depth DP2 from the first surface 131 . The predetermined depth DP2 of the third surface 148 of the third section 146 is, for example, the height hD2 from the transferred surface 231 of the protrusion 220 provided on the transferred substrate 230 described later, for example, the second light emitting element D2, It is larger than the difference δ2 between the height hD1 of the first light emitting element D1 from the first surface 131 of the holding substrate 130 . The third surface 148 may be connected to the outer peripheral surface (edge 132 ) of the holding substrate 130 . In this case, the thickness of the holding substrate 130 at the edge 132 connected to the third surface 148 is greater than the thickness when the third surface 148 is not connected to the edge 132 of the holding substrate 130 by the depth DP2 of the third surface 148 . minute, thinner. The depth DP2 of the third side 148 of the third section 146 may be the same as the depth DP1 of the second side 150 of the second section 144 . Third side 148 of third section 146 may be formed in the same process as second side 150 of second section 144 .

<Substrate to be transferred>
A substrate to be transferred 230 according to the second embodiment includes a region to be transferred 240 larger than the first region 140 of the holding substrate 130 on a surface 231 to be transferred, as shown in FIG. The transferred region 240 is provided at a predetermined distance from the edge 232 of the transferred substrate 230 . The transferred substrate 230 includes a first transferred area 242 and a second transferred area 244 in the transferred area 240 of the transferred surface 231 . The first transferred region 242 and the second transferred region 244 have sizes capable of holding the plurality of first light emitting elements D1 transferred from the holding substrate 130, respectively.

<Method for Manufacturing Display Substrate According to Second Embodiment>
A method of manufacturing the display device according to the second embodiment will be described below with reference to FIGS. 13 to 16. FIG. The manufacturing method of the display device according to the second embodiment is performed using a plurality of holding substrates 130, and the first light emitting elements D1 held by the respective holding substrates 130 are sequentially placed on the respective regions of the transferred substrate 230. Press against and transfer. In the following description, the multiple holding substrates 130 are referred to as a first holding substrate 130A and a second holding substrate 130B.

First, as shown in FIG. 13, the first holding substrate 130A is positioned with respect to the transfer area 240 of the transfer substrate 230. As shown in FIG. Here, the transferred substrate 230 holds a plurality of second light emitting elements D2 and third light emitting elements D3, and the plurality of second light emitting elements D2 and third light emitting elements D3 are arranged at predetermined intervals. there is

Next, as shown in FIG. 14, the plurality of first light emitting elements D1 held on the first surface 131 of the first holding substrate 130A is moved to the first transfer region 242 of the transfer surface 231 of the transfer substrate 230A. press against. The plurality of pressed first light emitting elements D1 are brought into contact with the plurality of electrodes provided on the surface 231 to be transferred of the substrate 230 to be transferred via the low-melting-point metal members. In this state, similarly to the embodiment shown in FIG. 7, the heating laser beam L1 is irradiated from the opposite surface of the first holding substrate 130A to the first surface 131. As shown in FIG. The low-melting-point metal member irradiated with the heating laser beam L1 melts and connects the first light-emitting element D1 held by the first holding substrate 130A and the electrode of the transferred surface 231 of the transferred substrate 230. . Further, similarly to the embodiment shown in FIG. 8, the surface of the first holding substrate 130A opposite to the first surface 131 is irradiated with the ablation laser beam L2 having a predetermined wavelength, thereby removing the first surface of the first holding substrate 130A. 131 and the first light emitting element D1 are separated.

Next, as shown in FIG. 15, the second holding substrate 130B is positioned with respect to the second transfer region 244 of the substrate 230 to be transferred. Positioning of the second holding substrate 130B is such that the first light emitting element D1 held on the first surface 131 of the second holding substrate 130B is positioned at a predetermined height in the direction perpendicular to the surface 231 of the substrate 230 to be transferred. , to a predetermined position of the second transfer area 244 of the transfer surface 231 of the transfer substrate 230 . The position at which the first light emitting element D1 held by the second holding substrate 130B is positioned is, for example, a predetermined position in the pixel E formed in the region 240 to be transferred of the substrate 230 to be transferred.

Further, the position of the second holding substrate 130B is set to the position of the second light emitting element D2 and the third light emitting element D3 that are held in the first transfer area 242 of the transfer surface 231 of the transfer substrate 230. Of the third light emitting element D3 on the second transfer area 244 side and the plurality of first light emitting elements D1 pressed against the second transfer area 244 of the transfer surface 231 of the transfer substrate 230 from the second holding substrate 130B, Alignment may be performed at a position where the distance from the first light emitting element D1 closest to the first transferred region 242 is a predetermined distance p.

10 and 12, positioning of the second holding substrate 130B is performed by first alignment marks 133 provided in advance on the second holding substrate 130B and second alignment marks 133 provided in advance on the substrate 230 to be transferred. It may be performed so that the alignment mark 233 overlaps.

Next, as shown in FIG. 16, the second holding substrate 130B is lowered, and the plurality of first light emitting elements D1 held on the first surface 131 of the second holding substrate 130B are moved to the substrate 230 to be transferred. It presses against the second transferred area 244 of the transfer surface 231 . Here, the plurality of first light emitting elements D1 are pressed against the transferred surface 231 of the transferred substrate 230 with a predetermined force. The plurality of first light emitting elements D1 are in contact with the plurality of electrodes provided on the surface 231 to be transferred of the substrate 230 to be transferred via the low-melting-point metal member. In this state, similarly to the embodiment shown in FIG. 7, a heating laser beam L1 having a predetermined wavelength is emitted from a heating laser device provided on the opposite surface of the second holding substrate 130B to the first surface 131 and applied to the second holding substrate 130B. The light is emitted toward the irradiation surface, which is the surface opposite to the first surface 131 of the substrate 130B. The low melting point metal member that has absorbed the irradiated heating laser beam L1 melts and connects the first light emitting element D1 held by the second holding substrate 130B and the electrode of the substrate 230 to be transferred. Further, similarly to the embodiment shown in FIG. 8, after the heating laser light L1 is irradiated to connect the first light emitting element D1 and the electrode, the second holding substrate 130B has a surface opposite to the first surface 131. A cutting laser beam L2 having a predetermined wavelength is emitted from the provided cutting laser device toward the surface opposite to the first surface 131 of the second holding substrate 130B. The interface between the first light emitting element D1 and the first surface 131 that absorbs the irradiated ablation laser beam L2 changes in quality, and separates the first surface 131 from the first light emitting element D1. In this way, the transfer of the first light emitting element D1 from the holding substrate 130 to the transferred substrate 230 is performed.

The holding substrate 130 has a first area 140 including a first section 142 and a second section 144 and a second area (third section 146 ) outside the first area 110 . A surface of the second region viewed from one direction is the third surface 148 , and the third surface 148 may be separated from the first surface 131 in the depth direction of the first surface 131 .

As a result, the holding substrate 130 has a second area (third section 146) outside the first area 140 of the first surface 131, and a surface of the first surface 131 viewed from a direction orthogonal to the first surface 131 Since the third surface 148 is separated from the surface 131 in the depth direction, when the plurality of first light emitting elements D1 are held on the first surface 101 and pressed against the surface 231 of the substrate 230 to be transferred, the surface 148 to be transferred can be removed. Even if the transferred surface 231 of the substrate 230 has a protrusion 220 protruding from the transferred surface 231 in a region corresponding to the second region, which is the region between the edge 132 of the holding substrate 130 and the first region 140. , the third surface 148 makes it possible to avoid the projection 220 of the surface 231 to be transferred. Further, the transferred area 240 for holding the first light emitting element D1 on the transferred surface 231 of the transferred substrate 230 for transferring the first light emitting element D1 is larger than the first area 140 of the holding substrate 130, for example, the Even when the first light emitting elements D1 are transferred by the one holding substrate 130A and the second holding substrate 130B, the plurality of first light emitting elements D1 transferred by the first holding substrate 130A are held. When the second holding substrate 130B, while holding the plurality of first light emitting elements D1, is pressed against the transferred substrate 230 to the second transferred area 244 adjacent to the area 242, the plurality of first light emitting elements D1 are transferred. , the contact between the protrusion 220 and the holding substrate 130 can be avoided.

The display device manufacturing method transfers the plurality of first light emitting elements D1 from the first holding substrate 130A to the first transferred region 242 of the transferred substrate 230, and then transfers the plurality of first light emitting elements D1 to the first surface. a step of aligning the position of the second holding substrate 130B held by 131 with a predetermined position of the second transfer region 244 of the substrate 230 to be transferred; and pressing the first light emitting element D1 against the surface 231 to be transferred of the substrate 230 to be transferred. The first holding substrate 130A and the second holding substrate 130B have a plurality of first sections 142 each having a first surface 131 when viewed from one direction, and a plurality of first sections 142 each having a second surface 150 when viewed from one direction. Each of the first regions 140 includes two compartments 144 . The first holding substrate 130A and the second holding substrate 130B hold a plurality of first light-emitting elements D1 on the first surface 131 of the first section 142, and the second surface 150 extends from the first surface 131 to They are separated in the depth direction of the first surface 131 . The first holding substrate 130A and the second holding substrate 130B have a second area (third section 146) outside the first area 140, the surface of which is a third surface 148 when viewed in one direction. The two regions are separated from the first surface 131 in the depth direction from the first surface 131 . The transferred substrate 230 includes a first transferred region 242 and a second transferred region 244 adjacent to the first transferred region 242 on the transferred surface 231 . The transferred substrate 230 has a transferred area 240 wider than the first area 140 of the holding substrate 130 .

As a result, the first holding substrate 130A and the second holding substrate 130B respectively have a first section 142 which is the first surface 131 when viewed from one direction, and a second surface 150 which is the second surface 150 when viewed from one direction. and a second region outside the first region 140, the surface of which is a third surface 148 when viewed in one direction, and the third surface 148 is Since it is separated from the first surface 131 in the depth direction of the first surface 131, the second transferred area 244 is adjacent to the first transferred area 242 to which the first light emitting device D1 is transferred from the first holding substrate 130A. In addition, when the second holding substrate 130B is pressed while holding the first light emitting element D1 on the first surface 131 and transferred, the first light emitting element D1 in the first transferred region 242 and the second holding substrate 130B can avoid contact with

The position of the transferred surface 231 of the transferred substrate 230 with which the second holding substrate 130B is aligned is the position of the first light emission closest to the first transferred region 242 held by the first surface 131 of the second holding substrate 130B. The distance between the element D1 and the first light emitting element D1 closest to the second transferred area 244 held in the first transferred area 242 is the plurality of first light emitting elements D1 held on the first holding substrate 130A. It is the position that becomes the same as the interval between them.

As a result, even when the transfer region 240 of the transfer substrate 230 is wider than the first region 140 of the holding substrate 130 , the holding substrate 130 can be transferred from the first region 140 of the first surface 131 to the manufacturing method of the display device 10 . Since the outer third section 146 has the third surface 148 separated from the first surface 131 in the predetermined depth direction, the surface 231 to be transferred of the substrate 230 to be transferred has already been moved by the first holding substrate 130A. The first light emitting device D1 held closest to the second transferred region 244 side of the first transferred region 242 is placed in the second transferred region 244 adjacent to the first transferred region 242 holding the first light emitting device D1. and the first light emitting element D1 held closest to the first transferred area 242 in the second transferred area 244 is the predetermined interval between the first light emitting elements D1 held on the holding substrate 130. Then, it becomes possible to press against the substrate to be transferred 230 .

According to the present embodiment, conventionally, when the second holding substrate 130B presses the plurality of first light emitting elements D1 against the second transfer region 244 of the transfer substrate 230 to transfer them, the third section 146 is greater than the predetermined spacing p of the first light emitting elements D1, the first light emitting elements D1 of the first transferred region 242 and the third section 146 may interfere. However, since the second holding substrate 130B according to the present embodiment has the third surface 148 separated from the first surface 131 by a predetermined depth in the third section 146, the first light emission of the first transferred region 242 Element D1 can be avoided. This makes it possible to set the position of the first light emitting element D1 transferred by the second holding substrate 130B regardless of the width of the third section 146. FIG. The positions of the first light emitting element D1 held in the first transferred area 242 and the positions of the first light emitting element D1 held in the second transferred area 244 are changed, for example, by a plurality of second transfer areas held in the first transferred area 242. It is possible to transfer one light emitting element D1 to a position with a predetermined interval p.

Although preferred embodiments have been described above, the present disclosure is not limited to such embodiments. The content disclosed in the embodiment is merely an example, and various modifications are possible without departing from the gist of the present disclosure. Appropriate changes that do not deviate from the spirit of the present disclosure also naturally belong to the technical scope of the present disclosure.

REFERENCE SIGNS LIST 10 display device 100, 130, 130A, 130B holding substrate 101, 131 first surface 102, 132 edge 103, 133 first alignment mark 110, 140 first region 112, 142 first section 114, 144 second section 120, 150 Second surface 146 Second region, third section 148 Third surface 200, 230 Transferred substrate 201, 231 Transferred surface 202, 232 Edge 203, 233 Second alignment mark 210, 240 Transferred region 220 Projection 222 Reflective wall 242 First transferred area 244 Second transferred area A1, A2 Opening D1 First light emitting element D2 Second light emitting element D3 Third light emitting element DP1 Depth of second surface DP2 Depth of third surface E Pixel hD1 First Light-emitting element height hD2 Light-emitting element height hR Reflection wall height L1 Heating laser light L2 Ablation laser light M1, M2 Light-shielding mask p Spacing for holding a plurality of first light-emitting elements w Width of third section δ1 First Difference between the position of the tip of the light emitting element and the position of the tip of the second light emitting element δ2 Difference between the position of the tip of the first light emitting element and the position of the tip of the protrusion

Claims (9)

When viewed from one direction, it is divided into a plurality of first sections having a first surface and a second section having a second surface,
the first section is a region in which a plurality of first light emitting elements are held on the first surface;
The second surface is a holding substrate separated from the first surface in the depth direction of the first surface. The plurality of first light emitting elements are pressed against a transferred substrate having a surface for arranging a plurality of protrusions while being held on the first surface of the first section,
2. The holding substrate according to claim 1, wherein said second section is provided at a position corresponding to the position of said protrusion. The depth of the second surface from the first surface is greater than the difference between the position of the tip of the protrusion and the position of the tip of the first light emitting element in a direction orthogonal to the first surface. 3. The holding substrate according to claim 2. The substrate to be transferred has a plurality of protrusions with different tip positions,
In a state in which the first light emitting element is pressed against the substrate to be transferred, tips of some of the plurality of protrusions are located deeper on the second surface side than the first surface. 4. A holding substrate according to claim 2 or 3. a first region including the first section and the second section;
and a second region that is a region outside the first region,
The second region has a third surface when viewed from the one direction,
The holding substrate according to any one of claims 2 to 4, wherein the third surface is separated from the first surface in the depth direction of the first surface. 6. The holding substrate according to any one of claims 2 to 5, wherein the protrusion is at least one of a light emitting element and a reflecting wall. aligning the positions of the plurality of first light emitting elements held by the holding substrate with predetermined positions on the surface of the substrate to be transferred having the plurality of projections;
pressing the first light emitting element held by the holding substrate aligned with the substrate to be transferred against the substrate to be transferred;
The holding substrate is divided into a plurality of first sections having a first surface and second sections having a second surface when viewed from one direction,
The first section holds a plurality of first light emitting elements on the first surface,
The second surface is separated from the first surface in the depth direction of the first surface,
A method for manufacturing a display device. After transferring the plurality of first light emitting elements from the first holding substrate to the first transfer area of the substrate to be transferred, the positions of the plurality of first light emitting elements held by the second holding substrate are transferred to the substrate to be transferred. aligning with a predetermined position of the second transferred area of
pressing the plurality of first light emitting elements held by the aligned second holding substrate against the transferred surface of the transferred substrate;
Each of the first holding substrate and the second holding substrate includes a first region including a plurality of first sections having first surfaces and second sections having second surfaces when viewed from one direction. , the first surface of the first section holds a plurality of the first light emitting elements, the second surface is separated from the first surface in the depth direction of the first surface, and the Outside the first area, a second area that is a third surface when viewed from the one direction, the third surface being separated from the first surface in the depth direction of the first surface,
The substrate to be transferred has, on the surface to be transferred, a region to be transferred including a first region to be transferred and a second region to be transferred adjacent to the first region to be transferred,
The area to be transferred is wider than the first area of the first holding substrate or the second holding substrate,
A method for manufacturing a display device. The position of the second transfer region of the transfer substrate to which the second holding substrate is aligned is
The first light emitting element closest to the first transferred region side held on the first surface of the second holding substrate, and the first light emitting element closest to the second transferred region side held on the first transferred region The distance from one light emitting element is the same as the distance between the plurality of first light emitting elements held by the first holding substrate.
A method of manufacturing a display device according to claim 8 .

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