TWI808165B - A fixture assembly for testing edge-emitting laser diodes and a testing apparatus having the same - Google Patents
A fixture assembly for testing edge-emitting laser diodes and a testing apparatus having the same Download PDFInfo
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- TWI808165B TWI808165B TW108114648A TW108114648A TWI808165B TW I808165 B TWI808165 B TW I808165B TW 108114648 A TW108114648 A TW 108114648A TW 108114648 A TW108114648 A TW 108114648A TW I808165 B TWI808165 B TW I808165B
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本發明係關於一種用於測試邊射型雷射二極體之治具組件及具備該組件之測試設備,尤指一種適用於固定測試邊射型雷射二極體之治具組件,以及執行該二極體之光學測試和電性測試的測試設備。 The present invention relates to a fixture assembly for testing edge-emitting laser diodes and testing equipment with the assembly, especially a fixture assembly suitable for fixing and testing edge-emitting laser diodes, and testing equipment for performing optical and electrical tests on the diodes.
邊射型雷射二極體(side/edge-emitting laser diode)因為具備直線傳播、微小光點(數um~)、單色性、高光密度、可干涉性(coherent)等特性,所以可以運用在相當多的領域中,包括感測、通訊、照明、感光、以及資料儲存等領域。進一步說明,例如CD、DVD、Blu-ray光碟之讀取和記錄、雷射印表機和多功能事務機(Multi Function Peripheral,MFP)之感光/印刷、光纖通訊、雷射顯微鏡和雷射標線器等之照明、以及距離感測、煙霧感測等。 The side/edge-emitting laser diode (side/edge-emitting laser diode) can be used in quite a few fields, including sensing, communication, lighting, photosensitive, and data storage, because of its linear propagation, tiny light spot (several um~), monochromaticity, high optical density, and coherent properties. Further explanation, such as reading and recording of CD, DVD, Blu-ray disc, photosensitive/printing of laser printer and Multi Function Peripheral (MFP), optical fiber communication, illumination of laser microscope and laser liner, distance sensing, smoke sensing, etc.
再者,無論是便攜式消費電子產品還是工業應用產品,都朝向縮小電子設備體積的趨勢發展,而這也直接限制了半導體晶片及雷射二極體等電子元件的尺 寸。然而,隨著元件尺寸的縮小,在測試時可用於臨時接觸的接點也變小。其中,接點佔據待測試元件表面部分的面積,導致僅剩下部分的表面區域可作為熱接觸面。此外,細間距(Fine pitch)彈簧探針無法提供足夠的的力量去達成良好的熱接觸。 Furthermore, whether it is portable consumer electronics or industrial application products, there is a trend towards reducing the size of electronic equipment, which directly limits the size of electronic components such as semiconductor chips and laser diodes. inch. However, as the size of components shrinks, the number of contacts available for temporary contact during testing also becomes smaller. Wherein, the contact occupies part of the surface area of the component to be tested, resulting in only a part of the surface area remaining as a thermal contact surface. In addition, fine pitch (Fine pitch) spring probes cannot provide enough force to achieve good thermal contact.
綜觀現有技術的技術水平,如中國實用新型專利公告第CN201974446U號、以及中國發明專利公開第CN106996990A號,都無法完全解決前述問題,仍有改善空間。進一步說明,以中國第CN201974446U號「雷射二極體晶片功率測試夾具(Test fixture for power of laser diode chip)」實用新型專利為例,其僅僅揭露在治具體上設有載體槽、及晶片槽,然後直接以光探測器直接逐一地對載體槽和晶片槽內的待測元件進行測試。因此,並沒有夾持待測元件的手段,無法對待測元件進行精準定位,且也無法確保待測元件與彈簧探針間的完整電性接觸。 Looking at the technical level of the existing technology, such as the Chinese Utility Model Patent Announcement No. CN201974446U and the Chinese Invention Patent Publication No. CN106996990A, both cannot completely solve the aforementioned problems, and there is still room for improvement. To further explain, take the utility model patent No. CN201974446U "Test fixture for power of laser diode chip" as an example, which only discloses that a carrier groove and a chip groove are provided on the fixture body, and then directly use a photodetector to directly test the components under test in the carrier groove and the chip groove one by one. Therefore, there is no means for clamping the DUT, the precise positioning of the DUT cannot be performed, and the complete electrical contact between the DUT and the spring probe cannot be ensured.
另外,以中國第CN106996990A號「同時測試多個多針雷射器件的測試夾具(Test fixture for simultaneously testing multiple multi-pin laser devices)」專利公開文件為例,雖然揭露有夾持待測元件之手段,不過機構過於複雜,還必須透過手動轉動手柄來進行夾持,更何況也沒有揭露可提供預燒測試(burn-in test)之功能。 In addition, take the Chinese patent publication No. CN106996990A "Test fixture for simultaneously testing multiple multi-pin laser devices" as an example. Although it discloses a means of clamping the device to be tested, the mechanism is too complicated and must be clamped by manually turning the handle, not to mention that it does not disclose the function of providing a burn-in test. .
本發明之主要目的係在提供一種用於測試邊射型雷射二極體之治具組件及具備該組件之測試設備,俾能穩固地夾持雷射二極體,並對其精準定位,而使檢測設備能夠接收到每一雷射二極體所發射的光束,且能確保雷射二極體所有接點(pads)能完整電性接觸彈簧探針(spring pins)。 The main purpose of the present invention is to provide a fixture assembly for testing edge-emitting laser diodes and testing equipment with the assembly, so that the laser diodes can be firmly clamped and positioned precisely, so that the testing equipment can receive the light beams emitted by each laser diode, and can ensure that all the pads of the laser diodes can completely electrically contact the spring pins.
本發明之另一目的係在提供一種用於測試邊射型雷射二極體之治具組件,俾能與連接到測試來源之適配的連接器耦接,而且治具本身可以在不同的設備間流通、處理,從而治具可提供重複處理,而非直接對待測元件。此外,因為尚未封裝的雷射二極體本身相當脆弱、容易損壞,將它們置放於治具內可以減少精密晶粒和接點與外部裝置接觸的機會。據此,雷射二極體是受到良好的保護,因為它們在其他的製程或測試中是被保存在治具中。 Another object of the present invention is to provide a fixture assembly for testing edge-emitting laser diodes, so that it can be coupled with a suitable connector connected to a test source, and the fixture itself can be circulated and processed between different devices, so that the fixture can provide repeated processing instead of directly testing the component. In addition, because unpackaged laser diodes are quite fragile and easily damaged, placing them in the jig can reduce the chance of precision dies and contacts coming into contact with external devices. Accordingly, the laser diodes are well protected since they are kept in the jig during other processes or tests.
為達成上述目的,本發明一種用於測試邊射型雷射二極體之治具組件主要包括一基座、一上蓋、以及一閉鎖機構;基座包括至少一容置槽、及至少一透射腔,而透射腔與容置槽係呈正交並彼此連通;上蓋包括一本體、一壓抵塊、及一施壓元件,而施壓元件組設於本體,壓抵塊耦接於本體並可相對於本體滑移,且壓抵塊設有一電性接觸介面;另,閉鎖機構係設置於基座、及上蓋中至少一者,係可選擇地使基座和上蓋彼此接合或脫離。其中,閉鎖機構使基座和上蓋彼此接合時,施 壓元件透過壓抵塊而施力於容置於容置槽內之邊射型雷射二極體。 In order to achieve the above object, a jig assembly for testing the edge-emitting laser diode of the present invention mainly includes a base, an upper cover, and a locking mechanism; the base includes at least one accommodating groove and at least one transmission cavity, and the transmission cavity and the accommodating groove are orthogonal and communicate with each other; the upper cover includes a body, a pressing block, and a pressing element, and the pressing element is set on the body, the pressing block is coupled to the body and can slide relative to the body, and the pressing block is provided with an electrical contact interface; In addition, the locking mechanism is arranged on at least one of the base and the upper cover, and can selectively engage or disengage the base and the upper cover. Wherein, when the locking mechanism engages the base and the upper cover with each other, the The pressing element exerts force on the edge-firing laser diode accommodated in the accommodating groove through the pressing block.
據此,當閉鎖機構使基座和上蓋緊固接合時,透過施壓元件而施力於壓抵塊,使壓抵塊與容置槽共同夾持待測試之雷射二極體,同時對該雷射二極體進行定位。此外,進行檢測時,邊射型雷射二極體所發出的雷射得以透過透射腔(Cavity)射出。 According to this, when the locking mechanism fastens the base and the upper cover, it exerts force on the pressing block through the pressing element, so that the pressing block and the accommodating groove jointly clamp the laser diode to be tested, and at the same time position the laser diode. In addition, when performing detection, the laser emitted by the edge-firing laser diode can be emitted through the transmission cavity (Cavity).
為達成前述目的,本發明一種用於測試邊射型雷射二極體之治具組件,該邊射型雷射二極體包括一發光面、及一接點面,發光面上包括一發光區域,其主要包括一基座、一上蓋、以及一閉鎖機構;基座包括至少一容置槽、及至少一透射腔,而透射腔與容置槽係呈正交並彼此連通,且容置槽係用於容設邊射型雷射二極體;上蓋包括一本體、一壓抵塊、及一施壓元件,而本體包括一貫通槽,壓抵塊滑設於本體之該貫通槽,且施壓元件設置於本體與壓抵塊之間,壓抵塊設有一電性接觸介面;閉鎖機構係設置於基座、及上蓋中至少一者,係可選擇地使基座和上蓋彼此接合或脫離;其中,閉鎖機構使基座和上蓋彼此接合時,施壓元件透過壓抵塊而施力於邊射型雷射二極體之接點面,而邊射型雷射二極體之接點面接觸該至少一電性接觸介面,且基座之透射腔露出至少局部之邊射型雷射二極體之發光區域。 In order to achieve the aforementioned object, the present invention is a fixture assembly for testing an edge-emitting laser diode. The edge-emitting laser diode includes a light-emitting surface and a contact surface. The light-emitting surface includes a light-emitting area, which mainly includes a base, an upper cover, and a locking mechanism; the base includes at least one accommodating groove and at least one transmission cavity, and the transmission cavity and the accommodating groove are orthogonal and communicate with each other, and the accommodating groove is used for accommodating the edge-emitting laser diode; the upper cover includes a body, a The pressing block and a pressing element, and the body includes a through groove, the pressing block is slidably arranged in the through groove of the main body, and the pressing element is arranged between the main body and the pressing block, and the pressing block is provided with an electrical contact interface; the locking mechanism is arranged on at least one of the base and the upper cover, which can selectively engage or disengage the base and the upper cover; wherein, when the locking mechanism makes the base and the upper cover engage with each other, the pressing element exerts force on the contact surface of the edge-emitting laser diode through the pressing block, The contact surface of the edge-emitting laser diode is in contact with the at least one electrical contact interface, and the transmission cavity of the base exposes at least part of the light-emitting area of the edge-emitting laser diode.
為達成前述目的,本發明一種檢測設備,主要包括:一電源模組、如前述之治具組件、一來源量測模組、以及一主控制器;其中,來源量測模組啟動邊射 型雷射二極體,而主控制器控制對邊射型雷射二極體執行一光學測試和一電性測試。 In order to achieve the above-mentioned purpose, a detection device of the present invention mainly includes: a power supply module, the aforementioned fixture assembly, a source measurement module, and a main controller; wherein, the source measurement module starts the side shot type laser diode, and the main controller controls to perform an optical test and an electrical test on the edge-fire type laser diode.
2:基座 2: Base
21:容置槽 21: storage tank
22:透射腔 22: Transmission cavity
3:上蓋 3: Top cover
31:本體 31: Ontology
311:貫通槽 311: through groove
312:卡止部 312: locking part
32:壓抵塊 32: Press block
321:擋止塊 321: stop block
322:電性接觸介面 322: electrical contact interface
323:探針 323: Probe
33:施壓元件 33: Pressure component
34:按鈕 34: button
4:閉鎖機構 4: Locking mechanism
41:閉鎖桿 41:Locking lever
411:凹槽 411: Groove
42:插槽 42: slot
421:容槽 421: storage tank
43:閉鎖件 43: Locking piece
431:彈簧 431: spring
432:卡固塊 432: Clamp block
5:溫度調控單元 5: Temperature control unit
51:加熱台 51: heating table
C:主控制器 C: main controller
IS:積分球 I S : Integrating sphere
Ld:邊射型雷射二極體 Ld: edge-firing laser diode
Ld1:發光面 Ld1: light emitting surface
Ld2:接點面 Ld2: contact surface
Ldz:發光區域 Ldz: Luminous area
M:來源量測模組 M: source measurement module
P:電源模組 P: power module
PD:光感測器 P D : Light sensor
S:測試器 S: tester
T:治具組件 T: fixture component
圖1係邊射型雷射二極體之示意立體圖。 FIG. 1 is a schematic perspective view of an edge-firing laser diode.
圖2係本發明之治具組件一較佳實施例之立體圖。 Fig. 2 is a perspective view of a preferred embodiment of the jig assembly of the present invention.
圖3係本發明之治具組件中的上蓋和基座分離時之立體圖。 Fig. 3 is a perspective view when the upper cover and the base of the jig assembly of the present invention are separated.
圖4係本發明之治具組件中的上蓋和基座分離時之局部剖視圖。 Fig. 4 is a partial sectional view when the upper cover and the base of the jig assembly of the present invention are separated.
圖5係本發明之治具組件中的上蓋和基座接合過程中之局部剖視圖。 Fig. 5 is a partial cross-sectional view of the upper cover and the base in the jig assembly of the present invention during the joint process.
圖6係本發明之治具組件中的上蓋和基座完成接合時之局部剖視圖。 Fig. 6 is a partial cross-sectional view of the upper cover and the base in the jig assembly of the present invention when the joint is completed.
圖7係本發明之檢測設備一較佳實施例之系統架構圖。 Fig. 7 is a system architecture diagram of a preferred embodiment of the detection equipment of the present invention.
本發明用於測試邊射型雷射二極體之治具組件及具備該組件之測試設備在本實施例中被詳細描述之前,要特別注意的是,以下的說明中,類似的元件將以相同的元件符號來表示。再者,本發明之圖式僅作為示意說明,其未必按比例繪製,且所有細節也未必全部呈現於圖式中。 Before the fixture assembly for testing edge-firing laser diodes of the present invention and the testing equipment equipped with the assembly are described in detail in this embodiment, it should be noted that in the following description, similar components will be represented by the same component symbols. Furthermore, the drawings of the present invention are for illustrative purposes only, and may not be drawn to scale, and not all details may be presented in the drawings.
請先參閱圖1,其係邊射型雷射二極體Ld之示意立體圖。一般而言,邊射型雷射二極體Ld包括一發 光面Ld1、及一接點面Ld2,其中發光面Ld1上包括一發光區域Ldz,即雷射由該發光區域Ldz發射。另外,接點面Ld2上則佈設有多個電性接點(圖中未示),其作為二極體晶片與電路板間電性導通之媒介。 Please refer to FIG. 1 first, which is a schematic perspective view of an edge-emitting laser diode Ld. Generally speaking, the edge-firing laser diode Ld includes a The light-emitting surface Ld1 and a contact surface Ld2, wherein the light-emitting surface Ld1 includes a light-emitting area Ldz, that is, the laser is emitted from the light-emitting area Ldz. In addition, a plurality of electrical contacts (not shown in the figure) are arranged on the contact surface Ld2, which serve as a medium for electrical conduction between the diode chip and the circuit board.
請再參閱圖2、及圖3,圖2係本發明之治具組件一較佳實施例之立體圖,圖3係本發明之治具組件中的上蓋和基座分離時之立體圖。如圖中所示,本實施例所提供之治具組件主要包括一基座2、一上蓋3、以及一閉鎖機構4,而基座2上設置有多個容置槽21,其係用於容設待測之邊射型雷射二極體Ld,即每一容置槽21可容納一如圖1所示之邊射型雷射二極體Ld。
Please refer to Fig. 2 and Fig. 3 again. Fig. 2 is a perspective view of a preferred embodiment of the jig assembly of the present invention, and Fig. 3 is a perspective view of the separation of the upper cover and the base of the jig assembly of the present invention. As shown in the figure, the jig assembly provided by this embodiment mainly includes a
請再一併參閱圖4,圖4係本發明之治具組件中的上蓋和基座分離時之局部剖視圖。如圖中所示,基座2又設置有多個透射腔22,其分別與多個容置槽21係呈正交並彼此連通。在本實施例中,容置槽21係縱向設置,而透射腔22則係橫向設置。此外,每一容置槽21的底部又設置有一溫度調控單元5,其係用於對該邊射型雷射二極體Ld升溫或降溫。
Please refer to FIG. 4 again. FIG. 4 is a partial cross-sectional view when the upper cover and the base of the jig assembly of the present invention are separated. As shown in the figure, the
其中,因本實施例之治具組件係供一預燒測試(Burn-in test)用,故溫度調控單元5採用一加熱台51,其係透過基座2加熱,而基座2又與一具有加熱或冷卻之夾具(chuck)連接(圖中未示)。換言之,在本實施例中,加熱台51和基座2皆為溫度的移轉平台(temperature transfer platform)。不過,本發明不以此為限,其他加熱或冷卻模組均可適用於本發明。
Wherein, because the jig assembly of this embodiment is used for a burn-in test (Burn-in test), the temperature control unit 5 adopts a heating platform 51, which is heated through the
另外,本實施例之上蓋3包括一本體31、多個壓抵塊32、及多個施壓元件33,施壓元件33組設於本體31內,而壓抵塊32耦接於本體31並可相對於本體31滑移。又,每一壓抵塊32設有一電性接觸介面322,在本實施例中電性接觸介面322包括多個探針323,其自壓抵塊32之下端面凸伸,並用於電性接觸邊射型雷射二極體Ld之接點面Ld2。
In addition, the
進一步說明,本體31上開設多個貫通槽311,而多個壓抵塊32分別滑設於該多個貫通槽311內,且壓抵塊32徑向向外凸出設置有一擋止塊321,貫通槽311徑向向內凸出設置有一卡止部312。本實施例之施壓元件33為一壓縮彈簧,其設置於貫通槽311內並介於卡止部312與擋止塊321之間,而該壓縮彈簧除了提供壓抵塊32滑移時的復位功能外,當該壓縮彈簧受到壓抵塊32的擠壓而壓縮時,其撐張彈力將可作為壓抵塊32之下壓力。
To further illustrate, the
再者,每一閉鎖機構4包括一對閉鎖桿41、一對插槽42、及一對閉鎖件43,該對閉鎖桿41係自基座2之上表面向上凸伸並分設於容置槽21之二側,每一閉鎖桿41之上緣包括一呈環形之凹槽411;該對插槽42係設置於該上蓋3並分設於貫通槽311之二側,且每一插槽42內又設有一容槽421,該插槽42和該容槽421成正交配置且相互連通。
Furthermore, each
又,該對閉鎖件43分別組設於該對插槽42內,每一閉鎖件43包括一彈簧431、及一卡固塊432,
而卡固塊432、及彈簧431容設於容槽421內,且彈簧431施予一偏壓予卡固塊432。換言之,彈簧431可驅動卡固塊432使其滑移於容槽421與凹槽411之間。
Moreover, the pair of locking
以下說明基座2和上蓋3之接合過程,請一併參閱圖4、圖5、及圖6,圖4係本發明之治具組件中的上蓋3和基座2分離時之局部剖視圖,圖5係本發明之治具組件中的上蓋3和基座2接合過程中之局部剖視圖,圖6係本發明之治具組件中的上蓋3和基座2完成接合時之局部剖視圖。
The joining process of the
當欲接合基座2和上蓋3時,隨著上蓋3逐漸下降並接近基座2,而上蓋3之插槽42套入閉鎖桿41,直到閉鎖桿41上的凹槽411對應到上蓋3的容槽421。此時,彈簧431驅使卡固塊432滑出容槽421,並卡固於容槽421與凹槽411之間,而閉鎖件43緊固閉鎖桿41,進而使基座2和上蓋3無法脫離,如此便完成閉鎖動作。
When the
然而,請見圖5,在上蓋3之插槽42套入閉鎖桿41,而當壓抵塊32下端面之探針323抵住邊射型雷射二極體Ld之接點面Ld2後,又隨著上蓋3逐漸下降,而施壓元件33逐漸受到擠壓而產生一下壓力並透過壓抵塊32而施加於邊射型雷射二極體Ld。需要特別說明是,此一下壓力雖然是針對個別待測物的離散之力,但最終在組件內的每一個待測物將都受到一順應力,而獲得均勻且完整的電性接觸和熱傳導接觸。
However, see FIG. 5 , the locking
換言之,透過施壓元件33施加下壓力於壓抵塊32,可確保電性接觸介面322完整接觸邊射型雷射二極體Ld之接點面Ld2,且壓抵塊32可協同容置槽21進而緊固夾持邊射型雷射二極體Ld。同時,發光面Ld1之發光區域Ldz可對準基座2之透射腔22,即透射腔22完整露出該發光區域Ldz。然而,開始測試時,邊射型雷射二極體Ld所發射之雷射光即可透過透射腔22射出,即如圖6所示。需要特別說明的是,對於測試而言,最大的光射出量是相當重要的,所以透射腔22之接口或開口角度必須考慮到發光面Ld1之發光區域Ldz的最大射出角(maximum divergence angles),以免阻擋了雷射光的射出。
In other words, applying a downward force to the
另一方面,請再度參閱圖2、圖3及圖4,本實施例之每一閉鎖機構4又包括一按鈕34,其係設置於上蓋3,且每一按鈕34連接至一卡固塊432。故當測試完畢時,只需按壓上蓋3之按鈕34,即可推動卡固塊432,使其退出閉鎖桿41之凹槽411,以解除上蓋3與基座2間的閉鎖,接著上蓋3便可輕易脫離基座2。
On the other hand, please refer to FIG. 2 , FIG. 3 and FIG. 4 again, each
請再參閱圖7,圖7係本發明之檢測設備一較佳實施例之系統架構圖。本實施例之檢測設備主要包括電源模組P、如前記實施例所述之測試邊射型雷射二極體之治具組件T、來源量測模組M、測試器S、以及主控制器C,而電源模組P、測試器S、及來源量測模組M係電性連接主控制器C,且測試器S係對應於基座2之透射腔22。
Please refer to FIG. 7 again. FIG. 7 is a system architecture diagram of a preferred embodiment of the detection device of the present invention. The detection equipment in this embodiment mainly includes a power module P, a fixture assembly T for testing edge-emitting laser diodes as described in the previous embodiment, a source measurement module M, a tester S, and a main controller C. The power module P, tester S, and source measurement module M are electrically connected to the main controller C, and the tester S corresponds to the
其中,當閉鎖機構4使基座2和上蓋3彼此接合時,即邊射型雷射二極體Ld之接點面Ld2上的電性接點電性接觸探針323後,來源量測模組M可供電並啟動邊射型雷射二極體Ld,此時來源量測模組M亦隨即量測電壓等電性參數,即進行一電性測試;而邊射型雷射二極體Ld之發光區域Ldz將發射雷射,並透過透射腔22自基座2射出雷射。然而,主控制器C便控制一測試器S測量自透射腔22所射出之雷射,進而檢測邊射型雷射二極體Ld之發光特性,其中測試器S是用於透過一積分球IS、及一光感測器PD監測或檢測光通量和光波長。
Wherein, when the
綜上,本發明至少具備以下特色及優勢: In summary, the present invention at least has the following features and advantages:
1.透過施壓元件33而施力於壓抵塊32,使壓抵塊32與容置槽21共同夾持待測試之雷射二極體Ld,除了可對該雷射二極體Ld進行定位外,同時可確保雷射二極體Ld與探針323完整電性接觸。而且,該施力可增加雷射二極體和基座間的熱傳導介面。
1. Apply force to the
2.施壓元件33提供了適當的壓力及緩衝力,使壓抵塊32不致於過度重壓雷射二極體Ld,進而導致雷射二極體Ld破裂毀損。
2. The
3.透射腔22完整暴露雷射二極體Ld上之發光面Ld1,使雷射二極體Ld所發射之雷射可不受阻礙地從治具組件T射出,以供量測。
3. The
4.可以透過溫度調控單元5直接接觸或透過其他流體接觸待測試之雷射二極體Ld,並對雷射二極體Ld升溫或降溫,故可提供高溫或低溫之測試環境。 4. It can directly contact the laser diode Ld to be tested through the temperature control unit 5 or through other fluids, and heat up or cool down the temperature of the laser diode Ld, so it can provide a high temperature or low temperature test environment.
5.操作相當容易,只要將上蓋3上的插槽42對準基座2上的閉鎖桿41,而將上蓋3與基座2直接壓合,即可完成閉鎖;完成測試時,只要按壓上蓋3上的按鈕34,即可使上蓋3脫離基座2。
5. The operation is quite easy, as long as the
6.存放於治具組件內的雷射二極體,將受到相當良好的保護,可以減少精密晶粒與外部裝置接觸的機會,進而避免受外力毀損。 6. The laser diode stored in the jig assembly will be well protected, which can reduce the chance of precision crystal grains contacting external devices, thereby avoiding damage by external forces.
7.治具組件可以在不同製程或設備間流動、處理,例如進行不同檢測項目時,雷射二極體無需移出治具,且治具組件可重複使用。 7. The fixture components can flow and be processed between different processes or equipment. For example, when performing different inspection items, the laser diode does not need to be removed from the fixture, and the fixture components can be reused.
上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments.
2‧‧‧基座 2‧‧‧base
22‧‧‧透射腔 22‧‧‧Transmission cavity
3‧‧‧上蓋 3‧‧‧Top cover
34‧‧‧按鈕 34‧‧‧button
Claims (10)
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CN101084447A (en) * | 2004-12-15 | 2007-12-05 | 雅赫测试系统公司 | System for testing and burning in of integrated circuits |
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TW201337281A (en) * | 2012-03-06 | 2013-09-16 | Hon Hai Prec Ind Co Ltd | Laser diode (LD) testing device, testing method, and manufacturing method |
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CN101084447A (en) * | 2004-12-15 | 2007-12-05 | 雅赫测试系统公司 | System for testing and burning in of integrated circuits |
US20130058367A1 (en) * | 2011-08-29 | 2013-03-07 | Intellectual Light, Inc. | Mount for Semiconductor Devices Using Conformable Conductive Layers, and Method |
TW201337281A (en) * | 2012-03-06 | 2013-09-16 | Hon Hai Prec Ind Co Ltd | Laser diode (LD) testing device, testing method, and manufacturing method |
TW201913863A (en) * | 2017-08-31 | 2019-04-01 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
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