TWI808164B - A fixture assembly for testing surface emitting laser diodes and testing apparatus having the same - Google Patents
A fixture assembly for testing surface emitting laser diodes and testing apparatus having the same Download PDFInfo
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- TWI808164B TWI808164B TW108114647A TW108114647A TWI808164B TW I808164 B TWI808164 B TW I808164B TW 108114647 A TW108114647 A TW 108114647A TW 108114647 A TW108114647 A TW 108114647A TW I808164 B TWI808164 B TW I808164B
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Abstract
Description
本發明係關於一種用於測試面射型雷射二極體之治具組件及具備該組件之測試設備,尤指一種適用於固定測試面射型雷射二極體之治具組件,以及執行該二極體之光學測試和電性測試的測試設備。 The present invention relates to a fixture assembly for testing surface-emitting laser diodes and testing equipment with the assembly, especially a fixture assembly suitable for fixing and testing surface-emitting laser diodes, and testing equipment for performing optical tests and electrical tests on the diodes.
常見的面射型雷射二極體,例如垂直共振腔面射型雷射(Vertical-Cavity Surface-Emitting Laser,簡稱VCSEL),其應用層面不斷地擴張,需求也日益強勁。目前VCSEL面射型雷射市場應用已涵蓋距離感測、自動對焦、3D感測、虹膜辨識、以及空氣與水質檢測。其中,3D感測又包括了手勢辨識(Gesture Recognition)、及人臉辨識(Face Recognition)等。 Common surface-emitting laser diodes, such as Vertical-Cavity Surface-Emitting Laser (VCSEL for short), are constantly expanding in application and demand. At present, VCSEL surface-emitting laser market applications have covered distance sensing, auto focus, 3D sensing, iris recognition, and air and water quality detection. Among them, 3D sensing includes gesture recognition (Gesture Recognition), and face recognition (Face Recognition), etc.
再者,無論是便攜式消費電子產品還是工業應用產品,都朝向縮小電子設備體積的趨勢發展,而這也直接限制了半導體晶片及雷射二極體等電子元件的尺寸。然而,隨著元件尺寸的縮小,在測試時可用於臨時接觸的接點也變小。其中,接點佔據待測試元件表面部 分的面積,導致僅剩下小部分的表面區域可供作為熱接觸面。此外,細間距(Fine pitch)彈簧探針無法提供足夠的的力量去達成良好的熱接觸。 Furthermore, whether it is a portable consumer electronic product or an industrial application product, the trend of reducing the volume of electronic equipment is developing, and this directly limits the size of electronic components such as semiconductor chips and laser diodes. However, as the size of components shrinks, the number of contacts available for temporary contact during testing also becomes smaller. Wherein, the contact occupies the surface portion of the component under test The divided area results in only a small portion of the surface area remaining available as a thermal contact surface. In addition, fine pitch (Fine pitch) spring probes cannot provide enough force to achieve good thermal contact.
綜觀現有技術的技術水平,如中國實用新型專利公告第CN201974446U號、以及中國發明專利公開第CN106996990A號,都無法完全解決前述問題,仍有改善空間。進一步說明,以中國第CN201974446U號「雷射二極體晶片功率測試夾具(Test fixture for power of laser diode chip)」實用新型專利為例,其僅僅揭露在治具體上設有載體槽、及晶片槽,然後以光探測器直接逐一地對載體槽和晶片槽內的待測元件進行測試。因此,並沒有夾持待測元件的手段,無法對待測元件進行精準定位,且也無法確保待測元件與彈簧探針間的完整電性接觸。 Looking at the technical level of the existing technology, such as the Chinese Utility Model Patent Announcement No. CN201974446U and the Chinese Invention Patent Publication No. CN106996990A, both cannot completely solve the aforementioned problems, and there is still room for improvement. To further illustrate, take the utility model patent No. CN201974446U "Test fixture for power of laser diode chip" as an example, which only discloses that a carrier slot and a chip slot are provided on the fixture body, and then a photodetector is used to directly test the components under test in the carrier slot and the wafer slot one by one. Therefore, there is no means for clamping the DUT, the precise positioning of the DUT cannot be performed, and the complete electrical contact between the DUT and the spring probe cannot be ensured.
另外,以中國第CN106996990A號「同時測試多個多針雷射器件的測試夾具(Test fixture for simultaneously testing multiple multi-pin laser devices)」專利公開文件為例,雖然揭露有夾持待測元件之手段,不過機構過於複雜,還必須透過手動轉動手柄來進行夾持,更何況也沒有揭露可提供預燒測試(burn-in test)之功能。 In addition, take the Chinese patent publication No. CN106996990A "Test fixture for simultaneously testing multiple multi-pin laser devices" as an example. Although it discloses a means of clamping the device to be tested, the mechanism is too complicated and must be clamped by manually turning the handle, not to mention that it does not disclose the function of providing a burn-in test. .
本發明之主要目的係在提供一種用於測試面射型雷射二極體之治具組件及具備該組件之測試設備,俾能穩固地夾持雷射二極體,並對其精準定位,而能夠 接收到每一雷射二極體所發射的光束,且能確保雷射二極體所有接點能完整電性接觸彈簧探針。 The main purpose of the present invention is to provide a fixture assembly for testing a surface-emitting laser diode and a testing device with the assembly, so that the laser diode can be firmly clamped and precisely positioned, and can be The light beam emitted by each laser diode is received, and it can be ensured that all the contacts of the laser diode can completely and electrically contact the spring probe.
本發明之另一目的係在提供一種用於測試面射型雷射二極體之治具組件,俾能與連接到測試來源之適配的連接器耦接,而且治具本身可以在不同的設備間流通、處理,從而治具可提供重複處理,而非直接對待測元件。此外,因為尚未封裝的雷射二極體本身相當脆弱、容易損壞,將它們置放於治具內可以減少精密晶粒和接點與外部裝置接觸的機會。據此,雷射二極體是受到良好的保護,因為它們在其他的製程或測試中是被保存在治具中。 Another object of the present invention is to provide a fixture assembly for testing a surface-emitting laser diode, so that it can be coupled with a suitable connector connected to a test source, and the fixture itself can be circulated and processed between different devices, so that the fixture can provide repeated processing instead of directly testing the component. In addition, because unpackaged laser diodes are quite fragile and easily damaged, placing them in the jig can reduce the chance of precision dies and contacts coming into contact with external devices. Accordingly, the laser diodes are well protected since they are kept in the jig during other processes or tests.
為達成上述目的,本發明一種用於測試面射型雷射二極體之治具組件,其主要包括一基座、一上蓋、以及一閉鎖機構;其中,基座包括至少一容置槽、及至少一電性接觸介面,而電性接觸介面係設置於容置槽內;另外,上蓋包括一本體、一壓抵塊、及一施壓元件,壓抵塊包括一貫穿孔,且壓抵塊耦接於本體並可相對於本體滑移,施壓元件則組設於本體。又,閉鎖機構係設置於基座、及上蓋中至少一者,係可選擇地使基座和上蓋彼此接合或脫離。其中,當閉鎖機構使基座和上蓋彼此接合時,容置槽與貫穿孔形成一貫穿腔體(Cavity)。 In order to achieve the above object, the present invention is a fixture assembly for testing a surface-emitting laser diode, which mainly includes a base, an upper cover, and a locking mechanism; wherein, the base includes at least one accommodating groove and at least one electrical contact interface, and the electrical contact interface is arranged in the accommodating groove; in addition, the upper cover includes a body, a pressing block, and a pressing element, the pressing block includes a through hole, and the pressing block is coupled to the body and can slide relative to the body, and the pressing element is assembled on the ontology. Moreover, the locking mechanism is provided on at least one of the base and the upper cover, and can selectively engage or disengage the base and the upper cover. Wherein, when the locking mechanism makes the base and the upper cover engage with each other, the accommodating groove and the through hole form a through cavity (Cavity).
據此,當閉鎖機構使基座和上蓋緊固接合時,透過施壓元件而施力於壓抵塊,使壓抵塊與容置槽共同夾持待測試之雷射二極體,同時對該雷射二極體進行定位。此外,進行檢測時,面射型雷射二極體所發出 的雷射得以透過容置槽與貫穿孔所形成之貫穿腔體(Cavity)射出。 According to this, when the locking mechanism fastens the base and the upper cover, it exerts force on the pressing block through the pressing element, so that the pressing block and the accommodating groove jointly clamp the laser diode to be tested, and at the same time position the laser diode. In addition, when performing detection, the surface-emitting laser diode emits The laser can be emitted through the cavity (Cavity) formed by the accommodating groove and the through hole.
為達成前述目的,本發明一種用於測試面射型雷射二極體之治具組件,該面射型雷射二極體可包括一發光面、及一接點面,且發光面上包括一發光區域。本發明之治具組件主要包括一基座、一上蓋、及一閉鎖機構;基座包括至少一容置槽,其用於容設面射型雷射二極體,且容置槽內設置一電性接觸介面,其係用於電性接觸面射型雷射二極體之接點面;又,上蓋包括一本體、一壓抵塊、及一施壓元件,而本體包括一貫通槽,而壓抵塊包括一貫穿孔,且壓抵塊滑設於本體之貫通槽,施壓元件設置於本體與壓抵塊之間;再且,閉鎖機構係設置於基座、及上蓋中至少一者,係可選擇地使基座和上蓋彼此接合或脫離。其中,當閉鎖機構使基座和上蓋彼此接合時,容置槽與貫穿孔形成一貫穿腔體(Cavity),以露出至少局部之發光區域。 To achieve the aforementioned purpose, the present invention provides a fixture assembly for testing a surface-emitting laser diode. The surface-emitting laser diode may include a light-emitting surface and a contact surface, and the light-emitting surface includes a light-emitting area. The jig assembly of the present invention mainly includes a base, an upper cover, and a locking mechanism; the base includes at least one accommodating groove for accommodating a surface-emitting laser diode, and an electrical contact interface is arranged in the accommodating groove, which is used for electrically contacting the contact surface of the surface-emitting laser diode; and the upper cover includes a body, a pressing block, and a pressing element, and the body includes a through groove, and the pressing block includes a through hole, and the pressing block is slid in the through groove of the body , the pressing element is arranged between the body and the pressing block; moreover, the locking mechanism is arranged on at least one of the base and the upper cover, and can selectively engage or disengage the base and the upper cover. Wherein, when the locking mechanism makes the base and the upper cover engage with each other, the accommodating groove and the through hole form a through cavity (cavity) to expose at least part of the light-emitting area.
為達成前述目的,本發明一種檢測設備,主要包括:電源模組、如前述之治具組件、來源量測模組、以及主控制器;其中,來源量測模組啟動面射型雷射二極體,而主控制器控制對面射型雷射二極體執行一光學測試和一電性測試。 In order to achieve the aforementioned purpose, the present invention provides a testing device, which mainly includes: a power supply module, the aforementioned fixture assembly, a source measurement module, and a main controller; wherein, the source measurement module activates the surface-emitting laser diode, and the main controller controls the surface-emitting laser diode to perform an optical test and an electrical test.
2‧‧‧基座 2‧‧‧base
21‧‧‧容置槽 21‧‧‧Accommodating tank
211‧‧‧電性接觸介面 211‧‧‧Electrical contact interface
212‧‧‧卡止部 212‧‧‧Catching part
213‧‧‧探針 213‧‧‧Probe
3‧‧‧上蓋 3‧‧‧Top cover
31‧‧‧本體 31‧‧‧Ontology
311‧‧‧貫通槽 311‧‧‧through slot
32‧‧‧壓抵塊 32‧‧‧press block
322‧‧‧擋止塊 322‧‧‧stop block
321‧‧‧貫穿孔 321‧‧‧through hole
33‧‧‧施壓元件 33‧‧‧Pressure components
34‧‧‧按鈕 34‧‧‧button
4‧‧‧閉鎖機構 4‧‧‧Locking mechanism
41‧‧‧閉鎖桿 41‧‧‧Locking lever
411‧‧‧凹槽 411‧‧‧groove
42‧‧‧插槽 42‧‧‧Slots
421‧‧‧容槽 421‧‧‧Reservoir
43‧‧‧閉鎖件 43‧‧‧Locking parts
431‧‧‧彈簧 431‧‧‧spring
432‧‧‧卡固塊 432‧‧‧Clamp block
5‧‧‧溫度調控單元 5‧‧‧Temperature control unit
51‧‧‧加熱台 51‧‧‧Heating table
C‧‧‧主控制器 C‧‧‧main controller
Ct‧‧‧貫穿腔體 Ct‧‧‧through cavity
IS‧‧‧積分球 I S ‧‧‧Integrating sphere
Ld‧‧‧面射型雷射二極體 Ld‧‧‧surface emitting laser diode
Ld1‧‧‧發光面 Ld1‧‧‧luminous surface
Ld2‧‧‧接點面 Ld2‧‧‧contact surface
Ldz‧‧‧發光區域 Ldz‧‧‧luminous area
M‧‧‧來源量測模組 M‧‧‧source measurement module
P‧‧‧電源模組 P‧‧‧Power module
PD‧‧‧光感測器 PD ‧‧‧light sensor
S‧‧‧測試器 S‧‧‧tester
T‧‧‧治具組件 T‧‧‧Jig Components
圖1係面射型雷射二極體之示意立體圖。 Fig. 1 is a schematic perspective view of a surface-emitting laser diode.
圖2係本發明之治具組件一較佳實施例之立體圖。 Fig. 2 is a perspective view of a preferred embodiment of the jig assembly of the present invention.
圖3係本發明之治具組件中的上蓋和基座分離時之立體圖。 Fig. 3 is a perspective view when the upper cover and the base of the jig assembly of the present invention are separated.
圖4係本發明之治具組件中的上蓋和基座分離時之局部剖視圖。 Fig. 4 is a partial sectional view when the upper cover and the base of the jig assembly of the present invention are separated.
圖5係本發明之治具組件中的上蓋和基座接合時之局部剖視圖。 Fig. 5 is a partial cross-sectional view of the upper cover and the base in the jig assembly of the present invention when they are engaged.
圖6係本發明之檢測設備一較佳實施例之系統架構圖。 Fig. 6 is a system architecture diagram of a preferred embodiment of the detection device of the present invention.
本發明用於測試面射型雷射二極體之治具組件及具備該組件之測試設備在本實施例中被詳細描述之前,要特別注意的是,以下的說明中,類似的元件將以相同的元件符號來表示。再者,本發明之圖式僅作為示意說明,其未必按比例繪製,且所有細節也未必全部呈現於圖式中。 Before the fixture assembly for testing surface-emitting laser diodes of the present invention and the testing equipment equipped with the assembly are described in detail in this embodiment, it should be noted that in the following description, similar elements will be represented by the same element symbols. Furthermore, the drawings of the present invention are for illustrative purposes only, and may not be drawn to scale, and not all details may be presented in the drawings.
請先參閱圖1,其係面射型雷射二極體Ld之示意立體圖。一般而言,面射型雷射二極體Ld包括一發光面Ld1、及一接點面Ld2,其中發光面Ld1上包括一發光區域Ldz,即雷射由該發光區域Ldz發射。另外,接點面Ld2上則佈設有多個電性接點(圖中未示),其作為二極體晶片與電路板間電性導通之媒介。 Please refer to FIG. 1 first, which is a schematic perspective view of a surface-emitting laser diode Ld. Generally speaking, the surface-emitting laser diode Ld includes a light-emitting surface Ld1 and a contact surface Ld2, wherein the light-emitting surface Ld1 includes a light-emitting region Ldz, that is, the laser is emitted from the light-emitting region Ldz. In addition, a plurality of electrical contacts (not shown in the figure) are arranged on the contact surface Ld2, which serve as a medium for electrical conduction between the diode chip and the circuit board.
請再參閱圖2、及圖3,圖2係本發明之治具組件一較佳實施例之立體圖,圖3係本發明之治具組件中的上蓋和基座分離時之立體圖。如圖中所示,本實施
例所提供之治具組件主要包括一基座2、一上蓋3、以及一閉鎖機構4,而基座2上設置有多個容置槽21,其係用於容設待測之面射型雷射二極體Ld,即每一容置槽21可容納一面射型雷射二極體Ld。
Please refer to Fig. 2 and Fig. 3 again. Fig. 2 is a perspective view of a preferred embodiment of the jig assembly of the present invention, and Fig. 3 is a perspective view of the separation of the upper cover and the base of the jig assembly of the present invention. As shown in the figure, this implementation
The jig assembly provided in the example mainly includes a
請再一併參閱圖4,圖4係本發明之治具組件中的上蓋和基座分離時之局部剖視圖。每一容置槽21的底部又設置有一溫度調控單元5,其係用於對該面射型雷射二極體Ld升溫或降溫,而溫度調控單元5之環周又設置一電性接觸介面211。其中,因本實施例之治具組件係供一預燒測試(Burn-in test)用,故溫度調控單元5採用具備一溫度調控面之加熱台51。
Please refer to FIG. 4 again. FIG. 4 is a partial cross-sectional view when the upper cover and the base of the jig assembly of the present invention are separated. The bottom of each containing
在本實施例中,該溫度調控面為一非常堅固耐用的高導熱界面,其直接接觸面射型雷射二極體Ld,且加熱台51透過一熱通路而耦接至一溫度調控器(圖中未示);但本發明不以此為限,其他加熱或冷卻模組均可適用於本發明。另外,本實施例之電性接觸介面211採用彈簧探針213(spring pins),其佈設於加熱台51之四環周,並用於電性接觸面射型雷射二極體Ld之接點面Ld2上的電性接點(圖中未示)。
In this embodiment, the temperature control surface is a very strong and durable high thermal conductivity interface, which directly contacts the surface-emitting laser diode Ld, and the heating table 51 is coupled to a temperature regulator (not shown in the figure) through a thermal path; but the present invention is not limited thereto, and other heating or cooling modules are applicable to the present invention. In addition, the
再者,本實施例之上蓋3包括一本體31、複數壓抵塊32、及複數施壓元件33,而本體31包括複數貫通槽311,每一貫通槽311又對應於基座2上的一容置槽21。其中,每一貫通槽311內滑設有一壓抵塊32,而每一貫通槽311內設有一卡止部212,且每一壓抵塊32包括一擋止塊322,而本實施例之施壓元件33為一壓
縮彈簧,其係容設於貫通槽311並介於卡止部212與擋止塊322之間,而該壓縮彈簧除了提供壓抵塊32滑移時的復位功能外,當該壓縮彈簧受到壓抵塊32的擠壓而壓縮時,其撐張彈力將可作為壓抵塊32之下壓力。
Furthermore, the
再如圖中所示,每一閉鎖機構4包括一閉鎖桿41、一插槽42、及一閉鎖件43,該閉鎖桿41係自基座2之上表面向上凸伸,而該插槽42係設置於該上蓋3,且貫穿該上蓋3,上蓋3之插槽42係對應於基座2之閉鎖桿41。另外,閉鎖件43包括一彈簧431、及一卡固塊432,且插槽42內設有一容槽421,而卡固塊432、及彈簧431容設於容槽421。其中,彈簧431並施予一偏壓予卡固塊432,閉鎖桿41包括一凹槽411。換言之,彈簧431可驅動卡固塊432使其滑移於容槽421與凹槽411之間。
Again as shown in the figure, each
請一併參閱圖5,圖5係本發明之治具組件中的上蓋3和基座2接合時之局部剖視圖。當該閉鎖機構4使該基座2和該上蓋3彼此接合時,彈簧431驅使該卡固塊432卡固於該容槽421與該凹槽411之間,此時閉鎖機構4緊固基座2和上蓋3,而容置槽21與貫穿孔321形成一貫穿腔體Ct。
Please also refer to FIG. 5 . FIG. 5 is a partial cross-sectional view of the
此時,施壓元件33因受到壓縮而產生一彈簧力,其透過壓抵塊32而施力於面射型雷射二極體Ld之發光面Ld1,即壓抵塊32向下推壓面射型雷射二極體Ld,而使面射型雷射二極體Ld之接點面Ld2完整地接觸電性接觸介面211之彈簧探針213而構成電性導通。
然而,此時面射型雷射二極體Ld之發光區域Ldz即可透過壓抵塊32之貫穿孔321射出雷射。需要特別說明的是,對於測試而言,最大的光射出量是相當重要的,所以貫穿孔321之開口角度必須考慮到面射型雷射二極體Ld之最大射出角(maximum divergence angles)。
At this time, the
另一方面,請再度參閱圖2、及圖3,本實施例之每一閉鎖機構4又包括一按鈕34,其係設置於上蓋3,且每一按鈕34連接至一卡固塊432。故當測試完畢時,只需按壓上蓋3之按鈕34,即可推動卡固塊432,使其退出閉鎖桿41之凹槽411,以解除上蓋3與基座2間的閉鎖,接著上蓋3便可輕易脫離基座2。
On the other hand, please refer to FIG. 2 and FIG. 3 again, each
請再參閱圖6,圖6係本發明之檢測設備一較佳實施例之系統架構圖。本實施例之檢測設備主要包括電源模組P、如前記實施例所述之測試面射型雷射二極體之治具組件T、來源量測模組M、測試器S、以及主控制器C,而電源模組P、測試器S、及來源量測模組M係電性連接主控制器C,且測試器S係對應於壓抵塊32之貫穿孔321。
Please refer to FIG. 6 again. FIG. 6 is a system architecture diagram of a preferred embodiment of the detection device of the present invention. The testing equipment of this embodiment mainly includes a power module P, a fixture assembly T for testing surface-emitting laser diodes as described in the previous embodiment, a source measurement module M, a tester S, and a main controller C. The power module P, tester S, and source measurement module M are electrically connected to the main controller C, and the tester S corresponds to the through
其中,當閉鎖機構4使基座2和上蓋3彼此接合時,即面射型雷射二極體Ld之接點面Ld2上的電性接點電性接觸彈簧探針213後,來源量測模組M可供電並啟動面射型雷射二極體Ld,此時來源量測模組M亦隨即量測電壓等電性參數,即進行一電性測試;而面射型雷射二極體Ld之發光區域Ldz將發射雷射,並透過貫穿腔體Ct自上蓋3射出雷射。然而,主控制器C便控制一
測試器S測量自貫穿腔體Ct所射出之雷射,進而檢測面射型雷射二極體Ld之發光特性,其中測試器S是用於透過一積分球IS、及一光感測器PD監測或檢測光通量和光波長。綜上,本發明至少具備以下特色及優勢:
Wherein, when the
1.透過施壓元件33而施力於壓抵塊32,使壓抵塊32與容置槽21共同夾持待測試之雷射二極體,除了可對該雷射二極體進行定位外,同時可確保雷射二極體與彈簧探針213完整電性接觸外。
1. Apply force to the
2.施壓元件33提供了適當的壓力及緩衝力,使壓抵塊32不致於過度重壓雷射二極體,進而導致雷射二極體破裂毀損。
2. The
3.貫穿腔體Ct完整暴露雷射二極體上之發光區域Ldz,使雷射二極體所發射之雷射可不受阻礙地從貫穿腔體Ct射出,以供量測。 3. The light-emitting region Ldz on the laser diode is completely exposed through the cavity Ct, so that the laser emitted by the laser diode can be emitted from the through cavity Ct without hindrance for measurement.
4.可以透過溫度調控單元5直接接觸或透過其他流體接觸待測試之雷射二極體,並對雷射二極體升溫或降溫,故可提供高溫或低溫之測試環境。 4. It can directly contact the laser diode to be tested through the temperature control unit 5 or through other fluids, and heat up or cool down the laser diode, so it can provide a high or low temperature test environment.
5.操作相當容易,只要將上蓋3上的插槽42對準基座2上的閉鎖桿41,而將上蓋3與基座2直接壓合,即可完成閉鎖;完成測試時,只要按壓上蓋3上的按鈕34,即可使上蓋3脫離基座2。
5. The operation is quite easy, as long as the
6.存放於治具組件內的雷射二極體,將受到相當良好的保護,可以減少精密晶粒與外部裝置接觸的機會,進而避免受外力毀損。 6. The laser diode stored in the jig assembly will be well protected, which can reduce the chance of precision crystal grains contacting external devices, thereby avoiding damage by external forces.
7.治具組件可以在不同製程或設備間流動、處理,例如進行不同檢測項目時,雷射二極體無需移出治具,且治具組件可重複使用。 7. The fixture components can flow and be processed between different processes or equipment. For example, when performing different inspection items, the laser diode does not need to be removed from the fixture, and the fixture components can be reused.
上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments.
2‧‧‧基座 2‧‧‧base
3‧‧‧上蓋 3‧‧‧Top cover
31‧‧‧本體 31‧‧‧Ontology
311‧‧‧貫通槽 311‧‧‧through slot
34‧‧‧按鈕 34‧‧‧button
Claims (9)
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TW200506395A (en) * | 2003-06-27 | 2005-02-16 | Canon Kk | Method and apparatus for inspecting semiconductor device |
CN101084447A (en) * | 2004-12-15 | 2007-12-05 | 雅赫测试系统公司 | System for testing and burning in of integrated circuits |
US20130058367A1 (en) * | 2011-08-29 | 2013-03-07 | Intellectual Light, Inc. | Mount for Semiconductor Devices Using Conformable Conductive Layers, and Method |
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TW200506395A (en) * | 2003-06-27 | 2005-02-16 | Canon Kk | Method and apparatus for inspecting semiconductor device |
CN101084447A (en) * | 2004-12-15 | 2007-12-05 | 雅赫测试系统公司 | System for testing and burning in of integrated circuits |
US20130058367A1 (en) * | 2011-08-29 | 2013-03-07 | Intellectual Light, Inc. | Mount for Semiconductor Devices Using Conformable Conductive Layers, and Method |
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