TWI807665B - Preformed conductive pillar structure and method of manufacturing the same - Google Patents

Abstract

A preformed conductive pillar structure having a plurality of conductive pillars and a package is provided. The conductive pillars are arranged upright and juxtaposed with each other. The package is wrapped on an outside of the conductive pillars and has a top surface and a bottom surface. Both ends of each conductive pillar are respectively exposed on the top surface and the bottom surface. The preformed conductive pillar structure is therefore simple in later stage of process steps and increasing yield.

Description

Preformed conductive column structure and manufacturing method thereof

The present invention relates to a semiconductor packaging structure and a manufacturing method thereof, and in particular to a preformed conductive column structure and a manufacturing method thereof.

As shown in FIG. 1 , first provide a conductive frame a1, which has a plate body a2 and a plurality of conductive pillars a3 formed on the plate body a2; then provide a chip b1, which has a plurality of electrode portions b2, place the chip b1 on the conductive frame a1, and weld the plurality of electrode portions b2 on the plurality of conductive pillars a3; finally provide a package c, wrap the package body c on the outside of the chip b1 and the plurality of conductive pillars a3, and remove the plate body a2 exposed from the package c. That is to complete a common single crystal packaging process.

However, the above-mentioned single crystal packaging process has the following disadvantages. First, the chip b1 needs to be removed after the plate body a2 is removed. Therefore, when the chip b1 has a poor connection, it is difficult to recycle and remanufacture because the chip b1 is covered by the package body c.

In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's development.

The present invention provides a preformed conductive post structure and a manufacturing method thereof. The preformed conductive post structure is used to package the conductive post, and both ends of the conductive post are exposed to the package body, so as to achieve the advantages of simple process steps, shortened process steps, and improved product yield in the latter stage of the single crystal packaging process.

In an embodiment of the present invention, the present invention provides a preformed conductive pillar structure, comprising: a plurality of conductive pillars, arranged upright with each other and juxtaposed at intervals; and a package, covering the exterior of the plurality of conductive pillars, the package has a top surface and a bottom surface, one end of each conductive pillar is exposed on the top surface and the other end is exposed on the bottom surface; wherein, the package is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar embedded in each of the through holes and welded up and down. a second metal post.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive column structure, the steps of which include: a) providing a metal plate body, performing etching treatment on the metal plate body, so that the metal plate body forms an etched surface on one side and a plurality of metal columns remaining on the etched surface; b) encapsulating the metal plate body, so that a package is combined on the metal plate body. and one end surface flush with the top surface of the package body; and c) removing the metal plate body so that each metal post has an exposed end surface flush with the bottom surface of the package body at the other end, and shipping the preformed conductive post structure to the client for the latter part of the single crystal packaging process.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive column structure, the steps of which include: a) providing a metal plate body, performing etching treatment on the metal plate body, so that the metal plate body forms an etched surface on one side and a plurality of metal columns remaining on the etched surface; b) encapsulating the metal plate body, so that a package is combined on the metal plate body. and one end surface flush with the top surface of the package body; and d) etching the metal plate body so that each metal post has an extended post exposed at the other end and protruding from the bottom surface of the package body, and the preformed conductive post structure is shipped to the client for the latter stage of the single crystal packaging process.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive column structure, the steps of which include: e) providing a first metal plate body, and performing etching treatment on the first metal plate body, so that the first metal plate body forms a first etched surface on one side and a plurality of first metal columns remaining on the first etched surface; pillar; g) stacking the plurality of first metal pillars and the plurality of second metal pillars up and down, and welding one end of each of the first metal pillars to one end of each of the second metal pillars; and h) encapsulating the first metal plate body and the second metal plate body, so that a package is combined between the first metal plate body and the second metal plate body, and the package body covers the first etched surface, the second etched surface, the outer peripheral surface of the plurality of first metal pillars, and the outer peripheral surface of the plurality of second metal pillars.

Based on the above, the preformed conductive post structure of the present invention has removed the metal plate body and packaged the conductive post, and the two ends of the conductive post are exposed to the package body, so that when the preformed conductive post structure is shipped to the client for the later stage of the single crystal packaging process, the client does not need to remove the metal plate body, and can be directly soldered to the chip by brushing the conductive post. In order to achieve the latter stage of the single crystal packaging process, the process steps are simple and shortened.

Based on the above, the preformed conductive pillar structure of the present invention has removed the metal plate body, so the step of first packaging the chip and the plate body with the conventional package body, and then removing the plate body can be omitted, so that the chip can be directly soldered to the conductive pillar without being packaged, and the chip can be recycled and remanufactured because the chip is not packaged in the subsequent detection of the chip.

〈knowledge〉

a1: conductive frame

a2: board body

a3: Conductive column

b1: chip

b2: electrode part

c: Encapsulation

<this invention>

10: Preformed conductive pillar structure

1: Conductive column

11: Metal plate body

111: etched surface

112: metal column

113: Outer peripheral surface

12: The first metal plate body

121: the first etched surface

122: The first metal column

123: Outer peripheral surface

13: The second metal plate body

131: the second etched surface

132: Second metal column

133: Outer peripheral surface

14, 14': end face

15, 15': extension column

2: Encapsulation

21: top surface

22: bottom surface

23: Through hole

a~k: steps

Fig. 1 is a combined cross-sectional view of a conventional single crystal package.

Fig. 2 is a flow chart of the steps of the first manufacturing method of the preformed conductive pillar structure of the present invention.

Fig. 3 is a perspective view of the etched surface and a plurality of metal pillars formed on the metal plate body of the present invention.

Fig. 4 is a cross-sectional view of the metal plate body of the present invention formed with the etched surface and a plurality of metal pillars.

Fig. 5 is a perspective view of the package body of the present invention combined on the metal plate body.

Fig. 6 is a cross-sectional view of the package body of the present invention combined on the metal plate body.

FIG. 7 is a perspective view of the first embodiment of the preformed conductive column structure of the present invention.

Fig. 8 is a cross-sectional view of the first embodiment of the preformed conductive column structure of the present invention.

Fig. 9 is a flow chart of the steps of the second manufacturing method of the preformed conductive column structure of the present invention.

Fig. 10 is a perspective view of the second embodiment of the preformed conductive column structure of the present invention.

Fig. 11 is a cross-sectional view of the second embodiment of the preformed conductive post structure of the present invention.

Fig. 12 is a flow chart of the steps of the third manufacturing method of the preformed conductive column structure of the present invention.

Fig. 13 is a perspective view of the first metal plate body formed with the first etched surface and a plurality of first metal pillars according to the present invention.

Fig. 14 is a perspective view of welding one end of each first metal post and one end of each second metal post in the present invention.

Fig. 15 is a cross-sectional view of welding one end of each first metal post and one end of each second metal post in the present invention.

Fig. 16 is a cross-sectional view of the package of the present invention combined between the first metal plate body and the second metal plate body.

Fig. 17 is a cross-sectional view of the third embodiment of the preformed conductive column structure of the present invention.

Fig. 18 is a flow chart of the steps of the fourth manufacturing method of the preformed conductive column structure of the present invention.

Fig. 19 is a perspective view of the fourth embodiment of the preformed conductive column structure of the present invention.

Fig. 20 is a cross-sectional view of the fourth embodiment of the preformed conductive column structure of the present invention.

Fig. 21 is a flow chart of the steps of the fifth manufacturing method of the preformed conductive column structure of the present invention.

Fig. 22 is a cross-sectional view of the fifth embodiment of the preformed conductive column structure of the present invention.

Fig. 23 is a perspective view of the sixth embodiment of the preformed conductive column structure of the present invention.

The detailed description and technical content of the present invention will be described as follows with accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present invention.

Referring to FIG. 2 to FIG. 8 , the present invention provides a first embodiment of a preformed conductive post structure and a manufacturing method thereof. The preformed conductive post structure 10 mainly includes a plurality of conductive posts 1 and a package 2 .

As shown in Figure 2, it is the steps of the manufacturing method of the first embodiment of the preformed conductive column structure of the present invention, which is further described as follows; first, as shown in step a of Figure 2 and Figures 3 to 4, a metal plate body 11 is provided, and the metal plate body 11 is etched, so that the metal plate body 11 forms an etched surface 111 on one side and a plurality of metal columns 112 remaining on the etched surface 111. Wherein, the metal plate body 11 can be made of conductive metals such as copper, silver, and gold, so that the metal pillars 112 can be made of conductive metals such as copper, silver, and gold.

Second, as shown in step b of FIG. 2 and FIGS. 5 to 6, the metal plate body 11 is packaged so that a package body 2 is bonded to the metal plate body 11. The package body 2 covers the etched surface 111 and the outer peripheral surface 113 of a plurality of metal posts 112. Each metal post 112 has an end surface 14 exposed at one end and flush with the top surface 21 of the package body 2.

In addition, the material of the package body 2 is polyimide (Polyimide, PI), dry film (Dry film), epoxy resin (Expoxy) or packaging material (Molding Compound), and the package body 2 can be formed on the metal plate body 11 by lamination or molding (Molding), but not limited to the above.

Furthermore, before performing the encapsulation process on the metal plate body 11, the surface to be etched 111 and the outer peripheral surfaces 113 of the plurality of metal pillars 112 can be subjected to surface roughening treatment, so that the surface of the etched surface 111 and the outer peripheral surfaces 113 of the plurality of metal pillars 112 are rough and easy to be stably combined with the package body 2, but this step is not necessary, and it can be retained or omitted depending on the actual situation.

Third, as shown in step c of FIG. 2 and FIGS. 7 to 8 , the metal plate body 11 is removed so that each metal post 112 has an exposed end surface 14 flush with the bottom surface 22 of the package body 2 at the other end. In this way, the first embodiment of the preformed conductive column structure 10 is produced.

Wherein, each end surface 14 in this embodiment is a plane, but it is not limited thereto. Each end surface 14 can also be etched to form a concave arc surface that is gradually depressed from the outer peripheral edge to the central point.

As shown in FIG. 7 to FIG. 8, it is the first embodiment of the preformed conductive post structure 10 of the present invention. The detailed description is as follows. The plurality of conductive posts 1 are arranged upright and spaced apart from each other;

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive pillar 1 includes a metal pillar 112 embedded in each through hole 23. Each metal pillar 112 has two end surfaces 14 that are exposed at both ends and are flush with the top surface 21 and the bottom surface 22. Since the metal pillar 112 is etched, the outer peripheral size of each metal pillar 112 gradually decreases from the two ends to the middle.

As shown in FIG. 7 to FIG. 8 , the use state of the first embodiment of the preformed conductive post structure 10 of the present invention is that the package 2 is used to cover the exterior of the plurality of conductive posts 1 , one end of each conductive post 1 is exposed and flush with the top surface 21 of the package body 2 and the other end is exposed and flush with the bottom surface 22 of the package body 2 . By this, the present The preformed conductive pillar structure 10 has removed the metal plate body 11 and packaged the conductive pillar 1, and both ends of the conductive pillar 1 are exposed to the package body 2, so that when the preformed conductive pillar structure 10 is shipped to the client for the later stage of the single crystal packaging process, the client does not need to remove the metal plate body 11, and the conductive pillar 1 can be directly soldered to the chip, so that the process step of the single crystal packaging process is simple and shortened.

In addition, the metal plate body 11 has been removed from the preformed conductive post structure 10 of the present invention, so the step of first packaging the chip and the plate body with the conventional package body, and then removing the plate body can be omitted, so that the chip can be directly welded to the conductive post 1 without being packaged. When the chip is subsequently inspected and there is a bad connection of the chip, the chip can be recycled and remanufactured because the chip is not packaged, thereby improving the yield rate of the single-chip packaging process.

Also, during the soldering process, one end of the conductive post 1 in this embodiment is exposed and flush with the top surface 21 of the package body 2 and the other end is exposed and flush with the bottom surface 22 of the package body 2, so the solder balls are not easy to roll off from the end of the conductive post 1, so that the preformed conductive post structure 10 has the effect of facilitating soldering.

Please refer to FIG. 3 to FIG. 6 , and FIG. 9 to FIG. 11 , which are the second embodiment of the preformed conductive post structure and the manufacturing method thereof according to the present invention, further described as follows.

Steps a to b of the manufacturing method of the second embodiment of the preformed conductive pillar structure of the present invention are the same as steps a to b of the first embodiment of the preformed conductive pillar structure. The difference between the manufacturing methods of the first and second embodiments of the preformed conductive pillar structure lies in the steps after step b.

After step a (as shown in FIGS. 3 to 4 ) and step b (as shown in FIGS. 5 to 6 ) of FIG. 9 , and then step d of FIG. 9 , as shown in FIGS. 10 to 11 , the metal plate body 11 is etched so that each metal post 112 is extended with an extension post 15 that is exposed and protrudes from the bottom surface 22 of the package body 2 at the other end. In this way, the second embodiment of the preformed conductive column structure 10 is produced.

Wherein, the end surface of each extension column 15 in this embodiment is a plane, but it is not limited thereto. The end surface of each extension column 15 can also be etched to form a concave arc surface that is gradually depressed from the outer periphery to the central point.

As shown in FIG. 10 to FIG. 11 , it is the second embodiment of the preformed conductive post structure 10 of the present invention. The details are as follows. The package body 2 is wrapped on the outside of the plurality of conductive posts 1 .

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a metal pillar 112 embedded in each through hole 23. Each metal pillar 112 has an exposed end surface 14 flush with the top surface 21 at one end and an extended pillar 15 exposed at the other end and protruding from the bottom surface 22. Because the metal pillar 112 is etched first, the extension pillar 15 is etched and formed, so each metal pillar 112 gradually reduces the outer peripheral size from both ends to the middle. The size of the outer periphery of the column 15 gradually decreases from both ends toward the middle. In this way, the same effect as that of the first embodiment of the preformed conductive column structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the extension column 15 is extended at one end of the metal column 112 by etching the metal plate body 11 , thereby increasing the length of the conductive column 1 , so that the preformed conductive column structure 10 has the function of extending the length of the conductive column 1 .

Please refer to FIG. 12 to FIG. 17 , the present invention provides a third embodiment of a preformed conductive post structure and a manufacturing method thereof. The preformed conductive post structure 10 mainly includes a plurality of conductive posts 1 and a package body 2 .

As shown in Figure 12, it is the steps of the manufacturing method of the third embodiment of the preformed conductive post structure of the present invention, which is further described as follows; first, as shown in step e of Figure 12 and Figure 13, a first metal plate body 12 is provided, and the first metal plate body 12 is etched, so that the first metal plate body 12 forms a first etched surface 121 on one side and a plurality of first metal columns 122 remaining on the first etched surface 121.

Second, as shown in step f of Figure 12 and Figures 14 to 15, a second metal plate body 13 is provided, and the second metal plate body 13 is etched to make the second metal plate body 13 form a second etched surface 131 and a plurality of second metal pillars 132 remaining on the second etched surface 131 on one side.

Third, as shown in step g of Figure 12 and Figures 14 to 15, the plurality of first metal columns 122 and the plurality of second metal columns 132 are stacked up and down, and one end of each first metal column 122 is welded to one end of each second metal column 132.

Step g is described in detail as follows. First brush tin on the ends of the plurality of second metal pillars 132, then stack the plurality of first metal pillars 122 and the plurality of second metal pillars 132 up and down, and increase the ambient temperature so that one end of each first metal pillar 122 and one end of each second metal pillar 132 are heated and melted through tin and then welded.

Fourth, as shown in step h of FIG. 12 and FIG. 16, the first metal plate body 12 and the second metal plate body 13 are packaged, so that a package body 2 is combined between the first metal plate body 12 and the second metal plate body 13, and the package body 2 covers the first etched surface 121, the second etched surface 131, the outer peripheral surface 123 of the plurality of first metal pillars 122 and the outer peripheral surface 133 of the plurality of second metal pillars 132.

In addition, the material of the package body 2 is polyimide (Polyimide, PI), dry film (Dry film), epoxy resin (Expoxy) or packaging material (Molding Compound), and the package body 2 can be formed between the first metal plate body 12 and the second metal plate body 13 by lamination or molding (Molding), but not limited to the above.

Furthermore, before the first metal plate body 12 and the second metal plate body 13 are packaged, the first etched surface 121, the second etched surface 131, the outer peripheral surface 123 of the plurality of first metal pillars 122 and the outer peripheral surface 133 of the plurality of second metal pillars 132 can be subjected to surface roughening treatment, so that the first etched surface 121, the second etched surface 131, the outer peripheral surface 123 of the plurality of first metal pillars 122 and the outer periphery of the plurality of second metal pillars 132 The surface 133 has a rough surface and is easy to be stably combined with the package body 2 , but this step is not necessary and can be retained or omitted depending on the actual situation.

Fifth, as shown in step i of FIG. 12 and FIG. 17, the first metal plate body 12 and the second metal plate body 13 are removed, so that each first metal post 122 and each second metal post 132 have two end surfaces 14' that are exposed and flush with the top surface 21 and the bottom surface 22 of the package body 2 at the other end. In this way, the third embodiment of the preformed conductive column structure 10 is produced.

Wherein, each end surface 14' of this embodiment is a plane, but it is not limited thereto, and each end surface 14' can also be etched to form a concave arc surface that is gradually depressed from the outer peripheral edge to the central point.

As shown in FIG. 17 , it is the third embodiment of the preformed conductive pillar structure 10 of the present invention. The details are as follows. The package body 2 is wrapped on the outside of the plurality of conductive pillars 1 .

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a first metal pillar 122 and a second metal pillar 132 embedded in each through hole 23 and welded up and down. The first metal pillar 122 and the second metal pillar 132 have two end surfaces 14' that are exposed and flush with the top surface 21 and the bottom surface 22 at the two ends far away from each other. Since the first metal pillar 122 and the second metal pillar 132 are etched and formed, each first metal pillar 122 is from both ends toward the middle. The size of the outer periphery is gradually reduced, and the size of the outer periphery of each second metal column 132 is gradually reduced from two ends toward the middle. In this way, the same effect as that of the first embodiment of the preformed conductive column structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal post 122 and the second metal post 132 are overlapped and welded up and down to increase the length of the conductive post 1 , so that the preformed conductive post structure 10 has the function of extending the length of the conductive post 1 .

Please refer to FIG. 13 to FIG. 16 , and FIG. 18 to FIG. 20 , which are the fourth embodiment of the preformed conductive column structure and the manufacturing method thereof according to the present invention, further described as follows.

Steps e to h of the manufacturing method of the fourth embodiment of the preformed conductive pillar structure of the present invention are the same as steps e to h of the third embodiment of the preformed conductive pillar structure. The difference between the manufacturing methods of the third and fourth embodiments of the preformed conductive pillar structure lies in the steps after step h.

First go through step e (as shown in FIG. 13 ), step f (as shown in FIG. 14 to FIG. 15 ), step g (as shown in FIG. 14 to FIG. 16 ), and step h (as shown in FIG. 16 ) of FIG. 18 , and then as shown in step j of FIG. 18 and FIG. 19 to FIG. 20 , the first metal plate body 12 and the second metal plate body 13 are etched, so that each first metal plate body The metal pillar 122 and each second metal pillar 132 are extended with two extending pillars 15' that are exposed and protrude from the top surface 21 and the bottom surface 22 of the package body 2 at the other end. In this way, the fourth embodiment of the preformed conductive pillar structure 10 is produced.

Wherein, the end surface of each extension column 15' in this embodiment is a plane, but it is not limited thereto. The end surface of each extension column 15' can also be etched to form a concave arc surface that is gradually depressed from the outer periphery to the central point.

As shown in FIG. 10 to FIG. 11 , it is the fourth embodiment of the preformed conductive pillar structure 10 of the present invention. The details are as follows. The package body 2 is wrapped on the outside of the plurality of conductive pillars 1 . The package body 2 has a top surface 21 and a bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through-holes 23. Each conductive pillar 1 includes a first metal pillar 122 and a second metal pillar 132 embedded in each through-hole 23 and welded up and down. The first metal pillar 122 and the second metal pillar 132 have two extended pillars 15' that are exposed and protrude from the top surface 21 and the bottom surface 22. Each first metal column 122 gradually reduces the outer peripheral size from both ends to the middle, each second metal column 132 gradually reduces the outer peripheral size from both ends to the middle, and each extension column 15' gradually reduces the outer peripheral size from both ends to the middle. In this way, the same effect as that of the third embodiment of the preformed conductive column structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal post 122 and the second metal post 132 are stacked and welded up and down, the first metal plate body 12 and the second metal plate body 13 are etched, and two extension posts 15 are extended at both ends of the first metal post 122 and the second metal post 132, thereby increasing the length of the conductive post 1, so that the preformed conductive post structure 10 has the function of extending the length of the conductive post 1.

Please refer to FIG. 13 to FIG. 16 , and FIG. 21 to FIG. 22 , which are the fifth embodiment of the preformed conductive column structure and the manufacturing method thereof according to the present invention, further described as follows.

Steps e to h of the manufacturing method of the fifth embodiment of the preformed conductive pillar structure of the present invention are the same as steps e to h of the third embodiment of the preformed conductive pillar structure. The difference between the manufacturing methods of the third and fifth embodiments of the preformed conductive pillar structure lies in the steps after step h.

First go through step e (as shown in FIG. 13 ), step f (as shown in FIGS. 14 to 15 ), step g (as shown in FIGS. 14 to 16 ), and step h (as shown in FIG. 16 ) of FIG. 21 , and then as shown in step k of FIG. 21 and FIG. 22 , one of the first metal plate body 12 and the second metal plate body 13 is removed and the other is etched, so that each first metal post 122 and each second metal post 132 have a bare and flush with the package at the other end. One end surface 14' of one of the top surface 21 and the bottom surface 22 of the package body 2 and an extension column 15' exposed and protruding from the other one of the top surface 21 and the bottom surface 22 of the package body 2. In this way, the fifth embodiment of the preformed conductive column structure 10 is produced.

Wherein, each end surface 14' of the present embodiment is etched to form a concave arc surface that is gradually depressed from the outer periphery to the central point, but it is not limited thereto, and each end surface 14' can also be a plane; the end surface of each extension column 15' is etched to form a concave arc surface that is gradually concave from the outer periphery to the central point, but it is not limited thereto, and the end surface of each extension column 15' can also be a plane.

As shown in FIG. 22 , it is the fifth embodiment of the preformed conductive post structure 10 of the present invention. The details are as follows. The package body 2 is wrapped on the outside of the plurality of conductive posts 1 .

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive post 1 includes a first metal post 122 and a second metal post 132 embedded in each through hole 23 and welded up and down. 5', because the first metal pillar 122 and the second metal pillar 132 are etched and formed first, and the extension pillar 15' is etched and formed again, so each first metal pillar 122 gradually reduces the outer peripheral dimension from both ends to the middle, and each second The two metal columns 132 gradually reduce the size of the outer periphery from both ends to the middle, and each extension column 15' gradually reduces the size of the outer periphery from both ends to the middle. In this way, the same effect as that of the third embodiment of the preformed conductive column structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal post 122 and the second metal post 132 are stacked and welded up and down, the first metal plate body 12 or the second metal plate body 13 is etched, and an extension post 15' is extended from one end of the first metal post 122 or the second metal post 132, thereby increasing the length of the conductive post 1, so that the preformed conductive post structure 10 has the function of extending the length of the conductive post 1.

As shown in FIG. 23 , it is the sixth embodiment of the preformed conductive column structure 10 of the present invention. The sixth embodiment of the preformed conductive column structure 10 is substantially the same as the second embodiment of the preformed conductive column structure 10. The differences between the sixth embodiment of the preformed conductive column structure 10 and the second embodiment of the preformed conductive column structure 10 are further described as follows.

By performing etching treatment with different parameters on different parts of the metal plate body 11, a part of the metal post 112 has an extended post 15 that is exposed at the other end and protrudes from the bottom surface 22 of the package body 2, and another part of the metal post 112 has an exposed end surface 14 that is flush with the bottom surface 22 of the package body 2 at the other end. In this way, the position of the end surface 14 and the extension column 15 can be arranged in accordance with the chip, so as to enhance the ability of the preformed conductive column structure 10 of the present invention to link with the chip.

Similarly, referring to FIG. 19 to FIG. 20 and FIG. 22 , different parts of the first metal plate body 12 or the second metal plate body 13 can also be etched with different parameters, so that the first metal pillar 122 has an end surface 14' that is exposed and flush with the top surface 21 of the package body 2 or an extension pillar 15' that protrudes from the top surface 21 of the package body 2, and the second metal pillar 132 has an end that is exposed and flush with the bottom surface 22 of the package body 2 at the other end. surface 14' or an extension post 15' protruding from the bottom surface 22 of the package body 2. In this way, the position of the end face 14' or the extension column 15' can be arranged in accordance with the chip, so as to enhance the ability of the preformed conductive column structure 10 of the present invention to link with the chip.

To sum up, the preformed conductive post structure and its manufacturing method of the present invention have never been seen in similar products and public use, and have industrial applicability, novelty and progress, and fully meet the requirements of patent application. Please file an application in accordance with the Patent Law. Please check carefully and grant the patent of this case to protect the rights of the inventor.

10: Preformed conductive pillar structure

14: End face

2: Encapsulation

21: top surface

23: Through hole

Claims (13)

A preformed conductive pillar structure, comprising: a plurality of conductive pillars arranged upright and juxtaposed with each other at intervals; and a package body wrapped on the outside of the plurality of conductive pillars, the package body has a top surface and a bottom surface, one end of each conductive pillar is exposed on the top surface and the other end is exposed on the bottom surface; wherein, the package body is provided with a plurality of through holes, and each conductive pillar includes a first metal pillar and a second metal pillar embedded in each of the through holes and welded up and down. The preformed conductive pillar structure as described in claim 1, wherein the first metal pillar and the second metal pillar have two end surfaces that are exposed and flush with the top surface and the bottom surface at two ends far away from each other, each of the first metal pillars gradually reduces the outer peripheral size from the two ends toward the middle, and each of the second metal pillars gradually reduces the outer peripheral size from the two ends toward the middle. The preformed conductive pillar structure as described in claim 1, wherein the first metal pillar and the second metal pillar have two extending pillars that are exposed and protrude from the top surface and the bottom surface at both ends far away from each other, each of the first metal pillars gradually reduces the outer peripheral size from both ends to the middle, each of the second metal pillars gradually reduces the outer peripheral size from both ends to the middle, and each of the extension pillars gradually reduces the outer peripheral size from both ends to the middle. The preformed conductive pillar structure as described in claim 1, wherein the first metal pillar and the second metal pillar have an exposed end surface flush with one of the top surface and the bottom surface at one end away from each other, and an extended pillar exposed and protruding from the other of the top surface and the bottom surface at the other end, each of the first metal pillars gradually reduces the outer peripheral dimension from both ends toward the middle, each of the second metal pillars gradually reduces the outer peripheral edge size from both ends toward the middle, and each of the extension pillars gradually reduces the outer peripheral edge from both ends toward the middle size. The preformed conductive column structure as claimed in claim 2, 3 or 4, wherein each end surface is a plane or a concave arc surface gradually depressed from the outer periphery to the central point. The preformed conductive column structure as claimed in claim 3 or 4, wherein the end surface of each of the extension columns is a plane or a concave arc surface gradually depressed from the outer periphery to the central point. A method for manufacturing a preformed conductive pillar structure, the steps comprising: a) providing a metal plate, etching the metal plate so that one side of the metal plate forms an etched surface and a plurality of metal pillars remaining on the etched surface; b) encapsulating the metal plate so that a package is bonded to the metal plate, the package covers the etched surface and the outer peripheral surface of the plurality of metal pillars, and each metal pillar has an exposed surface at one end that is flush with the top surface of the package one end surface; and c) removing the metal plate so that the other end of each metal post has an exposed end surface flush with the bottom surface of the package, and the preformed conductive post structure is shipped to the client for post-production process of single crystal packaging. A method for manufacturing a preformed conductive pillar structure, the steps comprising: a) providing a metal plate, etching the metal plate so that one side of the metal plate forms an etched surface and a plurality of metal pillars remaining on the etched surface; b) encapsulating the metal plate so that a package is bonded to the metal plate, the package covers the etched surface and the outer peripheral surface of the plurality of metal pillars, and each metal pillar has an exposed surface at one end that is flush with the top surface of the package one end surface; and in d), the metal plate body is etched, so that each of the metal pillars is extended at the other end with an extended pillar that is exposed and protrudes from the bottom surface of the package body, and the preformed conductive pillar structure is shipped to the client for the latter stage of the single crystal packaging process. A method for manufacturing a preformed conductive column structure, the steps comprising: e) providing a first metal plate body, and performing etching treatment on the first metal plate body, so that a first etched surface and a plurality of first metal columns remaining on the first etched surface are formed on one side of the first metal plate body; f) providing a second metal plate body, etching the second metal plate body, so that the second metal plate body forms a second etched surface on one side and a plurality of second metal pillars remaining on the second etched surface; g) stacking the plurality of first metal pillars and the plurality of second metal pillars up and down, and welding one end of each first metal pillar to one end of each second metal pillar; and h) packaging the first metal plate body and the second metal plate body, so that a package is combined with the first metal plate body and Between the second metal plates, the packaging body wraps the first etched surface, the second etched surface, the outer peripheral surfaces of the plurality of first metal pillars and the outer peripheral surfaces of the plurality of second metal pillars. The manufacturing method of the preformed conductive post structure as described in Claim 9, which further includes a step i) after the step h), and in step i), performing a removal process on the first metal plate body and the second metal plate body, so that each of the first metal post and each of the second metal post has two end surfaces that are exposed at the other end and are flush with the top surface and the bottom surface of the package. The manufacturing method of the preformed conductive post structure as described in Claim 9, which further includes a step j) after the step h), and in the step j), etching the first metal plate body and the second metal plate body, so that each of the first metal post and each of the second metal post has two extension posts that are exposed at the other end and protrude from the top surface and the bottom surface of the package. For example, the production method of the pre -shaped -conductive column structure described in the Request 9 is included in one step K after H), and in step K), the first metal plate body and one of the second metal plates are removed and the other is etched to make each first metal column with each end of the second metal column that is naked and flattened at the top surface of the seal. One end of one end of the bottom surface and exposed and protruding from the extension column of the top surface of the seal body and the other side of the bottom surface. The manufacturing method of the preformed conductive column structure as described in claim item 9, wherein in step g), tin is first brushed on the ends of the plurality of second metal columns, and then the plurality of first metal columns and the plurality of second The metal pillars are stacked up and down, and the ambient temperature is increased, so that one end of each first metal pillar and one end of each second metal pillar are welded through tin heating and melting.