TW202336928A - Preformed conductive pillar structure and method of manufacturing the same - Google Patents

Abstract

A preformed conductive pillar structure having a plurality of conductive pillars and a package is provided. The conductive pillars are arranged upright and juxtaposed with each other. The package is wrapped on an outside of the conductive pillars and has a top surface and a bottom surface. Both ends of each conductive pillar are respectively exposed on the top surface and the bottom surface. The preformed conductive pillar structure is therefore simple in later stage of process steps and increasing yield.

Description

Preformed conductive pillar structure and manufacturing method thereof

The present invention relates to a semiconductor packaging structure and a manufacturing method thereof, and in particular to a preformed conductive pillar structure and a manufacturing method thereof.

As shown in Figure 1, a conductive frame a1 is provided first. The conductive frame a1 has a plate body a2 and a plurality of conductive pillars a3 formed on the plate body a2. Then a wafer b1 is provided. The wafer b1 has a plurality of electrode portions b2. Place the wafer b1 Above the conductive frame a1, the plurality of electrode parts b2 are welded on the plurality of conductive pillars a3; finally, a package c is provided, and the package c is wrapped around the chip b1 and the plurality of conductive pillars a3, and then the package c is exposed By removing the board a2, a common single crystal packaging process is completed.

However, the above-mentioned single crystal packaging process has the following shortcomings. First, the chip b1 needs to be removed before the board a2 can be detected. Therefore, when the chip b1 has a poor connection, it will be recycled because the chip b1 has been covered by the package c. Secondly, during the welding process, the solder ball easily rolls off the top of the conductive pillar a3, causing welding inconvenience; thirdly, the board a2 needs to be removed in the later stage of the single crystal packaging process, making the process steps cumbersome and complicated.

In view of this, the inventor has devoted himself to research on the above-mentioned existing technology and cooperated with the application of academic theory to try his best to solve the above-mentioned problems, which has become the development goal of the inventor.

The present invention provides a preformed conductive pillar structure and a manufacturing method thereof. The preformed conductive pillar structure is used to encapsulate the conductive pillars, and both ends of the conductive pillars are exposed to the package body, so as to achieve the simple process steps in the latter part of the single crystal packaging process. The advantages of shortening and improving the yield of finished products.

In an embodiment of the present invention, the present invention provides a preformed conductive pillar structure, including: a plurality of conductive pillars, which are arranged upright and spaced apart from each other; and a package body covering the outside of the plurality of conductive pillars, the package body having A top surface and a bottom surface, one end of each conductive pillar is exposed on the top surface and the other end is exposed on the bottom surface.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive pillar structure. The steps include: a) providing a metal plate body and etching the metal plate body so that the metal plate body is Forming an etched surface and a plurality of metal pillars remaining on the etched surface; and b) encapsulating the metal plate body so that a package body is combined with the metal plate body, and the package body covers the metal plate body The etched surface and the outer peripheral surface of the plurality of metal pillars, each metal pillar has an end surface exposed at one end and flush with the top surface of the package.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive pillar structure. The steps include: e) providing a first metal plate body and etching the first metal plate body so that the first metal plate body is etched. A metal plate body is formed with a first etched surface and a plurality of first metal pillars remaining on the first etched surface on one side; f) providing a second metal plate body and etching the second metal plate body , so that the second metal plate body forms a second etched surface on one side and a plurality of second metal pillars remaining on the second etched surface; g) combine the plurality of first metal pillars and the plurality of second metal pillars The pillars are stacked up and down, and one end of each first metal pillar is welded to one end of each second metal pillar; and h) encapsulating the first metal plate body and the second metal plate body to Let a package body be combined between the first metal plate body and the second metal plate body. The package body covers the first etched surface, the second etched surface, and the outer peripheral surface of the plurality of first metal pillars. and the outer peripheral surface of the plurality of second metal pillars.

Based on the above, the preformed conductive pillar structure of the present invention has the metal plate removed and the conductive pillar encapsulated, and both ends of the conductive pillar are exposed to the package body, so that the preformed conductive pillar structure can be shipped to the client for the later stage of the single crystal packaging process. The client does not need to remove the metal plate. It only brushes tin on the conductive pillars and can be directly welded to the chip, thereby achieving the advantages of simple and shortened process steps in the latter part of the single crystal packaging process.

Based on the above, the preformed conductive pillar structure of the present invention has removed the metal plate, so the conventional package can omit the steps of first packaging the chip and the plate and then removing the plate, so that the chip can be directly connected to the conductive pillar without being packaged. During welding and subsequent inspection of the wafer, if a defective chip connection occurs, the wafer can be recycled and remanufactured since it has not been encapsulated, thus improving the yield rate of the single crystal packaging process.

The detailed description and technical content of the present invention will be described below with reference to the drawings. However, the attached drawings are only for illustrative purposes and are not intended to limit the present invention.

Referring to FIGS. 2 to 8 , the present invention provides a first embodiment of a preformed conductive pillar structure and a manufacturing method thereof. The preformed conductive pillar structure 10 mainly includes a plurality of conductive pillars 1 and a package 2 .

As shown in Figure 2, the steps of the manufacturing method of the first embodiment of the preformed conductive pillar structure of the present invention are further described as follows; First, as shown in step a of Figure 2 and Figures 3 to 4, a metal plate is provided The body 11 is etched to form an etched surface 111 on one side of the metal plate body 11 and a plurality of metal pillars 112 remaining on the etched surface 111 . The metal plate body 11 can be made of copper, silver, gold and other conductive metals, so that the metal pillar 112 can be made of copper, silver, gold and other conductive metals.

Second, as shown in step b of Figure 2 and Figures 5 to 6, the metal plate body 11 is packaged so that a package body 2 is combined with the metal plate body 11, and the package body 2 covers the etched surface 111 With the outer peripheral surface 113 of the plurality of metal pillars 112 , each metal pillar 112 has an end surface 14 exposed at one end and flush with the top surface 21 of the package body 2 .

In addition, the material of the package 2 is polyimide (PI), dry film (Dry film), epoxy resin (Expoxy) or molding compound. The package 2 can be laminate or molded. (Molding) is formed on the metal plate body 11, but is not limited to the above.

Furthermore, before encapsulating the metal plate body 11 , the surface to be etched 111 and the outer peripheral surface 113 of the plurality of metal pillars 112 can be roughened first, so that the surface of the etched surface 111 and the outer peripheral surface 113 of the plurality of metal pillars 112 can be roughened. It is rough and easy to be stably combined with the package body 2, but this step is not necessary and can be retained or omitted according to the actual situation.

Third, as shown in step c of Figure 2 and Figures 7 to 8, the metal plate body 11 is removed, so that each metal pillar 112 has an exposed and flush bottom surface 22 of the package body 2 at the other end. One end face 14. In this way, the first embodiment of the preformed conductive pillar structure 10 is produced.

Each end surface 14 in this embodiment is a flat surface, but this is not a limitation. Each end surface 14 can also be etched to form a concave arc surface that is gradually depressed from the outer periphery to the center point.

As shown in Figures 7 to 8, it is the first embodiment of the preformed conductive pillar structure 10 of the present invention. The detailed description is as follows. A plurality of conductive pillars 1 are arranged upright and spaced side by side; the package 2 is wrapped around the plurality of conductive pillars 1. Externally, the package body 2 has a top surface 21 and a bottom surface 22 . One end of each conductive pillar 1 is exposed and flush with the top surface 21 and the other end is exposed and flush with the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a metal pillar 112 embedded in each through hole 23. Each metal pillar 112 has exposed and flush surfaces at both ends of the top surface 21 and the bottom surface 22. Since the metal pillars 112 are etched and formed on the two end surfaces 14 of the metal pillars 112 , the outer peripheral size of each metal pillar 112 gradually decreases from both ends toward the middle.

As shown in FIGS. 7 to 8 , in the usage state of the first embodiment of the preformed conductive pillar structure 10 of the present invention, the package 2 is used to cover the exterior of a plurality of conductive pillars 1 , and one end of each conductive pillar 1 is exposed and The other end is flush with the top surface 21 of the package body 2 and is exposed and flush with the bottom surface 22 of the package body 2 . In this way, the preformed conductive pillar structure 10 of the present invention has removed the metal plate body 11 and encapsulated the conductive pillar 1, and both ends of the conductive pillar 1 are exposed to the package body 2, so that the preformed conductive pillar structure 10 can be shipped to the customer for single ordering. In the later stage of the crystal packaging process, the client does not need to remove the metal plate 11, and only brushes tin on the conductive pillar 1 to be directly welded to the chip, so as to achieve the advantages of simple and shortened process steps in the later stage of the single crystal packaging process.

In addition, the preformed conductive pillar structure 10 of the present invention has removed the metal plate 11, so the conventional package can omit the steps of first packaging the chip and the plate, and then removing the plate, so that the chip can be directly connected to the conductor without being packaged. Column 1 is welded. When the chip is subsequently inspected and a defective chip connection occurs, the chip can be recycled and remanufactured because it has not been encapsulated, thereby improving the yield rate of the single-chip packaging process.

In addition, during the welding process, one end of the conductive pillar 1 in this embodiment is exposed and flush with the top surface 21 of the package body 2 and the other end is exposed and flush with the bottom surface 22 of the package body 2, so the solder ball is not easy to self-conduct from the conductive pillar. The end of 1 rolls down to achieve the effect of preformed conductive pillar structure 10 to facilitate welding.

Please refer to FIGS. 3 to 6 and 9 to 11 , which illustrate a second embodiment of the preformed conductive pillar structure and its manufacturing method according to the present invention. Further description is as follows.

The steps a to b of the manufacturing method of the second embodiment of the preformed conductive pillar structure of the present invention are the same as the steps a to b of the first embodiment of the preformed conductive pillar structure. The manufacturing method of the first and second embodiments of the preformed conductive pillar structure The method differs in the steps after step b.

After first going through steps a (shown in Figures 3 to 4) and b (shown in Figures 5 and 6) in Figure 9, and then step d and 10 and 11 in Figure 9, the metal The board body 11 is etched, so that each metal pillar 112 extends at the other end with an extension pillar 15 that is exposed and protrudes from the bottom surface 22 of the package body 2 . In this way, the second embodiment of the preformed conductive pillar structure 10 is produced.

In this embodiment, the end surface of each extension column 15 is a flat surface, but this is not a limitation. The end surface of each extension column 15 can also be etched to form a concave surface that is gradually depressed from the outer periphery to the center point. Arc surface.

As shown in Figures 10 and 11, it is the second embodiment of the preformed conductive pillar structure 10 of the present invention. The details are as follows. The package body 2 is wrapped around the outside of the plurality of conductive pillars 1. The package body 2 has a top surface 21 and a bottom surface. 22. One end of each conductive pillar 1 is exposed and flush with the top surface 21 and the other end is exposed and protrudes from the bottom surface 22.

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a metal pillar 112 embedded in each through hole 23. Each metal pillar 112 has an exposed end surface 14 at one end and is flush with the top surface 21. And an extension pillar 15 that is exposed and protrudes from the bottom surface 22 extends at the other end. Since the metal pillar 112 is etched and formed first, and the extension pillar 15 is etched and formed again, each metal pillar 112 gradually reduces its outer periphery from both ends toward the middle. In terms of size, each extension column 15 gradually reduces its outer peripheral size from both ends toward the middle. In this way, the same effect as the first embodiment of the preformed conductive pillar structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the metal plate body 11 is etched to extend an extension pillar 15 from one end of the metal pillar 112, thereby increasing the length of the conductive pillar 1, so that the preformed conductive pillar structure 10 has the function of extending the length of the conductive pillar 1.

Referring to FIGS. 12 to 17 , the present invention provides a third embodiment of a preformed conductive pillar structure and a manufacturing method thereof. The preformed conductive pillar structure 10 mainly includes a plurality of conductive pillars 1 and a package body 2 .

As shown in Figure 12, the steps of the manufacturing method of the third embodiment of the preformed conductive pillar structure of the present invention are further described as follows; First, as shown in step e of Figure 12 and Figure 13, a first metal plate body is provided 12. Perform an etching process on the first metal plate body 12 so that a first etched surface 121 and a plurality of first metal pillars 122 remaining on the first etched surface 121 are formed on one side of the first metal plate body 12 .

Second, as shown in step f of Figure 12 and Figures 14 and 15, a second metal plate body 13 is provided, and the second metal plate body 13 is etched, so that a second metal plate body 13 is formed on one side. The second etched surface 131 and the plurality of second metal pillars 132 remaining on the second etched surface 131 .

Third, as shown in step g of Figure 12 and Figures 14 and 15, the plurality of first metal pillars 122 and the plurality of second metal pillars 132 are stacked up and down, and one end of each first metal pillar 122 is connected to each other. One end of the second metal pillar 132 is welded.

Step g is described in detail as follows. First, brush tin on the ends of the plurality of second metal pillars 132, and then stack the plurality of first metal pillars 122 and the plurality of second metal pillars 132 up and down, and increase the ambient temperature to make each first metal One end of the pillar 122 and one end of each second metal pillar 132 are heated and melted by tin and then welded.

Fourth, as shown in step h of Figure 12 and Figure 16, the first metal plate body 12 and the second metal plate body 13 are packaged, so that a package body 2 is combined with the first metal plate body 12 and the second metal plate body 13. Between the metal plates 13 , the package 2 covers the first etched surface 121 , the second etched surface 131 , the outer peripheral surfaces 123 of the plurality of first metal pillars 122 and the outer peripheral surfaces 133 of the plurality of second metal pillars 132 .

In addition, the material of the package 2 is polyimide (PI), dry film (Dry film), epoxy resin (Expoxy) or molding compound. The package 2 can be laminate or molded. (Molding) is formed between the first metal plate body 12 and the second metal plate body 13, but is not limited to the above.

Furthermore, before encapsulating the first metal plate body 12 and the second metal plate body 13, the first etched surface 121, the second etched surface 131, the outer peripheral surface 123 of the plurality of first metal pillars 122 and The outer peripheral surface 133 of the plurality of second metal pillars 132 undergoes surface roughening treatment, so that the first etched surface 121 , the second etched surface 131 , the outer peripheral surface 123 of the plurality of first metal pillars 122 and the outer periphery of the plurality of second metal pillars 132 The surface 133 has a rough surface and is easy to be stably combined with the package body 2, but this step is not necessary and can be retained or omitted depending on the actual situation.

Fifth, as shown in step i of Figure 12 and Figure 17, the first metal plate body 12 and the second metal plate body 13 are removed, so that each first metal pillar 122 and each second metal pillar 132 The other end has two end surfaces 14' that are exposed and flush with the top surface 21 and the bottom surface 22 of the package body 2. In this way, the third embodiment of the preformed conductive pillar structure 10 is produced.

Each end surface 14' of this embodiment is a flat surface, but this is not a limitation. Each end surface 14' can also be etched to form a concave arc surface that is gradually depressed from the outer periphery to the center point.

As shown in Figure 17, it is the third embodiment of the preformed conductive pillar structure 10 of the present invention. The detailed description is as follows. The package body 2 is wrapped around a plurality of conductive pillars 1. The package body 2 has a top surface 21 and a bottom surface 22. Each One end of a conductive pillar 1 is exposed and flush with the top surface 21 and the other end is exposed and flush with the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a first metal pillar 122 and a second metal pillar 132 embedded in each through hole 23 and welded on top and bottom. The pillar 122 and the second metal pillar 132 have two end surfaces 14' that are exposed and flush with the top surface 21 and the bottom surface 22 at the two ends that are far away from each other. Since the first metal pillar 122 and the second metal pillar 132 are etched and shaped, each A first metal pillar 122 gradually reduces its outer peripheral size from both ends toward the middle, and each second metal pillar 132 gradually reduces its outer peripheral size from both ends toward the middle. In this way, the same effect as the first embodiment of the preformed conductive pillar structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal pillar 122 and the second metal pillar 132 are overlapped and welded up and down, thereby increasing the length of the conductive pillar 1 , so that the preformed conductive pillar structure 10 has the function of extending the length of the conductive pillar 1 .

Please refer to FIGS. 13 to 16 and 18 to 20 , which are the fourth embodiment of the preformed conductive pillar structure of the present invention and its manufacturing method. Further description is as follows.

The steps e to h of the manufacturing method of the fourth embodiment of the preformed conductive pillar structure of the present invention are the same as the steps e to h of the third embodiment of the preformed conductive pillar structure. The manufacturing method of the third and fourth embodiments of the preformed conductive pillar structure The method differs in the steps after step h.

First go through step e (shown in Figure 13), step f (shown in Figure 14 to Figure 15), step g (shown in Figure 14 to Figure 16), and step h (shown in Figure 16) of Figure 18 Afterwards, as shown in step j of FIG. 18 and FIGS. 19 to 20 , the first metal plate body 12 and the second metal plate body 13 are etched, so that each first metal pillar 122 and each second metal plate body are etched. The metal pillar 132 extends from the other end to two exposed extending pillars 15 ′ that protrude from the top surface 21 and the bottom surface 22 of the package body 2 . In this way, the fourth embodiment of the preformed conductive pillar structure 10 is produced.

Among them, the end surface of each extension column 15' in this embodiment is a plane, but this is not a limitation. The end surface of each extension column 15' can also be etched to form a gradually concave shape from the outer periphery to the center point. A concave arc surface.

As shown in Figures 10 and 11, it is the fourth embodiment of the preformed conductive pillar structure 10 of the present invention. The detailed description is as follows. The package body 2 is wrapped around a plurality of conductive pillars 1. The package body 2 has a top surface 21 and a bottom surface. 22. One end of each conductive pillar 1 is exposed and protrudes from the top surface 21 and the other end is exposed and protrudes from the bottom surface 22.

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a first metal pillar 122 and a second metal pillar 132 embedded in each through hole 23 and welded on top and bottom. The pillar 122 and the second metal pillar 132 have two exposed extending pillars 15' extending from the two ends far away from each other and protruding from the top surface 21 and the bottom surface 22. Since the first metal pillar 122 and the second metal pillar 132 are etched and formed first, The extension pillars 15' are then etched and shaped, so that each first metal pillar 122 gradually reduces its outer peripheral size from both ends toward the middle, and each second metal pillar 132 gradually reduces its outer peripheral size from both ends toward the middle. 15' Gradually reduce the size of the outer periphery from both ends toward the middle. In this way, the same effect as the third embodiment of the preformed conductive pillar structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal pillar 122 and the second metal pillar 132 are overlapped and welded, and the first metal plate body 12 and the second metal plate body 13 are etched to form a gap between the first metal pillar 122 and the second metal plate body. Two extension pillars 15 extend from both ends of the pillar 132, thereby increasing the length of the conductive pillar 1, so that the preformed conductive pillar structure 10 has the function of extending the length of the conductive pillar 1.

Please refer to FIGS. 13 to 16 and 21 to 22 , which are the fifth embodiment of the preformed conductive pillar structure of the present invention and its manufacturing method. Further description is as follows.

The steps e to h of the manufacturing method of the fifth embodiment of the preformed conductive pillar structure of the present invention are the same as the steps e to h of the third embodiment of the preformed conductive pillar structure. The manufacturing method of the third and fifth embodiments of the preformed conductive pillar structure The method differs in the steps after step h.

First go through step e (shown in Figure 13), step f (shown in Figure 14 to Figure 15), step g (shown in Figure 14 to Figure 16), and step h (shown in Figure 16) of Figure 21 Afterwards, as shown in step k of FIG. 21 and FIG. 22 , one of the first metal plate body 12 and the second metal plate body 13 is removed and the other is etched, so that each first metal plate body 12 is etched. The metal pillar 122 and each second metal pillar 132 have at the other end an end surface 14' that is exposed and flush with one of the top surface 21 and the bottom surface 22 of the package body 2 and an exposed top surface that protrudes from the package body 2 21 and an extension column 15' of the other one of the bottom surface 22. In this way, the fifth embodiment of the preformed conductive pillar structure 10 is produced.

Each end surface 14' of this embodiment is etched to form a concave arc surface that is gradually depressed from the outer periphery to the center point. However, this is not a limitation. Each end surface 14' can also be a plane; each extension The end surface of the column 15' is etched to form a concave arc surface that is gradually depressed from the outer periphery to the center point. However, this is not a limitation. The end surface of each extended column 15' can also be a flat surface.

As shown in Figure 22, it is the fifth embodiment of the preformed conductive pillar structure 10 of the present invention. The detailed description is as follows. The package body 2 is wrapped around a plurality of conductive pillars 1. The package body 2 has a top surface 21 and a bottom surface 22. Each One end of a conductive pillar 1 is exposed and flush with one of the top surface 21 and the bottom surface 22 , and the other end is exposed and protrudes from the other of the top surface 21 and the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23. Each conductive pillar 1 includes a first metal pillar 122 and a second metal pillar 132 embedded in each through hole 23 and welded on top and bottom. The column 122 and the second metal column 132 have an end surface 14' exposed and flush with one of the top surface 21 and the bottom surface 22 at one end far away from each other, and an exposed end surface 14' protruding from the top surface 21 and the bottom surface 22 at the other end. One of the extension pillars 15', because the first metal pillar 122 and the second metal pillar 132 are etched and formed first, and the extension pillar 15' is etched and formed again, so each first metal pillar 122 gradually shrinks from both ends toward the middle. Regarding the outer peripheral size, each second metal column 132 gradually reduces the outer peripheral size from both ends toward the middle, and each extension column 15' gradually decreases the outer peripheral size from both ends toward the middle. In this way, the same effect as the third embodiment of the preformed conductive pillar structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal pillar 122 and the second metal pillar 132 are overlapped and welded up and down, and the first metal plate body 12 or the second metal plate body 13 is etched and the first metal pillar 122 or the second metal plate body is etched. An extension column 15' extends from one end of the column 132, thereby increasing the length of the conductive column 1, so that the preformed conductive column structure 10 has the function of extending the length of the conductive column 1.

As shown in Figure 23, it is the sixth embodiment of the preformed conductive pillar structure 10 of the present invention. The sixth embodiment of the preformed conductive pillar structure 10 is substantially the same as the second embodiment of the preformed conductive pillar structure 10. The preformed conductive pillar structure 10 is The differences between the sixth embodiment of the pillar structure 10 and the second embodiment of the preformed conductive pillar structure 10 are further described as follows.

By etching different parts of the metal plate body 11 with different parameters, a part of the metal post 112 extends to an exposed extension post 15 protruding from the bottom surface 22 of the package 2 at the other end, and the other part of the metal post 112 is at The other end has an end surface 14 that is exposed and flush with the bottom surface 22 of the package body 2 . Thereby, the positions of the end face 14 and the extension pillar 15 are arranged in accordance with the chip, thereby enhancing the ability of the preformed conductive pillar structure 10 of the present invention to connect with the chip.

Similarly, referring to FIGS. 19 to 20 and 22 , different parts of the first metal plate body 12 or the second metal plate body 13 can also be etched with different parameters to make the first metal pillar 122 The other end has an exposed end surface 14' flush with the top surface 21 of the package body 2 or an extension post 15' protruding from the top surface 21 of the package body 2. The second metal post 132 has an exposed end surface 14' flush with the top surface 21 of the package body 2 at the other end. The end surface 14' of the bottom surface 22 of the package body 2 or the extending pillar 15' protruding from the bottom surface 22 of the package body 2. Thereby, the position of the end surface 14' or the extension pillar 15' is arranged in accordance with the chip, thereby enhancing the ability of the preformed conductive pillar structure 10 of the present invention to connect with the chip.

To sum up, the preformed conductive pillar structure and its manufacturing method of the present invention have never been seen in similar products and are publicly used. It is industrially applicable, novel and progressive, and fully meets the patent application requirements. It is proposed in accordance with the patent law. To apply, please check carefully and grant the patent in this case to protect the rights of the inventor.

〈Knowledge〉 a1: conductive frame a2: plate body a3: conductive pillar b1:wafer b2:Electrode part c: package <The present invention> 10: Preformed conductive pillar structure 1: Conductive pillar 11:Metal plate body 111: Etched surface 112:Metal pillar 113: Outer peripheral surface 12: First metal plate body 121: The first etched surface 122:The first metal pillar 123:Outer peripheral surface 13: Second metal plate body 131: The second etched surface 132:Second metal pillar 133:Outer peripheral surface 14, 14’: end face 15, 15’: extension column 2:Package 21:Top surface 22: Bottom surface 23:Through hole a~k: steps

Figure 1 is an assembled cross-sectional view of a conventional single crystal package.

Figure 2 is a step flow chart of the first manufacturing method of the preformed conductive pillar structure of the present invention.

Figure 3 is a perspective view of the metal plate body of the present invention formed with an etched surface and a plurality of metal pillars.

Figure 4 is a cross-sectional view of the metal plate body of the present invention formed with an etched surface and a plurality of metal pillars.

Figure 5 is a perspective view of the package of the present invention combined with a metal plate.

Figure 6 is a cross-sectional view of the package of the present invention combined with a metal plate.

Figure 7 is a perspective view of the first embodiment of the preformed conductive pillar structure of the present invention.

Figure 8 is a cross-sectional view of the first embodiment of the preformed conductive pillar structure of the present invention.

Figure 9 is a step flow chart of the second manufacturing method of the preformed conductive pillar structure of the present invention.

Figure 10 is a perspective view of the second embodiment of the preformed conductive pillar structure of the present invention.

Figure 11 is a cross-sectional view of the second embodiment of the preformed conductive pillar structure of the present invention.

Figure 12 is a step flow chart of the third manufacturing method of the preformed conductive pillar structure of the present invention.

Figure 13 is a perspective view of the first metal plate body of the present invention formed with a first etched surface and a plurality of first metal pillars.

Figure 14 is a perspective view of one end of each first metal pillar and one end of each second metal pillar welded according to the present invention.

Figure 15 is a cross-sectional view of one end of each first metal pillar and one end of each second metal pillar welded according to the present invention.

Figure 16 is a cross-sectional view of the package of the present invention combined between the first metal plate body and the second metal plate body.

Figure 17 is a cross-sectional view of the third embodiment of the preformed conductive pillar structure of the present invention.

Figure 18 is a step flow chart of the fourth manufacturing method of the preformed conductive pillar structure of the present invention.

Figure 19 is a perspective view of the fourth embodiment of the preformed conductive pillar structure of the present invention.

Figure 20 is a cross-sectional view of the fourth embodiment of the preformed conductive pillar structure of the present invention.

Figure 21 is a step flow chart of the fifth manufacturing method of the preformed conductive pillar structure of the present invention.

Figure 22 is a cross-sectional view of the fifth embodiment of the preformed conductive pillar structure of the present invention.

Figure 23 is a perspective view of the sixth embodiment of the preformed conductive pillar structure of the present invention.

10: Preformed conductive pillar structure

14:End face

2:Package

21:Top surface

23:Through hole

Claims (16)

A preformed conductive pillar structure including: A plurality of conductive pillars, arranged upright and spaced side by side; and A package body covers the outside of the plurality of conductive pillars. The package body has a top surface and a bottom surface. One end of each conductive pillar is exposed on the top surface and the other end is exposed on the bottom surface. The preformed conductive pillar structure as claimed in claim 1, wherein the package is provided with a plurality of through holes, each of the conductive pillars includes a metal pillar embedded in each of the through holes, and each of the metal pillars has a The two end surfaces of each metal column are exposed and flush with the top surface and the bottom surface, and the outer peripheral size of each metal column gradually decreases from the two ends toward the middle. The preformed conductive pillar structure as claimed in claim 1, wherein the package is provided with a plurality of through holes, each of the conductive pillars includes a metal pillar embedded in each of the through holes, and each of the metal pillars has an exposed There is an extension column that is exposed and protrudes from the bottom surface and is flush with one end of the top surface and extends from the other end. Each metal column gradually reduces its outer peripheral size from both ends toward the middle. Each extension column extends from both ends. The outer circumferential size gradually decreases towards the middle. The preformed conductive pillar structure as claimed in claim 1, wherein the package is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar embedded in each of the through holes and overlapped and welded upper and lower; A second metal pillar. The first metal pillar and the second metal pillar have two end surfaces that are exposed and flush with the top surface and the bottom surface at the two ends that are far away from each other. Each first metal pillar faces from both ends. The outer peripheral size is gradually reduced in the middle, and the outer peripheral size of each second metal column is gradually reduced from both ends toward the middle. The preformed conductive pillar structure as claimed in claim 1, wherein the package is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar embedded in each of the through holes and overlapped and welded upper and lower; A second metal pillar, the first metal pillar and the second metal pillar have two exposed extending pillars extending from the two ends that are far away from each other and protruding from the top surface and the bottom surface. Each of the first metal pillars extends from both ends. The outer peripheral size is gradually reduced toward the middle. Each second metal column is gradually reduced in outer peripheral size from both ends toward the middle. Each extension column is gradually reduced in outer peripheral size from both ends toward the middle. The preformed conductive pillar structure as claimed in claim 1, wherein the package is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar embedded in each of the through holes and overlapped and welded upper and lower; A second metal pillar, the first metal pillar and the second metal pillar have an end surface that is exposed and flush with one of the top surface and the bottom surface at the ends far away from each other, and the other end has an exposed end surface that protrudes from the An extension column of the other one of the top surface and the bottom surface, each first metal column gradually reduces the outer peripheral size from both ends toward the middle, and each second metal column gradually reduces the outer peripheral size from both ends toward the middle, Each extension column gradually reduces its outer peripheral size from both ends toward the middle. The preformed conductive pillar structure as described in claim 2, 3, 4 or 6, wherein each end surface is a flat surface or a concave arc surface that is gradually depressed from the outer peripheral edge to the center point. The preformed conductive pillar structure as described in claim 3, 5 or 6, wherein the end surface of each extension pillar is a flat surface or a concave arc surface that is gradually depressed from the outer periphery to the center point. A method for manufacturing a preformed conductive pillar structure, the steps include: a) Provide a metal plate body and perform an etching process on the metal plate body so that the metal plate body forms an etched surface on one side and a plurality of metal pillars remaining on the etched surface; and b) Encapsulate the metal plate body so that a package body is combined on the metal plate body. The package body covers the etched surface and the outer peripheral surface of the plurality of metal pillars. Each metal pillar has a One end surface is exposed and flush with the top surface of the package. The manufacturing method of the preformed conductive pillar structure as described in claim 9 further includes, in step c) after step b), removing the metal plate body so that each metal plate The pillar has an exposed end surface at the other end and is flush with the bottom surface of the package. The manufacturing method of the preformed conductive pillar structure as described in claim 9 further includes, in step d) after step b), etching the metal plate body so that each metal plate The other end of the pillar is extended with an extension pillar that is exposed and protrudes from the bottom surface of the package. A method for manufacturing a preformed conductive pillar structure, the steps include: e) Provide a first metal plate body, and perform an etching process on the first metal plate body so that a first etched surface is formed on one side of the first metal plate body and a plurality of elements remaining on the first etched surface The first metal pillar; f) Provide a second metal plate body, and perform an etching process on the second metal plate body so that a second etched surface is formed on one side of the second metal plate body and a plurality of elements remaining on the second etched surface second metal pillar; g) Stack the plurality of first metal pillars and the plurality of second metal pillars on top and bottom, and weld one end of each first metal pillar to one end of each second metal pillar; and h) Encapsulate the first metal plate body and the second metal plate body, so that a package body is combined between the first metal plate body and the second metal plate body, and the package body covers the first metal plate body An etched surface, the second etched surface, the outer peripheral surfaces of the plurality of first metal pillars and the outer peripheral surfaces of the plurality of second metal pillars. The manufacturing method of the preformed conductive pillar structure as described in claim 12, further comprising a step i) after step h), in step i), performing a step on the first metal plate body and the second metal plate body. The removal process is performed so that each first metal pillar and each second metal pillar have two end surfaces at the other end that are exposed and flush with the top surface and bottom surface of the package. The manufacturing method of the preformed conductive pillar structure as described in claim 12, further includes a step j) after step h), step j), performing a step on the first metal plate body and the second metal plate body. The etching process is performed so that each first metal pillar and each second metal pillar extend at the other end with two extension pillars that are exposed and protrude from the top and bottom surfaces of the package. The manufacturing method of the preformed conductive pillar structure as described in claim 12, further includes a step k) after step h). In step k), the first metal plate body and the second metal plate body are One of them is removed and the other is etched, so that each of the first metal pillars and each of the second metal pillars has an exposed and flush surface on the top and bottom surfaces of the package at the other end. One end surface of one and an extending pillar that is exposed and protrudes from the other one of the top surface and the bottom surface of the package. The manufacturing method of the preformed conductive pillar structure as described in claim 12, wherein in step g), tin is first brushed on the ends of the plurality of second metal pillars, and then the plurality of first metal pillars and the plurality of second metal pillars are The top and bottom are stacked together, and the ambient temperature is raised, so that one end of each first metal column and one end of each second metal column are heated and melted through tin and then welded.

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