TWI807622B - 描繪裝置、描繪方法以及程式產品 - Google Patents

描繪裝置、描繪方法以及程式產品 Download PDF

Info

Publication number
TWI807622B
TWI807622B TW111103800A TW111103800A TWI807622B TW I807622 B TWI807622 B TW I807622B TW 111103800 A TW111103800 A TW 111103800A TW 111103800 A TW111103800 A TW 111103800A TW I807622 B TWI807622 B TW I807622B
Authority
TW
Taiwan
Prior art keywords
substrate
aforementioned
area
autofocus
pattern
Prior art date
Application number
TW111103800A
Other languages
English (en)
Chinese (zh)
Other versions
TW202248771A (zh
Inventor
坂本道昭
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202248771A publication Critical patent/TW202248771A/zh
Application granted granted Critical
Publication of TWI807622B publication Critical patent/TWI807622B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Recording Or Reproduction (AREA)
  • Container Filling Or Packaging Operations (AREA)
TW111103800A 2021-02-25 2022-01-28 描繪裝置、描繪方法以及程式產品 TWI807622B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021028763A JP2022129897A (ja) 2021-02-25 2021-02-25 描画装置、描画方法およびプログラム
JP2021-028763 2021-02-25

Publications (2)

Publication Number Publication Date
TW202248771A TW202248771A (zh) 2022-12-16
TWI807622B true TWI807622B (zh) 2023-07-01

Family

ID=82975832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111103800A TWI807622B (zh) 2021-02-25 2022-01-28 描繪裝置、描繪方法以及程式產品

Country Status (4)

Country Link
JP (1) JP2022129897A (ko)
KR (1) KR20220121697A (ko)
CN (1) CN114967378A (ko)
TW (1) TWI807622B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014041824A1 (ja) * 2012-09-14 2014-03-20 大日本スクリーン製造株式会社 パターン描画装置、パターン描画方法
TW202001323A (zh) * 2018-06-25 2020-01-01 日商Ｖ科技股份有限公司 曝光裝置及高度調整方法
WO2020059256A1 (ja) * 2018-09-21 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
WO2020085037A1 (ja) * 2018-10-22 2020-04-30 株式会社Ｓｃｒｅｅｎホールディングス 描画方法および描画装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014041824A1 (ja) * 2012-09-14 2014-03-20 大日本スクリーン製造株式会社 パターン描画装置、パターン描画方法
TW202001323A (zh) * 2018-06-25 2020-01-01 日商Ｖ科技股份有限公司 曝光裝置及高度調整方法
WO2020059256A1 (ja) * 2018-09-21 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
WO2020085037A1 (ja) * 2018-10-22 2020-04-30 株式会社Ｓｃｒｅｅｎホールディングス 描画方法および描画装置

Also Published As

Publication number Publication date
KR20220121697A (ko) 2022-09-01
JP2022129897A (ja) 2022-09-06
CN114967378A (zh) 2022-08-30
TW202248771A (zh) 2022-12-16

Similar Documents

Publication Publication Date Title
KR100875008B1 (ko) 노광장치 및 디바이스 제조방법
EP1921506A2 (en) Position Detecting Method and Device, Patterning Device, and Subject to be detected
JP4486323B2 (ja) 画素位置特定方法、画像ずれ補正方法、および画像形成装置
JP4676205B2 (ja) 露光装置および露光方法
KR20080072535A (ko) 패턴 형성 장치 및 방법
KR101146965B1 (ko) 노광 디바이스, 노광 방법, 및 반도체 디바이스를 제조하는 방법
JP2008015314A (ja) 露光装置
TWI807622B (zh) 描繪裝置、描繪方法以及程式產品
JP2009246165A (ja) 露光装置
JP2008058477A (ja) 描画装置
KR101588946B1 (ko) 묘화 장치 및 묘화 방법
US11397384B2 (en) Signal recognition during substrate patterning via digital photolithography
JP2006315086A (ja) レーザ加工装置及びレーザ加工方法
JP2008046457A (ja) 描画装置
JP2006315085A (ja) レーザ加工装置
JP2014052403A (ja) 描画露光方法
KR20220031085A (ko) 증착 머신용 기판 포지셔닝
JP2009145494A (ja) 焦点位置検出方法および描画装置
JP2009237255A (ja) 露光装置、及び露光方法
KR102696053B1 (ko) 묘화 시스템, 묘화 방법, 및 기억 매체에 기록된 프로그램
KR20240078331A (ko) 위치 검출 장치, 묘화 장치, 위치 검출 방법 및 기록 매체에 기록된 프로그램
JP3967330B2 (ja) レーザ加工装置及びレーザ加工方法
JP2024041379A (ja) 描画装置
JP2024032060A (ja) 露光装置および露光方法
KR20230031140A (ko) 묘화 장치 및 묘화 방법