TWI804085B - Resin Encapsulation Device - Google Patents

Abstract

The present invention provides a resin sealing device capable of collectively replacing a plurality of containers from which liquid resin is ejected. A resin encapsulation device (1) for encapsulating a work piece with resin includes a resin supply module (2) for a press set for clamping the work piece, pressurizing it and molding it into shape. The plurality of tanks ( 64 ) of the molding die ( 60 ) of the module ( 6 ) are supplied with liquid resin from the same number of resin supply ports ( 54 ). The resin supply module (2) includes: a container unit (40), which can be replaced collectively; and a piping member (50), which supplies liquid resin from the container unit (40) to the resin supply port (54). The container unit (40) includes: a plurality of containers (44) capable of ejecting liquid resin; and a holder (43) holding the plurality of containers. The container unit (40) is configured such that piping members (50) can be collectively connected to and disconnected from respective discharge ports (45) of a plurality of containers (44).

Description

Resin Encapsulation Device

The present invention relates to a resin packaging device using liquid resin.

There is known a device that can perform transfer molding using a liquid resin. For example, Patent Document 1 discloses a resin molding device including: a press device for performing transfer molding; and a resin supply device for supplying liquid resin to a tank of the press device. The resin supply includes the same number of syringes as tanks.

[Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-101517

In the flow path from the syringe to the tank, the resin adheres during the molding process and the pressure loss gradually changes. It is assumed that, in the case of a structure in which liquid resin is dispensed from a single or a small number of syringes to multiple tanks, due to insufficient supply in a flow path with a larger pressure loss than other flow paths, or in a flow path with a smaller pressure loss than other flow paths Since there is an excess supply in the tank, the amount of resin supplied to the tank tends to vary.

In the case of the resin supply device disclosed in Patent Document 1, since the same number of syringes as tanks are used, liquid resin can be equally supplied to a plurality of tanks. On the other hand, Patent Document 1 The resin supply device disclosed in uses a plurality of syringes. Therefore, in replenishing the resin supply device with liquid resin, the operator must fill the plurality of syringes with liquid resin individually. Replenishment work takes time, and the time during which the resin molding device is stopped becomes longer, thereby reducing productivity.

Therefore, an object of the present invention is to provide a resin sealing device capable of collectively replacing a plurality of containers from which liquid resin is discharged.

A resin sealing device according to an aspect of the present invention is a resin sealing device for sealing a work with resin. The resin encapsulation device includes a resin supply module that supplies resin from the same number of resin supply ports to a plurality of tanks provided in a molding die of a press module that clamps a workpiece, pressurizes it, and molds it into shape. Supply liquid resin. The resin supply module includes: a container unit, which can be replaced in a batch; and a pipeline member, which supplies liquid resin from the container unit to the resin supply port. The container unit includes: a plurality of containers capable of ejecting liquid resin; and a holder holding the plurality of containers. It is configured so that the piping members can be collectively connected to each of the discharge ports of the plurality of containers and can be disconnected collectively.

According to this aspect, the piping member can be collectively connected/disconnected to the plurality of containers held by the holder of the container unit, and the plurality of containers can be detached for each container unit. For example, by preparing a container unit filled with liquid resin in advance and replacing it with an empty container unit, the replenishment operation can be performed quickly. In the supplementary work, the stop time of the resin sealing device is shortened, and the productivity is improved. In addition, since the liquid resin can be filled into each container in a state detached from the resin sealing device, the operator does not need to squat down or take a restrained posture suitable for the device. Workability is improved to reduce the burden on the operator.

In the above form, a row of multiple tanks and the same number of resin supply ports may also be used. The rows are one row or two rows, and the arrangement of the plurality of containers is the same as the arrangement of the resin supply ports.

According to this aspect, it is easy to design the flow paths from the ejection port to the resin supply port to have equal lengths. However, even if the arrangement of the plurality of containers and the plurality of resin supply ports is different, each flow path can be designed to have an equal length, and the arrangement of the containers is not limited to the same arrangement as that of the resin supply ports.

In the above aspect, it may further include a container accommodating portion configured to allow attachment and detachment of the container unit by sliding the container unit along the direction in which the plurality of containers are arranged.

According to this aspect, it is easy to take out the container unit from the container accommodating part, and therefore it is excellent in workability.

In the above-mentioned form, it is also possible to further include an elevating mechanism that lifts and lowers the container accommodating part and the piping member separately, and is configured to be adjusted by raising the container accommodating part and/or descending the piping member. A plurality of containers can be collectively connected to the piping member, and the connection between the plurality of containers and the piping member can be disconnected collectively by lowering the container accommodating portion and/or raising the piping member.

According to this aspect, since the distance between the container housing part and the piping member can be adjusted freely, the flow paths can be collectively connected by bringing the two closer together, and can be collectively disconnected by separating the two.

In the above-mentioned form, it may further include two press die sets, the two press die sets are arranged at a distance from each other, and the resin supply die set is arranged so as to be sandwiched between the two press die sets.

According to this aspect, since the resin supply module is arranged on the shortest path connecting the two press modules, the resin supply port can be used to supply liquid resin to the tank of one of the press modules. Afterwards, the time for moving to supply the liquid resin to the tank of another pressing die set is minimized. The resin encapsulation device can be operated efficiently and productivity can be improved.

According to the present invention, it is possible to provide a resin sealing device capable of collectively replacing a plurality of containers from which liquid resin is discharged.

1: Resin encapsulation device

2: Resin supply module

3: Supply box

4: Workpiece supply module

5: Loader

6, 6L, 6R: pressing module

7: Unloader

8: To scrap machine

9: Workpiece storage module

10: Storage box

20: base

21: Advance and retreat mechanism

22: guide rail

23: Slider

24: Rotary mechanism

25: waste liquid cup

30: Lifting mechanism

31: Pillar

32: The first lifting part

33: The second lifting part

34: The third lifting part

35: Pipeline containment department

36: Container Containment

37: plunger

38: Temperature adjustment mechanism

40: container unit

43: Holder

44: container

45: Jet outlet

50: Piping components

54: Resin supply port

55: Connector

56: pinch valve

60: Molding mold (mold)

61: Lower mold

62: upper mold

63: plunger

64: tank

65: Picking pool

66: cavity

70: Press mechanism

71: movable platen

72: fixed platen

73: Tie rod

74: shutter

361: Guide shape department

431: control department

611: central block

612:Embed block

613: end block

D: Arrangement direction

W, W': workpiece

FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention.

Fig. 2 is an enlarged plan view showing a resin supply module and a pressing module shown in Fig. 1 .

Fig. 3 is a side view of the pressing die shown in Fig. 2 viewed from the operator's side.

Fig. 4 is a side view illustrating the operation of the resin supply module according to the present embodiment moving among a plurality of press modules to supply liquid resin.

Fig. 5 is a continuation of Fig. 4 and is a side view illustrating the operation of the resin supply module.

Fig. 6 is a continuation of Fig. 5 and is a side view illustrating the operation of the resin supply module.

FIG. 7 is a perspective view showing an example of a resin supply module according to this embodiment.

Fig. 8 is a perspective view partially transparently showing the container accommodating portion shown in Fig. 7 .

Fig. 9 is a cross-sectional view showing the internal structure of the tube accommodating portion shown in Fig. 7 .

Preferred embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, Parts marked with the same symbol have the same or the same structure. Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing an example of a resin sealing device 1 according to an embodiment of the present invention.

The resin sealing device 1 of the present embodiment is a resin sealing device for sealing a workpiece W with resin, and includes at least a resin supply module 2 as shown in FIG. 1 . In this embodiment, a workpiece supply module 4, a loader 5, a pressing module 6, an unloader 7, a degater 8, a workpiece storage module 9, and the like may be further included as arbitrary configurations.

The workpiece supply module 4 takes out the workpiece W before resin sealing from the supply magazine 3 and supplies it to the loader 5 . The loader 5 transfers the workpiece W supplied from the workpiece supply module 4 to the mold (molding mold) 60 of the press module 6 . The press die unit 6 clamps and presses the supplied work W, and encapsulates it with resin (molding).

The unloader 7 takes out the resin-encapsulated workpiece W′ from the mold 60 and transports it to the scrap remover 8 . The waste remover 8 separates useless resin from the resin-encapsulated workpiece W′. The workpiece storage module 9 receives the workpiece W′ from which unnecessary resin has been separated from the waste removal machine 8 and stores it in the storage magazine 10 .

FIG. 2 is an enlarged plan view showing the resin supply module 2 and the pressing module 6 shown in FIG. 1 . As shown in FIG. 2 , at least one pressing module 6 is disposed around the resin supply module 2 . In the illustrated example, the resin supply module 2 is arranged so as to be sandwiched between two press modules 6L and 6R arranged at a distance from each other, and a guide rail 22 described later is provided from one of the press modules 6L and 6R. Laying towards the other.

The press die unit 6 performs resin encapsulation (molding) of the work W by transfer molding in which the resin supplied to the tank 64 in the mold 60 is filled into the cavity 66 by the plunger 63 and cured. In the illustrated example, the lower mold 61 constituting the lower half of the mold 60 includes a The center block 611 in the center, the insert block 612 arranged to sandwich the center block 611 from left and right, and the end blocks 613 surrounding the center block 611 and the insert block 612 from four sides. The workpiece W is placed on the insert block 612 . On the central block 611 are provided a plurality of tanks 64 for receiving resin. The structure of the mold 60 is not limited to the illustrated example, and various structures can be appropriately selected.

The resin supply module 2 supplies thermosetting liquid resin to a plurality of tanks 64 provided in the mold 60 . The liquid resin is, for example, a composition of silicone-based resin or epoxy-based resin, and when cured by transfer molding or the like, it exhibits excellent encapsulation properties. As shown in FIG. 2 , the resin supply module 2 includes the same number of resin supply ports 54 as the tanks 64 of the mold 60 .

In order to reduce the useless resin removed by the scrap remover 8, the arrangement of the plurality of tanks 64 is preferably a multi-plunger structure in one or two rows. The resin supply module 2 includes a container unit 40 and a piping member 50 for supplying liquid resin from the container unit 40 to the resin supply port 54 . The container unit 40 includes a plurality of containers 44 capable of ejecting liquid resin.

In order to make the lengths of the plurality of piping members 50 equal, the arrangement of the plurality of containers 44 is preferably the same as the arrangement of the plurality of resin supply ports 54 . In the illustrated example, four tanks 64 are arranged in a row at equal intervals along the longitudinal direction of the central block 611, and the same number of resin supply ports 54 as the tanks 64 are arranged in a row at the same pitch (distance between centers) as the tanks 64. configuration. However, the arrangement of the tanks 64 is not limited to the illustrated example, and may be set in two rows, or three or more rows. Alternatively, a zigzag arrangement may be used.

FIG. 3 is a side view of the pressing die set 6 shown in FIG. 2 viewed from the operator side. As shown in FIG. 3 , the press die set 6 includes a die 60 including a lower die 61 and an upper die 62 , and a press mechanism 70 for opening and closing the die 60 . The pressing mechanism 70 includes a fixed platen 72 , a movable platen 71 that can move up and down relative to the fixed platen 72 , and a pair of fixed platen 72 and movable platen 71 . The pull rod 73 etc. which guide and position.

In the illustrated example, the upper mold 62 is attached to the fixed platen 72 , and the lower mold 61 is attached to the movable platen 71 . Alternatively, the lower die 61 may be on the fixed side and the upper die 62 may be on the movable side. In the upper die 62 , a cull 65 for heating the resin is provided at a position facing the tank 64 of the lower die 61 , and a cavity 66 for molding the resin is provided at a position facing the workpiece W. The cavity 66 is in communication with the reject pool 65 .

After the pressing module 6 closes the mold 60 by the pressing mechanism 70 to clamp the workpiece W, the liquid resin in the tank 64 is extruded to the reject pool 65 by the plunger 63 and filled into the cavity 66 . When the mold 60 is opened after the filled resin hardens, the resin-encapsulated workpiece W' can be taken out by the unloader 7 or the like. The resin-sealed workpiece W' may also be called a packaged product W'.

A heat-blocking shutter 74 may also be provided between the resin supply module 2 and the pressing module 6 . When the resin supply port 54 of the resin supply module 2 is located outside the mold 60 , the shutter 74 blocks heat from the mold 60 to suppress the temperature rise of the resin supply port 54 .

The resin supply module 2 includes a forward and backward mechanism 21 and a rotation mechanism 24 for moving among the plurality of pressing modules 6 . The advancing and retreating mechanism 21 includes: a guide rail 22 mounted on a frame-shaped base 20 that can be installed on the floor of a factory or the like; and a slider 23 that moves along the guide rail 22 . A rotation mechanism 24 is provided on the slider 23 . The rotation mechanism 24 rotates around a vertical axis with respect to the base 20 . A rotation mechanism 24 may also be provided on the base 20 , and a forward and backward mechanism 21 may be provided on the rotation mechanism 24 . The resin supply module 2 includes a lifting mechanism 30 fixed on the rotating mechanism 24 .

4 to 6 are side views illustrating the operation of the resin supply module 2 of the present embodiment moving among the plurality of press modules 6 to supply the liquid resin. FIG. 4 shows a state in which the resin supply module 2 shown in FIG. 3 is moved toward the pressing module 6L on the left by the advancing and retreating mechanism 21 . exist In the illustrated state, the resin supply port 54 provided on the front end side of the piping member 50 enters the mold 60 and is located directly above the corresponding tank 64 . The plunger 37 described later is driven to loosen the pinch valve 56 holding the piping member 50 , and the liquid resin is dripped into each tank 64 from the resin supply port 54 corresponding to the tank 64 .

FIG. 5 shows a state in which the support column 31 shown in FIG. 4 is rotated by 180 degrees around the vertical axis by the rotation mechanism 24 . The illustrated state is a standby state in which the resin supply port 54 is located outside the mold 60 . At this time, the shutter 74 provided between the resin supply module 2 and the pressing module 6 may also be closed. The temperature rise of the resin supply port 54 can be suppressed. A waste liquid cup 25 for temporarily storing liquid resin may be arranged directly below the resin supply port 54 . For example, when air is mixed into the piping member 50, the liquid resin can be discarded into the waste liquid cup 25 to discharge the air.

FIG. 6 shows a state in which the resin supply module 2 shown in FIG. 5 moves toward the pressing module 6R on the right side by the advancing and retreating mechanism 21 . In the illustrated state, the resin supply port 54 enters the mold 60 and is located directly above the corresponding tank 64 . Similar to the operation of supplying the liquid resin to the tank 64 on the left, the plunger 37 described later is driven to loosen the pinch valve 56 clamping the piping member 50 , and the resin supply port 54 corresponding to the tank 64 is supplied to each resin supply port 54 . The liquid resin is added dropwise to the tank 64 .

The above operations are repeated, and the resin supply module 2 supplies liquid resin to the tank 64 of the press module 6 . Soon, the remaining amount of the liquid resin in the container unit 40 decreases, and it is necessary to stop the resin supply module 2 to replenish the liquid resin. One of the features of the resin supply module 2 of the present embodiment is that the plurality of containers 44 for ejecting liquid resin can be collectively exchanged. Referring to FIGS. 7 to 9 , the structure related to replacement of the plurality of containers 44 will be described.

FIG. 7 is a perspective view showing an example of the resin supply module 2 of this embodiment. As shown in FIG. 7 , the lifting mechanism 30 includes a pillar 31 , a first lifter that can be lifted and lowered separately along the pillar 31 . The lifting part 32 , the second lifting part 33 and the third lifting part 34 . As shown in FIG. 9 , a plurality of piping members 50 are fixed to the first lifting portion 32 . The plurality of piping members 50 are covered by the piping housing portion 35 . The container storage part 36 which accommodates the container unit 40 is fixed to the 2nd lift part 33. As shown in FIG. A plurality of plungers 37 facing the container accommodating portion 36 from below are fixed to the third lift portion 34 . The elevating mechanism 30 can lift the pipeline member 50 in the pipeline accommodating part 35 , the container unit 40 in the container accommodating part 36 and the plurality of plungers 37 individually.

FIG. 8 is a perspective view partially transparently showing the container accommodating portion 36 shown in FIG. 7 . As shown in FIG. 8 , the container unit 40 includes, in addition to the plurality of containers 44 , a holder 43 for aligning and holding the plurality of containers 44 . In the illustrated example, six containers 44 are held by the holder 43 in a line-up state.

Liquid resin is filled in each container 44 . A discharge port 45 capable of discharging liquid resin is provided at the front end of the container 44 . The container 44 includes an airtight member such as an O-ring attached to the discharge port 45 . In a state where the container unit 40 is attached to the container housing portion 36 , each plunger 37 faces the corresponding container 44 from the side opposite to the discharge port 45 . When the container 44 is pressed by the plunger 37 , the liquid resin can be ejected from the ejection port 45 of each container 44 .

The container unit 40 is configured to be detachable from the container accommodating portion 36 . In the illustrated example, the container unit 40 is slidable along the direction D in which a plurality of containers 44 are arranged in a row, and the container unit 40 can be attached to the container accommodating portion 36 by holding the grip portion 431 provided on the holder 43 and pressing it in. , or the container unit 40 is detached from the container accommodating portion 36 by holding the grip portion 431 and pulling. For example, if the container receiving portion 36 is provided with a guide shape (rough guide) portion 361 whose lateral width becomes wider as it goes outward, and the container unit 40 is slid, the container receiving portion 36 and the container unit 40 can be easily aligned. bit.

FIG. 9 is a cross-sectional view showing the internal structure of the tube accommodating portion 35 shown in FIG. 7 . Each piping member 50 includes a flexible tube. The resin supply port 54 is provided on the front end side of the piping member 50 . In the illustrated example, a pinch valve 56 is provided at the resin supply port 54 . The pinch valve 56 narrows the flow path by pinching the pipe constituting the piping member 50 to adjust the flow rate supplied from the resin supply port 54 or to close the flow path.

The resin supply module 2 may further include a temperature adjustment mechanism 38 for maintaining the liquid resin flowing in the resin supply module 2 at a predetermined temperature range. The temperature adjustment mechanism 38 may be a heat exchanger through which a refrigerant such as air or water flows, or may be a thermoelectric conversion element such as a Peltier element.

The same number of connectors 55 as the discharge ports 45 of the container 44 are provided on the base end side of the piping member 50 . In addition, the number of resin supply ports 54 does not necessarily match the number of connectors 55 . For example, the piping member 50 may be branched into two, and the resin supply ports 54 may be provided with twice the number of connectors 55 .

The connector 55 is configured to be able to fit with an O-ring or the like at the front end of the container 44 . The holder 43 can hold so that the arrangement of the plurality of containers 44 does not shift in position. The lifting mechanism 30 raises and lowers each container 44 and the connector 55 corresponding to the container 44 so that the relative position in the horizontal direction does not change and the distance in the vertical direction changes.

When the distance between the discharge ports 45 of multiple containers 44 and the same number of connectors 55 is approached by the rise of the container receiving part 36 and/or the descent of the pipeline member 50, the directly above the discharge ports 45 correspond to The connectors 55 are inserted into the airtight members of the respective discharge ports 45 . Thereby, a plurality of containers 44 and a plurality of piping members 50 can be collectively connected.

On the contrary, when the descending of the container receiving part 36 and/or the ascending of the piping member 50 When the distances between the discharge ports 45 of a plurality of containers 44 are separated from the same number of connectors 55 , the connectors 55 corresponding to the discharge ports 45 are pulled out from the airtight members of the respective discharge ports 45 . In addition, the plunger 37 is pulled out from the container 44 . Thereby, the connections of the plurality of containers 44 and the plurality of piping members 50 can be released collectively.

According to the resin sealing device 1 of the present embodiment configured as described above, the plurality of containers 44 held in the container unit 40 can be collectively exchanged using the container unit 40 that can be connected and disconnected to the plurality of piping members 50 collectively. . Thereby, the replenishment operation of the liquid resin can be changed from internal replacement to external replacement, and the stop time of the resin sealing apparatus 1 during the replenishment operation can be shortened.

The embodiments described above are for easy understanding of the present invention, and are not for limiting the present invention. Each element included in the embodiment and its arrangement, material, condition, shape, size, etc. are not limited to the illustrated ones, and can be appropriately changed. In addition, configurations shown in different embodiments can be partially substituted or combined with each other.

2: Resin supply module

35: Pipeline containment department

36: Container Containment

37: plunger

40: container unit

43: Holder

44: container

45: Jet outlet

361: Guide shape department

431: control department

D: Arrangement direction

Claims (7)

A resin encapsulation device for encapsulating a workpiece with resin, the resin encapsulation device includes a resin supply module, and the resin supply module is directed to a pressing module that clamps the workpiece, pressurizes it, and molds it into shape The plurality of tanks of the molding die supply liquid resin from the same number of resin supply ports, and the resin supply module includes: a container unit that can be replaced uniformly; a piping member that supplies the resin from the container unit supplying liquid resin through the port; and an elevating mechanism that lifts and lowers the piping member and the container unit respectively, and the container unit includes: a plurality of containers capable of ejecting liquid resin; a holder holding the plurality of container; and the base end side of the pipeline member is provided with the same number of connectors as the discharge ports of the plurality of containers, and the lifting mechanism makes each of the plurality of containers and the corresponding ones of the plurality of containers The connector is raised and lowered so that the relative position in the horizontal direction does not change and the distance in the vertical direction changes, and the piping members can be connected to the discharge ports of the plurality of containers collectively and can be disconnected collectively. connect. The resin encapsulation device according to claim 1, wherein, The plurality of tanks and the same number of resin supply ports are arranged in one row or two rows, and the arrangement of the plurality of containers is the same as the arrangement of the resin supply ports. The resin sealing device according to claim 1, further comprising a container accommodating portion configured to detach the container unit by sliding the container unit along the direction in which the plurality of containers are arranged. . The resin sealing device according to claim 2, further comprising a container accommodating portion configured to detach the container unit by sliding the container unit along the direction in which the plurality of containers are arranged. . The resin encapsulating device according to claim 3, wherein the elevating mechanism lifts the container accommodating portion and the piping member separately, and is configured such that the elevating of the container accommodating portion and/or the The descending of the piping member can connect the plurality of containers to the piping member in a unified manner, and it is configured that the plurality of containers can be collectively released by the descending of the container accommodating part and/or the raising of the piping member. The connection between a container and the pipeline member. The resin encapsulating device according to claim 4, wherein the elevating mechanism lifts the container accommodating portion and the piping member separately, and is configured such that the elevating of the container accommodating portion and/or the The lowering of the pipeline member can connect the plurality of containers to the pipeline member in a unified manner, and is configured by lowering the container receiving part and/or raising the pipeline member. Therefore, the connection between the plurality of containers and the piping member can be disconnected collectively. The resin encapsulating device according to any one of claim 1 to claim 6, further comprising two pressing modules, the two pressing modules are arranged spaced apart from each other, and the resin supply module is configured to be The two pressing die sets are clamped.

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