TWI803502B - 化學機械拋光物品、系統、方法及微複製工具 - Google Patents

化學機械拋光物品、系統、方法及微複製工具 Download PDF

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Publication number
TWI803502B
TWI803502B TW107127051A TW107127051A TWI803502B TW I803502 B TWI803502 B TW I803502B TW 107127051 A TW107127051 A TW 107127051A TW 107127051 A TW107127051 A TW 107127051A TW I803502 B TWI803502 B TW I803502B
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TW
Taiwan
Prior art keywords
polishing
offset
plane
polishing pad
working surface
Prior art date
Application number
TW107127051A
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English (en)
Chinese (zh)
Other versions
TW201910056A (zh
Inventor
肯納斯 安卓 派尼 梅爾
強 喬瑟夫 蘇利文
布萊恩 威廉 魯克
達 卡 雷虎
大衛 傑佛瑞 穆拉迪安
大衛 法蘭克 斯拉瑪
Original Assignee
美商3M新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商3M新設資產公司 filed Critical 美商3M新設資產公司
Publication of TW201910056A publication Critical patent/TW201910056A/zh
Application granted granted Critical
Publication of TWI803502B publication Critical patent/TWI803502B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW107127051A 2017-08-04 2018-08-03 化學機械拋光物品、系統、方法及微複製工具 TWI803502B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762541362P 2017-08-04 2017-08-04
US62/541,362 2017-08-04

Publications (2)

Publication Number Publication Date
TW201910056A TW201910056A (zh) 2019-03-16
TWI803502B true TWI803502B (zh) 2023-06-01

Family

ID=65233633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127051A TWI803502B (zh) 2017-08-04 2018-08-03 化學機械拋光物品、系統、方法及微複製工具

Country Status (6)

Country Link
US (1) US12208483B2 (https=)
JP (1) JP7165719B2 (https=)
KR (1) KR102608124B1 (https=)
CN (1) CN111032284B (https=)
TW (1) TWI803502B (https=)
WO (1) WO2019026021A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
CN114599482A (zh) * 2019-11-04 2022-06-07 3M创新有限公司 抛光制品、抛光系统和抛光方法
WO2021090121A1 (en) * 2019-11-05 2021-05-14 3M Innovative Properties Company Molded abrasive rotary tool
GB2595668B (en) * 2020-06-02 2022-05-25 Illinois Tool Works A contact cleaning surface
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
JP2024130078A (ja) * 2023-03-14 2024-09-30 株式会社ディスコ ドレッシング部材
CN119927788B (zh) * 2025-04-08 2025-08-01 河北同光半导体股份有限公司 晶圆的研磨抛光加工方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW362551U (en) * 1994-04-08 1999-06-21 Rodel Inc Polishing pads
US6699115B2 (en) * 1997-05-15 2004-03-02 Applied Materials Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
CN101795961A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 用于制备微结构化制品的工具
JP2011235425A (ja) * 2010-05-13 2011-11-24 Asahi Glass Co Ltd 研磨パッド及び研磨パッドを用いた研磨装置
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
CN103328158A (zh) * 2011-01-26 2013-09-25 3M创新有限公司 具有复制的微结构化背衬的磨料制品以及其使用方法
TW201436941A (zh) * 2013-01-22 2014-10-01 奈平科技股份有限公司 具有含連續突出物之拋光表面之拋光墊
CN204277743U (zh) * 2014-10-29 2015-04-22 安阳方圆研磨材料有限责任公司 硬质抛光垫
CN105579194A (zh) * 2013-09-25 2016-05-11 3M创新有限公司 多层抛光垫
WO2016183126A1 (en) * 2015-05-13 2016-11-17 3M Innovative Properties Company Polishing pads and systems for and methods of using same
TW201726316A (zh) * 2015-10-07 2017-08-01 ３Ｍ新設資產公司 拋光墊與系統及其製造與使用方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211811A (en) 1964-06-29 1965-10-12 Armorlite Leus Company Inc Method and apparatus for casting thermosetting plastic lenses
DE69637994D1 (de) 1995-04-26 2009-09-24 Minnesota Mining & Mfg Ablationsverfahren durch laser-darstellung
US6780095B1 (en) * 1997-12-30 2004-08-24 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
FR2786118B1 (fr) * 1998-11-19 2000-12-22 Lam Plan Sa Dispositif de rodage ou polissage
JP2000158327A (ja) * 1998-12-02 2000-06-13 Rohm Co Ltd 化学的機械的研磨用研磨布およびそれを用いた化学的機械的研磨装置
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6776699B2 (en) * 2000-08-14 2004-08-17 3M Innovative Properties Company Abrasive pad for CMP
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US7048615B2 (en) 2004-08-05 2006-05-23 United Microelectronics Corp. Pad backer and CMP process using the same
US7169029B2 (en) * 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
US7261625B2 (en) 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US7226345B1 (en) * 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US7828634B2 (en) * 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
US20100188751A1 (en) 2009-01-29 2010-07-29 3M Innovative Properties Company Optical films with internally conformable layers and method of making the films
US8425278B2 (en) * 2009-08-26 2013-04-23 3M Innovative Properties Company Structured abrasive article and method of using the same
KR101161015B1 (ko) * 2010-09-10 2012-07-02 신한다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너 및 그 제조방법
KR101916492B1 (ko) * 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
JP5923353B2 (ja) 2012-03-21 2016-05-24 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
SG11201602206PA (en) 2013-09-25 2016-04-28 3M Innovative Properties Co Composite ceramic abrasive polishing solution
SG11201608134YA (en) 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW362551U (en) * 1994-04-08 1999-06-21 Rodel Inc Polishing pads
US6699115B2 (en) * 1997-05-15 2004-03-02 Applied Materials Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
CN101795961A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 用于制备微结构化制品的工具
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
JP2011235425A (ja) * 2010-05-13 2011-11-24 Asahi Glass Co Ltd 研磨パッド及び研磨パッドを用いた研磨装置
CN103328158A (zh) * 2011-01-26 2013-09-25 3M创新有限公司 具有复制的微结构化背衬的磨料制品以及其使用方法
TW201436941A (zh) * 2013-01-22 2014-10-01 奈平科技股份有限公司 具有含連續突出物之拋光表面之拋光墊
CN105579194A (zh) * 2013-09-25 2016-05-11 3M创新有限公司 多层抛光垫
CN204277743U (zh) * 2014-10-29 2015-04-22 安阳方圆研磨材料有限责任公司 硬质抛光垫
WO2016183126A1 (en) * 2015-05-13 2016-11-17 3M Innovative Properties Company Polishing pads and systems for and methods of using same
TW201726316A (zh) * 2015-10-07 2017-08-01 ３Ｍ新設資產公司 拋光墊與系統及其製造與使用方法

Also Published As

Publication number Publication date
JP2020529332A (ja) 2020-10-08
TW201910056A (zh) 2019-03-16
KR20200037269A (ko) 2020-04-08
US12208483B2 (en) 2025-01-28
KR102608124B1 (ko) 2023-11-29
CN111032284B (zh) 2022-11-04
JP7165719B2 (ja) 2022-11-04
US20200164484A1 (en) 2020-05-28
WO2019026021A1 (en) 2019-02-07
CN111032284A (zh) 2020-04-17

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