KR102608124B1 - 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 - Google Patents

향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 Download PDF

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Publication number
KR102608124B1
KR102608124B1 KR1020207004255A KR20207004255A KR102608124B1 KR 102608124 B1 KR102608124 B1 KR 102608124B1 KR 1020207004255 A KR1020207004255 A KR 1020207004255A KR 20207004255 A KR20207004255 A KR 20207004255A KR 102608124 B1 KR102608124 B1 KR 102608124B1
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South Korea
Prior art keywords
polishing
offset
delete delete
polishing pad
cell
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English (en)
Korean (ko)
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KR20200037269A (ko
Inventor
케네스 에이 피 메이어
존 제이 설리반
브라이언 더블유 루엑
두이 케이 레후
데이비드 제이. 무라디안
데이비드 에프 슬라마
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20200037269A publication Critical patent/KR20200037269A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020207004255A 2017-08-04 2018-08-02 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 Active KR102608124B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762541362P 2017-08-04 2017-08-04
US62/541,362 2017-08-04
PCT/IB2018/055815 WO2019026021A1 (en) 2017-08-04 2018-08-02 MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY

Publications (2)

Publication Number Publication Date
KR20200037269A KR20200037269A (ko) 2020-04-08
KR102608124B1 true KR102608124B1 (ko) 2023-11-29

Family

ID=65233633

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207004255A Active KR102608124B1 (ko) 2017-08-04 2018-08-02 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면

Country Status (6)

Country Link
US (1) US12208483B2 (https=)
JP (1) JP7165719B2 (https=)
KR (1) KR102608124B1 (https=)
CN (1) CN111032284B (https=)
TW (1) TWI803502B (https=)
WO (1) WO2019026021A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
CN114599482A (zh) * 2019-11-04 2022-06-07 3M创新有限公司 抛光制品、抛光系统和抛光方法
WO2021090121A1 (en) * 2019-11-05 2021-05-14 3M Innovative Properties Company Molded abrasive rotary tool
GB2595668B (en) * 2020-06-02 2022-05-25 Illinois Tool Works A contact cleaning surface
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
JP2024130078A (ja) * 2023-03-14 2024-09-30 株式会社ディスコ ドレッシング部材
CN119927788B (zh) * 2025-04-08 2025-08-01 河北同光半导体股份有限公司 晶圆的研磨抛光加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017062719A1 (en) 2015-10-07 2017-04-13 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211811A (en) 1964-06-29 1965-10-12 Armorlite Leus Company Inc Method and apparatus for casting thermosetting plastic lenses
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
DE69637994D1 (de) 1995-04-26 2009-09-24 Minnesota Mining & Mfg Ablationsverfahren durch laser-darstellung
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6780095B1 (en) * 1997-12-30 2004-08-24 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
FR2786118B1 (fr) * 1998-11-19 2000-12-22 Lam Plan Sa Dispositif de rodage ou polissage
JP2000158327A (ja) * 1998-12-02 2000-06-13 Rohm Co Ltd 化学的機械的研磨用研磨布およびそれを用いた化学的機械的研磨装置
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6776699B2 (en) * 2000-08-14 2004-08-17 3M Innovative Properties Company Abrasive pad for CMP
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US7048615B2 (en) 2004-08-05 2006-05-23 United Microelectronics Corp. Pad backer and CMP process using the same
US7169029B2 (en) * 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
US7261625B2 (en) 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US7226345B1 (en) * 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US7828634B2 (en) * 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
CN101795961B (zh) * 2007-09-06 2013-05-01 3M创新有限公司 用于制备微结构化制品的工具
US20100188751A1 (en) 2009-01-29 2010-07-29 3M Innovative Properties Company Optical films with internally conformable layers and method of making the films
US8425278B2 (en) * 2009-08-26 2013-04-23 3M Innovative Properties Company Structured abrasive article and method of using the same
WO2011082155A2 (en) 2009-12-30 2011-07-07 3M Innovative Properties Company Polishing pads including phase-separated polymer blend and method of making and using the same
JP5516051B2 (ja) * 2010-05-13 2014-06-11 旭硝子株式会社 研磨パッドを用いた研磨装置及びガラス板の製造方法
KR101161015B1 (ko) * 2010-09-10 2012-07-02 신한다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너 및 그 제조방법
KR20140018880A (ko) 2011-01-26 2014-02-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 복제된 미세구조화 배킹을 갖는 연마재 물품 및 그것을 이용하는 방법
KR101916492B1 (ko) * 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
JP5923353B2 (ja) 2012-03-21 2016-05-24 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
SG11201602206PA (en) 2013-09-25 2016-04-28 3M Innovative Properties Co Composite ceramic abrasive polishing solution
WO2015048011A1 (en) 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads
SG11201608134YA (en) 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
CN204277743U (zh) * 2014-10-29 2015-04-22 安阳方圆研磨材料有限责任公司 硬质抛光垫
US10556316B2 (en) 2015-05-13 2020-02-11 3M Innovative Properties Company Polishing pads and systems for and methods of using same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017062719A1 (en) 2015-10-07 2017-04-13 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same

Also Published As

Publication number Publication date
JP2020529332A (ja) 2020-10-08
TW201910056A (zh) 2019-03-16
KR20200037269A (ko) 2020-04-08
US12208483B2 (en) 2025-01-28
TWI803502B (zh) 2023-06-01
CN111032284B (zh) 2022-11-04
JP7165719B2 (ja) 2022-11-04
US20200164484A1 (en) 2020-05-28
WO2019026021A1 (en) 2019-02-07
CN111032284A (zh) 2020-04-17

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