TWI803340B - De-taping apparatus and operating method thereof - Google Patents

Abstract

A de-taping apparatus includes a movable chuck, a tape provider, a tape path holder, a pressing roller, and a tape receiver. The movable chuck is configured to attach a wafer. The wafer has a membrane. The tape provider is above the movable chuck and includes a roller and a peeling tape winding the roller. The tape path holder is above the movable chuck and downstream the tape provider, and abuts against the peeling tape, and is configured to limit a vertical distance between the membrane and the wafer. The pressing roller is above the movable chuck and downstream the tape path holder, and is configure to move in a direction vertical to the movable chuck to press the peeling tape, such that the peeling tape adheres to the membrane of the wafer. The tape receiver is above the movable chuck and downstream the pressing roller, and is connected to the peeling tape, and is configured to drive and receive the peeling tape.

Description

Rubber tearing equipment and its operation method

The present disclosure relates to a glue-removing device and an operation method of the glue-removing device.

Generally speaking, when a wafer with a MEMS is torn off the membrane (Membrane) protecting the MEMS, a hard rod is used to press the peeling tape on the membrane of the wafer, so that Peel off the tape attached to the diaphragm. Then, the stage carrying the wafer is moved so that the film can be detached from the wafer as the stripping tape moves.

However, since the rod generally maintains an inclination angle of 45 degrees relative to the wafer, the peeling angle when the tape is peeled off to remove the film is also about 45 degrees. In this way, a large vertical peeling force (Pelling force) will be generated on the MEMS covered by the film, which will easily cause damage to the MEMS of the wafer when the film is torn off, affecting the yield. In addition, the rigidity of the rod body is high, and there is a high risk to the MEMS of the wafer when pressure is applied to peel off the tape.

One technical aspect of the present disclosure is a glue tearing device.

According to some embodiments of the present disclosure, a glue tearing device includes a moving stage, a tape supply part, a tape path maintaining part, a pressure roller and a tape receiving part. Move the stage configuration to pick up the wafer. The wafer has a diaphragm. The tape supply part is located above the moving platform, and includes a roller and a peeling tape wound on the roller. The tape path maintaining part is located above the moving stage and downstream of the tape supply part, and abuts against the peeling tape, configured to limit the vertical distance between the film and the wafer. The pressing rollers are located above the moving stage and downstream of the tape path maintaining member, and are configured to move in a direction perpendicular to the moving stage to apply pressure to the peeling tape, so that the peeling tape is attached to the film of the wafer. The adhesive tape receiver is located above the moving stage and downstream of the pressing roller, connected to the stripping tape, and configured to drive and receive the stripping tape.

In some embodiments, the above-mentioned tape path maintaining member has rollers, and the roller and the pressing roller of the tape path maintaining member are configured to abut against the opposite first side and second side of the peeling tape, respectively.

In some embodiments, the roller of the tape supply abuts against the second side of the stripping tape.

In some embodiments, the above-mentioned tape receiver has a puck configured with the roller of the tape path maintainer to abut against the first side of the stripping tape.

In some embodiments, the tape receiver includes a motor configured to rotate the disc of the tape receiver to drive the tape to be peeled off.

In some embodiments, the material of the pressure roller includes polyurethane.

In some embodiments, the above adhesive tearing device further includes a clamping wheel set and auxiliary wheels. The clamping wheel set is located downstream of the tape supply and upstream of the tape path maintainer. The auxiliary wheels are located downstream of the sandwich wheel set and upstream of the tape path maintainer.

In some embodiments, the above adhesive tearing device further includes auxiliary wheels. The training wheel is located downstream of the pressure roller and upstream of the tape receiver.

In some embodiments, the adhesive tearing device above further includes a heat press head configured to heat press the stripped adhesive tape between the pressure roller and the auxiliary wheel.

Another technical aspect of the present disclosure is an operation method of a glue tearing device.

According to some embodiments of the present disclosure, an operation method of the adhesive tearing equipment includes lowering the pressure roller toward the direction close to the moving stage to apply pressure to the peeling tape, so that the peeling tape is attached to the wafer absorbed by the moving stage the diaphragm; lift the pressure roller away from the moving stage to separate the pressure roller from the stripping tape; move the moving stage in the horizontal direction and rotate the tape receiver connected to the stripping tape, so that the film can be peeled off The stripping tape is moved away from the wafer; and the tape path maintainer against the stripping tape is used to limit the vertical distance between the membrane and the wafer as the moving stage is moved and the tape receiver is rotated.

In some embodiments, the method for operating the adhesive stripping device further includes providing a stripping tape using a tape supply located upstream of the tape path maintainer, wherein the stripping tape is wound around a roller of the tape supply.

In some embodiments, the above-mentioned operation method of the adhesive stripping device further includes that when the pressure roller is lowered to apply pressure to the tape to be removed, the pressure roller and the roller of the tape supply member abut against the same side of the tape to be removed.

In some embodiments, the method of operating the above adhesive tearing device further includes when the pressure roller is lowered to apply pressure to the stripping tape, the disc of the tape receiving part and the roller of the tape path maintaining part abut against the same side of the stripping tape .

In some embodiments, the above-mentioned operation method of the adhesive stripping device further includes when the pressure roller is lowered to apply pressure to the stripping tape, the roller of the tape path maintaining member and the pressure roller respectively abut against opposite sides of the stripping tape.

In some embodiments, the above-mentioned operation method of the adhesive tearing device further includes moving the mobile platform in another horizontal direction opposite to the horizontal direction before lowering the pressure roller toward the direction of approaching the mobile platform.

In the above-mentioned embodiments of the present disclosure, since the pressure roller of the adhesive tearing device can be raised and lowered, the pressure roller can attach the peeling tape to the film of the wafer after being lowered, and can be separated from the peeling tape after being raised. In addition, when the moving stage is moved in the horizontal direction and the tape receiving member connected to the stripping tape is rotated, not only the film can be detached from the wafer with the movement of the stripping tape, but the tape path maintaining member can also abut against the stripping tape The vertical distance between the film and the wafer is limited so that the peeling angle of the peeling tape can be relatively horizontal (eg less than 30 degrees) when the film is torn off. In this way, the vertical peeling force (Peeling force) on the wafer (such as MEMS) covered by the film can be effectively reduced, avoiding damage to the MEMS of the wafer when the film is torn off, and improving product quality. Rate. In addition, the pressure-applying roller can be elastic, which can effectively reduce the risk of the MEMS of the wafer when the tape is peeled off by pressure.

The description of the embodiments disclosed below provides many different implementations, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present case. Of course, these examples are only examples and are not intended to be limiting. In addition, the present case may repeat element symbols and/or letters in various instances. This repetition is for the purposes of brevity and clarity and does not in itself dictate a relationship between the various implementations and/or configurations discussed.

Spatially relative terms such as "below", "beneath", "lower", "above", "upper", etc. may be used herein for convenience of description to describe The relationship of one element or feature to another element or feature as shown in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

FIG. 1 shows a side view of a glue tearing device 100 according to an embodiment of the present disclosure. The glue tearing device 100 includes a moving stage 110 , a tape supply part 120 , a tape path maintaining part 130 , a pressing roller 140 and a tape receiving part 150 . The moving stage 110 is configured to absorb the wafer W. Wafer W has a membrane M covering its surface. For example, the membrane M may cover a micro-electro-mechanical system (MEMS) for protection. The tape supply part 120 , the tape path maintaining part 130 , the pressing roller 140 and the tape receiving part 150 are all located above the moving stage 110 . The tape supply member 120 includes a roller 122 and a stripping tape 124 wound on the roller 122 . The tape path maintainer 130 is located downstream of the tape supply 120 and abuts against the stripping tape 124 . The tape path maintainer 130 is configured to limit the vertical distance between the membrane M and the wafer W, eg, the range of distance d. The pressing roller 140 is located downstream of the tape path maintaining member 130 and is configured to move in a direction of vertically moving the stage 110 . For example, the pressing roller 140 can descend to approach the mobile platform 110 , and can also rise away from the mobile platform 110 . The pressing roller 140 is elastic, and its material may include polyurethane (PU). The tape receiver 150 is located downstream of the pressing roller 140 and connected to the stripping tape 124 , configured to drive and receive the stripping tape 124 . In this embodiment, the tape receiving part 150 is actively rotating, and other components (such as the tape supply part 120 , the tape path maintaining part 130 and the pressing roller 140 ) are driven to rotate by the peeling tape 124 .

Furthermore, the tape path maintainer 130 has rollers 132 . The roller 132 and the pressing roller 140 of the tape path maintaining member 130 are configured to abut against the opposite first side 125 and the second side 127 of the stripping tape 124 , respectively. The roller 122 of the tape supply 120 abuts against the second side 127 of the stripping tape 124 . The tape receiver 150 includes a disc 152 and a motor 154 . The disc 152 of the tape receiver 150 is configured with the roller 132 of the tape path maintainer 130 to abut against the first side 125 of the stripping tape 124 . The motor 154 of the tape receiver 150 is configured to rotate the disc 152 to drive the peeling tape 124 .

In some embodiments, the adhesive tearing device 100 further includes a clamping wheel set 160 , auxiliary wheels 170 , 170 a and a thermal head 180 . The clamping wheel set 160 is located downstream of the tape supply part 120 and upstream of the tape path maintaining part 130 . The auxiliary wheel 170 is located downstream of the sandwich wheel set 160 and upstream of the tape path maintainer 130 . The auxiliary wheel 170 a is located downstream of the pressure roller 140 and the thermal head 180 and upstream of the tape receiver 150 . The clamping wheel set 160 and the auxiliary wheels 170 , 170 a can improve the transmission stability of the peeling tape 124 . The thermal pressing head 180 is configured to thermally press the stripping tape 124 between the pressing roller 140 and the auxiliary roller 170a.

It should be understood that the connection relationship, materials and functions of the components that have been described will not be repeated, and will be described first. In the following description, the operation method of the glue tearing equipment will be explained.

FIG. 2 shows a flow chart of the operation method of the adhesive tearing device according to an embodiment of the present disclosure. The operation method of the glue tearing equipment includes the following steps. In step S1, the pressure roller is lowered toward the moving stage to apply pressure to the peeling tape, so that the peeling tape is attached to the film of the wafer absorbed by the moving stage. Then in step S2, the pressing roller is lifted away from the moving stage, so that the pressing roller is separated from the peeling tape. Then in step S3 , move the moving stage in the horizontal direction and rotate the tape receiver connected to the peeling tape, so that the film is detached from the wafer along with the movement of the peeling tape. Subsequently in step S4, and when moving the mobile stage and rotating the tape receiver, the vertical distance between the film and the wafer is limited using the tape path maintainer against the stripped tape. The operation method of the glue tearing equipment is not limited to the above-mentioned steps S1 to S4. For example, in some embodiments, other steps can be further included between the two front and back steps, and it can also be further included before step S1 and after step S5. Additional steps.

In the following description, each step of the operation method of the above-mentioned glue tearing equipment will be described in detail.

FIG. 3 to FIG. 6 are schematic diagrams showing various steps in the operation method of the adhesive tearing equipment according to an embodiment of the present disclosure. For the sake of brevity and clarity, the clamping wheel set 160, the two auxiliary wheels 170, 170a, and the thermal head 180 in Fig. 1 are omitted from Fig. 3 to Fig. 6 . Referring to FIG. 3 , the stripping tape 124 is provided by the tape supply 120 upstream of the tape path maintainer 130 , wherein the stripping tape 124 is wound around the roller 122 of the tape supply 120 . Wafer W is sucked by moving stage 110 . First, the moving stage 110 is moved in the horizontal direction D, and the moving stage 110 is stopped when one end (for example, the left end) of the film M of the wafer W overlaps the pressure roller 140 in the vertical direction. Next, lower the pressure roller 140 toward the direction D1 approaching the moving stage 110 to apply pressure to the peeling tape 124 , so that the peeling tape 124 is attached to the film M of the wafer W. In this step, because the pressure roller 140 is elastic and is a soft material, when the adhesive tape 124 is peeled off from the membrane M by pressure, not only can the cracking and vibration of the wafer W be avoided, but the micro-electromechanical system of the wafer W can be effectively reduced. (MEMS) risk, can also reduce the down force and increase the contact area, which helps to peel off the adhesive tape 124 attached to the membrane M.

When lowering the pressure applying roller 140 to apply pressure to the stripping tape 124, the pressing roller 140 and the roller 122 of the tape supply part 120 abut against the same side (such as the second side 127) of the stripping tape 124, and the tape receiving part 150 The disc 152 and the roller 132 of the tape path maintainer 130 abut against the same side (e.g., the first side 125) of the stripped tape 124, while the rollers 132 of the tape path maintainer 130 and the pressure roller 140 respectively abut against the stripped tape 124 opposite sides (eg, the first side 125 and the second side 127).

Referring to FIG. 4 , after peeling off the adhesive tape 124 attached to the film M of the wafer W, the pressure roller 140 can be lifted in the direction D2 away from the moving stage 110 to separate the pressure roller 140 from the peeling tape 124 .

Referring to FIG. 5 , then, move the moving stage 110 in the horizontal direction D3 and rotate the tape receiver 150 connected to the peeling tape 124 , so that the film M can be separated from the wafer W as the peeling tape 124 moves. In this embodiment, the adhesive tape receiver 150 can be rotated synchronously when moving the moving stage 110 in the horizontal direction D3. In addition, when the tape receiving part 150 is rotated in the direction D4 (eg, clockwise), the roller 122 of the tape supply part 120 is rotated in the direction D5 (eg, counterclockwise).

Referring to Fig. 5 and Fig. 6 at the same time, when part of the film M is pulled away from the wafer W by the peeling tape 124, the mobile stage 110 can continue to be moved in the horizontal direction D3 and the tape receiving member 150 can be rotated to make the film M Gradually detaches from wafer W. The tape path maintainer 130 against the stripping tape 124 may be used to limit the vertical distance between the membrane M and the wafer W when the moving stage 110 is moved and the tape receiver 150 is rotated.

Specifically, during the detachment process of the membrane M, the bottom of the tape path maintaining member 130 also abuts against the peeling tape 124 to limit the vertical distance between the membrane M and the wafer W, so that the peeling tape 124 is peeled off. The stripping angle of the film M can be relatively horizontal (for example, less than 30 degrees).

In this way, the vertical peeling force (Peeling force) generated on the wafer W (such as microelectromechanical system) covered by the membrane M can be effectively reduced, and the microelectromechanical system (such as microelectromechanical system) of the wafer W is avoided when the membrane M is torn off. MEMS) damage, improve product yield.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. It should be appreciated by those skilled in the art that they may readily use the present disclosure as a basis for designing or modifying other processes and structures, so as to achieve the same purposes and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

100: glue tearing equipment

110: mobile carrier

120: tape supply parts

122:Roller

124: Peel off the tape

125: first side

127: second side

130: Tape path maintainer

132:Roller

140: pressure roller

150: tape receiver

152: Disc

154: motor

160: sandwich wheel set

170, 170a: training wheels

180: thermal head

D, D3: horizontal direction

D1, D2, D3, D4, D5: direction

d: distance

M: Diaphragm

W: Wafer

Aspects of the present disclosure are best understood from the following embodiments when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 shows a side view of a glue tearing device according to an embodiment of the present disclosure. FIG. 2 shows a flow chart of the operation method of the adhesive tearing device according to an embodiment of the present disclosure. FIG. 3 to FIG. 6 are schematic diagrams showing various steps in the operation method of the adhesive tearing equipment according to an embodiment of the present disclosure.

100: glue tearing equipment

110: mobile carrier

120: tape supply parts

122:Roller

124: Peel off the tape

125: first side

127: second side

130: Tape path maintainer

132:Roller

140: pressure roller

150: tape receiver

152: Disc

154: motor

160: sandwich wheel set

170, 170a: training wheels

180: thermal head

d: distance

M: Diaphragm

W: Wafer

Claims (13)

A glue tearing device, comprising: a mobile stage configured to absorb a wafer, wherein the wafer has a film; an adhesive tape supply member located above the mobile stage, and includes a roller and wound on the roller a stripping tape; a tape path maintainer, located above the moving stage and downstream of the tape supply, and against the stripping tape, configured to limit the vertical distance between the film and the wafer, wherein The adhesive tape path maintainer has a roller; a pressure roller is located above the mobile stage and downstream of the adhesive tape path maintainer, and is configured to move in a direction perpendicular to the movable stage to exert pressure on the peeling tape, so that the a peeling tape is attached to the film of the wafer, and the roller and the pressure roller of the tape path maintainer are configured to respectively abut against a first side and a second side opposite to the peeling tape; and A tape receiving part is located above the moving stage and downstream of the pressing roller, and is connected with the peeling tape, configured to drive and receive the peeling tape. The glue-removing device as claimed in claim 1, wherein the roller of the tape supply member abuts against the second side of the peeling tape. The adhesive tearing device as claimed in item 1, wherein the adhesive tape receiving part has a disc, and the disc of the adhesive tape receiving part and the roller of the adhesive tape path maintaining part are configured to abut against the first stripping adhesive tape side. The glue-removing device as claimed in claim 3, wherein the adhesive tape receiver includes a motor configured to rotate the disc of the adhesive tape receiver to drive the stripping tape. The adhesive tearing device as claimed in claim 1, wherein the material of the pressing roller comprises polyurethane. The glue tearing device as described in claim 1 further includes: a film clamping wheel set, located downstream of the tape supply member and upstream of the tape path maintenance member; and an auxiliary wheel, located downstream of the film clamping wheel set and upstream The tape path is maintained upstream of the member. The glue tearing device as claimed in claim 1 further includes: an auxiliary wheel located downstream of the pressure roller and upstream of the adhesive tape receiver. The adhesive tearing device as claimed in item 7 further includes: a heat press head configured to heat press the peeling tape between the pressure applying roller and the auxiliary wheel. A method for operating adhesive tearing equipment, comprising: lowering a pressure roller toward a moving stage to apply pressure to a peeling tape, so that the peeling tape is attached to a wafer absorbed by the moving stage A diaphragm of a tape path maintenance member and the pressing roller respectively abut against the opposite sides of the peeling tape; the pressing roller is raised in a direction away from the moving stage to make the pressing roller The roller is separated from the stripping tape; moving the mobile stage in a horizontal direction and rotating a tape receiving part connected to the stripping tape, so that the film is detached from the wafer as the stripping tape moves; and moves The vertical distance between the membrane and the wafer is limited using the tape path maintainer against the peel tape as the moving stage and the tape receiver are rotated. The operation method of the glue tearing device as described in claim 9 further includes: using a tape supply member located upstream of the tape path maintenance member to provide the peeling tape, wherein the peeling tape is wound on one of the tape supply member scroll wheel. The operation method of the glue tearing equipment as described in claim 10 further includes: when the pressure roller is lowered to apply pressure to the stripping tape, the pressure roller and the roller of the tape supply member abut against the stripping same side of the tape. The operation method of the glue tearing equipment as described in claim item 9 further includes: When the pressing roller is lowered to apply pressure to the stripping tape, a disc of the tape receiving part and a roller of the tape path maintaining part abut against the same side of the stripping tape. The operation method of the adhesive tearing device as described in Claim 9 further includes: before lowering the pressure roller toward the direction approaching the mobile platform, moving the mobile platform in another horizontal direction opposite to the horizontal direction.

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