CN117185247A - Glue tearing equipment and operation method thereof - Google Patents
Glue tearing equipment and operation method thereof Download PDFInfo
- Publication number
- CN117185247A CN117185247A CN202310412293.3A CN202310412293A CN117185247A CN 117185247 A CN117185247 A CN 117185247A CN 202310412293 A CN202310412293 A CN 202310412293A CN 117185247 A CN117185247 A CN 117185247A
- Authority
- CN
- China
- Prior art keywords
- tape
- roller
- wafer
- adhesive tape
- pressing roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 title claims description 20
- 239000002390 adhesive tape Substances 0.000 claims abstract description 52
- 239000012528 membrane Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000011144 upstream manufacturing Methods 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
A tape tearing apparatus and a method of operating the same, the apparatus including a moving stage, a tape supply member, a tape path maintaining member, a pressing roller, and a tape receiving member. The movable stage is configured to adsorb a wafer. The wafer has a membrane. The adhesive tape supply part is positioned above the movable carrier and comprises a roller and a stripping adhesive tape wound on the roller. The tape path maintaining member is located above the moving stage and downstream of the tape supplying member and is configured to abut against the peeling tape to limit a vertical distance between the film and the wafer. The pressing roller is arranged above the movable carrier and downstream of the adhesive tape path maintaining piece, and is configured to move in a direction perpendicular to the movable carrier to press the adhesive tape to adhere the adhesive tape to the film of the wafer. The adhesive tape receiving part is positioned above the movable carrier and downstream of the pressing roller and is connected with the stripping adhesive tape and is configured to drive and receive the stripping adhesive tape. Therefore, the stripping angle of the stripping tape when the film is stripped can be horizontal, and the vertical stripping force on the wafer covered by the film can be effectively reduced.
Description
Technical Field
The application relates to a glue tearing device and an operation method of the glue tearing device.
Background
In general, when a wafer having a micro-electromechanical system (MEMS) is peeled off a Membrane (Membrane) protecting the MEMS, a hard rod is used to press a dicing tape onto the Membrane of the wafer, so that the dicing tape is attached to the Membrane. Then, the carrier for carrying the wafer is moved, so that the film can be separated from the wafer along with the movement of the stripping tape.
However, since the lever generally maintains an inclined angle of 45 degrees with respect to the wafer, the peeling angle is also about 45 degrees when the peeling tape peels off the film. In this way, a large vertical stripping force (Peeling force) is generated on the MEMS covered by the membrane, which is easy to damage the MEMS of the wafer when the membrane is stripped, and affects the yield. In addition, the bar body has high hardness, and the pressure for peeling the tape has high risk to the micro-electromechanical system of the wafer.
Disclosure of Invention
One aspect of the present application is a glue tearing apparatus.
According to some embodiments of the present application, a tape tearing apparatus includes a moving stage, a tape supply, a tape path maintaining member, a pressing roller, and a tape receiving member. The movable stage is configured to adsorb a wafer. The wafer has a membrane. The adhesive tape supply part is positioned above the movable carrier and comprises a roller and a stripping adhesive tape wound on the roller. The tape path maintaining member is located above the moving stage and downstream of the tape supplying member and is configured to abut against the peeling tape to limit a vertical distance between the film and the wafer. The pressing roller is arranged above the movable carrier and downstream of the adhesive tape path maintaining piece, and is configured to move in a direction perpendicular to the movable carrier to press the adhesive tape to adhere the adhesive tape to the film of the wafer. The adhesive tape receiving part is positioned above the movable carrier and downstream of the pressing roller and is connected with the stripping adhesive tape and is configured to drive and receive the stripping adhesive tape.
In some embodiments, the adhesive tape path maintaining member has a roller, and the roller and the pressing roller of the adhesive tape path maintaining member are configured to respectively abut against a first side and a second side opposite to the adhesive tape.
In some embodiments, the roller of the tape supply abuts the second side of the strip.
In some embodiments, the tape receiving member has a disc, and the disc of the tape receiving member and the roller of the tape path maintaining member are configured to abut against the first side of the strip tape.
In some embodiments, the tape receiving member includes a motor configured to rotate a disk of the tape receiving member to drive the tape.
In some embodiments, the material of the pressure roller comprises polyurethane.
In some embodiments, the above-mentioned adhesive tearing device further includes a film clamping wheel set and an auxiliary wheel. The film clamping wheel set is positioned downstream of the adhesive tape supply and upstream of the adhesive tape path maintaining member. The auxiliary wheel is positioned downstream of the pinch roller assembly and upstream of the tape path maintenance assembly.
In some embodiments, the above-mentioned adhesive tearing device further comprises an auxiliary wheel. The auxiliary wheel is located downstream of the pressure roller and upstream of the tape receiving member.
In some embodiments, the above-described adhesive tape tearing apparatus further comprises a thermal pressure head configured to thermally press the adhesive tape peeled between the pressing roller and the auxiliary wheel.
Another technical aspect of the application is a method of operating a glue tearing apparatus.
According to some embodiments of the present application, a method of operating a tape tearing apparatus includes lowering a pressing roller in a direction approaching a moving stage to press a peeling tape so that the peeling tape is attached to a film of a wafer suctioned by the moving stage; lifting the pressing roller in a direction away from the movable carrier to separate the pressing roller from the stripping tape; moving the moving carrier in a horizontal direction and rotating the tape receiving member connected to the peeling tape to separate the film from the wafer along with the movement of the peeling tape; and limiting the vertical distance between the film and the wafer using the tape path maintaining member abutting against the peeling tape when the moving stage is moved and the tape receiving member is rotated.
In some embodiments, the method of operating a tape tearing apparatus further comprises providing a peeling tape using a tape supply located upstream of the tape path maintenance member, wherein the peeling tape is wound around a roller of the tape supply.
In some embodiments, the method of operating the above-described adhesive tape tearing apparatus further comprises that when the pressing roller is lowered to press the adhesive tape to be peeled, the pressing roller abuts against the same side of the adhesive tape as the roller of the adhesive tape supply member.
In some embodiments, the method of operating the above-described tape tearing apparatus further comprises that when the pressing roller is lowered to press the peeling tape, the disc of the tape receiving member abuts against the same side of the peeling tape as the roller of the tape path maintaining member.
In some embodiments, the operation method of the above-mentioned adhesive tearing apparatus further includes that when the pressing roller is lowered to press the adhesive tape, the roller of the adhesive tape path maintaining member and the pressing roller respectively abut against opposite sides of the adhesive tape.
In some embodiments, the method of operating a glue tearing apparatus further includes moving the movable stage in another horizontal direction opposite to the horizontal direction before lowering the pressing roller toward the movable stage.
In the above embodiment of the present application, since the pressing roller of the adhesive tearing apparatus is liftable, the pressing roller can attach the adhesive tape to the film of the wafer after being lowered, and can be separated from the adhesive tape after being lifted. In addition, when the moving carrier is moved in the horizontal direction and the tape receiving member connected to the tape is rotated, the film sheet can be separated from the wafer along with the movement of the tape, and the tape path maintaining member can also abut against the tape to limit the vertical distance between the film sheet and the wafer, so that the peeling angle of the tape sheet when the film sheet is peeled can be horizontal (for example, less than 30 degrees). Therefore, the vertical stripping force (Peeling force) generated on the wafer (such as a micro-electromechanical system) covered by the membrane can be effectively reduced, the damage of the micro-electromechanical system of the wafer caused when the membrane is stripped can be avoided, and the product yield can be improved. In addition, the pressing roller can have elasticity, and the risk of the micro-electromechanical system of the wafer can be effectively reduced when the adhesive tape is pressed and stripped.
Drawings
The aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawing figures. Note that the various features are not drawn to scale in accordance with standard practices in the industry. Indeed, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
Fig. 1 shows a side view of a glue tearing apparatus according to an embodiment of the application.
Fig. 2 is a flowchart illustrating an operation method of the adhesive tearing apparatus according to an embodiment of the application.
Fig. 3 to 6 are schematic diagrams illustrating an operation method of the adhesive tearing apparatus according to an embodiment of the application.
Wherein the symbols in the drawings are briefly described as follows:
100: a glue tearing device; 110: moving the carrier; 120: a tape supply; 122: a roller; 124: stripping off the adhesive tape; 125: a first side; 127: a second side; 130: a tape path maintaining member; 132: a roller; 140: a pressing roller; 150: an adhesive tape receiving member; 152: a disc; 154: a motor; 160: a film clamping wheel set; 170. 170a: an auxiliary wheel; 180: a hot press head; D. d3: a horizontal direction; d1, D2, D3, D4, D5: a direction; d: a distance; m: a membrane; w: and (3) a wafer.
Detailed Description
The following disclosure of embodiments provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course, these examples are merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Spatially relative terms, such as "below … …," "below … …," "lower," "above … …," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 shows a side view of a glue dispensing apparatus 100 according to an embodiment of the application. The adhesive tearing apparatus 100 includes a moving stage 110, an adhesive tape supply member 120, an adhesive tape path maintaining member 130, a pressing roller 140, and an adhesive tape receiving member 150. The moving stage 110 is configured to adsorb the wafer W. The wafer W has a membrane M covering its surface. For example, the membrane M may cover a microelectromechanical system (MEMS) to provide protection. The tape supply 120, the tape path maintaining 130, the pressing roller 140 and the tape receiving 150 are all positioned above the moving stage 110. The tape supply 120 includes a roller 122 and a peeling tape 124 wound around the roller 122. The tape path maintaining member 130 is located downstream of the tape supply member 120 and abuts against the peeling tape 124. The tape path maintaining member 130 is configured to limit a vertical distance between the membrane M and the wafer W, for example, a range of the distance d. The pressing roller 140 is located downstream of the tape path maintaining member 130 and is configured to move in a direction of vertically moving the stage 110. For example, the pressure roller 140 may be lowered near the mobile stage 110 or raised away from the mobile stage 110. The pressing roller 140 has elasticity, and the material thereof may include Polyurethane (PU). The tape receiving member 150 is located downstream of the pressure roller 140 and is coupled to the peeling tape 124 and configured to carry and receive the peeling tape 124. In the present embodiment, the tape receiving member 150 is actively rotated, and the other components (such as the tape supplying member 120, the tape path maintaining member 130 and the pressing roller 140) are rotated by the peeling tape 124.
In addition, the tape path maintaining member 130 has a roller 132. The roller 132 and the pressure roller 140 of the tape path maintenance member 130 are configured to abut against the first side 125 and the second side 127, respectively, of the strip 124. The roller 122 of the tape supply 120 abuts the second side 127 of the strip tape 124. The tape receiver 150 includes a disc 152 and a motor 154. The disc 152 of the tape receiver 150 and the roller 132 of the tape path maintenance member 130 are configured to abut the first side 125 of the strip tape 124. The motor 154 of the tape receiver 150 is configured to rotate the disc 152 to drive the strip tape 124.
In some embodiments, the adhesive tearing apparatus 100 further includes a pinch roller set 160, auxiliary wheels 170, 170a, and a thermal head 180. The pinch roller set 160 is located downstream of the tape supply 120 and upstream of the tape path maintenance 130. The auxiliary wheel 170 is located downstream of the pinch roller set 160 and upstream of the tape path maintenance 130. The auxiliary wheel 170a is located downstream of the pressure roller 140 and the thermal head 180 and upstream of the tape receiver 150. The film clamping roller 160 and the auxiliary rollers 170, 170a can improve the conveying stability of the peeling tape 124. The thermo-compression head 180 is configured to thermo-compress the peeling tape 124 between the pressure roller 140 and the auxiliary wheel 170 a.
It should be appreciated that the connection relationships, materials and functions of the elements described above will not be repeated, and are described in detail. In the following description, the operation method of the adhesive tearing apparatus will be described.
Fig. 2 is a flowchart illustrating an operation method of the adhesive tearing apparatus according to an embodiment of the application. The operation method of the adhesive tearing device comprises the following steps. In step S1, the pressing roller is lowered in a direction approaching the moving stage to press the peeling tape, so that the peeling tape is attached to the film of the wafer suctioned by the moving stage. Then, in step S2, the pressing roller is lifted in a direction away from the moving stage, so that the pressing roller is separated from the peeling tape. Then in step S3, the moving stage is moved in a horizontal direction and the tape receiving member connected to the tape is rotated, so that the film sheet is separated from the wafer along with the movement of the tape. Subsequently, in step S4, the vertical distance between the film and the wafer is limited by the tape path maintaining member abutting against the peeling tape while the moving stage is moved and the tape receiving member is rotated. The operation method of the adhesive tearing apparatus is not limited to the steps S1 to S4, for example, in some embodiments, other steps may be further included between the two steps, or other steps may be further included before the step S1 and after the step S4.
In the following description, each step of the operation method of the above-described adhesive tearing apparatus will be described in detail.
Fig. 3 to 6 are schematic diagrams illustrating an operation method of the adhesive tearing apparatus according to an embodiment of the application. For brevity and clarity, fig. 3-6 omit the pinch roller set 160, two auxiliary wheels 170, 170a, and the thermal head 180 of fig. 1. Referring to fig. 3, the tape-stripping tape 124 is provided using the tape supply member 120 located upstream of the tape path maintaining member 130, wherein the tape-stripping tape 124 is wound around the roller 122 of the tape supply member 120. The wafer W is suctioned by the moving stage 110. First, the moving stage 110 is moved in the horizontal direction D, and the moving stage 110 is stopped when one end (e.g., left end) of the membrane M of the wafer W overlaps the pressing roller 140 in the vertical direction. Then, the pressing roller 140 is lowered in a direction D1 approaching the moving stage 110 to press the peeling tape 124, so that the peeling tape 124 is attached to the film M of the wafer W. In this step, since the pressing roller 140 is made of flexible material, when the peeling tape 124 is pressed against the membrane M, the wafer W is prevented from breaking and vibrating, so that the risk of Micro Electro Mechanical Systems (MEMS) of the wafer W is effectively reduced, the pressing force is reduced, the contact area is increased, and the peeling tape 124 is facilitated to be attached to the membrane M.
When the pressing roller 140 is lowered to press the peeling tape 124, the pressing roller 140 and the roller 122 of the tape supply 120 abut against the same side (e.g., the second side 127) of the peeling tape 124, the disc 152 of the tape receiving member 150 and the roller 132 of the tape path maintaining member 130 abut against the same side (e.g., the first side 125) of the peeling tape 124, and the roller 132 and the pressing roller 140 of the tape path maintaining member 130 abut against opposite sides (e.g., the first side 125 and the second side 127) of the peeling tape 124, respectively.
Referring to fig. 4, after the tape strip 124 is attached to the film M of the wafer W, the pressing roller 140 may be lifted in a direction D2 away from the moving stage 110, so that the pressing roller 140 is separated from the tape strip 124.
Referring to fig. 5, the moving stage 110 is then moved in the horizontal direction D3 and the tape receiving member 150 connected to the peeling tape 124 is rotated so that the film M can be separated from the wafer W as the peeling tape 124 moves. In the present embodiment, the tape receiver 150 can be rotated synchronously while moving the moving stage 110 in the horizontal direction D3. In addition, when the tape receiving member 150 is rotated in the direction D4 (e.g., clockwise), the roller 122 of the tape supply member 120 is driven to rotate in the direction D5 (e.g., counterclockwise).
Referring to fig. 5 and 6, when a portion of the film M is pulled by the peeling tape 124 to separate from the wafer W, the moving stage 110 may be continuously moved in the horizontal direction D3 and the tape receiving member 150 may be rotated to gradually separate the film M from the wafer W. When the moving stage 110 is moved and the tape receiving member 150 is rotated, the vertical distance between the film M and the wafer W may be limited using the tape path maintaining member 130 abutting against the peeling tape 124.
Specifically, during the detachment of the film M, the bottom of the tape path maintaining member 130 abuts against the peeling tape 124 to limit the vertical distance between the film M and the wafer W, so that the peeling angle of the peeling tape 124 when the film M is peeled off can be relatively horizontal (e.g. less than 30 degrees).
In this way, the vertical stripping force (Peeling force) generated on the wafer W (for example, the MEMS) covered by the membrane M can be effectively reduced, the MEMS damage of the wafer W when the membrane M is stripped can be avoided, and the product yield can be improved.
The above description is only of the preferred embodiments of the present application, but not limited thereto, and any person skilled in the art can make further modifications and variations without departing from the spirit and scope of the present application, and the scope of the present application is defined by the appended claims.
Claims (15)
1. A glue tearing apparatus, comprising:
a moving stage configured to adsorb a wafer, wherein the wafer has a membrane;
the adhesive tape supply piece is positioned above the movable carrier and comprises a roller and a stripping adhesive tape wound on the roller;
a tape path maintaining member disposed above the moving stage and downstream of the tape supplying member and abutting against the peeling tape, configured to limit a vertical distance between the film and the wafer;
a pressing roller above the moving stage and downstream of the tape path maintaining member, configured to move in a direction perpendicular to the moving stage to press the peeling tape so that the peeling tape is attached to the film of the wafer; and
and the adhesive tape receiving piece is positioned above the movable carrier and downstream of the pressing roller, is connected with the stripping adhesive tape and is configured to drive and receive the stripping adhesive tape.
2. The adhesive tape tearing apparatus of claim 1, wherein the tape path maintenance member has a roller, the roller and the pressure roller of the tape path maintenance member being configured to abut against first and second opposite sides of the strip, respectively.
3. The adhesive tape stripping apparatus of claim 2, wherein the roller of the tape supply abuts the second side of the strip of adhesive tape.
4. The adhesive tape tearing apparatus of claim 2 wherein the tape receiving member has a disc, the disc of the tape receiving member and the roller of the tape path maintenance member being configured to abut the first side of the strip of tape.
5. The adhesive tape dispenser of claim 4, wherein the tape receiver comprises: a motor configured to rotate the disc of the tape receiving member to drive the tape.
6. The adhesive stripping apparatus of claim 1, wherein the material of the pressure roller comprises polyurethane.
7. The glue dispensing apparatus of claim 1, further comprising:
a film clamping wheel set positioned downstream of the adhesive tape supply member and upstream of the adhesive tape path maintaining member; and
an auxiliary wheel is positioned at the downstream of the film clamping wheel set and the upstream of the adhesive tape path maintaining piece.
8. The glue dispensing apparatus of claim 1, further comprising:
an auxiliary wheel is positioned downstream of the pressure roller and upstream of the tape receiving member.
9. The glue dispensing apparatus of claim 8, further comprising:
a thermo-compression head configured to thermo-compress the peeling tape between the pressing roller and the auxiliary wheel.
10. A method of operating a glue tearing apparatus comprising:
lowering the pressing roller toward the moving stage to press the peeling tape, so that the peeling tape is attached to the film of the wafer adsorbed by the moving stage;
lifting the pressing roller in a direction away from the movable carrier to separate the pressing roller from the stripping adhesive tape;
moving the moving carrier in a horizontal direction and rotating the tape receiving member connected to the tape to separate the film from the wafer along with the movement of the tape; and
the vertical distance between the film and the wafer is limited by the tape path maintaining member abutting against the peeling tape while moving the moving stage and rotating the tape receiving member.
11. The method of operating a glue dispensing apparatus of claim 10, further comprising:
the strip tape is provided using a tape supply upstream of the tape path maintenance member, wherein the strip tape is wound around a roller of the tape supply member.
12. The method of operating a glue dispensing apparatus of claim 11, further comprising:
when the pressing roller is lowered to press the peeling tape, the pressing roller and the roller of the tape supply member are abutted against the same side of the peeling tape.
13. The method of operating a glue dispensing apparatus of claim 10, further comprising:
when the pressing roller is lowered to press the peeling tape, the disc of the tape receiving member and the roller of the tape path maintaining member abut against the same side of the peeling tape.
14. The method of operating a glue dispensing apparatus of claim 10, further comprising:
when the pressing roller is lowered to press the stripping tape, the roller of the tape path maintaining member and the pressing roller are respectively abutted against opposite sides of the stripping tape.
15. The method of operating a glue dispensing apparatus of claim 10, further comprising:
the movable stage is moved in another horizontal direction opposite to the horizontal direction before the pressing roller is lowered in a direction approaching the movable stage.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111121122 | 2022-06-07 | ||
| TW111121122A TWI803340B (en) | 2022-06-07 | 2022-06-07 | De-taping apparatus and operating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117185247A true CN117185247A (en) | 2023-12-08 |
Family
ID=87424619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310412293.3A Pending CN117185247A (en) | 2022-06-07 | 2023-04-18 | Glue tearing equipment and operation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117185247A (en) |
| TW (1) | TWI803340B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4494753B2 (en) * | 2003-10-27 | 2010-06-30 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| CN104347449A (en) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | Peeling apparatus and peeling method |
| JP2019186399A (en) * | 2018-04-11 | 2019-10-24 | 日東電工株式会社 | Adhesive tape peeling method and adhesive tape peeling device |
| JP7319889B2 (en) * | 2019-10-21 | 2023-08-02 | 株式会社東京精密 | Sheet peeling device |
-
2022
- 2022-06-07 TW TW111121122A patent/TWI803340B/en active
-
2023
- 2023-04-18 CN CN202310412293.3A patent/CN117185247A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202349550A (en) | 2023-12-16 |
| TWI803340B (en) | 2023-05-21 |
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