TWI803136B - Differential feed TMmode patch array antenna - Google Patents

Abstract

陣列排列的微帶TM ₀₅模貼片天線，各微帶TM ₀₅模貼片天線在E平面方向之陣間距可大於1個波長(

)，且各微帶TM ₀₅模貼片天線的反向電流位置分別設有複數個開槽，各波導層與各耦合層係設在天線層與接地層之間，且依序為一個波導層與一個耦合層交錯疊合，而形成差分饋電模組，差分饋電模組是利用振幅相同且相位相反的兩路訊號同時饋電至同一微帶TM ₀₅模貼片天線上，完成高增益、低旁瓣及低交叉極化天線設計。 The present invention is a differential feed _TM05 mode patch array antenna, comprising an antenna layer, a plurality of waveguide layers, a plurality of coupling layers and a grounding layer, wherein the antenna layer comprises a first dielectric board and a

Microstrip TM ₀₅ mode patch antennas arranged in an array, and the array spacing of each microstrip TM ₀₅ mode patch antenna in the E plane direction can be greater than 1 wavelength (

), and the reverse current positions of each microstrip TM ₀₅ patch antenna are respectively provided with a plurality of slots, and each waveguide layer and each coupling layer are arranged between the antenna layer and the ground layer, and in turn form a waveguide layer Interleaved with a coupling layer to form a differential feed module, the differential feed module uses two signals with the same amplitude and opposite phase to simultaneously feed to the same microstrip TM ₀₅ patch antenna to achieve high gain , low sidelobe and low cross-polarization antenna design.

Description

Differential Feed TM05 Die SMD Array Antenna

The present invention relates to an array antenna, especially an array antenna arranged with a microstrip TM ₀₅ patch antenna, and a plurality of switches are respectively arranged at the reverse current position of each microstrip TM ₀₅ patch antenna. The slots are fed to each microstrip TM ₀₅ patch antenna with a differential feed module to complete the array antenna design with high gain, low sidelobe and low cross polarization.

With the vigorous development of the automobile industry, there are more and more functions of automobiles, and the world is currently developing toward the intelligentization of automobile electronics. A lot of technology has been invested to improve car driving safety. Although passive safety protection systems can reduce the severity of car accidents, they can only treat the symptoms but not the root cause. How to effectively avoid accidents is the fundamental solution. For this reason, a large amount of electronic communication technology is used to develop the car warning function, so as to strengthen the driver's field of vision, know the relative distance with other cars to prevent collision. Accordingly, active vehicle safety protection systems have become the mainstream of vehicle safety development.

Advanced driver assistance systems (Advanced driver assistance systems, ADAS) is one of the key points in the active development of automotive active safety protection technology. It can provide drivers with information on the operating status of the vehicle and changes in the driving environment outside the vehicle. Vehicle ranging radars are required for forward collision avoidance systems (FCAS), adaptive cruise control (ACC), and forward collision warning systems (FCWS). Vehicle ranging radar is usually installed in front of the vehicle. It can measure the safe distance between the vehicle and other vehicles, relative speed, azimuth and other data, and send it back to the driver in time after processing, so that the driver can respond to sudden Accelerate, brake, and shift gears in advance to avoid accidents. The sensing distance and accuracy of automotive radar are the key technologies to achieve safe driving, and it is also a necessary part of the process of intelligent vehicles.

之水平視角範圍。 In terms of adaptive cruise control (Adaptive cruise control, ACC), including long range radar (Long range radar, LRR), middle range radar (Middle range radar, MRR) and short range radar (Short range radar, SRR), etc., They are used in different places according to their characteristics. Among them, the main function of the LRR radar is to maintain an appropriate distance between vehicles. When the traffic flow is heavy, the driver needs to focus more on maintaining an appropriate distance from the vehicle in front, which will cause considerable stress and fatigue to the driver. In order to assist the driver to drive safely and easily, the function of the LRR radar is extremely important. It can automatically detect the distance and relative speed to the vehicle in front, and make a judgment on acceleration or deceleration, and because of its high sensitivity It can also use the clutter reflected by the ground to detect vehicles covered by the dead corner of the front vehicle. In order to have the above functions, the LRR radar must have a longer detection distance, about 250 meters and ±15

The horizontal viewing angle range.

16陣列天線，雖然能使增益提高到25.01 dBi，然而其H-plane方向之低旁波瓣位準(side lobe level，縮寫：SLL)卻只有-12.5 dB，這會影響到雷達天線的精準度。 In recent years, there have been quite a lot of researches on LRR radar. Document 1 (S. Lan et al., "A 77GHz bioradar antenna module design using microstrip arrays," 2016 IEEE International Symposium on Antennas and Propagation (APSURSI), "pp. 1177-1178, 2016) proposed a microstrip array composed of rectangular patches 10

Although the 16-array antenna can increase the gain to 25.01 dBi, its low side lobe level (SLL) in the H-plane direction is only -12.5 dB, which will affect the accuracy of the radar antenna.

15/

12 dB。 Document 2 (J. Xu, W. Hong, H. Zhang, G. Wang, Y. Yu and ZH Jiang, "An Array Antenna for Both Long- and Medium-Range 77 GHz Automotive Radar Applications," in IEEE Transactions on Antennas and Propagation, "vol. 65, no. 12, pp. 7207-7216, Dec. 2017) proposed a patch array antenna suitable for medium and long distances, with a gain of 20 dBi and a method of unequal amplitude distribution To suppress side lobes, the SLLs in the E/H-plane direction are

15/

12dB.

32陣列天線，其增益為22.8 dBi，H-plane方向SLL為

25.4 dB。 Document 3 (J. Xu, ZN Chen and X. Qing, "CPW Center-Fed Single-Layer SIW Slot Antenna Array for Automotive Radars," in IEEE Transactions on Antennas and Propagation, vol. 62, no. 9, pp. 4528 -4536, Sept. 2014.) proposed to use slot antennas to form 4

32 array antennas, the gain is 22.8 dBi, and the SLL in the H-plane direction is

25.4 dB.

18貼片陣列天線，其增益為21.35 dBi，H-plane方向SLL為

20.17 dB。 Document 4 (D. Shin, K. Kim, J. Kim and S. Park, "Design of Null-Filling Antenna for Automotive Radar Using the Genetic Algorithm," in IEEE Antennas and Wireless Propagation Letters, vol. 13, pp. 738 -741, 2014.) proposed to feed by the proximity coupling method 8

18-patch array antenna, its gain is 21.35 dBi, and the SLL in the H-plane direction is

20.17 dB.

32陣列天線，其增益為25.53 dBi，E/H-plane SLL為

25/

21dB。該設計雖能達到高增益及壓低旁波瓣效果，但其使用之單元天線數目較多，並使用大量的串聯饋電方式，使得設計難度大幅增加且天線尺寸過大。 Document 5(S. Yasini and K. Mohammadpour-Aghdam, "Design and simulation of a Comb-line fed microstrip antenna array with low side lobe level at 77GHz for automotive collision avoidance radar," 2016 Fourth International Conference on Millimeter-Wave and Terahertz Technologies (MMWaTT), pp. 87-90, 2016.) uses a patch antenna and designs a feeder circuit with Taylor function distribution to form a 32

32 array antennas, the gain is 25.53 dBi, the E/H-plane SLL is

25/

21dB. Although this design can achieve high gain and suppress side lobe effects, it uses a large number of element antennas and uses a large number of series feeding methods, which greatly increases the design difficulty and the antenna size is too large.

Literature 6 (M. Ettorre, R. Sauleau, L. Le Coq and F. Bodereau, "Single-Folded Leaky-Wave Antennas for Automotive Radars at 77 GHz," in IEEE Antennas and Wireless Propagation Letters, vol. 9, pp. 859-862, 2010.) Using the leaky wave antenna and adding the gain of the reflective surface concentrated antenna formed by the metal pillar, the gain can reach up to 27.7dBi and the side lobe can be reduced to below -25dB, but its radiation pattern is not Vertical or horizontal to the antenna, making it difficult to integrate with the front-end circuit.

線性極化貼片天線組成2

27的陣列天線，其增益在76.5GHz時為20.3dBi，E-plane SLL約為-19dB。 Document 7 (Y. Hayashi, K. Sakakibara, M. Nanjo, S. Sugawa, N. Kikuma and H. Hirayama, "Millimeter-Wave Microstrip Comb-Line Antenna Using Reflection-Canceling Slit Structure," in IEEE Transactions on Antennas and Propagation, vol. 59, no. 2, pp. 398-406, Feb. 2011.) using 45

Linearly Polarized Patch Antenna Composition 2

27 array antenna, its gain is 20.3dBi at 76.5GHz, and the E-plane SLL is about -19dB.

20的堆疊貼片，增益為24.1dBi，旁波瓣位準約為-18.1dB。 Literature 8 (SB Yeap, X. Qing and ZN Chen, "77-GHz Dual-Layer Transmit-Array for Automotive Radar Applications," in IEEE Transactions on Antennas and Propagation, vol. 63, no. 6, pp. 2833-2837 , June 2015.) proposed a slotted array antenna design, and added 20

With 20 stacked patches, the gain is 24.1dBi, and the side lobe level is about -18.1dB.

16的陣列天線，水平面旁波瓣壓制-20dB，增益為21.7dBi。 Document 9 (Y. Yu, W. Hong, H. Zhang, J. Xu and ZH Jiang, "Optimization and Implementation of SIW Slot Array for Both Medium- and Long-Range 77 GHz Automotive Radar Application," in IEEE Transactions on Antennas and Propagation, vol. 66, no. 7, pp. 3769-3774, July 2018.) Composed of 6 slotted antennas

16 array antennas, horizontal side lobe suppression -20dB, gain 21.7dBi.

7dBi之間。 In addition, the Rectangular microstrip patch antenna (Rectangular microstrip patch antenna) architecture to design LRR radar has a planar structure, simple analysis and manufacturing process, and easy to integrate with other planar circuits. However, the traditional microstrip patch antenna has a characteristic Disadvantage, its antenna gain is low, about 4

Between 7dBi.

In order to improve the disadvantage of low gain of the patch antenna, it can be improved by increasing the number of unit antennas to form an array antenna. Generally, there are two feeding modes of an array antenna, which are series feeding and parallel feeding. The series feed-in line has the advantages of simple structure, tight unit spacing, small circuit size, and small insertion loss, but the bandwidth is narrow, and the units are easy to interact with each other, making impedance matching design more difficult. The units of the parallel feed-in line are relatively less susceptible to mutual influence, but the feed-in line is more complicated, the circuit size is larger, and the insertion loss is larger. Regardless of the feeding method mentioned above, when the number of element antennas is large, it will increase the difficulty of design and the path loss caused by the large feeding circuit. Therefore, the improvement method is to increase the gain of the element antenna to reduce the number of elements required to form an array, so as to reduce the difficulty of feeding circuit design and insertion loss.

At present, many literatures propose methods to increase the gain of patch units, such as using stacked patches to increase the gain of patch units. However, this method will increase the number of circuit layers, and the aperture efficiency is low. Alternatively, the metal area of the antenna may be increased in disguise by using parasitic element coupling, thereby increasing the gain of the antenna. However, the coupling between high-frequency elements is difficult to adjust and is easily affected by manufacturing conditions. Or load the Fabuli-Perro resonant cavity structure on the upper layer of the antenna, and generate leaky waves in the multilayer board to increase the gain, so there will be a problem with a high number of layers, and the gain depends on the coverage area and dielectric of the resonant cavity. Electrical coefficient, not antenna body gain. In addition, an end-fired antenna is used and a director is added to increase its gain, but the effect of the increase is limited and the area of the antenna is too large. It is also possible to let the patch resonate in a high-order mode to increase the gain and suppress side lobes. This method can effectively increase the gain of the unit antenna without using too many circuit layers. However, this method can only be applied between 2.85 and 10GHz, and it does not mention whether it can be applied to a higher frequency band (such as 79GHz for automotive radar), nor does it further verify whether it can be used in array antennas.

20 dB之設計需求，此外前述許多天線設計之天線單元數皆較多，會增加饋電網路設計上的難度，並使得天線尺寸過大，或者不易與前端電路整合，故需要針對此些問題進行改善。 Based on the above, it is really difficult for the current array antenna to achieve antenna gain greater than 20 dBi, and the side lobe level (SLL) of the horizontal plane needs to be lower than

20 dB design requirement. In addition, many antenna designs mentioned above have a large number of antenna elements, which will increase the difficulty of feeding circuit design, and make the antenna size too large, or it is difficult to integrate with the front-end circuit. Therefore, these problems need to be improved. .

20 dB之陣列天線，且因使用TM ₀₅模貼片，可減少陣列天線所需單元數，可簡化饋電網路佈局及結構設計，且天線的尺寸不致於過大，又可方便與前端電路整合。 In view of the problems of the prior art, one object of the present invention provides that the antenna gain needs to be greater than 20 dBi, and the side lobe level (Side lobe level, SLL) of the horizontal plane needs to be lower than

20 dB array antenna, and because of the use of TM ₀₅ die patch, the number of units required for the array antenna can be reduced, the layout and structure design of the feeder circuit can be simplified, and the size of the antenna will not be too large, and it can be easily integrated with the front-end circuit.

陣列排列的微帶TM ₀₅模貼片天線，各微帶TM ₀₅模貼片天線在E平面方向之陣間距可大於1個波長(λ)，且各微帶TM ₀₅模貼片天線的反向電流位置分別設有複數個開槽，各波導層與各耦合層係設在天線層與接地層之間，且依序為一個波導層與一個耦合層交錯疊合，而形成差分饋電模組，差分饋電模組是利用振幅相同且相位相反的兩路訊號同時饋電至同一微帶TM ₀₅模貼片天線上。 According to the purpose of the present invention, it is to provide a differential feed TM ₀₅ mode patch array antenna, including an antenna layer, a plurality of waveguide layers, a plurality of coupling layers and a ground layer, wherein the antenna layer includes a first dielectric plate and is located on the first Dielectric board

Microstrip TM ₀₅ -mode patch antennas arranged in an array, the array spacing of each microstrip TM ₀₅ -mode patch antenna in the E plane direction can be greater than 1 wavelength (λ), and the reverse direction of each microstrip TM ₀₅ -mode patch antenna A plurality of slots are respectively set at the current position, and each waveguide layer and each coupling layer are arranged between the antenna layer and the ground layer, and one waveguide layer and one coupling layer are overlapped in sequence to form a differential feed module , The differential feed module uses two signals with the same amplitude and opposite phase to simultaneously feed to the same microstrip TM ₀₅ patch antenna.

的等比級數遞增的金屬單元，其中i為從零開始遞增的自然數(0、1、2、3…、i-2、i-1、i)。 Wherein, each waveguide layer is a second dielectric plate, and each second dielectric plate is arranged sequentially from bottom to top

Metal units with increasing geometric progression, where i is a natural number (0, 1, 2, 3..., i-2, i-1, i) increasing from zero.

Wherein, the ground layer is the first metal plate.

個耦合單元，其中j為從j開始遞減到1的自然數 (j、j-1、j-2…、3、2、1) 且

的數量等於微帶TM ₀₅模貼片天線的數量。 Wherein, each coupling layer is a second metal plate, and each second metal plate is arranged sequentially from top to bottom

coupling units, where j is a natural number decreasing from j to 1 (j, j-1, j-2..., 3, 2, 1) and

The number is equal to the number of Microstrip TM _05- mode patch antennas.

Wherein, each coupling unit is in the shape of a slit, and each coupling unit is located at the differential feeding position of each second metal plate corresponding to the lower waveguide layer, and is opened towards the vertical current direction.

Among them, the metal unit of the bottom waveguide layer is a differential feed module surrounded by a plurality of first metal through-holes, and the bottom coupling layer passes between the bottom waveguide layer and the ground layer Two feeding through holes are provided, and the positions of the two feeding through holes are adjacent to each coupling unit of the lowermost coupling layer.

Wherein, the differential feeding module is a T-shaped differential feeding module or a Taylor distributed differential feeding module.

Wherein, the metal units of the waveguide layers descending sequentially between the uppermost and the lowermost coupling layers are a pair of two power dividers surrounded by a plurality of second metal through holes.

In summary, the present invention uses double slots to suppress the reverse current of the antenna substrate, and at the same time achieves the effect of beam shaping, and adopts the differential feeding method, which can improve the symmetry of the radiation field and reduce the cross polarization, and The array is formed with a large array spacing, so that the grid lobe of the array factor is facing the zero point of the radiation of the unit, so as to achieve the effect of suppressing the grid lobe, and complete the high gain and low side lobe antenna design.

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

陣列排列的微帶TM ₀₅模貼片天線12，M、N為整正數，各微帶TM ₀₅模貼片天線12在E平面方向之陣間距(以下稱大間陣距)大於1個波長(λ)，大間陣距進一步為大於1個波長(λ)且小於2個波長(λ)之間，大間陣距更進一步可為大於1.3個波長(λ)且小於1.7個波長(λ)之間，且各微帶TM ₀₅模貼片天線12的反向電流位置分別設有複數個開槽120，用以將高階模態反向電流所在之主要區域挖除，使反向電流無法輻射，僅有傳導電流之功能，進一步而言，每一個微帶TM ₀₅模貼片天線12的為反向電流位置處係朝垂直電流方向各設二開槽120，且此二兩開槽120孔頭尾相鄰，並相隔一段間距。 Please refer to shown in Fig. 1, the present invention is a kind of differential feed _TM05 mold chip array antenna, comprises antenna layer 1, multiple waveguide layers 2, multiple coupling layers 3 and ground plane 4, wherein all waveguide layers 2 and All the coupling layers 3 are arranged between the antenna layer 1 and the ground layer 4, and one waveguide layer 2 and one coupling layer 3 are overlapped sequentially. The antenna layer 1 includes the first dielectric board 10 and the Plate 10's

Microstrip TM ₀₅ mode patch antennas 12 arranged in an array, M and N are integer positive numbers, and the array spacing of each microstrip TM ₀₅ mode patch antenna 12 in the E plane direction (hereinafter referred to as the large inter-array spacing) is greater than 1 wavelength (λ ), the large inter-array spacing is further greater than 1 wavelength (λ) and less than 2 wavelengths (λ), and the large inter-array spacing can be further greater than 1.3 wavelengths (λ) and less than 1.7 wavelengths (λ), And the reverse current positions of each microstrip TM ₀₅ patch antenna 12 are respectively provided with a plurality of slots 120, which are used to excavate the main area where the high-order mode reverse current is located, so that the reverse current cannot be radiated, and only The function of conducting current, further speaking, each microstrip TM ₀₅ die patch antenna 12 is provided with two slots 120 in the direction of the vertical current at the reverse current position, and the two slots 120 holes are in the same direction. Adjacent and separated by a distance.

Furthermore, all the waveguide layers 2 and all the coupling layers 3 form a differential feed module 5, wherein the bottom waveguide layer 2 provides a set of two-way feed signals with the same amplitude and opposite phase, which pass through each Coupling layer 3 and other waveguide layers 2 , and finally the uppermost coupling layer 3 provides two feed signals with the same amplitude and opposite phase to each microstrip TM ₀₅ mode patch antenna 12 .

的等比級數遞增的金屬單元22，其中i為從零開始遞增的自然數(0、1、2、3…、i-2、i-1、i)。又，接地層4係為第一金屬板。而各耦合層3為第二金屬板，且各第二金屬板由上往下依序設有

個耦合單元32，其中j為從j開始遞減到1的自然數 (j、j-1、j-2…、3、2、1) 且

的數量等於微帶TM ₀₅模貼片天線12的數量。 In the present invention, each waveguide layer 2 is a second dielectric plate 20, and each second dielectric plate 20 is arranged sequentially from bottom to top

The metal unit 22 with increasing geometric series, wherein i is a natural number (0, 1, 2, 3..., i-2, i-1, i) increasing from zero. Also, the ground layer 4 is a first metal plate. Each coupling layer 3 is a second metal plate, and each second metal plate is sequentially arranged from top to bottom

A coupling unit 32, wherein j is a natural number (j, j-1, j-2..., 3, 2, 1) decreasing from j to 1 and

The number is equal to the number of Microstrip TM ₀₅ -mode patch antennas 12.

In the present invention, each coupling unit 32 is in the shape of a slit, and each coupling unit 32 is opened toward the vertical current direction at the differential feeding position of each second metal plate corresponding to the lower waveguide layer 2 . Furthermore, the metal unit 22 of the lowermost waveguide layer 2 is a differential feeding module surrounded by a plurality of first metal through holes 220, and the lowermost coupling layer 3 passes through the lowermost waveguide layer Two feed through holes 34 are provided between the ground layer 2 and the ground layer 4 , and the two feed through holes 34 are located next to the coupling unit 32 of the lowest adjacent coupling layer 3 .

In the present invention, the differential feed module is a T-type differential feed module (T-type power divider) or a Taylor distribution differential feed module, and the uppermost and lowermost coupling layers 3 are sequentially connected to each other. The metal units 22 of the lower waveguide layers 2 are a pair of two power dividers surrounded by a plurality of second metal through holes 222 .

In order to allow the present invention to be combined with the external connector 6 , in the present invention, a ground coplanar waveguide (GCPW for short) is provided on the ground layer 4 for combining with the external connector 6 .

In order to further understand the present invention, five embodiments of array antennas are given below for description.

First embodiment:

陣列的陣列天線，微帶TM ₀₅模貼片天線12的尺寸為1.3

0.84

，在E-plane方向的共振長度為1.3

，L1為微帶TM ₀₅模貼片天線12共振電流方向之長度，於微帶TM ₀₅模貼片天線12的

及

之反向電流位置處，朝垂直電流方向挖兩條開槽120，此二開槽120孔頭尾相鄰，槽孔長度各為LS1，天線層1及波導層2，採用廠牌羅傑斯(Rogers)型號：4003C的高頻板材，介電常數

，厚度為0.305 mm。尺寸參數如下表所示： Please refer to Figures 1-2, the first embodiment is

The array antenna of the array, Microstrip TM ₀₅ die patch antenna 12 with a size of 1.3

0.84

, the resonance length in the E-plane direction is 1.3

, L1 is the length of the resonant current direction of the microstrip TM ₀₅ -mode patch antenna 12, which is the length of the microstrip TM ₀₅ -mode patch antenna 12

and

At the position of the reverse current, two slots 120 are dug in the direction of the vertical current. The two slots 120 are adjacent to each other. The length of each slot is LS1. ) Model: 4003C high-frequency plate, dielectric constant

, with a thickness of 0.305 mm. The size parameters are shown in the table below:

      0.58       Antenna Size Chart (Unit: mm) Ls ₁ Ws ₁ d _e d _h 1.32 0.15 5.51 4.18

0.58

2陣列天線共需八個差分饋電埠。差分饋電模組5採用垂直並聯架構達到八路功率分割，且擁有輸出端成對相位相反之效果。最下面的波導層2為T型功分器，由二饋電穿孔34來實現一分二，並藉由上方的各耦合層3的耦合單元32進行耦合，及上方的各波導層2的金屬單元22，以垂直並聯方式，將最下面的差分饋電訊號，達到二分四功率等分及相位相反效果，再繼續藉由上方的各耦合層3的耦合單元32進行耦合，及上方的各波導層2的金屬單元22，達成四分八功率分割。其中八個輸出端埠兩兩成對。 Furthermore, each microstrip _TM05 mode patch antenna 12 needs a group of differential feed signals for feeding, so 2

2 array antennas require a total of eight differential feed ports. The differential feed module 5 adopts a vertical parallel structure to achieve eight-way power division, and has the effect of paired output terminals with opposite phases. The bottom waveguide layer 2 is a T-shaped power splitter, which is divided into two by two feeding through holes 34, and coupled by the coupling unit 32 of each coupling layer 3 above, and the metal of each waveguide layer 2 above. The unit 22, in a vertical parallel manner, divides the lowermost differential feed signal into two, four power equal divisions and phase opposite effects, and then continues to couple through the coupling units 32 of the upper coupling layers 3, and the upper waveguides The metal unit 22 of the layer 2 achieves a power split of 40/8. Among them, eight output ports are paired in pairs.

陣列的陣列天線模擬S參數響應圖，由圖可知，在77.66

80.06 GHz頻率範圍，|S11|均小於

10 dB，阻抗匹配特性良好，頻寬約為3.04%，可符合天線頻寬78.89

79.17 GHz所需。請參閱圖3所示，因採用差分饋電，主輻射場型相當對稱，E平面的交叉極化與主極化峰值相比小於

41.3 dB，H平面的交叉極化與主極化相比小於

55.73 dB。 Please refer to Figure 3, the first embodiment is

The array antenna simulation S parameter response diagram of the array, as can be seen from the figure, at 77.66

80.06 GHz frequency range, |S11| are less than

10 dB, the impedance matching characteristic is good, the bandwidth is about 3.04%, which can meet the antenna bandwidth of 78.89

Required for 79.17 GHz. Please refer to Figure 3, due to the differential feed, the main radiation pattern is quite symmetrical, and the cross polarization of the E plane is smaller than the peak value of the main polarization

41.3 dB, the cross polarization of the H plane is less than the main polarization

55.73 dB.

Second embodiment:

陣列的陣列天線， Please refer to Figure 5, the second embodiment is

array of array antennas,

8貼片陣列天線，E面及H面陣間距分別為1.45波長及1.1波長，最下方的波導層2係設有泰勒分佈一分八差分饋電網路，進一步再藉由上方波導層2及耦合層3，達成一分十六之差分輸出。本實施例的天線層1及波導層2採用廠牌羅傑斯(Rogers)型號：4003C的高頻板材，介電常數

，厚度為0.305 mm。 In the second embodiment, the number of microstrip TM ₀₅ mode patch antennas 12 is increased in the E plane, and 2 are formed in a large array spacing mode.

8-patch array antenna, the spacing between the E-plane and H-plane arrays is 1.45 wavelengths and 1.1 wavelengths respectively, and the bottom waveguide layer 2 is equipped with a Taylor distributed 1:8 differential feed circuit, and further through the upper waveguide layer 2 and the coupling Layer 3, to achieve a differential output of one point sixteen. The antenna layer 1 and the waveguide layer 2 of the present embodiment adopt the brand Rogers (Rogers) model: 4003C high-frequency plate, the dielectric constant

, with a thickness of 0.305 mm.

10 dB阻抗頻寬為79.35

80.05 GHz (0.8%)。請參閱圖7所示，本實施例的陣列天線模擬輻射場型圖，頻率為79 GHz時，天線增益可達20.65 dBi，E平面SLL為

14.51 dB，H平面SLL可壓低至

23.12 dB，交叉極化在

30

可視範圍內皆低於

37.18 dB。由圖可看出輻射場型不對稱問題已獲良好改善，且增益及SLL皆符合設計之需求，特性良好。 Please refer to Figure 6, this array antenna

The 10 dB impedance bandwidth is 79.35

80.05 GHz (0.8%). Please refer to Fig. 7, the simulated radiation pattern diagram of the array antenna of this embodiment, when the frequency is 79 GHz, the antenna gain can reach 20.65 dBi, and the E-plane SLL is

14.51 dB, H-plane SLL can be suppressed down to

23.12 dB, cross-polarized at

30

Visible range is lower than

37.18 dB. It can be seen from the figure that the problem of radiation field asymmetry has been well improved, and the gain and SLL meet the design requirements, and the characteristics are good.

Third embodiment:

陣列的陣列天線，第二實施例與第三實施例雷同，兩者的差別為進一步再藉由上方波導層2及耦合層3，達成一分三十二之差分輸出。請參閱圖9所示，其

10 dB阻抗頻寬為78.47

80.04 GHz (1.98%)，請參閱圖10所示，為第三實施例的模擬輻射場型圖，於79 GHz時增益可達24.46 dBi，H-plane SLL為

23.2 dB，且交叉極化於

30

範圍內皆低於

44.24 dB。 Please refer to Figure 8, the third embodiment is

The array antenna of the array, the second embodiment is the same as the third embodiment, and the difference between the two is that the differential output of 1/32 is further achieved through the upper waveguide layer 2 and the coupling layer 3 . Please refer to Figure 9, which

The 10 dB impedance bandwidth is 78.47

80.04 GHz (1.98%), please refer to Figure 10, which is the simulated radiation pattern diagram of the third embodiment, the gain can reach 24.46 dBi at 79 GHz, and the H-plane SLL is

23.2 dB with cross polarization at

30

range below

44.24 dB.

Fourth embodiment:

8貼片陣列天線模擬輻射場型圖，於79GHz時，其增益為19.06dBi，E-plane SLL為-12.68dB，H-plane SLL為-24.89dB且交叉極化於

30

範圍內皆低於

40.4 dB。 Please refer to FIG. 11 , the fourth embodiment is an embodiment in which the antenna layer 1, the second waveguide layer 2, the second coupling layer 3 and the ground layer 4 of the second embodiment are connected by insulating connectors (such as plastic screws). A ground coplanar waveguide (GCPW for short) is arranged on the ground layer 4 to be combined with the external connector 6, as shown in FIG. 11 , it is a structure with surface wave suppression

8-patch array antenna simulation radiation pattern, at 79GHz, its gain is 19.06dBi, E-plane SLL is -12.68dB, H-plane SLL is -24.89dB and the cross polarization is at

30

range below

40.4dB.

20dB以下，意即，本發明可以達到高增益低旁瓣天線設計需求。 According to the above, the present invention adopts the method of large array spacing to form the array. In addition, the method of forming the array with large array spacing makes the grid lobe of the array factor face the zero point of the radiation of the unit to achieve the effect of depressing the grid lobe. The TM ₀₅ die suppresses the reverse current through double slots and achieves the effect of beam shaping at the same time, and uses a vertical T-shaped power divider for differential feeding, which can improve the symmetry of the radiation field and reduce cross polarization. The feeder circuit adopts 1/8 Taylor distribution feeder circuit to form the Taylor distribution differential feeder module 5, so as to lower the water level side wave to

Below 20dB, that is, the present invention can meet the design requirement of high-gain and low-sidelobe antenna.

The above detailed description is a specific description of the feasible embodiments of the present invention, but the foregoing embodiments are not intended to limit the patent scope of the present invention, and any equivalent implementation or change that does not depart from the technical spirit of the present invention should be included in In the patent scope of this case.

1: Antenna layer 10: First dielectric plate 12: Microstrip TM ₀₅ die patch antenna 120: Slot 2: Waveguide layer 20: Second dielectric plate 22: Metal unit 220: First metal through hole 222: Second metal Through hole 3: Coupling layer 32: Coupling unit 34: Feed through hole 4: Ground layer 5: Differential feed module 6: Connector

1 Figure 1 is an exploded perspective view of the first embodiment of the present invention. Fig. 2 is a schematic top view of the first embodiment of the present invention. Fig. 3 is a schematic diagram of the simulated | S ₁₁ | response of the first embodiment of the present invention. Fig. 4 is a schematic diagram of the simulated radiation field of the first embodiment of the present invention. Fig. 5 is a three-dimensional exploded view of the second embodiment of the present invention. Fig. 6 is a schematic diagram of the simulated | S ₁₁ | response of the second embodiment of the present invention. Fig. 7 is a schematic diagram of the simulated radiation field of the second embodiment of the present invention. Fig. 8 is an exploded perspective view of the third embodiment of the present invention. Fig. 9 is a schematic diagram of the simulated | S ₁₁ | response of the third embodiment of the present invention. Fig. 10 is a schematic diagram of the simulated radiation field of the third embodiment of the present invention. Fig. 11 is a schematic diagram of the practical appearance of the second embodiment of the present invention. FIG. 12 is a schematic diagram of the simulated radiation field in FIG. 11 .

1: Antenna layer

10: The first medium board

12:Microstrip TM ₀₅ die patch antenna

120: slotting

2: waveguide layer

20: Second dielectric board

22: Metal unit

220: The first metal through hole

222: Second metal through hole

3: Coupling layer

32:Coupling unit

34: Feed perforation

4: Ground layer

5: Differential feed module

6: Connector

Claims (11)

A differential feed TM ₀₅ die patch array antenna, comprising: an antenna layer, the antenna layer includes a first dielectric plate and a plurality of microstrip TM ₀₅ die-attached arrays arranged in an M×N array on the first dielectric plate Chip antenna, the array spacing of each microstrip TM ₀₅ mode patch antenna in the direction of E plane and H plane is greater than 1 wavelength (λ), and the shape of each microstrip TM ₀₅ mode patch antenna is a rectangle, where the long side The direction is the resonant current direction, and the two reverse current positions of the microstrip TM ₀₅ patch antenna are respectively provided with a plurality of slots in the vertical current direction; a ground layer; a plurality of waveguide layers; and a plurality of couplings layer; wherein each of the waveguide layers and each of the coupling layers is arranged between the antenna layer and the ground layer, and the antenna layer, the coupling layer and the waveguide layer are stacked sequentially from top to bottom, and Forming a differential feed module, the differential feed module uses two feed signals with the same amplitude and opposite phase to simultaneously feed to the same microstrip TM ₀₅ mode patch antenna; the waveguide layers and the The metal of the coupling layer is grounded; the signal is input from the bottom waveguide layer, and the coupling effect of each waveguide layer and the coupling unit of each coupling layer makes the phase of the electromagnetic field at both ends of the propagation path coupled to the upper layer of the waveguide layer On the contrary, a differential feed module can be formed; the differential feed module expands layer by layer from bottom to top, sequentially couples the input signal of the lower layer to the upper layer and divides it into multiple output signals at the same time, and every two output signals jointly form A pair of differential signals can provide differential feed signals with the same amplitude and opposite phase to feed to the same microstrip TM ₀₅ patch antenna at the same time. Differential feeding _TM05 mode patch array antenna as described in claim item 1, wherein each of the waveguide layers is a second dielectric plate, and each of the second dielectric plates is provided with 2 ⁱ etc. A metal unit that increases from a series, where i is a natural number that increases from zero (0, 1, 2, 3..., i-2, i-1, i). The differentially fed _TM05 die patch array antenna as claimed in claim 2, wherein the ground layer is a first metal plate. Differential feeding _TM05 mode patch array antenna as described in claim item 3, wherein each of the coupling layers is a second metal plate, and each of the second metal plates is provided with 2 ^j of the coupling layers sequentially from top to bottom unit, where j is a natural number starting from j and decreasing to 1 (j, j-1, j-2..., 3, 2, 1), and the number of 2 ^j is equal to the number of the microstrip TM ₀₅ mode patch antenna . The differential feed _TM05 mode patch array antenna as described in Claim 4, wherein each of the coupling units is in the shape of a slit. Differential feeding _TM05 mode patch array antenna as described in claim item 5, wherein each of the coupling units is arranged at the differential feeding position of the waveguide layer below each of the second metal plates, facing the vertical current direction open. The differential feed _TM05 patch array antenna as described in claim item 6, wherein the metal unit of the waveguide layer at the bottom is the differential feed surrounded by a plurality of first metal through holes module, and the lowermost coupling layer passes through the lowermost waveguide layer to the ground layer and is provided with one or two feed through holes, and the positions of the two feed through holes are adjacent to the lowermost coupling layer. next to the coupling unit. The differential feed _TM05 patch array antenna as described in claim item 7, wherein the differential feed module is a T-shaped differential feed module. The differential feed _TM05 patch array antenna as described in claim item 7, wherein the differential feed module is a Taylor distributed differential feed module. The differential feed _TM05 mode patch array antenna as described in claim item 7, wherein the metal units of each of the waveguide layers descending sequentially between the uppermost and the lowermost coupling layers are in the form of a plurality of first A pair of two power dividers are arranged around the two metal through holes. The differential feed _TM05 patch array antenna as described in claim item 9, wherein the Taylor distribution differential feed module is a 1/8 Taylor distribution feed circuit, and the array is formed in the direction of the H plane, and the array spacing is 1.1 λ ₀ .

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