TWI802156B - 感光性樹脂組成物及有機el元件隔壁 - Google Patents

感光性樹脂組成物及有機el元件隔壁 Download PDF

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Publication number
TWI802156B
TWI802156B TW110147407A TW110147407A TWI802156B TW I802156 B TWI802156 B TW I802156B TW 110147407 A TW110147407 A TW 110147407A TW 110147407 A TW110147407 A TW 110147407A TW I802156 B TWI802156 B TW I802156B
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TW
Taiwan
Prior art keywords
resin
group
resin composition
carbon atoms
mass
Prior art date
Application number
TW110147407A
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English (en)
Chinese (zh)
Other versions
TW202244100A (zh
Inventor
石田恭裕
古江健太郎
倉本拓樹
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW202244100A publication Critical patent/TW202244100A/zh
Application granted granted Critical
Publication of TWI802156B publication Critical patent/TWI802156B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/22Exposing sequentially with the same light pattern different positions of the same surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
TW110147407A 2020-12-28 2021-12-17 感光性樹脂組成物及有機el元件隔壁 TWI802156B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020219012 2020-12-28
JP2020-219012 2020-12-28

Publications (2)

Publication Number Publication Date
TW202244100A TW202244100A (zh) 2022-11-16
TWI802156B true TWI802156B (zh) 2023-05-11

Family

ID=82260423

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147407A TWI802156B (zh) 2020-12-28 2021-12-17 感光性樹脂組成物及有機el元件隔壁

Country Status (3)

Country Link
JP (1) JPWO2022145188A1 (enrdf_load_stackoverflow)
TW (1) TWI802156B (enrdf_load_stackoverflow)
WO (1) WO2022145188A1 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201901297A (zh) * 2017-04-07 2019-01-01 日商昭和電工股份有限公司 感光性樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10866512B2 (en) * 2015-10-21 2020-12-15 Showa Denko K.K. Positive photosensitive resin composition
JP6689434B1 (ja) * 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機el素子隔壁、及び有機el素子
US20220221790A1 (en) * 2019-05-27 2022-07-14 Showa Denko K.K. Photosensitive resin composition and organic el element partition wall

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201901297A (zh) * 2017-04-07 2019-01-01 日商昭和電工股份有限公司 感光性樹脂組成物

Also Published As

Publication number Publication date
TW202244100A (zh) 2022-11-16
JPWO2022145188A1 (enrdf_load_stackoverflow) 2022-07-07
WO2022145188A1 (ja) 2022-07-07

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